JP2011176344A - Electronic component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting head that comprises a small number of components and is easy to design and assemble, and to provide an electronic component mounting device. <P>SOLUTION: The present invention relates to the electronic component mounting head 10 including a plurality of suction nozzles 21 each configured to suck an electronic component P at the tip portion 21a and to mount it on a printed board, a nozzle holder 17 configured to rotate on an axis 16a extending in an up/down direction and to hold the plurality of suction nozzles 21 on a circumference concentric with respect to the axis 16a so that they can move in the up/down direction, a background means 18 arranged inside the circumference, and a CCD camera disposed outside the circumference and configured to acquire a two-dimensional image by making good use of light and shade between the electronic component P sucked to a tip portion 21a and the background means 18; and the electronic component mounting device including a CCD camera which is opposed to the background means 18 along an axis direction of the nozzle holder 17, and detects a holding position of the electronic component P sucked to the tip portion 21a, the background means 18 including a mark for detecting the holding position of the electronic component P. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting head for mounting an electronic component on a printed board, and an electronic component mounting apparatus including the electronic component mounting head.

  Conventionally, an electronic component mounting head and an electronic component mounting device described in Patent Document 1 are known. In the electronic component mounting head of this electronic component mounting apparatus, a plurality of suction nozzles are held on the circumference of a nozzle holder that can rotate about an axis extending in the vertical direction so as to be movable in the vertical direction. A light emitting element is disposed at the center, and a light receiving element is disposed at a position facing the light emitting element across the suction nozzle.

  According to this electronic component mounting head, the height position of the lower end surface of the electronic component sucked by the suction nozzle can be detected as a boundary position that changes from the light receiving state of the light receiving element to the light receiving state. It can be determined whether or not the nozzle is normally adsorbed.

JP-A-2005-109119 (6th page, 7th page, FIG. 13, FIG. 14)

  However, the mounting head of the conventional electronic component mounting apparatus has a disadvantage because the light emitting element is arranged at the center of the rotating nozzle holder. That is, since the light emitting element can project light only in one direction, it is necessary to fix the light emitting element so as to face the light receiving element, and design restrictions are large. In addition, it is necessary to pass a power cord for supplying power to the light emitting element through the center of the nozzle holder, which makes it difficult to assemble.

  The present invention has been made in view of the above-described conventional problems, and provides an electronic component mounting head and an electronic component mounting device that are easy to design and assemble.

  In order to solve the above-described problem, the electronic component mounting head according to claim 1 is characterized in that a plurality of suction nozzles for sucking an electronic component at the tip and mounting the electronic component on a printed circuit board are arranged around the axis. A nozzle holder that is pivotable and holds the plurality of suction nozzles movably on a circumference concentric with the axis, background means capable of reflecting, emitting or absorbing light, and light in the direction of the background means And first imaging means for acquiring a two-dimensional image of the electronic component adsorbed on the tip by light reflected or emitted by the background means or light reflected by the electronic component; The background means is disposed inside a circumference concentric with the axis, and the irradiation means and the first imaging means are arranged on a circumference concentric with the axis. Placed outside It is.

  According to a second aspect of the present invention, there is provided an electronic component mounting head according to the first aspect, wherein the background means, the electronic component sucked by the suction nozzle, and the first component are in the state where the suction nozzle is moved to the uppermost end. The incident part of the light to the imaging means is on a virtual straight line.

  The electronic component mounting head according to a third aspect of the present invention is the electronic component mounting head according to the first or second aspect, wherein light is not directly irradiated from the irradiation unit to the electronic component between the irradiation unit and the suction nozzle. A shielding plate is provided.

  A feature of the electronic component mounting head according to a fourth aspect is that, in any one of the first to third aspects, the irradiation unit is disposed on both sides of the first imaging unit.

  A feature of an electronic component mounting head according to a fifth aspect is that in any one of the first to fourth aspects, the background means has a circular or regular polygonal cross section.

The electronic component mounting head according to claim 6 is characterized in that in any one of claims 1 to 5,
Second imaging means for detecting the holding position of the electronic component is provided in the axial direction of the nozzle holder and facing the background means, and the background means detects the holding position of the electronic component. It is to provide a mark for.

  A feature of the electronic component mounting apparatus according to a seventh aspect is that the electronic component mounting head according to any one of the first to sixth aspects is provided.

  In the electronic component mounting head according to claim 1, a plurality of suction nozzles are movably held on the circumference of a nozzle holder that can rotate around an axis, and background means is provided inside the suction nozzles. An irradiation unit and a first imaging unit are provided outside the suction nozzle. Therefore, it is not necessary to arrange the irradiation means at the center of the rotating nozzle holder, and the degree of freedom in design is great. Further, it is not necessary to pass a power cord for supplying power to the irradiation means through the central portion of the nozzle holder, and assembly is easy. Therefore, according to this electronic component mounting head, design and assembly can be facilitated.

  In the electronic component mounting head according to claim 2, in a state where the suction nozzle is moved to the uppermost end, the background means, the electronic component sucked by the suction nozzle, and the light incident portion to the first imaging means are virtually Since it is on a straight line, the light reflected or emitted by the background means or the light reflected by the electronic component is reliably incident on the first image pickup means, and a contrasted image can be acquired.

  In the electronic component mounting head according to the third aspect, since the light can be prevented from being directly irradiated from the irradiation means to the electronic component by the shielding plate, the light reflected or emitted by the background means is incident on the first imaging means. The reflected light from the electronic component is less likely to enter the first imaging means, and a contrasted image can be acquired regardless of the color and state of the surface of the electronic component.

  In the electronic component mounting head according to the fourth aspect, since the irradiating means is disposed on both sides of the first imaging means, it is possible to sufficiently obtain the light reflected or emitted by the background means.

  In the electronic component mounting head according to claim 5, since the cross section of the background means is circular or regular polygonal, even if the background means rotates together with the nozzle holder, it is reflected or emitted by the background means. Sufficient light can be obtained.

  In the electronic component mounting head according to the sixth aspect, since the background means includes a mark for detecting the holding position of the electronic component, it is not necessary to provide a separate mark, and the number of components can be reduced.

  In the electronic component mounting apparatus according to the seventh aspect, since the electronic component mounting head is provided, design and assembly can be facilitated.

The perspective view of the electronic component mounting apparatus of embodiment. The front view of the electronic component mounting head of embodiment. The bottom view of the electronic component mounting head of an embodiment. FIG. 2 is a partially enlarged sectional view of the electronic component mounting head according to the embodiment.

  Embodiments and modifications 1 and 2 embodying an electronic component mounting head and an electronic component mounting apparatus according to the present invention will be described below with reference to the drawings.

  As shown in FIG. 1, the electronic component mounting apparatus according to the embodiment includes a component supply device 70, a board transfer device 60, and a component transfer mounting 1.

  The component supply device 70 is configured by arranging a plurality of cassette type feeders 71 in parallel on a base frame 80. The cassette type feeder 71 includes a main body 72 detachably attached to the base frame 80, a supply reel 73 provided at the rear portion of the main body 72, and a component take-out portion 74 provided at the tip of the main body 72. An elongated tape (not shown) in which electronic components are enclosed at a predetermined pitch is wound and held on the supply reel 73, and this tape is pulled out at a predetermined pitch by a sprocket (not shown), so that the electronic component is released from the enclosed state. The components are sequentially sent to the component extraction unit 74. In addition, a CCD camera 75 is provided between the component supply device 70 and the substrate transport device 60 as a second imaging unit that detects the holding position of the electronic component. Although the component transfer device 1 is retracted backward in FIG. 1, the component transfer device 1 is moved above the CCD camera 75 when detecting the holding position of the electronic component. At this time, the CCD camera 75 is in the direction of the axis 16a of the nozzle holder 17 described later and faces the reflector 18 described later.

  The board transport device 60 is of a so-called double conveyor type in which a printed circuit board is transported in the X-axis direction and a first transport device 61 and a second transport device 62 are arranged in parallel. The first transport device 61 (second transport device 62) has a pair of guide rails 64a, 64b (65a, 65b) arranged parallel to each other in parallel on the base 63, and the guide rails 64a, A pair of conveyor belts (not shown) for supporting and transporting the printed circuit boards respectively guided by 64b (65a, 65b) are arranged in parallel to face each other. The substrate transport device 60 is provided with a clamp device (not shown) that pushes up and clamps the printed circuit board transported to a predetermined position, and the printed circuit board is positioned and fixed at the mounting position by the clamp device.

  The component transfer device 1 is of the XY robot type, is mounted on a base frame 80 and is disposed above the substrate transfer device 60 and the component supply device 70 and is moved in the Y-axis direction by the Y-axis servo motor 2. The Y-axis slider 3 is provided. The Y-axis slider 3 is attached with an electronic component mounting head 10 that sucks and mounts electronic components on a printed circuit board.

  Specifically, as shown in FIG. 2, the electronic component mounting head 10 includes an X axis slider 11, an index axis motor 15, an index axis 16, a nozzle holder 17, a reflector 18 as background means, a suction nozzle 21, and a θ axis. A motor 25, a Z-axis motor 30, a CCD camera 43 as a first imaging unit, an LED 44 as an irradiation unit, and the like are included. When the X-axis slider 11 moves, the electronic component mounting head 10 as a whole moves accordingly. The X-axis slider 11 is movably held by the Y-axis slider 3 via a pair of guide rails 3a and a pair of guide blocks 11a. Specifically, the pair of guide rails 3a is fixed to the Y-axis slider 3 and extends in the X-axis direction orthogonal to the Y-axis. The pair of guide blocks 11a is fixed to the X-axis slider 11 and is fitted to the guide rail 3a. In addition, an X-axis servo motor (not shown) is fixed to the Y-axis slider 3, and a ball screw 3b extending in the X-axis direction is attached to the output shaft of the X-axis servo motor. The ball screw 3b is screwed to a ball nut 11b fixed to the X-axis slider 11 via a ball (not shown). Thereby, when the X-axis servo motor rotates, the ball screw 3b rotates, and the X-axis slider 11 is guided by the guide rail 3a via the ball nut 11b and moves in the X-axis direction. It moves in the X-axis direction.

  The X-axis slider 11 is provided with first and second frames 12 and 13 that extend in the horizontal direction as a unit. An index shaft motor 15 is fixed to the first frame 12, and an index shaft 16 passes through the first frame 12, a driven gear 27, a connecting body 28, and a θ-axis gear 29 described later on the output shaft of the index shaft motor 15. It is connected so as to be rotatable around an axis 16a extending in the vertical direction. A cylindrical nozzle holder 17 is fixed to the lower end portion of the index shaft 16, and a cylindrical reflector 18 capable of reflecting light is fixed to the lower end portion of the nozzle holder 17. Therefore, the nozzle holder 17 and the reflector 18 rotate around the axis 16 a together with the index shaft 16. Thereby, when the index shaft motor 15 is rotated, the nozzle holder 17 can be rotated, and all the suction nozzles 21 described later can be rotated around the axis 16a. In addition, as the reflector 18, you may employ | adopt what a cross section perpendicular | vertical to the axis line 16a makes a regular polygon. This is because, if the cross section of the reflector 18 is circular or regular polygonal, sufficient light reflected by the reflector 18 can be obtained even if the reflector 18 rotates together with the nozzle holder 17. . However, in the case where the central portion along the axis 16a of the index shaft 16 is not rotated, the reflector 18 fixed to this portion may have a reflecting surface that is planar. The axis 16a extends in the vertical direction, but may be inclined with respect to the vertical direction.

  As shown in FIG. 3, the reflector 18 is disposed inside a circumference 17 a concentric with the axis 16 a, and a mark 18 a for detecting the holding position of the electronic component P is attached to the center of the lower surface of the reflector 18. Yes. Thus, since the reflector 18 is provided with a mark, it is not necessary to provide a separate mark, and the number of parts can be reduced. In the present embodiment, one mark 18a is attached to the center of the lower surface of the reflector 18. However, for example, a plurality of marks may be attached to the outer periphery of the lower surface of the reflector 18. Further, the outer periphery of the lower surface of the reflector 18 can be a mark. FIG. 3 is a view of the electronic component mounting head 10 as viewed from below.

  The nozzle holder 17 holds a plurality of suction nozzles 21 so as to be movable in the vertical direction on a circumference 17a concentric with the axis 16a. As shown in FIG. 2, each suction nozzle 21 is mounted on the spindle 20 at the upper end. The spindle 20 is slidable through the nozzle holder 17 in the vertical direction. A large-diameter portion 20a having a larger diameter than other portions is formed at the lower end portion of the spindle 20, and a nozzle gear 22 having a tooth portion 22a formed on the outer periphery is fixed to the upper end portion of the spindle 20. A compression spring 23 is provided between the nozzle gear 22 and the nozzle holder 17, whereby the spindle 20 and the suction nozzle 21 are urged upward, and the spindle 20 and the suction nozzle 21 are moved upward by the large diameter portion 20 a. Movement is restricted. Further, a negative pressure is supplied to each suction nozzle 21 from a suction nozzle driving device (not shown) via the spindle 20. Thereby, each adsorption nozzle 21 can adsorb the electronic component P by the front-end | tip part 21a.

  A θ-axis motor 25 is fixed to the first frame 12, and a drive gear 26 having a tooth portion 26 a formed on the outer periphery is fixed to the output shaft of the θ-axis motor 25. Further, a driven gear 27 having a tooth portion 27a formed on the outer periphery thereof is supported on the index shaft 16 so as to be rotatable around the axis 16a. Meshed. A connecting body 28 is fixed to the lower end of the driven gear 27, and a θ-axis gear 29 is fixed to the lower end of the connecting body 28. Similar to the driven gear 27, the connecting body 28 and the θ-axis gear 29 are also supported by the index shaft 16 so as to be rotatable around the axis 16a. A tooth portion 29 a is formed on the outer periphery of the θ-axis gear 29, and the tooth portion 29 a meshes with the tooth portion 22 a of each nozzle gear 22. Thereby, when the θ-axis motor 25 is rotated, all the suction nozzles 21 can be rotated simultaneously through the drive gear 26, the driven gear 27, the θ-axis gear 29, and the nozzle gear 22.

  A Z-axis motor 30 is fixed to the first frame 12, and a ball screw shaft 31 is connected to the output shaft of the Z-axis motor 30. The ball screw shaft 31 is supported by a bearing 12a fixed to the first frame 12 and a bearing 13a fixed to the second frame 13 so as to be rotatable around an axial line 31a extending in the vertical direction. The ball screw shaft 31 converts the rotational motion of the Z-axis motor 30 into a linear motion and transmits it to the ball nut 32 via a ball (not shown). The ball nut 32 is fixed to the suction nozzle lever 33. Further, a guide 34 fixed to the first frame 12 and the second frame 13 and extending in the vertical direction passes through the suction nozzle lever 33, and the suction nozzle lever 33 is slidable in the vertical direction along the guide 34. Has been. The suction nozzle lever 33 is provided with a pressing portion 33 a that presses the upper end of the spindle 20. Accordingly, when the Z-axis motor 30 is rotated, the ball screw shaft 31 is rotated, and the suction nozzle lever 33 is guided by the guide 34 via the ball nut 32 and moves up and down. When the suction nozzle lever 33 moves up and down, the pressing portion 33a also moves up and down, and the spindle 20 and the suction nozzle 21 with which the pressing portion 33a abuts can be moved up and down. The spindle 20 and the suction nozzle 21 move up and down, but may move in a direction inclined with respect to the vertical direction.

  A bracket 40 is suspended from the second frame 13, and a CCD camera 43 that acquires a two-dimensional image of the electronic component P adsorbed to the tip 21 a of the adsorption nozzle 21 by the light reflected by the reflector 18. Is fixed. Further, a cable 46 in which the power supply line and signal line of the CCD camera 43 are bundled is drawn out from the bracket 40. A bracket 41 is fixed on the suction nozzle 21 side of the bracket 40, and a printed board 47 on which an LED 44 that irradiates light in the direction of the reflector is fixed to the bracket 41. The power of the LED 44 is supplied from the power line of the CCD camera 43. Between the LED 44 and the suction nozzle 21, a shielding plate 41 a that prevents light from being directly irradiated onto the electronic component P from the LED 44 is provided integrally with the bracket 40. The bracket 41 is provided with two prisms 45.

  As shown in FIG. 3, the CCD camera 43 and the LED 44 are arranged outside a circumference 17a concentric with the axis 16a. Three LEDs 44 are arranged on each side of the CCD camera 43. In a state where the suction nozzle 21 is moved to the uppermost end, the light emitted from the LED 44 is reflected by the reflector 18 as indicated by an arrow. At this time, since the LEDs 44 are arranged on both sides of the CCD camera 43 and are arranged in the lateral direction, the light reflected by the reflector 18 can be sufficiently obtained. In addition, in this embodiment, although LED44 was arrange | positioned in linear form, you may arrange | position in circular arc shape along the circumference 17a.

  As shown in FIG. 4, in a state where the suction nozzle 21 is moved to the uppermost end, the reflector 18, the electronic component P sucked by the suction nozzle 21, and the light incident portion 41 b to the CCD camera 43 are virtual straight lines. 48. As a result, the light reflected by the reflector 18 passes through the outer peripheral edge of the electronic component P and the light incident portion 41 b as shown by an arrow, is reflected by the prism 45, and enters the CCD camera 43. Further, the suction nozzle 21 is in a position to be moved up and down by the pressing portion 33 a of the suction nozzle lever 33. That is, the CCD camera 43 acquires a two-dimensional image of the electronic component P sucked by the suction nozzle 21 at a position moved up and down by the suction nozzle lever 33. The CCD camera 43 may acquire a two-dimensional image of the electronic component P sucked by the suction nozzle 21 other than the suction nozzle 21. In this case, since the two-dimensional image of the electronic component P sucked by the other suction nozzle 21 can be acquired while the suction nozzle 21 sucking the electronic component P is moving up and down, the image acquisition time is reduced. Not only can there be room, but the tact time can be shortened. Further, if the lifting / lowering operation of the suction nozzle 21 and the rotating operation of the nozzle holder 17 are performed in parallel, the tact time can be further shortened.

  An operation of mounting the electronic component P on the printed board in the electronic component mounting apparatus having the above configuration will be described. First, when a control device (not shown) drives the conveyor belt of the substrate conveying device 60, the printed circuit board is guided to the guide rails 64a and 64b (65a and 65b) and conveyed to a predetermined position. Then, the printed circuit board is pushed up and clamped and fixed by the clamp device.

  Next, by driving the Y-axis servo motor 2 and the X-axis servo motor, the Y-axis slider 3 and the X-axis slider 11 are moved, and the electronic component mounting head 10 is moved to the component take-out portion 74 of the component supply device 70. Is done.

  Thereafter, by rotating the index shaft motor 15, the nozzle holder 17 is rotated, and the spindle 20 on which the predetermined suction nozzle 21 is mounted is indexed below the pressing portion 33 a of the suction nozzle lever 33. Then, when the Z-axis motor 30 is rotated forward, the suction nozzle lever 33 is pushed downward against the urging force of the compression spring 23, and the tip 21a of the suction nozzle 21 is very close to the electronic component P. Pushed down. Further, a negative pressure is supplied from the suction nozzle driving device to the suction nozzle 21, and the electronic component P is sucked and held at the tip 21 a of the suction nozzle 21. Thereafter, when the Z-axis motor 30 is reversed, the suction nozzle lever 33 is moved upward, and is pushed up to a state where the suction nozzle 21 is moved to the uppermost end by the urging force of the compression spring 23.

  In this state, light is emitted from the LED 44. This light is reflected by the reflector 18, passes through the outer peripheral edge of the electronic component P and the incident portion 41 b, and enters the CCD camera 43. Accordingly, a two-dimensional image (XZ two-dimensional image viewed from the Y-axis direction) in which the reflector 18 portion becomes a bright background and the electronic component P and the tip 21a of the suction nozzle 21 are dark can be acquired. This XZ two-dimensional image is processed as grayscale or black and white binary XZ two-dimensional image data, and the distance from the tip 21a of the suction nozzle 21 to each electronic component P is calculated. The difference between the calculated data and the data of the reference position of each electronic component P from the tip 21a of the suction nozzle 21 calculated in advance in the design stage, that is, “position shift” is obtained and compared with a threshold value. As a result, when the “positional deviation” exceeds the threshold value, it is determined that the electronic component P is not properly attracted to the suction nozzle 21 (when the electronic part P is not present or the suction posture is abnormal), and the “positional deviation” is the threshold value. If it does not exceed, it is determined to be normal. However, “when the suction posture is abnormal” refers to a case where the suction posture of the electronic component P is not within an allowable range for mounting on the printed circuit board. This “positional deviation” data is stored in the storage area of the control device, and is used when an electronic component P described later is mounted on a printed circuit board.

  At this time, in a state where the suction nozzle 21 at the position moved up and down by the pressing portion 33a of the suction nozzle lever 33 is moved to the uppermost end, the reflector 18 and the electronic component P sucked by the suction nozzle 21; The light incident portion 41 b to the CCD camera 43 is on the virtual straight line 48. Since a two-dimensional image can be acquired by the CCD camera 43, it is possible to determine whether or not there is a suction error of the electronic component P in a stationary state without rotating the nozzle holder 17. If it is determined that there is no electronic component P, the suction nozzle 21 can be immediately lowered to perform re-suction. Further, when it is determined that the suction posture is abnormal, the electronic component P is discarded in the disposal box, and it can be determined whether or not the electronic component P has been disposed normally after the disposal operation is completed. By repeating the above operation, each of the electronic components P is sucked by the plurality of suction nozzles 21.

  Next, by driving the Y-axis servo motor 2 and the X-axis servo motor, the Y-axis slider 3 and the X-axis slider 11 are moved, and the electronic component mounting head 10 is moved above the CCD camera 75. Then, the CCD camera 75 captures a two-dimensional image (XY two-dimensional image viewed from the Z-axis direction) of all the electronic components P sucked by the suction nozzle 21. From this XY two-dimensional image data, the distance from the mark 18a of the reflector 18 to each electronic component P, that is, the holding position of each electronic component P is calculated. The difference between the data of the holding position of each electronic component P and the data of the reference position of each electronic component P from the mark 18a calculated in advance at the design stage, that is, “positional deviation” is obtained, and stored in the storage area of the control device. Remember. This “positional deviation” data is used when an electronic component P, which will be described later, is mounted on a printed board.

  Next, when the Y-axis servo motor 2 and the X-axis servo motor are driven, the Y-axis slider 3 and the X-axis slider 11 are moved, and the electronic component mounting head 10 is moved above the printed circuit board which is the mounting position. The In this state, it is possible to confirm the presence or absence of each electronic component P by irradiating light from the LED 44 and acquiring a two-dimensional image by the CCD camera 43.

  Then, the index shaft motor 15 and the θ-axis motor 25 are rotated to bring the electronic component P into a predetermined position and orientation. At this time, fine adjustment is performed based on the “positional deviation” data obtained based on the above-described XY two-dimensional image data. This absorbs not only the variation in the suction position of the electronic component P by the suction nozzle 21 but also the displacement of the relative position of the electronic component mounting head 10 due to secular change, thermal deformation, etc., so that the electronic component P is placed at a predetermined position on the printed circuit board. Can be mounted accurately.

  Thereafter, when the Z-axis motor 30 is rotated forward, the suction nozzle lever 33 is pushed downward against the urging force of the compression spring 23, and the electronic component P at the tip 21a of the suction nozzle 21 is applied to the printed circuit board. Pressed down until installed. At this time, fine adjustment is performed based on the “positional deviation” data obtained based on the above-described XZ two-dimensional image data. That is, since the height (length in the Z direction) of the electronic component P can be obtained from the XZ two-dimensional image data, the lowering amount (pushing amount) of the suction nozzle 21 can be finely adjusted and given to the electronic component P. Impact can be reduced. Thereafter, when the Z-axis motor 30 is reversed, the suction nozzle lever 33 is moved upward, and is pushed up to a state where the suction nozzle 21 is moved to the uppermost end by the urging force of the compression spring 23.

  In this state, light is emitted from the LED 44, a two-dimensional image is acquired by the CCD camera 43, and whether or not the electronic component P is taken home is confirmed. Thereby, when the electronic component P is taken home, the suction nozzle 21 can be immediately lowered and remounted. By repeating the above operation, all the electronic components P are mounted on the printed circuit board. Finally, the clamp of the printed circuit board is released, the printed circuit board is discharged, and the operation of mounting the electronic component P on one printed circuit board is completed.

  In the electronic component mounting head 10 and the electronic component mounting apparatus of the present embodiment, the plurality of suction nozzles 21 can move in the vertical direction on the circumference 17a of the nozzle holder 17 that can rotate around the axis 16a extending in the vertical direction. The reflector 18 is provided inside the suction nozzle 21, and the CCD camera 43 and the LED 44 are provided outside the suction nozzle 21. Therefore, it is not necessary to arrange the LED 44 at the center of the rotating nozzle holder 17, and the degree of freedom in design is great. Further, it is not necessary to pass a power cord for supplying power to the LED 44 through the central portion of the nozzle holder 17, and assembly is easy. Therefore, according to the electronic component mounting head 10 and the electronic component mounting apparatus, design and assembly can be facilitated.

  Further, in the electronic component mounting head 10 and the electronic component mounting device, in the state where the suction nozzle 21 at the position moved up and down by the pressing portion 33a of the suction nozzle lever 33 is moved to the uppermost end, The electronic component P sucked by the suction nozzle 21 and the light incident portion 41 b to the CCD camera 43 are on the virtual straight line 48. Thereby, the light emitted from the LED 44 is reflected by the reflector 18, passes through the outer peripheral edge of the electronic component P and the incident portion 41 b, and enters the CCD camera 43, so that the reflector 18 portion becomes a bright background, and the electronic component P and the tip 21a of the suction nozzle 21 become dark, and a contrasted image can be acquired.

  Further, in the electronic component mounting head 10 and the electronic component mounting apparatus, light can be prevented from being directly irradiated from the LED 44 to the electronic component P by the shielding plate 41a, so that the reflected light from the electronic component P is incident on the CCD camera 43. Incidents are reduced, and a contrasted image can be acquired regardless of the color and state of the surface of the electronic component P. However, the direct light from the LED 44 to the electronic component P does not need to be completely blocked by the shielding plate 41a, and the contrast between the image of the electronic component P and the tip 21a of the suction nozzle 21 and the image of the reflector 18 serving as the background is high. It is sufficient that the amount of light can be limited to the extent that it can be obtained.

  In the electronic component mounting head 10 and the electronic component mounting apparatus, the CCD cameras 43 and 75 are used as the first imaging unit and the second imaging unit. However, any device capable of acquiring a two-dimensional image may be used. For example, a CMOS camera may be used.

  Next, an electronic component mounting head and an electronic component mounting apparatus according to the first modification will be described. The main mechanical configuration of the electronic component mounting apparatus according to Modification 1 is the same as that of the electronic component mounting apparatus according to the embodiment shown in FIGS. 1 to 4, and the same reference numerals are used, and the description thereof is omitted. However, an ultraviolet irradiation device that irradiates ultraviolet rays is employed instead of the LED 44, and a phosphor having a phosphor screen that absorbs ultraviolet rays and emits visible light is employed instead of the reflector 18. The CCD camera 43 is equipped with an ultraviolet filter and is not provided with a shielding plate 41a. Other mechanical configurations are the same as in the embodiment.

  In the electronic component mounting apparatus configured as described above, when the electronic component mounting head 10 is in the same position as in the embodiment, the ultraviolet light irradiated from the ultraviolet irradiation device is absorbed by the fluorescent material and visible light from the fluorescent material. Is emitted. This visible light passes through the outer peripheral edge of the electronic component P and the incident portion 41 b and enters the CCD camera 43. The CCD camera 43 is equipped with an ultraviolet filter, and the ultraviolet light reflected by the electronic component P is removed, so that the shielding plate 41a can be removed. Also in the electronic component mounting head 10 and the electronic component mounting apparatus according to the first modification, the same operations and effects as those of the embodiment can be obtained.

  Next, an electronic component mounting head and an electronic component mounting apparatus according to Modification 2 will be described. The main mechanical configuration of the electronic component mounting apparatus according to the second modification is the same as that of the electronic component mounting apparatus according to the embodiment shown in FIGS. 1 to 4, and the same reference numerals are used, and the description thereof is omitted. However, an absorber having a black surface that absorbs light is employed instead of the reflector 18 while removing the shielding plate 41a. As this black surface, for example, a surface obtained by applying a black paint to the surface of the absorber can be used. Other mechanical configurations are the same as in the embodiment.

  In the electronic component mounting apparatus having the above configuration, when the electronic component mounting head 10 is at the same position as in the embodiment, the light emitted from the LED 44 is reflected by the electronic component P and the tip 21a of the suction nozzle 21, The light enters the CCD camera 43. Then, a two-dimensional image is obtained in which the electronic component P and the tip 21a are bright and the background is dark by the light reflected by the electronic component P and the tip 21a. That is, in the second modification, the brightness and darkness of the electronic component P and the tip 21a and the background are opposite to those in the embodiment and the first modification. In the electronic component mounting head 10 and the electronic component mounting apparatus according to the second modified embodiment, the same operations and effects as in the embodiment can be obtained.

  As mentioned above, although the electronic component mounting head 10 and the electronic component mounting apparatus of the present invention have been described according to the embodiment and the first and second modifications, the present invention is not limited to these, and the technical idea of the present invention. Needless to say, as long as it is not contrary to the above, it can be applied with appropriate modifications.

  DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting head, 16a ... Axis, 17 ... Nozzle holder, 17a ... Circumference, 18 ... Background means (reflector), 18a ... Mark, 21 ... Suction nozzle, 21a ... Tip part, 41a ... Shielding plate, 41b ... Incident part 43... First imaging means (CCD camera) 44. Irradiation means (LED) 48. Virtual straight line 75. Second imaging means (CCD camera) P P electronic component.

Claims (7)

A plurality of suction nozzles for sucking electronic components at the tip and mounting the electronic components on a printed circuit board;
A nozzle holder that is rotatable about an axis, and that holds the plurality of suction nozzles movably on a circumference concentric with the axis;
Background means capable of reflecting, emitting or absorbing light;
Irradiating means for irradiating light in the direction of the background means;
An electronic component mounting head comprising: 3 for obtaining a two-dimensional image of the electronic component adsorbed on the tip by the light reflected or emitted by the background means or the light reflected by the electronic component. And
The background means is disposed inside a circumference concentric with the axis;
The electronic component mounting head according to claim 1, wherein the irradiation unit and the first imaging unit are disposed outside a circumference concentric with the axis. In claim 1,
In the state where the suction nozzle is moved to the uppermost end, the background means, the electronic component sucked by the suction nozzle, and a light incident portion to the first imaging means are on a virtual straight line. Electronic component mounting head. In claim 1 or 2,
An electronic component mounting head, wherein a shielding plate for preventing light from being directly irradiated from the irradiation unit to the electronic component is provided between the irradiation unit and the suction nozzle. In any one of Claims 1 thru | or 3,
The electronic component mounting head according to claim 1, wherein the irradiation unit is disposed on both sides of the first imaging unit. In any one of Claims 1 thru | or 4,
The electronic component mounting head according to claim 1, wherein the background means has a circular or regular polygonal cross section. In any one of Claims 1 thru | or 5,
A second imaging means for detecting a holding position of the electronic component in the axial direction of the nozzle holder and facing the background means;
The electronic component mounting head according to claim 1, wherein the background means includes a mark for detecting a holding position of the electronic component.   An electronic component mounting apparatus comprising the electronic component mounting head according to claim 1.

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