US20160046047A1 - Reformable epoxy resin for composites - Google Patents
Reformable epoxy resin for composites Download PDFInfo
- Publication number
- US20160046047A1 US20160046047A1 US14/826,345 US201514826345A US2016046047A1 US 20160046047 A1 US20160046047 A1 US 20160046047A1 US 201514826345 A US201514826345 A US 201514826345A US 2016046047 A1 US2016046047 A1 US 2016046047A1
- Authority
- US
- United States
- Prior art keywords
- composite structure
- epoxy resin
- resin material
- reformable epoxy
- reformable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 75
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 41
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims description 91
- 239000004593 Epoxy Substances 0.000 claims description 18
- 230000009477 glass transition Effects 0.000 claims description 18
- 239000002023 wood Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 6
- 239000012815 thermoplastic material Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000002657 fibrous material Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 47
- 230000001070 adhesive effect Effects 0.000 description 47
- 229920001187 thermosetting polymer Polymers 0.000 description 11
- 239000004615 ingredient Substances 0.000 description 10
- 241000894007 species Species 0.000 description 10
- 150000002118 epoxides Chemical group 0.000 description 9
- 239000000835 fiber Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 4
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- -1 monoethanolamine) Chemical compound 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 238000009435 building construction Methods 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000002407 reforming Methods 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- DJCYQEDZXFZHRL-UHFFFAOYSA-N 2-(2-hydroxyphenoxy)peroxyphenol Chemical compound OC1=CC=CC=C1OOOC1=CC=CC=C1O DJCYQEDZXFZHRL-UHFFFAOYSA-N 0.000 description 1
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- 241000208140 Acer Species 0.000 description 1
- 244000198134 Agave sisalana Species 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 244000025254 Cannabis sativa Species 0.000 description 1
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 1
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 240000000491 Corchorus aestuans Species 0.000 description 1
- 235000011777 Corchorus aestuans Nutrition 0.000 description 1
- 235000010862 Corchorus capsularis Nutrition 0.000 description 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 235000009120 camo Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 235000005607 chanvre indien Nutrition 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011487 hemp Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000002557 mineral fiber Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/003—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised by the matrix material, e.g. material composition or physical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/30—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B1/00—Layered products having a non-planar shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B21/042—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of wood
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B21/08—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
- B32B2262/0269—Aromatic polyamide fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/04—Cellulosic plastic fibres, e.g. rayon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/738—Thermoformability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/75—Printability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2363/00—Epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2479/00—Furniture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2605/00—Vehicles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2605/00—Vehicles
- B32B2605/18—Aircraft
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F41—WEAPONS
- F41H—ARMOUR; ARMOURED TURRETS; ARMOURED OR ARMED VEHICLES; MEANS OF ATTACK OR DEFENCE, e.g. CAMOUFLAGE, IN GENERAL
- F41H1/00—Personal protection gear
- F41H1/04—Protection helmets
- F41H1/08—Protection helmets of plastics; Plastic head-shields
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F41—WEAPONS
- F41H—ARMOUR; ARMOURED TURRETS; ARMOURED OR ARMED VEHICLES; MEANS OF ATTACK OR DEFENCE, e.g. CAMOUFLAGE, IN GENERAL
- F41H5/00—Armour; Armour plates
- F41H5/06—Shields
- F41H5/08—Shields for personal use, i.e. hand held shields
Definitions
- the present invention pertains generally to reformable epoxy resins for use in composites, and more particularly to reformable epoxy resin adhesives layered between material layers whereby the reformable epoxy resin permits shaping and re-shaping of the composite structures without adhesive failure of the adhesive or breaking of the material layers.
- Composite structures are common in a wide variety of industries including building construction, sporting equipment, furniture, automotive, train, aerospace (and other transportation vehicles) among others. It is common to use composite structures due to their high strength and the variety of materials that can be utilized for the various composite layers. However, it is challenging to identify materials that provide sufficient strength and also sufficient cohesion with adjacent material layers, especially when it is desirable to mold or shape the composite structures. Thus, there are often significant limitations on the ability to curve, mold and form composite structures having both sufficient strength and sufficient cohesion. Further, the ability to mold complex shapes may be limited by the adhesive used to form the composite, such that the adhesive fails to adhere the layers when the composite structure is molded. Such adhesives also prevent reforming of a composite structure into a different shape after initial forming of the composite structure.
- the teachings herein are directed to a method comprising forming a substantially planar composite structure having at least two layers, applying a reformable epoxy resin material onto one or more of the at least two layers, optionally cutting the composite structure to a desired shape and heating the composite structure in a mold to form a non-planar composite structure.
- the reformable epoxy resin material may fall below its glass transition temperature upon exposure to ambient temperature in less than 5 minutes. After the reformable epoxy resin material falls below its glass transition temperature, it may be heated multiple times above its glass transition temperature for molding into the non-planar composite structure. The reformable epoxy resin material falls below its glass transition temperature upon exposure to ambient temperature.
- the composite structure may be a furniture panel.
- the composite structure may be an automotive or aerospace panel.
- the reformable epoxy resin material may fall below its glass transition temperature prior to forming the non-planar composite structure.
- At least one of the at least two layers may be a wood material.
- At least one of the at least two layers may be a polymeric material.
- At least one of the at least two layers may be a cellulosic material.
- the reformable epoxy resin material may be stored at room temperature prior to use.
- the shelf life of the reformable epoxy resin material may be at least about 3 months, at least about 6 months, at least about 1 year, or even at least about 5 years.
- the reformable epoxy resin material may be recyclable.
- the glass transition temperature of the reformable epoxy resin material may be higher than room temperature but lower than 200° C.
- the reformable epoxy resin material can be processed at a temperature of less than 200° C., or even less than 150° C.
- the stiffness of the reformable epoxy resin material may be substantially higher than the stiffness of a thermoplastic material without an epoxy component.
- the reformable epoxy resin material may be capable of receiving printed material prior to forming the composite structure whereby the printed material can be clearly viewed after formation of the composite structure.
- the resulting composite structure may be stampable.
- the resulting composite structure may include natural fiber materials.
- the resulting composite structure does not fail at greater than 2.5% strain during a three point bend test.
- the resulting composite structure does not fail at greater than 3.5% strain during a three point bend test.
- the teachings herein facilitate a simple process for forming and shaping composites structures using a reformable epoxy resin adhesive.
- the composite structures are formed such that the material layers will fail during a curving or molding process before the adhesive material fails.
- the resulting composite structures are thus stronger than similar structures made using a typical thermoplastic material, and also more flexible (e.g., moldable, shapeable and/or stampable) than similar structures made using a typical epoxy-based thermoset material.
- the teachings herein make advantageous use of a reformable epoxy resin epoxy adhesive that hardens and adheres when it cools.
- the teachings herein contemplate a method for providing composite structures that are formable and moldable after the reformable epoxy resin material is heated and subsequently falls below its glass transition temperature.
- the reformable epoxy resin adhesive provides structural toughness associated with epoxy materials, but is amenable to molding and re-molding after cure unlike other epoxy-based adhesive materials.
- Thermoplastic films are known in the art of composite structure formation, but such films typically fail to provide sufficient adhesion and stiffness. Reformable epoxy resin adhesives for use in composite structures provide additional stiffness, adhesion and allow for reforming and are therefore useful for composites that are formed to have curved profiles.
- RER reformable epoxy resin
- the RER materials may be provided initially in a pellet form and then formed into an RER film. Accordingly, a reformable epoxy resin may be desirable because of its long shelf life, which may be in pelletized form or in a film form, or in an alternative adhesive form. It also may not require storage at a refrigerated temperature, unlike some alternative materials.
- the shelf life of the reformable epoxy resin material is at least about 3 months, at least about 6 months, at least about 1 year, or even at least about 5 years.
- the use of epoxy-based adhesives provides for composite materials that can endure minimal curving based on the relatively brittle nature of the epoxy adhesives.
- the amount of curving that a composite structure can withstand without cohesive failure is controlled by the adhesive.
- the amount of curving that a composite structure can withstand when formed with the adhesives described herein is controlled by the material layers that receive the adhesive.
- An advantage of the present teachings over existing epoxy materials used for adhesives is that the materials herein have improved strength and adhesion as compared to typical thermoplastic materials and are also significantly more flexible than other epoxy-based adhesives. Further, the RER adhesive can be easily and selectively removed by the addition of heat. Thus, a composite material formed using an RER adhesive could be shaped and reshaped by the addition of heat, as required. The removed RER adhesive may also be recyclable and thus re-used. Additional benefits of the RER material include fast hardening and adhesion, and also the ability to remove the adhesive and re-mold any composite formed with the adhesive. Adhesion, hardening, and returning to a solid state upon cooling of the RER begins almost immediately after heating is stopped. Full adhesion can occur within about 10 seconds to about 60 seconds (e.g., about 30 seconds). It is contemplated that allowing the adhesive to return to ambient temperature is sufficient for adhesion, and additional hardening steps are possible, but not necessary.
- Exemplary RER materials are made using bisphenol A diglycidyl ether (BADGE) and monoethanolamine.
- BADGE diglycidyl ether
- T g glass transition temperature
- BADGE may be replaced by an epoxy monomer with less mobility.
- epoxy monomers may include diglycidylether of fluoren diphenol or 1,6 napthalene diepoxy.
- BADGE can be replaced by a brominated bisphenol A epoxy resin.
- the RER material having at least one epoxide group may be hydroxy-phenoxyether polymer, such as a polyetheramine thermoplastic material as described herein.
- thermoplastic polymeric material having at least one epoxide group may be a product (e.g., a thermoplastic condensation reaction product) of a reaction of a mono-functional or di-functional species (i.e., respectively, a species having one or two reactive groups, such as an amide containing species), with an epoxide-containing moiety, such as a diepoxide (i.e., a compound having two epoxide functionalities), reacted under conditions for causing the hydroxyl moieties to react with the epoxy moieties to form a generally linear backbone polymer chain with ether linkages.
- a mono-functional or di-functional species i.e., respectively, a species having one or two reactive groups, such as an amide containing species
- an epoxide-containing moiety such as a diepoxide (i.e., a compound having two epoxide functionalities)
- examples of such mono-functional or di-functional species may include a dihydric phenol, a secondary amine (e.g., a bis-secondary amine), a primary amine, or any combination thereof. Any amine of the functional species can be an aromatic amine, an aliphatic amine or a combination thereof.
- the mono-functional or di-functional species may have one or two functionalities capable of reacting with epoxide groups to form a generally non-cross-linked polymer.
- ком ⁇ онент for reaction with an epoxy moiety in accordance with the present teachings includes an ethanolamine (e.g., monoethanolamine), piperazine or a combination thereof. Any of the illustrative functional species may be substituted or unsubstituted.
- epoxide-containing moieties may be employed, as is taught in U.S. Pat. No. 6,011,111 (incorporated by reference; see, e.g., Cols. 5-6), and WO 98/14498 (incorporated by reference; see, e.g., page 8) such moieties may include at least one mono-functional epoxide and/or a di-functional epoxide (“diepoxide”).
- Diepoxide a di-functional epoxide
- An example of a diepoxide that can be employed in the teachings includes a diglycidyl ether of a dihydric phenol (e.g., resorcinol, biphenol or bisphenol A). Any epoxide-containing moiety herein may be an aliphatic and/or an aromatic epoxide.
- the composite structures envisioned herein may comprise panels consisting of a plurality of material layers with the reformable epoxy resin adhesive located onto and/or between the plurality of material layers.
- the material layers may be of wood, paper, fabric, plastic or metal.
- the material layers may be a naturally occurring material (e.g., a rubber, a cellulose, sisal, jute, hemp, or some other naturally occurring material).
- the material layers may include a natural fiber material.
- the material layers may be a synthetic material (e.g., a polymer (which may be a homopolymer, a copolymer, a terpolymer, a blend, or any combination thereof)).
- the material layers may include fibers selected from (organic or inorganic) mineral fibers (e.g., glass fibers, such as E-glass fibers, S-glass, B-glass or otherwise), polymeric fibers (e.g., an aramid fiber, a cellulose fiber, or otherwise), carbon fibers, metal fibers, natural fibers (e.g., derived from an agricultural source), or any combination thereof.
- the plurality of elongated fibers may be oriented generally parallel to each other. They may be braided. They may be twisted. Collections of fibers may be woven and/or nonwoven.
- the material layers may include a honeycomb or other material support structure.
- the material layers may comprise the same material or may comprise different materials.
- the material layers may include exterior veneer layers with internal layers that provide sufficient support for the external veneer layers.
- the composite structure may include any structure where the reformable epoxy resin can be utilized with an external veneer to provide a visually appealing exterior surface to the composite structure.
- the reformable epoxy resin material is capable of receiving printed material prior to forming the composite structure whereby the printed material can be clearly viewed after formation of the composite structure.
- a liquid material for the adhesive
- the present teachings also contemplate using an RER film.
- Using a film can be beneficial, as it avoids bringing significant unwanted mass to the composite structure, as a liquid adhesive may do.
- a film also enables the user to control the quantity and distribution of the adhesive, which may assist in handling the adhesive.
- the film may be located along the entirety of a surface of a material layer of the composite structure, or may be located onto only portions of a surface of a material layer.
- the adhesive film may be a continuous sheet or may be cut into strips or any other shape to facilitate connection between one or more material layers of the composite structure.
- RER adhesives are advantageous as they allow for faster hardening and adhesion, thereby reducing the need for extended periods of time and large areas of space for curing adhesives in composite structures. While RER adhesives may be workable at ambient temperature, it is often desirable to have a heat applying step to soften or melt the RER adhesive to allow it to move or become more workable. Heating the resulting composite structure allows for ease of formability into a desired shape (e.g., by molding or stamping), which may have a curved profile. Adhesion and hardening of the RER begins almost immediately after heating is stopped and full adhesion can occur within about 10 seconds to about 5 minutes (e.g., about 2 minutes).
- the RER adhesive may be applied as a film layer to a substrate (e.g., a material layer).
- the substrate may be a wood-based material.
- the substrate may be a plastic or metallic material.
- a second material layer may be located over and onto the RER adhesive film layer. Additional layers of RER adhesive and material layers may be alternated to any desired thickness to make a resulting composite. Additional covering material layers (e.g., veneers) may be added to the composite, each veneer adjacent a layer of the RER film.
- the composite may then be heated and shaped, either simultaneously or heated and then shaped to soften the RER adhesive and form a curved composite.
- Cooling at ambient temperature may be sufficient to reduce the RER adhesive to a temperature below its glass transition temperature for sufficient adhering and hardening of the curved composite.
- the glass transition temperature of the RER adhesive may be greater than 30° C., greater than 50° C., greater than 60° C., or even greater than 70° C.
- the glass transition temperature of the reformable epoxy resin material may be higher than room temperature but lower than 200° C.
- the RER adhesive may thus be processed at a temperature of less than 200° C., or even less than 150° C.
- thermoset epoxy material including Araldite 1564 SP epoxy and Aradur 22962 curing agent (both available from Huntsman Corporation, The Woodlands, TX) in a ratio of about 4:1.
- the second piece was laminated with an RER film material in accordance with the teachings herein (two sheets of 0.005′′ film). All laminates were cured in a press at 75 psi and 120° C. for 15 minutes then 75 psi at 150° C. for 2 hours. A three-point bend test for flexural properties was performed at 85° C. (in accordance with ASTM D790). The thermoset laminate failed at 2.2% strain. The RER film laminate did not fail at 2.2% strain.
- the RER film laminate did not fail even up to 3.8% strain. Testing was stopped at 3.8% strain due to failure of the wood material (as opposed to failure of the laminating material).
- the thermoset laminate was thus limited by the flexibility of the thermoset epoxy, whereas the RER laminate was limited only by the flexibility of the wood. This shows that the shaping of thermoset laminates is limited by the epoxy laminate, while the RER laminate has greater flexibility. Furthermore, the tensile strengths of the thermoset laminate (41 MPa) and the RER laminate (44 MPa) are comparable. Thus the RER material is not significantly weaker than a thermoset epoxy, as may be expected from a typical thermoplastic material.
- thermoset laminate was shapeable, whereas the thermoset laminate was not. Results are shown in the table below.
- RER adhesives may be used for the manufacture of furniture including chairs, tables, cupboards, bed frames, or any other type of furniture where curvature may be desired.
- RER adhesives may be used for the manufacture of sporting equipment such as racquets, snow boards, skis, hockey and lacrosse sticks, helmets, or the like.
- RER adhesives may be used for the manufacture of ballistic or other safety devices such as shields, helmets, body armor or the like.
- RER adhesives may be used for the manufacture of building construction materials, especially those where aesthetic presentation is important such as home and office interiors.
- any member of a genus may be excluded from the genus; and/or any member of a Markush grouping may be excluded from the grouping.
- any numerical values recited herein include all values from the lower value to the upper value in increments of one unit provided that there is a separation of at least 2 units between any lower value and any higher value.
- the amount of a component, a property, or a value of a process variable such as, for example, temperature, pressure, time and the like is, for example, from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70
- intermediate range values such as (for example, 15 to 85, 22 to 68, 43 to 51, 30 to 32 etc.) are within the teachings of this specification.
- individual intermediate values are also within the present teachings.
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Abstract
Description
- The present invention pertains generally to reformable epoxy resins for use in composites, and more particularly to reformable epoxy resin adhesives layered between material layers whereby the reformable epoxy resin permits shaping and re-shaping of the composite structures without adhesive failure of the adhesive or breaking of the material layers.
- Composite structures are common in a wide variety of industries including building construction, sporting equipment, furniture, automotive, train, aerospace (and other transportation vehicles) among others. It is common to use composite structures due to their high strength and the variety of materials that can be utilized for the various composite layers. However, it is challenging to identify materials that provide sufficient strength and also sufficient cohesion with adjacent material layers, especially when it is desirable to mold or shape the composite structures. Thus, there are often significant limitations on the ability to curve, mold and form composite structures having both sufficient strength and sufficient cohesion. Further, the ability to mold complex shapes may be limited by the adhesive used to form the composite, such that the adhesive fails to adhere the layers when the composite structure is molded. Such adhesives also prevent reforming of a composite structure into a different shape after initial forming of the composite structure.
- There is thus a need for an adhesive that avoids these common problems encountered with forming composite structures into curved and/or complex shapes.
- The teachings herein are directed to a method comprising forming a substantially planar composite structure having at least two layers, applying a reformable epoxy resin material onto one or more of the at least two layers, optionally cutting the composite structure to a desired shape and heating the composite structure in a mold to form a non-planar composite structure.
- The reformable epoxy resin material may fall below its glass transition temperature upon exposure to ambient temperature in less than 5 minutes. After the reformable epoxy resin material falls below its glass transition temperature, it may be heated multiple times above its glass transition temperature for molding into the non-planar composite structure. The reformable epoxy resin material falls below its glass transition temperature upon exposure to ambient temperature.
- The composite structure may be a furniture panel. The composite structure may be an automotive or aerospace panel. The reformable epoxy resin material may fall below its glass transition temperature prior to forming the non-planar composite structure. At least one of the at least two layers may be a wood material. At least one of the at least two layers may be a polymeric material. At least one of the at least two layers may be a cellulosic material. The reformable epoxy resin material may be stored at room temperature prior to use. The shelf life of the reformable epoxy resin material may be at least about 3 months, at least about 6 months, at least about 1 year, or even at least about 5 years.
- The reformable epoxy resin material may be recyclable. The glass transition temperature of the reformable epoxy resin material may be higher than room temperature but lower than 200° C. The reformable epoxy resin material can be processed at a temperature of less than 200° C., or even less than 150° C. The stiffness of the reformable epoxy resin material may be substantially higher than the stiffness of a thermoplastic material without an epoxy component. The reformable epoxy resin material may be capable of receiving printed material prior to forming the composite structure whereby the printed material can be clearly viewed after formation of the composite structure. The resulting composite structure may be stampable. The resulting composite structure may include natural fiber materials. The resulting composite structure does not fail at greater than 2.5% strain during a three point bend test. The resulting composite structure does not fail at greater than 3.5% strain during a three point bend test.
- The teachings herein facilitate a simple process for forming and shaping composites structures using a reformable epoxy resin adhesive. The composite structures are formed such that the material layers will fail during a curving or molding process before the adhesive material fails. The resulting composite structures are thus stronger than similar structures made using a typical thermoplastic material, and also more flexible (e.g., moldable, shapeable and/or stampable) than similar structures made using a typical epoxy-based thermoset material.
- The present teachings meet one or more of the above needs by the improved composite structures and methods described herein. The explanations and illustrations presented herein are intended to acquaint others skilled in the art with the teachings, its principles, and its practical application. Those skilled in the art may adapt and apply the teachings in its numerous forms, as may be best suited to the requirements of a particular use. Accordingly, the specific embodiments of the present teachings as set forth are not intended as being exhaustive or limiting of the teachings. The scope of the teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are incorporated by reference for all purposes. Other combinations are also possible as will be gleaned from the following claims, which are also hereby incorporated by reference into this written description.
- This application claims the benefit of the filing date of U.S. Provisional Application No. 62/037,199, filed Aug. 14, 2014, the entirety of the contents of this application being hereby incorporated by reference for all purposes.
- The teachings herein make advantageous use of a reformable epoxy resin epoxy adhesive that hardens and adheres when it cools. The teachings herein contemplate a method for providing composite structures that are formable and moldable after the reformable epoxy resin material is heated and subsequently falls below its glass transition temperature. The reformable epoxy resin adhesive provides structural toughness associated with epoxy materials, but is amenable to molding and re-molding after cure unlike other epoxy-based adhesive materials. Thermoplastic films are known in the art of composite structure formation, but such films typically fail to provide sufficient adhesion and stiffness. Reformable epoxy resin adhesives for use in composite structures provide additional stiffness, adhesion and allow for reforming and are therefore useful for composites that are formed to have curved profiles.
- The materials and methods taught herein include possible uses for reformable epoxy resin (RER) materials. It is possible that the RER materials may be provided initially in a pellet form and then formed into an RER film. Accordingly, a reformable epoxy resin may be desirable because of its long shelf life, which may be in pelletized form or in a film form, or in an alternative adhesive form. It also may not require storage at a refrigerated temperature, unlike some alternative materials. The shelf life of the reformable epoxy resin material is at least about 3 months, at least about 6 months, at least about 1 year, or even at least about 5 years.
- Typically, the use of epoxy-based adhesives provides for composite materials that can endure minimal curving based on the relatively brittle nature of the epoxy adhesives. As a result, the amount of curving that a composite structure can withstand without cohesive failure is controlled by the adhesive. However, the amount of curving that a composite structure can withstand when formed with the adhesives described herein is controlled by the material layers that receive the adhesive.
- An advantage of the present teachings over existing epoxy materials used for adhesives is that the materials herein have improved strength and adhesion as compared to typical thermoplastic materials and are also significantly more flexible than other epoxy-based adhesives. Further, the RER adhesive can be easily and selectively removed by the addition of heat. Thus, a composite material formed using an RER adhesive could be shaped and reshaped by the addition of heat, as required. The removed RER adhesive may also be recyclable and thus re-used. Additional benefits of the RER material include fast hardening and adhesion, and also the ability to remove the adhesive and re-mold any composite formed with the adhesive. Adhesion, hardening, and returning to a solid state upon cooling of the RER begins almost immediately after heating is stopped. Full adhesion can occur within about 10 seconds to about 60 seconds (e.g., about 30 seconds). It is contemplated that allowing the adhesive to return to ambient temperature is sufficient for adhesion, and additional hardening steps are possible, but not necessary.
- Exemplary RER materials are made using bisphenol A diglycidyl ether (BADGE) and monoethanolamine. For some applications that may require a higher glass transition temperature (Tg), it is contemplated that BADGE may be replaced by an epoxy monomer with less mobility. Such epoxy monomers may include diglycidylether of fluoren diphenol or 1,6 napthalene diepoxy. Also, it is contemplated that where fire resistance is desired, BADGE can be replaced by a brominated bisphenol A epoxy resin. The RER material having at least one epoxide group may be hydroxy-phenoxyether polymer, such as a polyetheramine thermoplastic material as described herein. For example, such thermoplastic polymeric material having at least one epoxide group may be a product (e.g., a thermoplastic condensation reaction product) of a reaction of a mono-functional or di-functional species (i.e., respectively, a species having one or two reactive groups, such as an amide containing species), with an epoxide-containing moiety, such as a diepoxide (i.e., a compound having two epoxide functionalities), reacted under conditions for causing the hydroxyl moieties to react with the epoxy moieties to form a generally linear backbone polymer chain with ether linkages.
- Though other functional species may be employed, as is taught in U.S. Pat. No. 6,011,111 (incorporated by reference; see, e.g., Cols. 6-8) and WO 98/14498 (incorporated by reference; see, e.g., pages 8-11) examples of such mono-functional or di-functional species may include a dihydric phenol, a secondary amine (e.g., a bis-secondary amine), a primary amine, or any combination thereof. Any amine of the functional species can be an aromatic amine, an aliphatic amine or a combination thereof. The mono-functional or di-functional species may have one or two functionalities capable of reacting with epoxide groups to form a generally non-cross-linked polymer. Some particular examples, without limitation, of functional species for reaction with an epoxy moiety in accordance with the present teachings includes an ethanolamine (e.g., monoethanolamine), piperazine or a combination thereof. Any of the illustrative functional species may be substituted or unsubstituted.
- Though other epoxide-containing moieties may be employed, as is taught in U.S. Pat. No. 6,011,111 (incorporated by reference; see, e.g., Cols. 5-6), and WO 98/14498 (incorporated by reference; see, e.g., page 8) such moieties may include at least one mono-functional epoxide and/or a di-functional epoxide (“diepoxide”). An example of a diepoxide that can be employed in the teachings includes a diglycidyl ether of a dihydric phenol (e.g., resorcinol, biphenol or bisphenol A). Any epoxide-containing moiety herein may be an aliphatic and/or an aromatic epoxide.
- Other examples of illustrative materials, functional species and diepoxides are described in U.S. Pat. Nos. 5,115,075; 4,438,254; 6,011,111; and WO 98/14498 (see e.g., pages 3-8) along with illustrative synthesis conditions, all incorporated by reference herein (see also U.S. Pat. Nos. 3,317,471 and 4,647,648, also incorporated by reference herein). Examples of such materials also can be found, without limitation at paragraphs 15-25 of Published U.S. Patent Application No. 20070270515 (Chmielewski et al), incorporated by reference for all purposes.
- The composite structures envisioned herein may comprise panels consisting of a plurality of material layers with the reformable epoxy resin adhesive located onto and/or between the plurality of material layers. In this instance, the material layers may be of wood, paper, fabric, plastic or metal. The material layers may be a naturally occurring material (e.g., a rubber, a cellulose, sisal, jute, hemp, or some other naturally occurring material). The material layers may include a natural fiber material. The material layers may be a synthetic material (e.g., a polymer (which may be a homopolymer, a copolymer, a terpolymer, a blend, or any combination thereof)). It may be a carbon derived material (e.g., carbon fiber, graphite, graphene, or otherwise). The material layers may include fibers selected from (organic or inorganic) mineral fibers (e.g., glass fibers, such as E-glass fibers, S-glass, B-glass or otherwise), polymeric fibers (e.g., an aramid fiber, a cellulose fiber, or otherwise), carbon fibers, metal fibers, natural fibers (e.g., derived from an agricultural source), or any combination thereof. The plurality of elongated fibers may be oriented generally parallel to each other. They may be braided. They may be twisted. Collections of fibers may be woven and/or nonwoven.
- The material layers may include a honeycomb or other material support structure. The material layers may comprise the same material or may comprise different materials. The material layers may include exterior veneer layers with internal layers that provide sufficient support for the external veneer layers. The composite structure may include any structure where the reformable epoxy resin can be utilized with an external veneer to provide a visually appealing exterior surface to the composite structure. In addition, the reformable epoxy resin material is capable of receiving printed material prior to forming the composite structure whereby the printed material can be clearly viewed after formation of the composite structure. Certain composite materials are disclosed in U.S. Provisional Application Nos. 62/130,832, filed Mar. 10, 2015; and 62/183,380, filed Jun. 23, 2015, the entirety of these applications being hereby incorporated by reference for all purposes.
- While it is possible to use a liquid material for the adhesive, the present teachings also contemplate using an RER film. Using a film can be beneficial, as it avoids bringing significant unwanted mass to the composite structure, as a liquid adhesive may do. A film also enables the user to control the quantity and distribution of the adhesive, which may assist in handling the adhesive. The film may be located along the entirety of a surface of a material layer of the composite structure, or may be located onto only portions of a surface of a material layer. The adhesive film may be a continuous sheet or may be cut into strips or any other shape to facilitate connection between one or more material layers of the composite structure. Certain films that may be used in accordance with the teachings herein are described in U.S. Provisional Application No. 62/113,728, filed Feb. 9, 2015, the entirety of this application being hereby incorporated by reference for all purposes.
- RER adhesives are advantageous as they allow for faster hardening and adhesion, thereby reducing the need for extended periods of time and large areas of space for curing adhesives in composite structures. While RER adhesives may be workable at ambient temperature, it is often desirable to have a heat applying step to soften or melt the RER adhesive to allow it to move or become more workable. Heating the resulting composite structure allows for ease of formability into a desired shape (e.g., by molding or stamping), which may have a curved profile. Adhesion and hardening of the RER begins almost immediately after heating is stopped and full adhesion can occur within about 10 seconds to about 5 minutes (e.g., about 2 minutes). It is contemplated that allowing the adhesive to return to ambient temperature is sufficient for adhesion, and additional hardening steps are possible, but not necessary. With an RER adhesive, it is also possible that the bond formed between the adhesive and the substrates of the composites can be debonded by increasing the temperature over the glass transition temperature (Tg) of the RER to allow the bonded substrates to be separated.
- In one embodiment, the RER adhesive may be applied as a film layer to a substrate (e.g., a material layer). The substrate may be a wood-based material. The substrate may be a plastic or metallic material. A second material layer may be located over and onto the RER adhesive film layer. Additional layers of RER adhesive and material layers may be alternated to any desired thickness to make a resulting composite. Additional covering material layers (e.g., veneers) may be added to the composite, each veneer adjacent a layer of the RER film. The composite may then be heated and shaped, either simultaneously or heated and then shaped to soften the RER adhesive and form a curved composite. Cooling at ambient temperature may be sufficient to reduce the RER adhesive to a temperature below its glass transition temperature for sufficient adhering and hardening of the curved composite. The glass transition temperature of the RER adhesive may be greater than 30° C., greater than 50° C., greater than 60° C., or even greater than 70° C. The glass transition temperature of the reformable epoxy resin material may be higher than room temperature but lower than 200° C. The RER adhesive may thus be processed at a temperature of less than 200° C., or even less than 150° C.
- Two pieces of ⅛″ maple wood were each laminated. The first piece was laminated with a thermoset epoxy material including Araldite 1564 SP epoxy and Aradur 22962 curing agent (both available from Huntsman Corporation, The Woodlands, TX) in a ratio of about 4:1. The second piece was laminated with an RER film material in accordance with the teachings herein (two sheets of 0.005″ film). All laminates were cured in a press at 75 psi and 120° C. for 15 minutes then 75 psi at 150° C. for 2 hours. A three-point bend test for flexural properties was performed at 85° C. (in accordance with ASTM D790). The thermoset laminate failed at 2.2% strain. The RER film laminate did not fail at 2.2% strain. The RER film laminate did not fail even up to 3.8% strain. Testing was stopped at 3.8% strain due to failure of the wood material (as opposed to failure of the laminating material). The thermoset laminate was thus limited by the flexibility of the thermoset epoxy, whereas the RER laminate was limited only by the flexibility of the wood. This shows that the shaping of thermoset laminates is limited by the epoxy laminate, while the RER laminate has greater flexibility. Furthermore, the tensile strengths of the thermoset laminate (41 MPa) and the RER laminate (44 MPa) are comparable. Thus the RER material is not significantly weaker than a thermoset epoxy, as may be expected from a typical thermoplastic material.
- The laminates were then allowed to cool under strain. When the strain was removed, the thermoset laminate returned to its original shape. As desired, the RER laminate retained the curved shape. Thus, the RER laminate was shapeable, whereas the thermoset laminate was not. Results are shown in the table below.
-
Ultimate Tensile Strain at Sample Thickness Peak Load Strength Break Type (mm) (N) (MPa) (mm/mm) Result Thermoset 29.490 161.443 41.0 0.022 Failed under strain at 2.2%; Laminate cooled and strain removed - returned to original shape. RER 29.610 168.445 44.2 0.038 No failure under strain at 3.8%; Laminate (no break) cooled and retained curved shape. - As mentioned above, the composite materials described herein are applicable to wide range of products. RER adhesives may be used for the manufacture of furniture including chairs, tables, cupboards, bed frames, or any other type of furniture where curvature may be desired. RER adhesives may be used for the manufacture of sporting equipment such as racquets, snow boards, skis, hockey and lacrosse sticks, helmets, or the like. RER adhesives may be used for the manufacture of ballistic or other safety devices such as shields, helmets, body armor or the like. RER adhesives may be used for the manufacture of building construction materials, especially those where aesthetic presentation is important such as home and office interiors.
- As used herein, unless otherwise stated, the teachings envision that any member of a genus (list) may be excluded from the genus; and/or any member of a Markush grouping may be excluded from the grouping.
- Unless otherwise stated, any numerical values recited herein include all values from the lower value to the upper value in increments of one unit provided that there is a separation of at least 2 units between any lower value and any higher value. As an example, if it is stated that the amount of a component, a property, or a value of a process variable such as, for example, temperature, pressure, time and the like is, for example, from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, it is intended that intermediate range values such as (for example, 15 to 85, 22 to 68, 43 to 51, 30 to 32 etc.) are within the teachings of this specification. Likewise, individual intermediate values are also within the present teachings. For values which are less than one, one unit is considered to be 0.0001, 0.001, 0.01 or 0.1 as appropriate. These are only examples of what is specifically intended and all possible combinations of numerical values between the lowest value and the highest value enumerated are to be considered to be expressly stated in this application in a similar manner. As can be seen, the teaching of amounts expressed as “parts by weight” herein also contemplates the same ranges expressed in terms of percent by weight. Thus, an expression in the of a range in terms of at “x′ parts by weight of the resulting polymeric blend composition” also contemplates a teaching of ranges of same recited amount of “x” in percent by weight of the resulting polymeric blend composition.”
- Unless otherwise stated, all ranges include both endpoints and all numbers between the endpoints. The use of “about” or “approximately” in connection with a range applies to both ends of the range. Thus, “about 20 to 30” is intended to cover “about 20 to about 30”, inclusive of at least the specified endpoints.
- The disclosures of all articles and references, including patent applications and publications, are incorporated by reference for ail purposes. The term “consisting essentially of to describe a combination shall include the elements, ingredients, components or steps identified, and such other elements ingredients, components or steps that do not materially affect the basic and novel characteristics of the combination. The use of the terms “comprising” or “including” to describe combinations of elements, ingredients, components or steps herein also contemplates embodiments that consist of, or consist essentially of the elements, ingredients, components or steps.
- Plural elements, ingredients, components or steps can be provided by a single integrated element, ingredient, component or step. Alternatively, a single integrated element, ingredient, component or step might be divided into separate plural elements, ingredients, components or steps. The disclosure of “a” or “one” to describe an element, ingredient, component or step is not intended to foreclose additional elements, ingredients, components or steps.
- It is understood that the above description is intended to be illustrative and not restrictive. Many embodiments as well as many applications besides the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the invention should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are incorporated by reference for all purposes. The omission in the following claims of any aspect of subject matter that is disclosed herein is not a disclaimer of such subject matter, nor should it be regarded that the inventors did not consider such subject matter to be part of the disclosed inventive subject matter.
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US18/112,899 US20230211578A1 (en) | 2014-08-14 | 2023-02-22 | Reformable epoxy resin for composites |
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US201462037199P | 2014-08-14 | 2014-08-14 | |
US14/826,345 US20160046047A1 (en) | 2014-08-14 | 2015-08-14 | Reformable epoxy resin for composites |
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EP (2) | EP4140733A1 (en) |
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US9586363B2 (en) | 2013-10-04 | 2017-03-07 | Zephyros, Inc. | Method and apparatus for adhesion of inserts |
US9796891B2 (en) | 2014-08-11 | 2017-10-24 | Zephyros, Inc. | Panel edge enclosures |
US10570258B2 (en) | 2015-03-10 | 2020-02-25 | Zephyros, Inc. | Composites with thermoplastic epoxy polymeric phase, articles such as carriers made therewith and associated methods |
US10689784B2 (en) | 2014-10-22 | 2020-06-23 | Zephryos, Inc. | Reformable resin fibers |
US11155673B2 (en) | 2015-11-12 | 2021-10-26 | Zephyros, Inc. | Controlled glass transition polymeric material and method |
US11332197B2 (en) | 2018-10-12 | 2022-05-17 | Zephyros, Inc. | Composite load bearing flooring |
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CN113954378A (en) * | 2015-11-30 | 2022-01-21 | 泽菲罗斯公司 | Adhesive resins and films for composites and tapes, and methods of use thereof |
WO2017205172A1 (en) * | 2016-05-24 | 2017-11-30 | Zephyros, Inc. | Reformable resin materials and uses therefor |
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US9586363B2 (en) | 2013-10-04 | 2017-03-07 | Zephyros, Inc. | Method and apparatus for adhesion of inserts |
US9796891B2 (en) | 2014-08-11 | 2017-10-24 | Zephyros, Inc. | Panel edge enclosures |
US10442965B2 (en) | 2014-08-11 | 2019-10-15 | Zephyros, Inc. | Panel edge enclosures |
US10689784B2 (en) | 2014-10-22 | 2020-06-23 | Zephryos, Inc. | Reformable resin fibers |
US10570258B2 (en) | 2015-03-10 | 2020-02-25 | Zephyros, Inc. | Composites with thermoplastic epoxy polymeric phase, articles such as carriers made therewith and associated methods |
US11248096B2 (en) | 2015-03-10 | 2022-02-15 | Zephyros, Inc. | Composites with thermoplastic epoxy polymeric phase, articles such as carriers made therewith and associated methods |
US12043709B2 (en) | 2015-03-10 | 2024-07-23 | Zephyros, Inc. | Composites with thermoplastic epoxy polymeric phase, articles such as carriers made therewith and associated methods |
US11155673B2 (en) | 2015-11-12 | 2021-10-26 | Zephyros, Inc. | Controlled glass transition polymeric material and method |
US11332197B2 (en) | 2018-10-12 | 2022-05-17 | Zephyros, Inc. | Composite load bearing flooring |
US11572106B2 (en) | 2018-10-12 | 2023-02-07 | Zephyros, Inc. | Composite load bearing flooring |
Also Published As
Publication number | Publication date |
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WO2016025787A1 (en) | 2016-02-18 |
EP3194162B1 (en) | 2022-11-02 |
CN115230250A (en) | 2022-10-25 |
CN106573440A (en) | 2017-04-19 |
EP4140733A1 (en) | 2023-03-01 |
US20230211578A1 (en) | 2023-07-06 |
EP3194162A1 (en) | 2017-07-26 |
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