JP2011115021A - Planar motor device, stage device, and exposure apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a planar motor device which is capable of easy energization control even in driving another object. <P>SOLUTION: This planar motor device includes a fixed part 16 which has one of a magnetizing unit and a coil unit to form a prescribed movement face, and a mobile part which has the other of the magnetizing unit and the coil unit and can move along a movement face. The coil unit has the first coil unit CU1 which moves the mobile part with its energization being controlled by the first control system CUC1, and the second coil unit CU2 which moves the second mobile part provided independent of the mobile part with its energization being controlled by the second control system CUC2 provided independent of the first control system. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a planar motor device, a stage device, and an exposure apparatus.

  In the photolithography process, which is one of the manufacturing processes of imaging elements such as semiconductor elements, liquid crystal display elements, CCDs (Charge Coupled Devices), thin film magnetic heads, and other various devices, masks or reticles (when these are collectively referred to) An exposure apparatus that transfers a pattern formed on a mask) onto a substrate such as a glass plate or a wafer coated with a photoresist via a projection optical system is used. In this exposure apparatus, since it is necessary to position the substrate at an exposure position with high accuracy, the substrate is held on the substrate holder by vacuum suction or the like, and the substrate holder is fixed on the substrate table. Yes.

  In recent years, it has been required to move the substrate at a higher speed in order to improve throughput (the number of substrates that can be exposed per unit time). In addition, it is also required to realize the positioning of the substrate with high accuracy without being affected by the accuracy of the mechanical guide surface by miniaturizing the pattern to be transferred to the substrate. Furthermore, in order to extend the operating time of the exposure apparatus by reducing maintenance opportunities, it is also required to extend the life by avoiding mechanical friction.

In order to satisfy these requirements, a stage apparatus has been developed that positions a substrate by driving a substrate table on which the substrate is placed in a two-dimensional direction without contact.
As such a planar motor, there is, for example, a planar motor constituted by a fixed part having coils arranged two-dimensionally and a moving part having permanent magnets arranged two-dimensionally. The dimension of the surface of the fixed part is, for example, about 1 m × 1 m. Planar motors have been devised that use Lorentz force generated by passing a current through a coil to drive a moving part two-dimensionally with respect to a fixed part (see, for example, Patent Documents 1 to 3).

JP-A-11-164543 Japanese Patent Laid-Open No. 2003-224961 US Pat. No. 5,677,758

However, the following problems exist in the conventional technology as described above.
When driving another object in addition to the moving unit, if the motor device for the other object is separately installed, the device becomes large. Therefore, the coil is shared and the coil is energized according to the position of the plurality of moving units. However, in this case, there is a problem that energization control is complicated.

  The present invention has been made in consideration of the above points, and an object of the present invention is to provide a planar motor device, a stage device, and an exposure apparatus that can easily control energization even when another object is driven. .

In order to achieve the above object, the present invention employs the following configuration.
The planar motor device of the present invention has one of a magnetizing unit and a coil unit and has a fixed part that forms a predetermined moving surface, and the other of the magnetizing unit and the coil unit, and moves along the moving surface. A planar motor device including a movable unit, wherein the coil unit is independent of the first control system and a first coil unit that moves the movable unit by controlling energization of the first control system. And a second coil unit that is controlled to be energized by the second control system provided and moves the second moving part provided independently of the moving part.

Moreover, the stage apparatus of this invention is equipped with the planar motor apparatus of this invention.
Furthermore, the exposure apparatus of the present invention includes the stage apparatus of the present invention.

  In the present invention, even when another object is driven, the planar motor device can suppress the increase in size without complicating the energization control.

It is a figure which shows schematic structure of the exposure apparatus by one Embodiment of this invention. It is a top view which shows the structure of wafer stage WST. It is a top view of stage unit WST1 provided in wafer stage WST. It is a cross-sectional arrow view along the AA line in FIG. 3 is an enlarged view of a core member 22. FIG. It is a cross-sectional arrow view along the BB line in FIG. It is a cross-sectional arrow view along CC line in FIG. It is a top view for demonstrating operation | movement of wafer stage WST. It is a figure which shows the fixing | fixed part which concerns on 2nd Embodiment. It is a figure which shows the fixing | fixed part which concerns on 3rd Embodiment. It is a flowchart which shows an example of the manufacturing process of a microdevice. It is a figure which shows an example of the detailed process of step S13 in FIG.

  Hereinafter, embodiments of a planar motor device, a stage device, and an exposure apparatus according to the present invention will be described with reference to FIGS.

(First embodiment)
FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. An exposure apparatus 10 shown in FIG. 1 is an exposure apparatus for manufacturing a semiconductor element. The pattern formed on the reticle R is sequentially transferred to the wafer W while the reticle (mask) R and the wafer (substrate) W are moved synchronously. This is a reduction projection type exposure apparatus of a step-and-scan method for transferring the image on the top.

  In the following description, if necessary, an XYZ orthogonal coordinate system is set in the drawing, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. This XYZ orthogonal coordinate system is set so that the X-axis and the Z-axis are parallel to the paper surface, and the Y-axis is set to a direction perpendicular to the paper surface. In the XYZ coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z-axis is set vertically upward. Further, it is assumed that the synchronous movement direction (scanning direction) of the wafer W and the reticle R at the time of exposure is set in the Y direction.

  As shown in FIG. 1, the exposure apparatus 10 includes an illumination optical system ILS, a reticle stage RST that holds a reticle R as a mask, a projection optical system PL, and a wafer W as a substrate in an X direction and a Y direction in an XY plane. It includes wafer stage WST as a stage apparatus including stage units WST1 and WST2 that are moved in a two-dimensional direction, and a main controller MCS that controls them. Although not shown, wafer stage WST may be provided with a stage unit provided with various measuring instruments for measuring the performance of exposure apparatus 10 in addition to stage units WST1 and WST2.

  The illumination optical system ILS performs shaping of exposure light emitted from a light source unit (not shown) (for example, a laser light source such as an ultra-high pressure halogen lamp or an excimer laser) and makes the illuminance distribution uniform, thereby making a rectangular (or rectangular) on the reticle R (or Irradiate the illumination area IAR in a circular arc shape with uniform illuminance. The reticle stage RST has a configuration in which a stage movable unit 11 is provided on a reticle base (not shown), and the stage movable unit 11 moves on the reticle base along a predetermined scanning direction at a predetermined scanning speed during exposure.

  A reticle R is held on the upper surface of the stage movable unit 11 by, for example, vacuum suction. An exposure light passage hole (not shown) is formed below the reticle R of the stage movable unit 11. A reflecting mirror (moving mirror) 12 is disposed at the end of the movable stage 11, and the position of the movable stage 11 is detected by the laser interferometer 13 measuring the position of the reflecting mirror 12. . The detection result of the laser interferometer 13 is output to the stage control system SCS. The stage control system SCS drives the stage movable unit 11 based on the detection result of the laser interferometer 13 and a control signal from the main controller MCS based on the moving position of the stage movable unit 11. Although not shown in FIG. 1, above the reticle stage RST, a mark (reticle mark) formed on the reticle R and a reference mark formed on a reference member for determining the reference position of the wafer stage WST A reticle alignment sensor is provided to measure the relative positional relationship by simultaneously observing.

  The projection optical system PL is a reduction optical system having a reduction magnification of α (α is, for example, 4 or 5), for example, and is disposed below the reticle stage RST, and the direction of the optical axis AX is set to the Z-axis direction. ing. Here, a refracting optical system comprising a plurality of lens elements arranged at a predetermined interval along the optical axis AX direction is used so as to provide a telecentric optical arrangement. An appropriate lens element is selected according to the wavelength of light emitted from the light source unit. When the illumination area IAR of the reticle R is illuminated by the illumination optical system ILS, a reduced image (partial inverted image) of the pattern in the illumination area IAR of the reticle R is an exposure area IA conjugate to the illumination area IAR on the wafer W. Formed.

FIG. 2 is a plan view showing the configuration of wafer stage WST. As shown in FIGS. 1 and 2, wafer stage WST includes a base member 14 and stage units WST1 to WST1, which are levitated and supported by an air slider described later via a clearance of about several μm above the upper surface of base member 14. Articulated type that relays WST2, a driving device 15 that drives each of these stage units WST1 and WST2 in a two-dimensional direction in the XY plane, and cables (utility supply members) connected to stage units WST1 to WST2 Robot arms RB1 and RB2, and tube carriers TC1 and TC2 that support the robot arms RB1 and RB2 (that is, the cables) and move along the Y direction. Stage units WST1 and WST2 are provided to hold and transfer wafer W.
By individually driving the driving device 15 provided in each of the stage units WST1 and WST2, each of the stage units WST1 and WST2 can be individually moved in any direction within the XY plane.

  In the example shown in FIG. 2, the position of the −Y side end of the base member 14 is the loading position of the wafer W, and when the wafer W after the exposure processing is unloaded and when the unexposed wafer W is loaded. In this case, one of stage units WST1 and WST2 is arranged at this position. In the example shown in FIG. 2, the position where the projection optical system PL is arranged is the exposure position, and one of the stage units WST1 and WST2 holding the wafer W to be subjected to exposure processing is at this position during exposure. Placed in. As described above, since the stage units WST1 and WST2 can be individually moved in any direction within the XY plane, the loading position and the exposure position can be alternately switched. Further, the wafer focusing information may be detected at the loading position.

  Here, as shown in FIG. 1, the driving device 15 is fixed to a fixing portion 16 provided (embedded) on the upper portion of the base member 14 and to the bottom portions (base facing surface side) of the stage units WST1 and WST2. And a planar motor that includes a moving unit 17 that moves along a moving surface 16a on the fixed unit 16. Further, the moving unit 17, the base member 14, and the driving device 15 constitute a planar motor device. In the following description, the driving device 15 is referred to as a planar motor device 15 for convenience.

  Wafer W is fixed on stage units WST1 and WST2 by, for example, vacuum suction. Further, the side surfaces of the stage units WST1 and WST2 are reflection surfaces that reflect the laser beam from the laser interferometer 18 (see FIG. 1). The laser interferometers 18 arranged outside the stage units WST1 and WST2 The position in the XY plane is always detected with a resolution of about 0.5 to 1 nm, for example.

  In FIG. 1, the laser interferometer 18 is representatively illustrated, but actually, a laser interferometer that detects the position of the stage units WST1 and WST2 in the Y direction and a laser interference that detects the position in the X direction. It consists of a total.

  The position information (or speed information) of the stage units WST1 and WST2 is sent to the stage control system SCS and the main controller MCS via this. In the stage control system SCS, in the XY plane of the stage units WST1 and WST2 via the planar motor device 15 based on the position information (or speed information) of the stage units WST1 and WST2 according to an instruction from the main controller MCS. Control each move.

  Here, the configuration of wafer stage WST will be described. FIG. 3 is a top view of stage unit WST1 provided on wafer stage WST, and FIG. 4 is a cross-sectional view taken along the line AA in FIG. 3 and 4, the same members as those shown in FIGS. 1 and 2 are denoted by the same reference numerals. Since stage unit WST1 and stage unit WST2 have the same configuration, stage unit WST1 will be described as a representative here.

  As shown in FIGS. 3 and 4, the first stage 25 that forms a part of the stage unit WST1 has a predetermined distance (about several μm) from the fixed part 16 on the fixed part 16 provided on the upper part of the base member 14. Is supported by levitation. Fixed portion 16 forming a part of wafer stage WST has coil 21 wound around it and includes core members 22 arranged at a predetermined pitch in the XY plane. The core member 22 is formed of, for example, a magnetic material such as SS400-equivalent low carbon steel or stainless steel, and includes a head portion 22a and a column portion 22b. The head 22a has a rectangular cross-sectional shape in the XY plane, and the cross-sectional shape in the XY plane of the column portion 22b is a circular shape. The head portion 22a and the column portion 22b are integrated, and the coil 21 is wound around the column portion 22b.

  FIG. 5 is an enlarged view of the core member 22. As shown in FIG. 5, the coil 21 is wound around the support portion 22 b of the core member 22 via the heat insulating material Ti. This is to prevent the positioning error of the stage units WST1 and WST2 caused by the heat generated when a current is passed through the coil 21 being transmitted to the core member 22. In addition, as the heat insulating material Ti, a resin excellent in heat insulating properties and heat resistance can be used.

The core member 22 is arranged on the base member 14 so that the front end portion of the head portion 22a is included in substantially one surface. At this time, the support member 22 b of the core member 22 is magnetically connected to the base member 14. A separator 23 made of a non-magnetic material is provided between the heads 22 a of the core member 22. The separator 23 is made of, for example, SUS or ceramics, and prevents the magnetic circuit from being formed between adjacent core members 22.
Since the height position of the upper portion of the separator 23 is set to be the same as the height position of the distal end portion of the head portion 22a of the core member 22, the upper surface (moving surface) of the fixed portion 16 is substantially flat. Become.

A guide member 24 is provided on the upper surface of the fixed portion 16. The guide member 24 serves as a guide plate for moving the stage units WST1 and WST2 in the XY plane, and is formed of a nonmagnetic material. The guide member 24 is formed, for example, by spraying alumina (Al ₂ O ₃ ) on the upper surface of the flat fixed portion 16 and spraying it on the metal surface with a high-pressure gas.

6 is a cross-sectional arrow view taken along line BB in FIG.
The fixed portion 16 includes a first coil unit CU1 in which the core members 22 are arranged in a lattice pattern in the XY plane, and the first coil unit CU1 is parallel to the moving surface 16a. The first coil unit CU1 is provided with second coil units CU2 arranged along the Y direction at both ends in the X direction (in FIG. 6, only the second coil unit CU2 on the −X side is shown).

The coil 21 provided in the first coil unit CU1 is supplied with a three-phase alternating current composed of a U phase, a V phase, and a W phase. By applying the current of each phase to each of the coils 21 arranged in the XY plane at a predetermined timing in a predetermined order, the stage units WST1 and WST2 can be moved in a desired direction at a desired speed. As shown in FIG. 6, in the first coil unit CU1, the head portions 22a of the core member 22 having a rectangular cross-sectional shape are arranged in a matrix in the XY plane, and the separator 23 is interposed between the head portions 22a. Is provided.
In FIG. 6, each phase of the three-phase alternating current applied to the coil 21 wound around each core member 22 is illustrated in association with the head portion 22 a of the core member 22. Referring to FIG. 6, it can be seen that the U phase, V phase, and W phase are regularly arranged in the XY plane.

  Further, by applying a current of each phase to each of the coils 21 of the second coil unit CU2 arranged along the Y direction at a predetermined timing in a predetermined order, a tube carrier TC1 having a magnet generator (not shown). , TC2 can be moved in a desired direction (Y direction and Z direction) at a desired speed.

  Energization of the coil 21 in the first coil unit CU1 is controlled by the first control system CUC1 under the control of the stage control system SCS. The energization of the coil 21 in the second coil unit CU2 is controlled independently of the coil 21 in the first coil unit CU1 by the second control system CUC2 under the control of the stage control system SCS.

  In addition, a plurality of coils (core members 22) in the first coil unit CU1 are accommodated in one casing C as shown by two-dot chain lines in FIG. 6A. Although cooling is performed collectively by the cooling device 43 described later, the coil 21 (core member 22) in the second coil unit CU1 arranged adjacent to each other is accommodated in the casing C1 located at both ends in the X direction. Cooled together.

  The moving unit 17 forming part of the wafer stage WST includes a first stage 25, a permanent magnet 26, an air pad 27, a second stage 28, a horizontal drive mechanism 29, and a vertical drive mechanism 30. Permanent magnets 26 and air pads 27 are regularly arranged on the bottom surface of the first stage 25. As the permanent magnet 27, a rare earth magnet such as a neodymium / iron / cobalt magnet, an aluminum / nickel / cobalt (alnico) magnet, a ferrite magnet, a samarium / cobalt magnet, or a neodymium / iron / boron magnet can be used.

  FIG. 7 is a cross-sectional arrow view taken along the line CC in FIG. As shown in FIG. 7, the permanent magnets 26 are arranged at predetermined intervals in the XY plane so that adjacent magnets have different poles. With this arrangement, an alternating magnetic field is formed in both the X and Y directions. A vacuum preload type air pad 27 is provided between the permanent magnets 26. The air pad 27 blows air (air) toward the guide member 24, and thereby supports the moving unit 17 to float (non-contact) with respect to the fixed unit 16 through a clearance of, for example, several microns.

The second stage 28 is supported on the first stage 25 by the vertical drive mechanism 30.
Here, the vertical drive mechanism 30 includes support mechanisms 30a, 30b, and 30c (see FIG. 3) including, for example, a voice coil motor (VCM), and the second stage 28 is provided by these support mechanisms 30a, 30b, and 30c. Supports three different points. The support mechanisms 30a, 30b, and 30c are configured to be extendable and contractible in the Z direction, and the second stage 28 can be moved in the Z direction by driving the support mechanisms 30a, 30b, and 30c with the same expansion / contraction amount. The rotation of the second stage 28 around the X axis and the rotation around the Y axis can be controlled by driving the support mechanisms 30a, 30b, 30c independently or by driving different amounts of expansion and contraction. Can do.

  The horizontal drive mechanism 29 includes drive mechanisms 29a, 29b, 29c (see FIG. 3) including, for example, a voice coil motor (VCM), and the XY plane of the second stage 28 by these drive mechanisms 29a, 29b, 29c. The position inside and the rotation around the Z axis are controlled. Specifically, the position of the second stage 28 in the Y direction can be varied by driving the drive mechanisms 29a and 29b with the same expansion / contraction amount, and the X of the second stage 28 can be changed by driving the drive mechanism 29c. The direction position can be varied, and the rotation of the second stage 28 about the Z-axis can be varied by driving the drive mechanisms 29a and 29b with different expansion / contraction amounts. That is, it can be said that the first stage 25 driven by the planar motor 17 described above is a coarse movement stage, and the second stage 28 driven by the horizontal drive mechanism 29 is a fine movement stage. The horizontal drive mechanism 29 and the vertical drive mechanism 30 adjust the position of the second stage 28 in the XY plane and the position in the Z direction under the control of the stage control system SCS.

  Returning to FIG. 1, the exposure apparatus 10 of the present embodiment includes an air pump 40 for supplying pressurized air to the air pad 27 shown in FIG. Air pump 40 and stage units WST1 and WST2 are connected to each other via tubes 41 and 42, and air from air pump 40 is supplied to stage unit WST1 via tube 41 and via tube 42. To the stage unit WST2. A cooling device 43 for cooling the coil 21 shown in FIG. 4 is provided. The cooling device 43 is connected to the base member 14 by a refrigerant supply pipe 44 and a refrigerant discharge pipe 45. The refrigerant from the cooling device 43 is supplied to the base member 14 (in the casings C and C1 in which the coil 21 in the fixed portion 16 is provided) through the refrigerant supply pipe 44, and the refrigerant through the base member 14 is discharged from the refrigerant. It is collected in the cooling device 43 through the pipe 45.

  Although not shown in FIG. 1, the exposure apparatus 10 includes an off-axis type wafer alignment sensor for measuring positional information of alignment marks formed on the wafer W on the projection optical system PL side. A TTL (through-the-lens) type alignment sensor that measures positional information of alignment marks formed on the wafer W via the projection optical system PL is provided. Further, slit-like detection light is irradiated to the wafer W from an oblique direction, and the reflected light is measured to detect the position and posture (rotation about the X and Y axes) of the wafer W in the Z direction. An autofocus mechanism and an auto leveling mechanism are provided that correct the position and orientation of the wafer W in the Z direction based on the detection result and align the surface of the wafer W with the image plane of the projection optical system PL.

  When the stage units WST1 and WST2 configured as described above are moved, a driving method similar to that of a known linear motor driven by three-phase AC can be used. That is, when the stage units WST1 and WST2 are considered to be composed of a linear motor configured to be movable in the X direction and a linear motor configured to be movable in the Y direction, the stage units WST1 and WST2 are moved in the X direction. The first control system CUC1 applies the same three-phase alternating current as that of the linear motor configured to be movable in the X direction to the coils 21 in the first coil units CU1 arranged in the X direction, and the stage units WST1, WST2 When the first control system CUC1 applies the same three-phase alternating current as that of the linear motor configured to be movable in the Y direction to the coils 21 arranged in the Y direction. Good.

  Further, during scanning, a part of the pattern image of the reticle R is projected onto the exposure area IA, and is synchronized with the movement of the reticle R in the −X direction (or + X direction) at the speed V with respect to the projection optical system PL. Thus, the wafer W moves in the + X direction (or -X direction) at a speed β · V (β is a projection magnification). When the exposure process for one shot area is completed, main controller MCS moves stage unit WST1 to step the next shot area to the scanning start position, and thereafter, similarly to each shot area by the step-and-scan method. Exposure processing is performed sequentially.

  Here, when the stage unit WST1 moves on the base member 14 (on the fixed portion 16), for example, from the position shown in FIG. 2 to the position shown in FIG. 8, the stage unit WST1 is moved with respect to each coil 21 in the second coil unit CU2. When the second control system CUC2 controls energization, the tube carrier TC1 moves following the Y direction according to the position of the stage unit WST1 in the Y direction, and the robot according to the position of the stage unit WST1 in the X direction. By rotating arm RB1, it is possible to prevent an error factor such as vibration from being transmitted to stage unit WST1 due to deformation of cables and the like accompanying movement of stage unit WST1.

As described above, in the present embodiment, energization control to the coil 21 in the first coil unit CU1 is performed by the first control system CUC1, and energization control to the coil 21 in the second coil unit CU2 is performed by the first control. By performing the second control system CUC2 independent of the system CUC1, the control for moving the stage units WST1 and WST2 and the control for moving the tube carriers TC1 and TC2 can be performed separately, and thrust distribution And logical expressions can be easily set.
Further, in the present embodiment, the coil 21 in the first coil unit CU1 and the coil 21 in the second coil unit CU2 are collectively cooled in the same casing C1, so the first coil unit CU1 and the second coil unit CU2 It is possible to suppress an increase in the size of the device as in the case where the device is simply attached.

(Second Embodiment)
Next, a second embodiment of the planar motor device will be described with reference to FIG.
In this figure, the same components as those of the first embodiment shown in FIGS. 1 to 8 are denoted by the same reference numerals, and the description thereof is omitted.
In the present embodiment, a configuration in which a counter mass is provided in addition to the above-described tube carriers TC1 and TC2 as the second moving unit will be described.

  As shown in FIG. 9, in the present embodiment, the first coil unit CU1 is arranged on both ends in the X direction along the Y direction, and the second coil unit CU2 arranged along the Y direction has the first on the −Z side. A three-coil unit CU3 is provided. Part of the coil 21 (core member 22) in the third coil unit CU3 is part of the coil 21 (core member 22) in the second coil unit CU2 and one part of the coil 21 (core member 22) in the first coil unit CU1. Together with the part, it is housed in the housing C1 and cooled together.

Energization of the coil 21 in the third coil unit CU3 is controlled by the third control system CUC3 under the control of the stage control system SCS. In the third coil unit CU3, counter masses CM1 and CM2 that have a magnetism generator (not shown) and move in the Y direction when the coil 21 is energized are provided at positions facing the coil 21 (in FIG. 9). Only the counter mass CM1 on the −X side is shown, and the counter mass CM2 on the + X side is not shown).
Other configurations are the same as those of the first embodiment.

In wafer stage WST having the above configuration, when stage units WST1 and WST2 move on base member 14 (on fixed portion 16) in accordance with energization control by first control system CUC1, energization control by second control system CUC2 is performed. Accordingly, the tube carriers TC1 and TC2 move in the Y direction, but the position of the center of gravity of the base member 14 (fixed portion 16) varies due to the movement of the stage units WST1 and WST2 and the tube carriers TC1 and TC2. Therefore, the third control system CUC3 moves the counter masses CM1 and CM2 in accordance with the momentum conservation law in the direction opposite to the moving direction of the stage units WST1 and WST2 and the tube carriers TC1 and TC2, and the center of gravity position of the base member 14 In order to maintain the current, the energization to the coil 21 in the third coil unit CU3 is controlled.
Thereby, even when the stage units WST1 and WST2 and the tube carriers TC1 and TC are moved, the position of the center of gravity as the wafer stage WST is maintained, and an exposure error due to an inclination or the like can be eliminated.

  In this way, in this embodiment, in addition to obtaining the same operation and effect as in the first embodiment, even when the stage units WST1 and WST2 (and the tube carriers TC1 and TC2) move, the base member 14 can be maintained in a constant state, and the energization control is individually performed by the control systems CUC1 to CUC3 provided for the respective coil units CU1 to CU3, so that the movement control of each moving unit is easily performed. It becomes possible.

  In the second embodiment, the third coil unit CU3 and the counter masses CM1 and CM2 are arranged on both sides of the fixed portion 16 in the X direction. However, the third coil unit CU3 and the counter masses CM1 and CM2 are disposed on both sides of the fixed portion 16 in the Y direction. A configuration in which the counter masses CM1 and CM2 are arranged, or a configuration in which the third coil unit CU3 and the counter masses CM1 and CM2 are arranged on both sides in the X direction and both sides in the Y direction of the fixed portion 16 may be adopted.

(Third embodiment)
Next, a third embodiment of the planar motor device will be described with reference to FIG.
In this figure, the same components as those of the first embodiment shown in FIGS. 1 to 8 are denoted by the same reference numerals, and the description thereof is omitted.
In the first and second embodiments, the second coil unit CU2 is arranged on both ends in the X direction of the first coil unit CU1, but in the present embodiment, the first and second coil units CU1 and CU2 are arranged. A configuration arranged in a stacked state in the Z direction will be described.

As shown in FIG. 10A, the second coil unit CU2 in the present embodiment is the same as the first coil unit CU1 when the coil 21 (core member 22) is planar (as viewed from the Z direction). As shown in FIG. 10B, the Z direction is arranged in a stacked state on the −Z side of the first coil unit CU1. Further, the side facing the second coil unit CU2 (that is, the side opposite to the stage units WST1 and WST2 across the base member 14) has a magnetism generator (not shown), and the coil 21 in the second coil unit CU2 is provided. Is provided with a counter mass (second moving unit) CM that moves in parallel with the XY plane.
Other configurations are the same as those of the first embodiment.

In wafer stage WST having the above configuration, when stage units WST1 and WST2 move on base member 14 (on fixed portion 16) in accordance with energization control by first control system CUC1, in response to energization control by second control system CUC2. In order to maintain the position of the center of gravity of the base member 14 by moving the counter mass CM in accordance with the momentum conservation law in the direction opposite to the moving direction of the stage units WST1 and WST2, the coil 21 in the third coil unit CU3 is energized. Control.
Thereby, even when the stage units WST1 and WST2 are moved, the position of the center of gravity as the wafer stage WST is maintained, and an exposure error due to an inclination or the like can be eliminated. Further, the planar size can be reduced as compared with the configuration in which the counter masses CM1 and CM2 of the second embodiment are arranged, which can contribute to the downsizing of the footprint.

  In addition, the coil unit and the tube carrier arranged on both sides in the X direction of the first coil unit CU1 shown in the first embodiment are attached to the configuration of the present embodiment to eliminate the adverse effects due to the vibration of the cables and the like. Needless to say, the configuration may be adopted.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, when an interaction occurs between the energization control to the second and third coil units CU2 and CU3 and the energization control to the first coil unit CU1 shown in the above embodiment, the mutual influence is measured in advance. In the energization control to each coil unit, the energization control may be performed so as to correct the stored influence.

  Moreover, in the said embodiment, although the coil unit CU was arrange | positioned at the fixing | fixed part 16 and the permanent magnet 26 was arrange | positioned at the moving part 17, it illustrated about the so-called moving magnet type planar motor apparatus 15, However, It is not limited to this. Alternatively, a so-called moving coil type planar motor device 15 in which a magnet generator such as a permanent magnet is disposed in the fixed portion 16 and a coil unit is disposed in the moving portion 17 may be used.

In this case, a first coil unit is provided on the side of the first stage 25 of the moving unit 17 that faces the magnetism of the fixed unit 16, and the moving unit 17 (first stage 25) is controlled by energization control of the coils of the first coil unit. Can be driven in a direction parallel to the XY plane, the second coil unit is provided in a stacked state on the side facing the second stage 28 from the first coil unit, and the magnetism generator is provided on the second stage 28. Good.
Then, instead of the horizontal drive mechanism 29 and the vertical drive mechanism 30, the second stage 28 is moved relative to the first stage 25 in the direction parallel to the XY plane and in the Z direction by driving the planar motor device 15. As a result, the second stage 28 can be used as a fine movement stage as a highly accurate positioning device for the wafer W.

In the above embodiment, the case where the present invention is applied to wafer stage WST has been described. However, the present invention can also be applied to reticle stage RST, and can also be applied to both reticle stage RST and wafer stage WST. Is possible.
Further, the present invention can be used in devices other than the exposure apparatus. For example, the present invention is also effective when using power in a stage device of a machine tool that requires accuracy. It will be apparent to those skilled in the art that various modifications can be made to the present invention without departing from the spirit or scope of the invention.

  As the exposure apparatus 10, in addition to a step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the reticle R by synchronously moving the reticle R and the wafer W, the reticle R and the wafer W It can also be applied to a step-and-repeat projection exposure apparatus (stepper) in which the pattern of the reticle R is collectively exposed while the wafer is stationary and the wafer W is sequentially moved stepwise. The present invention can also be applied to a step-and-stitch type exposure apparatus that partially transfers at least two patterns on the wafer W.

  In addition to the semiconductor wafer for manufacturing semiconductor devices, the substrate of the above embodiment includes a glass substrate for display devices, a ceramic wafer for thin film magnetic heads, or an original mask (reticle) used in an exposure apparatus (synthesis). Quartz, silicon wafer) or the like is applied.

The light source of the exposure apparatus to which the present invention is applied includes not only KrF excimer laser (248 nm), ArF excimer laser (193 nm), F ₂ laser (157 nm), but also g-line (436 nm) and i-line (365 nm). ) Can be used. Further, the magnification of the projection optical system may be not only a reduction system but also an equal magnification or an enlargement system. In the above embodiment, the refraction type projection optical system is exemplified, but the present invention is not limited to this. For example, a catadioptric or refractive optical system may be used.

  The exposure apparatus of the present invention is an exposure apparatus that is used for manufacturing a semiconductor element to transfer a device pattern onto a semiconductor substrate, an exposure apparatus that is used for manufacturing a liquid crystal display element to transfer a circuit pattern onto a glass plate, The present invention can also be applied to an exposure apparatus that is used for manufacturing a thin film magnetic head and transfers a device pattern onto a ceramic wafer, and an exposure apparatus that is used to manufacture an image sensor such as a CCD.

  Further, the present invention is applied to a so-called immersion exposure apparatus in which a liquid is locally filled between the projection optical system and the substrate, and the substrate is exposed through the liquid. It is disclosed in the publication No. 99/49504 pamphlet. Further, in the present invention, the entire surface of the substrate to be exposed as disclosed in JP-A-6-124873, JP-A-10-303114, US Pat. No. 5,825,043 and the like is in the liquid. The present invention is also applicable to an immersion exposure apparatus that performs exposure while being immersed.

In the above embodiment, a configuration in which a plurality of (two) stage units are provided is illustrated. However, the configuration is not limited to this, and a configuration in which a single unit is provided may be used.
In addition, a plurality of stage units are not provided, but a reference member on which a substrate stage for holding a substrate and a reference mark are formed, as disclosed in Japanese Patent Application Laid-Open No. 11-135400 and Japanese Patent Application Laid-Open No. 2000-164504. In addition, the present invention can also be applied to an exposure apparatus that includes a measurement stage that measures information related to exposure by mounting various photoelectric sensors.

  As described above, the exposure apparatus 10 of the embodiment of the present application maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

Next, an embodiment of a manufacturing method of a micro device using the exposure apparatus and the exposure method according to the embodiment of the present invention in the lithography process will be described. FIG. 11 is a flowchart illustrating a manufacturing example of a micro device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micro machine, or the like).
First, in step S10 (design step), function / performance design (for example, circuit design of a semiconductor device) of a micro device is performed, and pattern design for realizing the function is performed. Subsequently, in step S11 (mask manufacturing step), a mask (reticle) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S12 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.
Next, in step S13 (wafer processing step), using the mask and wafer prepared in steps S10 to S12, an actual circuit or the like is formed on the wafer by lithography or the like, as will be described later. Next, in step S14 (device assembly step), device assembly is performed using the wafer processed in step S13. This step S14 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S15 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S14 are performed. After these steps, the microdevice is completed and shipped.

FIG. 12 is a diagram illustrating an example of a detailed process of step S13 in the case of a semiconductor device.
In step S21 (oxidation step), the surface of the wafer is oxidized. In step S22 (CVD step), an insulating film is formed on the wafer surface. In step S23 (electrode formation step), an electrode is formed on the wafer by vapor deposition. In step S24 (ion implantation step), ions are implanted into the wafer. Each of the above steps S21 to S24 constitutes a pre-processing process at each stage of the wafer processing, and is selected and executed according to a necessary process at each stage.
At each stage of the wafer process, when the above pre-process is completed, the post-process is executed as follows. In this post-processing process, first, in step S25 (resist formation step), a photosensitive agent is applied to the wafer. Subsequently, in step S26 (exposure step), the circuit pattern of the mask is transferred to the wafer by the lithography system (exposure apparatus) and the exposure method described above. Next, in step S27 (development step), the exposed wafer is developed, and in step S28 (etching step), exposed members other than the portion where the resist remains are removed by etching. In step S29 (resist removal step), the resist that has become unnecessary after the etching is removed. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the wafer.

  In addition, not only microdevices such as liquid crystal display elements or semiconductor elements, but also mother reticles for manufacturing reticles or masks used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc. The present invention can also be applied to an exposure apparatus that transfers a pattern to a glass substrate or silicon wafer. Here, in an exposure apparatus using DUV (deep ultraviolet), VUV (vacuum ultraviolet) light, or the like, a transmission type reticle is generally used. As a reticle substrate, quartz glass, fluorine-doped quartz glass, fluorite, Magnesium fluoride or quartz is used. In proximity-type X-ray exposure apparatuses, electron beam exposure apparatuses, and the like, a transmissive mask (stencil mask, membrane mask) is used, and a silicon wafer or the like is used as a mask substrate. Such an exposure apparatus is disclosed in WO99 / 34255, WO99 / 50712, WO99 / 66370, JP-A-11-194479, JP-A2000-12453, JP-A-2000-29202, and the like. .

  DESCRIPTION OF SYMBOLS 10 ... Exposure apparatus, 16 ... Fixed part, 16a ... Moving surface, 17 ... Moving part, C1 ... Housing, CM ... Counter mass (2nd moving part), CUC1 ... 1st control system, CUC2 ... 2nd control system, WST ... Wafer stage (stage device), WST1, WST2 ... Stage unit

Claims (11)

A fixed portion having one of a magnetizing unit and a coil unit and forming a predetermined moving surface, and a moving portion having the other of the magnetizing unit and the coil unit and movable along the moving surface. A planar motor device,
The coil unit includes a first coil unit that controls the energization of the first control system and moves the moving unit;
A plane having a second coil unit that is controlled in energization by a second control system provided independently of the first control system and moves a second moving unit provided independently of the moving unit. Motor device.   The planar motor device according to claim 1, wherein the first coil unit and the second coil unit are disposed substantially parallel to the moving surface.   The planar motor device according to claim 1, wherein the first coil unit and the second coil unit are arranged in a stacked state in a direction substantially orthogonal to the moving surface. The moving unit includes the coil unit in which the first coil unit is opposed to the magnetizing unit.
4. The planar motor device according to claim 3, wherein the second moving unit is supported by the moving unit, moves integrally with the moving unit, and moves relative to the moving unit by energization of the second coil unit. 5. .   The planar motor device according to any one of claims 1 to 3, wherein the second control system moves the second moving unit in synchronization with movement of the moving unit.   5. The planar motor device according to claim 4, wherein the second control system moves the second moving unit following the movement of the moving unit in a first direction parallel to the moving surface.   The second control system moves the second moving unit in a direction opposite to the moving direction of the moving unit in accordance with the movement of the moving unit and the momentum conservation law with respect to a first direction parallel to the moving surface. Item 5. The planar motor device according to Item 4.   With respect to a second direction that is parallel to the moving surface and substantially orthogonal to the first direction, a third moving unit that moves in a direction opposite to the moving direction of the moving unit according to the movement of the moving unit and the conservation of momentum is provided. The planar motor device according to claim 6.   The planar motor device according to any one of claims 1 to 8, further comprising a cooling device that cools at least a part of the first coil unit and at least a part of the second coil unit in a casing. .   A stage device comprising the planar motor device according to any one of claims 1 to 9.   An exposure apparatus comprising the stage apparatus according to claim 10.

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