JP2011181599A5 - - Google Patents

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Publication number
JP2011181599A5
JP2011181599A5 JP2010042554A JP2010042554A JP2011181599A5 JP 2011181599 A5 JP2011181599 A5 JP 2011181599A5 JP 2010042554 A JP2010042554 A JP 2010042554A JP 2010042554 A JP2010042554 A JP 2010042554A JP 2011181599 A5 JP2011181599 A5 JP 2011181599A5
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JP
Japan
Prior art keywords
substrate
plasma
bias
applying
radius
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010042554A
Other languages
English (en)
Japanese (ja)
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JP2011181599A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010042554A priority Critical patent/JP2011181599A/ja
Priority claimed from JP2010042554A external-priority patent/JP2011181599A/ja
Priority to PCT/JP2011/051689 priority patent/WO2011105163A1/ja
Priority to TW100105160A priority patent/TW201145387A/zh
Publication of JP2011181599A publication Critical patent/JP2011181599A/ja
Publication of JP2011181599A5 publication Critical patent/JP2011181599A5/ja
Pending legal-status Critical Current

Links

JP2010042554A 2010-02-26 2010-02-26 プラズマ成膜装置及び方法 Pending JP2011181599A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010042554A JP2011181599A (ja) 2010-02-26 2010-02-26 プラズマ成膜装置及び方法
PCT/JP2011/051689 WO2011105163A1 (ja) 2010-02-26 2011-01-28 プラズマ成膜装置及び方法
TW100105160A TW201145387A (en) 2010-02-26 2011-02-16 Plasma film-forming apparatus and plasma film-forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010042554A JP2011181599A (ja) 2010-02-26 2010-02-26 プラズマ成膜装置及び方法

Publications (2)

Publication Number Publication Date
JP2011181599A JP2011181599A (ja) 2011-09-15
JP2011181599A5 true JP2011181599A5 (cg-RX-API-DMAC10.html) 2013-02-28

Family

ID=44506584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010042554A Pending JP2011181599A (ja) 2010-02-26 2010-02-26 プラズマ成膜装置及び方法

Country Status (3)

Country Link
JP (1) JP2011181599A (cg-RX-API-DMAC10.html)
TW (1) TW201145387A (cg-RX-API-DMAC10.html)
WO (1) WO2011105163A1 (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6009870B2 (ja) * 2012-09-11 2016-10-19 株式会社日立国際電気 半導体装置の製造方法、基板処理方法、基板処理装置およびプログラム
JP5971144B2 (ja) * 2013-02-06 2016-08-17 東京エレクトロン株式会社 基板処理装置及び成膜方法
JP7670876B1 (ja) 2024-01-15 2025-04-30 日本特殊陶業株式会社 半導体基板処理用基台、セラミックス基材、および製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04271122A (ja) * 1991-02-27 1992-09-28 Fuji Electric Co Ltd プラズマ処理装置
JP4398802B2 (ja) * 2004-06-17 2010-01-13 東京エレクトロン株式会社 基板処理装置
US8709162B2 (en) * 2005-08-16 2014-04-29 Applied Materials, Inc. Active cooling substrate support

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