JP2011140101A - Ｍｅｍｓデバイスの製造方法 - Google Patents

Ｍｅｍｓデバイスの製造方法 Download PDF

Info

Publication number
JP2011140101A
JP2011140101A JP2010002884A JP2010002884A JP2011140101A JP 2011140101 A JP2011140101 A JP 2011140101A JP 2010002884 A JP2010002884 A JP 2010002884A JP 2010002884 A JP2010002884 A JP 2010002884A JP 2011140101 A JP2011140101 A JP 2011140101A
Authority
JP
Japan
Prior art keywords
layer
forming
sacrificial layer
metal material
resist layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2010002884A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011140101A5 (https=
Inventor
Tetsunao Sakamoto
哲尚 坂本
Masahiro Nakatani
昌弘 中谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Priority to JP2010002884A priority Critical patent/JP2011140101A/ja
Publication of JP2011140101A publication Critical patent/JP2011140101A/ja
Publication of JP2011140101A5 publication Critical patent/JP2011140101A5/ja
Withdrawn legal-status Critical Current

Links

Landscapes

  • Micromachines (AREA)
JP2010002884A 2010-01-08 2010-01-08 Ｍｅｍｓデバイスの製造方法 Withdrawn JP2011140101A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010002884A JP2011140101A (ja) 2010-01-08 2010-01-08 Ｍｅｍｓデバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010002884A JP2011140101A (ja) 2010-01-08 2010-01-08 Ｍｅｍｓデバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2011140101A true JP2011140101A (ja) 2011-07-21
JP2011140101A5 JP2011140101A5 (https=) 2013-01-10

Family

ID=44456324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010002884A Withdrawn JP2011140101A (ja) 2010-01-08 2010-01-08 Ｍｅｍｓデバイスの製造方法

Country Status (1)

Country Link
JP (1) JP2011140101A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011157596A (ja) * 2010-02-01 2011-08-18 Japan Electronic Materials Corp Ｍｅｍｓデバイスの製造方法
CN111983272A (zh) * 2020-08-14 2020-11-24 强一半导体（苏州）有限公司 一种导引板mems探针结构制作方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08176757A (ja) * 1994-10-27 1996-07-09 Tdk Corp マイクロマシン部品およびその取り扱い方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08176757A (ja) * 1994-10-27 1996-07-09 Tdk Corp マイクロマシン部品およびその取り扱い方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011157596A (ja) * 2010-02-01 2011-08-18 Japan Electronic Materials Corp Ｍｅｍｓデバイスの製造方法
CN111983272A (zh) * 2020-08-14 2020-11-24 强一半导体（苏州）有限公司 一种导引板mems探针结构制作方法

Similar Documents

Publication Publication Date Title
JP6502464B2 (ja) インダクター及びその製造方法
JP2009002947A (ja) センシングユニット及びその製造方法
KR20180095315A (ko) 프로브 핀 및 이의 제조 방법
JP2010123879A5 (https=)
TW201737272A (zh) 充電線圈及其製造方法
US8530276B2 (en) Method for manufacturing a microelectronic device and a microelectronic device thus manufactured
US20200140259A1 (en) Method of forming semiconductor device structure
CN110310817A (zh) 电感器及制造该电感器的方法
JP5477711B2 (ja) Ｍｅｍｓデバイスの製造方法
JP2011140101A (ja) Ｍｅｍｓデバイスの製造方法
JP6264597B2 (ja) 多層電子支持構造体の層間の位置合わせ
JP2013106015A (ja) 半導体装置、及びその製造方法
JP2011505690A (ja) プリント回路基板及びその製造方法並びにプリント回路基板製造用のパネル
JP2016166855A (ja) 半導体装置及びその製造方法
KR101786548B1 (ko) Oled 제조용 금속 마스크 및 이의 제조 방법
CN205911121U (zh) 充电线圈
TW201307184A (zh) 在晶圓層級封裝中用於高密度電感與重分配的薄膜結構
KR20190077934A (ko) 인덕터 및 이의 제작 방법
KR101546190B1 (ko) 관통형 전극을 포함하는 기판 구조체 및 이의 제조 방법
KR100968445B1 (ko) 접속소자의 제조방법
JP7571995B2 (ja) 微細素子の製造方法及び微細素子
JP2008535284A (ja) セラミック・スペース・トランスフォーマのプローブ・パッド構造
US8312624B1 (en) Method for manufacturing a heat dissipation structure of a printed circuit board
CN118497664A (zh) 掩膜版及其制备方法
JP4309379B2 (ja) 回路基板とその製造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121022

A621 Written request for application examination

Effective date: 20121022

Free format text: JAPANESE INTERMEDIATE CODE: A621

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121119

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131029

A977 Report on retrieval

Effective date: 20131031

Free format text: JAPANESE INTERMEDIATE CODE: A971007

A761 Written withdrawal of application

Effective date: 20131220

Free format text: JAPANESE INTERMEDIATE CODE: A761