JP2011184668A5 - - Google Patents

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Publication number
JP2011184668A5
JP2011184668A5 JP2010054701A JP2010054701A JP2011184668A5 JP 2011184668 A5 JP2011184668 A5 JP 2011184668A5 JP 2010054701 A JP2010054701 A JP 2010054701A JP 2010054701 A JP2010054701 A JP 2010054701A JP 2011184668 A5 JP2011184668 A5 JP 2011184668A5
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JP
Japan
Prior art keywords
adhesive composition
conductive thermoplastic
thermoplastic adhesive
composition according
graphite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010054701A
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English (en)
Japanese (ja)
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JP2011184668A (ja
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Publication date
Application filed filed Critical
Priority to JP2010054701A priority Critical patent/JP2011184668A/ja
Priority claimed from JP2010054701A external-priority patent/JP2011184668A/ja
Publication of JP2011184668A publication Critical patent/JP2011184668A/ja
Publication of JP2011184668A5 publication Critical patent/JP2011184668A5/ja
Pending legal-status Critical Current

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JP2010054701A 2010-03-11 2010-03-11 熱伝導性熱可塑性接着剤組成物 Pending JP2011184668A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010054701A JP2011184668A (ja) 2010-03-11 2010-03-11 熱伝導性熱可塑性接着剤組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010054701A JP2011184668A (ja) 2010-03-11 2010-03-11 熱伝導性熱可塑性接着剤組成物

Publications (2)

Publication Number Publication Date
JP2011184668A JP2011184668A (ja) 2011-09-22
JP2011184668A5 true JP2011184668A5 (zh) 2012-11-29

Family

ID=44791321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010054701A Pending JP2011184668A (ja) 2010-03-11 2010-03-11 熱伝導性熱可塑性接着剤組成物

Country Status (1)

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JP (1) JP2011184668A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101523144B1 (ko) * 2013-12-11 2015-05-26 동의대학교 산학협력단 방열특성이 개선된 에폭시 복합수지 조성물 및 이를 이용한 방열 구조물
US20160046047A1 (en) * 2014-08-14 2016-02-18 Zephyros, Inc. Reformable epoxy resin for composites
CN108137415B (zh) * 2015-09-23 2021-07-20 纳米技术仪器公司 一体化的高度取向的卤化石墨烯的整体式膜
JP7322382B2 (ja) * 2018-11-09 2023-08-08 日本ゼオン株式会社 熱伝導シート
EP4011617A4 (en) * 2019-08-06 2023-09-13 Resonac Corporation PRIMER EQUIPPED THERMOPLASTIC RESIN ELEMENT AND RESIN-RESIN CONJUGATE
WO2022254906A1 (ja) * 2021-06-02 2022-12-08 旭化学工業株式会社 熱可塑性エポキシ樹脂、接着剤、改質剤、および、熱可塑性エポキシ樹脂の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6290235A (ja) * 1985-10-15 1987-04-24 鐘淵化学工業株式会社 電気用金属箔張積層板
JPH0347877A (ja) * 1990-05-31 1991-02-28 Toray Ind Inc エポキシ系球状粒子状接着剤及びその製造方法
JPH06334288A (ja) * 1993-05-20 1994-12-02 Furukawa Electric Co Ltd:The 金属ベースプリント基板
JP2000273426A (ja) * 1999-03-29 2000-10-03 Polymatech Co Ltd 熱伝導性接着剤および接着方法ならびに半導体装置
CN101454418A (zh) * 2006-06-21 2009-06-10 日立化成高分子株式会社 热导性热塑性粘合剂组合物
CN101479311B (zh) * 2006-06-26 2012-11-21 松下电器产业株式会社 热固化性树脂组合物以及使用其的电路基板的安装方法以及修复工序
US20080039555A1 (en) * 2006-08-10 2008-02-14 Michel Ruyters Thermally conductive material
JP5004538B2 (ja) * 2006-09-12 2012-08-22 日立化成ポリマー株式会社 熱伝導性湿気硬化型接着剤、及びその施工方法
JP5343335B2 (ja) * 2006-09-29 2013-11-13 東レ株式会社 電子機器用接着剤シート
JP2008214597A (ja) * 2007-03-08 2008-09-18 Toray Ind Inc 電子部品用接着剤組成物
JP4495768B2 (ja) * 2008-08-18 2010-07-07 積水化学工業株式会社 絶縁シート及び積層構造体

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