JP2011233658A - Flow channel built-in substrate and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flow channel built-in substrate which reduces the temperature difference in a heat exchange medium flowing in the flow channel and reduces the bias in a heat distribution inside of the substrate.SOLUTION: The flow channel built-in substrate 1 comprises: a base substance which has a first substrate provided with a pair of wall parts 21b that face each other, on a principal surface, and a second substrate which is joined to the pair of the wall parts and forms a cavity 4 for flowing the heat exchange medium between itself and the first substrate; and rectification members 3 which are fixed to the base substance and arranged so as to divide the cavity into a plurality of flow channels. The rectification members are open to the adjacent flow channels respectively and have an aperture 3a for connecting these flow channels.

Description

  The present invention relates to a flow path built-in substrate and an electronic device.

  As an example of a cooler that exhausts heat generated from a semiconductor element such as an LED, a substrate with a built-in channel shown in Patent Document 1 has been proposed.

  The substrate with a built-in flow path described in Patent Document 1 includes a base body having a hollow portion therein and a rectifying member made of a metal plate inserted into the hollow portion. The rectifying member is provided so as to divide the cavity into a plurality of flow paths. A heat exchange medium such as water flows into the cavity. An element is disposed on the substrate, and heat generated from the element is transmitted to the heat exchange medium through the substrate. The heat exchange medium that has absorbed the heat transmitted from the element is discharged from the flow path built-in substrate. Thereby, the heat generated in the element is released to the outside.

  When the rectifying member is not provided, the flow of the heat exchange medium varies between the central portion and the end portion of the hollow portion. As a result, the heat exchange between the substrate and the heat exchange medium varies depending on the location of the substrate. In the flow path built-in substrate described in Patent Document 1, the flow variation is reduced by providing the flow straightening member.

JP 2001-35981 A

  The substrate with a built-in flow path described in Patent Document 1 only has a flow path divided by a rectifying member. Therefore, when an element is mounted on a base, a heat exchange medium that flows in a flow path that is located directly below the element and that easily transmits heat from the element and a heat exchange medium that flows in a flow path located elsewhere There is a possibility that a large temperature difference occurs between the two and the heat distribution inside the flow path built-in substrate.

  According to one aspect of the present invention, the flow path built-in substrate includes a base and a rectifying member. The base body includes a first substrate having a pair of wall portions opposed to each other on the main surface, and a second portion formed by joining the wall portion and a cavity for flowing the heat exchange medium between the first substrate and the substrate. Having a substrate. The rectifying member is provided so as to divide the cavity into a plurality of flow paths, and is fixed to the base. Furthermore, the rectifying member has an opening that opens to adjacent flow paths and connects these flow paths.

  According to one aspect of the present invention, since the rectifying member has openings that are respectively open to adjacent flow paths and connect these flow paths, Distribution bias is reduced. More specifically, when the rectifying member has the above structure, the heat exchange medium can move between the adjacent flow paths through the opening. Therefore, heat can be easily exchanged between these flow paths. As a result, the temperature difference between the heat exchange media flowing in the respective flow paths is reduced, and the uneven distribution of heat in the flow path built-in substrate is reduced.

It is a top view which shows the board | substrate with a built-in flow path of 1st Embodiment, and an electronic device provided with the same. It is sectional drawing in the cross section which is parallel to the upper surface of the 2nd board | substrate of the flow path built-in board | substrate shown in FIG. FIG. 2 is a cross-sectional view taken along the line AA of the substrate with a built-in channel illustrated in FIG. It is a BB sectional view of a channel built-in board shown in Drawing 1, and an electronic device provided with the same. It is a perspective view which shows the rectification | straightening member in the board | substrate with a built-in flow path of 1st Embodiment. It is sectional drawing which shows the 1st modification of the board | substrate with a built-in flow path of 1st Embodiment, and an electronic device provided with the same. It is a top view which shows the rectification | straightening member in the 2nd modification of the flow path incorporation board | substrate of 1st Embodiment, and an electronic device provided with the same. It is a top view which shows the rectification | straightening member in the 3rd modification of a flow path built-in board | substrate of 1st Embodiment, and an electronic device provided with the same. It is a top view which shows the rectification | straightening member in the 4th modification of a flow path built-in board | substrate of 1st Embodiment, and an electronic device provided with the same. It is a disassembled perspective view which shows the rectification | straightening member in the flow-path built-in board | substrate of 2nd Embodiment, and an electronic device provided with the same. It is a perspective view which shows the rectification | straightening member in the 1st modification of the flow-path built-in board | substrate of 2nd Embodiment, and an electronic device provided with the same. It is a disassembled perspective view which shows the rectification | straightening member in the 2nd modification of the flow-path built-in board | substrate of 2nd Embodiment, and an electronic device provided with the same.

  Hereinafter, a substrate with a built-in channel according to an embodiment of the present invention and an electronic apparatus using the substrate will be described with reference to the drawings. However, in the drawings referred to below, for convenience of explanation, among the constituent members of the embodiment, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the flow path built-in substrate and the electronic apparatus using the same according to the present invention can include arbitrary constituent members not shown in the drawings. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1 to 5, the flow path built-in substrate 1 according to the first embodiment is joined to the first substrate 21 and the wall portion 21 b which are provided with a pair of wall portions 21 b facing each other on the main surface. The base 2 having the second substrate 22 that forms the cavity 4 for allowing the heat exchange medium to flow between the base 21 and the rectifying member 3 provided in the cavity 4 of the base 2 is provided. The cavity 4 is divided into a plurality of flow paths 41 by the rectifying member 3. When the flow path built-in substrate 1 is used, a liquid or gas containing, for example, water or an organic solvent as a main component flows in the flow path 41 as a heat exchange medium. Thus, since the heat exchange medium flows through the flow path 41, the heat transmitted to the base 2 can be released to the outside through the heat exchange medium.

  The base body 2 of the present embodiment has a first substrate 21 and a second substrate 22 bonded to the first substrate 21. Between the first substrate 21 and the second substrate 22, a cavity 4 is formed that opens at one end and the other end of the base 2. One end side is the upstream side of the flow path 41, and the heat exchange medium flows into the cavity portion 4 from this one end portion. Further, the other end side is the downstream side of the flow path 41, and the heat exchange medium flowing through the flow path 41 is discharged to the outside from the other end.

  The first substrate 21 includes a main substrate 21a that is a flat plate member and a pair of flat wall portions 21b that are provided on the main substrate 21a and face each other. As the main substrate 21a and the wall 21b, for example, ceramics or metal can be used as a material. Examples of ceramics include alumina and aluminum nitride. Examples of the metal include molybdenum, tungsten, iron, copper, nickel, cobalt, and alloys thereof. The main substrate 21a and the wall portion 21b may be joined after being formed separately, or may be integrally formed. When the main substrate 21a and the wall portion 21b are formed separately, the main substrate 21a and the wall portion 21b may be joined using a brazing material.

  The second substrate 22 has a flat plate shape and is joined to the wall portion 21 b of the first substrate 21. In the present embodiment, the second substrate 22 is bonded to the upper surfaces of the pair of wall portions 21b, but the present invention is not limited to this. For example, you may join with respect to the mutually opposing side surface of a pair of wall part 21b, respectively.

  As the second substrate 22, the same material as that of the first substrate 21 can be used. In particular, the second substrate 22 is preferably made of the same material as the first substrate 21. This is because the difference in thermal expansion between the first substrate 21 and the second substrate 22 is reduced, so that the thermal stress applied to the base 2 can be reduced. Thereby, the reliability of the flow path built-in substrate 1 can be improved.

  Furthermore, it is preferable that the first substrate 21 and the second substrate 22 are ceramics. Since ceramics has higher rigidity than metal, when ceramics are used as these substrates, the base 2 is less likely to be deformed such as warpage. Therefore, for example, when the flow path built-in substrate 1 is installed on an external substrate (not shown), the position of the flow path built-in substrate 1 can be stabilized.

  On the upper surface of the second substrate 22, a placement region 22 a on which the electronic component 51 is placed is formed. By placing an electronic component 51 such as a semiconductor element on the placement region 22a, the electronic device 5 including the flow path built-in substrate 1 of the present embodiment can be used. In the case where the second substrate 22 is a metal, ceramics and resin are provided between the wiring conductor 52 and the second substrate 22 in order to insulate the wiring conductor 52 from the metal constituting the second substrate 22. An insulating member (not shown) such as glass may be provided.

  It is preferable that at least a part of the placement region 22a on which the electronic component 51 is placed is positioned so as to overlap with the flow path 41 when the base body 2 is viewed through. The electronic device 5 is preferably positioned so that the electronic component 51 overlaps the flow path 41 when the base 2 is seen through in plan. This is because the heat generated in the electronic component 51 can be efficiently transferred to the heat exchange medium.

  A wiring conductor 52 that is electrically connected to the electronic component 51 is disposed on the upper surface of the second substrate 22. Signals can be input / output between the electronic component 51 and an external circuit (not shown) via the wiring conductor 52. As the wiring conductor 52, a member having good conductivity is preferably used. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold, or a member obtained by stacking these metals in layers can be used as the wiring conductor 52.

  The electronic device 5 of this embodiment includes an electronic component 51. The electronic component 51 is placed on the placement region 22 a so as to be electrically connected to the wiring conductor 52. The connection between the electronic component 51 and the wiring conductor 52 is performed by wire bonding, for example. Moreover, you may join the electronic component 51 and the wiring conductor 52 using a conductive adhesive. As the electronic component 51, for example, a semiconductor element such as a photoelectric conversion element can be used. Examples of the photoelectric conversion element include an LED element and a solar cell element.

  The electronic component 51 is fixed to the base 2 via an adhesive such as resin, glass and brazing material. When a brazing material is used as an adhesive, a brazing metal layer is disposed between the brazing material and the second substrate 22 in order to improve the bondability between the brazing material and the second substrate 22. It is preferable to do.

  In addition, although the electronic device 5 of this embodiment is provided with the one electronic component 51 as shown in FIG. 1, it is not restricted to this in particular. For example, a configuration in which a plurality of placement regions 22a are formed on the upper surface of the second substrate 22 and the electronic component 51 is placed on each placement region 22a may be employed. That is, the electronic device 5 including a plurality of electronic components 51 may be used.

  An inlet member 23 a and an outlet member 23 b each having an opening connected to the opening of the cavity 4 are joined to one end and the other end of the base 2. A heat exchange medium flows into the cavity 4 from the inlet member 23 a, and the flowed heat exchange medium flows through each flow path 41 divided by the rectifying member 3. The heat exchange media flowing in the respective flow paths 41 divided by the rectifying member 3 are collected at the discharge port member 23b and discharged to the outside.

  Although the flow path built-in substrate 1 of the present embodiment includes one inlet member 23a and one outlet member 23b, the present invention is not particularly limited thereto. For example, a plurality of inlet members 23a and a plurality of outlet members 23b connected to each of the flow paths 41 divided by the rectifying member 3 may be provided. When the plurality of inlet members 23a and the plurality of outlet members 23b are provided as described above, the inflow amount of the heat exchange medium flowing into each channel 41 can be adjusted. 1 can be further reduced.

  A brazing material can be used for joining the base body 2 to the inlet member 23a and the outlet member 23b. As the inlet member 23a and the outlet member 23b, the same member as the first substrate 21 can be used. In particular, it is preferable that the first substrate 21, the second substrate 22, the inlet member 23a, and the outlet member 23b are formed of the same member. This is because the difference in thermal expansion between these members is reduced, so that the thermal stress applied to the base 2 can be further reduced. Thereby, the reliability of the flow path substrate 1 can be further improved.

  A plurality of rectifying members 3 are provided inside the base 2 so as to divide the cavity 4 into a plurality of flow paths 41. Each rectifying member 3 is fixed to the base body 2 in order to suppress the displacement of the rectifying member 3. In order to fix the rectifying member 3 to the base 2, for example, a brazing material may be used to join the base 2. An exemplary brazing material is silver brazing. As shown in FIG. 3, the rectifying member 3 of the present embodiment is fixed to both the first substrate 21 and the second substrate 22, but only to the first substrate 21 as shown in FIG. It may be fixed. 6 is a cross-sectional view showing a cross section that is perpendicular to the direction in which the heat exchange medium flows and includes the center of the substrate 2, as in the cross-sectional view shown in FIG. 4.

  The rectifying member 3 has openings 3 a that open to adjacent flow paths 41 and connect the flow paths 41. As a result, the heat exchange medium can be moved between the adjacent flow paths 41 via the rectifying member 3. Since the temperature difference between the flow paths 41 adjacent to each other via the rectifying member 3 can be reduced, the bias of the heat distribution in the flow path built-in substrate 1 is reduced. As a result, the heat generated from the electronic component 51 can be efficiently transmitted to the heat exchange medium.

  The opening 3a of the rectifying member 3 may be formed by, for example, joining a plurality of plate members having recesses on the surfaces to be joined to each other, and forming a through hole in the plate member using a tool or the like. May be formed.

  The flow path built-in substrate 1 of the present embodiment can move more heat between the adjacent flow paths 41 by providing the opening 3 a in the rectifying member 3. As a result, the temperature difference between the flow paths 41 is reduced, and the uneven distribution of heat in the flow path built-in substrate 1 is reduced. As a result, the heat generated from the electronic component 51 can be efficiently transmitted to the heat exchange medium.

  As shown in FIG. 5, the rectifying member 3 in the present embodiment includes two bent portions 32 and a linear portion 31 positioned between these bent portions 32. Since the bent portion 32 is provided, the heat exchange medium can be transmitted over a wide range of the flow path built-in substrate 1 without increasing the size of the inlet member 23a and the outlet member 23b. Since it is not necessary to enlarge the inlet member 23a and the outlet member 23b, it becomes easy to allow the heat exchange medium to flow into the cavity 4 with high pressure. Therefore, the heat generated from the electronic component 51 can be efficiently transmitted to the heat exchange medium.

  When the channel-embedded substrate 1 is viewed in plan, it is preferable that the straight portion 31 is located in a region overlapping the placement region 22a. This is because the heat exchange medium easily flows in the straight part 31 as compared with the bent part 32, and thus heat generated from the electronic component 51 can be efficiently transmitted to the heat exchange medium.

  As the rectifying member 3, a member similar to the first substrate 21 can be used. In particular, the rectifying member 3 is preferably made of metal. Compared to ceramics, metal is superior in thermal conductivity. Since the rectifying member 3 faces the flow path 41, when metal is used as the rectifying member 3, the heat generated from the electronic component 51 can be efficiently transmitted to the heat exchange medium.

  Further, when the rectifying member 3 is made of metal, the wall portion 21b of the first substrate 21 is also preferably made of metal. Thereby, the difference of the thermal expansion coefficient of the rectification | straightening member 3 and the wall part 21b can be reduced, and the thermal stress added to the flow path built-in board | substrate 1 can be reduced.

  As for the opening part 3a of the rectification | straightening member 3, as shown in FIG. 7, it is preferable that the direction which penetrates between the adjacent flow paths 41 is diagonal with respect to the direction perpendicular | vertical to the transmission direction of a heat exchange medium. In other words, it is preferable that one of the two opening surfaces of the opening 3a is located upstream of the other opening surface through which the heat exchange medium flows. Thereby, the directivity of the flow of the heat exchange medium inside the opening 3a can be enhanced. Specifically, the amount of heat exchange medium flowing from the channel 41 facing the opening surface located on the upstream side to the channel 41 facing the opening surface located on the downstream side is increased. To do. Conversely, the amount of heat exchange medium flowing from the channel 41 facing the opening surface located on the downstream side to the channel 41 facing the opening surface located on the upstream side decreases. Therefore, the stagnation of the heat exchange medium inside the opening 3a can be suppressed. As a result, the heat generated from the electronic component 51 can be efficiently transmitted to the heat exchange medium.

  Further, as the plurality of flow paths 41, the first flow path 41 and the second flow path 41 that are adjacent to each other are provided, and an opening surface that opens to the first flow path 41 is formed in the second flow path 41. It is desirable that it is larger than the opening surface to be opened. Thereby, the directivity of the flow of the heat exchange medium inside the opening 3a can be enhanced. Specifically, the amount of heat exchange medium flowing from the first flow path 41 having a relatively large opening surface into the second flow path 41 having a relatively small opening surface increases. On the contrary, the inflow amount of the heat exchange medium from the second flow path 41 to the first flow path 41 decreases. Therefore, the stagnation of the flow of the heat exchange medium inside the opening 3a can be suppressed. As a result, the heat generated from the electronic component 51 can be efficiently transmitted to the heat exchange medium.

  As shown in FIG. 8, the rectifying member 3 desirably has an annular protrusion 3 b formed on the side surface facing the flow path 41 so as to surround the opening 3 a. The rectifying member 3 in the present embodiment has one annular protrusion 3b, and the opening 3a is surrounded by the protrusion 3b. When it has such a projection part 3b, this can suppress the stagnation of the flow of the heat exchange medium inside the opening part 3a. Specifically, the amount of heat exchange medium flowing from the flow path 41 located on the side where the protrusion 3b is provided into the opening 3a is reduced. For this reason, the heat exchange medium easily flows from the flow channel 41 located on the side where the projection 3b is not provided toward the flow channel 41 located on the side where the projection 3b is provided. Stagnation of the heat exchange medium can be suppressed. As a result, the heat generated from the electronic component 51 can be efficiently transmitted to the heat exchange medium.

  Preferably, as shown in FIG. 8, the rectifying member 3 has an annular protrusion 3 b so as to surround each opening 3 a, and two flow paths in which a part of the protrusion 3 b faces the rectifying member 3. 41 faces one of the flow paths 41, and a part of the protrusions 3 b faces the other flow path 41 of the two flow paths 41 facing the rectifying member 3. Thereby, the flow of the heat exchange medium between the adjacent flow paths 41 can be performed more efficiently.

  The configuration of the rectifying member 3 having the protruding portions 3b is not limited to the configuration shown in FIG. 8, and each protruding portion 3b is only on the side surface of the rectifying member 3 facing the one flow path 41. It may be formed.

  Moreover, it is desirable that the inner surface of the protrusion 3b is continuous with the inner surface of the opening 3a. Thereby, a heat exchange medium can be made easier to flow. Specifically, the step at the boundary between the inner surface of the protrusion 3b and the inner surface of the opening 3a is less than the surface roughness of the protrusion 3b and the opening 3a at an unavoidable level in the manufacturing process. preferable. This is because the heat exchange medium easily flows from the flow channel 41 located on the side where the projection 3b is not provided toward the flow channel 41 located on the side where the projection 3b is provided.

  The configuration of the rectifying member 3 is not particularly limited to the above embodiment. For example, the rectifying member 3 may be composed of only the straight portion 31 or may have a plurality of bent portions 32. Further, as shown in FIG. 9, an opening 3 a may be provided in the bent portion 32.

  Next, a flow path built-in substrate and an electronic apparatus according to a second embodiment of the present invention will be described with reference to FIG. The difference between the substrate with built-in flow path 1 of the second embodiment and the substrate with built-in flow path 1 of the first embodiment is the configuration of the rectifying member 3. About another structure, it is the same as that of the board | substrate 1 with a built-in flow path of 1st Embodiment.

  As shown in FIG. 10, the rectifying member 3 in the present embodiment has a mesh-shaped configuration (net body). The mesh shape here means a shape formed by crossing a plurality of linear or thread-like materials. Specifically, for example, a mesh formed by weaving metals such as wires can be used. In the rectifying member 3 in the present embodiment, the mesh in the mesh body 34 functions as the opening 3a in the first embodiment. Therefore, the mesh is so large that the heat exchange medium can pass through.

  The rectifying member 3 includes a frame 33 having an opening at the center and a net 34 provided at the opening of the frame 33. As the frame 33, the same material as that of the rectifying member 3 in the first embodiment can be used.

  In the case where the rectifying member 3 provided with the net 34 is used as in the flow path built-in substrate 1 of the present embodiment, heat transfer between the rectifying member 3 and the heat exchange medium is efficiently performed. It can be carried out. Compared with the case where the opening 3a is formed by forming a through-hole like the opening 3a in the first embodiment, the flow path of the rectifying member 3 when the rectifying member 3 includes the net 34. It is easy to form large irregularities in the portion facing 41. Therefore, turbulence tends to occur in the flow of the heat exchange medium in the vicinity of the net body 34. As a result, the heat exchange medium is unlikely to stagnate in the vicinity of the mesh body 34, so that heat can be efficiently transferred between the rectifying member 3 and the heat exchange medium.

  The rectifying member 3 in the present embodiment is configured to include a frame 33 having an opening in the center and a net 34 provided in the opening of the frame 33, but as the rectifying member 3 having the net 34 Is not particularly limited to this. For example, as shown in FIG. 11, the rectifying member 3 may be composed of a net body 34. When the rectifying member 3 is composed of the net body 34, the rectifying member 3 is easily deformed. Therefore, even when the base 2 is thermally deformed, the stress generated between the base 2 and the rectifying member 3 can be reduced because the rectifying member 3 is easily deformed. The rectifying member 3 can be fixed to the base 2 by providing a cutout portion in each of the portions of the first substrate 21 and the second substrate 22 facing the cavity portion 4 and inserting the cutout portions into the cutout portions. it can.

  In the case of using a rectifying member 3 having a mesh body 34, as shown in FIG. 12, two frame bodies 33 having an opening at the center, and a mesh body 34 sandwiched between these frame bodies 33, It is preferable to provide. This is because the possibility that the net 34 is peeled off from the frame 33 can be reduced by the configuration in which the net 34 is sandwiched between the two frames 33.

  Next, the manufacturing method of the flow path built-in substrate and the electronic device of the above embodiment will be described.

  First, the first substrate 21 and the second substrate 22 constituting the base 2 are prepared. When each substrate constituting the substrate 2 is, for example, ceramics, a green sheet is molded from a mixture obtained by adding and mixing an organic binder, a plasticizer, a solvent, and the like to raw material powders such as alumina and aluminum nitride.

  By laminating the green sheets, a sheet laminated body to be the main substrate 21a constituting the first substrate 21 is formed. Further, a green sheet to be a pair of wall portions 21b is laminated on the sheet laminate.

  In addition, the green sheets are laminated in the same manner as the sheet laminate that becomes the main substrate 21a, thereby forming the sheet laminate that becomes the second substrate 22. A wiring conductor 52 to be electrically connected to the electronic component 51 is disposed on the upper surface of the sheet laminate that becomes the second substrate 22. The wiring conductor 52 may be disposed as follows. A high melting point metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to obtain a metal paste. Then, a metal paste is applied to the upper surface of the second substrate in the green sheet state to pattern the wiring conductor 52.

  By firing these sheet laminates at a temperature of about 1600 ° C., the first substrate 21 and the second substrate 22 are produced. In the above manufacturing method, the main substrate 21a and the wall portion 21b are integrally formed. However, the main substrate 21a and the wall portion 21b may be separately formed and then joined together using a brazing material.

  Further, when the first substrate 21 and the second substrate 22 are made of, for example, a metal material, by performing metal processing such as punching on the metal plates to be the first substrate 21 and the second substrate 22. The first substrate 21 and the second substrate 22 are produced.

  A plurality of rectifying members 3 having openings 3a are arranged on the main substrate 21a of the manufactured first substrate 21. For example, as shown in FIG. 2, a plurality of rectifying members 3 may be provided side by side on the main board 21a.

  The base 2 is manufactured by bonding the first substrate 21, the second substrate 22, and the rectifying member 3. The inlet member 23a and the outlet member 23b having openings connected to the openings of the cavity 4 are joined to one end and the other end of the manufactured base body 2, respectively. In this way, the flow path built-in substrate 1 of the above embodiment is manufactured.

  A placement region 22a on which the electronic component 51 is placed is formed on the upper surface of the second substrate 22 of the flow path built-in substrate 1 manufactured by the above-described process. The electronic component 51 is placed on the placement region 22a so as to be electrically connected to the wiring conductor 52. The connection between the electronic component 51 and the wiring conductor 52 may be performed using wire bonding as described above. In this way, the electronic device 5 of the above embodiment is manufactured.

  In addition, this invention is not limited to the above-mentioned embodiment. That is, various modifications can be made without departing from the scope of the present invention. For example, the rectifying member 3 in the first embodiment of the present invention has an annular protrusion 3b around the opening surface that opens to the one flow path 41 side, and the side that does not have the protrusion 3b. The opening surface may be larger than the opening surface on the side having the protrusion 3b. Thereby, the stagnation of the heat exchange medium in the opening 3a can be further suppressed.

DESCRIPTION OF SYMBOLS 1 ... Channel built-in board | substrate 2 ... Base | substrate 21 ... 1st board | substrate 21a ... Main board | substrate 21b ... Wall part 22 ... 2nd board | substrate 22a ... Mounting area 23a. ··· Inlet member 23b ··· Discharge port member 3 ··· Rectifying member 31 ··· Linear portion 32 ··· Bending portion 3a ··· Opening portion 3b ··· Projection portion 33 ··· Frame 34 ..Network body 4 ... cavity 41 ... channel 5 ... electronic device 51 ... electronic component 52 ... wiring conductor

Claims (8)

A first substrate having a pair of wall portions opposed to each other on the main surface and a second portion that is bonded to the pair of wall portions and forms a cavity that allows a heat exchange medium to flow between the first substrate and the first substrate. A substrate having a substrate of
A flow path built-in substrate provided with a rectifying member fixed to the base body and provided to divide the cavity into a plurality of flow paths,
The flow path-containing substrate, wherein the rectifying member has an opening that opens to the adjacent flow paths and connects the flow paths.   2. The flow path built-in substrate according to claim 1, wherein the base is ceramics and the rectifying member is metal.   The flow direction of the heat exchange medium in the opening is oblique to the flow direction of the heat exchange medium in the flow path when the opening is seen through a plane. A substrate with a built-in channel.   The plurality of flow paths include a first flow path and a second flow path that are adjacent to each other, and the opening has an opening surface that opens to the first flow path. 2. The substrate with a built-in channel according to claim 1, wherein the substrate is larger than an opening surface that opens to the path.   2. The flow path built-in substrate according to claim 1, wherein the rectifying member has an annular protrusion formed on the surface facing the flow path so as to surround the opening.   The flow path-containing substrate according to claim 1, wherein the rectifying member has a mesh shape.   An electronic apparatus comprising the flow path built-in substrate according to claim 1 and an electronic component placed on the flow path built-in substrate.   The electronic apparatus according to claim 7, wherein the electronic component is positioned so as to overlap the flow path when the base is seen through in plan.

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