JP2011143501A - Grinding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a grinding device which includes a retaining table movement mechanism without a turn table. <P>SOLUTION: In the grinding device, the retaining table 2 having a retaining surface 22a is rotatably supported by a rotation support mechanism 20 and is positioned at a position opposed to a grinding tool by the retaining table movement mechanism 21. The retaining table movement mechanism 21 includes a first permanent magnet on the opposite surface of the retaining surface 22a and a first electro-magnet 212 arranged at a position opposed to the opposite surface of the retaining surface 22a along a movement route of the retaining table 2. The rotation support mechanism 20 includes a second permanent magnet arranged on the outer peripheral surface of the retaining table 2; a retaining table movement restriction part 201 arranged with the second electro-magnet surrounding the outer peripheral surface of the retaining table 2; and a restriction part drive part for selectively positioning the retaining table movement restriction part 201 to a restriction position for obstructing the movement of the retaining table 2 and an allowable position. Rotation and revolution are achieved by supporting the retaining table 2 using magnetic force. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a grinding apparatus that has a holding table that rotates and moves, and that grinds a workpiece held on the holding table.

  Grinding and polishing of semiconductor wafers, such as ICs, LSIs, etc., which are partitioned by a line to be divided and formed on the surface, as well as various ceramic substrates and glass substrates used for resin substrates, electronic components, etc. After the back surface is ground and polished by an apparatus to have a predetermined thickness, it is divided into individual devices by a dicing apparatus or a laser processing apparatus, and each divided device is used in various electronic devices.

  In recent years, these plate-like objects have been increased in size in order to increase the amount of chips taken per work, and in particular, standardization of φ450 mm has been promoted for semiconductor wafers. On the other hand, as a device for grinding and polishing the back surface of these plate-like objects, a grinding and polishing device called a grinder provided with rough grinding means and finish grinding (polishing) means is widely used.

  In the grinding / polishing apparatus, a plurality of holding tables for holding a workpiece are provided on the turntable at equal intervals in the circumferential direction, and the turntable rotates while the workpiece is held on the holding table. By doing so, a series of processing is sequentially performed from rough grinding to finish grinding or polishing by the grinding means or the polishing means arranged to face the turntable (see, for example, Patent Document 1).

JP 2001-284303 A

  However, in the configuration in which the holding table is moved to a predetermined position by rotating the turntable, it is necessary to install wiring and piping for driving the turntable or driving each holding table in the apparatus, and a movable part is also provided. There are many problems that the assembly work is complicated.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a grinding apparatus including a holding table moving mechanism having a structure that is not complicated to assemble and that replaces a turntable. is there.

  The present invention relates to a holding table having a holding surface for holding a workpiece, a rotation support mechanism for rotatably supporting the holding table about a direction perpendicular to the holding surface of the holding table, and a workpiece held on the holding table. And a holding table moving mechanism for positioning the holding table at a position facing the grinding tool of the grinding mechanism. The holding table moving mechanism is disposed on the opposite surface of the holding surface of the holding table. The first permanent magnet arranged and the first electromagnet arranged along the movement path of the holding table at a position facing the opposite surface of the holding surface of the holding table. A holding tape provided with a second permanent magnet arranged on the outer peripheral side of the table and a second electromagnet arranged at a position surrounding the outer peripheral side of the holding table. And a restricting portion that selectively positions the holding table movement restricting portion at a restricting position that prevents movement of the holding table along the moving path and an allowable position that allows movement of the holding table along the moving route. And a drive unit.

  The grinding apparatus preferably includes a liquid supply mechanism that fills a space between the first permanent magnet and the first electromagnet.

  In the present invention, the holding table is supported using magnetic force to achieve rotation (spinning) and revolving movement, so that complicated wiring and piping are not required, and the structure is simpler than a structure using a conventional turntable. can do. In addition, if a liquid supply mechanism that fills the space between the first permanent magnet and the first electromagnet is provided, it is possible to prevent dirt and the like from accumulating between the apparatus main body and the holding table.

It is a perspective view which shows the example of a grinding device. It is a perspective view which shows the holding table supported by the rotation support mechanism and the holding table moving mechanism. It is a top view which shows a holding table. It is a bottom view which shows a holding table. It is a side view which shows a holding table. It is sectional drawing which shows schematically the internal structure of a holding table. It is a top view which shows the base mechanism for the rotation and revolution of a holding table. It is a perspective view which shows a base mechanism and a holding table. FIG. 8 is an end view schematically showing the relationship between the BB cutting line end face of FIG. 7 and the holding table when the holding table movement restricting portion is in the allowable position. FIG. 8 is a schematic end view showing the relationship between the BB cutting line end face of FIG. 7 and the holding table when the holding table movement restricting portion is in the restricting position. FIG. 8 is an end view schematically showing a relationship between an end surface along the line AA in FIG. 7 and a holding table. It is sectional drawing which shows the state which grinds a workpiece | work schematically. It is sectional drawing which shows schematically the state just before conveying the workpiece | work after grinding. It is sectional drawing which shows schematically the state which adsorb | sucks a workpiece | work for conveyance. It is sectional drawing which shows schematically the state with which the space between the 1st permanent magnet and the 1st electromagnet of the lower surface of a holding table was satisfy | filled with water. It is sectional drawing which shows schematically the state with which the space between the 1st permanent magnet and the 1st electromagnet of the lower surface of a holding table was satisfy | filled with the grinding water.

  A grinding apparatus 1 shown in FIG. 1 is an apparatus that grinds a workpiece held by a plurality of (three in the illustrated example) holding table 2 by two grinding mechanisms 3a and 3b. The cassette 40a for storing the plate-shaped workpiece before grinding and the cassette 40b for storing the plate-shaped workpiece after grinding are mounted on the mounting tables 4a and 4b, respectively.

  At a position facing the openings of the cassette 40a and the cassette 40b, a loading / unloading mechanism 5 for carrying out the workpiece from the cassette 40a and loading the workpiece into the cassette 40b is disposed. The carry-in / out mechanism 5 includes a holding unit 50 that holds a workpiece, a rotating unit 51 that rotates the holding unit 50, and a bendable arm unit 52.

  An alignment mechanism 6 that aligns the workpiece at a predetermined position is disposed in the movable range of the holding portion 50 that constitutes the carry-in / out mechanism 5. The alignment mechanism 6 includes a holding unit 60 that sucks a workpiece, a plurality of radially formed long holes 61, and an abutting member 62 that can move through the long holes 61. The workpieces can be aligned at a certain position by moving in the direction in which they approach each other and pushing the peripheral edge of the workpiece placed on the holding unit 60.

  In the vicinity of the alignment mechanism 6, a first conveyance mechanism 7 that conveys the workpiece from the alignment mechanism 6 to one of the three holding tables 2 is disposed. The first transport mechanism 7 includes a suction unit 70 that sucks a workpiece and an arm unit 71 that turns and lifts the suction unit 70.

  A cleaning mechanism 8 that cleans the workpiece after grinding is disposed in the movable range of the holding unit 50 constituting the carry-in / out mechanism 5. The cleaning mechanism 8 includes a holding table 80 that holds a workpiece and can be rotated and raised and lowered, and a nozzle (not shown) that ejects cleaning liquid and air to the rotating workpiece.

  In the vicinity of the cleaning mechanism 8, a second transport mechanism 9 that transports the cleaned workpiece from any one of the holding tables 2 to the holding table 8 of the cleaning mechanism 8 is disposed. The second transport mechanism 9 includes an adsorption unit 90 that adsorbs a workpiece, and an arm unit 91 that turns and lifts the adsorption unit 90.

  Since the grinding mechanisms 3a and 3b have the same structure, they will be described with common reference numerals. The grinding mechanisms 3a and 3b are a grinding tool 30 that acts on the work held by the holding table 2 to perform grinding, a support mount 31 that supports the grinding tool 30, and a support mount 31 that supports the tip of the support mount 31 in the vertical direction. A rotating shaft 32 that extends and a motor 33 that rotates the rotating shaft 32 are provided. The grinding tool 30 includes a base 300 fixed to the support mount 31 and a plurality of grindstones 301 fixed to the lower surface of the base 300. The grindstone 301 constituting the grinding mechanism 3a is for rough grinding, and the grindstone 301 constituting the grinding mechanism 3b is for finish grinding.

  The grinding mechanisms 3a and 3b can be moved up and down by the processing feed mechanisms 10a and 10b. Since the processing feed mechanisms 10a and 10b have the same structure, they will be described with common reference numerals. The processing feed mechanisms 10a and 10b include a ball screw 100 having a vertical axis, a pair of guide rails 101 arranged in parallel to the ball screw 100, a pulse motor 102 that rotates the ball screw 100, a ball A nut (not shown) that is screwed into the screw 100 is provided inside, and a sliding base 103 whose side is in sliding contact with the guide rail 101 is provided. The ball screw 101 is rotated by being driven by the pulse motor 102. Accordingly, the sliding base 103 is guided by the guide rail 101 and moves up and down. Since the support portion 104 fixed to the sliding base 103 supports the grinding mechanisms 3a and 3b, the grinding mechanisms 3a and 3b are also moved up and down as the sliding base 103 moves up and down.

  As shown in FIG. 2, each of the three holding tables 2 is supported by a rotation support mechanism 20 so as to be capable of rotating, and is supported by a holding table moving mechanism 21 so as to be capable of revolving in the direction of an arrow A, for example. .

  As shown in FIG. 3, on the surface side of each holding table 2, a holding portion 22 formed of a porous member such as porous ceramics is provided, and the surface thereof serves as a holding surface 22a. The holding portion 22 is surrounded by a frame body 23, and an elastic seal portion 23a formed of silicon rubber or the like is embedded in the frame body 23 in a ring shape. The rotation support mechanism 20 shown in FIG. 2 supports the holding table 2 so as to be rotatable about a direction perpendicular to the holding surface 22a as a rotation axis. On the other hand, the holding table moving mechanism 21 can position the grinding tool 30 constituting the grinding mechanisms 3a and 3b shown in FIG. 1 at a position facing the holding surface 22a by revolving the holding table 2.

  As shown in FIG. 4, a first permanent magnet 21 a is formed concentrically on the back surface side opposite to the holding surface 22 a of the holding table 2. The first permanent magnet 21a is configured by alternately arranging S poles and N poles. A suction hole 24 communicating with the suction source is formed at the center of the back surface of the holding table 2.

  As shown in FIG. 5, a second permanent magnet 200 is disposed on the outer peripheral side surface of the holding table 2. The second permanent magnet 200 is configured by alternately arranging S poles and N poles in the circumferential direction. A supporting permanent magnet 25 is disposed below the frame body 23. The outer diameter of the second permanent magnet 200 is smaller than that of the supporting permanent magnet 25.

  As shown in FIG. 6, a gap 26 communicating with the suction hole 24 is formed below the holding portion 22. The suction hole 24 is provided with a reverse support valve 24 a that allows only a gas flow from the gap 26 to the outside through the suction hole 24. An open hole 26 a that opens to the outside is formed on the side of the gap 26. The open hole 26a is blocked by a gas sealing plate 23b connected to an elastic seal portion 23a embedded in the frame body 23, and the gap 26 is configured not to be opened to the atmosphere through the open hole 26a. A spring 23c is disposed below the gas sealing plate 23b so as to prevent the air gap 26 from being opened to the atmosphere by urging the gas sealing plate 23b upward.

  A base mechanism 2 a shown in FIG. 7 is a mechanism that realizes rotation and revolution of the three holding tables 2, and the holding table moving mechanism 21 includes an outer frame 210 and an inner frame 211. As shown in FIG. 8, the inner peripheral side of the outer frame 210 is formed with a stepped structure, and supporting permanent magnets 210a and 210b are embedded in the inner peripheral surface and the upper surface of the stepped portion, respectively. In addition, the outer peripheral side of the inner frame 211 is also formed with a stepped structure, and supporting permanent magnets 211a and 211b are embedded in the outer peripheral surface and the upper surface of the step portion, respectively.

  As shown in FIG. 7, between the inner periphery of the outer frame 210 and the outer periphery of the inner frame 211, the same number of holding table movement restricting portions 201 formed in a cylindrical shape as the holding table 2 are arranged. The holding table movement restricting portion 201 has an outer diameter that is equal to or slightly larger than the outer diameter of the frame body 23 of the holding table 2 shown in FIGS. Further, the inner diameter of the holding table movement restricting portion 201 is formed larger than the outer diameter of the second permanent magnet 200 of the holding table 2.

  As shown in FIG. 7, below the three holding table movement restricting portions 201, a first electromagnet 212 formed in a ring shape that passes directly under the center of all the holding table movement restricting portions 201 is disposed. Yes. The first electromagnet 212 is disposed along the movement path of the holding table 2 at a position facing the back surface side of the holding surface 22a of the holding table 2, and two types of magnetic poles whose polarity can be switched are alternated. It is arranged and configured.

  As shown in FIG. 8, a supporting permanent magnet 201 a is embedded in the upper surface of the holding table movement restricting portion 201. A second electromagnet 201 b is embedded in the inner peripheral surface of the holding table movement restricting portion 201. The holding table 2 is supported in a non-contact state in the vertical direction by repulsion between the supporting permanent magnet 25 of the holding table 2 shown in FIG. 5 and the supporting permanent magnet 201a embedded in a position facing the vertical direction. Is done. Further, the second electromagnet 201b formed on the inner peripheral surface of the holding table movement restricting portion 201 faces the second permanent magnet 200 formed on the outer peripheral side surface of the holding table 5 shown in FIG. As the second electromagnet 201b and the second permanent magnet 200 repel each other, the holding table 2 is supported in a non-contact state in the horizontal direction.

  The second electromagnet 201b is configured by alternately arranging two types of magnetic poles whose polarity can be switched. Further, the first electromagnet 212 repels the first permanent magnet 21a (see FIG. 4) formed on the back side of the holding table 2, thereby supporting the holding table 2 from below in a non-contact state. The concentric arc of the first permanent magnet 21a and the arc of the first electromagnet 212 intersect each other. The first electromagnet 212 is provided with the same number of suction shafts 212a as the holding table 2 that can be mounted so that it can be raised and lowered in the vertical direction. The suction shafts 212a are arranged at three positions, that is, a carry-in / out area where the work is carried in / out with respect to the holding table and an area where the grinding by the grinding mechanisms 3a, 3b is performed.

  The holding table movement restricting unit 201 moves up and down under the control of the restricting unit driving unit 202 shown in FIG. 1, and when the holding table movement restricting unit 201 is lowered as shown in FIG. And the revolution of the holding table 2 is restricted when the holding table movement restricting portion 201 is raised as shown in FIG. The position of the holding table movement restriction unit 201 when the movement of the holding table 2 along the movement path is not hindered is referred to as an allowable position, and the holding table movement restriction unit when the movement of the holding table 2 along the movement path is hindered. The position 201 is referred to as a restriction position. These two positions that the holding table movement restriction unit 201 can take are controlled by the restriction drive unit 202.

  As shown in FIG. 9, in a state where the revolution of the holding table 2 is allowed, as shown in FIG. 11, the supporting permanent magnets 210 a and 210 b formed on the outer frame 210 and the support formed on the inner frame 211. By switching the polarity of the magnetic poles of the first electromagnet 212 shown in FIGS. 7 and 8 over time while being supported by the permanent magnets 211a and 211b, the polarity of the adjacent magnetic poles is different. The holding table 2 revolves when its center moves along the ring shape of the first electromagnet 212. As shown in FIG. 4, since the first permanent magnet 21a is formed concentrically, the holding table 2 can revolve regardless of its orientation.

  As shown in FIG. 10, in a state where the revolution of the holding table 2 is restricted, the supporting permanent magnet 25 of the holding table 2 and the supporting permanent magnet 201a of the holding table movement restricting portion 201 repel each other, and the holding table 2 Is supported in a non-contact state with the holding table movement restricting portion 201. Then, in this state, the polarity of adjacent magnetic poles of the second electromagnet 201b formed on the inner peripheral surface of the holding table movement restricting portion 201 is alternately changed over time, thereby being formed on the outer peripheral side surface of the holding table 2. Since the second permanent magnet 200 rotates, the holding table 2 rotates by this.

Next, operation | movement of the apparatus at the time of grinding a workpiece | work using the grinding apparatus 1 shown in FIG. 1 is demonstrated. The workpiece to be ground is not particularly limited, but for example, semiconductor wafers such as silicon wafers and GaAs, ceramics, glass, sapphire (Al ₂ O ₃ ) based inorganic material substrates, ductile materials such as plate metals and resins, Flatness (TTV: total thickness variation: difference between the maximum value and the minimum value of the entire surface of the workpiece ground surface measured in the thickness direction with the workpiece ground surface as the reference surface) is required. And various processing materials.

  The workpiece to be ground is held when the holding portion 50 of the carry-in / out mechanism 5 enters the cassette 40a, and is carried out when the holding portion 50 retreats from the cassette 40a. Then, the work held by the holding unit 50 is placed on the holding unit 60 of the alignment mechanism 6. In the alignment mechanism 6, the workpiece is aligned at a fixed position by moving the abutting members 62 toward each other.

  Next, the aligned workpiece is held by the holding unit 50 of the carry-in / out mechanism 5 and is conveyed and placed on the holding table 2 at the nearest position. Then, the suction shaft 212a is raised and connected to the suction hole 24 so that the suction hole 24 communicates with the suction source, and a negative pressure is applied to the holding surface 22a to hold the workpiece W. Next, while the suction shaft 212a is lowered to release the connection with the suction hole 24, as shown in FIG. 9, the holding table movement restricting portion 201 is lowered and is positioned at the allowable position. By switching the magnetic poles of the first electromagnet 212 shown in FIG. 1 over time, the holding table 2 is revolved and the work held on the holding table 2 is moved to just below the grinding mechanism 3a shown in FIG. At this time, even if the suction shaft 212 a is lowered, the gap 26 remains at a negative pressure, and the state where the workpiece W is sucked is maintained on the holding surface 22 of the holding table 2. In addition, since the first permanent magnets 21 a formed on the holding table 2 are formed concentrically, the holding table 2 can be reliably moved regardless of the orientation of the holding table 2. Furthermore, the revolution speed can be freely adjusted by adjusting the switching speed of the magnetic poles.

  Next, as shown in FIG. 12, the holding table movement restricting portion 201 and the suction shaft 212a are raised to connect the suction hole 24 formed in the holding table 2 and the suction shaft 212a so as to communicate with the suction source and hold it. A negative pressure is applied to the surface 22a to hold the workpiece W. Then, while the holding table 2 is rotated by switching the magnetic poles of the second electromagnet 201b shown in FIG. 8 over time, the grinding mechanism 3a is lowered under the control of the processing feed mechanism 10a, and the rotating grindstone 301 is moved to the workpiece W. Rough grinding is performed by acting on the exposed surface. At this time, the suction shaft 212a serves as a rotation shaft when the holding table 2 rotates. The suction shaft 212a supports the holding table 2 in the vertical direction together with the supporting permanent magnet 201a of the holding table movement restricting portion 201, and acts so as not to rotate.

  After the rough grinding, the work table held on the holding table 2 is lowered by lowering the holding table movement restricting portion 201 and the suction shaft 212a and switching the magnetic poles of the first electromagnet 212 shown in FIGS. W is moved to just below the grinding mechanism 3b shown in FIG. At this time, the gap 26 remains at a negative pressure, and the state in which the workpiece W is sucked is maintained on the holding surface 22 of the holding table 2. Then, the holding table movement restricting portion 201 and the suction shaft 212a are raised and the magnetic pole of the second electromagnet 201b shown in FIG. The grinding mechanism 3b is lowered and the rotating grindstone 301 is applied to the exposed surface of the workpiece W to perform finish grinding. At the time of finish grinding, as in the case of rough grinding, the suction shaft 212a serves as a rotation shaft when the holding table 2 rotates, and the holding table in the vertical direction together with the supporting permanent magnet 201a of the holding table movement restricting portion 201. Supports 2 and acts so that rotation does not shake.

  After finishing grinding, the holding table movement restricting portion 201 and the suction shaft 212a are lowered, and the magnetic poles of the first electromagnet 212 shown in FIGS. Return table 2. Then, the holding table movement restricting portion 201 is raised, and the suction portion 90 of the second transport mechanism 9 shown in FIG. 1 is moved immediately above the workpiece W as shown in FIG. Here, as shown in FIG. 13, a ring-shaped pressing portion 90 a for pressing the elastic seal portion 23 a embedded in the frame body 23 of the holding table 2 protrudes downward from the suction portion 90. Yes. Then, as shown in FIG. 14, when the pressing portion 90a presses the elastic seal portion 23a by the lowering of the adsorbing portion 90, the gas sealing plate 23b is lowered against the urging force of the spring 23c, thereby the gap 26 is formed. The air is released to the atmosphere through the opening hole 26a, and the adsorption of the work W on the holding surface 22a is released.

  When the suction of the workpiece W on the holding surface 22a is released in this way, the suction portion 90 is lifted, so that the workpiece W sucked by the suction portion 90 is detached from the holding table 2, and the second conveyance shown in FIG. The workpiece 9 is conveyed to the cleaning mechanism 8 by the mechanism 9 and is held on the holding table 80. Then, while the holding table 80 rotates, the cleaning liquid is jetted onto the workpiece W to perform cleaning, and then drying is performed. After cleaning the workpiece W, the holding unit 50 of the carry-in / out mechanism 5 holds the workpiece W and carries it into the cassette 40b.

  As shown in FIG. 15, in order to fill the space formed between the first permanent magnet 21a and the first electromagnet 212 of the holding table 2 with water, a liquid supply mechanism 27 is provided in the apparatus main body. You can also. Then, the liquid 27a supplied from the liquid supply mechanism 27 fills the space formed between the first permanent magnet 21a and the first electromagnet 212 with water and discharges the water from the drainage portion 28 to the outside. Thus, it is possible to prevent accumulation of dirt such as contamination between the holding table 2 and the apparatus main body.

  Further, without providing a dedicated liquid supply mechanism, as shown in FIG. 16, the grinding water 34 a flowing downward from the grinding water flow passage 34 formed inside the grinding mechanisms 3 a and 3 b is supplied to the holding table 2. A similar effect can be obtained by filling and discharging the space formed between the first permanent magnet 21a and the first electromagnet 212.

  As described above, the grinding device 1 supports the holding table 2 using magnetic force to realize rotation and revolution, so that complicated wiring is not required and the structure is simpler than a structure using a conventional turntable. It can be a structure. Further, since the movable part is reduced by driving the holding table 2 using magnetic force, there is less concern about leakage of liquid into the apparatus.

  In the example described above, the movement path of the holding table 2 is described as being circular. However, the movement path is not limited to being circular. Therefore, the holding table moving mechanism 21 can take various shapes according to the shape of the moving path. Further, the holding table movement restricting portion 201 disposed at a position where the work is carried out and carried in by the first transfer mechanism 7 and the second transfer mechanism 9 has a function of rotating the holding table 2. Since it is not necessary, the second electromagnet is not necessarily disposed on the inner periphery.

1: Grinding device 2: Holding table 2a: Base mechanism 20: Rotating support mechanism 200: Second permanent magnet 201: Holding table movement restricting portion 201a: Supporting permanent magnet 201a 201b: Second electromagnet 202: Restricting portion driving portion 21: Holding table moving mechanism 21a: First permanent magnet 210: Outer frame 210a, 210b: Supporting permanent magnet 211: Inner frame 211a, 211b: Supporting permanent magnet 212: First electromagnet 212a: Suction shaft 22: Holding Portion 22a: Holding surface 23: Frame body 23a: Elastic seal portion 23b: Gas sealing plate 23c: Spring 24: Suction hole 24a: Reverse support valve 25: Supporting permanent magnet 26: Gap 26a: Opening hole 27: Liquid supply mechanism 27a : Liquid 28: Drainage part 3a, 3b: Grinding mechanism 30: Grinding tool 300: Base 301: Grinding wheel 31: Support mount 32: Rotating shaft 33 Motor 34: Grinding water flow path 34a: Grinding water 4a, 4b: Mounting table 40a, 40b: Cassette 5: Loading / unloading mechanism 50: Holding part 51: Turning part 52: Arm part 6: Positioning mechanism 60: Holding part 61: Long hole 62: Abutting member 7: First transport mechanism 70: Suction unit 71: Arm unit 8: Cleaning mechanism 80: Holding table 9: Second transport mechanism 90: Suction unit 90a: Press unit 91: Arm unit 10a 10b: Processing feed mechanism 100: Ball screw 101: Guide rail 102: Pulse motor 103: Sliding base 104: Support part

Claims (2)

A holding table having a holding surface for holding a workpiece, a rotation support mechanism for rotatably supporting the holding table around a direction perpendicular to the holding surface of the holding table, and a workpiece held on the holding table. A grinding device having a grinding mechanism for grinding, a holding table moving mechanism for positioning the holding table at a position facing a grinding tool of the grinding mechanism,
The holding table moving mechanism is
A first permanent magnet disposed on the opposite side of the holding surface of the holding table; and a first permanent magnet disposed along the movement path of the holding table at a position facing the opposite surface of the holding table. An electromagnet, and
The rotation support mechanism is
A second permanent magnet disposed on the outer peripheral side surface of the holding table; a holding table movement restricting portion provided with a second electromagnet disposed at a position surrounding the outer peripheral side surface of the holding table; and the holding table A restricting portion driving portion that selectively positions the movement restricting portion at a restricting position that prevents movement of the holding table along the moving path and an allowable position that allows movement of the holding table along the moving route; Grinding equipment.   2. The grinding apparatus according to claim 1, further comprising a liquid supply mechanism that fills a space between the first permanent magnet and the first electromagnet.

Images