JP2011184668A5 - - Google Patents
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- Publication number
- JP2011184668A5 JP2011184668A5 JP2010054701A JP2010054701A JP2011184668A5 JP 2011184668 A5 JP2011184668 A5 JP 2011184668A5 JP 2010054701 A JP2010054701 A JP 2010054701A JP 2010054701 A JP2010054701 A JP 2010054701A JP 2011184668 A5 JP2011184668 A5 JP 2011184668A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- conductive thermoplastic
- thermoplastic adhesive
- composition according
- graphite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 6
- 230000001070 adhesive effect Effects 0.000 claims 6
- 229920001169 thermoplastic Polymers 0.000 claims 5
- 239000004416 thermosoftening plastic Substances 0.000 claims 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 4
- 229910002804 graphite Inorganic materials 0.000 claims 4
- 239000010439 graphite Substances 0.000 claims 4
- -1 amine compound Chemical class 0.000 claims 3
- 125000000524 functional group Chemical group 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 238000007561 laser diffraction method Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010054701A JP2011184668A (ja) | 2010-03-11 | 2010-03-11 | 熱伝導性熱可塑性接着剤組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010054701A JP2011184668A (ja) | 2010-03-11 | 2010-03-11 | 熱伝導性熱可塑性接着剤組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011184668A JP2011184668A (ja) | 2011-09-22 |
| JP2011184668A5 true JP2011184668A5 (enrdf_load_stackoverflow) | 2012-11-29 |
Family
ID=44791321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010054701A Pending JP2011184668A (ja) | 2010-03-11 | 2010-03-11 | 熱伝導性熱可塑性接着剤組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2011184668A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101523144B1 (ko) * | 2013-12-11 | 2015-05-26 | 동의대학교 산학협력단 | 방열특성이 개선된 에폭시 복합수지 조성물 및 이를 이용한 방열 구조물 |
| US20160046047A1 (en) * | 2014-08-14 | 2016-02-18 | Zephyros, Inc. | Reformable epoxy resin for composites |
| CN108137415B (zh) * | 2015-09-23 | 2021-07-20 | 纳米技术仪器公司 | 一体化的高度取向的卤化石墨烯的整体式膜 |
| JP7322382B2 (ja) * | 2018-11-09 | 2023-08-08 | 日本ゼオン株式会社 | 熱伝導シート |
| US20220219403A1 (en) * | 2019-08-06 | 2022-07-14 | Showa Denko K.K. | Primer-equipped thermoplastic resin member, and resin-resin conjugate |
| JP2024105744A (ja) * | 2021-06-02 | 2024-08-07 | 旭化学工業株式会社 | 熱可塑性エポキシ樹脂、接着剤、改質剤、および、熱可塑性エポキシ樹脂の製造方法 |
| JP2024090446A (ja) * | 2022-12-23 | 2024-07-04 | 株式会社レゾナック | 接合方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6290235A (ja) * | 1985-10-15 | 1987-04-24 | 鐘淵化学工業株式会社 | 電気用金属箔張積層板 |
| JPH0347877A (ja) * | 1990-05-31 | 1991-02-28 | Toray Ind Inc | エポキシ系球状粒子状接着剤及びその製造方法 |
| JPH06334288A (ja) * | 1993-05-20 | 1994-12-02 | Furukawa Electric Co Ltd:The | 金属ベースプリント基板 |
| JP2000273426A (ja) * | 1999-03-29 | 2000-10-03 | Polymatech Co Ltd | 熱伝導性接着剤および接着方法ならびに半導体装置 |
| CN101454418A (zh) * | 2006-06-21 | 2009-06-10 | 日立化成高分子株式会社 | 热导性热塑性粘合剂组合物 |
| US20090236036A1 (en) * | 2006-06-26 | 2009-09-24 | Hidenori Miyakawa | Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable composition |
| US20080039555A1 (en) * | 2006-08-10 | 2008-02-14 | Michel Ruyters | Thermally conductive material |
| JP5004538B2 (ja) * | 2006-09-12 | 2012-08-22 | 日立化成ポリマー株式会社 | 熱伝導性湿気硬化型接着剤、及びその施工方法 |
| JP5343335B2 (ja) * | 2006-09-29 | 2013-11-13 | 東レ株式会社 | 電子機器用接着剤シート |
| JP2008214597A (ja) * | 2007-03-08 | 2008-09-18 | Toray Ind Inc | 電子部品用接着剤組成物 |
| JP4495768B2 (ja) * | 2008-08-18 | 2010-07-07 | 積水化学工業株式会社 | 絶縁シート及び積層構造体 |
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2010
- 2010-03-11 JP JP2010054701A patent/JP2011184668A/ja active Pending