JP2011129686A - Thermoelectric conversion device, and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermoelectric conversion device that is easy to manufacture. <P>SOLUTION: As one embodiment, the thermoelectric conversion device 10 includes a first heating medium flow passage 12 and a second heating medium flow passage 13 disposed around a columnar hollow portion 11 to form double spiral flow passages, a spiral first thermoelectric conversion portion 14 forming one border between the first heating medium flow passage 12 and second heating medium flow passage 13, and a spiral second thermoelectric conversion portion 15 forming the other border between the first heating medium flow passage 12 and second heating medium flow passage 13, wherein the first thermoelectric conversion portion 14 and second thermoelectric conversion portion 15 are flexible. The thermoelectric conversion device 10 is manufactured using a flexible thermoelectric conversion substrate 20 having a center through hole 22, a slit 28 extending from an end edge to the center through hole, a first end face 23 and a second end face 24 which face each other across the slit 28, a first electrode 45 disposed on the first end face, and a second electrode 46 disposed on the second end face. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a thermoelectric conversion device and a manufacturing method thereof.

  In recent years, thermoelectric conversion devices that convert waste heat energy into electrical energy have attracted attention. Thermoelectric conversion devices are also used for heat transfer using electrical energy. As described above, the thermoelectric conversion device includes a thermoelectric generator that generates electricity by heat and a Peltier element that transfers heat by electricity. The basic structures of these thermoelectric generators and Peltier elements are the same.

  Since the thermoelectric converter does not have a movable part, it has high reliability. Further, since the thermoelectric conversion device can be formed in a small size, it is a power generation device that is easy to install. Furthermore, the thermoelectric conversion device is noiseless and vibration-free and has excellent environmental properties.

  For example, some conventional thermoelectric conversion devices are formed by connecting a plurality of thermoelectric conversion elements electrically in series. In each thermoelectric conversion element, a p-type semiconductor element and an n-type semiconductor element are electrically connected in series, and thermally, the p-type semiconductor element and the n-type semiconductor element are arranged in parallel. The thermoelectric conversion device has a structure in which these thermoelectric conversion elements are fixed on a ceramic plate having electrical insulation, and can be disposed in the vicinity of a heat source.

JP 2008-91539 A JP 2009-43752 A

  As described above, the conventional thermoelectric conversion device has a structure in which a large number of thermoelectric conversion elements are arranged on a ceramic plate. Thus, the thermoelectric conversion device using the ceramic plate is difficult to process the brittle ceramic plate. Therefore, it is difficult to automate the manufacture of the thermoelectric conversion device.

  In the thermoelectric conversion device, in order to arrange a large number of p-type semiconductor elements and n-type semiconductor elements in parallel in parallel, it is desirable that the contact area in thermal contact with the heat medium is large.

  In addition, thermoelectric conversion devices are required to improve energy conversion efficiency.

  In this specification, it aims at providing the thermoelectric conversion apparatus with easy manufacture, and its manufacturing method.

  It is another object of the present specification to provide a thermoelectric conversion device having a thermally large contact area with a heat medium and a method for manufacturing the thermoelectric conversion device.

  Furthermore, it aims at providing the thermoelectric conversion apparatus with high energy conversion efficiency, and its manufacturing method in this specification.

  According to one aspect of the thermoelectric conversion device disclosed in the present specification, a first heat medium flow path and a second heat medium flow path that form a double spiral flow path arranged around a columnar hollow portion; A spiral first thermoelectric converter that forms one boundary between the first heat medium flow path and the second heat medium flow path, the first heat medium flow path, and the second heat medium flow path A spiral second thermoelectric conversion unit that forms the other boundary between the first thermoelectric conversion unit and the second thermoelectric conversion unit.

  Moreover, in the manufacturing method of the thermoelectric conversion apparatus mentioned above, the center through-hole, the slit extended from the edge to the said center through-hole, the 1st end surface and 2nd end surface which oppose on both sides of the said slit, and the said 1st end surface A thermoelectric conversion device is manufactured using a flexible thermoelectric conversion substrate having a first electrode arranged and a second electrode arranged on the second end face.

  According to the thermoelectric conversion device and the manufacturing method thereof disclosed in the present specification described above, the manufacturing is easy.

  Moreover, according to the thermoelectric conversion apparatus and its manufacturing method disclosed in the present specification described above, a thermal contact area with the heat medium is large.

  Furthermore, according to the thermoelectric conversion device and the manufacturing method thereof disclosed in the present specification described above, the energy conversion efficiency is high.

  The objects and advantages of the invention will be realized and obtained by means of the elements and combinations particularly pointed out in the appended claims.

  Both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention as claimed.

1 is a perspective view showing a first embodiment of a thermoelectric conversion device disclosed in this specification. FIG. It is the X1-X1 sectional view taken on the line of FIG. It is a perspective view which shows the thermoelectric conversion board | substrate which forms the thermoelectric conversion apparatus of FIG. FIG. 4 is a partially broken perspective view of the thermoelectric conversion substrate of FIG. 3. It is a disassembled perspective view of the thermoelectric conversion board | substrate of FIG. (A) is a top view which shows the thermoelectric conversion board | substrate of FIG. 3 from which the 2nd board | substrate was removed, (B) is the X2-X2 sectional view taken on the line of (A). (A) is a top view which shows the 2nd board | substrate which forms the thermoelectric conversion board | substrate of FIG. 3, (B) is the X3-X3 sectional view taken on the line of (A). (A) is a figure which shows the manufacturing process (the 1) of 1st Embodiment of the manufacturing method of the thermoelectric conversion apparatus disclosed to this specification, (B) is a figure which shows a manufacturing process (the 2). . (A) is a figure which shows the manufacturing process (the 3) of 1st Embodiment of the manufacturing method of the thermoelectric conversion apparatus disclosed to this specification, (B) is a figure which shows a manufacturing process (the 4). . It is a figure which shows the manufacturing process (the 5) of 1st Embodiment of the manufacturing method of the thermoelectric conversion apparatus disclosed to this specification. It is a figure which shows the manufacturing process (the 6) of 1st Embodiment of the manufacturing method of the thermoelectric conversion apparatus disclosed to this specification. It is a figure which shows the manufacturing process (the 7) of 1st Embodiment of the manufacturing method of the thermoelectric conversion apparatus disclosed to this specification. It is a figure which shows the manufacturing process (the 8) of 1st Embodiment of the manufacturing method of the thermoelectric conversion apparatus disclosed to this specification. It is a perspective view which shows 2nd Embodiment of the thermoelectric conversion apparatus disclosed to this specification. It is the Y1-Y1 sectional view taken on the line of FIG. (A) is a perspective view which shows the state which one thermoelectric conversion board | substrate which forms the thermoelectric conversion apparatus of FIG. 13 bent, (B) is a partially broken perspective view which shows the state which the 1st thermoelectric conversion board | substrate is not bent. FIG. (A) is a perspective view which shows the state which the other thermoelectric conversion board | substrate which forms the thermoelectric conversion apparatus of FIG. 13 bent, (B) is a partially broken perspective view which shows the state which the 2nd thermoelectric conversion board | substrate does not bend. FIG. It is a figure which shows the manufacturing process (the 1) of 2nd Embodiment of the manufacturing method of the thermoelectric conversion apparatus disclosed to this specification. It is a figure which shows the manufacturing process (the 2) of 2nd Embodiment of the manufacturing method of the thermoelectric conversion apparatus disclosed to this specification. It is a figure which shows the manufacturing process (the 3) of 2nd Embodiment of the manufacturing method of the thermoelectric conversion apparatus disclosed to this specification. It is a front view which shows 3rd Embodiment of the thermoelectric conversion apparatus disclosed to this specification. It is a top view of the thermoelectric conversion apparatus of FIG. (A) is a figure which shows the manufacturing process (the 1) of 3rd Embodiment of the manufacturing method of the thermoelectric conversion apparatus disclosed to this specification, (B) is a figure of the thermoelectric conversion apparatus disclosed to this specification. It is a figure which shows the manufacturing process (the 2) of 3rd Embodiment of a manufacturing method. It is a figure which shows the modification of the manufacturing method of the thermoelectric conversion board | substrate disclosed to this specification.

  Hereinafter, a preferred first embodiment of a thermoelectric conversion device disclosed in this specification will be described with reference to the drawings. However, it should be noted that the technical scope of the present invention is not limited to these embodiments, but extends to the invention described in the claims and equivalents thereof.

  FIG. 1 is a perspective view showing a first embodiment of a thermoelectric conversion device disclosed in this specification. 2 is a cross-sectional view taken along line X1-X1 of FIG.

  The thermoelectric conversion device 10 of this embodiment includes a first heat medium flow channel 12 and a second heat medium flow channel 13 that are arranged around a columnar hollow portion 11 to form a double spiral flow channel.

  The first heat medium flow path 12 is a spiral flow path formed inside the thermoelectric conversion device 10 as indicated by the solid line arrow in FIG. 2. Similarly, the second heat medium flow path 13 is a spiral flow path formed inside the thermoelectric conversion device 10 as indicated by the dotted arrow in FIG.

  Each of the first heat medium flow path 12 and the second heat medium flow path 13 is an independent flow path, and has one opening below the thermoelectric conversion device 10 and the other opening above the thermoelectric conversion device 10. Part. Each of the first heat medium flow channel 12 and the second heat medium flow channel 13 extends in a spiral shape from the lower side to the upper side of the thermoelectric conversion device 10.

  In the thermoelectric conversion device 10, the first heat medium flow path 12 and the second heat medium flow path 13 are not connected to the hollow portion 11. Moreover, the part which is not pinched | interposed into the 1st thermoelectric conversion part 12 and the 2nd thermoelectric conversion part 13 is not open | released outside the 1st heat-medium flow path 12 and the 2nd heat-medium flow path 13.

  The thermoelectric conversion device 10 includes a spiral first thermoelectric conversion unit 14 that forms one boundary between the first heat medium flow path 12 and the second heat medium flow path 13, and a first heat medium flow path. 12 and a spiral second thermoelectric conversion unit 15 that forms the other boundary between the second heat medium flow path 13 and the second heat medium flow path 13.

  The first thermoelectric conversion unit 14 extends in a spiral shape from the lower side to the upper side of the thermoelectric conversion device 10. The first thermoelectric conversion unit 14 has a first end face 23 above the thermoelectric conversion device 10 and a second end face 24 below.

  The first thermoelectric converter 14 has an upper surface in thermal contact with the first heat medium flow path 12 and a lower surface in thermal contact with the second heat medium flow path 13. The first thermoelectric conversion portion 14 that spirally extends from the lower side to the upper side of the thermoelectric conversion device 10 is sandwiched between the first heat medium flow channel 12 and the second heat medium flow channel 13 over substantially the whole thereof. And are in thermal contact with the respective flow paths.

  The 1st thermoelectric conversion part 14 has a thermoelectric conversion circuit inside. The first electrode 45 of the thermoelectric conversion circuit is disposed on the first end face 23, and the second electrode 46 of the thermoelectric conversion circuit is disposed on the second end face 24.

  The second thermoelectric conversion unit 15 has an upper surface in thermal contact with the second heat medium flow path 13 and a lower surface in thermal contact with the first heat medium flow path 12. The second thermoelectric conversion portion 15 that spirally extends from the lower side to the upper side of the thermoelectric conversion device 10 is sandwiched between the first heat medium flow channel 12 and the second heat medium flow channel 13 over substantially the whole. And are in thermal contact with the respective flow paths.

  The second thermoelectric conversion unit 15 has the same structure as the first thermoelectric conversion unit 14 and has a thermoelectric conversion circuit independent of the first thermoelectric conversion unit 14. This thermoelectric conversion circuit also has a first electrode and a second electrode (not shown).

  As described above, in the thermoelectric conversion device 10, the thermoelectric conversion unit and the heat medium flow path are integrally formed.

  In the thermoelectric conversion device 10 of the present embodiment, each of the first thermoelectric conversion unit 14 and the second thermoelectric conversion unit 15 has flexibility. As will be described in detail later, each of the first thermoelectric conversion unit 14 and the second thermoelectric conversion unit 15 includes a plurality of flexible thermoelectric conversion substrates that are combined and joined to each other in a bent state. A structure is formed. Therefore, the thermoelectric conversion device 10 also has flexibility as a whole.

  When thermoelectric power generation is performed using the thermoelectric conversion device 10, for example, the temperature of the first heat medium flow path 12 from the lower side to the upper side of the thermoelectric conversion device 10 as indicated by the solid line arrow in FIG. 2. A high heat medium is flowed. In addition, a heat medium having a low temperature flows through the second heat medium flow path 13 from the upper side to the lower side of the thermoelectric conversion device 10, for example, as indicated by a dotted arrow in FIG. 2.

  A large amount of heat medium can be circulated in the first heat medium flow path 12 and the second heat medium flow path 13 according to the required heat generation power, for example.

  Thus, each of the first thermoelectric conversion unit 14 and the second thermoelectric conversion unit 15 includes the temperature of the heat medium flowing in the first heat medium flow channel 12 and the temperature of the heat medium flowing in the second heat medium flow channel 13. Thermal power is generated by the difference between The generated electric power is taken out from the first electrode and the second electrode in the thermoelectric conversion unit, respectively.

  Further, for example, by using the lead wire 16 illustrated in FIG. 1, the thermoelectric conversion circuit of the first thermoelectric conversion unit 14 and the thermoelectric conversion circuit of the second thermoelectric conversion unit 15 are connected in series. The first electrodes may be connected to each other. In this case, the electrodes thermoelectrically generated by the first thermoelectric conversion unit 14 and the second thermoelectric conversion unit 15 are taken out from the two second electrodes located below the thermoelectric conversion device 10.

  Further, by supplying electric power to the thermoelectric conversion circuits of the first thermoelectric conversion unit 14 and the second thermoelectric conversion unit 15, the heat medium flowing in the first heat medium flow channel 12 and the second heat medium flow channel 13. It is also possible to transfer heat energy to and from the heat medium flowing inside.

  The thermoelectric conversion device 10 shown in FIGS. 1 and 2 is formed by combining and joining a plurality of flexible thermoelectric conversion substrates 20a and 20b in a bent state. The first thermoelectric conversion portion 14 is formed by joining a bent thermoelectric conversion substrate 20a in a spiral shape. The second thermoelectric conversion unit 15 is formed by joining a bent thermoelectric conversion substrate 20b in a spiral shape.

  Next, the thermoelectric conversion board | substrate 20a is demonstrated below with reference to FIGS. Since the thermoelectric conversion substrate 20b has the same structure as the thermoelectric conversion substrate 20a, the description of the thermoelectric conversion substrate 20a described below is also applied to the thermoelectric conversion substrate 20b as appropriate.

  FIG. 3 is a perspective view showing a bent state of the thermoelectric conversion substrate 20a forming the thermoelectric conversion device 10 of FIG. FIG. 4 is a partially broken perspective view of the thermoelectric conversion substrate 20a of FIG. FIG. 5 is an exploded perspective view of the thermoelectric conversion substrate 20a of FIG. 6A is a plan view showing the thermoelectric conversion substrate 20a of FIG. 3 with the second substrate 34 removed, and FIG. 6B is a cross-sectional view taken along line X2-X2 of FIG. 6A. . 7A is a plan view showing a second substrate forming the thermoelectric conversion substrate 20a of FIG. 3, and FIG. 7B is a cross-sectional view taken along line X3-X3 of FIG. 7A.

  As shown in FIG. 4, the thermoelectric conversion substrate 20 a includes a first substrate 31 and a second substrate 34. The first substrate 31 and the second substrate 34 have flexibility.

  As shown in FIG. 6A, the first substrate 31 has a first through hole 32 located in the center and a first slit 33 extending from the edge to the first through hole 32. The first substrate 31 has electrical insulation.

  As shown in FIG. 7A, the second substrate 34 includes a second through hole 35 located in the center and a second slit 36 extending from the edge to the second through hole 35. The second substrate 34 has electrical insulation.

  In the thermoelectric conversion substrate 20a, the first through hole 32 and the second through hole 35 have the same shape. In the present embodiment, the first through hole 32 and the second through hole 35 have a circular shape, but the first through hole 32 and the second through hole 35 have other shapes such as a rectangle. May be.

  Moreover, in the thermoelectric conversion board | substrate 20a, the 1st board | substrate 31 and the 2nd board | substrate 34 have the same shape. In the present embodiment, the first substrate 31 and the second substrate 34 have a square shape, but the first through hole 32 and the second through hole 35 may have other shapes such as a circle. good.

  In the thermoelectric conversion substrate 20 a, an inter-substrate seal portion 21 that seals the inside is formed between the periphery of the first substrate 31 and the periphery of the second substrate 34.

  The first slit 33 and the second slit 36 may be slits having no width, or may be slits having a predetermined width.

  In the thermoelectric conversion substrate 20 a, a central seal portion 25 is formed around the second through hole 35 on the second substrate 34 so as to surround the second through hole 35 and to be interrupted at the position of the second slit 36. Further, the thermoelectric conversion substrate 20 a is formed with an outer peripheral seal portion 26 that is interrupted at the position of the second slit 36 on the periphery on the second substrate 34. The thermoelectric conversion substrate 20b is also formed in the same manner as the thermoelectric conversion substrate 20a.

  The inter-substrate seal part 21, the center seal part 25, and the outer peripheral seal part 26 have flexibility.

  Further, in the thermoelectric conversion substrate 20a, the first through hole 32 and the second through hole 35 are aligned, and the first slit 33 and the second slit 36 are aligned, so that the second substrate 34 is placed on the first substrate 31. The thermoelectric conversion circuits 40 are stacked.

  Specifically, the first substrate 31 and the second substrate 34 are stacked with a thermoelectric conversion circuit 40 having a p-type semiconductor element 41 and an n-type semiconductor element 42 disposed between the two substrates. The thermoelectric conversion circuit 40 is disposed on the first substrate 31 and includes a first electrode 45 and a second electrode 46.

  As shown in FIGS. 4 and 5, in the thermoelectric conversion substrate 20 a, the central through hole 22 is formed by the first through hole 32, the second through hole 35, and the portion of the inter-substrate seal portion 21 that seals between these through holes. Is formed. Further, between the first slit 33 and the second slit 36, an opposing first end surface 23 and second end surface 24 are formed by the portion of the inter-substrate seal portion 21.

  A slit 27 is formed between the first end surface 23 and the second end surface 24. As shown in FIG. 3, in the thermoelectric conversion substrate 20a in the bent state, in the slit 27, the end portion 23a on the first end face side and the end portion 24a on the second end face side are opposite to each other in these plane directions. The cut portion 28 is formed by shifting in the direction.

  The first electrode 45 is disposed on the first end face 23, and the second electrode 46 is disposed on the second end face 24. The first electrode 45 has a concave portion that can accept the portion of the second electrode 46 having a convex electrode shape.

  Next, the thermoelectric conversion circuit 40 will be further described below with reference to FIGS. 6 and 7.

  6A and 6B, the thermoelectric conversion circuit 40 includes a p-type semiconductor element 41 and an n-type semiconductor element 42 connected in series via a first conductive plate 43. A plurality of elements are connected in series. Each of the p-type semiconductor element 41 and the n-type semiconductor element 42 is connected to the first conductive plate 43 through a conductive adhesive 47. The first conductive plate 43 is disposed on the first substrate 31.

  The thermoelectric conversion elements 48 are connected to each other via a second conductive plate 46 (see FIG. 7B) disposed on the surface of the second substrate 34 facing the first substrate 31. Specifically, each of the p-type semiconductor element 41 and the n-type semiconductor element 42 is connected to the second conductive plate 46 via the conductive adhesive 47. In FIG. 2, the conductive adhesive 47 is not shown.

  The first electrode 45 is connected to the first conductive plate 43 that forms one end of the thermoelectric conversion circuit 40 via the conductive adhesive 47. The second electrode 46 is connected to the first conductive plate 43 that forms the other end of the thermoelectric conversion circuit 40 via a conductive adhesive 47.

  The first conductive plate 43 and the second conductive plate 46 are preferably flexible.

  In the thermoelectric conversion circuit 40 of the present embodiment, a plurality of thermoelectric conversion elements 48 are connected in series. However, in the thermoelectric conversion circuit 40, the plurality of thermoelectric conversion elements 48 are connected in parallel or in series. Alternatively, they may be connected in parallel.

  The dimensions of the p-type semiconductor element 41, the n-type semiconductor element 42, the first electrode 45, and the second electrode 46 are dimensions that do not prevent the thermoelectric conversion substrate 20a from being bent to form the thermoelectric conversion device 10. It is preferable.

  Since the technology for forming the thermoelectric conversion circuit 40 described above can use conventional production technologies such as electronic components or semiconductor elements, the thermoelectric conversion substrate 20a can be produced in large quantities at a low cost.

  As a material for forming the flexible first substrate 31 or second substrate 32 for forming the thermoelectric conversion substrates 20a and 20b, polyimide (manufactured by Scotch: polyimide tape, etc.) flexible tape, copper for flexible printed circuit (FPC) A stretched polyimide film or the like can be used.

  Moreover, as a forming material of the flexible inter-substrate seal part 21, the central seal part 25, and the outer peripheral seal part 26 which form the thermoelectric conversion substrates 20a and 20b, an electrically insulating thermosetting resin, a sheet structure An adhesive (manufactured by 3M: APAS) or the like can be used.

  For example, Bi2Te3, Sb2Te3, PbTe, Sm2S3, Cu2O, Ge-Te, FeSi2, or CoSb3 can be used as a material for forming the p-type semiconductor element 41 or the n-type semiconductor element 42 forming the thermoelectric conversion element 48. .

  According to the thermoelectric conversion device 10 of the present embodiment described above, manufacturing is easy because conventional production techniques such as electronic components or semiconductor devices can be used.

  Moreover, according to the thermoelectric conversion apparatus 10, the 1st thermoelectric conversion part 14 and the 2nd thermoelectric conversion part 15 are respectively the double spiral 1st heat-medium flow path 12 and 2nd heat-medium flow over substantially the whole. Since it is in thermal contact with the path 13, it has a large thermal contact area with the heat medium. On the other hand, since the thermoelectric conversion device 10 has a structure extending in a spiral shape in the vertical direction, the flat area required by the thermoelectric conversion device 10 is small.

  Moreover, according to the thermoelectric conversion apparatus 10, since it has a thermally large contact area between heat media, energy conversion efficiency is high.

  Furthermore, according to the thermoelectric conversion device 10, the hollow portion 11 can be easily attached to, for example, a screw-shaped structure that is thermally connected to a heat sink.

  Next, an embodiment of a preferable manufacturing method of the above-described thermoelectric conversion device will be described below with reference to FIGS.

  First, as shown in FIG. 8A, on a flexible first substrate 31 having a first through hole 32 located in the center and a first slit 33 extending from the edge to the first through hole 32, A plurality of first conductive plates 43 are formed. The plurality of first conductive plates 43 are formed, for example, by patterning using a lithography technique. As a material for forming the first conductive plate 43, for example, copper can be used.

  The dimensions of the first substrate 31 can be, for example, a square with a thickness of 2 mm and a side length of 40 mm. The first through hole 32 can be, for example, a circle having a diameter of 10 mm. As for the dimension of the 1st slit 33, a width | variety can be 2 mm, for example.

  Then, a conductive adhesive 47 is applied to each portion of the first conductive plate 43 where the p-type semiconductor element, the n-type semiconductor element, the first electrode, or the second electrode is mounted. The conductive adhesive 47 may be applied to the p-type semiconductor element, the n-type semiconductor element, the first electrode, or the second electrode.

  Next, as shown in FIG. 8B, the p-type semiconductor element 41, the n-type semiconductor element 42, and the first electrode 45 are placed on predetermined portions of the first conductive plate 43 via a conductive adhesive 47. And the 2nd electrode 46 is adhere | attached and mounted. In this way, the plurality of thermoelectric conversion elements 48 are mounted on the first substrate 31. The dimensions of the p-type semiconductor element 41 and the n-type semiconductor element 42 can be, for example, 5 mm in length and 2 mm in length and 2 mm in height. Further, Bi2Te3 to which an impurity is added can be used as a material for forming the p-type semiconductor element 41 and the n-type semiconductor element 42.

  Further, the inter-substrate seal portion 21 is formed on the peripheral edge on the first substrate 31.

  The inter-substrate seal portion 21 is formed by printing a thermosetting electrically insulating resin paste on the first substrate 31 using, for example, a metal mask printer. The dimensions of the inter-substrate seal part 21 can be, for example, a height of 300 μm and a width of 2 mm.

  Next, as shown in FIG. 9A, on a flexible second substrate 34 having a second through hole 35 located in the center and a second slit 36 extending from the edge to the second through hole 35. A plurality of second conductive plates 46 are formed. The second conductive plate 46 is formed in the same manner as the first conductive plate 43.

  The shape of the second substrate 32 was the same as that of the first substrate 31. The shape of the second through hole 35 is the same as that of the first through hole 32. The shape of the second slit 36 is the same as that of the first slit 33. The shape of the second conductive plate 46 is the same as that of the first conductive plate 43.

  Then, a conductive adhesive 47 is applied to each of the second conductive plates 46 where the p-type semiconductor element 41 and the n-type semiconductor element 42 are connected.

  Next, as shown in FIG. 9B, the central seal portion 25 surrounding the second through hole 35 around the second through hole 35 on the upper surface of the second substrate 34 and being interrupted at the position of the second slit 36 is provided. It is formed. Further, an outer peripheral seal portion 26 that is interrupted at the position of the second slit 36 is formed on the periphery of the upper surface of the second substrate 32. Here, the upper surface of the second substrate 32 means a surface opposite to the surface on which the second conductive plate 46 is formed. The central seal portion 25 and the outer peripheral seal portion 26 are formed in the same manner as the inter-substrate seal portion 21.

  Next, as shown in FIG. 10, the second substrate 34 has the first through hole 32 and the second through hole 35 aligned on the first substrate 31 on which the plurality of thermoelectric conversion elements 48 are mounted, and A thermoelectric conversion circuit 40 having a plurality of thermoelectric conversion elements 48 between both substrates is formed by laminating the first slit 33 and the second slit 36 together. Here, the second substrate 34 is laminated on the first substrate 31 so that the surface of the second substrate 34 on which the second conductive plate 46 is formed faces the first substrate 31.

  At this time, the interior including the thermoelectric conversion circuit 40 is hermetically sealed by the inter-substrate seal portion 21 formed between the periphery of the first substrate 31 and the periphery of the second substrate 34. In addition, the second substrate 34 is stacked on the first substrate 31, so that the first through hole 32, the second through hole 35, and the portion of the inter-substrate seal portion 21 that seals between these through holes are centralized. A through hole 22 is formed. Further, between the first slit 33 and the second slit 36, an opposing first end surface 23 and second end surface 24 are formed by the portion of the inter-substrate seal portion 21. Further, the first electrode 45 of the thermoelectric conversion circuit 40 is disposed on the first end face 23, and the second electrode 46 of the thermoelectric conversion circuit 40 is disposed on the second end face 24.

  In this way, a plurality of thermoelectric conversion substrates 20a and 20b shown in FIG. 11 are formed. In FIG. 11, the thermoelectric conversion board 20b is shown in the opposite direction to the thermoelectric conversion board 20a.

  Next, as shown in FIG. 12, a thermoelectric conversion substrate composite 50a is formed using the two thermoelectric conversion substrates 20a and 20b.

  Specifically, the end portion 23a on the first end surface side and the end portion 23b on the second end surface side of each of the two thermoelectric conversion substrates 20a and 20b are shifted in opposite directions in these surface directions in the slit 27. Thus, the cut portion 28 is formed. Then, the cut portion 28 of one thermoelectric conversion substrate 20a and the cut portion 28 of the other thermoelectric conversion substrate 20b are inserted into each other. And the end part 23a on the first end face side of one thermoelectric conversion board 20a is overlaid on the upper side of the other thermoelectric conversion board 20b, and the end part 24a on the second end face side of one thermoelectric conversion board 20a is It is overlaid on the lower side of the other thermoelectric conversion substrate 20b. Furthermore, the end portion 23a on the first end face side of the other thermoelectric conversion substrate 20b is overlaid on the upper side of the one thermoelectric conversion substrate 20a, and the end portion 24a on the second end face side of the other thermoelectric conversion substrate 20b is One thermoelectric conversion substrate 20a is overlaid on the lower side. And one thermoelectric conversion board | substrate 20a and the other thermoelectric conversion board | substrate 20b are mutually overlap | superposed with the center through-holes 22 and 22 aligning.

  When the one thermoelectric conversion substrate 20a and the other thermoelectric conversion substrate 20b are overlapped with the center through holes 22 and 22 aligned, the following portions are joined together. That is, the center seal portion 25 of one thermoelectric conversion substrate 20a is disposed and joined to a portion around the central through hole 22 on the lower surface of the other thermoelectric conversion substrate 20b that is overlaid, and the other thermoelectric conversion substrate. The central seal portion 25 of 20b is disposed and joined to a portion around the central through hole 22 on the lower surface of one of the superimposed thermoelectric conversion substrates 20a. As a result, an extended central through hole 51 is formed by the central seal portions 25 and 25 and the central through holes 22 and 22. At the same time, the outer peripheral seal portion 26 of one thermoelectric conversion substrate 20a is arranged and joined to the peripheral portion of the lower surface of the other thermoelectric conversion substrate 20b that is overlaid, and the outer periphery of the other thermoelectric conversion substrate 20b. The seal portion 26 is disposed and joined to the peripheral portion of the lower surface of the one thermoelectric conversion substrate 20a that is overlaid. In this way, the thermoelectric conversion substrate composite 50a is formed.

  For example, as shown in FIG. 12, a thermoelectric conversion substrate composite in which two thermoelectric conversion substrates 20a and 20b are combined is used for joining the central seal portion 25 and the outer peripheral seal portion 26 to the portions facing these seal portions. It is performed by pressing and heating 50a from above and below. This pressurization and heat treatment can be performed using, for example, an isobaric press machine under conditions of a temperature of 150 ° C., a pressure of 2 MPa, and a time of 30 minutes. In addition, the first substrate 31 and the second substrate 32 forming the two thermoelectric conversion substrates 20 a and 20 b are bonded to each other through the inter-substrate seal portion 21 by the pressurization and heat treatment.

  In the present embodiment, three thermoelectric conversion substrate composites described above are formed.

  Next, as shown in FIG. 13, the thermoelectric conversion device 10 is formed using the three thermoelectric conversion substrate composites 50a, 50b, and 50c.

  Specifically, the first end surface 23 of one thermoelectric conversion substrate 20a in one thermoelectric conversion substrate composite 50a, and the second end surface 24 of one thermoelectric conversion substrate 20a in another thermoelectric conversion substrate composite 50b, However, the first electrode 45 and the second electrode 46 at these end faces are electrically connected and joined.

  The first end face 23 of the other thermoelectric conversion board 20b in one thermoelectric conversion board composite 50a and the second end face 24 (not shown) of the other thermoelectric conversion board 20b in another thermoelectric conversion board composite 50b. ) Electrically connect and join the first electrode 45 and the second electrode 46 (not shown) at these end faces.

  Furthermore, another thermoelectric conversion substrate composite 50b in which the center seal portion 25 of one thermoelectric conversion substrate 20a and the center seal portion 25 of the other thermoelectric conversion substrate 20b in one thermoelectric conversion substrate composite 50a are overlapped. It joins with the peripheral part of the extending | stretching center through-hole 51 of the lower surface of this.

  Furthermore, another thermoelectric conversion substrate composite in which the outer peripheral seal portion 26 of one thermoelectric conversion substrate 20a and the outer peripheral seal portion 26 of the other thermoelectric conversion substrate 20b in one thermoelectric conversion substrate composite 50a are overlapped. It joins with the peripheral part of the lower surface of 50b. Then, the two thermoelectric conversion substrate composites 50a and 50b are overlapped with the extended central through holes 51 and 51 aligned.

  For example, the first end face 23 and the second end face 24 are bonded by heat treatment after applying a thermosetting electrical insulating paste between both end faces.

  As a method for joining the central seal portion 25 and the outer peripheral seal portion 26 to the opposing portions, for example, a thermosetting electrical insulating paste is applied between both end faces and then used for forming a thermoelectric conversion substrate composite. Conventional pressurization and heat treatment can be used. In addition, during the formation of the thermoelectric conversion substrate composite, pressure and heat treatment are not performed, and during the pressure and heat treatment when joining the joints with the central seal portion 25 and the outer peripheral seal portion 26 are opposed. You may collectively join between the junction parts in a thermoelectric conversion board | substrate composite_body | complex.

  Similarly, the thermoelectric conversion substrate composite 50b and the thermoelectric conversion substrate composite 50c are joined to form the thermoelectric conversion device 10. At this time, the three thermoelectric conversion substrates 20a are joined to form the first thermoelectric conversion portion 14. Similarly, the three thermoelectric conversion substrates 20b are joined to form the second thermoelectric conversion unit 15. Moreover, the 1st heat-medium flow path 12 and the 2nd heat-medium flow path 13 which make the 1st thermoelectric conversion part 14 and the 2nd thermoelectric conversion part 15 a boundary are formed. Further, the hollow portion 11 is formed by overlapping the three extending central through holes 51.

  According to the manufacturing method of the thermoelectric conversion device of the present embodiment described above, the thermoelectric conversion device using the flexible first substrate 31 and the second substrate 34 and the flexible thermoelectric conversion substrates 20a and 20b. Since 10 is formed, manufacture is easy. Thus, since the manufacturing process mainly deals with flat substrates, the manufacturing process can be easily automated. In addition, since the flexible first substrate 31 and the second substrate 34 and the flexible thermoelectric conversion substrates 20a and 20b are used, it is difficult for components to be damaged. Therefore, the productivity of the thermoelectric conversion device can be improved.

  In the above-described embodiment, the thermoelectric conversion device is formed by laminating three thermoelectric conversion substrate composites. However, the number of laminations of the thermoelectric conversion substrate composites can be appropriately set according to required thermoelectric generation characteristics. . Moreover, the dimension of the thermoelectric conversion board | substrate which forms the thermoelectric conversion board | substrate composite body can also be set suitably according to the thermoelectric power generation characteristic calculated | required.

  Next, thermoelectric conversion devices according to second and third embodiments disclosed in this specification will be described below with reference to the drawings. Regarding points that are not particularly described in the second and third embodiments, the description in detail regarding the first embodiment is applied as appropriate. Further, in FIGS. 14 to 17 and FIGS. 21 to 22, the same components as those in FIGS.

  FIG. 14 is a perspective view showing a second embodiment of the thermoelectric conversion device disclosed in this specification. 15 is a cross-sectional view taken along line Y1-Y1 of FIG. FIG. 16A is a perspective view showing a bent state of one thermoelectric conversion substrate forming the thermoelectric conversion device of FIG. 13, and FIG. 16B shows a state where one thermoelectric conversion substrate is not bent. It is a partially broken perspective view shown. FIG. 17A is a perspective view showing a bent state of the other thermoelectric conversion substrate forming the thermoelectric conversion device of FIG. 13, and FIG. 17B shows a state where the other thermoelectric conversion substrate is not bent. It is a partially broken perspective view shown.

  Next, a second embodiment of the thermoelectric conversion device disclosed in this specification will be described below.

  Unlike the first embodiment described above, the thermoelectric conversion device 10 of the present embodiment has either one of the first heat medium flow path 12 and the second heat medium flow path 13 connected to the hollow portion 11. Yes.

  Specifically, as shown in FIGS. 14 and 15, the first heat medium flow path 12 is connected to the hollow portion 11 and is sandwiched between the first thermoelectric conversion portion 14 and the second thermoelectric conversion portion 15. The part which is not open | released except the part connected with the hollow part 11 is not open | released outside. In the present specification, the first heat medium flow path 12 and the second heat medium flow path 13 forming the double helix are either one of the first heat medium flow path 12 and the second heat medium flow path 13 being hollow. The structure connected with the part 11 is included.

  Further, the second heat medium flow path 13 is not connected to the hollow portion 11, and a portion not sandwiched between the first thermoelectric conversion portion 14 and the second thermoelectric conversion portion 15 has a boundary with the hollow portion 11. It is open to the outside, except for the touching part. In the present specification, the first heat medium flow path 12 and the second heat medium flow path 13 that form a double helix are either the first heat medium flow path 12 or the second heat medium flow path 13 and the The structure connected with the exterior of the converter 10 is included.

  When thermoelectric power generation is performed using the thermoelectric conversion device 10, for example, in the first heat medium flow path 12, as indicated by the dotted arrows in FIG. 15, the temperature increases from below to above the thermoelectric conversion device 10. A high heat medium is flowed. The heat medium having a high temperature flows linearly in the hollow portion 11 from below to above, and spirally flows in the first heat medium flow path 12 as indicated by solid line arrows in FIG. .

  On the other hand, the second heat medium flow path 13 is connected to the atmosphere outside the thermoelectric conversion device 10. For example, the thermoelectric conversion device 10 can be arranged in a thermostat, and the temperature in the thermostat can be made lower than the temperature of the heat medium flowing through the first heat medium flow path 12.

  Thus, each of the first thermoelectric conversion unit 14 and the second thermoelectric conversion unit 15 has the temperature of the heat medium flowing in the first heat medium flow channel 12 and the temperature of the heat medium in the second heat medium flow channel 13. Thermoelectric power is generated by the difference.

  The thermoelectric conversion device 10 shown in FIGS. 14 and 15 is formed by combining and bonding one thermoelectric conversion substrate 20a having flexibility and the other thermoelectric conversion substrate 20b in a bent state. The first thermoelectric conversion unit 14 is formed by joining one bent thermoelectric conversion substrate 20a in a spiral shape. The second thermoelectric conversion unit 15 is formed by joining the other bent thermoelectric conversion substrate 20b in a spiral shape.

  Next, one thermoelectric conversion substrate 20a will be described below with reference to FIGS. 16 (A) and 16 (B).

  As shown in FIGS. 16A and 16B, in this embodiment, one thermoelectric conversion substrate 20a has a structure in which the central seal portion is removed from the thermoelectric conversion substrate of the first embodiment described above. . That is, an outer peripheral seal portion 26 that is interrupted at the position of the second slit 36 is formed on the peripheral edge of the one thermoelectric conversion substrate 20 a on the second substrate 34.

  In the present embodiment, since one thermoelectric conversion substrate 20 a has a central seal portion, the first heat medium flow path 12 is connected to the hollow portion 11.

  Next, the other thermoelectric conversion substrate 20b will be described below with reference to FIGS. 17 (A) and 17 (B).

  As shown in FIGS. 17A and 17B, in the present embodiment, the other thermoelectric conversion substrate 20b has a structure in which the outer peripheral seal portion is removed from the thermoelectric conversion substrate of the first embodiment described above. Have That is, a central seal portion 25 surrounding the second through hole 35 and being interrupted at the position of the second slit 36 is formed around the second through hole 35 on the second substrate 34 in the other thermoelectric conversion substrate 20b. .

  In the present embodiment, since the other thermoelectric conversion substrate 20b has an outer peripheral seal portion, the second heat medium flow path 13 is connected to the atmosphere outside the thermoelectric conversion device 10.

  Other structures of the thermoelectric conversion device 10 of the present embodiment are the same as those of the first embodiment described above.

  According to the thermoelectric conversion device of the present embodiment described above, a larger amount of heat medium is caused to flow through the first heat medium flow path 12 connected to the hollow portion 11 and the second heat medium flow path 13 connected to the outside. be able to. Therefore, large heat energy can be given to the first thermoelectric conversion unit 14 and the second thermoelectric conversion unit 15.

  Next, an embodiment of a preferable method for manufacturing the thermoelectric conversion device described above will be described below with reference to FIGS.

  First, in the same manner as described in the manufacturing method of the thermoelectric conversion device of the first embodiment described above, one thermoelectric conversion substrate 20a and the other thermoelectric conversion substrate 20b shown in FIG. 18 are formed.

  Next, as shown in FIG. 19, a thermoelectric conversion substrate composite 50a is formed using the two thermoelectric conversion substrates 20a and 20b.

  Specifically, the end portion 23a on the first end surface side and the end portion 23b on the second end surface side in each of the one thermoelectric conversion substrate 20a and the other thermoelectric conversion substrate 20b are mutually connected in the surface direction in the slit 27. The cut portion 28 is formed by shifting in the opposite direction. Then, the cut portion 28 of one thermoelectric conversion substrate 20a and the cut portion 28 of the other thermoelectric conversion substrate 20b are inserted into each other. And the end part 23a on the first end face side of one thermoelectric conversion board 20a is overlaid on the upper side of the other thermoelectric conversion board 20b, and the end part 24a on the second end face side of one thermoelectric conversion board 20a is It is overlaid on the lower side of the other thermoelectric conversion substrate 20b. Furthermore, the end portion 23a on the first end face side of the other thermoelectric conversion substrate 20b is overlaid on the upper side of the one thermoelectric conversion substrate 20a, and the end portion 24a on the second end face side of the other thermoelectric conversion substrate 20b is One thermoelectric conversion substrate 20a is overlaid on the lower side. And one thermoelectric conversion board | substrate 20a and the other thermoelectric conversion board | substrate 20b are mutually overlap | superposed with the center through-holes 22 and 22 aligning.

  When the one thermoelectric conversion substrate 20a and the other thermoelectric conversion substrate 20b are overlapped with the center through holes 22 and 22 aligned, the following portions are joined together. That is, the center seal portion 25 of the other thermoelectric conversion substrate 20b is disposed and bonded to a portion around the central through hole 22 on the lower surface of the one of the superimposed thermoelectric conversion substrates 20a. As a result, an extended central through hole 51 is formed by the central seal portion 25 and the central through holes 22 and 22. At the same time, the outer peripheral seal portion 26 of one thermoelectric conversion substrate 20a is disposed and joined to the peripheral portion of the lower surface of the other thermoelectric conversion substrate 20b that is overlaid. In this way, the thermoelectric conversion substrate composite 50a is formed.

  The joining of the central seal portion 25 and the outer peripheral seal portion 26 to the portions facing these seal portions is performed in the same manner as in the method for manufacturing the thermoelectric conversion device of the first embodiment described above.

  In the present embodiment, four thermoelectric conversion substrate composites described above are formed.

  Next, as shown in FIG. 20, the thermoelectric conversion device 10 is formed using the four thermoelectric conversion substrate composites 50a, 50b, 50c, and 50d.

  Specifically, the first end surface 23 of one thermoelectric conversion substrate 20a in one thermoelectric conversion substrate composite 50a, and the second end surface 24 of one thermoelectric conversion substrate 20a in another thermoelectric conversion substrate composite 50b, However, the first electrode 45 and the second electrode 46 at these end faces are electrically connected and joined.

  The first end face 23 of the other thermoelectric conversion board 20b in one thermoelectric conversion board composite 50a and the second end face 24 (not shown) of the other thermoelectric conversion board 20b in another thermoelectric conversion board composite 50b. ) Electrically connect and join the first electrode 45 and the second electrode 46 (not shown) at these end faces.

  Furthermore, the central seal portion of the other thermoelectric conversion substrate 20b in the one thermoelectric conversion substrate composite 50a is a portion around the extended central through hole 51 on the lower surface of another superimposed thermoelectric conversion substrate composite 50b. Be joined.

  Furthermore, the outer peripheral seal portion 26 of one thermoelectric conversion substrate 20a in one thermoelectric conversion substrate composite 50a is joined to the peripheral portion of the lower surface of another superimposed thermoelectric conversion substrate composite 50b. Further, the two thermoelectric conversion substrate composites 50a and 50b are overlapped with the extended central through holes 51 and 51 aligned.

  For example, the first end face 23 and the second end face 24 are bonded by heat treatment after applying a thermosetting electrical insulating paste between both end faces.

  As a method for joining the central seal portion 25 and the outer peripheral seal portion 26 to the opposing portions, for example, the pressurization and heat treatment used for forming the thermoelectric conversion substrate composite described above can be used.

  Similarly, the thermoelectric conversion substrate 10 is formed by joining the thermoelectric conversion substrate composite 50b, the thermoelectric conversion substrate composite 50c, and the thermoelectric conversion substrate composite 50d.

  According to the method for manufacturing the thermoelectric conversion device of the present embodiment described above, the same effects as those of the method for manufacturing the thermoelectric conversion device of the first embodiment described above can be obtained.

  Next, a third embodiment of the thermoelectric conversion device disclosed in this specification will be described below.

  FIG. 21 is a front view showing a third embodiment of the thermoelectric conversion device disclosed in this specification. FIG. 22 is a plan view of the thermoelectric conversion device of FIG.

  The thermoelectric conversion device 10 of the present embodiment is formed by connecting three thermoelectric conversion units 10a, 10b, and 10c side by side with their spiral directions aligned. Each thermoelectric conversion unit 10a, 10b, 10c has the same structure as the thermoelectric conversion apparatus of 1st Embodiment mentioned above.

  The thick line in FIG. 22 indicates the position of the step in the front view of FIG.

  According to the thermoelectric conversion device 10 of the present embodiment described above, since it has a plurality of thermoelectric conversion units arranged side by side, it is possible to increase the power generated by thermoelectric power generation. In addition, the thermoelectric conversion device 10 has a compact size because the thermoelectric conversion units are aligned and coupled with the spiral direction aligned.

  In the present embodiment, the three thermoelectric conversion units are combined, but the number of thermoelectric conversion units forming the thermoelectric conversion device may be two, or four or more. good.

  Next, an embodiment of a preferable method for manufacturing the thermoelectric conversion device described above will be described below with reference to FIG.

  First, as shown in FIG. 23A, thermoelectric conversion substrate continuous bodies 200a and 200b in which a plurality of thermoelectric conversion substrates are continuously formed are formed. The thermoelectric conversion substrate continuous body 200a has a structure in which three thermoelectric conversion substrates described in the method for manufacturing the thermoelectric conversion device of the first embodiment described above are continuous. The thermoelectric conversion substrates 20 a are joined to each other at the side surfaces with the direction of the slits 27 aligned.

  The thermoelectric conversion substrate continuous body 200b has the same structure as the thermoelectric conversion substrate continuous body 200a except that the positions of the slits 27 are different.

  Next, as shown in FIG. 23B, the thermoelectric conversion substrate continuum 200a and the thermoelectric conversion substrate continuum 200b are bent to form a cut portion in the slit 27, and the corresponding cut portions are inserted into each other. Thus, the thermoelectric conversion substrate continuous body composite 300a is formed. This thermoelectric conversion substrate continuous body composite 300a has a structure in which three thermoelectric conversion substrate composites shown in FIG. Here, three thermoelectric conversion board | substrate continuous body composites are formed.

  Next, three thermoelectric conversion board | substrate continuous body composite bodies 300a, 300b, 300c are joined in the direction of a spiral, and the thermoelectric conversion apparatus 10 shown in FIG.21 and FIG.22 is formed.

  In the present invention, the thermoelectric conversion device and the manufacturing method thereof according to each of the embodiments described above can be appropriately changed without departing from the spirit of the present invention.

  For example, the first substrate on which the thermoelectric conversion element shown in FIG. 6B is mounted may be formed as shown in FIG. Specifically, first, as shown in FIG. 24A, a substrate 60 formed by laminating a non-conductive layer 60b on both surfaces of a conductive layer 60a is formed.

  Next, as shown in FIG. 24B, portions of the non-conductive layer at predetermined portions of the substrate 60 are removed from both surfaces of the substrate 60 to expose portions of the conductive layer 60a.

  Next, as shown in FIG. 24C, a conductive adhesive 61 is applied to a portion where the conductive layer 60 a on one surface of the substrate 60 is exposed, and an outer peripheral seal portion 62 is formed on the periphery of the substrate 60. It is formed.

  Next, as shown in FIG. 24D, a p-type semiconductor element 63 and an n-type semiconductor element 64 are bonded to a conductive adhesive 61 applied to the exposed portion of the conductive layer 60a, so that a thermoelectric conversion element 65 is obtained. Is mounted on the substrate 60. In this way, a substrate on which the thermoelectric conversion element is mounted is formed.

  In the substrate on which the thermoelectric conversion element shown in FIG. 24D is mounted, the heat medium flowing under the substrate 60 does not go through the non-conductive layer 60b with low thermal conductivity, and the conductive layer 60a with high thermal conductivity. Direct thermal contact. Therefore, the heat transfer efficiency between the thermoelectric conversion element 65 and the heat medium flowing under the substrate 60 is improved.

  All examples and conditional words mentioned herein are intended for educational purposes to help the reader deepen and understand the inventions and concepts contributed by the inventor. All examples and conditional words mentioned herein are to be construed without limitation to such specifically stated examples and conditions. Also, such exemplary mechanisms in the specification are not related to showing the superiority and inferiority of the present invention. While embodiments of the present invention have been described in detail, it should be understood that various changes, substitutions or modifications can be made without departing from the spirit and scope of the invention.

  Regarding the above-described embodiments, the following additional notes are disclosed.

(Appendix 1)
A first heat medium flow path and a second heat medium flow path arranged around a columnar hollow portion to form a double spiral flow path;
A spiral first thermoelectric converter that forms one boundary between the first heat medium flow path and the second heat medium flow path;
A spiral second thermoelectric converter that forms the other boundary between the first heat medium flow path and the second heat medium flow path;
With
The first thermoelectric conversion unit and the second thermoelectric conversion unit are flexible thermoelectric conversion devices.

(Appendix 2)
The thermoelectric conversion device according to appendix 1, wherein the first heat medium flow path and the second heat medium flow path are not connected to the hollow portion.

(Appendix 3)
The thermoelectric device according to appendix 2, wherein the first heat medium flow channel and the second heat medium flow channel are not opened to the outside at a portion not sandwiched between the first thermoelectric conversion unit and the second thermoelectric conversion unit. Conversion device.

(Appendix 4)
The thermoelectric conversion device according to supplementary note 1, wherein either one of the first heat medium flow path or the second heat medium flow path is connected to the hollow portion.

(Appendix 5)
The first heat medium flow path is not connected to the hollow portion, and a portion not sandwiched between the first thermoelectric conversion portion and the second thermoelectric conversion portion is in contact with the hollow portion. Except for the parts that are open to the outside,
The second heat medium flow path is connected to the hollow portion, and a portion not sandwiched between the first thermoelectric conversion portion and the second thermoelectric conversion portion is excluded from a portion connected to the hollow portion. The thermoelectric conversion device according to appendix 4, which is not open to the outside.

(Appendix 6)
Each of the first thermoelectric conversion unit and the second thermoelectric conversion unit includes a flexible first substrate and a flexible second substrate,
The said 1st board | substrate and the said 2nd board | substrate are any one of the additional notes 1-5 by which the thermoelectric conversion circuit which has a p-type semiconductor element and an n-type semiconductor element is arrange | positioned between both board | substrates, and is laminated | stacked. Thermoelectric conversion device.

(Appendix 7)
A first heat medium flow path and a second heat medium flow path forming a double spiral flow path disposed around the columnar hollow portion;
A spiral first thermoelectric converter that forms one boundary between the first heat medium flow path and the second heat medium flow path;
A spiral second thermoelectric converter that forms the other boundary between the first heat medium flow path and the second heat medium flow path;
And the first thermoelectric conversion unit and the second thermoelectric conversion unit are formed by combining a plurality of flexible thermoelectric conversion units aligned in a spiral direction.

(Appendix 8)
A flexible first substrate having a first through hole located in the center and a first slit extending from an edge to the first through hole;
A flexible second substrate having a second through hole located in the center and a second slit extending from the edge to the second through hole;
A thermoelectric conversion circuit disposed on the first substrate and having a first electrode and a second electrode;
With
The second substrate is laminated on the first substrate with the thermoelectric conversion circuit sandwiched between the first through hole and the second through hole, and the first slit and the second slit. And
Between the first substrate and the second substrate, an inter-substrate seal portion is formed to seal the inside, and the first through hole, the second through hole, and the inter-substrate seal between these through holes. A central through hole is formed by a portion of the seal portion, and a first end surface and a second end surface are formed between the first slit and the second slit by the portion of the inter-substrate seal portion. And
A flexible thermoelectric conversion substrate in which the first electrode is disposed on the first end surface and the second electrode is disposed on the second end surface.

(Appendix 9)
Two thermoelectric conversion boards according to appendix 8 are provided,
In each of the two thermoelectric conversion substrates, the first substrate and the second substrate have the same shape, the first through hole and the second through hole have the same shape, and the inter-substrate seal portion Is formed between the periphery of the first substrate and the periphery of the second substrate,
Each of the two thermoelectric conversion substrates has a central seal portion that is interrupted at the position of the second slit around the second through hole on the second substrate, and a peripheral edge on the second substrate. Is formed with an outer peripheral seal part which is interrupted at the position of the second slit, and the end part on the first end face side and the end part on the second end face side are opposite to each other in these surface directions. Has been displaced,
The end portion on the first end face side of one of the thermoelectric conversion substrates is overlaid on the upper side of the other thermoelectric conversion substrate, and the end portion on the second end face side of one of the thermoelectric conversion substrates is placed on the other end Overlay the bottom of the thermoelectric conversion board,
The end portion on the first end face side of the other thermoelectric conversion substrate is overlaid on the upper side of one thermoelectric conversion substrate, and the end portion on the second end face side of the other thermoelectric conversion substrate is placed on one of the thermoelectric conversion substrates. Overlay the bottom of the thermoelectric conversion board,
One of the thermoelectric conversion substrates and the other thermoelectric conversion substrate are overlaid with the center through-holes aligned,
The central seal portion of one of the thermoelectric conversion substrates is disposed in a portion around the central through hole on the lower surface of the other thermoelectric conversion substrate that is overlaid, and the central seal portion of the other thermoelectric conversion substrate is , Disposed in a portion around the central through hole on the lower surface of one of the thermoelectric conversion substrates that are superposed, extending central through hole is formed by these central seal portion and the central through hole,
The outer peripheral seal portion of one of the thermoelectric conversion substrates is disposed at a peripheral portion of the lower surface of the other thermoelectric conversion substrate that is overlapped, and the outer peripheral seal portion of the other thermoelectric conversion substrate is overlapped. The thermoelectric conversion board | substrate composite body arrange | positioned at the peripheral part of the lower surface of one said thermoelectric conversion board | substrate.

(Appendix 10)
Two thermoelectric conversion boards according to appendix 8 are provided,
In each of the two thermoelectric conversion substrates, the first through hole and the second through hole have the same shape, the first substrate and the second substrate have the same shape, and the inter-substrate seal portion Is formed between the periphery of the first substrate and the periphery of the second substrate,
On the peripheral edge on the second substrate in one of the thermoelectric conversion substrates, an outer peripheral seal portion that is interrupted at the position of the second slit is formed,
Around the second through hole on the second substrate in the other thermoelectric conversion substrate, a central seal portion that is interrupted at the position of the second slit is formed,
Each of the two thermoelectric conversion substrates, the end portion on the first end surface side and the end portion on the second end surface side are shifted in directions opposite to each other in these surface directions,
The end portion on the first end face side of one of the thermoelectric conversion substrates is overlaid on the upper side of the other thermoelectric conversion substrate, and the end portion on the second end face side of one of the thermoelectric conversion substrates is placed on the other end Overlay the bottom of the thermoelectric conversion board,
The end portion on the first end face side of the other thermoelectric conversion substrate is overlaid on the upper side of one thermoelectric conversion substrate, and the end portion on the second end face side of the other thermoelectric conversion substrate is placed on one of the thermoelectric conversion substrates. Overlay the bottom of the thermoelectric conversion board,
One of the thermoelectric conversion substrates and the other thermoelectric conversion substrate are overlapped with each other with the center through-holes aligned,
The central seal portion of the other thermoelectric conversion substrate is disposed in a portion around the central through hole on the lower surface of the one of the superimposed thermoelectric conversion substrates, and is extended by the central seal portion and the central through hole. A central through hole is formed,
The thermoelectric conversion substrate composite, wherein the outer peripheral seal portion of one of the thermoelectric conversion substrates is disposed at a peripheral portion of the lower surface of the other thermoelectric conversion substrate that is overlaid.

(Appendix 11)
Comprising a plurality of thermoelectric conversion substrate composites according to appendix 9,
The first end surface of one of the thermoelectric conversion substrates in one thermoelectric conversion substrate composite and the second end surface of one of the thermoelectric conversion substrates in another thermoelectric conversion substrate composite are these end surfaces. In which the first electrode and the second electrode are electrically connected and joined,
The first end surface of the other thermoelectric conversion substrate in the one thermoelectric conversion substrate composite and the second end surface of the other thermoelectric conversion substrate in the another thermoelectric conversion substrate composite are these end surfaces. In which the first electrode and the second electrode are electrically connected and joined,
In the one thermoelectric conversion substrate composite, the central seal portion of one of the thermoelectric conversion substrates and the central seal portion of the other thermoelectric conversion substrate are overlapped with each other. Is joined to the peripheral part of the extending central through hole of
In the one thermoelectric conversion substrate composite, the outer peripheral seal portion of one of the thermoelectric conversion substrates and the outer peripheral seal portion of the other thermoelectric conversion substrate are overlapped with each other. It is joined with the peripheral part of
A thermoelectric conversion device in which a plurality of the thermoelectric conversion substrate composites are overlapped with each other with the extension center through-holes aligned.

(Appendix 12)
Comprising a plurality of thermoelectric conversion substrate composites according to appendix 10,
The first end surface of one of the thermoelectric conversion substrates in one thermoelectric conversion substrate composite and the second end surface of one of the thermoelectric conversion substrates in another thermoelectric conversion substrate composite are these end surfaces. In which the first electrode and the second electrode are electrically connected and joined,
The first end surface of the other thermoelectric conversion substrate in the one thermoelectric conversion substrate composite and the second end surface of the other thermoelectric conversion substrate in the another thermoelectric conversion substrate composite are these end surfaces. In which the first electrode and the second electrode are electrically connected and joined,
The central seal portion of the other thermoelectric conversion substrate in the one thermoelectric conversion substrate composite is joined to a portion around the extended central through hole on the lower surface of the another thermoelectric conversion substrate composite that is overlaid. ,
The outer peripheral seal portion of one of the thermoelectric conversion substrates in the one thermoelectric conversion substrate composite is joined to a peripheral portion of the lower surface of the another thermoelectric conversion substrate composite that is overlaid,
A thermoelectric conversion device in which a plurality of the thermoelectric conversion substrate composites are overlapped with each other with the extension center through-holes aligned.

(Appendix 13)
A plurality of thermoelectric conversion elements are mounted on a flexible first substrate having a first through hole located in the center and a first slit extending from the edge to the first through hole,
A flexible second substrate having a second through hole located in the center and a second slit extending from an edge to the second through hole on the first substrate on which the plurality of thermoelectric conversion elements are mounted. A thermoelectric conversion circuit having the plurality of thermoelectric conversion elements between both substrates, wherein the first through hole and the second through hole are aligned and the first slit and the second slit are aligned and stacked. Forming, and
Between the first substrate and the second substrate, an inter-substrate seal portion that seals the inside is formed, and the first through hole, the second through hole, and the inter-substrate seal between these through holes A central through hole is formed by a portion of the seal portion, and a first end surface and a second end surface facing each other are formed by the portion of the inter-substrate seal portion between the first slit and the second slit. ,
The manufacturing method of the thermoelectric conversion board | substrate which arrange | positions the 1st electrode of the said thermoelectric conversion circuit to the said 1st end surface, and arrange | positions the 2nd electrode of the said thermoelectric conversion circuit to the said 2nd end surface.

(Appendix 14)
The first substrate on which the thermoelectric conversion element is mounted is
Removing a portion of the non-conductive layer at a predetermined portion of the substrate formed by laminating the non-conductive layer on both sides of the conductive layer to expose the portion of the conductive layer by removing from both sides of the substrate;
The method of manufacturing a thermoelectric conversion substrate according to appendix 13, wherein a thermoelectric conversion element is mounted on a portion of the one surface of the substrate where the conductive layer is exposed.

(Appendix 15)
A central through hole,
A slit extending from the edge to the central through hole;
A first end face and a second end face facing each other across the slit;
A first electrode disposed on the first end face;
A second electrode disposed on the second end surface;
A method of manufacturing a thermoelectric conversion composite substrate using a flexible thermoelectric conversion substrate having
The first end face side end part and the second end face side end part of each of the two thermoelectric conversion substrates are shifted in directions opposite to each other in these plane directions to form a cut part,
Inserting the cut portion of one of the thermoelectric conversion substrates and the cut portion of the other thermoelectric conversion substrate,
The end portion on the first end face side of one of the thermoelectric conversion substrates is overlaid on the upper side of the other thermoelectric conversion substrate, and the end portion on the second end face side of one of the thermoelectric conversion substrates is placed on the other end The thermoelectric conversion board is overlaid on the lower side, the end on the first end face side of the other thermoelectric conversion board is overlaid on the upper side of one of the thermoelectric conversion boards, and the second end face of the other thermoelectric conversion board is overlaid. A thermoelectric conversion composite in which one end of the thermoelectric conversion substrate is overlaid on the lower side of the one thermoelectric conversion substrate, and the one thermoelectric conversion substrate and the other thermoelectric conversion substrate are overlapped with the center through-holes aligned. A method for manufacturing a substrate.

(Appendix 16)
Around the central through hole on the upper surface of each of the two thermoelectric conversion substrates, a central seal portion that is interrupted at the position of the slit is formed,
On the periphery of the upper surface of each of the two thermoelectric conversion substrates, an outer peripheral seal portion that is interrupted at the position of the slit is formed,
When superposing one thermoelectric conversion substrate and the other thermoelectric conversion substrate with the center through-holes aligned with each other,
The central seal portion of one of the thermoelectric conversion substrates is disposed in a portion around the central through hole on the lower surface of the other thermoelectric conversion substrate that is overlaid, and the central seal of the other thermoelectric conversion substrate A portion is disposed in a portion around the central through hole on the lower surface of one of the thermoelectric conversion substrates that are overlaid, and an extended central through hole is formed by the central seal portion and the central through hole, and
The outer peripheral seal portion of one of the thermoelectric conversion substrates is disposed on the peripheral portion of the lower surface of the other thermoelectric conversion substrate that is overlaid, and the outer peripheral seal portion of the other thermoelectric conversion substrate is overlaid. The manufacturing method of the thermoelectric conversion board | substrate composite_body | complex of Additional remark 15 arrange | positioned in the peripheral part of the lower surface of the one said thermoelectric conversion board | substrate which is carrying out.

(Appendix 17)
Around the central through hole on the upper surface of the other thermoelectric conversion substrate is formed a central seal portion that is interrupted at the position of the slit,
On the periphery of the upper surface of one of the thermoelectric conversion substrates, an outer peripheral seal portion that is interrupted at the position of the slit is formed,
When superposing one thermoelectric conversion substrate and the other thermoelectric conversion substrate with the center through-holes aligned with each other,
The central seal portion of the other thermoelectric conversion substrate is arranged in a portion around the central through hole on the lower surface of one of the superimposed thermoelectric conversion substrates, and is stretched by the central seal portion and the central through hole. The thermoelectric conversion board according to appendix 15, wherein a central through hole is formed, and the outer peripheral seal portion of one of the thermoelectric conversion boards is disposed at a peripheral portion of the lower surface of the other thermoelectric conversion board that is overlaid. A method for producing a composite.

(Appendix 18)
A method of manufacturing a thermoelectric conversion device using a plurality of thermoelectric conversion composite substrates according to appendix 16,
The first end surface of one of the thermoelectric conversion substrates in one thermoelectric conversion substrate composite and the second end surface of one of the thermoelectric conversion substrates in another thermoelectric conversion substrate composite, these end surfaces Electrically connecting and joining the first electrode and the second electrode in; and
The first end face of the other thermoelectric conversion board in the one thermoelectric conversion board composite and the second end face of the other thermoelectric conversion board in the another thermoelectric conversion board composite are these end faces. Electrically connecting and joining the first electrode and the second electrode in; and
The lower surface of the other one thermoelectric conversion substrate composite in which the central seal portion of one of the thermoelectric conversion substrates and the central seal portion of the other thermoelectric conversion substrate in the one thermoelectric conversion substrate composite are overlaid. And a portion around the extended central through hole of
The lower surface of the one other thermoelectric conversion substrate composite in which the outer peripheral seal portion of one of the thermoelectric conversion substrates and the outer peripheral seal portion of the other thermoelectric conversion substrate in the one thermoelectric conversion substrate composite are overlaid. Join to the peripheral part of
The manufacturing method of the thermoelectric conversion apparatus which aligns the said extending | stretching center through-hole mutually, and overlaps several said thermoelectric conversion board | substrate composite bodies.

(Appendix 19)
A method for manufacturing a thermoelectric conversion device using a plurality of thermoelectric conversion composite substrates according to appendix 17,
The first end surface of one of the thermoelectric conversion substrates in one thermoelectric conversion substrate composite and the second end surface of one of the thermoelectric conversion substrates in another thermoelectric conversion substrate composite, these end surfaces Electrically connecting and joining the first electrode and the second electrode in; and
The first end face of the other thermoelectric conversion board in the one thermoelectric conversion board composite and the second end face of the other thermoelectric conversion board in the another thermoelectric conversion board composite are these end faces. Electrically connecting and joining the first electrode and the second electrode in; and
The center seal portion of the other thermoelectric conversion substrate in the one thermoelectric conversion substrate composite is joined to a portion around the extended central through hole on the lower surface of the another thermoelectric conversion substrate composite that is overlaid. ,and,
The outer peripheral seal portion of one of the thermoelectric conversion substrates in the one thermoelectric conversion substrate composite is joined to a peripheral portion of the lower surface of the another thermoelectric conversion substrate composite that is overlaid,
The manufacturing method of the thermoelectric conversion apparatus which aligns the said extending | stretching center through-hole mutually, and overlaps several said thermoelectric conversion board | substrate composite bodies.

DESCRIPTION OF SYMBOLS 10 Thermoelectric conversion apparatus 11 Hollow part 12 1st heat medium flow path 13 2nd heat medium flow path 14 1st thermoelectric conversion part 15 2nd thermoelectric conversion part 16 Lead wire 20a, 20b Thermoelectric conversion board 21 Inter-substrate sealing part 22 Center penetration Hole 23 First end face 23a End part on the first end face side 24 Second end face 24a End part on the second end face side 25 Central seal part 26 Peripheral seal part 27 Slit 28 Cut part 31 First substrate 32 First through hole 33 1st Slit 34 second substrate 35 second through hole 36 second slit 40 thermoelectric conversion circuit 41 p-type semiconductor element 42 n-type semiconductor element 43 first conductive plate 44 second conductive plate 45 first electrode 46 second electrode 47 conductive adhesive Material 48 Thermoelectric conversion element 50a, 50b, 50c, 50d Thermoelectric conversion substrate composite 51 Stretch center through hole 60 Substrate 60a Conductive layer 60b Non-conductive layer 6 DESCRIPTION OF SYMBOLS 1 Conductive adhesive material 62 Inter-substrate seal part 63 p-type semiconductor element 64 n-type semiconductor element 200a, 200b Thermoelectric conversion board | substrate continuous body 300a, 300b, 300c Thermoelectric conversion board | substrate continuous body composite body

Claims (6)

A first heat medium flow path and a second heat medium flow path arranged around a columnar hollow portion to form a double spiral flow path;
A spiral first thermoelectric converter that forms one boundary between the first heat medium flow path and the second heat medium flow path;
A spiral second thermoelectric converter that forms the other boundary between the first heat medium flow path and the second heat medium flow path;
With
The first thermoelectric conversion unit and the second thermoelectric conversion unit are flexible thermoelectric conversion devices. A central through hole,
A slit extending from the edge to the central through hole;
A first end face and a second end face facing each other across the slit;
A first electrode disposed on the first end face;
A second electrode disposed on the second end surface;
A method of manufacturing a thermoelectric conversion composite substrate using a flexible thermoelectric conversion substrate having
The first end face side end part and the second end face side end part of each of the two thermoelectric conversion substrates are shifted in directions opposite to each other in these plane directions to form a cut part,
Inserting the cut portion of one of the thermoelectric conversion substrates and the cut portion of the other thermoelectric conversion substrate,
The end portion on the first end face side of one of the thermoelectric conversion substrates is overlaid on the upper side of the other thermoelectric conversion substrate, and the end portion on the second end face side of one of the thermoelectric conversion substrates is placed on the other end The thermoelectric conversion board is overlaid on the lower side, the end on the first end face side of the other thermoelectric conversion board is overlaid on the upper side of one of the thermoelectric conversion boards, and the second end face of the other thermoelectric conversion board is overlaid. A thermoelectric conversion composite in which one end of the thermoelectric conversion substrate is overlaid on the lower side of the one thermoelectric conversion substrate, and the one thermoelectric conversion substrate and the other thermoelectric conversion substrate are overlapped with the center through-holes aligned. A method for manufacturing a substrate. Around the central through hole on the upper surface of each of the two thermoelectric conversion substrates, a central seal portion that is interrupted at the position of the slit is formed,
On the periphery of the upper surface of each of the two thermoelectric conversion substrates, an outer peripheral seal portion that is interrupted at the position of the slit is formed,
When superposing one thermoelectric conversion substrate and the other thermoelectric conversion substrate with the center through-holes aligned with each other,
The central seal portion of one of the thermoelectric conversion substrates is disposed in a portion around the central through hole on the lower surface of the other thermoelectric conversion substrate that is overlaid, and the central seal of the other thermoelectric conversion substrate A portion is disposed in a portion around the central through hole on the lower surface of one of the thermoelectric conversion substrates that are overlaid, and an extended central through hole is formed by the central seal portion and the central through hole, and
The outer peripheral seal portion of one of the thermoelectric conversion substrates is disposed on the peripheral portion of the lower surface of the other thermoelectric conversion substrate that is overlaid, and the outer peripheral seal portion of the other thermoelectric conversion substrate is overlaid. The manufacturing method of the thermoelectric conversion board | substrate composite_body | complex of Claim 2 arrange | positioned in the peripheral part of the lower surface of the one said thermoelectric conversion board | substrate which is carrying out. Around the central through hole on the upper surface of the other thermoelectric conversion substrate is formed a central seal portion that is interrupted at the position of the slit,
On the periphery of the upper surface of one of the thermoelectric conversion substrates, an outer peripheral seal portion that is interrupted at the position of the slit is formed,
When superposing one thermoelectric conversion substrate and the other thermoelectric conversion substrate with the center through-holes aligned with each other,
The central seal portion of the other thermoelectric conversion substrate is arranged in a portion around the central through hole on the lower surface of one of the superimposed thermoelectric conversion substrates, and is stretched by the central seal portion and the central through hole. The thermoelectric conversion according to claim 2, wherein a central through hole is formed, and the outer peripheral seal portion of one of the thermoelectric conversion substrates is disposed at a peripheral portion of the lower surface of the other thermoelectric conversion substrate that is overlaid. A method for producing a substrate composite. A method of manufacturing a thermoelectric conversion device using a plurality of thermoelectric conversion composite substrates according to claim 3,
The first end surface of one of the thermoelectric conversion substrates in one thermoelectric conversion substrate composite and the second end surface of one of the thermoelectric conversion substrates in another thermoelectric conversion substrate composite, these end surfaces Electrically connecting and joining the first electrode and the second electrode in; and
The first end face of the other thermoelectric conversion board in the one thermoelectric conversion board composite and the second end face of the other thermoelectric conversion board in the another thermoelectric conversion board composite are these end faces. Electrically connecting and joining the first electrode and the second electrode in; and
The lower surface of the other one thermoelectric conversion substrate composite in which the central seal portion of one of the thermoelectric conversion substrates and the central seal portion of the other thermoelectric conversion substrate in the one thermoelectric conversion substrate composite are overlaid. And a portion around the extended central through hole of
The lower surface of the one other thermoelectric conversion substrate composite in which the outer peripheral seal portion of one of the thermoelectric conversion substrates and the outer peripheral seal portion of the other thermoelectric conversion substrate in the one thermoelectric conversion substrate composite are overlaid. Join to the peripheral part of
The manufacturing method of the thermoelectric conversion apparatus which aligns the said extending | stretching center through-hole mutually, and overlaps several said thermoelectric conversion board | substrate composite bodies. A method of manufacturing a thermoelectric conversion device using a plurality of thermoelectric conversion composite substrates according to claim 4,
The first end surface of one of the thermoelectric conversion substrates in one thermoelectric conversion substrate composite and the second end surface of one of the thermoelectric conversion substrates in another thermoelectric conversion substrate composite, these end surfaces Electrically connecting and joining the first electrode and the second electrode in; and
The first end face of the other thermoelectric conversion board in the one thermoelectric conversion board composite and the second end face of the other thermoelectric conversion board in the another thermoelectric conversion board composite are these end faces. Electrically connecting and joining the first electrode and the second electrode in; and
The center seal portion of the other thermoelectric conversion substrate in the one thermoelectric conversion substrate composite is joined to a portion around the extended central through hole on the lower surface of the another thermoelectric conversion substrate composite that is overlaid. ,and,
The outer peripheral seal portion of one of the thermoelectric conversion substrates in the one thermoelectric conversion substrate composite is joined to a peripheral portion of the lower surface of the another thermoelectric conversion substrate composite that is overlaid,
The manufacturing method of the thermoelectric conversion apparatus which aligns the said extending | stretching center through-hole mutually, and overlaps several said thermoelectric conversion board | substrate composite bodies.

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