JP2011184668A5 - - Google Patents
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- Publication number
- JP2011184668A5 JP2011184668A5 JP2010054701A JP2010054701A JP2011184668A5 JP 2011184668 A5 JP2011184668 A5 JP 2011184668A5 JP 2010054701 A JP2010054701 A JP 2010054701A JP 2010054701 A JP2010054701 A JP 2010054701A JP 2011184668 A5 JP2011184668 A5 JP 2011184668A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- conductive thermoplastic
- thermoplastic adhesive
- composition according
- graphite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010054701A JP2011184668A (ja) | 2010-03-11 | 2010-03-11 | 熱伝導性熱可塑性接着剤組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010054701A JP2011184668A (ja) | 2010-03-11 | 2010-03-11 | 熱伝導性熱可塑性接着剤組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011184668A JP2011184668A (ja) | 2011-09-22 |
JP2011184668A5 true JP2011184668A5 (zh) | 2012-11-29 |
Family
ID=44791321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010054701A Pending JP2011184668A (ja) | 2010-03-11 | 2010-03-11 | 熱伝導性熱可塑性接着剤組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2011184668A (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101523144B1 (ko) * | 2013-12-11 | 2015-05-26 | 동의대학교 산학협력단 | 방열특성이 개선된 에폭시 복합수지 조성물 및 이를 이용한 방열 구조물 |
US20160046047A1 (en) * | 2014-08-14 | 2016-02-18 | Zephyros, Inc. | Reformable epoxy resin for composites |
CN108137415B (zh) * | 2015-09-23 | 2021-07-20 | 纳米技术仪器公司 | 一体化的高度取向的卤化石墨烯的整体式膜 |
JP7322382B2 (ja) * | 2018-11-09 | 2023-08-08 | 日本ゼオン株式会社 | 熱伝導シート |
EP4011617A4 (en) * | 2019-08-06 | 2023-09-13 | Resonac Corporation | PRIMER EQUIPPED THERMOPLASTIC RESIN ELEMENT AND RESIN-RESIN CONJUGATE |
WO2022254906A1 (ja) * | 2021-06-02 | 2022-12-08 | 旭化学工業株式会社 | 熱可塑性エポキシ樹脂、接着剤、改質剤、および、熱可塑性エポキシ樹脂の製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6290235A (ja) * | 1985-10-15 | 1987-04-24 | 鐘淵化学工業株式会社 | 電気用金属箔張積層板 |
JPH0347877A (ja) * | 1990-05-31 | 1991-02-28 | Toray Ind Inc | エポキシ系球状粒子状接着剤及びその製造方法 |
JPH06334288A (ja) * | 1993-05-20 | 1994-12-02 | Furukawa Electric Co Ltd:The | 金属ベースプリント基板 |
JP2000273426A (ja) * | 1999-03-29 | 2000-10-03 | Polymatech Co Ltd | 熱伝導性接着剤および接着方法ならびに半導体装置 |
CN101454418A (zh) * | 2006-06-21 | 2009-06-10 | 日立化成高分子株式会社 | 热导性热塑性粘合剂组合物 |
CN101479311B (zh) * | 2006-06-26 | 2012-11-21 | 松下电器产业株式会社 | 热固化性树脂组合物以及使用其的电路基板的安装方法以及修复工序 |
US20080039555A1 (en) * | 2006-08-10 | 2008-02-14 | Michel Ruyters | Thermally conductive material |
JP5004538B2 (ja) * | 2006-09-12 | 2012-08-22 | 日立化成ポリマー株式会社 | 熱伝導性湿気硬化型接着剤、及びその施工方法 |
JP5343335B2 (ja) * | 2006-09-29 | 2013-11-13 | 東レ株式会社 | 電子機器用接着剤シート |
JP2008214597A (ja) * | 2007-03-08 | 2008-09-18 | Toray Ind Inc | 電子部品用接着剤組成物 |
JP4495768B2 (ja) * | 2008-08-18 | 2010-07-07 | 積水化学工業株式会社 | 絶縁シート及び積層構造体 |
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2010
- 2010-03-11 JP JP2010054701A patent/JP2011184668A/ja active Pending
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