JP2011139109A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device that permits manufacture through a simplified process. <P>SOLUTION: The light emitting device includes: a package body having first and second major surfaces and a plurality of side surfaces formed between the major surfaces, the package body having first and second level regions defined to include the first and the second major surface, respectively, and formed of curing resin; a first and a second block for external terminal disposed on both ends of the package body, respectively, each having a first and a second surface, and side surfaces between the first and the second surface with the first surface being exposed to the first major surface of the package body, the first and the second block for external terminal each having a connection connected to the other surface which is externally exposed in a portion located internally of the package body; a light emitting diode chip positioned in the first level region between the first and the second block for external terminal and having an electrode-forming surface on which a first and a second electrode are formed; and wires adapted to electrically connect the first and the second electrode of the light emitting diode chip to the connections of the first and the second block for external terminal, respectively. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light emitting device, and more particularly, to a light emitting device including a semiconductor light emitting diode chip and a method for manufacturing the same.

  Generally, a package structure having a case in which a white resin is injection-molded on a lead frame is widely used in a light-emitting device including a light-emitting diode chip. In such a light emitting device, an LED chip is mounted in a groove portion of a case so as to be connected to a lead frame, and then the groove portion is filled with resin. In particular, in order to manufacture a white light emitting device, a method in which phosphor powder is included in the resin filled in the groove can be used.

  However, the conventional light emitting device structure has several disadvantages in terms of miniaturization and yield. For example, in the case of a side-view type light-emitting device that can be surface-mounted and used mainly as a light source for a backlight of a display unit of a mobile phone, the side-emitting type light-emitting device becomes thinner as the mobile phone becomes thinner. There is also a great demand for conversion. However, in the structure of the conventional light emitting device, since the groove portion must be provided for mounting the LED chip, it is difficult to manufacture the case provided with this with a sufficiently small size.

  In addition, a complicated process is performed such as mounting the LED chip after injection molding the case together with the lead frame, and then providing the resin packaging part in the groove part, resulting in a decrease in yield and an increase in cost for the process. There is a problem of doing.

  In particular, in the white light emitting device, in the step of dispensing the liquid resin containing the phosphor powder into the groove part, there is a problem that the color dispersion is not uniform due to the dispersion of the phosphor filling amount by the dispenser (dispenser). May occur.

  The present invention is to solve the above-mentioned problems of the prior art, and its purpose is to reduce the size, but unlike the conventional packaging process, the light emitting diode chip and the external connection are formed in a single process. It is providing the manufacturing method of the light-emitting device which can be integrated with the electrode lead for electric power.

  Another object of the present invention is to provide a light emitting device having a new structure that can be manufactured in a simplified process while being able to be further downsized.

  Another object of the present invention is to provide a manufacturing process for the optical component.

  In order to solve the above technical problem, one aspect of the present invention provides a method of manufacturing a light emitting device according to two embodiments.

  A manufacturing method of a light emitting device according to a first embodiment of the present invention includes a plurality of light emitting diode chips having electrode forming surfaces on which both electrodes are formed, and a plurality of external terminal blocks having connection portions exposed on at least one surface. And the external terminal block and the light emitting element on the first sheet so that the light emitting diode chip is positioned between the external terminal blocks with each electrode forming surface and the exposed surface of the connection portion facing upward. A step of attaching the diode chip, a step of connecting the electrodes of the light emitting diode chip to the exposed connection portion of the adjacent external terminal block with wires, and an array region of the external terminal block and the light emitting diode chip A chip array structure is provided by attaching a spacer having a height greater than the height of the wire on the first sheet. A step of arranging a chip array structure in the chamber, depressurizing the chamber so that the chamber is depressurized or evacuated, and an array region in the spacer so that the array region surrounded by the spacer is filled A step of dropping a curable liquid resin on the substrate, a step of attaching a second sheet on the spacer in a state where the curable liquid resin is filled in the chip array structure, and a curing filled in the chip array structure A step of curing the functional liquid resin, and a step of cutting the chip array structure into a desired size so as to obtain a plurality of light emitting devices.

  The manufacturing method according to the second embodiment of the present invention includes a step of providing a plurality of external terminal blocks each having a plurality of light emitting diode chips each having an electrode forming surface on which both electrodes are formed and a connection portion exposed on at least one surface. The external terminal block and the light emitting diode chip are placed on the first sheet so that the light emitting diode chip is positioned between the external terminal blocks with the exposed surfaces of the electrode forming surface and the connection portion facing upward. A first sheet so as to surround the mounting step, the step of connecting the electrode of the light emitting diode chip to the exposed connection portion of the adjacent external terminal block with a wire, and the array region of the external terminal block and the light emitting diode chip, respectively. Attaching a spacer having a height greater than the height of the wire and provided with at least one inlet; A process of manufacturing a chip array structure having an internal space including the arrangement area by attaching a second sheet on the sensor, and arranging the chip array structure in the chamber, the internal space of the chip array structure is depressurized. Alternatively, a process of reducing the pressure in the chamber so as to be in a vacuum state, and a curable liquid resin is disposed in a region adjacent to the inflow port of the spacer so that the internal space is sealed while the pressure in the chamber is maintained. A step of releasing the vacuum or vacuum state of the chamber so that the curable liquid resin is filled into the internal space through the inlet and the curable liquid filled in the chip array structure. A step of curing the liquid resin, and a step of cutting the chip array structure into a desired size so as to obtain a plurality of light emitting devices.

  Each of the plurality of light emitting diode chips may include a transparent resin layer formed on at least a side surface. The transparent resin layer can be formed on the side surface and the surface opposite to the electrode forming surface. Of the transparent resin layer, at least a portion formed on the surface opposite to the electrode forming surface may include phosphor powder for converting the emission wavelength.

  Unlike this, before the chip array structure is cut to a desired size, a phosphor layer can be further formed in at least the light emitting diode chip region of the exposed surface after removing the first sheet. .

  The method may further include a step of removing the first and second sheets after the curable liquid resin is cured and before the step of cutting the chip array structure.

  The external terminal block employed in the present invention includes an insulating block body having a first surface and a second surface positioned opposite to each other, and the connecting portion includes the first surface and the second surface of the insulating block body. It can be implemented by a conductive via hole that penetrates. The exposed area of the connecting portion to which the wire is coupled may be the first surface of the insulating block body.

  In this case, in order to sufficiently secure the wire connection region, the connection part may further include an electrode layer formed on the first surface of the insulating block body so as to be connected to the conductive via hole.

  The insulating block body may be a ceramic block body or a PCB block. When the insulating block body is a ceramic block body, the insulating block body may be made of a porous ceramic in order to reinforce adhesion with a resin.

  In addition, the external terminal block may have a side surface on which at least one step is formed so that the external terminal block is well bound to the light emitting device.

  In the external terminal block having the conductive via hole, the conductive via hole is cut and exposed to the cut surface in the cutting process of the chip array structure.

  In this case, preferably, the arrangement of the external terminal block and the light emitting diode chip may be implemented such that the four light emitting diode chips share one external terminal block, and two adjacent insulating block bodies are adjacent to each other. The chip array structure is cut together with the external terminal block so that the conductive via hole is exposed on one side.

  The step of attaching the light emitting diode chip and the external terminal block on the first sheet includes the step of arranging the light emitting diode chip and the external terminal block on the first sheet coated with a curable material, And a step of curing the curable material so as to maintain the light emitting diode chip and the external terminal block.

  Preferably, the curable liquid resin can be defoamed in the step of reducing the pressure in the chamber by disposing the curable liquid resin in the chamber before the step of reducing the pressure in the chamber.

Preferably, the curable liquid resin may include a highly reflective powder having electrical insulation. As such highly reflective powder, TiO ₂ powder can be used.

  In the step of attaching the external terminal block and the light emitting diode chip, a Zener diode can be further attached on the external terminal block or the light emitting diode chip. Similar to this, a heat radiator can be further mounted on the light emitting diode chip.

  In the manufacturing method according to the second embodiment of the present invention, it is preferable to use a rigid sheet as the second sheet. In a specific embodiment, the height of the external terminal block is the same as the height of the spacer, and the external terminal block has a step structure formed on the surface facing the light emitting diode chip, and the step surface and the upper end surface are The structure may be electrically connected to each other. In this case, the external terminal block can be made of a conductor so that it can be provided as a connecting part.

  Another aspect of the present invention includes a first level region and a second level region having a first main surface and a second main surface and a plurality of side surfaces positioned therebetween, each including the first main surface and the second main surface. A package main body made of a curable resin, and disposed at both ends of the package main body, having a first surface and a second surface and a side surface therebetween, at least the first surface being a first main surface of the package main body A first external terminal block and a second external terminal block having a connection portion connected to another surface exposed and exposed at a portion located inside the package body; and a first external portion in the first level region. Located between the terminal block and the second external terminal block, has an electrode forming surface on which the first electrode and the second electrode are formed, and is arranged so that the electrode forming surface faces the second level region. Light-emitting diode chip To provide a light emitting device comprising a wire for each electrically connecting the first electrode and the second electrode to the connection portion of the first external terminal block and a second external terminal blocks each diode chip, a.

  According to the present invention, since a separate case structure is not employed, a new light emitting device having a sufficiently compact structure can be realized. Unlike conventional methods that require a resin packaging part forming process separately from the case structure injection molding, the entire structure can be manufactured in a single process, and the lead frame is processed separately. Since no process is required, it can be beneficially used for mass production processes of compact packages. In addition, since the size of the light emitting device can be uniformly applied through an appropriate design of the chip array structure, the process deviation can be reduced and an excellent light emitting device can be produced more effectively.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

  The light emitting device manufacturing method according to the first embodiment of the present invention can be more easily understood through the process example illustrated in FIGS. 1 and 2. 1a to 1d are views illustrating a process of providing a chip array structure necessary for a manufacturing process of a light emitting device according to a first embodiment of the present invention.

  As shown in FIG. 1a, the external terminal block 15 and the light emitting diode chip 12 are arranged on the first sheet 11a 'to which the curable material R is applied.

  The light emitting diode chip 12 has a structure in which all of the bipolar electrodes 12a and 12b are formed on one surface (hereinafter also referred to as “electrode forming surface”). The resin layer 14 formed on the opposite surface and the side surface of the electrode forming surface as in the present embodiment can be included. The resin layer 14 can include phosphor powder for wavelength conversion as necessary. In particular, the resin layer portion including the phosphor may be provided on the surface of the light emitting diode chip 12 that is provided as the light emitting surface, that is, on the surface opposite to the electrode forming surface.

  The external terminal block 15 employed in the present embodiment has an insulating block body 15a and a connecting portion 15b made of a conductor penetrating both surfaces thereof. The connection portion 15 b provides an area that is exposed on at least one surface of the external terminal block 15 and is connected to the light emitting diode chip 12. Such an external terminal block 15 is provided as an external terminal of the final light emitting device. Such a connection region for the external terminal can be obtained by exposing through the cut surface of the connection portion 15b that appears in the subsequent cutting process.

  Depending on the desired final light emitting device structure (eg, side view or top view), the position and shape of the connecting portion 15b and the shape of the connecting portion 15b can be variously changed (see FIGS. 7a and 7b). (See FIG. 16).

  The external terminal block 15 that can be used in the present invention is not limited to a specific form, and has an exposed connection portion 15b connected to the electrodes 12a and 12b of the light emitting diode chip, and the final light emitting device (ie, Any configuration having the connection portion 15b exposed on the surface of the light emitting device in the cutting step) may be used. In a specific embodiment, the external terminal block itself may be a structure made of a conductive material so as to be provided as a connection part.

  In the present embodiment, the light emitting diode chips 12 are arranged so as to be positioned between the external terminal blocks 15. For the subsequent wire connection process, the light emitting diode chip 12 and the external terminal block 15 are arranged so that the electrode formation surface and the exposed surface of the connection portion 15b face upward. A preferred arrangement that can be employed in this embodiment is shown in FIG.

  Referring to FIG. 3, the light emitting diode chips 12 are illustrated as an LED chip array A arranged in a line. Such an LED chip array A can be understood as a form that is not completely cut into individual chips after the resin layer 14 is formed. Of course, unlike the present example, the chip array may be used instead of the chip array.

  In this arrangement example, one external terminal block 15 is shared by four light emitting diode chips 12. Therefore, when cut in a subsequent process according to the dotted line, one external terminal block 15 can be cut into ¼ units and belong to four individual light emitting devices. Here, when the external terminal block 15 is cut in 1/4 units, the conductive via hole which is the connection portion 15b is also cut, and the connection portion 15b is exposed at the two adjacent side surfaces formed by the cutting. The The exposed connection area can be provided as a connection area for an external terminal. The method of configuring the external terminals of the light emitting device is not limited to this, and those skilled in the art can realize other arrangement forms in which one external terminal block is shared by two or different numbers of chips. it can.

  Next, as shown in FIG. 1b, the light-emitting diode chip 12 and the external terminal block 15 are fixed to the first sheet 11a by the adhesive curable material R.

  This step can be obtained by applying the curing conditions for the adhesive curable substance R after the appropriate crimping step for the arranged light emitting diode chips 12 and the external terminal blocks 15. For example, when the curable substance R is an ultraviolet (UV) curable resin, desired attachment can be realized by irradiating ultraviolet rays after pressure bonding.

  Next, as shown in FIG. 1c, the electrodes 12a and 12b of the light emitting diode chip 12 are connected to the exposed connection portions 15b of the adjacent external terminal blocks 15 by wires 16a and 16b, respectively.

  In the previous arranging step (see FIG. 1a), the LED chip 12 and the external terminal block 15 are arranged so that the electrode forming surface and the exposed surface of the connecting portion 15b are positioned on the upper surface, respectively. The bonding process can be easily realized.

  Next, as shown in FIG. 1 d, a spacer 17 is attached on the first sheet 11 a so as to surround the array region of the external terminal block 15 and the light emitting diode chip 12.

  The spacer 17 serves to define a resin filling region in the subsequent resin filling step. Therefore, the spacer 17 has a height larger than the height of the wires 16a and 16b so that the wires 16a and 16b are located inside the package body made of resin. The spacer 17 can be attached using an adhesive resin or a curable material.

  Through this process, the chip array structure used in the first embodiment of the present invention can be manufactured. The chip array structure shown in FIG. 1d can be manufactured as a plurality of light emitting devices through a series of processes including the resin filling process and the cutting process shown in FIGS. 2a to 2d.

  First, as shown in FIG. 2 a, a curable liquid resin 18 ′ is dropped onto the arrangement region in the spacer 17 so that the arrangement region surrounded by the spacer 17 is filled.

  The curable liquid resin 18 ′ is preferably dripped in a sufficiently large amount so that the internal space surrounded by the spacer 17 is filled. More specifically, the curable liquid resin 18 ′ is preferably dropped so that it can have at least the height of the spacer 17.

The curable liquid resin 18 ′ may be a transparent resin including a highly reflective powder having electrical insulation to prevent loss due to light absorption of other components and to improve light emission efficiency. As the highly reflective powder, TiO ₂ powder can be preferably used. As the transparent resin, a silicon resin, an epoxy resin, or a combination thereof can be used.

  It is preferable to adjust the process conditions such as the viscosity of the resin so that the curable liquid resin 18 ′ to be dropped can be appropriately positioned in the space between the light emitting diode chip 12 and the external terminal block 15.

  In the present embodiment, the resin filling step is performed in a state where the chip array structure is disposed in a vacuum chamber and the chamber is depressurized so that the chamber is depressurized or vacuumed. For example, the process can be performed using the vacuum chamber illustrated in FIGS. 4a and 4b.

  As shown in FIGS. 4 a and 4 b, the vacuum chamber apparatus includes a chamber 31, a vacuum valve 36 provided on one side of the chamber 31, and a stage 33 provided inside the chamber 31.

  The internal space of the chamber 31 is depressurized through the vacuum valve 36, and the internal space of the chamber 31 can be converted into a vacuum or a desired depressurized state. The chamber 31 may be further equipped with a resin storage unit 34 for dropping the curable liquid resin 18 ′ at a desired position. The defoaming treatment of the curable liquid resin 18 ′ filled under such a reduced pressure condition can be ensured.

  Preferably, before depressurizing the inside of the chamber 31, a curable liquid resin may be disposed in advance and disposed in the chamber 31 to perform the defoaming process more effectively.

  Next, as shown in FIG. 2 b, after releasing the reduced pressure or vacuum state of the chamber 31, the second sheet 11 b is attached on the spacer 17.

  In the step of attaching the second sheet 11b onto the spacer 17, the level of the curable liquid resin 18 'can be adjusted so as to conform to the height of the spacer 17. Further, the curable liquid resin 18 ′ is more effectively injected into the space between the light emitting diode chip 12 and the external terminal block 15 through appropriate pressurization applied in the process of attaching the second sheet 11 b. be able to. Other subsequent steps along with this step can be performed externally with the chip array structure unloaded, preferably after releasing the vacuum or vacuum state of the chamber.

  Next, as shown in FIG. 2c, the curable liquid resin 18 'filled in the chip array structure is cured.

  The main curing step can be performed by heat or ultraviolet irradiation depending on the type of resin. This step can be performed directly inside the chamber 31 as necessary, but can be performed using a separate pressurization equipment P outside the chamber 31 by taking out the chip array structure. The cured resin 18 can bind the light emitting diode chip 12 and the external terminal block 15 to provide a single structure, and can electrically connect the light emitting diode chip 12 and the external terminal block 15 to each other. The connecting wire 16 portion can be protected.

  Next, as shown in FIG. 2d, the first sheet 11a and the second sheet 11b are removed from the chip array structure, and the chip array structure is cut into a desired size so that a plurality of light emitting devices 10 can be obtained. .

  The first sheet 11a and the second sheet 11b can be removed from the chip array structure by an appropriate chemical / mechanical method known to those skilled in the art. After the removal of the sheets 11a and 11b, the chip array structure is cut using a dicing apparatus D.

  In the arrangement described with reference to FIGS. 1 a and 3, the external terminal block 15 is divided into four light emitting devices by setting the cut positions so that the external terminal block 15 is divided into ¼. Can be provided as an external terminal. Further, by cutting the external terminal block 15, the connecting portion 15b can be exposed at two side surfaces adjacent to each other.

  5a and 5b are a plan view and a side sectional view, respectively, showing an example of a light emitting device that can be manufactured according to the first embodiment of the present invention.

  5a and 5b, the light emitting device 20 includes a package body 28 made of a curable resin. The package body 28 has a first main surface 28a and a second main surface 28b positioned opposite to each other, and a side surface 28c positioned therebetween. The first main surface 28a, the second main surface 28b, and the side surface 28c of the package body 28 are provided as flat surfaces. In the present embodiment, each surface is illustrated as a flat surface, but can be deformed through further processing steps.

The package body 28 may be a transparent resin including a highly reflective powder having electrical insulation to reduce loss due to light absorption of other components. It is preferable to use TiO ₂ powder as the highly reflective powder.

  First and second external terminal blocks 25 are located at both ends of the package body 28. The first and second external terminal blocks 25 have a first surface exposed to the first main surface 28a of the package body 28, and a second surface facing the first surface. The external terminal block 25 employed in the present embodiment includes an insulating block body 25a and a connecting portion 25b penetrating the first surface and the second surface.

  In order to more easily describe the structure of the light emitting device 20 according to the present embodiment, the package body 28 includes a first main surface 28a and a second main surface of the light emitting diode chip 22 on the basis of the surface on which the electrodes 22a and 22b are formed. It can be understood that it is divided into a first level region L1 and a second level region L2 each including the surface 28b.

  The light emitting diode chip 22 is positioned between the first and second external terminal blocks 25 in the first level region L1, and the electrode formation surface on which the first electrode 22a and the second electrode 22b are formed defines the second level region L2. It is arranged to face. The light emitting diode chip 22 may be connected to the connection portion 25b exposed on the second surface of the first and second external terminal blocks 25 through wires 26a and 26b. Further, the portions where the wires 26a and 26b are present can be protected by being located in a region extending from the first level region L1 to the second level region L2 of the package body 28.

  In the present embodiment, as described in the arrangement form of FIG. 3 and the cutting process of FIG. 2d, each of the external terminal blocks 25 is divided into four so that the connecting portions 25b are exposed at two adjacent cut surfaces. And can be cut. In this case, the side surface of the package main body 28 where the connection portion 25b of the external terminal block 25 is exposed can be provided as a mounting surface of the light emitting device 20. The light emitting device 20 having such a structure can be very usefully used as a side emission type LED package structure.

  In particular, since the light emitting device 20 according to the present embodiment does not employ a separate case structure, a sufficiently compact structure can be realized. Also, unlike conventional methods that require a resin packaging part forming process separately from the case structure injection molding, the entire structure can be manufactured in a single process and a separate processing process for the lead frame Can be beneficially used in mass production processes for compact packages.

  The light emitting device according to the present embodiment can be variously modified and implemented according to a desired package structure. As a modified example, necessary components can be appropriately added and executed. As a typical example, the heat sink and / or the Zener diode for withstand voltage characteristics that can effectively emit the light emitting diode chip can be provided.

  6a and 6b are a plan view and a side sectional view, respectively, showing another example of the light emitting device according to the present invention. Referring to FIGS. 6a and 6b, the light emitting device 30 includes a package main body 38 and first and second external terminals located at both ends of the package main body 38, similar to the light emitting device 20 shown in FIGS. 5a and 5b. Block 35 for use. Further, a light emitting diode chip 32 positioned between the first and second external terminal blocks 35 is also included.

  The light emitting diode chip 32 is located in the first level region L1, and the first electrode 32a and the second electrode 32b are connected to the connection portion 35b of the first and second external terminal blocks 35 through the wires 36a and 36b, respectively. be able to. Further, the portions where the wires 36 a and 36 b exist can be protected by being located in the second level region L 2 of the package body 38.

  The light emitting device 30 according to the present embodiment includes a Zener diode 37 that is located in the second level region L <b> 2 and is arranged on one of the external terminal blocks 35. The Zener diode 37 can be electrically connected to the light emitting diode chip 32 by wire bonding or surface mount bonding. That is, as in the present embodiment, one electrode of the Zener diode 37 is connected to the connection portion 35b of the external terminal block 35 by surface mounting, and the other electrode is connected to the connection portion 35b of the other external terminal block 35 by the wire 36c. Can be linked.

  Unlike this, the Zener diode 37 may have another bonding structure depending on the electrode position and mounting position of the Zener diode 37. For example, unlike the present embodiment, the Zener diode 37 can be mounted on the electrode forming surface of the light emitting diode chip 32. In this case, both electrodes can be connected to each connecting portion via a wire.

  In addition, the light emitting device 30 may further include a heat dissipating body 39 that is located on the second level region L2 and attached on the light emitting diode chip 32. The radiator 39 can be made of a known material having excellent thermal conductivity.

  Thus, the Zener diode 37 and / or the heat radiating body 39 can be added to the light emitting device 30 as necessary. Such a process may be performed in the manufacturing process of the chip array structure shown in FIGS. 1a to 1d, and preferably performed before the wire bonding process (FIG. 1c).

  7a and 7b are perspective views showing an external terminal block that can be preferably used in the first embodiment of the present invention. Here, the external terminal block shown in the figure has a structure that can be applied to the arrangement shown in FIG. 3. In the final light emitting device, the external terminal block is divided into quarters indicated by dotted lines. Alternatively, it may be provided in the form of a substrate, such as that illustrated in FIG.

  The external terminal block 45 shown in FIG. 7a includes an insulating block body 45a. Such an insulating block body 45a is preferably made of a ceramic body. In particular, by providing the ceramic body with a porous structure having a large number of voids h, the bonding strength with the resin constituting the package body can be improved. For such a purpose, the porosity constituting the porous structure is preferably about 10 to 60%, and the pore diameter is preferably about 0.1 to 1.3 μm.

  The connection portion 45b of the external terminal block 45 may include a conductive via hole V1 penetrating both surfaces of the insulating block body 45a and an electrode layer E1 connected to the conductive via hole V1. Here, the electrode layer E1 can provide a wider connection area when wire-bonding with the electrode of the light-emitting diode chip, and can reduce bonding defects.

In the process of forming the conductive via hole V1, a metal layer M made of a metal such as Au or Ag can be formed on the external terminal block 45 as necessary. Since such a metal layer M absorbs light generated from the light emitting diode chip in the package structure, the light efficiency may be reduced. In order to prevent this, it is preferable that the external terminal block 45 further includes a light absorption preventing layer 46 formed so as to cover at least the metal layer M. The light absorption preventing layer 46 can be made of a resin layer containing a highly reflective powder such as TiO ₂ .

  The external terminal block 55 shown in FIG. 7b includes an insulating block body 55a. Such an insulating block 55a has a configuration in which a step S is added to the side surface thereof. Such a step structure S can improve the bonding strength with the resin constituting the package body, like the porous structure of the previous example.

  The connection portion 55b of the external terminal block 55 may include a conductive via hole V2 penetrating both surfaces of the insulating block body 55a and an electrode layer E2 connected to the conductive via hole V2. Here, the electrode layer E2 can provide a wider connection area when wire-bonding with the electrode of the light emitting diode chip, and can reduce bonding defects.

  8a to 8d are cross-sectional views showing a part of the manufacturing process of the light emitting device according to the modification of the first embodiment of the present invention (a manufacturing process of the chip array structure).

  As shown in FIG. 8a, the external terminal block 65 and the light emitting diode chip 62 are arranged on the first sheet 61a 'to which the curable material R is applied.

The light emitting diode chip 62 has an electrode forming surface on which all of the bipolar electrodes 62a and 62b are formed. Unlike the embodiment illustrated in FIG. 1, the present embodiment has a structure that does not have a separate resin layer on the surface of the light emitting diode chip 62.

  As in FIG. 1, the external terminal block 65 can have an insulating block body 65a and a connecting portion 65b made of a conductor penetrating both surfaces. The external terminal block 65 can be cut in a subsequent cutting step (see FIG. 2e) to expose the connection portion 65b at the cut surface so that it can be provided as an external connection region.

  In the present embodiment, the light emitting diode chip 62 is arranged so as to be positioned between the external terminal blocks 65, and the light emitting diode chip 62 and the external terminal block 65 have the electrode forming surface and the exposed surface of the connecting portion 65b. Arranged to face the top.

  In this arrangement example, as shown in FIG. 9, the external terminal block 65 is provided in a substrate structure. Such an external terminal block 65 can be easily manufactured using a PCB substrate. Further, when cut in a subsequent process according to the dotted line, the connection portion 65b of one external terminal block 65 can be cut in 1/4 units and belong to four individual light emitting devices. Here, the connecting portion can be exposed at two adjacent side surfaces formed by such cutting. The exposed area can be provided as a connection area for an external terminal. The method of configuring the external terminals of the light emitting device is not limited to this, and those skilled in the art can realize other arrangement forms so that one external terminal block is shared by two or different numbers of chips. it can.

  Next, as shown in FIG. 8B, the arranged light emitting diode chips 62 and the external terminal blocks 65 are attached to the first sheet 61a by using the adhesive curable material R.

  This attachment process can be obtained by applying curing conditions for the adhesive curable substance R after an appropriate pressure bonding process to the arranged light emitting diode chips 62 and the external terminal blocks 65.

  Next, as shown in FIG. 8c, the electrodes 62a and 62b of the light emitting diode chip 62 are connected to the exposed connection portion 65b of the adjacent external terminal block 65 by wires 66a and 66b, respectively.

  Next, as shown in FIG. 8 d, a spacer 67 is attached on the first sheet 61 a so as to surround the arrangement region of the external terminal block 65 and the light emitting diode chip 62.

  The spacer 67 has a height greater than the height of the wires 66a and 66b so that the wires 66a and 66b are located inside the package body made of resin. The attachment of the spacer 67 can be realized using an adhesive resin or a curable material.

  Through such a process, the chip array structure used in the present embodiment can be manufactured. The chip array structure shown in FIG. 8d can be manufactured as a plurality of light emitting devices through a series of processes including the resin filling process and the cutting process shown in FIGS. 10a to 10e.

  Unlike the embodiment shown in FIG. 1, the light-emitting diode chip 62 employed in the present embodiment is illustrated in a form in which no resin layer is provided on the surface thereof. Therefore, this embodiment provides a new method for adding a phosphor layer when it is necessary to add a phosphor layer for wavelength conversion as in a white light emitting device. This method can be understood by the steps shown in FIGS. 10a to 10e.

  First, as shown in FIG. 10 a, a curable liquid resin 68 ′ is dropped onto the arrangement region in the spacer 67 so that the arrangement region surrounded by the spacer 67 is filled.

  It is preferable that the curable liquid resin 68 ′ is dripped in a sufficiently large amount so that the internal space surrounded by the spacer 67 is filled. More specifically, the curable liquid resin 68 ′ is preferably dropped so that it can have at least the height of the spacer 67.

  The resin filling step in the present embodiment is performed in a state where the chip array structure is disposed in a vacuum chamber and the chamber is depressurized so that the chamber is depressurized or vacuumed. For example, similar to the embodiment shown in FIG. 1, the vacuum chamber shown in FIGS. 4a and 4b can be used. The description is omitted here.

  The curable liquid resin used in the present embodiment is preferably a resin having a low refractive index so as to prevent light from entering the inside of the package body and facilitate light extraction in a desired direction. More preferably, a transparent liquid resin having a refractive index of about 1.5 or less is used as the curable liquid resin.

  Next, as shown in FIG. 10 b, the second sheet 61 b is attached on the spacer 67 after releasing the reduced pressure or vacuum state of the chamber.

  In the step of attaching the second sheet 61b onto the spacer 67, the level of the curable liquid resin 68 'can be adjusted so as to conform to the height of the spacer 67. In addition, the curable liquid resin 68 ′ is more effectively injected into the space between the light emitting diode chip 62 and the external terminal block 65 by appropriate pressure applied in the attaching process of the second sheet 61b. Can be made. Other subsequent steps along with this step can be performed externally with the chip array structure unloaded, preferably after releasing the vacuum or vacuum state of the chamber.

  Next, as shown in FIG. 10c, the curable liquid resin 68 'filled in the chip array structure is cured.

  The main curing step can be performed by heat or ultraviolet irradiation depending on the kind of the curable liquid resin 68 '. Although this step can be performed directly inside the chamber as necessary, the chip array structure can be taken out and used with another pressurization equipment P outside the chamber as in this embodiment. it can. The curable liquid resin 68 thus cured binds the light emitting diode chip 62 and the external terminal block 65 to provide a single structure, and the light emitting diode chip 62 and the external terminal block 65 are electrically connected. It is possible to protect the wire 66a, 66b portion connected to the.

  Next, as shown in FIG. 10d, after the first sheet 61a and the second sheet 61b are removed from the chip array structure, the phosphor layer 69 is formed on the surface exposed by removing the first sheet 61a.

  The first sheet 61a and the second sheet 61b can be removed from the chip array structure by an appropriate chemical / mechanical method known to those skilled in the art. The surface on which the phosphor layer 69 is formed is preferably formed at least in a region corresponding to the light emitting diode chip 62 as a light emitting surface.

  Next, as shown in FIG. 10E, the chip array structure is cut to provide a plurality of light emitting devices 60.

  This cutting step can be performed using a suitable dicing apparatus D. In the case where one external terminal block 65 is shared by four light emitting diode chips 62 as in the present embodiment, one external terminal block 65 is cut into ¼ units and belongs to each light emitting device 60. Can be cut as follows. Here, the conductive via hole, which is the connection portion 65b, is also cut together with the external terminal block 65, and the connection portion 65b can be exposed at the two adjacent side surfaces formed by the cutting. The exposed connection area can be provided as a connection area for an external terminal.

  FIGS. 11 a and 11 b are a plan view and a side sectional view showing a light emitting device that can be manufactured by the method shown in FIGS. 8 a to 8 d and FIGS. 10 a to 10 e, respectively.

  Referring to FIGS. 11a and 11b, the light emitting device 70 includes a package body 78 made of a curable resin. The package main body 78 has a first main surface 78a and a second main surface 78b positioned opposite to each other, and a side surface 78c positioned therebetween. The first main surface 78a, the second main surface 78b, and the side surface 78c of the package body 78 are provided as flat surfaces.

  First and second external terminal blocks 75 are positioned at both ends of the package body 78. The first and second external terminal blocks 75 have a first surface exposed to the first main surface 78a of the package body 78, and a second surface facing the first surface. The block 75 employed in the present embodiment has an insulating block body 75a and a connecting portion 75b penetrating the first surface and the second surface.

  The package body 78 is divided into a first level region L1 and a second level region L2 including a first main surface 78a and a second main surface 78b on the basis of the surface on which the electrodes 72a and 72b are formed of the light emitting diode chip 72. I can understand.

  The light emitting diode chip 72 is located between the first and second external terminal blocks 75 in the first level region L1, and the electrode formation surface on which the first electrode 72a and the second electrode 72b are formed is the second level region L2. It is arranged to face. The light emitting diode chip 72 can be connected to the connection portions 75b exposed on the second surfaces of the first and second external terminal blocks 75 through wires 76a and 76b, respectively.

  In addition, the portion where the wire 76 exists can be protected by being positioned in the second level region L2 of the package body 78. In the light emitting diode chip 72, the surface opposite to the electrode forming surface is exposed to the first main surface 78a. The first main surface 78a of the package body 78 is provided as a light emitting surface. The phosphor layer 79 is provided on the first main surface 78a of the package body so as to include at least the light emitting diode chip 72 region.

  The curable resin constituting the package body 78 has a low refractive index so that light generated from the light emitting diode chip 72 is prevented from entering the package body 78 and can be easily extracted in the direction of the phosphor layer 79. It is preferable to use a resin. It is more preferable to use a transparent resin having a refractive index of about 1.5 or less as the curable resin.

In addition, as illustrated in FIGS. 11 a and 11 b, the light emitting device 70 further includes side reflection layers 74 formed on opposite side surfaces of the light emitting device 70 so as to cover at least a region where the light emitting diode chip 72 is located. Including. The side reflection layer 74 is disposed on the side surface where the external terminal block 75 is not located, and serves to block light traveling in the side surface direction of the package body 78. Preferably, the side reflection layer 74 may be made of a resin containing a highly reflective powder such as TiO ₂ .

  In this embodiment, the external terminal block 75 has a structure in which the connecting portion 75b is exposed at two cut surfaces adjacent to each other. In this case, the side surface of the package main body 78 where both the connection portions 75 b of the external terminal block 75 are exposed can be provided as a mounting surface of the light emitting device 70. The light emitting device 70 having such a structure can be very usefully used as a side emission type LED package structure, and the structure of the external terminal block can be variously changed as necessary.

  For example, when using the external terminal block 65 in the form of a board as shown in FIG. 9, the external terminal block of the final individual light emitting device is arranged on three adjacent surfaces as shown in FIG. 11a. Can be exposed.

  In contrast, when the external terminal block 15 shown in FIG. 3 is used, the external terminal block of the final individual light emitting device is exposed to two adjacent side surfaces as shown in FIG. The surface where the connection part of the external terminal block is exposed to the same can be provided as the mounting surface. In particular, in this embodiment, since the electrode is not exposed on the side surface opposite to the surface used as the mounting surface, it is possible to prevent a shot problem due to the metal cover after setting.

  Unlike the first embodiment described above, the second embodiment of the present invention uses a resin filling process using a new vacuum suction. 13a to 13d are cross-sectional views showing a part of the manufacturing process of the light emitting device according to the second embodiment of the present invention (a manufacturing process of the chip array structure).

  First, as shown in FIG. 13 a, the external terminal block 85 and the light emitting diode chip 82 are arranged on the first sheet 81 a ′ coated with the curable material R.

  The light emitting diode chip 82 has an electrode forming surface on which all of the bipolar electrodes 82a and 82b are formed, and can include a resin layer 84 formed on the opposite surface and the side surface of the electrode forming surface. The resin layer 84 can include phosphor powder for wavelength conversion as necessary. In particular, the resin layer portion including the phosphor is provided as a light emitting surface of the light emitting diode chip 82 and can be provided on the surface opposite to the electrode forming surface.

  The external terminal block 85 employed in the present embodiment is a conductor block having a step structure. The step surface 85a of the external terminal block 85 is provided as a connection region connected to the electrodes 82a and 82b of the light emitting diode chip 82. The upper end surface 85b of the external terminal block 85 is provided as an external connection area of the final light emitting device. Therefore, the thickness of the external terminal block corresponds to the final height of the light emitting device.

  The arrangement form of the light emitting diode chip and the external terminal block in the present embodiment can be applied in the same manner as in the first embodiment. The description is omitted here.

  Next, as shown in FIG. 13b, the light emitting diode chip 82 and the external terminal block 85 arranged on the first sheet 81a are attached to the first sheet 81a by curing the adhesive substance R.

  This step can be obtained by applying curing conditions for the adhesive curable substance R after an appropriate pressure bonding step for the arranged light emitting diode chips 82 and the external terminal blocks 85. For example, when the adhesive curable substance R is an ultraviolet (UV) curable resin, desired attachment can be realized by irradiating ultraviolet rays after pressure bonding. In the present embodiment, an example in which the adhesive curable substance is separately applied is exemplified, but in the present invention, the first sheet 81a itself may be a curable resin.

  Next, as shown in FIG. 13c, the electrodes 82a and 82b of the light emitting diode chip 82 are connected to the adjacent external terminal block 85 by wires 86a and 86b, respectively.

  In the external terminal block 85 employed in the present embodiment, a connection region connected to the light emitting diode chip 82 can be provided as the step surface 85a. Since the stepped surface 85a of the external terminal block 85 is arranged facing upward along with the electrode forming surface, this wire bonding step can be easily realized. In the present embodiment, the external terminal block 85 itself is made of a conductive material. Therefore, the upper end surface 85b exposed in the final package can be electrically connected to the step surface 85a, and the upper end surface 85b of the external terminal block 85 is provided as an external connection region of the final light emitting device. Can do.

  Next, as shown in FIG. 13d, a spacer 87 is formed so as to surround the region where the light emitting diode chip 82 and the external terminal block 85 are arranged and has at least one inflow port (I, see FIG. 16). Then, the second sheet 81 b is attached on the spacer 87.

  The spacer 87 has a certain height and defines an internal space including the arrangement region together with the first sheet 81a and the second sheet 81b. The height of the spacer 87 corresponds to the final thickness of the light emitting device, and is substantially the same as the thickness of the external terminal block in this embodiment.

  As shown in FIG. 16, the internal space of the chip array structure has two inlets I for connecting the internal space to the outside at opposing side wall portions. The inlet I is used as a supply path for the resin surrounding the surface of the chip 82 in a subsequent process.

  As in this embodiment, by providing a plurality of inflow ports I on opposite sides, smoother inflow of resin can be ensured. However, the present invention is not limited to the number and position of the inlets I, and at least one inlet may be sufficient depending on the size of the arrangement region and the arrangement interval.

  The chip array structure shown in FIG. 13d can perform a resin filling process using the vacuum chamber shown in FIGS. 17a and 17b.

  17a and 17b are a side sectional view and an internal plan view showing an example of a vacuum chamber apparatus that can be used in the present embodiment, respectively.

  As shown in FIGS. 17 a and 17 b, the vacuum chamber apparatus includes a chamber 91, a vacuum valve 96 provided on one side of the chamber 91, and a stage provided inside the chamber 91. The internal space of the chamber 91 is depressurized through the vacuum valve 96, and the internal space of the chamber 91 can be converted into a vacuum or a desired depressurized state.

  The chamber 91 includes a resin storage unit 94 at the top of the chamber 91 so that the curable liquid resin 88 ′ can be dropped at a desired position. In the present embodiment, the resin storage portions 94 are preferably arranged in regions adjacent to the inlet I as shown in the drawing so that the inlet I of the spacer 87 is sealed.

  Hereinafter, an example of a chip component manufacturing process according to the second embodiment of the present invention will be described with reference to FIGS. 14A to 14D. It can be understood that the present embodiment is implemented using the vacuum chamber apparatus illustrated in FIGS. 17A and 17B, and FIGS. 14A and 14B are referred to for a more specific description of the following manufacturing process.

  First, as shown in FIG. 14 a, with the chip array structure disposed in the chamber 31, the internal space of the chamber 91 is changed to a vacuum or a reduced pressure state through the vacuum valve 96, and the curable liquid resin 88 ′ is replaced with the spacer 87. To the inlet I.

  Although it is preferable that the inside of the chamber 91 is brought into a vacuum state by this decompression process, the following suction of the resin can be ensured even in an appropriate decompression state. By such pressure reduction, not only the inside of the chamber 91 but also the internal space of the chip array structure can be converted to the same pressure state through the inflow port I.

  Preferably, the liquid resin 88 ′ can be defoamed by disposing the curable liquid resin 88 ′ in the chamber 91 in advance during the decompression process. Therefore, an additional defoaming step for the curable liquid resin 88 'can be omitted.

  Next, as shown in the drawing, the curable liquid resin 88 ′ is dripped in a sufficient amount so that the inflow port I is covered, and the inner space of the chip array structure is substantially sealed by the dripped resin. it can.

  Next, by releasing the vacuum or reduced pressure state using the vacuum valve 96, a chip array structure in which the internal space is filled with the curable liquid resin 88 'as shown in FIG. 14b can be obtained.

  In this release process, the internal pressure of the chamber 91 rises rapidly, but the internal space of the chip array structure is temporarily reduced in pressure or vacuum by the curable liquid resin 88 ′ that prevents the inlet I. Can be maintained. Accordingly, a high pressure difference is generated between the internal space of the chip array structure and the other external space (that is, the inside of the chamber 91), and such a pressure difference causes a curable liquid as indicated by an arrow in FIG. 14a. The resin 88 ′ can be introduced into the internal space of the chip array structure through the inflow port I to fill the internal space. In order to achieve effective filling of the resin 88 ′ through this step, the viscosity of the resin 88 ′, the position and form of the dropped resin, and the dropping amount can be adjusted.

  Next, as shown in FIG. 14C, the curable liquid resin 88 'filled in the internal space of the chip array structure is cured. Such a curing process can be performed by heat or ultraviolet irradiation depending on the type of resin. This step can be performed directly inside the chamber 91 if necessary, but can be performed through another equipment P outside the chamber 91 by removing the chip array structure. The cured resin 88 can be present on all surfaces except the first surface 82a of the chip 82 protected by the first sheet 81a.

  Finally, the first sheet 81a and the second sheet 81b are removed from the chip array structure, and the chip array structure is cut to a desired size so that a plurality of light emitting devices 80 are obtained.

  The first sheet 81a and the second sheet 81b can be removed from the chip array structure by an appropriate chemical / mechanical method known to those skilled in the art. After the removal of the first sheet 81a and the second sheet 81b, the chip array structure is cut using the dicing apparatus D.

  The manufacturing method according to the present embodiment is characterized in that the vacuum inflow of the curable liquid resin is used, and such a manufacturing method applies pressure to the chip array structure during the resin inflow (see FIG. 14a). Since the condition that the second sheet can be supported by the external terminal block is preferable, it can be more preferably applied when the height of the external terminal block corresponds to the height of the package.

  Of course, if the second sheet is made of a rigid material that does not generate distortion without a separate support structure even when the pressure is applied during resin vacuum inflow, the resin filling process by vacuum suction according to the present embodiment is illustrated in FIG. The embodiment adopting the low external terminal block shown in FIG. 1 and FIG. 8 can be advantageously applied.

  The light emitting device obtained from the present embodiment uses an external terminal block having the same height as the final light emitting device and having a step formed on the side surface. Accordingly, it is possible to provide a wire connection region for the light emitting diode chip on the stepped surface of the external terminal block and expose the upper end surface to provide the external connection region. Such a structure can be beneficially used as a top view light emitting package structure.

  15a and 15b are a plan view and a side sectional view showing a light emitting device that can be manufactured by the manufacturing method of FIGS.

  Referring to FIGS. 15a and 15b, the light emitting device 100 includes a package body 108 made of a curable resin. The package main body 108 has a first main surface 108a and a second main surface 108b that are positioned opposite to each other, and a side surface 108c that is positioned therebetween. The first main surface 108a, the second main surface 108b, and the side surface 108c of the package body 108 are provided as flat surfaces.

The package body 108 can be a transparent resin including a highly reflective powder having electrical insulation to reduce loss due to light absorption of other components. It is preferable to use TiO ₂ powder as the highly reflective powder.

  First and second external terminal blocks 105 are located at both ends of the package body 108. In the present embodiment, unlike the first embodiment, the first and second external terminal blocks 105 have the same height as the package body 108, but have a step formed on the side surface facing the light emitting diode chip 102. Has a structure. Further, the first and second external terminal blocks 105 may themselves be made of a conductive material. Accordingly, the step surface 105a providing a connection region connected to the light emitting diode chip 102 and the upper end surface 105b exposed on the second main surface 108b of the package body can be electrically connected to each other.

  In order to more easily describe the structure of the light emitting device 100 according to the present embodiment, the package main body 108 includes a first main surface 108a and a second main surface 108A, with reference to the surface of the light emitting diode chip 102 where the electrodes 102a and 102b are formed. It can be understood by dividing the first level region L1 and the second level region L2 including the surface 108b.

  The light emitting diode chip 102 is located between the first and second external terminal blocks 105 in the first level region L1, and the electrode formation surface on which the first electrode 102a and the second electrode 102b are formed is the second level region L2. It is arranged to face. The light emitting diode chip 102 can be connected to the stepped surfaces 105a of the first and second external terminal blocks 105 through wires 106a and 106b, respectively. Also, the portions where the wires 106a and 106b exist can be protected by being positioned in the second level region L2 of the package body 108.

  In the light emitting device according to the present embodiment, since the upper end surface 105b of the external terminal block exposed on the second main surface 108b of the package body 108 is provided as an external connection region, the package body 108 is bonded while being bonded by the surface mounting method. The second main surface 108b can be provided as a mounting surface. The light emitting device 100 having such a structure can be used very effectively as a top emission LED package structure.

  In this embodiment, the external terminal block 105 has a second main surface 108b opposite to the light emission surface (first main surface 108a), and a structural example for providing a connection region that can be connected to an external circuit. It is. In order to realize such a structure, as described above, the external terminal block 105 has a step on the side surface facing the light emitting diode chip 102 while having the same height as the package body 108 (this is the light emitting diode chip). Providing a connection region for 102).

  The structure of the external terminal block can be variously modified and implemented. 18a and 18b are an upper plan view and a side sectional view showing an external terminal block that can be employed in the second embodiment of the present invention.

  The external terminal block 115 shown in FIGS. 18a and 18b is an example showing a structure that is divided into ¼ according to a dotted line and used as an external terminal in an individual package.

  The external terminal block 115 includes an insulating block 115a having a height substantially the same as a desired package body and having a step formed so as to face the light emitting diode chip. The insulating block body 115a can be made of a porous ceramic body having a large number of void structures h in order to strengthen the binding force with the package body made of resin. As described above, in order to reinforce such a binding force, the porosity constituting the porous structure is preferably about 10 to 60%, and the void diameter is preferably about 0.1 to 1.3 μm.

  The stepped surface of the external terminal block 115 is located inside the package body and is provided as a connection region with the electrode of the light emitting diode chip. The upper end surface of the external terminal block 115 is exposed to the mounting surface of the package body and is connected to the external circuit. Provides an area that is connected to. In order to realize such an external terminal structure, an electrode layer 115b is formed on the upper end surface of the external terminal block 115 according to the stepped surface, and electrically connects the LED chip and the upper surface exposed to the outside. be able to.

  Thus, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims and does not depart from the technical idea of the present invention described in the claims. It will be apparent to those skilled in the art that various forms of substitution, modification, and alteration are possible within the scope.

It is sectional drawing according to process which shows a one part process (manufacturing process of a chip array structure) among the manufacturing processes of the light-emitting device by 1st Embodiment of this invention. It is sectional drawing according to process which shows a one part process (manufacturing process of a chip array structure) among the manufacturing processes of the light-emitting device by 1st Embodiment of this invention. It is sectional drawing according to process which shows a one part process (manufacturing process of a chip array structure) among the manufacturing processes of the light-emitting device by 1st Embodiment of this invention. It is sectional drawing according to process which shows a one part process (manufacturing process of a chip array structure) among the manufacturing processes of the light-emitting device by 1st Embodiment of this invention. It is sectional drawing according to process which shows the remaining partial processes (manufacturing process of an individual light-emitting device) among the manufacturing processes of the light-emitting device by 1st Embodiment of this invention. It is sectional drawing according to process which shows the remaining partial processes (manufacturing process of an individual light-emitting device) among the manufacturing processes of the light-emitting device by 1st Embodiment of this invention. It is sectional drawing according to process which shows the remaining partial processes (manufacturing process of an individual light-emitting device) among the manufacturing processes of the light-emitting device by 1st Embodiment of this invention. It is sectional drawing according to process which shows the remaining partial processes (manufacturing process of an individual light-emitting device) among the manufacturing processes of the light-emitting device by 1st Embodiment of this invention. 1B is a plan view of the arrangement shown in FIG. It is a sectional side view of the vacuum chamber which can be used by this invention. It is an internal top view of the vacuum chamber which can be used by this invention. It is a top view which shows an example of the light-emitting device by this invention. It is a sectional side view which shows an example of the light-emitting device by this invention. It is a top view which shows the other example of the light-emitting device by this invention. It is a sectional side view which shows the other example of the light-emitting device by this invention. It is a perspective view which shows the block for external terminals employable for 1st Embodiment of this invention. It is a perspective view which shows the block for external terminals employable for 1st Embodiment of this invention. It is sectional drawing according to process which shows a one part process (manufacturing process of a chip array structure) among the manufacturing processes of the light-emitting device by the application example of 1st Embodiment of this invention. It is sectional drawing according to process which shows a one part process (manufacturing process of a chip array structure) among the manufacturing processes of the light-emitting device by the application example of 1st Embodiment of this invention. It is sectional drawing according to process which shows a one part process (manufacturing process of a chip array structure) among the manufacturing processes of the light-emitting device by the application example of 1st Embodiment of this invention. It is sectional drawing according to process which shows a one part process (manufacturing process of a chip array structure) among the manufacturing processes of the light-emitting device by the application example of 1st Embodiment of this invention. It is the top view which looked at the arrangement | sequence form illustrated by FIG. 8a from the upper part. It is sectional drawing according to process which shows the remaining partial process (manufacturing process of an individual light-emitting device) among the manufacturing processes of the light-emitting device by the application example of 1st Embodiment of this invention. It is sectional drawing according to process which shows the remaining partial process (manufacturing process of an individual light-emitting device) among the manufacturing processes of the light-emitting device by the application example of 1st Embodiment of this invention. It is sectional drawing according to process which shows the remaining partial process (manufacturing process of an individual light-emitting device) among the manufacturing processes of the light-emitting device by the application example of 1st Embodiment of this invention. It is sectional drawing according to process which shows the remaining partial process (manufacturing process of an individual light-emitting device) among the manufacturing processes of the light-emitting device by the application example of 1st Embodiment of this invention. It is sectional drawing according to process which shows the remaining partial process (manufacturing process of an individual light-emitting device) among the manufacturing processes of the light-emitting device by the application example of 1st Embodiment of this invention. It is a top view which shows the 1st example of the light-emitting device by this invention. It is a sectional side view which shows the 1st example of the light-emitting device by this invention. It is a top view which shows the 2nd example of the light-emitting device by this invention. It is sectional drawing according to process which shows a one part process (manufacturing process of a chip array structure) among the manufacturing processes of the light-emitting device by 2nd Embodiment of this invention. It is sectional drawing according to process which shows a one part process (manufacturing process of a chip array structure) among the manufacturing processes of the light-emitting device by 2nd Embodiment of this invention. It is sectional drawing according to process which shows a one part process (manufacturing process of a chip array structure) among the manufacturing processes of the light-emitting device by 2nd Embodiment of this invention. It is sectional drawing according to process which shows a one part process (manufacturing process of a chip array structure) among the manufacturing processes of the light-emitting device by 2nd Embodiment of this invention. It is sectional drawing according to process which shows the remaining one part process (manufacturing process of an individual light-emitting device) among the manufacturing processes of the light-emitting device by 2nd Embodiment of this invention. It is sectional drawing according to process which shows the remaining one part process (manufacturing process of an individual light-emitting device) among the manufacturing processes of the light-emitting device by 2nd Embodiment of this invention. It is sectional drawing according to process which shows the remaining one part process (manufacturing process of an individual light-emitting device) among the manufacturing processes of the light-emitting device by 2nd Embodiment of this invention. It is sectional drawing according to process which shows the remaining one part process (manufacturing process of an individual light-emitting device) among the manufacturing processes of the light-emitting device by 2nd Embodiment of this invention. FIG. 13 is a plan view illustrating the light emitting device illustrated in FIGS. FIG. 13 is a side cross-sectional view illustrating the light emitting device illustrated in FIGS. It is the top view which looked at the arrangement form illustrated in Drawing 13d from the upper part. It is a sectional side view of the vacuum chamber which can be used by this invention. It is an internal top view of the vacuum chamber which can be used by this invention. It is an upper top view which shows the block for external terminals employable for 2nd Embodiment of this invention. It is a sectional side view which shows the block for external terminals employable for 2nd Embodiment of this invention.

10, 20, 30, 60, 70, 80, 100 Light-emitting devices 11a, 11b, 61a, 61b, 81a, 81b Sheets 12a, 12b, 22a, 22b, 32a, 32b, 62a, 62b, 72a, 72b, 82a, 82b , 102a, 102b Electrodes 12, 22, 32, 62, 72, 82, 102 Light emitting diode chip 14 Resin layers 15, 25, 35, 45, 55, 65, 75, 85, 105, 115 External terminal blocks 15a, 25a , 45a, 55a, 65a, 75a, 115a Insulating block bodies 15b, 25b, 35b, 45b, 55b, 65b, 75b Connection portions 16a, 16b, 26a, 26b, 36a, 36b, 66a, 66b, 76a, 76b, 86a , 86b, 106a, 106b Wire 17, 67, 87 Spacer 18, 68 , 88 Curable liquid resin 28, 38, 78, 108 Package body 31, 91 Chamber 33 Stage 34, 94 Resin storage unit 36, 96 Vacuum valve 37 Zener diode 39 Radiator 46 Light absorption prevention layer 69, 79 Phosphor layer 74 Side reflective layer 84 Resin layer

Claims (23)

A package main body having a first main surface and a second main surface and a plurality of side surfaces located between the first main surface and a second main surface, and made of a curable resin;
The first and second surfaces are disposed at both ends of the package body, and have a plurality of side surfaces located therebetween, at least the first surface being coplanar with the first main surface of the package body, At least one side surface of the plurality of side surfaces is coplanar with one side surface of the package body and has a portion exposed to the outside, and is connected to the exposed portion at a portion located inside the package body. First and second external terminal blocks having connecting portions;
The package body has an electrode forming surface located between the first and second external terminal blocks and formed with first and second electrodes, and the electrode forming surface is a second main surface of the package body. A light emitting diode chip that is disposed so as to face the surface opposite to the electrode forming surface and is coplanar with the first main surface of the package body;
A wire disposed in the package body and electrically connecting the first electrode and the second electrode of the light emitting diode chip to the connection portion of the first external terminal block and the second external terminal block, respectively; A light emitting device characterized.   The light emitting device according to claim 1, wherein the light emitting diode chip includes a transparent resin layer formed on at least a side surface.   The light emitting device according to claim 1, wherein the light emitting diode chip includes a transparent resin layer formed on a side surface and a surface opposite to the electrode forming surface.   4. The light emitting device according to claim 3, wherein at least a portion of the transparent resin layer formed on a surface opposite to the electrode forming surface includes phosphor powder.   5. The light emitting device according to claim 1, further comprising a phosphor layer formed in at least the light emitting diode chip region of the first main surface of the package body.   6. The light emitting device according to claim 1, wherein the curable resin constituting the package body is a resin having a refractive index of 1.5 or less.   The display device according to claim 1, further comprising a side reflection layer made of a resin including a highly reflective powder, which is formed on opposite side surfaces of the package body so as to cover a region where the light emitting diode chip is located. The light emitting device according to any one of 1 to 6. The second surfaces of the first and second external terminal blocks are located inside the package body, and a part of the side surfaces is exposed to the side surface of the package body.
The connection portion according to claim 1, wherein the connection portion is formed to be connected to the exposed portion from the second surface of the first and second external terminal blocks. The light-emitting device of description. The first and second external terminal blocks each have a first surface exposed on the first main surface of the package body, a second surface opposite to the first surface, and an insulating block having a side surface therebetween. Including the body,
The connection portions of the first and second external terminal blocks pass through the first and second surfaces of the insulating block body, respectively, and are formed to be exposed from exposed portions of the side surfaces. The light emitting device according to claim 1, further comprising a via hole.   10. The light emitting device according to claim 1, wherein two adjacent side surfaces of the first and second external terminal blocks are exposed to two adjacent side surfaces of the package body, respectively. apparatus.   10. The light emitting device according to claim 1, wherein three adjacent side surfaces of the first and second external terminal blocks are respectively exposed to three adjacent side surfaces of the package body. 11. apparatus.   The connection part of the first and second external terminal blocks further includes an electrode layer formed on the second surface of the insulating block body and connected to the conductive via hole. Light-emitting device.   The first and second external terminal blocks are formed on the first surface of the insulating block body so as to cover a metal layer formed on the first surface of the insulating block body and connected to the conductive via hole. The light-emitting device according to claim 9, further comprising a light absorption prevention layer made of a resin containing a highly reflective powder.   The light emitting device according to claim 9, wherein the insulating block body is a ceramic block body or a PCB block.   15. The light emitting device according to claim 14, wherein the ceramic block body has a porous structure.   16. The light emitting device according to claim 15, wherein the porosity of the porous structure is 10 to 60%, and the void diameter is 0.1 to 1.3 [mu] m. The first and second external terminal blocks have a step portion formed on a side surface facing the light emitting diode chip, and the second surface is positioned so as to be exposed to the second main surface of the package body. ,
2. The light emitting device according to claim 1, wherein the connection portion is formed to be connected to the exposed second surface from a step portion of the first and second external terminal blocks.   The light emitting device according to claim 17, wherein the first and second external terminal blocks are made of a material having electrical conductivity provided as a connection part.   The light emitting device according to claim 1, wherein the curable resin includes a highly reflective powder having electrical insulation. The light emitting device according to claim 19, wherein the highly reflective powder is TiO ₂ powder.   It is located in the package body and is attached to one of the first surface of the first and second external terminal block bodies and the electrode forming surface of the light emitting diode chip, and is electrically connected to the connecting portion and the first or second electrode. The light-emitting device according to claim 1, further comprising a zener diode connected in an electrically connected manner.   The light emitting device according to any one of claims 1 to 21, further comprising a heat dissipating body located in the package body and attached on the light emitting diode chip.   The light emitting device according to any one of claims 1 to 22, wherein the first and second main surfaces and side surfaces of the package body are flat surfaces.

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