JP2011181599A5 - - Google Patents
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- Publication number
- JP2011181599A5 JP2011181599A5 JP2010042554A JP2010042554A JP2011181599A5 JP 2011181599 A5 JP2011181599 A5 JP 2011181599A5 JP 2010042554 A JP2010042554 A JP 2010042554A JP 2010042554 A JP2010042554 A JP 2010042554A JP 2011181599 A5 JP2011181599 A5 JP 2011181599A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plasma
- bias
- applying
- radius
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 22
- 239000007789 gas Substances 0.000 claims description 8
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010042554A JP2011181599A (ja) | 2010-02-26 | 2010-02-26 | プラズマ成膜装置及び方法 |
| PCT/JP2011/051689 WO2011105163A1 (ja) | 2010-02-26 | 2011-01-28 | プラズマ成膜装置及び方法 |
| TW100105160A TW201145387A (en) | 2010-02-26 | 2011-02-16 | Plasma film-forming apparatus and plasma film-forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010042554A JP2011181599A (ja) | 2010-02-26 | 2010-02-26 | プラズマ成膜装置及び方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011181599A JP2011181599A (ja) | 2011-09-15 |
| JP2011181599A5 true JP2011181599A5 (https=) | 2013-02-28 |
Family
ID=44506584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010042554A Pending JP2011181599A (ja) | 2010-02-26 | 2010-02-26 | プラズマ成膜装置及び方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2011181599A (https=) |
| TW (1) | TW201145387A (https=) |
| WO (1) | WO2011105163A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6009870B2 (ja) * | 2012-09-11 | 2016-10-19 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法、基板処理装置およびプログラム |
| JP5971144B2 (ja) * | 2013-02-06 | 2016-08-17 | 東京エレクトロン株式会社 | 基板処理装置及び成膜方法 |
| JP7670876B1 (ja) | 2024-01-15 | 2025-04-30 | 日本特殊陶業株式会社 | 半導体基板処理用基台、セラミックス基材、および製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04271122A (ja) * | 1991-02-27 | 1992-09-28 | Fuji Electric Co Ltd | プラズマ処理装置 |
| JP4398802B2 (ja) * | 2004-06-17 | 2010-01-13 | 東京エレクトロン株式会社 | 基板処理装置 |
| US8709162B2 (en) * | 2005-08-16 | 2014-04-29 | Applied Materials, Inc. | Active cooling substrate support |
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2010
- 2010-02-26 JP JP2010042554A patent/JP2011181599A/ja active Pending
-
2011
- 2011-01-28 WO PCT/JP2011/051689 patent/WO2011105163A1/ja not_active Ceased
- 2011-02-16 TW TW100105160A patent/TW201145387A/zh unknown