JP2011165720A - 電子機器 - Google Patents
電子機器 Download PDFInfo
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- JP2011165720A JP2011165720A JP2010023591A JP2010023591A JP2011165720A JP 2011165720 A JP2011165720 A JP 2011165720A JP 2010023591 A JP2010023591 A JP 2010023591A JP 2010023591 A JP2010023591 A JP 2010023591A JP 2011165720 A JP2011165720 A JP 2011165720A
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- semiconductor element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
- H01L2224/85207—Thermosonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
Abstract
【解決手段】半導体素子10と、半導体素子10と配線によって接続される、半導体素子10を接地する接地台14と、を含み、接地台14の高さが、半導体素子10と接地台14とを接続する配線の長さの値と閾値との差が所定の範囲内に収まる高さである。
【選択図】図2
Description
以下、本発明の一実施形態について図面に基づき詳細に説明する。
図3は、第2の実施形態に係る光パッケージ1の内部構造の一例を概念的に示す概念図である。図4は、図3に示す光パッケージ1に含まれる、半導体素子10と接地台14との位置関係の一例を示す側面図である。
図5は、第3の実施形態に係る光パッケージ1に含まれる、半導体素子10と接地台14との位置関係の一例を示す平面図である。図6は、第3の実施形態に係る光パッケージ1に含まれる、半導体素子10と接地台14との位置関係の一例を示す側面図である。第3の実施形態に係る光パッケージ1の構成は、接地台14の形状を除いては、第1の実施形態に係る光パッケージ1の構成と同様である。
図9は、第4の実施形態に係る光パッケージ1に含まれる、半導体素子10と接地台14との位置関係の一例を示す平面図である。図10は、第4の実施形態に係る光パッケージ1に含まれる、半導体素子10と接地台14との位置関係の一例を示す側面図である。第4の実施形態に係る光パッケージ1の構成は、接地台14の形状を除いては、第2の実施形態に係る光パッケージ1の構成と同様である。
Claims (6)
- 半導体素子と、前記半導体素子と配線によって接続される、前記半導体素子を接地する接地台と、を含み、
前記接地台の高さが、前記半導体素子と前記接地台とを接続する配線の長さの値と閾値との差が所定の範囲内に収まる高さである、
を含むことを特徴とする電子機器。 - 前記接地台に、前記接地台と、当該接地台が配置される面とを接着する接着剤を受け入れる切り欠きが形成されている、
ことを特徴とする請求項1に記載の電子機器。 - 前記接地台が、配線が接続される接続部を複数含み、
前記切り欠きが、前記複数の接続部の間に形成されている、
ことを特徴とする請求項2に記載の電子機器。 - 前記接地台が配置される面と前記接地台とが接触する領域の面積が、前記接地台の配線が接続される面の面積よりも小さい、
ことを特徴とする請求項2に記載の電子機器。 - 前記接地台と、当該接地台が配置される面とを接着する接着剤と、前記半導体素子と、当該半導体素子が配置される面とを接着する接着剤と、が共通する、
ことを特徴とする請求項1から4のいずれか一項に記載の電子機器。 - 光電変換を行う光電変換部をさらに含み、
前記接地台が前記半導体素子と前記光電変換部との間に設けられている、
ことを特徴とする請求項1から5のいずれか一項に記載の電子機器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2010023591A JP5358472B2 (ja) | 2010-02-04 | 2010-02-04 | 電子機器 |
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JP2010023591A JP5358472B2 (ja) | 2010-02-04 | 2010-02-04 | 電子機器 |
Publications (2)
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JP2011165720A true JP2011165720A (ja) | 2011-08-25 |
JP5358472B2 JP5358472B2 (ja) | 2013-12-04 |
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JP2010023591A Active JP5358472B2 (ja) | 2010-02-04 | 2010-02-04 | 電子機器 |
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JP (1) | JP5358472B2 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07142626A (ja) * | 1993-11-12 | 1995-06-02 | Japan Energy Corp | 半導体装置 |
JP2001044235A (ja) * | 1999-08-02 | 2001-02-16 | Hitachi Kokusai Electric Inc | 通信装置 |
JP2003068929A (ja) * | 2001-08-27 | 2003-03-07 | Kyocera Corp | 半導体素子搭載用基板および半導体装置 |
JP2004288735A (ja) * | 2003-03-19 | 2004-10-14 | Kyocera Corp | 半導体装置 |
JP2006253676A (ja) * | 2005-03-08 | 2006-09-21 | Sumitomo Electric Ind Ltd | 光アセンブリ |
-
2010
- 2010-02-04 JP JP2010023591A patent/JP5358472B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07142626A (ja) * | 1993-11-12 | 1995-06-02 | Japan Energy Corp | 半導体装置 |
JP2001044235A (ja) * | 1999-08-02 | 2001-02-16 | Hitachi Kokusai Electric Inc | 通信装置 |
JP2003068929A (ja) * | 2001-08-27 | 2003-03-07 | Kyocera Corp | 半導体素子搭載用基板および半導体装置 |
JP2004288735A (ja) * | 2003-03-19 | 2004-10-14 | Kyocera Corp | 半導体装置 |
JP2006253676A (ja) * | 2005-03-08 | 2006-09-21 | Sumitomo Electric Ind Ltd | 光アセンブリ |
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JP5358472B2 (ja) | 2013-12-04 |
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