JP2010263020A - Optical device module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical device module allowing a light reception surface of a camera unit to be reduced and miniaturized, and manufacturable inexpensively. <P>SOLUTION: A solid-state imaging device 1 as one form of this optical device module includes a substrate 10 having a front face and a back face, and a solid-state imaging element 20 laminated on the front face side of the substrate 10. On the substrate 10, holes 11 penetrating in the thickness direction are formed. The solid-state imaging element 20 includes an imaging circuit 21 on a surface of the solid-state imaging element 20 on the side opposite to a surface facing the substrate 10, and is formed with holes 22 reaching the imaging circuit 21 from the surface facing the substrate 10. The solid-state imaging device 1 further includes electrodes 12, 23 for extracting electric signals output from the imaging circuit 21 to the back face side of the substrate 10 through the holes 11, 22. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an optical device, and more particularly to a compact optical device module.

  2. Description of the Related Art In recent years, the development of compact and high-pixel optical elements used in video scopes, movie cameras, digital still cameras, mobile phone cameras, and the like has been advanced. In addition to this, these optical devices are required to be smaller as the equipment to be incorporated becomes smaller.

  As an example of the optical device described above, a solid-state imaging device (imaging module) using a solid-state imaging device such as a CCD (charge coupled imaging device) as a light receiving device has been developed. These solid-state imaging devices are often incorporated into small camera units. These solid-state imaging devices are used by being incorporated into a housing at the tip of a small camera unit.

  In particular, a small camera unit used in a video scope is required to have a thin outer diameter at the tip in order to enable insertion observation in a slight gap. From such a viewpoint, it is important to reduce the size of the solid-state imaging device or the area of the light receiving surface. In order to realize a low-priced small camera unit, it is also important to improve the assembly work efficiency of the solid-state imaging device and reduce the manufacturing cost.

  2. Description of the Related Art Conventionally, as a solid-state imaging device that is miniaturized, a configuration in which a lead such as a flexible substrate on which an IC or a chip part is mounted is bent and connected to a bump on a specific side of the solid-state imaging device (for example, known) Patent Document 1).

  As shown in FIG. 3, the solid-state imaging device 100 disclosed in Patent Document 1 connects a flexible substrate 102 on which a chip component 101 is mounted to a bonding pad unit 104 provided on the light-receiving surface side of the solid-state imaging element 103. is doing.

  In addition, as another conventional example of a solid-state image pickup device that has been miniaturized, a solid-state image pickup element is connected to a terminal at the bottom of a flexible substrate that is bent into a box shape and an electronic component is mounted on the inner surface of the box shape. A solid-state imaging device having a connected configuration is known (for example, see Patent Document 2). In the solid-state imaging device disclosed in Patent Document 2, the flexible substrate is folded into a box shape having a rectangular shape on each surface, and electronic components are mounted on the inner surface side of the box-shaped substrate. The tip portion can be reduced in diameter and size.

JP 11-271646 A JP 2000-210252 A

  A small camera unit used for a video scope is used for an internal confirmation by insertion into a narrow space where direct viewing is impossible. Therefore, in order to reduce the tube of the camera unit attached to the tip, it is necessary to reduce the light receiving surface.

  In the case of a camera unit using a plurality of solid-state imaging devices disclosed in Patent Documents 1 and 2, the structure of the camera unit itself becomes large because it is necessary to provide an external connection portion on the light receiving surface.

  In addition, Patent Documents 1 and 2 disclose a technique for making these integrated ones compact, but a technique for reducing a light receiving surface of a solid-state imaging device incorporated in a lens barrel has been disclosed so far. It has not been.

  The present invention has been made in view of such a point, and an object of the present invention is to provide an optical device module that can be manufactured at a reduced size and at a low cost with a reduced light receiving surface of a camera unit.

  An optical device module according to an aspect of the present invention includes a substrate having a front surface and a back surface, and a solid-state imaging element stacked on the front surface side of the substrate. A first hole penetrating in the thickness direction is formed in the substrate. The solid-state imaging device includes an imaging circuit on a surface opposite to the surface facing the substrate of the solid-state imaging device, and a second hole reaching the imaging circuit from the surface facing the substrate is formed. . The optical device module further includes output wiring for extracting an electrical signal output from the imaging circuit to the back side of the substrate through the first and second holes.

  As in the above configuration, the electrical signal output from the imaging circuit is taken out to the back side of the substrate via the hole provided in the solid-state imaging device and the substrate, so that the space for connecting the bonding pad is received. There is no need to provide it on the surface. As a result, the optical device module can be reduced in size as a whole.

  The output wiring may include a cable that is flexible and is inserted into the first hole and electrically connected to the imaging circuit. Accordingly, the cable can be bent into an arbitrary shape, and the cable can be prevented from protruding to the outside of the substrate. As a result, the optical device module can be reduced in size as a whole.

  Furthermore, the optical device module may include a flexible substrate stacked on the back surface side of the substrate, and an electronic component disposed on the flexible substrate and electrically connected to the output wiring.

  As described above, by electrically connecting the substrate and the flexible substrate, the electric signal output from the imaging circuit can be taken out only by connecting the cable to the flexible substrate. As a result, the number of connection lines and connection locations can be reduced, the apparatus can be miniaturized, and the cost can be reduced.

  The flexible substrate includes a first flexible substrate along a back surface of the substrate, a second flexible substrate that holds the electronic component, and a bent portion that connects the first and second flexible substrates to each other. May be provided. Thereby, the area | region which hold | maintains an electronic component can fully be ensured.

  The flexible substrate is a film carrier tape formed by laminating a flexible insulating film and a metal wiring formed on the insulating film and electrically connecting the output wiring and the electronic component. . And the said insulating film may be selectively removed in the said bending part. Thereby, bending of a flexible substrate becomes easy.

  Furthermore, the optical device module may include a cable that has flexibility and is electrically connected to the electronic component. Accordingly, the cable can be bent into an arbitrary shape, and the cable can be prevented from protruding to the outside of the substrate. As a result, the optical device module can be reduced in size as a whole.

  Furthermore, the optical device module may include a transparent protective member that is stacked on the solid-state imaging device so as to cover the imaging circuit. Thereby, it can prevent that dust adheres to a light-receiving surface, or a damage | wound is attached.

  The solid-state imaging device and the transparent protective member may be bonded with an adhesive that is transparent and has a lower refractive index than the transparent protective member. Thereby, the light from the outside can be efficiently collected on the light receiving surface.

  Furthermore, the optical device module may include a reinforcing member for reinforcing electrical connection on at least one of the front surface and the back surface of the substrate. Thereby, a highly reliable optical device module can be obtained.

  According to the present invention, since the electric signal output from the imaging circuit is taken out to the back side of the substrate via the hole provided in the solid-state imaging device and the substrate, the optical device module can be reduced in size as a whole. .

FIG. 2 is a schematic perspective view and a schematic side view of the solid-state imaging device according to the first embodiment. 6 is a schematic perspective view and a schematic side view of a solid-state imaging device according to Embodiment 2. FIG. It is a figure which shows the structure of the conventional solid-state imaging device.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of brevity.

(Embodiment 1)
In the first embodiment, a solid-state imaging apparatus (optical device module) using a solid-state imaging element as an optical element will be described.

  1A and 1B are a schematic perspective view and a side view of the solid-state imaging device 1 according to the first embodiment. The solid-state imaging device 1 according to the first embodiment mainly includes a substrate (hereinafter referred to as “substrate”) 10, a solid-state imaging device 20, a transparent protective member 30, and a cable 40.

  The substrate 10 is formed with a hole 11 penetrating in the thickness direction. An electrode 12 is held in the hole 11. Furthermore, the connection terminal part 13 exposed to the surface (left side surface of FIG. 1B) of the substrate 10 is formed at one end of the electrode 12. The left side surface of the substrate 10 shown in FIG. 1B is referred to as “front surface”, and the right side surface is referred to as “back surface”.

  An imaging circuit 21 is formed on one surface of the solid-state imaging device 20 (the left surface in FIG. 1B, hereinafter referred to as “light receiving surface”). The imaging circuit 21 includes a plurality of photodiodes (not shown) arranged on a matrix and peripheral wiring (not shown) that inputs and outputs signals between the plurality of photodiodes. The solid-state imaging device 20 is typically a CCD (Charge Coupled Device).

  The solid-state imaging device 20 has a hole 22 that reaches the imaging circuit 21 from the back surface (the surface facing the substrate 10). Further, an electrode 23 is held inside the hole 22. One end of the electrode 23 is electrically connected to the imaging circuit 21, and a connection terminal portion 24 is formed at the other end. The connection terminal portion 24 is exposed on the surface facing the substrate 10 of the solid-state imaging device 20 (the right surface in FIG. 1B).

  The solid-state imaging device 20 is laminated on the surface of the substrate 10 (the left surface in FIG. 1B). The connection terminal portion 13 of the substrate 10 and the connection terminal portion 24 of the solid-state imaging device 20 are electrically connected via bumps (not shown).

  The transparent protective member 30 is stacked on the solid-state imaging device 20 so as to cover the imaging circuit 21. The transparent protective member 30 guides light from the outside to the image pickup circuit 21 and prevents dust from being attached to the image pickup circuit 21 or being damaged. As a material of the transparent protective member 30, for example, Terex (registered trademark) glass, Pyrex (registered trademark) glass, or quartz can be used.

  Further, the solid-state imaging device 20 and the transparent protective member 30 are bonded with a transparent adhesive 31. As the adhesive 31, for example, an ultraviolet curable or heat curable material such as an acrylic resin, a polyimide resin, or an epoxy resin having a refractive index smaller than that of the transparent protective member 30 can be used.

  The cable 40 is composed of, for example, a flexible conductor and an insulator that covers the conductor. Specifically, the cable 40 of the first embodiment is an insulated wire or shielded wire using copper for metal wiring. Thus, by adopting the cable 40 having flexibility, it becomes easy to bend into an arbitrary shape.

  The cable 40 is inserted into the hole 11 from the back side of the substrate 10 and is electrically connected to the electrode 12. Further, the cable 40 is disposed so as to extend in a direction away from the light receiving surface of the solid-state imaging device 20.

  Furthermore, the substrate 10 has reinforcing members 14 and 15 on the front surface and the back surface thereof. The reinforcing member 14 is sandwiched between the substrate 10 and the solid-state imaging device 20 to reinforce the electrical connection between the connection terminal portions 13 and 24. Similarly, the reinforcing member 15 reinforces the electrical connection between the electrode 12 and the cable 40. As a material of the reinforcing members 14 and 15, for example, an epoxy resin thermosetting resin or the like can be used.

  According to the above configuration, an electrical signal output from the imaging circuit 21 via the holes 11 and 22 can be taken out to the back side of the substrate 10. Further, the cable 40 can be bent into an arbitrary shape so as not to protrude to the outside of the substrate 10. As a result, the size of the light receiving surface can be reduced, and the shape of the solid-state imaging device 1 can be made compact. The “output wiring” in the first embodiment includes at least the electrodes 12 and 23 and may further include the cable 40.

(Embodiment 2)
In the second embodiment, a camera unit (optical device unit) incorporating a solid-state imaging device as an optical element will be described.

  A schematic perspective view and a side view of the solid-state imaging device 2 according to Embodiment 2 are shown in FIGS. 2 (a) and 2 (b). In addition, the same reference number is attached | subjected to the component which is common in the solid-state imaging device 1 which concerns on Embodiment 1, and detailed description is abbreviate | omitted.

  The solid-state imaging device 2 according to the second embodiment further includes a flexible substrate 50 in addition to the components of the solid-state imaging device 1. The flexible substrate 50 connects the first flexible substrate 51 along the back surface of the substrate 10, the second flexible substrate 52 holding the electronic component 60, and the first and second flexible substrates 51, 52 to each other. And a bent portion 53.

  The flexible substrate 50 is obtained by forming a metal wiring 54 on the surface of a flexible insulating film (substrate). Specifically, the flexible substrate 50 of the second embodiment is a single-sided film carrier tape using a polyimide film or a liquid crystal polymer film as an insulating film and copper as the metal wiring 54.

  The second flexible substrate 52 is bent at the side end portion of the substrate 10 to the side opposite to the light receiving surface side, and extends in a direction away from the light receiving surface of the solid-state imaging element 20. An electronic component 60 is mounted on the surface of the second flexible substrate 52.

  The electronic component 60 includes a driver IC 61 that drives the solid-state imaging device 20, a chip resistor 62, a chip capacitor 63, a chip transistor 64, and the like. The electronic component 60 including these constitutes a drive circuit and an input / output circuit for the solid-state imaging device 20. The electronic component 60 is electrically connected to the metal wiring 54 of the flexible substrate 50 by solder or the like.

  Further, the bent portion 53 of the flexible substrate 50 is a portion where only the metal wiring 54 is formed by selectively removing the insulating film. For this reason, it is easy to bend and it is easy to hold the bent state. Moreover, since the curvature radius of the bending part 53 can be made small, the shape of the solid-state imaging device 2 can be made compact.

  Thus, since the electrode 12 of the substrate 10 and the metal wiring 54 of the flexible substrate 50 are electrically connected, an electrical signal output from the imaging circuit 21 can be obtained simply by connecting the cable 40 to the flexible substrate 50. Can be taken out. As a result, the number of connection lines and connection locations can be reduced, the apparatus can be miniaturized, and the cost can be reduced. The “output wiring” in the first embodiment includes at least the electrodes 12 and 23 and may further include the metal wiring 54 and the cable 40.

  As mentioned above, although embodiment of this invention was described with reference to drawings, this invention is not limited to the thing of embodiment shown in figure. Various modifications and variations can be made to the illustrated embodiment within the same range or equivalent range as the present invention.

  As described above, the optical device according to the present invention can be formed into a compact shape, and thus is useful as an optical device module for a small camera unit.

DESCRIPTION OF SYMBOLS 1,2,100 Solid-state imaging device 10 Substrate 11,22 Hole 12,23 Electrode 13,24 Connection terminal part 14,15 Reinforcement member 20,103 Solid-state image sensor 21 Imaging circuit 30 Transparent protection member 31 Adhesive 40 Cable 50, DESCRIPTION OF SYMBOLS 102 Flexible substrate 51 1st flexible substrate 52 2nd flexible substrate 53 Bending part 54 Metal wiring 60 Electronic component 61 Driver IC
62 Chip resistor 63 Chip capacitor 64 Chip transistor 101 Chip component 104 Bonding pad

Claims (9)

An optical device module comprising a substrate having a front surface and a back surface, and a solid-state imaging device stacked on the front surface side of the substrate,
A first hole penetrating in the thickness direction is formed in the substrate,
The solid-state imaging device includes an imaging circuit on a surface opposite to a surface facing the substrate of the solid-state imaging device, and a second hole reaching the imaging circuit from a surface facing the substrate is formed. ,
The optical device module further includes an output wiring for extracting an electrical signal output from the imaging circuit to the back side of the substrate through the first and second holes. The optical device module according to claim 1, wherein the output wiring includes a cable having flexibility and being inserted into the first hole and electrically connected to the imaging circuit. The optical device module further comprises:
A flexible substrate laminated on the back side of the substrate;
The optical device module according to claim 1, further comprising an electronic component disposed on the flexible substrate and electrically connected to the output wiring. The flexible substrate includes a first flexible substrate along a back surface of the substrate, a second flexible substrate that holds the electronic component, and a bent portion that connects the first and second flexible substrates to each other. The optical device module according to claim 3. The flexible substrate is a film carrier tape in which a flexible insulating film and a metal wiring formed on the insulating film and electrically connecting the output wiring and the electronic component are laminated,
The optical device module according to claim 4, wherein the insulating film is selectively removed at the bent portion. The optical device module according to claim 3, further comprising a cable that has flexibility and is electrically connected to the electronic component. The optical device module according to claim 1, further comprising a transparent protective member that is stacked on the solid-state imaging device so as to cover the imaging circuit. The optical device module according to claim 7, wherein the solid-state imaging element and the transparent protective member are bonded with an adhesive that is transparent and has a lower refractive index than the transparent protective member. The optical device module according to claim 1, further comprising a reinforcing member for reinforcing electrical connection on at least one of the front surface and the back surface of the substrate.

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