JP2011130347A - Electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus that enables high-density packaging. <P>SOLUTION: The electronic apparatus includes a substrate 19 on which an electronic component 3 is mounted, a connector 1 mounted on a first surface of the substrate 19 with an insert hole 1c inclined toward the in-plane direction of the substrate 19 and a bottom 1e made closer to the substrate 19 than an entrance 1d of the insert hole 1c, a barrel 7 disposed higher than the position of the entrance 1d of the insert hole 1c of the connector 1 with reference to the first surface of the substrate 19 in a first direction perpendicular to the first surface, and a flexible printed wiring board 2 that is extended from the barrel 7 to the substrate 19 and is inserted from the entrance 1d of the insert hole 1c to the bottom 1e. A distance between the entrance 1d of the insert hole 1c and the closest portion of the barrel 7 to the substrate 19 is shorter than a distance between the entrance 1d of the insert hole 1c and the bottom 1e. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic device capable of high-density mounting.

  Imaging devices using a solid-state imaging device such as a CCD or CMOS as an imaging device that converts a subject image into an electrical signal are widely used. In recent years, in an imaging apparatus such as a digital camera, the camera body has been downsized and thinned while maintaining high functionality and high performance, such as miniaturization of an optical system and a circuit element substrate and a reduction in the height of a circuit element. Yes. Conventionally, a connector provided on a circuit element board has been configured such that a flexible printed board is inserted horizontally or vertically with respect to the circuit element board.

  On the other hand, Patent Document 1 discloses an FPC / FFC connector in which a contact connected to a lead is inclined with respect to a printed board, and an insertion hole and a contact are held diagonally upward and held by a housing.

JP-A-8-130068

  However, a connector configured to insert a flexible printed circuit board horizontally with respect to the circuit element board is difficult to mount tall electronic components on the circuit element board, and the density of the circuit element board is increased. I can't plan. In addition, a connector configured to insert a flexible printed board perpendicularly to a circuit element board has good workability, but the height of the connector itself is high, and thinning of an electronic device is hindered. Thus, the layout of the connector provided on the circuit element substrate hinders the miniaturization of the circuit element substrate.

  Further, Patent Document 1 does not disclose a circuit element substrate provided with a connector and a configuration around the circuit element substrate.

  Therefore, the present invention provides an electronic device capable of high-density mounting.

  An electronic device according to one aspect of the present invention includes a board on which electronic components are mounted, and an insertion hole provided obliquely with respect to the in-plane direction of the board, the bottom of the insertion hole having the bottom. A connector mounted on a first surface of the substrate so as to be close to the substrate, and a first direction perpendicular to the first surface with respect to the first surface of the substrate; A structure disposed at a position higher than the position of the entrance portion of the insertion hole, and a flexible printed circuit board extending from the structure toward the substrate and inserted from the entrance portion of the insertion hole to the bottom portion The distance between the entrance portion of the insertion hole and the portion of the structure closest to the substrate is smaller than the distance between the entrance portion and the bottom portion of the insertion hole.

  Other objects and features of the present invention are illustrated in the following examples.

  According to the present invention, it is possible to provide an electronic device capable of high-density mounting.

1 is a schematic diagram of a main part of an electronic device according to a first embodiment. FIG. 10 is a schematic diagram of a main part of an electronic device according to a second embodiment. FIG. 10 is a main part configuration diagram of an electronic device according to a third embodiment. It is a schematic block diagram of the electronic device in a present Example.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each figure, the same members are denoted by the same reference numerals, and redundant description is omitted.

  First, with reference to FIG. 4, a schematic configuration of the electronic apparatus in the present embodiment will be described. FIG. 4 is a schematic configuration diagram of a digital camera 100 (electronic device) as an imaging apparatus in the present embodiment. 4A is a front view of the digital camera 100, FIG. 4B is a rear view thereof, and FIG. 4C is a perspective view of the internal structure when the digital camera 100 is viewed from the bottom.

  As shown in FIG. 4A, a lens barrel 7 is provided in the central portion on the right side of the front surface of the housing of the digital camera 100. The lens barrel 7 holds a lens. On the top surface of the housing of the digital camera 100, a shutter button 61 is provided at the left end when viewed from the front of the housing. A flash window 9 is provided on the upper right side of the front of the housing. The flash window 9 emits flash light used for night photography. Further, a tripod screw 50 for fixing the tripod is provided on the lower surface of the housing. As shown in FIG. 4B, an LCD (Liquid Crystal Display) that functions as the image display unit 28 is provided on the rear surface of the housing of the digital camera 100.

  As shown in FIG. 4C, the battery storage unit 25 and the substrate 19 (main substrate) are provided at the left end inside the housing of the digital camera 100. The battery storage unit 25 stores a battery that is a power source of the digital camera 100. The board 19 mounts a video engine for processing a video signal. A large-capacity main capacitor 12 is disposed at the right end inside the housing of the digital camera 100. The main capacitor 12 is used in a booster circuit for obtaining a high voltage necessary for the operation of a flash for night photography. In addition, an imaging unit 22 in which an imaging element that forms a subject image is mounted is provided inside the housing of the digital camera 100. The light receiving surface of the image sensor is disposed at a position where the lens held by the lens barrel 7 forms a subject image.

  Next, a configuration of main parts of the electronic device according to the first embodiment of the present invention will be described. FIG. 1 is a schematic diagram of a main part of a digital camera (electronic device) in the present embodiment. FIG. 1 is a cross-sectional view taken along a line AA in FIG. 4B, and shows only components necessary for the description. The substrate 19 mounts the electronic component 3 on the first surface (the upper surface of the substrate 19 in FIG. 1). Although only one electronic component 3 is shown in FIG. 1, a plurality of electronic components 3 may be mounted. The connector 1 includes an insertion hole 1c provided obliquely with respect to the in-plane direction of the substrate 19 (direction parallel to the substrate surface). Such a connector 1 is mounted on the first surface of the substrate 19 such that the bottom portion 1e is closer to the substrate 19 than the inlet portion 1d of the insertion hole 1c.

  An imaging unit 22 is mounted on a flexible printed circuit board 2 (FPC: Flexible Printed Circuits). The flexible printed circuit board 2 extends from the lens barrel 7 as a structure toward the substrate 19 and is inserted from the lens barrel 7 into the bottom 1 e through the inlet 1 d of the insertion hole 1 c of the connector 1 mounted on the substrate 19. Is done. Thus, the flexible printed circuit board 2 is inserted into the insertion hole 1c of the connector 1 at an angle (from the upper left to the lower right in FIG. 1).

  The connector 1 mechanically locks or releases the flexible printed circuit board 2 and the connector 1 by operating the flip 1a. When the connector 1 and the flexible printed circuit board 2 are mechanically locked by the flip 1a, the flexible printed circuit board 2 comes into contact with the connector terminal portion 1b, and electrical connection therebetween is possible.

  The lens barrel 7 as a structure is inserted into the connector 1 in a first direction (upward direction in FIG. 1) perpendicular to the first surface with reference to the first surface (connector mounting surface) of the substrate 19. It arrange | positions in the position higher than the position of the entrance part 1d of the hole 1c. That is, the lens barrel 7 is arranged so that its highest position is located higher than the inlet portion 1 d of the connector 1. As shown in FIG. 1, the imaging unit 22 mounted on the flexible printed circuit board 2 is disposed on the upper side of the lens barrel 7 as a structure.

  In this embodiment, the height of the lens barrel 7 (structure) with respect to the first surface (connector mounting surface) of the substrate 19 is the insertion height V of the flexible printed circuit board 2 in the connector 1 (the first surface of the substrate 19). 1) and the distance between the inlet portion 1d of the insertion hole 1c. For this reason, in this embodiment, the flexible printed circuit board 2 is arranged on the circuit board 19 with the connector 1 that can be inserted and removed obliquely with respect to the in-plane direction of the circuit board 19 facing the lens barrel 7. As a result, the flexible printed circuit board 2 is gently bent, and the burden applied to the flexible printed circuit board 2 is extremely small.

  Further, the electronic component 3 higher than the connector 1 can be arranged on the insertion side of the flexible printed circuit board 2 of the connector 1. That is, even when the height of the electronic component 3 in the first direction is higher than the entrance portion 1d of the insertion hole 1c of the connector 1 with respect to the first surface of the substrate 19, such electronic component 3 is connected to the connector 1. And the lens barrel 7 as the structure can be provided. Thus, by using the connector 1 in which the flexible printed board 2 can be inserted obliquely, the area of the board 19 can be effectively utilized.

  In the present embodiment, the distance H2 between the connector 1 and the lens barrel 7 (the distance between the inlet 1d of the insertion hole 1c and the portion of the lens barrel 7 closest to the substrate 19) is the flexible printed circuit board 2. Insertion stroke H1 (the distance between the inlet 1d and the bottom 1e of the connector 1). In the present embodiment, by employing the connector 1 that allows the flexible printed circuit board 2 to be inserted obliquely, interference with the lens barrel 7 when the flexible printed circuit board 2 is inserted can be reduced. For this reason, the flexible printed circuit board can be inserted into the connector 1 even at a smaller distance H2 in the same insertion stroke H1 as compared with the conventional case where a connector configured to horizontally insert the flexible printed circuit board is used. Is possible.

  Therefore, according to the configuration of the present embodiment, the degree of freedom in the arrangement of the connector increases, and the connector can be arranged at an appropriate position with respect to the electric circuit. As a result, an electronic device capable of high-density mounting can be provided.

  Next, with reference to FIG. 2, the principal part structure of the electronic device in Example 2 of this invention is demonstrated. FIG. 2 is a schematic diagram of a main part of a digital camera (electronic device) in the present embodiment.

  As shown in FIG. 2, in this embodiment, the imaging unit 22 is arranged in a direction (second direction) opposite to the direction (first direction) of the connector 1 mounted on the substrate 19. Has been. Therefore, the flexible printed circuit board 2 inserted into the connector 1 and picked up by the imaging unit 22 passes between the circuit board 19 and the lens barrel 7 (when viewed in the sectional view of FIG. As provided). Since the other configuration is the same as that of the first embodiment, description thereof is omitted here.

  According to the configuration of the present embodiment, even when the distance H2 between the connector 1 and the lens barrel 7 is smaller than the insertion stroke H1 of the flexible printed board 2, the flexible printed board 2 can be loosened naturally. In addition, the flexible printed circuit board 2 can be easily inserted into the connector 1 by pinching the slack portion with tweezers. As a result, an electronic device capable of high-density mounting can be provided.

  Next, with reference to FIG. 3, the principal part structure of the electronic device in Example 3 of this invention is demonstrated. FIG. 3 is a schematic diagram of a main part of a digital camera (electronic device) in the present embodiment. In the first and second embodiments, the structure is the lens barrel 7. However, this embodiment is an example in which a connector (another connector) that has a predetermined height and is adjacent is a structure.

  As shown in FIG. 3, a plurality of connectors 10 a to 10 h that have the same shape and can be inserted obliquely are arranged in a row on the substrate 29. Electronic components 30a to 30h are arranged between adjacent connectors. The plurality of connectors 10a to 10h are configured such that the flexible printed boards 20a to 20h can be inserted obliquely. In the present embodiment, the distance H3 between adjacent connectors is smaller than the connector insertion stroke H1 described in the first and second embodiments, and the plurality of connectors 10a to 10h are arranged in high density.

  Thus, according to the configuration of the present embodiment, the plurality of connectors 10a to 10h can be arranged at the distance H3 smaller than the insertion stroke H1 without causing an excessive load on the flexible printed boards 20a to 20h. For this reason, the freedom degree of the layout of the connectors 10a-10h on the board | substrate 29 becomes large. As a result, an electronic device capable of high-density mounting can be provided.

  The embodiment of the present invention has been specifically described above. However, the present invention is not limited to the matters described as the above-described embodiments, and can be appropriately changed without departing from the technical idea of the present invention.

1: Connector 2: Flexible printed circuit board 3: Electronic component 7: Lens barrel 19: Board 100: Digital camera (electronic device)

Claims (5)

A board on which electronic components are mounted;
A connector mounted on the first surface of the board, the insertion hole being provided obliquely with respect to the in-plane direction of the board, the bottom of the insertion hole being closer to the board than the inlet portion; ,
A structure disposed at a position higher than the position of the inlet portion of the insertion hole of the connector in a first direction perpendicular to the first surface with respect to the first surface of the substrate;
A flexible printed circuit board extending from the structure toward the substrate and inserted from the entrance portion of the insertion hole to the bottom portion;
The distance between the entrance portion of the insertion hole and the portion of the structure closest to the substrate is smaller than the distance between the entrance portion and the bottom portion of the insertion hole. machine. The electronic component mounted on the substrate is located between the connector and the structure,
The height of the electronic component is higher than the entrance portion of the insertion hole of the connector in the first direction perpendicular to the first surface with respect to the first surface of the substrate. The electronic device according to claim 1.   The electronic apparatus according to claim 1, wherein the flexible printed circuit board is inserted into the insertion hole of the connector through between the substrate and the structure.   The electronic device according to claim 1, wherein the structure is a lens barrel.   The electronic device according to claim 1, wherein the structural body is another connector different from the connector.