JP2011171684A5 - - Google Patents

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Publication number
JP2011171684A5
JP2011171684A5 JP2010036665A JP2010036665A JP2011171684A5 JP 2011171684 A5 JP2011171684 A5 JP 2011171684A5 JP 2010036665 A JP2010036665 A JP 2010036665A JP 2010036665 A JP2010036665 A JP 2010036665A JP 2011171684 A5 JP2011171684 A5 JP 2011171684A5
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JP
Japan
Prior art keywords
substrate
transfer arm
unit
chamber
processing apparatus
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JP2010036665A
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English (en)
Japanese (ja)
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JP5724182B2 (ja
JP2011171684A (ja
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Priority to JP2010036665A priority Critical patent/JP5724182B2/ja
Priority claimed from JP2010036665A external-priority patent/JP5724182B2/ja
Publication of JP2011171684A publication Critical patent/JP2011171684A/ja
Publication of JP2011171684A5 publication Critical patent/JP2011171684A5/ja
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Publication of JP5724182B2 publication Critical patent/JP5724182B2/ja
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JP2010036665A 2010-02-22 2010-02-22 基板処理装置および積層半導体装置製造方法 Active JP5724182B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010036665A JP5724182B2 (ja) 2010-02-22 2010-02-22 基板処理装置および積層半導体装置製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010036665A JP5724182B2 (ja) 2010-02-22 2010-02-22 基板処理装置および積層半導体装置製造方法

Publications (3)

Publication Number Publication Date
JP2011171684A JP2011171684A (ja) 2011-09-01
JP2011171684A5 true JP2011171684A5 (fr) 2013-12-26
JP5724182B2 JP5724182B2 (ja) 2015-05-27

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ID=44685450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010036665A Active JP5724182B2 (ja) 2010-02-22 2010-02-22 基板処理装置および積層半導体装置製造方法

Country Status (1)

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JP (1) JP5724182B2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116864415A (zh) * 2023-07-07 2023-10-10 北京屹唐半导体科技股份有限公司 工艺平台

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003289095A (ja) * 2002-03-28 2003-10-10 Hitachi Kokusai Electric Inc 半導体製造装置
JP2006351883A (ja) * 2005-06-16 2006-12-28 Tokyo Electron Ltd 基板搬送機構及び処理システム
JP4961895B2 (ja) * 2006-08-25 2012-06-27 東京エレクトロン株式会社 ウェハ搬送装置、ウェハ搬送方法及び記憶媒体
JP5417751B2 (ja) * 2008-06-30 2014-02-19 株式会社ニコン 接合装置および接合方法

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