JP2011173277A - Precoated aluminum sheet for electronic device - Google Patents

Precoated aluminum sheet for electronic device Download PDF

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JP2011173277A
JP2011173277A JP2010037523A JP2010037523A JP2011173277A JP 2011173277 A JP2011173277 A JP 2011173277A JP 2010037523 A JP2010037523 A JP 2010037523A JP 2010037523 A JP2010037523 A JP 2010037523A JP 2011173277 A JP2011173277 A JP 2011173277A
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resin film
film
aluminum
component
resin
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JP5555008B2 (en
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Nobuo Hattori
伸郎 服部
Tomoko Tanaka
智子 田中
Koichi Aikawa
耕一 相川
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Kobe Steel Ltd
Nihon Parkerizing Co Ltd
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Kobe Steel Ltd
Nihon Parkerizing Co Ltd
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Priority to KR1020110015390A priority patent/KR101279287B1/en
Priority to CN2011100485564A priority patent/CN102162097A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00Coating not provided for in groups C23C2/00 - C23C24/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00Metallic substrate
    • B05D2202/20Metallic substrate based on light metals
    • B05D2202/25Metallic substrate based on light metals based on Al

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Printing Plates And Materials Therefor (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a precoated aluminum sheet for an electronic device which has excellent conductivity, lubricity, fingerprint-proof property and corrosion resistance and is friendly in environment. <P>SOLUTION: The precoated aluminum sheet 10 is obtained by forming a resin coating film 12 without providing a substrate treatment coating film containing chromium on at least one surface of an aluminum base sheet 11 having 0.3 to 0.5 μm arithmetic mean roughness Ra. The resin coating film 12 does not contain a metal element and contains an acrylic resin component, an urethane resin component, a silica component and a particulate lubricating component, wherein the content of the silica component occupied in the resin coating film 12 is >12 mass%, the content of the lubricating component contained in the resin coating film 12 is >8 mass%, the average film thickness of the resin coating film 12 is 0.15 to 1.0 μm and resistance measured by a specific method is ≤10 Ω. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、成形されることにより電子機器のケースや構造部材などとして使用されるプレコートアルミニウム板に関する。   The present invention relates to a precoated aluminum plate that is molded and used as a case or a structural member of an electronic device.

アルミニウム板(アルミニウム合金板含む)は、高い強度と成形性を兼ね備えつつ、鋼板に比べて大幅な軽量化が可能なことから、様々な成形を施すことにより容器、箔、電気製品、自動車用品、更には建材等の様々な用途に適用されている。   Aluminum plates (including aluminum alloy plates) have high strength and formability, and can be significantly reduced in weight compared to steel plates. Therefore, containers, foils, electrical products, automobile supplies, Furthermore, it is applied to various uses such as building materials.

アルミニウム板の成形品は、使用する用途や環境に合わせて外観や耐食性等の向上を目的として表面処理が行なわれることがある。ここで、表面処理を行う手法としては、大量生産性、製造工程の簡素化、コスト低減等の観点から、プレス成形前のアルミニウム板に予め表面処理して皮膜を形成させたプレコートアルミニウム板を利用する、プレコート法が望ましい。   The molded product of the aluminum plate may be subjected to surface treatment for the purpose of improving the appearance and corrosion resistance in accordance with the intended use and environment. Here, as a method for performing the surface treatment, from the viewpoint of mass productivity, simplification of the manufacturing process, cost reduction, etc., a precoated aluminum plate in which a film is formed by performing a surface treatment on the aluminum plate before press forming is used. The precoat method is desirable.

さらに、近年かかるプレコートアルミニウム板は、製品、機器の多様化と高級化に応えるため、種々の機能、例えば、耐指紋性、耐疵付き性、導電性(アース接続性)、放熱性、遮熱性、抗菌性、防カビ性、親水性、撥水性、潤滑性等を付与した機能性プレコートアルミニウム板が開発され、広く普及している。これらのうち電子機器用プレコートアルミニウム板としては導電性、耐指紋性、耐疵付き性および潤滑性を兼ね備えたプレコートアルミニウム板がもっとも幅広く採用されている。   Furthermore, in recent years, such pre-coated aluminum sheets have various functions such as fingerprint resistance, scratch resistance, electrical conductivity (ground connection), heat dissipation, and thermal insulation in order to meet the diversification and upgrading of products and equipment. Functional pre-coated aluminum plates imparted with antibacterial, antifungal, hydrophilic, water repellency, lubricity, etc. have been developed and are widely used. Among these, precoated aluminum plates having electrical conductivity, fingerprint resistance, scratch resistance and lubricity are most widely used as precoated aluminum plates for electronic devices.

特許文献1には、アルミニウム板に潤滑剤を含む樹脂をコーティングして樹脂皮膜を形成することにより、表面に付着した指紋や、表面に生じた微細な疵を目立たなくさせる、耐指紋性および耐疵付き性に優れた表面処理アルミニウム板が提案されている。
この発明によれば、アルミニウム板の耐指紋性および耐疵付き性がある程度向上されるものの、絶縁物たる樹脂皮膜がコーティングされたアルミニウム板の表面は絶縁性を呈するようになるため、前記電子機器のケースまたは構造部材からアースを取る場合には、前記樹脂皮膜の一部を削り取ってアルミニウム板の金属部分を露出させた導通部を設ける等の後工程が必要となる。
In Patent Document 1, an aluminum plate is coated with a resin containing a lubricant to form a resin film, thereby making fingerprints attached to the surface and fine wrinkles generated on the surface inconspicuous. A surface-treated aluminum plate excellent in scratching has been proposed.
According to the present invention, although the fingerprint resistance and wrinkle resistance of the aluminum plate are improved to some extent, the surface of the aluminum plate coated with the resin film serving as an insulator exhibits insulation properties. In the case where the ground is taken from the case or the structural member, a post-process such as providing a conducting portion by removing a part of the resin film and exposing a metal portion of the aluminum plate is required.

そこで、このようなプレコートアルミニウム板の表面における導電性確保の問題を解決するため、導電性物質を含有する樹脂皮膜をコーティングする技術が、特許文献2および特許文献3などで提案されている。   Therefore, in order to solve the problem of ensuring conductivity on the surface of such a pre-coated aluminum plate, techniques for coating a resin film containing a conductive substance have been proposed in Patent Document 2 and Patent Document 3.

しかしながら、このように導電性物質を含有する樹脂をアルミニウム板の表面にコーティングする方法では、導電性物質の粒子を前記樹脂の中に均一に分散させることが必要であり、アルミニウム板の表面に形成された樹脂皮膜中で導電性物質の粒子同士の接触が充分に確保されない場合には、または樹脂皮膜とアルミニウム板の界面において、導電性物質とアルミニウム板の接触が十分に確保されない場合には、所望の導電性が得られないという問題が生じる。したがって、所望とする導電性を得るには、導電性物質の成分量を増加させる必要が生じる。ところが、導電性物質の成分量を増加させると樹脂皮膜が硬くなって脆くなるため、樹脂皮膜が形成されたアルミニウム板にプレス加工を施す際に樹脂皮膜の割れ(剥離)が発生し易くなるという問題が生じる。   However, in the method of coating the surface of the aluminum plate with the resin containing the conductive material in this way, it is necessary to uniformly disperse the particles of the conductive material in the resin, and it is formed on the surface of the aluminum plate. In the case where the contact between the particles of the conductive material is not sufficiently ensured in the formed resin film, or when the contact between the conductive material and the aluminum plate is not sufficiently ensured at the interface between the resin film and the aluminum plate, There arises a problem that desired conductivity cannot be obtained. Therefore, in order to obtain the desired conductivity, it is necessary to increase the component amount of the conductive material. However, if the amount of the conductive material component is increased, the resin film becomes hard and brittle, so that the resin film is likely to be cracked (peeled) when it is pressed on the aluminum plate on which the resin film is formed. Problems arise.

本発明者らは、これら導電性物質を樹脂皮膜中に添加する構成の発明の問題点を解決するため、特許文献4において、アルミニウム板の持つ表面粗さと樹脂皮膜の平均膜厚の関係に着目し、導電性物質を使わないで導電性を確保する技術を提案している。すなわち、この特許文献4には、図5に示すように、所定の中心線平均粗さRaを有するアルミニウム素板41の少なくとも一面に、所定の耐食性皮膜42と所定の平均膜厚を有する樹脂皮膜43とを形成し、アルミニウム素板41の有する微細な凹凸の凸部が耐食性皮膜42に被覆された状態で樹脂皮膜43の表面に露出するようにした電子機器用プレコートアルミニウム板40が記載されており、このようにすることで高い導電性を向上させつつ、その他の要求も満足している。   In order to solve the problems of the invention in which the conductive material is added to the resin film, the present inventors pay attention to the relationship between the surface roughness of the aluminum plate and the average film thickness of the resin film in Patent Document 4. In addition, we are proposing a technology to ensure conductivity without using conductive materials. That is, in Patent Document 4, as shown in FIG. 5, a predetermined corrosion-resistant film 42 and a resin film having a predetermined average film thickness are formed on at least one surface of an aluminum base plate 41 having a predetermined centerline average roughness Ra. 43, and a pre-coated aluminum plate 40 for an electronic device is described in which the fine irregularities of the aluminum base plate 41 are exposed on the surface of the resin film 43 in a state of being covered with the corrosion-resistant film 42. In this way, other requirements are satisfied while improving high conductivity.

前記した構成を有する特許文献4に記載の電子機器用プレコートアルミニウム板は、導電性、耐指紋性、耐疵付き性、潤滑性に優れているため、光ディスクドライブのカバーや液晶パネルのフレーム、液晶パネルのバックパネル、車載用オーディオの内部ケースなど、各種電子機器に採用されている。   The pre-coated aluminum plate for electronic equipment described in Patent Document 4 having the above-described structure is excellent in conductivity, fingerprint resistance, wrinkle resistance, and lubricity. Therefore, the cover of the optical disk drive, the frame of the liquid crystal panel, the liquid crystal It is used in various electronic devices such as the back panel of panels and the inner case of in-vehicle audio.

特公平6−70870号公報Japanese Patent Publication No. 6-70870 特開平7−313930号公報JP 7-313930 A 特許第3245696号公報Japanese Patent No. 3245696 特許第4237975号公報Japanese Patent No. 4237975

しかしながら、特許文献4に記載の電子機器用プレコートアルミニウム板で使用されている耐食性皮膜は、クロム(Cr)またはジルコニウム(Zr)を主成分とした従来公知の耐食性皮膜であり、かかる耐食性皮膜がCrを主成分としたものである場合、りん酸クロメート処理皮膜、クロム酸クロメート処理皮膜、あるいは塗布型クロメート処理皮膜などを適宜使用することができる旨が特許文献4に記載されている。   However, the corrosion-resistant film used in the precoated aluminum plate for electronic devices described in Patent Document 4 is a conventionally known corrosion-resistant film mainly composed of chromium (Cr) or zirconium (Zr), and the corrosion-resistant film is Cr. Patent Document 4 describes that a phosphoric acid chromate-treated film, a chromic acid chromate-treated film, a coating-type chromate-treated film, or the like can be used as appropriate.

例えば、りん酸クロメート処理皮膜を形成するりん酸クロメート処理は、6価クロムを有する薬液とアルミニウムとを化学反応させる処理であり、反応の過程で6価クロムは3価に還元されるため、得られた化成皮膜(耐食性皮膜)には6価クロムが含まれない処理として知られている。また、薬液に使用される6価クロムを含有する反応液は、その水洗水を含めて設備から排水・廃棄物を流出しない、いわゆる「クローズドシステム」設計がなされており、環境への配慮は十分になされている完成された技術であることもよく知られている。   For example, the phosphate chromate treatment for forming a phosphate chromate treatment film is a treatment in which a chemical solution having hexavalent chromium and aluminum are chemically reacted, and hexavalent chromium is reduced to trivalent in the course of the reaction. The resulting chemical conversion film (corrosion resistance film) is known as a treatment not containing hexavalent chromium. In addition, the reaction solution containing hexavalent chromium used in chemicals has a so-called “closed system” design that does not allow wastewater or waste to flow out of the equipment, including the washing water. It is well known that this is a completed technology.

しかしながら、一般消費者の立場で見ると、3価クロムと6価クロムの違いなどが正しく理解されているとは考え難く、「クロム」という言葉の響き自体が製品のイメージを低下させる場合がある。
また、近年、電子機器分野では環境保護の観点から「電子・電気機器における特定有害物質の使用制限についてのEU指令(RoHS指令)」や「廃電気・電子製品に関するEU指令(WEEE指令)」などによって、使用される原材料が制限を受ける方向にあり、6価クロムがこれに該当する。
However, from the point of view of general consumers, it is difficult to think that the difference between trivalent chromium and hexavalent chromium is correctly understood, and the sound of the word “chromium” itself may reduce the image of the product. .
In recent years, in the field of electronic equipment, from the viewpoint of environmental protection, “EU Directive on Restriction of Use of Specific Hazardous Substances in Electronic and Electrical Equipment (RoHS Directive)” and “EU Directive on Waste Electrical and Electronic Products (WEEE Directive)” etc. Therefore, the raw material used is in a direction to be restricted, and hexavalent chromium corresponds to this.

前記したようにりん酸クロメート処理皮膜は6価クロムを含まないものであるが、3価クロムは含むものである。これが製品として使用され、廃棄された場合、廃棄後にどのような環境にさらされるかについてまでは、もはや管理することはできない。そのため、特殊な環境下で3価クロムが6価クロムに変質する可能性が無いかという問いに対して、100%全く無いとまで言い切るのは困難である。
このようなレベルにまで踏み込んで、6価クロムの安全性から100%開放されるためには、もはやクロムそのものを全く使用しないで所定の性能を確保するよりほかはない。
As described above, the phosphate chromate-treated film does not contain hexavalent chromium, but contains trivalent chromium. If this is used as a product and discarded, it is no longer possible to control what kind of environment it will be exposed to after disposal. For this reason, it is difficult to say that there is no possibility that trivalent chromium is transformed into hexavalent chromium in a special environment.
In order to reach 100% from the safety of hexavalent chromium by stepping up to such a level, there is no other way than ensuring the predetermined performance without using chromium at all.

本発明は前記課題に鑑みてなされたものであって、その目的は、導電性、潤滑性、耐指紋性および耐疵付き性に優れるとともに、りん酸クロメートに代表されるクロム含有下地処理皮膜をいっさい形成しなくても、優れた耐食性を備えた、環境にやさしい電子機器用プレコートアルミニウム板を提供することにある。   The present invention has been made in view of the above-mentioned problems, and its purpose is to provide a chromium-containing ground treatment film typified by phosphoric acid chromate as well as excellent conductivity, lubricity, fingerprint resistance and wrinkle resistance. An object of the present invention is to provide an environment-friendly precoated aluminum plate for electronic equipment that has excellent corrosion resistance without being formed at all.

前記課題を解決した本発明に係る電子機器用プレコートアルミニウム板は、算術平均粗さRaが0.3μm以上0.5μm以下であるアルミニウム素板の少なくとも片面に、クロムを含有する下地処理皮膜を設けることなく樹脂皮膜が形成された電子機器用プレコートアルミニウム板であって、前記樹脂皮膜は金属元素を含まず、アクリル樹脂成分、ウレタン樹脂成分、シリカ成分および粒子状の潤滑成分を含み、前記樹脂皮膜中に占める前記シリカ成分の含有量が12質量%を超え、前記樹脂皮膜中に含まれる前記潤滑成分の含有量が8質量%を超え、前記樹脂皮膜の平均膜厚が0.15μm以上1.0μm以下であり、先端部が半径10mmの球状端子を、前記樹脂皮膜を形成した前記アルミニウム素板に対して0.4Nの荷重で押し付けたときにおける前記球状端子と前記アルミニウム素板との間の抵抗値が10Ω以下であることを特徴としている(請求項1)。   The pre-coated aluminum plate for electronic equipment according to the present invention that has solved the above problems is provided with an undercoat film containing chromium on at least one surface of an aluminum base plate having an arithmetic average roughness Ra of 0.3 μm or more and 0.5 μm or less. A pre-coated aluminum plate for an electronic device on which a resin film is formed, wherein the resin film does not include a metal element, and includes an acrylic resin component, a urethane resin component, a silica component, and a particulate lubricating component, The content of the silica component in the resin film exceeds 12% by mass, the content of the lubricating component contained in the resin film exceeds 8% by mass, and the average film thickness of the resin film is 0.15 μm or more. A spherical terminal having a radius of 10 mm at a tip of 0 μm or less is pressed against the aluminum base plate on which the resin film is formed with a load of 0.4 N. It is characterized in that the resistance value between the aluminum workpieces and the spherical terminal is 10Ω or less at the time (claim 1).

本発明に係る電子機器用プレコートアルミニウム板は、クロムを含有する下地処理皮膜を形成せず、アルミニウム素板の算術平均粗さRaと、樹脂皮膜の平均膜厚とをそれぞれ特定の範囲内に規制したので、アルミニウム素板の微細な凸部が樹脂皮膜の平均的な高さよりも高く飛び出た形態となり、凸部を覆う樹脂皮膜の膜厚は従来技術の下地処理皮膜を形成した場合とほぼ同程度に留まる。そのため、前記した方法によって測定した際の抵抗値が10Ω以下となるような、優れた導電性を確保することができる。
また、本発明に係る電子機器用プレコートアルミニウム板は、樹脂皮膜を形成する樹脂成分を前記したように規定するとともに、所定の含有量のシリカ成分と潤滑成分を必須成分として含むことにより、電子機器用として要求される耐食性を確保するとともに、潤滑性、耐指紋性および耐疵付き性が確保される。さらにクロムを含む下地処理皮膜を含まず、樹脂皮膜中にもクロムをはじめとする金属元素を含まないため、環境にやさしい電子機器用プレコートアルミニウム板が具現される。
The pre-coated aluminum plate for electronic equipment according to the present invention does not form a chromium-containing ground treatment film, and regulates the arithmetic average roughness Ra of the aluminum base plate and the average film thickness of the resin film within specific ranges, respectively. Therefore, the fine protrusions of the aluminum base plate protruded higher than the average height of the resin film, and the film thickness of the resin film covering the protrusions was almost the same as that of the case of forming the ground treatment film of the prior art. Stay around. Therefore, excellent conductivity can be ensured such that the resistance value measured by the above method is 10Ω or less.
In addition, the precoated aluminum plate for electronic equipment according to the present invention defines the resin component for forming the resin film as described above, and includes a silica component and a lubricating component having a predetermined content as essential components, thereby providing electronic equipment. As well as ensuring the corrosion resistance required for use, lubricity, fingerprint resistance and scratch resistance are ensured. Furthermore, since the resin film does not contain a base treatment film containing chromium and does not contain chromium or other metal elements, an environment-friendly pre-coated aluminum plate for electronic devices is realized.

本発明に係る電子機器用プレコートアルミニウム板は、前記アルミニウム素板と前記樹脂皮膜の間に下地処理皮膜をいっさい設けないのが好ましい(請求項2)。
このように、アルミニウム素板と樹脂皮膜の間にクロムを含まない下地処理皮膜を含め下地処理皮膜をいっさい設けない構成とすれば、下地処理皮膜を形成する工程と、下地処理皮膜形成に使用する薬剤が省略されるため、本発明の電子機器用プレコートアルミニウム板を製造する設備構成が大幅に簡略化でき、コストダウンできるとともに生産性も高めた電気機器用プレコートアルミニウム板が具現される。
In the precoated aluminum plate for electronic equipment according to the present invention, it is preferable that no base treatment film is provided between the aluminum base plate and the resin film.
Thus, if it is set as the structure which does not provide any base-treatment film including the base-treatment film which does not contain chromium between an aluminum base plate and a resin film, it will be used for the process of forming a base-treatment film, and a base-treatment film formation. Since a chemical | medical agent is abbreviate | omitted, the equipment structure which manufactures the precoat aluminum plate for electronic devices of this invention can be simplified significantly, the precoat aluminum plate for electrical devices which can be reduced in cost and productivity was embodied.

本発明に係る電子機器用プレコートアルミニウム板は、前記樹脂皮膜中に含まれる前記潤滑成分の粒子径が2.5μm以下であるのが好ましい(請求項3)。
このようにすれば、本発明に係る電子機器用プレコートアルミニウム板に形成する樹脂皮膜の膜厚を薄くして下限付近とした場合であっても潤滑成分が脱落し難くなるため、高い導電性を維持しつつ一層高い潤滑性を確保した電子機器用プレコートアルミニウム板が具現される。
In the precoated aluminum plate for electronic equipment according to the present invention, the particle diameter of the lubricating component contained in the resin film is preferably 2.5 μm or less.
In this way, even when the film thickness of the resin film formed on the precoated aluminum plate for electronic equipment according to the present invention is reduced to the vicinity of the lower limit, the lubricating component does not easily fall off, so that high conductivity is achieved. A pre-coated aluminum plate for electronic equipment that maintains a higher lubricity while maintaining it is realized.

本発明に係る電子機器用プレコートアルミニウム板の前記樹脂皮膜は、さらに平均粒子径が0.3μm以上15μm以下の光学特性調整微粒子を1質量%以上30質量%以下含むのが好ましい(請求項4)。
このようにすれば、表面の光学特性がさらに最適化されて耐指紋性が一層向上した電子機器用プレコートアルミニウム板が具現される。
The resin film of the precoated aluminum plate for electronic equipment according to the present invention preferably further contains 1% by mass to 30% by mass of optical property adjusting fine particles having an average particle size of 0.3 μm or more and 15 μm or less (Claim 4). .
In this way, a pre-coated aluminum plate for electronic equipment with further improved fingerprint resistance by further optimizing the optical characteristics of the surface is realized.

本発明に係る電子機器用プレコートアルミニウム板は、前記アルミニウム素板に含まれる合金用添加元素としてのクロム含有量が0.1質量%未満であるのが好ましい(請求項5)。
このようにすれば、樹脂皮膜や下地処理皮膜だけではなくアルミニウム板そのものにもクロムを含まないため、より一層環境にやさしい電子機器用プレコートアルミニウム板が具現される。
In the precoated aluminum plate for electronic equipment according to the present invention, the chromium content as an alloying additive element contained in the aluminum base plate is preferably less than 0.1% by mass (Claim 5).
In this way, since not only the resin film and the base treatment film but also the aluminum plate itself does not contain chromium, a pre-coated aluminum plate for electronic equipment that is more environmentally friendly can be realized.

本発明に係る電子機器用プレコートアルミニウム板によれば、アルミニウム素板の算術平均粗さRaと、樹脂皮膜の平均膜厚とをそれぞれ特定の範囲内に規制し、さらに樹脂皮膜の成分を適切化したため、導電性、潤滑性、耐指紋性、耐疵付き性および耐食性に優れている。
また、本発明に係る電子機器用プレコートアルミニウム板によれば、樹脂皮膜および下地処理皮膜にクロムを含まないため環境にやさしい。
According to the pre-coated aluminum plate for electronic equipment according to the present invention, the arithmetic average roughness Ra of the aluminum base plate and the average film thickness of the resin film are regulated within specific ranges, respectively, and further the components of the resin film are optimized. Therefore, it has excellent conductivity, lubricity, fingerprint resistance, scratch resistance and corrosion resistance.
Moreover, according to the precoat aluminum plate for electronic devices which concerns on this invention, since a resin film and a base-treatment film do not contain chromium, it is environmentally friendly.

本発明に係る電子機器用プレコートアルミニウム板の構成を模式的に示す要部拡大断面図である。It is a principal part expanded sectional view which shows typically the structure of the precoat aluminum plate for electronic devices which concerns on this invention. 電子機器用プレコートアルミニウム板の抵抗値を測定する方法を模式的に示す模式図である。It is a schematic diagram which shows typically the method of measuring the resistance value of the precoat aluminum plate for electronic devices. 本発明に係る電子機器用プレコートアルミニウム板の他の一例の構成を模式的に示す要部拡大断面図である。It is a principal part expanded sectional view which shows typically the structure of the other example of the precoat aluminum plate for electronic devices which concerns on this invention. 電子機器用プレコートアルミニウム板の耐疵付き性を測定する剪断曲げ試験法を模式的に示す模式図である。It is a schematic diagram which shows typically the shear bending test method which measures the abrasion resistance of the precoat aluminum plate for electronic devices. 従来技術に係る電子機器用プレコートアルミニウム板の構成を模式的に示す要部拡大断面図である。It is a principal part expanded sectional view which shows typically the structure of the precoat aluminum plate for electronic devices which concerns on a prior art.

以下、適宜図面を参照して本発明に係る電子機器用プレコートアルミニウム板について詳細に説明する。
図1に示すように、本発明に係る電子機器用プレコートアルミニウム板10は、アルミニウム素板11と、このアルミニウム素板11の少なくとも片面に形成された樹脂皮膜12とを有する。なお、このアルミニウム素板11と樹脂皮膜12の間には、少なくとも一般的によく用いられるりん酸クロメートのようなクロムを含有する化成皮膜(下地処理皮膜)が形成されていない。しかし、図3のようにクロムを含有しない下地処理皮膜であればアルミニウム素板11と樹脂皮膜12の間にこれを形成することは許容される。
Hereinafter, the precoated aluminum plate for electronic equipment according to the present invention will be described in detail with reference to the drawings as appropriate.
As shown in FIG. 1, the precoat aluminum plate 10 for electronic devices which concerns on this invention has the aluminum base plate 11 and the resin film 12 formed in the at least single side | surface of this aluminum base plate 11. As shown in FIG. In addition, between this aluminum base plate 11 and the resin film 12, the chemical conversion film (base-treatment film | membrane) containing chromium like the phosphoric acid chromate used at least generally is not formed. However, as shown in FIG. 3, it is permissible to form this between the aluminum base plate 11 and the resin film 12 if it is a base treatment film that does not contain chromium.

このアルミニウム素板11の表面に形成される樹脂皮膜12は金属元素を含まず、アクリル樹脂成分、ウレタン樹脂成分、シリカ成分および粒子状の潤滑成分を含み、この樹脂皮膜12中に占めるシリカ成分の含有量は12質量%を超えているとともに、当該樹脂皮膜12中に含まれる潤滑成分の含有量は8質量%を超えている。
なお、アルミニウム素板11の表面には微細な凹凸が形成されているため、前記した樹脂皮膜12は、アルミニウム素板11の表面の凹凸の凹部については相対的に厚く形成され、凸部については相対的に薄く形成されており、その平均膜厚は0.15μm以上1.0μm以下となっている。
本発明に係る電子機器用プレコートアルミニウム板10は、このような樹脂皮膜12を有しているため、先端部が半径10mmの球状端子23(図2参照)を、樹脂皮膜12を形成したアルミニウム素板11に対して0.4Nの荷重で押し付けたときにおける、前記した球状端子23とアルミニウム素板11との間の抵抗値を10Ω以下とすることが可能である。
The resin film 12 formed on the surface of the aluminum base plate 11 does not contain a metal element, includes an acrylic resin component, a urethane resin component, a silica component, and a particulate lubricating component. The content exceeds 12% by mass, and the content of the lubricating component contained in the resin film 12 exceeds 8% by mass.
In addition, since the fine unevenness | corrugation is formed in the surface of the aluminum base plate 11, the above-mentioned resin film 12 is formed relatively thick about the uneven | corrugated recessed part of the surface of the aluminum base plate 11, and about a convex part, It is formed relatively thin, and the average film thickness is 0.15 μm or more and 1.0 μm or less.
Since the precoated aluminum plate 10 for electronic equipment according to the present invention has such a resin film 12, a spherical terminal 23 (see FIG. 2) having a radius of 10 mm at the tip is formed of an aluminum element on which the resin film 12 is formed. When pressed against the plate 11 with a load of 0.4 N, the resistance value between the spherical terminal 23 and the aluminum base plate 11 can be 10Ω or less.

なお、前記した本発明に係る電子機器用プレコートアルミニウム板10に関する記載、および図1に示す本発明に係る電子機器用プレコートアルミニウム板10の構成と、図5に示す従来技術に係る電子機器用プレコートアルミニウム板40の構成とを比較すればわかるように、本発明に係る電子機器用プレコートアルミニウム板10の樹脂皮膜12は、従来技術に係る電子機器用プレコートアルミニウム板40の耐食性皮膜42と樹脂皮膜43とを一体化した構成および役割を担っている。従って、後に詳しく説明するが、図3のようにクロムを含まない下地処理皮膜13を設けることは妨げない。   In addition, the description regarding the precoat aluminum plate 10 for electronic devices which concerns on the above-mentioned this invention, the structure of the precoat aluminum plate 10 for electronic devices which concerns on this invention shown in FIG. 1, and the precoat for electronic devices which concerns on the prior art shown in FIG. As can be seen from a comparison with the configuration of the aluminum plate 40, the resin film 12 of the precoat aluminum plate 10 for electronic equipment according to the present invention is the corrosion resistant film 42 and the resin film 43 of the precoat aluminum plate 40 for electronic equipment according to the prior art. And has a unified structure and role. Therefore, as will be described in detail later, it is not hindered to provide the base treatment film 13 not containing chromium as shown in FIG.

以下、本発明に係る電子機器用プレコートアルミニウム板10の各構成要件について説明する。   Hereinafter, each structural requirement of the precoat aluminum plate 10 for electronic devices which concerns on this invention is demonstrated.

[アルミニウム素板]
本発明で用いることのできるアルミニウム素板11は、アルミニウムまたはアルミニウム合金からなるものであり、使用できる品種も特に制限されるものではなく、製品形状や成形方法、使用時に求められる強度等に基づいて任意に選択することができる。一般的には、非熱処理型のアルミニウム板、すなわち、1000系の工業用純アルミニウム板、3000系のAl−Mn系合金板、5000系のAl−Mg系合金板を好適に使用することができる。特に、しごき加工を伴う深い容器形状のケースを製作する場合には、JISH4000に規定されるA1050、A1100、A3003、A3004等のアルミニウム板が推奨される。また、比較的浅い容器形状のケースを製作する場合や、曲げ加工主体のケースを製作する場合には、JISH4000に規定されるA5052、A5182等のアルミニウム板が推奨される。調質、板厚についても、目的に応じて種々のものを選定して使用することができる。
[Aluminum base plate]
The aluminum base plate 11 that can be used in the present invention is made of aluminum or an aluminum alloy, and the type that can be used is not particularly limited, and is based on the product shape, molding method, strength required at the time of use, and the like. Can be arbitrarily selected. In general, a non-heat-treatable aluminum plate, that is, a 1000 series industrial pure aluminum plate, a 3000 series Al—Mn alloy plate, and a 5000 series Al—Mg alloy plate can be preferably used. . In particular, when manufacturing a case having a deep container shape with ironing, aluminum plates such as A1050, A1100, A3003, and A3004 defined in JISH4000 are recommended. Further, when a relatively shallow container-shaped case is manufactured or when a case mainly made of bending is manufactured, aluminum plates such as A5052 and A5182 defined in JISH4000 are recommended. Various types of tempering and plate thickness can be selected and used according to the purpose.

なお、アルミニウム素板11はクロムを含まないのが最も好ましいが、クロムを含む場合はその含有量を0.1質量%未満とするのが好ましい。このように規定した理由は性能上の問題ではなく、環境に対してよりやさしい製品とするため、再生地金などにより不可避的に混入されるクロム成分を除いて、積極的にクロムを添加しないという立場に立つためである。また、この程度のクロムの含有を許容しないと、アルミニウム合金の利点である優れたリサイクル性が損なわれるだけでなく、毎回新地金しか使用できないこととなってしまうため、多大なエネルギーと資源を必要とし、かえって環境にやさしくない製品となってしまう。   In addition, it is most preferable that the aluminum base plate 11 does not contain chromium, but when it contains chromium, the content is preferably less than 0.1% by mass. The reason specified in this way is not a problem in performance, but in order to make the product more friendly to the environment, it does not actively add chromium except for chromium components inevitably mixed with recycled metal. This is to stand in a position. Moreover, if this level of chromium content is not allowed, not only the excellent recyclability that is an advantage of aluminum alloys is impaired, but only new bullion can be used every time, so a great deal of energy and resources are required. On the contrary, it becomes a product that is not environmentally friendly.

このような観点に立つと、前記したアルミニウム合金のうちA5052は合金中のクロム含有量が0.15〜0.35質量%と定められており、合金成分として積極的にクロムを添加しなければならない合金に該当する。このような合金の使用は、本発明としては望ましいものではないので、可能であれば類似した性能を有する代替合金を使用する方が望ましい。例えば、A5052の代替合金としては、A5052と同等レベルの2.5質量%程度のマグネシウムを含み、クロムは積極的には含まず、クロムの代わりにマンガンを0.45質量%程度添加した5K52(株式会社神戸製鋼所製)をアルミニウム素板に採用することができる。   From this point of view, among the above-described aluminum alloys, A5052 has a chromium content of 0.15 to 0.35 mass% in the alloy, and chromium must be positively added as an alloy component. Corresponds to alloys that must not be. The use of such an alloy is not desirable for the present invention, so it is desirable to use an alternative alloy with similar performance if possible. For example, as an alternative alloy of A5052, 5K52 (contains about 2.5 mass% magnesium equivalent to A5052, does not actively contain chromium, and adds about 0.45 mass% manganese instead of chromium. Kobe Steel Co., Ltd.) can be used for the aluminum base plate.

(アルミニウム素板の算術平均粗さRa:0.3μm以上0.5μm以下)
アルミニウム素板11の算術平均粗さRaは、後記する樹脂皮膜12の平均膜厚とともに、本発明の電子機器用プレコートアルミニウム板10における導電性、耐食性、耐指紋性、耐疵付き性等の各種特性の発現に寄与する重要なパラメータである。
(Arithmetic average roughness Ra of aluminum base plate: 0.3 μm or more and 0.5 μm or less)
The arithmetic average roughness Ra of the aluminum base plate 11 includes various properties such as conductivity, corrosion resistance, fingerprint resistance, and scratch resistance in the precoated aluminum plate 10 for electronic equipment of the present invention, as well as the average film thickness of the resin film 12 to be described later. It is an important parameter that contributes to the development of properties.

アルミニウム素板11の算術平均粗さRaが0.3μm未満であると、電子機器用プレコートアルミニウム板10の表面の光沢度が過剰に大きくなって、表面に付着した指紋および表面に生じた微細な疵が目立ち易くなり、耐指紋性および耐疵付き性に劣ったものとなる。また、この場合には、前記した微細な凹凸を有するアルミニウム素板11の素地の凸部の高さが低くなり、その結果凸部を覆う樹脂皮膜12の膜厚が厚くなるため、所望の導電性を確保することが困難となる。
一方、アルミニウム素板11の算術平均粗さRaが0.5μmを超えると、アルミニウム素板11の凸部の高さが高くなり過ぎるため、凸部の頂上が樹脂皮膜12から露出し易くなる。その結果、露出したアルミニウム素板11の表面が金型によって磨耗を受けるため、耐疵付き性が低下するとともに潤滑性も低下する。また、凸部が樹脂皮膜12から露出すると、そこを起点に腐食が発生し、周囲に広がるため耐食性が低下する。
つまり、アルミニウム素板11の算術平均粗さRaを0.3μm以上0.5μm以下の範囲に規定することによって、優れた導電性、耐指紋性、耐疵付き性および耐食性を備えさせることができる。
When the arithmetic average roughness Ra of the aluminum base plate 11 is less than 0.3 μm, the glossiness of the surface of the precoated aluminum plate 10 for electronic equipment becomes excessively large, and fingerprints adhering to the surface and the fineness generated on the surface A wrinkle becomes conspicuous, and is inferior to fingerprint resistance and wrinkle resistance. Further, in this case, the height of the convex portion of the base of the aluminum base plate 11 having fine irregularities described above is lowered, and as a result, the film thickness of the resin film 12 covering the convex portion is increased, so that the desired conductive It is difficult to ensure the property.
On the other hand, when the arithmetic average roughness Ra of the aluminum base plate 11 exceeds 0.5 μm, the height of the convex portion of the aluminum base plate 11 becomes too high, so that the top of the convex portion is easily exposed from the resin film 12. As a result, since the exposed surface of the aluminum base plate 11 is worn by the mold, the scratch resistance is lowered and the lubricity is also lowered. Moreover, if a convex part is exposed from the resin film 12, corrosion will generate | occur | produce from there and will spread to circumference | surroundings, and corrosion resistance will fall.
That is, by defining the arithmetic average roughness Ra of the aluminum base plate 11 in the range of 0.3 μm or more and 0.5 μm or less, it is possible to provide excellent conductivity, fingerprint resistance, scratch resistance and corrosion resistance. .

なお、アルミニウム素板11の算術平均粗さRaを前記した範囲内に調整する方法としては、例えば、アルミニウム素板11の圧延工程で表面粗さが適宜設定された圧延ロールを用いて冷間圧延の最終(仕上げ)圧延を行う方法や、圧延後のアルミニウム素板11の表面に適宜の条件でエッチング処理を施す方法、微粒子などをたたきつけるブラスト法などが挙げられる。   In addition, as a method of adjusting the arithmetic average roughness Ra of the aluminum base plate 11 within the above-described range, for example, cold rolling is performed using a rolling roll whose surface roughness is appropriately set in the rolling process of the aluminum base plate 11. The final (finishing) rolling method, the method of etching the surface of the aluminum base plate 11 after the rolling under appropriate conditions, the blasting method of hitting fine particles, and the like.

本発明では、このようにして算術平均粗さRaが調整されて微細な凹凸が形成されたアルミニウム素板11の上に成分と平均膜厚を特定した樹脂皮膜12を形成するため、アルミニウム素板11の微細な凸部を覆う樹脂皮膜12の膜厚が厚くなり過ぎることもなく、また薄くなり過ぎることもない。そのため、所望の導電性、潤滑性、耐指紋性および耐疵付き性が確保されるとともに、耐食性が高められた電子機器用プレコートアルミニウム板10を得ることができる。   In the present invention, the aluminum base plate is formed on the aluminum base plate 11 in which the arithmetic average roughness Ra is adjusted in this way and the fine irregularities are formed, so that the resin film 12 specifying the components and the average film thickness is formed. The film thickness of the resin film 12 covering the 11 minute projections does not become too thick and does not become too thin. Therefore, it is possible to obtain the precoated aluminum plate 10 for electronic equipment that has the desired conductivity, lubricity, fingerprint resistance, and wrinkle resistance, and has improved corrosion resistance.

また、クロムを含有しない下地処理皮膜であればアルミニウム素板11と樹脂皮膜12の間にこれを形成することは許容されるが、下地処理皮膜をいっさい形成しない場合は、下地処理皮膜を形成する工程と、下地処理皮膜形成に使用する薬剤を省略することができるため、本発明の電子機器用プレコートアルミニウム板10を製造する設備構成を大幅に簡略化することが可能であり、コストダウンできるとともに生産性を高めることができる。   In addition, it is permissible to form this between the aluminum base plate 11 and the resin film 12 as long as it does not contain chromium. However, if no ground treatment film is formed, a ground treatment film is formed. Since the chemicals used for forming the process and the base treatment film can be omitted, it is possible to greatly simplify the equipment configuration for producing the precoated aluminum plate 10 for electronic equipment of the present invention, and to reduce the cost. Productivity can be increased.

[樹脂皮膜]
(樹脂皮膜の構成成分:アクリル樹脂成分、ウレタン樹脂成分、シリカ成分および粒子状の潤滑成分を含む)
前記したように、本発明の電子機器用プレコートアルミニウム板10に用いられる樹脂皮膜12は、構成成分としてアクリル樹脂成分、ウレタン樹脂成分、シリカ成分および粒子状の潤滑成分を含むことを必要とする。
[Resin film]
(Constituent components of resin film: including acrylic resin component, urethane resin component, silica component and particulate lubricating component)
As described above, the resin film 12 used in the precoated aluminum plate 10 for electronic equipment of the present invention needs to contain an acrylic resin component, a urethane resin component, a silica component, and a particulate lubricating component as constituent components.

樹脂成分としてアクリル樹脂成分とウレタン樹脂成分を併用することにより、微細な凹凸を有するアルミニウム素板11の表面の凹部だけではなく凸部も薄い膜で覆うことができるため、耐食性、耐疵付き性、耐指紋性が良好なプレコートアルミニウム板10を得ることができるようになる。   Since the acrylic resin component and the urethane resin component are used in combination as the resin component, not only the concave portions on the surface of the aluminum base plate 11 having fine irregularities but also the convex portions can be covered with a thin film. Thus, the precoated aluminum plate 10 having good fingerprint resistance can be obtained.

ここで、樹脂成分のみにおけるアクリル樹脂成分とウレタン樹脂成分の含有比率は、質量比で、アクリル樹脂成分:ウレタン樹脂成分が5:95〜95:5が望ましく、より望ましくは10:90〜90:10、さらに望ましくは50:50〜85:15である。95:5よりもアクリル樹脂成分が多くなると耐食性が劣ってくる。また5:95よりもウレタン樹脂成分が多くなると耐食性とともに耐疵付き性が劣ってくる。   Here, the content ratio of the acrylic resin component and the urethane resin component in only the resin component is a mass ratio, and the acrylic resin component: urethane resin component is preferably 5:95 to 95: 5, and more preferably 10:90 to 90: 10 and more desirably 50:50 to 85:15. When the acrylic resin component is larger than 95: 5, the corrosion resistance is inferior. On the other hand, when the urethane resin component is larger than 5:95, the corrosion resistance and the scratch resistance become inferior.

シリカ成分、潤滑成分ともにアクリル樹脂成分とウレタン樹脂成分を併用した樹脂成分中に分散されることで前記したとおり微細な凹凸を有するアルミニウム素板11の表面の凹部はもちろん凸部も薄く満遍なく覆うことができるため、他の樹脂成分を用いた樹脂皮膜と比べると耐食性や潤滑性を向上させる効果が大きい。特に耐食性向上の効果は飛躍的に大きくなるため、例えば、従来の電子機器用プレコートアルミニウム板40(図5参照)で耐食性付与を担ってきたりん酸クロメート処理皮膜などの下地処理皮膜42を使用することなく、本発明のように薄い膜厚(平均膜厚)であっても高い耐食性を確保することができるようになる。   As described above, the silica component and the lubricating component are dispersed in the resin component using both the acrylic resin component and the urethane resin component, and as described above, not only the recesses on the surface of the aluminum base plate 11 having fine unevenness, but also the protrusions are thinly and uniformly covered. Therefore, compared with resin films using other resin components, the effect of improving the corrosion resistance and lubricity is great. In particular, since the effect of improving the corrosion resistance is remarkably increased, for example, a base treatment film 42 such as a phosphate chromate treatment film that has been imparted with corrosion resistance by the conventional precoated aluminum plate 40 for electronic equipment (see FIG. 5) is used. Even if it is thin film thickness (average film thickness) like this invention, high corrosion resistance can be ensured now.

(樹脂皮膜の成分:金属元素を含有しない)
本発明は環境にやさしい電子機器用プレコートアルミニウム板10を提供することを目的としているためクロムを含有する下地処理皮膜を設けないこととしているが、樹脂皮膜12中にクロムはもちろんその他の金属元素を含まないようにすることにより、さらに環境にやさしい電子機器用プレコートアルミニウム板10を提供することができる。例えば、耐食性を向上させる目的で添加されることの多い防錆顔料(さび止め顔料)として、鉛系防錆顔料、亜鉛系防錆顔料、りん酸系防錆顔料がある。鉛系防錆顔料としては、鉛丹、亜酸化鉛、塩基性クロム酸鉛、シアナミド鉛、鉛酸カルシウム、塩基性硫酸鉛などがあり、Pb、Cr、Caが含有されている。亜鉛系防錆顔料にはZnが含有されており、りん酸系防錆顔料としては、りん酸亜鉛、りん酸マグネ、ポリりん酸ナトリウム、りん酸亜鉛カルシウム、トリポリりん酸アルミニウム、りんモリブデン酸アルミニウムなどがあり、Zn、Mg、Na、K、Al、Moが含有されている。また、着色を目的として添加されることの多い着色系顔料として、白色顔料の酸化チタン、酸化亜鉛系顔料、酸化鉄系顔料などがあるがこれらにはTi、Zn、Feが含有されており、体質顔料には、炭酸カルシウム、硫酸バリウム、アルミナ、カオリン、タルク、ベントナイト、マイカなどがあり、Ca、Ba、Al、Mg、Naが含有されている。さらには、導電塗料としてニッケル粉、アルミ粉、ステンレス粉、亜鉛末、その他カドミウムイエロー、コバルトバイオレット、モリブデートオレンジなどがあるが、これらにはNi、Al、Fe、Zn、Cd、Co、Moが含有されている。
したがって、樹脂皮膜12は、これら金属元素を含有する防錆顔料、着色系顔料、導電塗料を添加してはならないが、後記するように樹脂皮膜12は、耐食性および導電性についてはこれらを含有しないでも十分な性能を発揮することができるため、これらを含有しないことについて何ら問題となることはない。
(Resin film component: Does not contain metal elements)
The present invention aims to provide an environmentally friendly pre-coated aluminum plate 10 for electronic equipment, so that a base treatment film containing chromium is not provided, but other metal elements as well as chromium are contained in the resin film 12. By not including it, the precoat aluminum plate 10 for electronic devices that is more environmentally friendly can be provided. For example, as a rust preventive pigment (rust preventive pigment) often added for the purpose of improving the corrosion resistance, there are a lead rust preventive pigment, a zinc rust preventive pigment, and a phosphoric acid rust preventive pigment. Examples of lead-based anticorrosive pigments include red lead, lead suboxide, basic lead chromate, lead cyanamide, calcium leadate, and basic lead sulfate, and contain Pb, Cr, and Ca. Zinc-based rust preventive pigments contain Zn, and phosphoric acid-based rust preventive pigments include zinc phosphate, magnesium phosphate, sodium polyphosphate, zinc calcium phosphate, aluminum tripolyphosphate, and aluminum phosphomolybdate. Zn, Mg, Na, K, Al, and Mo are contained. In addition, as coloring pigments that are often added for the purpose of coloring, there are white pigments such as titanium oxide, zinc oxide pigments, iron oxide pigments, etc., but these contain Ti, Zn, Fe, The extender pigment includes calcium carbonate, barium sulfate, alumina, kaolin, talc, bentonite, mica, and the like, and contains Ca, Ba, Al, Mg, and Na. Furthermore, there are nickel powder, aluminum powder, stainless steel powder, zinc powder, cadmium yellow, cobalt violet, molybdate orange, etc. as conductive paints. These include Ni, Al, Fe, Zn, Cd, Co, and Mo. Contained.
Therefore, the resin film 12 must not contain rust preventive pigments, colored pigments, and conductive paints containing these metal elements. However, as will be described later, the resin film 12 does not contain corrosion resistance and conductivity. However, since sufficient performance can be exhibited, there is no problem with not containing them.

(樹脂皮膜中に占めるシリカ成分の含有量:12質量%を超える)
シリカ成分は、耐食性を飛躍的に向上させる。したがって、これを一定量を超えて含有させることにより、アクリル樹脂成分とウレタン樹脂成分だけでは得られない程の耐食性を電子機器用プレコートアルミニウム板10に備えさせることが可能となる。
シリカ成分の含有量が12質量%以下となると耐食性が低下する。そのため、りん酸クロメート処理皮膜などのクロムを含む下地処理皮膜(耐食性皮膜42(図5参照))を使用した従来の電子機器用プレコートアルミニウム板40(図5参照)と比較して耐食性が低下してしまう。なお、シリカ成分の含有量は15質量%以上が望ましい。
また、塗装時の樹脂の流動性などを考慮するとシリカ成分の含有量は50質量%以下とするのが望ましい。
(Silica component content in the resin film: more than 12% by mass)
The silica component dramatically improves the corrosion resistance. Therefore, by containing this in excess of a certain amount, it becomes possible to provide the precoated aluminum plate 10 for electronic equipment with corrosion resistance that cannot be obtained with only the acrylic resin component and the urethane resin component.
When the content of the silica component is 12% by mass or less, the corrosion resistance decreases. Therefore, the corrosion resistance is reduced as compared with the conventional pre-coated aluminum plate 40 (see FIG. 5) for electronic equipment using a chromium-containing base treatment film (corrosion-resistant film 42 (see FIG. 5)) such as a phosphate chromate-treated film. End up. The content of the silica component is preferably 15% by mass or more.
Further, considering the fluidity of the resin during coating, the content of the silica component is preferably 50% by mass or less.

(樹脂皮膜中に含まれる潤滑成分の含有量:8質量%を超える)
潤滑成分は、その名の通り潤滑性を高め、成形性を向上させる役割を担う。
潤滑成分の含有量が8質量%以下となると充分な潤滑性が得られないため、連続的にプレス加工を施した際に摩耗粉の発生量が多くなり、樹脂皮膜の剥離が発生し易くなるといった不具合の原因となる。そのため、潤滑成分の含有量は8質量%を超える必要がある。なお、潤滑成分の含有量は12質量%以上とするのが望ましい。
また、潤滑成分の含有量が多くなると樹脂皮膜の造膜性が低下して耐疵付き性が低下する傾向があるため、潤滑成分の含有量は30質量%以下とするのが望ましい。
(Lubricating component content in resin film: more than 8% by mass)
As the name suggests, the lubricating component plays a role of improving lubricity and improving moldability.
When the content of the lubricating component is 8% by mass or less, sufficient lubricity cannot be obtained. Therefore, the amount of generated abrasion powder increases during continuous pressing, and the resin film is easily peeled off. Cause a malfunction. Therefore, the content of the lubricating component needs to exceed 8% by mass. The content of the lubricating component is desirably 12% by mass or more.
Moreover, since the film forming property of the resin film tends to be lowered and the scratch resistance tends to be lowered when the content of the lubricating component is increased, the content of the lubricating component is desirably 30% by mass or less.

(潤滑成分の望ましい粒子径:2.5μm以下)
前記したように潤滑成分は粒子状を成している。その粒子径は2.5μm以下であることが望ましい。潤滑成分の粒子径が2.5μmを超えると、本発明に規定している平均膜厚が下限付近となった場合に、潤滑成分が樹脂皮膜から脱落し易くなる。本発明で使用する潤滑成分の粒子径は0.6μm以下がさらに望ましい。潤滑性を高め、成形性を向上させる効果を有効に発揮させるため、潤滑成分の粒子径は0.1μm以上とするのが望ましい。
(Preferred particle size of lubricating component: 2.5 μm or less)
As described above, the lubricating component is in the form of particles. The particle size is desirably 2.5 μm or less. When the particle diameter of the lubricating component exceeds 2.5 μm, the lubricating component easily falls off the resin film when the average film thickness defined in the present invention is near the lower limit. The particle diameter of the lubricating component used in the present invention is more preferably 0.6 μm or less. In order to enhance the lubricity and effectively exert the effect of improving the moldability, the particle size of the lubricating component is desirably 0.1 μm or more.

潤滑成分としては、成形性の向上と経済性とを適度に調和させる観点から、例えば、ポリエチレンワックス、ポリアルキレン系ワックス、マイクロクリスタリンワックス、フッ素系ワックス、ラノリンワックス、カルナウバワックス、パラフィンワックス、グラファイトの中から選択された少なくとも1種を用いることができる。   As a lubricating component, for example, polyethylene wax, polyalkylene wax, microcrystalline wax, fluorine wax, lanolin wax, carnauba wax, paraffin wax, graphite, from the viewpoint of appropriately balancing moldability improvement and economy. At least one selected from among them can be used.

(望ましい成分:光学特性調整微粒子)
本発明の電子機器用プレコートアルミニウム板10においては、光学特性調整微粒子を添加するのが望ましい。本発明ではシリカ成分や潤滑成分などの微粒子を含むため、もともと優れた耐指紋性を有しているが、光学特性調整微粒子を添加することによって、表面の光学特性がさらに最適化されて耐指紋性がいっそう向上した電子機器用プレコートアルミニウム板10を具現することができる。
(Desired component: optical property adjusting fine particles)
In the precoated aluminum plate 10 for electronic equipment of the present invention, it is desirable to add optical property adjusting fine particles. In the present invention, since it contains fine particles such as silica component and lubricating component, it originally has excellent fingerprint resistance. However, by adding optical property adjusting fine particles, the optical properties of the surface are further optimized and fingerprint resistance is improved. The precoat aluminum plate 10 for electronic devices with further improved properties can be realized.

このような光学特性調整微粒子としては、例えば、アクリル樹脂系の微粒子、ナイロン樹脂系の微粒子、ウレタン樹脂系の微粒子、ポリオレフィン樹脂系の微粒子、フッ素樹脂系の微粒子などの各種有機系微粒子やガラス微粒子などの無機系微粒子の中から選択された少なくとも1種を用いることができる。   Examples of such optical property adjusting fine particles include various organic fine particles such as acrylic resin fine particles, nylon resin fine particles, urethane resin fine particles, polyolefin resin fine particles, fluororesin fine particles, and glass fine particles. At least one selected from inorganic fine particles such as, for example, can be used.

(光学特性調整微粒子の望ましい粒子径:0.3μm以上15μm以下)
光学特性調整微粒子を添加する場合、光学特性調整微粒子の粒子径は0.3μm以上15μm以下とすることが望ましい。光学特性調整微粒子の粒子径が0.3μm未満であると光学特性を向上する効果がほとんど得られないため、これを添加する意味がない。一方、光学特性調整微粒子の粒子径が15μmを超えると、当該微粒子が樹脂皮膜12から脱落し易くなる。フッ素樹脂ビーズやポリオレフィン系樹脂ビーズのように化学的な活性が低いものほど樹脂皮膜12からより脱落し易くなるため、粒子径は5μm以下とするのがさらに望ましい。さらに、本発明に規定している平均膜厚が下限付近となった場合を想定すると、粒子径は2.5μm以下とするのがさらに望ましい。
(Preferred particle size of optical property adjusting fine particles: 0.3 μm to 15 μm)
When the optical property adjusting fine particles are added, the particle size of the optical property adjusting fine particles is preferably 0.3 μm or more and 15 μm or less. If the particle size of the optical property adjusting fine particles is less than 0.3 μm, the effect of improving the optical property is hardly obtained, so there is no point in adding this. On the other hand, when the particle diameter of the optical property adjusting fine particles exceeds 15 μm, the fine particles easily fall off from the resin film 12. Since the lower the chemical activity, such as fluororesin beads and polyolefin resin beads, the easier it is to drop from the resin film 12, the particle diameter is more preferably 5 μm or less. Further, assuming that the average film thickness defined in the present invention is near the lower limit, the particle diameter is more preferably 2.5 μm or less.

(光学特性調整微粒子の望ましい成分量:1質量%以上30質量%以下)
また、光学特性調整微粒子を添加する場合、光学特性調整微粒子の成分量は1質量%以上30質量%以下とするのが望ましい。光学特性調整微粒子の成分量が1質量%未満であると光学特性を向上する効果がほとんど得られないため、これを添加する意味がない。一方、光学特性調整微粒子の成分量が30質量%を超えると、樹脂皮膜12中における当該微粒子の数が多くなり過ぎるため、導電性を確保しようとした際に微粒子が電極とアルミニウム素板11の間に数多く入って両者が近づくのを阻害するため、導電性が低下する。したがって、光学特性調整微粒子の成分量は10質量%以下とするのがさらに望ましい。
(A desirable component amount of the optical property adjusting fine particles: 1% by mass or more and 30% by mass or less)
In addition, when the optical property adjusting fine particles are added, the component amount of the optical property adjusting fine particles is preferably 1% by mass or more and 30% by mass or less. If the component amount of the optical property adjusting fine particles is less than 1% by mass, the effect of improving the optical property is hardly obtained, so there is no point in adding this. On the other hand, when the component amount of the optical property adjusting fine particles exceeds 30% by mass, the number of the fine particles in the resin film 12 becomes too large, so that the fine particles are formed between the electrode and the aluminum base plate 11 when securing conductivity. In order to prevent the two from approaching each other in between, the conductivity decreases. Therefore, the component amount of the optical property adjusting fine particles is more preferably 10% by mass or less.

(樹脂皮膜の平均膜厚:0.15μm以上1.0μm以下)
アルミニウム素板11の上に形成される樹脂皮膜12は、本発明に係る電子機器用プレコートアルミニウム板10に所望の潤滑性、耐食性、耐指紋性および耐疵付き性を付与するために設けられるものである。本発明では、樹脂皮膜12の平均膜厚を0.15μm以上1.0μm以下という特定の範囲に規定することによって、潤滑性、耐食性、耐指紋性および耐疵付き性と併せて所望の導電性を具現させている。
(Average film thickness of resin film: 0.15 μm to 1.0 μm)
The resin film 12 formed on the aluminum base plate 11 is provided for imparting desired lubricity, corrosion resistance, fingerprint resistance and wrinkle resistance to the precoated aluminum plate 10 for electronic equipment according to the present invention. It is. In the present invention, by defining the average film thickness of the resin film 12 within a specific range of 0.15 μm or more and 1.0 μm or less, the desired conductivity can be obtained in addition to lubricity, corrosion resistance, fingerprint resistance, and scratch resistance. Is embodied.

樹脂皮膜12の平均膜厚が0.15μm未満では、アルミニウム素板11の凸部を十分に被覆することができないため、十分な耐食性を得ることができないおそれがある。また、アルミニウム素板11の凹部に形成される樹脂皮膜12の膜厚も薄くなるとともに、シリカ成分および潤滑成分も少なくなるため、耐指紋性、耐疵付き性に劣り、潤滑性も充分でないため、成形加工が難しくなる。
一方、樹脂皮膜12の平均膜厚が1.0μmを超えると、アルミニウム素板11の表面粗さ(算術平均粗さRa)を本発明で規定する上限付近となるように粗くしてもアルミニウム素板11の凸部を覆う樹脂皮膜12の膜厚が厚過ぎるため、所望する導電性を確保することが困難となる。
If the average film thickness of the resin film 12 is less than 0.15 μm, the convex portions of the aluminum base plate 11 cannot be sufficiently covered, so that sufficient corrosion resistance may not be obtained. In addition, since the resin film 12 formed in the concave portion of the aluminum base plate 11 is thin, the silica component and the lubricating component are also reduced, and therefore, the fingerprint resistance and wrinkle resistance are inferior, and the lubricity is not sufficient. The molding process becomes difficult.
On the other hand, if the average film thickness of the resin film 12 exceeds 1.0 μm, the aluminum element 11 may be roughened so that the surface roughness (arithmetic average roughness Ra) of the aluminum base plate 11 is close to the upper limit defined in the present invention. Since the resin film 12 covering the convex portion of the plate 11 is too thick, it is difficult to ensure desired conductivity.

(樹脂皮膜の形成方法)
かかる樹脂皮膜12は、例えば、本発明で規定する樹脂成分を含む液体状の皮膜形成用薬剤をロールコート法によりコイル状のアルミニウム素板11の片面または両面に連続して塗布した後、オーブンが単数あるいは複数連なって形成された連続式オーブン内を通過させて焼付けすることで形成することができる。このようにすれば、電子機器用プレコートアルミニウム板10を連続的にかつ速やかに製造することができるため生産性で好適である。
また、このとき樹脂皮膜12は、アルミニウム素板11の表面上に塗布された当初は液体状であるため、アルミニウム素板11の表面の凸部を薄く被覆する一方、凹部に優先的に充填され、凹部を厚く被覆する。そして、引き続き行われる焼付け処理によって凸部上に薄い膜厚で硬質な樹脂皮膜12を形成させるとともに、凹部に厚い膜厚で硬質な樹脂皮膜12を形成させ、結果的に本発明で規定する平均膜厚を有するようにすることができる。
なお、樹脂皮膜12の平均膜厚は、この樹脂皮膜12が形成された部分の面積およびその樹脂量から比較的容易に求めることができる。
(Method for forming resin film)
For example, the resin film 12 is formed by continuously applying a liquid film-forming agent containing the resin component defined in the present invention to one or both surfaces of the coiled aluminum base plate 11 by a roll coating method, It can be formed by passing through a continuous oven formed in a single or plural series and baking. In this way, the precoated aluminum plate 10 for electronic equipment can be manufactured continuously and quickly, which is preferable in terms of productivity.
At this time, since the resin film 12 is initially in a liquid state when applied on the surface of the aluminum base plate 11, the resin film 12 covers the convex portions on the surface of the aluminum base plate 11 while being preferentially filled into the concave portions. Cover the recesses thickly. Then, a hard resin film 12 having a thin film thickness is formed on the convex portion by a baking process performed subsequently, and a hard resin film 12 having a thick film thickness is formed on the concave portion. It can be made to have a film thickness.
The average film thickness of the resin film 12 can be determined relatively easily from the area of the portion where the resin film 12 is formed and the amount of the resin.

[電子機器用プレコートアルミニウム板の性能]
(抵抗値:10Ω以下)
本発明に係る電子機器用プレコートアルミニウム板10では、後記するような方法で測定される抵抗値を10Ω以下とすることが必要である。かかる抵抗値を10Ω以下とすれば、電子機器用プレコートアルミニウム板10の樹脂皮膜12の上から直接アースをとることが可能となる。また、電磁波ノイズを充分に除去することができる。したがって、電子機器が光ディスクドライブなどのドライブ装置であって、当該ドライブ装置のケースおよびシャーシといった構造部材に本発明に係る電子機器用プレコートアルミニウム板10を用いた場合には、書き込みまたは再生エラーが誘発され難くなり、電子機器が液晶パネルであって、当該液晶パネルの固定用フレームおよび背面カバーといった構造部材に本発明に係る電子機器用プレコートアルミニウム板10を用いた場合には、画像ノイズが発生し難くなる。
これに対し、抵抗値が10Ωを超えると、樹脂皮膜12の上から直接アースをとることも、電磁波ノイズを充分に除去することもできなくなる。
[Performance of pre-coated aluminum sheet for electronic equipment]
(Resistance value: 10Ω or less)
In the precoated aluminum plate 10 for electronic equipment according to the present invention, it is necessary that the resistance value measured by a method as described later be 10Ω or less. If the resistance value is 10Ω or less, it is possible to ground directly from the resin film 12 of the precoated aluminum plate 10 for electronic equipment. Moreover, electromagnetic wave noise can be sufficiently removed. Therefore, when the electronic device is a drive device such as an optical disk drive, and the precoated aluminum plate 10 for electronic device according to the present invention is used for a structural member such as a case and a chassis of the drive device, a writing or reproduction error is induced. When the electronic device is a liquid crystal panel and the precoated aluminum plate 10 for an electronic device according to the present invention is used as a structural member such as a fixing frame and a back cover of the liquid crystal panel, image noise is generated. It becomes difficult.
On the other hand, if the resistance value exceeds 10Ω, it is impossible to ground directly from the resin film 12 and to sufficiently remove electromagnetic noise.

本発明では、アルミニウム素板11の算術平均粗さRaを本発明で規定する特定の範囲(0.3μm以上0.5μm以下)内とするとともに、樹脂皮膜12の平均膜厚を本発明で規定する特定の範囲(0.15μm以上1.0μm以下)内とすることにより、特定の方法で測定される抵抗値が10Ω以下となるようにしている。すなわち、本発明に係る電子機器用プレコートアルミニウム板10では、特定の範囲の算術平均粗さRaを有するアルミニウム素板11に対して樹脂皮膜12を適宜な均一性で形成することにより、アルミニウム素板11の微細な凸部が樹脂皮膜12の平均的な高さよりも高く飛び出た形態となる。このように樹脂皮膜12の平均的な高さよりも高く飛び出した凸部では、樹脂皮膜12の膜厚は従来技術の塗装下地処理皮膜(耐食性皮膜42(図5参照))とほぼ同程度の膜厚に留まるため抵抗値を10Ω以下とすることができ、導電性を確保することができる。   In the present invention, the arithmetic average roughness Ra of the aluminum base plate 11 is set within a specific range (0.3 μm or more and 0.5 μm or less) defined in the present invention, and the average film thickness of the resin film 12 is defined in the present invention. By making it within a specific range (0.15 μm or more and 1.0 μm or less), the resistance value measured by a specific method is set to 10Ω or less. That is, in the pre-coated aluminum plate 10 for electronic equipment according to the present invention, the aluminum base plate is formed by appropriately forming the resin film 12 on the aluminum base plate 11 having the arithmetic average roughness Ra within a specific range. 11 fine convex portions protruded higher than the average height of the resin film 12. Thus, in the convex part which protruded higher than the average height of the resin film 12, the film thickness of the resin film 12 is substantially the same as that of the conventional coating ground treatment film (corrosion resistant film 42 (see FIG. 5)). Since the thickness remains, the resistance value can be 10Ω or less, and the conductivity can be ensured.

ただし、アルミニウム素板11の算術平均粗さRaを特定の範囲(0.3μm以上0.5μm以下)内および樹脂皮膜12の平均膜厚を特定の範囲(0.05μm以上1.0μm以下)内に規定することは、抵抗値を10Ω以下という条件を満足させるための必要条件であっても十分条件ではなく、これらの条件を満たしていても抵抗値が10Ω以下にならない場合がある。例えば、アルミニウム素板11の算術平均粗さRaが下限付近であり、樹脂皮膜12の平均膜厚が上限付近である場合には、アルミニウム素板11の凹凸が小さく、膜厚が厚いため、そのようになり易い。
したがって、本発明では、後記する特定の方法で測定される抵抗値が10Ω以下であることを要件としている。
However, the arithmetic average roughness Ra of the aluminum base plate 11 is within a specific range (0.3 μm or more and 0.5 μm or less) and the average film thickness of the resin film 12 is within a specific range (0.05 μm or more and 1.0 μm or less). However, even if it is a necessary condition for satisfying the condition that the resistance value is 10Ω or less, it is not a sufficient condition. Even if these conditions are satisfied, the resistance value may not be 10Ω or less. For example, when the arithmetic average roughness Ra of the aluminum base plate 11 is near the lower limit and the average film thickness of the resin film 12 is near the upper limit, the unevenness of the aluminum base plate 11 is small and the film thickness is large. It is easy to become.
Therefore, the present invention requires that the resistance value measured by a specific method described later is 10Ω or less.

具体例としては、特開2004−68042号公報の比較例C3は、表面粗さ0.4μmのアルミニウム合金板を使用し、塗料を0.62μm塗布している例が記載されている。
これはアルミニウム素板11の表面粗さRa、塗膜の塗布量(平均膜厚)ともに本発明の要件を満たすものであるが、抵抗値は23Ωとなっており本発明の要件を満たしていない。測定方法の違いの影響も考慮しておく必要があるが、この比較例C3では、抵抗値を測定する際の荷重が100gであり、本願の0.4N(≒40gf)より強い力で電極を試験片に押し当てているため、測定方法からすれば本発明で規定されている方法よりも低い抵抗値が測定されるはずであるが、本発明の要件を満たさない高い抵抗値しか得られない結果が開示されている。
この例からもわかるように、アルミニウム素板11の算術平均粗さRaの範囲内(0.3μm以上0.5μm以下)および樹脂皮膜12の平均膜厚の範囲内(0.15μm以上1.0μm以下)に規定することは、後記する特定の方法で測定される抵抗値が10Ω以下という要件を満足するための必要条件であっても十分条件ではないため、本発明では後記する特定の方法によって測定した際の抵抗値が10Ω以下という要件を満たすことを確認できたものだけを本発明とみなすこととしている。
As a specific example, Comparative Example C3 of Japanese Patent Application Laid-Open No. 2004-68042 describes an example in which an aluminum alloy plate having a surface roughness of 0.4 μm is used and a coating is applied by 0.62 μm.
This satisfies the requirements of the present invention for both the surface roughness Ra of the aluminum base plate 11 and the coating amount (average film thickness) of the coating film, but the resistance value is 23Ω and does not satisfy the requirements of the present invention. . Although it is necessary to consider the influence of the difference in measurement method, in Comparative Example C3, the load when measuring the resistance value is 100 g, and the electrode is applied with a force stronger than 0.4 N (≈40 gf) of the present application. Since it is pressed against the test piece, the measurement method should measure a lower resistance value than the method specified in the present invention, but only a high resistance value that does not satisfy the requirements of the present invention can be obtained. Results are disclosed.
As can be seen from this example, the arithmetic average roughness Ra of the aluminum base plate 11 is within the range of 0.3 μm to 0.5 μm and the average film thickness of the resin film 12 is 0.15 μm to 1.0 μm. In the present invention, since it is not a sufficient condition even if it is a necessary condition for satisfying the requirement that the resistance value measured by a specific method described below is 10 Ω or less, it is determined by the specific method described later in the present invention. Only those that have been confirmed to satisfy the requirement that the measured resistance value is 10Ω or less are considered as the present invention.

図2は、本発明に係る電子機器用プレコートアルミニウム板の抵抗値を測定する方法を模式的に示す図である。本測定方法は、特許文献4や、特開2005−297290号公報、特開2002−206178号公報などで開示されているものと同一方式、同一条件の測定法である。
本発明における抵抗値の測定方法は、テスター20の一方の端子21を、電子機器用プレコートアルミニウム板の一部の樹脂皮膜をサンドペーパーで研磨して露出させたアルミニウム素板に直接導通接触させ、テスター20の他方の端子22を、先端部が半径10mmの略球形状に形成された真鍮製球状端子23を介して、電子機器用プレコートアルミニウム板の樹脂皮膜の上から測定箇所に0.4N(≒40gf)の荷重にて接触させることにて行う、一点接触方式で測定する。なおテスター20の端子21(球状端子23と反対の端子)については、電子機器用プレコートアルミニウム板のアルミニウム素板に直接接触させないといけないため、サンドペーパー等により樹脂皮膜を研磨除去した部分に直接接触させる。また、端子21および球状端子23の表面にある自然酸化膜も抵抗値の測定値をばらつかせる原因となるため、抵抗値の測定の前に端子21および球状端子23の表面を予めサンドペーパー等で研磨して自然酸化膜を充分に除去しておくことが望ましい。さらに、抵抗値の測定時におけるテスター20の内部抵抗の影響を排除すべく、この抵抗値の測定を行う前に、端子21の先端部と球状端子23の先端部とを接触させた状態でゼロ点補正を行い、その上でテスター20の最も敏感なレンジを使用し、テスター20の表示が安定したときの値を測定値とするのが望ましい。そして、抵抗値の信頼性を充分に確保するために、この抵抗値の測定を、1枚の電子機器用プレコートアルミニウム板につき、ランダムな位置で少なくとも10ヶ所、可能であれば50ヶ所測定し、その平均値を本発明で規定する抵抗値として採用するのが望ましい。
FIG. 2 is a diagram schematically showing a method of measuring the resistance value of the precoated aluminum plate for electronic equipment according to the present invention. This measurement method is a measurement method using the same method and the same conditions as those disclosed in Patent Document 4, Japanese Patent Application Laid-Open No. 2005-297290, Japanese Patent Application Laid-Open No. 2002-206178, and the like.
The resistance value measuring method in the present invention is such that one terminal 21 of the tester 20 is in direct conductive contact with an aluminum base plate exposed by polishing a part of a resin film of a pre-coated aluminum plate for electronic equipment with sandpaper, The other terminal 22 of the tester 20 is passed through a brass spherical terminal 23 whose tip is formed in a substantially spherical shape with a radius of 10 mm from the top of the resin film of the pre-coated aluminum plate for electronic equipment to the measurement location at 0.4 N ( Measured by a one-point contact method performed by contacting with a load of ≈40 gf). Note that the terminal 21 of the tester 20 (the terminal opposite to the spherical terminal 23) must be in direct contact with the aluminum base plate of the pre-coated aluminum plate for electronic equipment, so it is in direct contact with the portion where the resin film is polished and removed with sandpaper or the like. Let Further, since the natural oxide films on the surfaces of the terminal 21 and the spherical terminal 23 also cause variations in the measured resistance value, the surfaces of the terminal 21 and the spherical terminal 23 are previously sandpaper or the like before measuring the resistance value. It is desirable to sufficiently remove the natural oxide film by polishing with. Further, in order to eliminate the influence of the internal resistance of the tester 20 at the time of measuring the resistance value, before the resistance value is measured, the tip of the terminal 21 and the tip of the spherical terminal 23 are brought into contact with each other. It is desirable to perform point correction, use the most sensitive range of the tester 20, and use the value when the display of the tester 20 is stabilized as the measurement value. In order to sufficiently ensure the reliability of the resistance value, the measurement of the resistance value is measured at a random position at least 10 places, preferably 50 places, for one electronic device pre-coated aluminum plate, It is desirable to adopt the average value as the resistance value defined in the present invention.

[下地処理皮膜]
一般的なプレコートアルミニウム板に形成される下地処理皮膜の役割は、樹脂皮膜とアルミニウム素板との密着性を向上させると同時に耐食性を向上させることにある。この目的のために多くの場合、CrまたはZrを含む無機単独皮膜あるいは無機有機複合皮膜が使用される。中でも下地処理皮膜として3価クロム系のりん酸クロメート処理皮膜が使用される場合が多い。しかし、本発明の樹脂皮膜12は前記したように下地処理皮膜が果たす役割を兼ね備えているため、必ずしも下地処理皮膜を設ける必要はない。本発明の目的の一つに、環境にやさしい電子機器用プレコートアルミニウム板10を提供することを掲げているため、特に従来公知のりん酸クロメート処理皮膜、クロム酸クロメート処理皮膜、塗布型クロメート処理皮膜といった、クロムを含有する下地処理皮膜を設けることは許容できない。そのため、樹脂皮膜12とアルミニウム素板11のさらなる密着性の向上および耐食性の向上を図るため下地処理皮膜を形成する場合は、クロムを含有しない下地処理皮膜であればこれを形成することを許容することができる。
[Undercoat film]
The role of the base treatment film formed on a general pre-coated aluminum plate is to improve the corrosion resistance while improving the adhesion between the resin film and the aluminum base plate. For this purpose, an inorganic single film or an inorganic / organic composite film containing Cr or Zr is often used. Of these, a trivalent chromium phosphate chromate-treated film is often used as a base-treated film. However, since the resin film 12 of the present invention has the role of the ground treatment film as described above, it is not always necessary to provide the ground treatment film. One of the objects of the present invention is to provide an environmentally friendly pre-coated aluminum plate 10 for electronic equipment, and in particular, a conventionally known phosphoric acid chromate-treated film, chromate-chromated film, and coating-type chromate-treated film. It is unacceptable to provide a base treatment film containing chromium. Therefore, when a base treatment film is formed in order to further improve the adhesion between the resin film 12 and the aluminum base plate 11 and the corrosion resistance, it is allowed to form the base treatment film if it does not contain chromium. be able to.

クロムを含有しない下地処理皮膜を形成する場合、本発明に係る電子機器用プレコートアルミニウム板10’は、例えば図3に示すような構成となる。
電子機器用プレコートアルミニウム板10’は、図3に示すように、アルミニウム素板11と、このアルミニウム素板11の少なくとも片面に形成された樹脂皮膜12と、アルミニウム素板11と樹脂皮膜12の間にクロムを含有しない下地処理皮膜13が形成される。
In the case of forming a base treatment film not containing chromium, the precoated aluminum plate 10 ′ for electronic equipment according to the present invention has a configuration as shown in FIG. 3, for example.
As shown in FIG. 3, the precoat aluminum plate 10 ′ for electronic equipment includes an aluminum base plate 11, a resin film 12 formed on at least one surface of the aluminum base plate 11, and a space between the aluminum base plate 11 and the resin film 12. Thus, a base treatment film 13 containing no chromium is formed.

このような下地処理皮膜13としては、例えばりん酸ジルコニウム(PZr)処理皮膜やりん酸チタン(PTi)処理皮膜などを挙げることができる。もちろん、かかる下地処理皮膜13には、クロム以外の環境負荷物質、例えばRoHSやWEEEなどで使用が制限されている物質が含まれてはならないことはいうまでもない。   Examples of such a base treatment film 13 include a zirconium phosphate (PZr) treatment film and a titanium phosphate (PTi) treatment film. Of course, it is needless to say that the ground treatment film 13 should not contain environmentally hazardous substances other than chromium, for example, substances whose use is restricted by RoHS or WEEE.

以上に説明した本発明に係る電子機器用プレコートアルミニウム板10は、次のように理解することも可能である。
本発明に係る電子機器用プレコートアルミニウム板10は、中心線平均粗さRaが0.3μm以上0.5μm以下であるアルミニウム素板11の少なくとも片面に樹脂皮膜12が形成された電子機器用プレコートアルミニウム板であって、アルミニウム素板11と樹脂皮膜12の間には下地処理皮膜(図5における耐食性皮膜42が相当する)が形成されておらず、樹脂皮膜12は金属元素を含まず、アクリル樹脂成分、ウレタン樹脂成分、シリカ成分および粒子状の潤滑成分を含み、樹脂皮膜12中に占めるシリカ成分の含有量が12質量%を超え、樹脂皮膜12中に含まれる潤滑成分の含有量が8質量%を超え、樹脂皮膜12の平均膜厚が0.15μm以上1.0μm以下であり、先端部が半径10mmの球状端子23(図2参照)を、樹脂皮膜12を形成したアルミニウム素板11に対して0.4Nの荷重で押し付けたときにおける球状端子23とアルミニウム素板11との間の抵抗値が10Ω以下である(図1参照)。
なお、アルミニウム素板11と樹脂皮膜12の間にクロムを含まない下地処理皮膜13(図4参照)を設けることもできる。
The pre-coated aluminum plate 10 for an electronic device according to the present invention described above can be understood as follows.
The precoated aluminum plate 10 for an electronic device according to the present invention is a precoated aluminum for an electronic device in which a resin film 12 is formed on at least one surface of an aluminum base plate 11 having a center line average roughness Ra of 0.3 μm or more and 0.5 μm or less. A base treatment film (corresponding to the corrosion-resistant film 42 in FIG. 5) is not formed between the aluminum base plate 11 and the resin film 12, and the resin film 12 does not contain a metal element and is an acrylic resin. Component, urethane resin component, silica component, and particulate lubricant component, the silica component content in the resin film 12 exceeds 12 mass%, and the lubricant component content in the resin film 12 is 8 mass% %, The average film thickness of the resin film 12 is 0.15 μm or more and 1.0 μm or less, and the spherical terminal 23 (see FIG. 2) having a radius of 10 mm at the tip portion Resistance of at 10Ω or less between the spherical terminal 23 and the aluminum workpiece 11 at the time when pressed with a load of 0.4N with respect to the aluminum workpieces 11 formed a film 12 (see FIG. 1).
It is also possible to provide a base treatment film 13 (see FIG. 4) that does not contain chromium between the aluminum base plate 11 and the resin film 12.

以上に説明した本発明に係る電子機器用プレコートアルミニウム板10によれば、以下の効果を奏する。
(1)本発明に係る電子機器用プレコートアルミニウム板10によれば、アルミニウム素板11の算術平均粗さRaおよび樹脂皮膜12の平均膜厚を特定の範囲に規定し、樹脂成分、シリカ成分の含有量および潤滑成分の含有量を規定した。これにより、微細な凹凸を有するアルミニウム素板11の凸部が樹脂皮膜12の平均的な高さよりも高く飛び出た形態となり、この凸部を覆う樹脂皮膜12の膜厚は従来技術の塗装下地処理皮膜(耐食性皮膜42(図5参照))とほぼ同程度となり、導電性、耐指紋性および耐疵付き性を従来技術と同程度に維持することができる。特に、樹脂皮膜12の樹脂成分を特定のものに規定することにより、クロムを含有する下地処理皮膜(耐食性皮膜42(図5参照))を形成しなくても優れた耐食性を確保することができる。また、クロムを含有する下地処理皮膜が形成されていないので本発明の電子機器用プレコートアルミニウム板10は、従来技術の電子機器用プレコートアルミニウム板よりも環境にやさしい。
According to the precoat aluminum plate 10 for electronic devices which concerns on this invention demonstrated above, there exist the following effects.
(1) According to the pre-coated aluminum plate 10 for electronic equipment according to the present invention, the arithmetic average roughness Ra of the aluminum base plate 11 and the average film thickness of the resin film 12 are specified within a specific range, and the resin component, silica component The content and the content of lubricating components were defined. Thereby, the convex part of the aluminum base plate 11 having fine irregularities protrudes higher than the average height of the resin film 12, and the film thickness of the resin film 12 covering the convex part is the coating surface treatment of the prior art. The film is almost the same as the film (corrosion-resistant film 42 (see FIG. 5)), and the conductivity, fingerprint resistance, and scratch resistance can be maintained at the same level as in the prior art. In particular, by defining the resin component of the resin film 12 as a specific one, excellent corrosion resistance can be ensured without forming a base treatment film containing chromium (corrosion resistance film 42 (see FIG. 5)). . Moreover, since the base-treatment film | membrane containing chromium is not formed, the precoat aluminum plate 10 for electronic devices of this invention is more environmentally friendly than the precoat aluminum plate for electronic devices of a prior art.

(2)本発明に係る電子機器用プレコートアルミニウム板10によれば、アルミニウム素板11と樹脂皮膜12の間にクロムを含有する下地処理皮膜はもちろん、クロムを含有しない下地処理皮膜を含めて下地処理皮膜はいっさい設けないので、下地処理皮膜を形成する工程と、下地処理皮膜形成に使用する薬剤とを省略することができるため、本発明の電子機器用プレコートアルミニウム板10を製造する設備構成が大幅に簡略化でき、コストダウンできるとともに生産性も高めることができる。 (2) According to the pre-coated aluminum plate 10 for electronic equipment according to the present invention, the base including the base treatment film not containing chromium as well as the base treatment film containing chromium is provided between the aluminum base plate 11 and the resin film 12. Since no treatment film is provided, the step of forming the base treatment film and the chemical used for the formation of the base treatment film can be omitted, so that the equipment configuration for producing the precoated aluminum plate 10 for electronic equipment of the present invention is provided. It can be greatly simplified, cost can be reduced and productivity can be increased.

(3)本発明に係る電子機器用プレコートアルミニウム板10によれば、樹脂皮膜12中に含まれる潤滑成分の粒子径が2.5μm以下となるように構成したので、樹脂皮膜12の膜厚が前記した範囲の内の下限付近となった場合であっても、潤滑成分を脱落し難くすることができるため、高い導電性を維持しつつ一層高い潤滑性を確保することができる。 (3) According to the precoated aluminum plate 10 for electronic equipment according to the present invention, since the particle diameter of the lubricating component contained in the resin film 12 is 2.5 μm or less, the film thickness of the resin film 12 is Even when it is near the lower limit of the above-described range, it is possible to make it difficult for the lubricating component to fall off, so it is possible to ensure higher lubricity while maintaining high conductivity.

(4)本発明に係る電子機器用プレコートアルミニウム板10によれば、樹脂皮膜12は、平均粒子径が0.3μm以上15μm以下の光学特性調整微粒子を1質量%以上30質量%以下含んでいるので、表面の光学特性がさらに最適化されて耐指紋性を一層向上させることができる。 (4) According to the precoated aluminum plate 10 for electronic equipment according to the present invention, the resin film 12 contains 1% by mass to 30% by mass of optical property adjusting fine particles having an average particle size of 0.3 μm to 15 μm. Therefore, the optical characteristics of the surface can be further optimized and the fingerprint resistance can be further improved.

(5)本発明に係る電子機器用プレコートアルミニウム板10によれば、プレコートアルミニウム板に使用するアルミニウム素板11には、アルミニウム素板11に含まれる合金用添加元素としてのクロム含有量を0.1質量%未満としたので、より一層環境にやさしいものとすることができる。 (5) According to the precoat aluminum plate 10 for electronic equipment according to the present invention, the aluminum base plate 11 used for the precoat aluminum plate has a chromium content of 0.001 as an additive element for alloy contained in the aluminum base plate 11. Since it is less than 1% by mass, it can be made more environmentally friendly.

本発明に係る電子機器用プレコートアルミニウム板10は、光ディスクドライブ装置のケースおよびシャーシ、液晶パネルの固定用フレームおよび背面カバーといった各種の電子機器のケースや構造部材に好適に使用することができる。
さらに、本発明に係る電子機器用プレコートアルミニウム板10は、優れた潤滑性を有しているため、成形性に優れており、電子機器用成形品を製造する工程でプレス成形における品質不良の発生率を低減化し、製品の歩留まりを向上させることができる。これにより、本発明は、電子機器用成形品の全体的なコストを低減することができ、その結果、電子機器製品のコストダウンに大きく寄与するものである。
The precoat aluminum plate 10 for an electronic device according to the present invention can be suitably used for various electronic device cases and structural members such as a case and chassis of an optical disk drive device, a fixing frame for a liquid crystal panel, and a back cover.
Furthermore, since the precoated aluminum plate 10 for electronic equipment according to the present invention has excellent lubricity, it is excellent in formability, and quality defects occur in press molding in the process of producing a molded article for electronic equipment. The rate can be reduced and the product yield can be improved. Thereby, this invention can reduce the whole cost of the molded article for electronic devices, As a result, it contributes greatly to the cost reduction of electronic device products.

次に、本発明で規定する要件を満たす実施例と要件を満たさない比較例とを対比して、本発明に係る電子機器用プレコートアルミニウム板についてより具体的に説明する。   Next, the precoated aluminum plate for electronic devices according to the present invention will be described more specifically by comparing an example that satisfies the requirements defined in the present invention with a comparative example that does not satisfy the requirements.

実施例1〜23および比較例1〜14のプレコートアルミニウム板を次のようにして作製した。
まず、JISH4000に規定されているA5182の組成を有するアルミニウム地金を溶解し、合金成分を調整した後、鋳造により圧延用のスラブを製作した。スラブ表面の偏析層を面削し、均質化処理の工程を経た後、熱間圧延、冷間圧延および熱処理の各工程を経て、アルミニウム素板(板厚:0.5mm、合金種:A5182−H34)を作製した。なお、前記冷間圧延の最終(仕上げ)工程では、圧延ロールの表面粗さを適宜に変更することにより、表1および表2に示す各種の表面粗さ(算術平均粗さ)を有するアルミニウム素板を製造した。
Precoated aluminum plates of Examples 1 to 23 and Comparative Examples 1 to 14 were produced as follows.
First, an aluminum ingot having a composition of A5182 defined in JISH4000 was melted and the alloy components were adjusted, and then a slab for rolling was manufactured by casting. The segregation layer on the surface of the slab is chamfered and subjected to a homogenization process, followed by a hot rolling process, a cold rolling process, and a heat treatment process to obtain an aluminum base plate (plate thickness: 0.5 mm, alloy type: A5182- H34) was produced. In the final (finishing) step of the cold rolling, an aluminum element having various surface roughnesses (arithmetic average roughness) shown in Tables 1 and 2 by appropriately changing the surface roughness of the rolling rolls. A board was produced.

その後、製造したアルミニウム素板を市販のアルミニウム用弱アルカリ性脱脂液を使用して脱脂し、塗装前処理とした。次いで、表1および表2に示すように、塗装下地として実施例4にはりん酸ジルコニウム(PZr)を用いた下地処理を行い、実施例5にはりん酸チタン(PTi)を用いた下地処理を行い、比較例3、4にはりん酸クロメート(PCr)を用いた下地処理を行ったが、実施例1〜3、6〜23、比較例1、2、5〜14については、通常、プレコートアルミニウム板の塗装下地として使用されるりん酸クロメートなどの下地処理は行わなかった。なお、比較例4は、特許文献4(特許第4237975号公報)の実施例相当品である。   Then, the manufactured aluminum base plate was degreased using the commercially available weak alkaline degreasing liquid for aluminum, and it was set as the coating pretreatment. Next, as shown in Tables 1 and 2, the base treatment using zirconium phosphate (PZr) was performed in Example 4 as the coating base, and the base treatment using titanium phosphate (PTi) was used in Example 5. In Comparative Examples 3 and 4, the base treatment using phosphoric acid chromate (PCr) was performed, but for Examples 1 to 3 and 6 to 23 and Comparative Examples 1, 2 and 5 to 14, normally, No pretreatment such as phosphoric acid chromate used as a precoating aluminum plate was applied. In addition, the comparative example 4 is an Example equivalent product of patent document 4 (patent 4237975 gazette).

次いで、これらのアルミニウム素板の表面に、表1および表2に示す樹脂成分、シリカ成分の含有量(質量%)、潤滑成分の含有量(質量%)、潤滑成分の粒子径(μm)、光学特性調整微粒子の種類、光学特性調整微粒子の粒子径(μm)、光学特性調整微粒子量(質量%)を有する皮膜形成用薬をロールコート法によって塗布し、加熱温度230℃で30秒間焼付けすることで表1および表2に示す平均膜厚(μm)を有する樹脂皮膜を形成し、実施例1〜23および比較例1〜14の電子機器用プレコートアルミニウム板とした(以下、単に「実施例1」、「比較例1」などと記載する。)。   Next, on the surfaces of these aluminum base plates, the resin components shown in Table 1 and Table 2, the content of silica components (% by mass), the content of lubricating components (% by mass), the particle size (μm) of the lubricating components, A film-forming agent having the kind of optical property adjusting fine particles, the particle size (μm) of the optical property adjusting fine particles, and the amount (% by mass) of the optical property adjusting fine particles is applied by a roll coat method and baked at a heating temperature of 230 ° C. for 30 seconds. Thus, a resin film having an average film thickness (μm) shown in Table 1 and Table 2 was formed and used as precoated aluminum plates for electronic devices of Examples 1 to 23 and Comparative Examples 1 to 14 (hereinafter simply referred to as “Examples”). 1 ”,“ Comparative Example 1 ”, etc.).

Figure 2011173277
Figure 2011173277

Figure 2011173277
Figure 2011173277

実施例1〜23および比較例1〜14の潤滑成分としてポリエチレンワックスを用いた。
また、表1および表2の樹脂成分において、Aはアクリル樹脂、Uはウレタン樹脂、Pはポリエステル樹脂、Eはエポキシ樹脂を表し、括弧書きで示した数値は組成比率を表す。
また、表1の光学特性調整粒子の種類において、Aはアクリル樹脂微粒子、Pはポリエチレン樹脂微粒子(ポリオレフィン系)、Gはガラス微粒子を表す。
Polyethylene wax was used as a lubricating component in Examples 1 to 23 and Comparative Examples 1 to 14.
Moreover, in the resin component of Table 1 and Table 2, A represents an acrylic resin, U represents a urethane resin, P represents a polyester resin, E represents an epoxy resin, and numerical values shown in parentheses represent a composition ratio.
In the types of optical property adjusting particles in Table 1, A represents acrylic resin fine particles, P represents polyethylene resin fine particles (polyolefin type), and G represents glass fine particles.

なお、アルミニウム素板の表面粗さ(算術平均粗さRa)は、表面粗さ測定機(小坂研究所社製、サーフコーダSE−30D)を用いてアルミニウム素板の圧延方向に直角な方向に走査し、算術平均粗さRa(JIS B0601)を求めることにより測定した。
また、製造した実施例1〜23および比較例1〜14について、導電性(抵抗値(Ω))、潤滑性(摩擦係数)、耐指紋性(色差(ΔE))、耐疵付き性、耐食性(レイティングナンバ(RT No.))を評価した。これらは以下のようにして測定して評価した。
In addition, the surface roughness (arithmetic average roughness Ra) of the aluminum base plate is in a direction perpendicular to the rolling direction of the aluminum base plate using a surface roughness measuring machine (Surfcoder SE-30D, manufactured by Kosaka Laboratory Ltd.). The measurement was performed by scanning and calculating the arithmetic average roughness Ra (JIS B0601).
Moreover, about the manufactured Examples 1-23 and Comparative Examples 1-14, electroconductivity (resistance value (ohm)), lubricity (friction coefficient), fingerprint resistance (color difference ((DELTA) E)), wrinkle resistance, corrosion resistance (Rating number (RT No.)) was evaluated. These were measured and evaluated as follows.

<導電性>
導電性は、テスター20としてLCRメーター(HEWLETT PACKARD社製4263B)を用いて、図2に示すように、テスター20の一方の端子21を、電子機器用プレコートアルミニウム板の一部の樹脂皮膜をサンドペーパーで研磨して露出させたアルミニウム素板に直接導通接触させ、テスター20の他方の端子22を、球状端子23(この球状端子23は、先端部の半径が10mmである略球形状に形成された真鍮製の測定棒である。)を介して電子機器用プレコートアルミニウム板の樹脂皮膜の上から測定箇所に0.4N(≒40gf)の荷重にて接触させ、通電させることで測定した。なお、測定の際には、端子21および球状端子23の表面を予めサンドペーパーで研磨し、端子21の先端部と球状端子23の先端部とを接触させた状態でゼロ点補正を行った。かかる測定を、球状端子23の位置をランダムに50ヶ所変えながら測定して平均値を算出し、抵抗値の平均値が10Ω以下を合格、10Ωを超えると不合格とした。
<Conductivity>
As for conductivity, an LCR meter (4263B manufactured by HEWLETT PACKARD) is used as the tester 20, and as shown in FIG. 2, one terminal 21 of the tester 20 is sanded with a part of the resin film of the pre-coated aluminum plate for electronic equipment. The aluminum base plate exposed by polishing with paper is brought into direct conductive contact, and the other terminal 22 of the tester 20 is formed into a spherical terminal 23 (this spherical terminal 23 is formed in a substantially spherical shape with a tip portion having a radius of 10 mm. The measurement point was measured by applying a current of 0.4 N (≈40 gf) from the top of the resin film of the precoated aluminum plate for electronic equipment to the measurement location via a measuring rod made of brass. In the measurement, the surfaces of the terminal 21 and the spherical terminal 23 were previously polished with sandpaper, and zero point correction was performed in a state where the tip portion of the terminal 21 and the tip portion of the spherical terminal 23 were in contact with each other. This measurement was performed while randomly changing the position of the spherical terminal 23 to calculate an average value. When the average resistance value passed 10Ω or less, it exceeded 10Ω.

<潤滑性>
潤滑性は、バウデンレーベン法(鋼球φ16分の3インチ(4.7625mm)、荷重2N(200gf)、すべり速度200mm/min)により、各電子機器用プレコートアルミニウム板の表面でランダムに選んだ3ヶ所の摩擦係数を測定し、その平均値を算出した。
摩擦係数の平均値が0.2以下であれば、各種の電子機器で通常行われる成形加工では特に問題がなく、0.1以下であれば特に良いと評価することができるので、これらを合格とし、0.2を超える場合を不合格とした。
<Lubricity>
The lubricity was randomly selected on the surface of each pre-coated aluminum plate for electronic equipment by the Bowden-Leben method (steel ball φ3 / 16 inch (4.7625 mm), load 2N (200 gf), sliding speed 200 mm / min). The friction coefficient at three locations was measured and the average value was calculated.
If the average value of the friction coefficient is 0.2 or less, there is no particular problem in the molding usually performed in various electronic devices, and if it is 0.1 or less, it can be evaluated that it is particularly good. And the case of exceeding 0.2 was regarded as rejected.

<耐指紋性>
耐指紋性は、実施例1〜23および比較例1〜14の表面を素手で触ることにより指紋が付着する前後の色差(ΔE)を、コニカミノルタ社製分光測色計(CM−600d)を使用して測定した。
色差△E値が0.5以下であれば、表面に付着した指紋を肉眼で殆ど確認することができなかったので合格とし、0.5を超えると表面に付着した指紋を肉眼で確認することができたので不合格とした。
<Fingerprint resistance>
For fingerprint resistance, the color difference (ΔE) before and after the fingerprint adheres by touching the surfaces of Examples 1 to 23 and Comparative Examples 1 to 14 with a spectrocolorimeter (CM-600d) manufactured by Konica Minolta. Measured using.
If the color difference ΔE value is 0.5 or less, the fingerprint attached to the surface could hardly be confirmed with the naked eye, so it was accepted, and if it exceeded 0.5, the fingerprint attached to the surface was confirmed with the naked eye. Was rejected.

<耐疵付き性>
耐疵付き性は、剪断曲げ試験法により評価した。すなわち、図4に示すように、上金型31と下金型32により実施例1〜23および比較例1〜14の試験片を挟持し、試験片の樹脂皮膜を形成した面をポンチ33が摺動するようにして曲げ加工を行うことで、プレスによる成形加工時に発生する加工疵の再現を試みた。下金型32とポンチ33との間に生じる間隔(金型間隔)は、用いた試験片の板厚に10%のクリアランスを加算した間隔とした。
曲げ加工を行った試験片の摺動面を目視観察し、各試験片に対する曲げ加工疵の度合いによって0点(劣)〜5点(優)の点数を付けて数値化し、耐疵付き性の評価を行った。同じ実験を5回行い、その平均値が2点以上の点数のついたものを合格とし、平均値が2点未満のものを不合格とした。
<Wear resistance>
The scratch resistance was evaluated by a shear bending test method. That is, as shown in FIG. 4, the test piece of Examples 1-23 and Comparative Examples 1-14 is pinched | interposed with the upper metal mold | die 31 and the lower metal mold | die 32, and the punch 33 has the surface which formed the resin film of the test piece. We tried to reproduce the wrinkles that occur during the molding process by pressing by bending so as to slide. The interval (die interval) generated between the lower die 32 and the punch 33 was an interval obtained by adding 10% clearance to the plate thickness of the test piece used.
The sliding surface of the bent test piece is visually observed, and it is digitized by assigning a score of 0 (inferior) to 5 (excellent) depending on the degree of bending flaw on each test piece. Evaluation was performed. The same experiment was performed 5 times, and those having an average value of 2 or more points were accepted, and those having an average value less than 2 were rejected.

<耐食性>
耐食性は、JISZ2271に規定された中性塩水噴霧試験に準じて試験を行い、評価した。すなわち、ストレッチ試験サンプルに噴霧する噴霧液として5質量%の塩化ナトリウム水溶液を用い、噴霧環境温度は35℃、噴霧量は面積80cm2で1時間毎に1.5ミリリットルとした。また試験時間は最大100時間とした。
腐食面積率によって腐食の程度を定量化するレイティングナンバ法に準拠して、試験を行ったストレッチ試験サンプルに生じた腐食の数値化を行ない、レイティングナンバ(RT No.)が9.0以上のものを合格とし、レイティングナンバが9.0を下回るものは不合格とした。
<Corrosion resistance>
Corrosion resistance was evaluated by conducting a test according to the neutral salt spray test defined in JISZ2271. That is, a 5 mass% sodium chloride aqueous solution was used as a spray liquid sprayed on the stretch test sample, the spray environment temperature was 35 ° C., the spray amount was 80 cm 2 , and the amount was 1.5 ml per hour. The maximum test time was 100 hours.
Corresponding to the rating number method that quantifies the degree of corrosion based on the corrosion area ratio, the corrosion that occurred in the stretched test sample was quantified, and the rating number (RT No.) is 9.0 or more And those with a rating number below 9.0 were rejected.

これらの評価結果を表3および表4に示す。   These evaluation results are shown in Tables 3 and 4.

Figure 2011173277
Figure 2011173277

Figure 2011173277
Figure 2011173277

(結果)
表1〜4に示される内容から、以下のことが明らかになった。
(アルミニウム素板の表面粗さ(算術平均粗さRa)の影響)
比較例1は、算術平均粗さRaが本発明で規定する範囲の下限値未満であるため、耐指紋性、耐疵付き性が合格基準を満たさない結果となった。また、比較例2は、算術平均粗さRaが本発明で規制する上限値を超えているため、潤滑性、耐疵付き性および耐食性が合格基準を満たさない結果となった。
(result)
From the contents shown in Tables 1 to 4, the following became clear.
(Influence of surface roughness of aluminum base plate (arithmetic mean roughness Ra))
In Comparative Example 1, the arithmetic average roughness Ra was less than the lower limit value of the range defined in the present invention, so that the fingerprint resistance and wrinkle resistance did not satisfy the acceptance criteria. In Comparative Example 2, the arithmetic average roughness Ra exceeded the upper limit value regulated by the present invention, so that the lubricity, scratch resistance and corrosion resistance did not satisfy the acceptance criteria.

(樹脂皮膜の平均膜厚の影響)
比較例5は、樹脂皮膜の平均膜厚が本発明で規定する範囲の下限値未満であるため、耐指紋性、耐疵付き性および耐食性が合格基準を満たさない結果となった。また、比較例6は、樹脂皮膜の平均膜厚が本発明で規定する範囲の上限値を超えているため、抵抗値が合格基準を満たさない結果となった。
(Influence of average film thickness of resin film)
In Comparative Example 5, since the average film thickness of the resin film was less than the lower limit of the range defined in the present invention, the fingerprint resistance, wrinkle resistance and corrosion resistance did not satisfy the acceptance criteria. Moreover, since the average film thickness of the resin film exceeded the upper limit of the range prescribed | regulated by this invention, the comparative example 6 resulted in a resistance value not satisfy | filling an acceptance | permission standard.

(樹脂皮膜の樹脂成分の影響)
比較例7は、アクリル樹脂のみを使用しているため、比較例8は、ウレタン樹脂のみを使用しているため、比較例9は、ポリエステル樹脂のみを使用しているため、および比較例10は、エポキシ樹脂のみを使用しているため、いずれも耐食性が合格基準を満たさない結果となった。また、比較例8については、ウレタン樹脂のみを使用しているため、耐疵付き性も合格基準を満たさない結果となった。
(Influence of resin component of resin film)
Since Comparative Example 7 uses only acrylic resin, Comparative Example 8 uses only urethane resin, Comparative Example 9 uses only polyester resin, and Comparative Example 10 Since only the epoxy resin was used, the corrosion resistance did not satisfy the acceptance criteria. Moreover, about the comparative example 8, since only the urethane resin was used, the result which does not satisfy an acceptance standard also with respect to a rust resistance.

なお、樹脂成分としてアクリル樹脂成分とウレタン樹脂成分を併用した実施例1と、実施例18〜23とについて、アクリル樹脂成分とウレタン樹脂成分の比率と耐食性の結果を比較した。その結果、質量比で、アクリル樹脂成分:ウレタン樹脂成分が5:95の実施例23およびアクリル樹脂成分:ウレタン樹脂成分が95:5の実施例1は、レイティングナンバが9であったが、アクリル樹脂成分:ウレタン樹脂成分が10:90の実施例22、アクリル樹脂成分:ウレタン樹脂成分が15:85の実施例21およびアクリル樹脂成分:ウレタン樹脂成分が90:10の実施例18は、レイティングナンバが9.3で望ましい結果となっており、さらにアクリル樹脂成分:ウレタン樹脂成分が50:50の実施例20およびアクリル樹脂成分:ウレタン樹脂成分=85:15の実施例19は、レイティングナンバが9.5とさらに望ましい結果となった。   In addition, about the Example 1 which used the acrylic resin component and the urethane resin component together as a resin component, and the Examples 18-23, the ratio of an acrylic resin component and a urethane resin component, and the corrosion resistance result were compared. As a result, in Example 23 where the acrylic resin component: urethane resin component was 5:95 and the acrylic resin component: urethane resin component was 95: 5 in Example 1, the rating number was 9, Resin component: Example 22 with 10:90 urethane resin component, Example 21 with acrylic resin component: 15:85 urethane resin component, and Example 18 with acrylic resin component: 90:10 urethane resin component are rated numbers In Example 20 in which the acrylic resin component: urethane resin component was 50:50 and in Example 19 in which the acrylic resin component: urethane resin component = 85: 15, the rating number was 9 More desirable result with .5.

(樹脂皮膜のシリカ成分の含有量の影響)
比較例11、12は、シリカ成分の含有量が本発明で規定する範囲の下限値未満であるため、耐食性が合格基準を満たさない結果となった。
(Influence of silica content of resin film)
In Comparative Examples 11 and 12, since the content of the silica component was less than the lower limit value of the range defined in the present invention, the corrosion resistance did not satisfy the acceptance criteria.

(樹脂皮膜の潤滑成分の含有量の影響)
比較例13は、潤滑成分の含有量が本発明で規定する範囲の下限値未満であるため、潤滑性が合格基準を満たさない結果となった。
(Influence of the content of the lubricating component of the resin film)
In Comparative Example 13, since the content of the lubricating component was less than the lower limit value of the range defined in the present invention, the lubricity did not satisfy the acceptance criteria.

一方、アルミニウム素板の表面粗さ(算術平均粗さRa)、平均膜厚、樹脂皮膜中の樹脂成分、シリカ成分の含有量、潤滑成分の含有量がいずれも本発明で規定する範囲を満たしている実施例1〜17では、導電性、潤滑性、耐指紋性、耐疵付き性および耐食性の全てにおいて全く問題がない結果となった。   On the other hand, the surface roughness (arithmetic average roughness Ra), the average film thickness, the resin component in the resin film, the content of the silica component, and the content of the lubricating component all satisfy the range defined in the present invention. In Examples 1 to 17, there were no problems in all of the conductivity, lubricity, fingerprint resistance, scratch resistance and corrosion resistance.

なお、比較例14については、アルミニウム素板の表面粗さ(算術平均粗さRa)、平均膜厚、樹脂皮膜中の樹脂成分、シリカ成分の含有量、潤滑成分の含有量がいずれも本発明で規定する範囲を満たしているにもかかわらず、導電性だけは本発明の合格基準を満たしていなかった。これは、算術平均粗さRaが下限付近であり、平均膜厚が上限付近であるためにこのような結果になったと考えられる。よって、本発明で規定する各種パラメータは導電性を確保する上で必要条件ではあっても、十分条件ではないということができるため、本発明の所望する効果、すなわち、導電性、潤滑性、耐指紋性、耐疵付き性および耐食性に優れるという効果を確実に奏するため、特定の方法で測定した抵抗値が10Ω以下となることを規定する必要がある。   For Comparative Example 14, the surface roughness (arithmetic average roughness Ra), average film thickness, resin component in the resin film, content of the silica component, and content of the lubricating component are all included in the present invention. However, only the electrical conductivity did not satisfy the acceptance criteria of the present invention. This is probably because the arithmetic average roughness Ra is near the lower limit and the average film thickness is near the upper limit. Therefore, although the various parameters defined in the present invention are necessary conditions to ensure conductivity, it can be said that they are not sufficient conditions. Therefore, the desired effects of the present invention, that is, conductivity, lubricity, resistance to resistance. In order to surely exhibit the effect of excellent fingerprint property, scratch resistance and corrosion resistance, it is necessary to specify that the resistance value measured by a specific method is 10Ω or less.

比較例3、4は、得られる効果の面では本発明の合格基準をすべて満たしているが、下地処理皮膜にクロムを含むものであるため、本発明の趣旨から本発明の基準を満たさない比較例と位置づけられる。   Comparative Examples 3 and 4 satisfy all of the acceptance criteria of the present invention in terms of the effect to be obtained, but since the ground treatment film contains chromium, the comparative examples that do not satisfy the criteria of the present invention are included in the meaning of the present invention. Positioned.

以上、発明の詳細な説明により本発明に係る電子機器用プレコートアルミニウム板について説明したが、本発明の趣旨は前記した内容に限定されるものではなく、本発明の技術的思想に基づく範囲において適宜変更することが可能であり、当然にそのような範囲も本発明の技術的思想に含まれると解釈すべきである。   As described above, the pre-coated aluminum plate for electronic equipment according to the present invention has been described by the detailed description of the invention. However, the gist of the present invention is not limited to the above-described contents, and is appropriately within the scope based on the technical idea of the present invention. It should be understood that such a range is included in the technical idea of the present invention.

10,10’ 電子機器用プレコートアルミニウム板
11 アルミニウム素板
12 樹脂皮膜
13 クロムを含有しない下地処理皮膜
10, 10 'Pre-coated aluminum plate for electronic equipment 11 Aluminum base plate 12 Resin coating 13 Base treatment coating containing no chromium

Claims (5)

算術平均粗さRaが0.3μm以上0.5μm以下であるアルミニウム素板の少なくとも片面に、クロムを含有する下地処理皮膜を設けることなく樹脂皮膜が形成された電子機器用プレコートアルミニウム板であって、
前記樹脂皮膜は金属元素を含まず、アクリル樹脂成分、ウレタン樹脂成分、シリカ成分および粒子状の潤滑成分を含み、
前記樹脂皮膜中に占める前記シリカ成分の含有量が12質量%を超え、
前記樹脂皮膜中に含まれる前記潤滑成分の含有量が8質量%を超え、
前記樹脂皮膜の平均膜厚が0.15μm以上1.0μm以下であり、
先端部が半径10mmの球状端子を、前記樹脂皮膜を形成した前記アルミニウム素板に対して0.4Nの荷重で押し付けたときにおける前記球状端子と前記アルミニウム素板との間の抵抗値が10Ω以下である
ことを特徴とする電子機器用プレコートアルミニウム板。
A pre-coated aluminum plate for electronic equipment in which a resin film is formed on at least one surface of an aluminum base plate having an arithmetic average roughness Ra of 0.3 μm or more and 0.5 μm or less without providing a base treatment film containing chromium. ,
The resin film does not include a metal element, and includes an acrylic resin component, a urethane resin component, a silica component, and a particulate lubricating component,
The content of the silica component in the resin film exceeds 12% by mass,
The content of the lubricating component contained in the resin film exceeds 8% by mass,
The average film thickness of the resin film is 0.15 μm or more and 1.0 μm or less,
The resistance value between the spherical terminal and the aluminum base plate when a spherical terminal having a radius of 10 mm is pressed with a load of 0.4 N against the aluminum base plate on which the resin film is formed is 10Ω or less. A precoated aluminum plate for electronic equipment, which is characterized in that
前記アルミニウム素板と前記樹脂皮膜の間に下地処理皮膜をいっさい設けないことを特徴とする請求項1に記載の電子機器用プレコートアルミニウム板。   2. The precoated aluminum plate for electronic equipment according to claim 1, wherein no base treatment film is provided between the aluminum base plate and the resin film. 前記樹脂皮膜中に含まれる前記潤滑成分の粒子径が2.5μm以下であることを特徴とする請求項1または請求項2に記載の電子機器用プレコートアルミニウム板。   3. The precoated aluminum plate for electronic equipment according to claim 1, wherein a particle diameter of the lubricating component contained in the resin film is 2.5 μm or less. 前記樹脂皮膜は、さらに平均粒子径が0.3μm以上15μm以下の光学特性調整微粒子を1質量%以上30質量%以下含むことを特徴とする請求項1乃至請求項3のいずれか1項に記載の電子機器用プレコートアルミニウム板。   4. The resin film according to claim 1, further comprising 1% by mass or more and 30% by mass or less of optical property adjusting fine particles having an average particle size of 0.3 μm or more and 15 μm or less. Pre-coated aluminum plate for electronic equipment. 前記アルミニウム素板に含まれる合金用添加元素としてのクロム含有量が0.1質量%未満であることを特徴とする請求項1乃至請求項4のいずれか1項に記載の電子機器用プレコートアルミニウム板。   5. The precoated aluminum for an electronic device according to claim 1, wherein a chromium content as an additive element for the alloy contained in the aluminum base plate is less than 0.1% by mass. Board.
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