JP2011146524A5

JP2011146524A5 -

Info

Publication number: JP2011146524A5
Application number: JP2010006035A
Authority: JP
Filing date: 2010-01-14
Publication date: 2013-10-24
Anticipated expiration: 2030-01-14

Claims

In a lead frame for mounting a semiconductor element,
A die pad having a mounting surface for mounting a semiconductor element;
A lead portion provided around the die pad and having a bonding surface to which the conductive portion is connected;
A lead frame, wherein a mounting surface of a die pad and a bonding surface of a lead part are formed with a flat rounded rectangular anchor groove for preventing the outer resin part from dropping off.

For lead frames with resin,
A lead frame;
An outer resin portion provided on the lead frame,
The lead frame is
A die pad having a mounting surface for mounting a semiconductor element;
A lead portion provided around the die pad and having a bonding surface to which the conductive portion is connected;
A lead frame with resin, wherein a mounting surface of a die pad and a bonding surface of a lead part are formed with anchor grooves having a flat rounded rectangular shape to prevent the outer resin part from dropping off.

In semiconductor devices,
A lead frame having a die pad and a lead portion provided around the die pad;
An outer resin portion provided on the lead frame;
A semiconductor element mounted on a die pad of a lead frame;
A conductive portion that electrically connects the lead portion of the lead frame and the semiconductor element;
A sealing resin portion for sealing the semiconductor element and the conductive portion;
The die pad of the lead frame has a mounting surface on which the semiconductor element is mounted,
The lead portion has a bonding surface to which the conductive portion is connected,
2. A semiconductor device comprising: a mounting surface of a die pad; and a bonding surface of a lead portion, wherein a planar rounded rectangular anchor groove for preventing the outer resin portion from falling off is formed.

In a lead frame on which a semiconductor element is placed,
A die pad having a mounting surface for mounting a semiconductor element;
A lead portion provided around the die pad,
A lead frame, wherein a mounting recess composed of a first recess having a shallow depth and a second recess having a deep depth at the center of the first recess is formed on the mounting surface of the die pad.

The semiconductor element is an LED element, and the side wall of the first recess forms a curved surface from the surface side of the die pad to the second recess side, and this curved surface functions as a reflective surface that reflects light from the LED element. The lead frame according to claim 4 .

The first recess is formed by etching, the lead frame according to claim 4 or 5, wherein the second recess is being formed by a press.

In semiconductor devices,
A lead frame having a die pad and a lead portion provided around the die pad;
A semiconductor element mounted on a die pad of a lead frame;
A conductive portion that electrically connects the lead portion of the lead frame and the semiconductor element;
A sealing resin portion for sealing the semiconductor element and the conductive portion;
The die pad of the lead frame has a mounting surface on which the semiconductor element is mounted,
On the mounting surface of the die pad, a mounting recess composed of a first recess having a shallow depth and a second recess having a deep depth located at the center of the first recess is formed, and the semiconductor element is placed in the mounting recess. A semiconductor device characterized by being mounted.

Semiconductor device, the semiconductor device according to claim 7, characterized in that it is mounted in the second mounting through a mounting material contained in the recess置凹of loading recess.

The semiconductor device comprises an LED element, the external resin portion is provided with a recess surrounding the LED element, the sealing resin portion, claim 7 or 8, characterized in that it is filled into the recess of the external resin portion The semiconductor device described.

The semiconductor element is an LED element, and the side wall of the first recess forms a curved surface from the surface side of the die pad to the second recess side, and this curved surface functions as a reflective surface that reflects light from the LED element. the semiconductor device of any one of claims 7 to 9, wherein the.

The first recess is formed by etching, the semiconductor device of any one of claims 7 to 10 second recess is being formed by a press.

In a lead frame manufacturing method having a die pad having a mounting surface on which a semiconductor element is mounted and a lead portion provided around the die pad
Preparing a metal substrate;
Forming a resist layer for etching on the front and back of the metal substrate,
Etching the front and back of the metal substrate with the etching resist layer as an anticorrosion film to form a die pad and a lead portion, and forming a first recess having a shallow depth on the mounting surface of the die pad;
And a step of forming a second recess having a depth deeper than that of the first recess by pressing at a center of the first recess.

In a method for manufacturing a semiconductor device,
Producing a lead frame by the lead frame producing method according to claim 12 ;
Placing the semiconductor element in the mounting recess of the die pad of the lead frame;
Connecting the semiconductor element and the lead portion by a conductive portion;
A method of manufacturing a semiconductor device, comprising: sealing a semiconductor element and a conductive portion with a sealing resin portion.