JP2011176146A5 - - Google Patents

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Publication number
JP2011176146A5
JP2011176146A5 JP2010039379A JP2010039379A JP2011176146A5 JP 2011176146 A5 JP2011176146 A5 JP 2011176146A5 JP 2010039379 A JP2010039379 A JP 2010039379A JP 2010039379 A JP2010039379 A JP 2010039379A JP 2011176146 A5 JP2011176146 A5 JP 2011176146A5
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JP
Japan
Prior art keywords
waveguide
processing apparatus
plasma processing
stubs
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010039379A
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English (en)
Japanese (ja)
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JP2011176146A (ja
JP5663175B2 (ja
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Priority to JP2010039379A priority Critical patent/JP5663175B2/ja
Priority claimed from JP2010039379A external-priority patent/JP5663175B2/ja
Publication of JP2011176146A publication Critical patent/JP2011176146A/ja
Publication of JP2011176146A5 publication Critical patent/JP2011176146A5/ja
Application granted granted Critical
Publication of JP5663175B2 publication Critical patent/JP5663175B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010039379A 2010-02-24 2010-02-24 プラズマ処理装置 Active JP5663175B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010039379A JP5663175B2 (ja) 2010-02-24 2010-02-24 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010039379A JP5663175B2 (ja) 2010-02-24 2010-02-24 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2011176146A JP2011176146A (ja) 2011-09-08
JP2011176146A5 true JP2011176146A5 (https=) 2013-04-04
JP5663175B2 JP5663175B2 (ja) 2015-02-04

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ID=44688745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010039379A Active JP5663175B2 (ja) 2010-02-24 2010-02-24 プラズマ処理装置

Country Status (1)

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JP (1) JP5663175B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102322536B (zh) 2011-09-05 2012-11-07 上海鸿润科技有限公司 阀芯组件及采用该阀芯组件的阀门
JP6470515B2 (ja) * 2014-07-08 2019-02-13 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
JP6442242B2 (ja) * 2014-11-17 2018-12-19 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6388554B2 (ja) * 2015-03-05 2018-09-12 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP7516674B2 (ja) * 2022-06-21 2024-07-16 株式会社日立ハイテク プラズマ処理装置および加熱装置
JP2024017093A (ja) * 2022-07-27 2024-02-08 株式会社日立ハイテク プラズマ処理装置
KR20240128810A (ko) * 2023-02-15 2024-08-27 주식회사 히타치하이테크 플라스마 처리 장치 및 플라스마 처리 방법
KR102932119B1 (ko) 2023-07-27 2026-02-27 주식회사 히타치하이테크 플라스마 처리 장치 및 플라스마 처리 방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4837854B2 (ja) * 2001-09-28 2011-12-14 東京エレクトロン株式会社 整合器およびプラズマ処理装置

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