JP2011115022A - Shaft motor, stage device, and exposure apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shaft motor which can prevent the enlargement and price rise of a device. <P>SOLUTION: One of a shaft 60 and a cylinder 70 is provided with a magnetizer 61, and the other of the shaft and the cylinder is provided with a coil body CL. It has a position controller CD, CONT which adjusts the position of the axis of the shaft body and the position of the axis of the cylinder to be coaxial. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a shaft motor, a stage apparatus, and an exposure apparatus.

  In a stage apparatus and an exposure apparatus provided with this stage apparatus, as a driving apparatus for moving an object, a shaft and a cylinder that move relative to each other by Lorentz force, which is a kind of electromagnetic interaction, are fixed and movable. A shaft motor may be used (see, for example, Patent Document 1).

JP 2001-023894 A

However, the following problems exist in the conventional technology as described above.
Since it is necessary to use a guide device in order to suppress the positional deviation between the central axis of the stator and the central axis of the mover, there arises a problem that the apparatus is increased in size and cost.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a shaft motor, a stage apparatus, and an exposure apparatus that can prevent an increase in size and cost of the apparatus.

In order to achieve the above object, the present invention employs the following configuration.
A shaft motor according to the present invention is a shaft motor in which a magnetomotive member is provided on one of a shaft body and a cylindrical body, and a coil body is provided on the other of the shaft body and the cylindrical body, and the axial position of the shaft body And a position adjusting device that adjusts the axial position of the cylindrical body to be coaxial.

  Moreover, the stage apparatus of this invention is equipped with the shaft motor of this invention as a drive device.

  The exposure apparatus of the present invention includes the stage apparatus of the present invention.

  In the present invention, the axial positions of the stator and the mover can be matched while preventing an increase in size and cost of the apparatus.

It is a schematic perspective view which shows the shaft motor structure of 1st Embodiment. It is a front sectional view of the shaft motor. It is a figure for demonstrating position adjustment with a shaft axis and a cylinder. It is a schematic perspective view which shows the shaft motor structure of 2nd Embodiment. It is a rough front sectional view showing the shaft motor composition of a 3rd embodiment. It is a schematic perspective view which shows the shaft motor structure of 4th Embodiment. It is a figure which shows schematic structure of the exposure apparatus by one Embodiment of this invention. It is a top view which shows the structure of wafer stage WST. It is a top view of stage unit WST1 provided in wafer stage WST. It is a cross-sectional arrow view along the AA line in FIG. 3 is an enlarged view of a core member 22. FIG. It is a cross-sectional arrow view along the BB line in FIG. It is a cross-sectional arrow view along CC line in FIG. It is a schematic perspective view which shows the shaft motor structure of another form. It is a schematic sectional drawing which shows the shaft motor structure of another form. It is a flowchart which shows an example of the manufacturing process of a microdevice. It is a figure which shows an example of the detailed process of step S13 in FIG.

  Embodiments of a shaft motor, a stage apparatus, and an exposure apparatus according to the present invention will be described below with reference to FIGS.

(Shaft motor; first embodiment)
First, a first embodiment of a shaft motor will be described with reference to FIGS. 1 to 3.
Here, a shaft motor in which a shaft body having a magnetism body is provided as a stator and a cylinder body having a coil body is provided as a mover will be described as an example.

FIG. 1 is an external perspective view of the shaft motor SM.
The shaft motor SM shown in this figure includes a shaft shaft (shaft body) 60 as a stator extending in one direction, a cylindrical body 70 as a cylindrical mover inserted through the shaft shaft 60, and a control device CONT. It has.

  The shaft 60 has a structure in which N poles and S poles are joined to each other (magnet generator) 61, and the magnetic circuit extends in all directions at a pitch L that is two times the length of the magnet 61. (Radially).

  The cylindrical body 70 surrounds the shaft shaft 60 and is provided so as to be movable in the axial direction of the shaft shaft 60 (hereinafter referred to as “L direction”), and a housing 71 made of a non-magnetic member and an axis around the housing 71. And a plurality of coil bodies CU arranged at intervals in the circumferential direction. The coil body CU is positioned on the outer peripheral side and generates a thrust in the L direction, and is positioned on the inner peripheral side and thrust in the radial direction (hereinafter referred to as the D direction) substantially orthogonal to the L direction. And a plurality of coil bodies (second coil bodies) CD that cause A plurality of coil bodies CL and CD are arranged at intervals also in the L direction (length direction). The coil body CD and the control device CONT constitute a position adjusting device.

  More specifically, in this embodiment, a three-phase motor is used, and a plurality of coil bodies CL are arranged at regular intervals in the circumferential direction around the axis, and a coil for one phase with respect to the pitch L described above. A plurality of coil units having three axially aligned coils of length L / 3 arranged in series in the L direction are connected in series. The energization amount for the coil body CL is controlled by the control device CONT, a magnetic field is generated according to the energization amount, and the cylindrical body 70 moves in the L direction by the thrust according to Fleming's left-hand rule.

  A plurality of coil bodies CD are arranged at regular intervals in the circumferential direction around the axis, and here an even number are arranged, and a plurality of coil bodies CD are also provided at intervals in the L direction at positions facing each other across the axis. The energization amount for the coil body CD is controlled by the control device CONT, and the cylindrical body 70 moves in the D direction with a thrust according to the energization amount.

  In the shaft motor SM having the above configuration, when the coil body CL is energized by the control device CONT, the cylindrical body 70 moves in the L direction with a thrust according to the energization amount. Further, when the coil body CD is energized with the same energization amount by the control device CONT, the thrust in the D direction by the coil bodies CD facing each other across the axis line becomes the same and balances. It becomes coaxial with the axial line position of the shaft 60.

Here, as shown in FIG. 3, when the axial position 70 a is shifted from the axial position 60 a of the shaft 60 during the movement of the cylindrical body 70, the coil bodies CD (CD 1 and CD 2) facing each other in the shifted direction. The amount of current flowing through the battery changes. That is, the current flowing through the coil body CD1 having a short distance from the shaft axis 60 is larger than the current flowing through the coil body CD2 having a long distance from the shaft axis 60. Therefore, the control device CONT adjusts the energization amount (that is, the thrust in the D direction) so that the current values are equal when the amount of current flowing through the coil bodies CD1 and CD2 varies as described above.
Thereby, the position of the cylinder 70 is adjusted such that the axis 70 a is coaxial with the axis 60 a of the shaft 60.

  As described above, in this embodiment, the axial position of the stator and the axial position of the mover can be adjusted coaxially without providing a separate guide device, and thus the size and cost of the device can be prevented from increasing. In the present embodiment, since the axis positions 60a and 70a are adjusted by the control device CONT that controls the thrust in the L direction, the position of the mover can be easily adjusted.

(Shaft motor; second embodiment)
Next, a second embodiment of the shaft motor SM will be described with reference to FIG.
In this figure, the same components as those of the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and the description thereof is omitted.
In the first embodiment, the coil bodies CL and CD are arranged adjacent to each other in the D direction orthogonal to the axial direction. In the second embodiment, the coil bodies CL and CD are arranged adjacent to each other in the L direction.

As shown in FIG. 4, the cylindrical body 70 in this embodiment includes a housing 71 provided with a coil body CL, and a housing 72 disposed on both sides in the L direction of the housing 71 and provided with a coil body CD. Yes. Energization of the coil bodies CL and CD is controlled by the control device CONT.
Other configurations are the same as those of the first embodiment.

  In the shaft motor SM configured as described above, in addition to obtaining the same operation and effect as those of the first embodiment, the distance between the magnet 61 and the coil body CL is shortened, so that thrust in the L direction can be efficiently performed. Can be granted.

(Shaft motor; Third Embodiment)
Next, a third embodiment of the shaft motor SM will be described with reference to FIG.
In this figure, the same components as those of the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and the description thereof is omitted.
In the first embodiment, the control unit CONT adjusts the energization amount of each coil body CD according to the fluctuation of the current value flowing through the coil body CD. However, in the second embodiment, it is substantially orthogonal to the axial direction. A sensor that measures the relative positional relationship between the shaft axis 60 in the D direction (radial direction) and the cylinder 70 is used.

That is, as shown in FIG. 5, a plurality of (here, four at 90 ° intervals) distance sensors (measuring devices) 65 are provided on the shaft 60 of the shaft motor SM in the present embodiment. The distance sensor 65 measures a distance from the inner peripheral surface of the cylinder 70 (a gap amount between the shaft 60 and the cylinder 70) and outputs the distance to the control device CONT.
When there is a distribution in the gap amount between the shaft 60 and the cylinder 70, which is the output of the distance sensor 65, the control device CONT energizes the coil body CD so that this distribution is eliminated. The amount is adjusted and the cylinder 70 is driven in the D direction.

  As described above, in this embodiment, in addition to obtaining the same operation and effect as in the first embodiment, the distance sensor 65 actually measures the gap amount between the shaft 60 and the cylindrical body 70. Compared with the case where the value of the current flowing through each coil body CD is monitored, the axis 60a of the shaft 60 and the axis 70a of the cylinder 70 can be adjusted coaxially with higher accuracy.

(Shaft motor; fourth embodiment)
Next, a fourth embodiment of the shaft motor SM will be described with reference to FIG.
In this figure, the same components as those of the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and the description thereof is omitted.
In the first to third embodiments, the so-called moving coil type shaft motor SM in which the shaft shaft 60 is provided with the magnet and the cylindrical body 70 is provided with the coil body has been described. In the fourth embodiment, the moving magnet type is provided. The shaft motor SM will be described.

  As shown in FIG. 6, the cylindrical body in this embodiment has a magnet (or is formed of a magnet). A three-phase coil body CL is arranged on the shaft 60 along the length direction with a coil body CD interposed therebetween. A plurality of coil bodies CD are arranged around the central axis. Further, although not shown in FIG. 6, the shaft shaft 60 is provided with a distance sensor 65 at the position where the coil body CD is disposed, similarly to the one shown in FIG.

In the shaft motor SM having the above configuration, when the coil body CL is energized by the control device CONT, the cylindrical body 70 moves in the L direction with a thrust according to the energization amount. Further, when the coil body CD is energized with the same energization amount by the control device CONT, the thrust in the D direction by the coil bodies CD facing each other across the axis line becomes the same and balances. It becomes coaxial with the axial line position of the shaft 60.
In addition, when there is a distribution in the gap amount between the shaft 60 and the cylindrical body 70, which is the output of the distance sensor, the control device CONT supplies the coil CD to the coil body CD so that this distribution is eliminated. The energization amount is adjusted, and the cylindrical body 70 is driven in the D direction.

  As described above, in this embodiment, in addition to obtaining the same operation and effect as the first embodiment, in order to actually measure the gap amount between the shaft 60 and the cylindrical body 70 with the distance sensor, It becomes possible to adjust the axis 60a of the shaft 60 and the axis 70a of the cylindrical body 70 coaxially with higher accuracy.

(Stage device and exposure device)
Next, a stage apparatus and an exposure apparatus to which the shaft motor SM according to the present invention is applied will be described with reference to FIGS.
Here, a case will be described in which the shaft motor SM is applied to a tube carrier driving device that holds a power supply member that supplies power to the wafer stage in the exposure apparatus.

  FIG. 7 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. An exposure apparatus 10 shown in FIG. 7 is an exposure apparatus for manufacturing a semiconductor element. The pattern formed on the reticle R is sequentially transferred to the wafer W while the reticle (mask) R and the wafer (substrate) W are moved synchronously. This is a reduction projection type exposure apparatus of a step-and-scan method for transferring the image on the top.

  In the following description, if necessary, an XYZ orthogonal coordinate system is set in the drawing, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. This XYZ orthogonal coordinate system is set so that the X-axis and the Z-axis are parallel to the paper surface, and the Y-axis is set to a direction perpendicular to the paper surface. In the XYZ coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z-axis is set vertically upward. Further, it is assumed that the synchronous movement direction (scanning direction) of the wafer W and the reticle R at the time of exposure is set in the Y direction.

  As shown in FIG. 7, the exposure apparatus 10 includes an illumination optical system ILS, a reticle stage RST that holds a reticle R as a mask, a projection optical system PL, and a wafer W as a substrate in an X direction and a Y direction within an XY plane. It includes wafer stage WST as a stage apparatus including stage units WST1 and WST2 that are moved in a two-dimensional direction, and a main controller MCS that controls them. Although not shown, wafer stage WST may be provided with a stage unit provided with various measuring instruments for measuring the performance of exposure apparatus 10 in addition to stage units WST1 and WST2.

  The illumination optical system ILS performs shaping of exposure light emitted from a light source unit (not shown) (for example, a laser light source such as an ultra-high pressure halogen lamp or an excimer laser) and makes the illuminance distribution uniform, thereby making a rectangular (or rectangular) on the reticle R (or Irradiate the illumination area IAR in a circular arc shape with uniform illuminance. The reticle stage RST has a configuration in which a stage movable unit 11 is provided on a reticle base (not shown), and the stage movable unit 11 moves on the reticle base along a predetermined scanning direction at a predetermined scanning speed during exposure.

  A reticle R is held on the upper surface of the stage movable unit 11 by, for example, vacuum suction. An exposure light passage hole (not shown) is formed below the reticle R of the stage movable unit 11. A reflecting mirror 12 is disposed at the end of the stage movable unit 11, and the position of the stage movable unit 11 is detected by the laser interferometer 13 measuring the position of the reflecting mirror 12. The detection result of the laser interferometer 13 is output to the stage control system SCS. The stage control system SCS drives the stage movable unit 11 based on the detection result of the laser interferometer 13 and a control signal from the main controller MCS based on the moving position of the stage movable unit 11. Although not shown in FIG. 7, above the reticle stage RST, a mark (reticle mark) formed on the reticle R and a reference mark formed on a reference member for determining the reference position of the wafer stage WST A reticle alignment sensor is provided to measure the relative positional relationship by simultaneously observing.

  The projection optical system PL is a reduction optical system having a reduction magnification of α (α is, for example, 4 or 5), for example, and is disposed below the reticle stage RST, and the direction of the optical axis AX is set to the Z-axis direction. ing. Here, a refracting optical system comprising a plurality of lens elements arranged at a predetermined interval along the optical axis AX direction is used so as to provide a telecentric optical arrangement. An appropriate lens element is selected according to the wavelength of light emitted from the light source unit. When the illumination area IAR of the reticle R is illuminated by the illumination optical system ILS, a reduced image (partial inverted image) of the pattern in the illumination area IAR of the reticle R is an exposure area IA conjugate to the illumination area IAR on the wafer W. Formed.

FIG. 8 is a plan view showing the configuration of wafer stage WST. As shown in FIGS. 7 and 8, wafer stage WST includes a base member 14 and stage units WST1 to WST1, which are levitated and supported by an air slider described later via a clearance of about several μm above the upper surface of base member 14. Articulated type that relays WST2, a driving device 15 that drives each of these stage units WST1 and WST2 in a two-dimensional direction in the XY plane, and cables (utility supply members) connected to stage units WST1 to WST2 Robot arms (multi-joint type arm devices) RB1 and RB2, and tube carriers TC1 and TC2 that support the robot arms RB1 and RB2 (that is, the cables) and move along the Y direction. ing. Stage units WST1 and WST2 are provided to hold and transfer wafer W.
By individually driving the driving device 15 provided in each of the stage units WST1 and WST2, each of the stage units WST1 and WST2 can be individually moved in any direction within the XY plane.

  The tube carriers TC1 and TC2 are connected to the cylinder 70 that is the mover of the shaft motor SM described above, and the cylinder 70 moves relative to the shaft 60 that is the stator, so Driven by.

  In the example shown in FIG. 8, the position of the −Y side end of the base member 14 is the loading position of the wafer W, and when the wafer W after the exposure processing is unloaded and when the unexposed processing wafer W is loaded. In this case, one of stage units WST1 and WST2 is arranged at this position. In the example shown in FIG. 8, the position where the projection optical system PL is arranged is the exposure position, and one of the stage units WST1 and WST2 holding the wafer W to be subjected to the exposure process is at this position during exposure. Placed in. As described above, since the stage units WST1 and WST2 can be individually moved in any direction within the XY plane, the loading position and the exposure position can be alternately switched. Further, the wafer focusing information may be detected at the loading position.

  Here, as shown in FIG. 7, the driving device 15 is fixed to a fixing portion 16 provided (embedded) on the upper portion of the base member 14 and to the bottom portions (base facing surface side) of the stage units WST1 and WST2. And a planar motor that includes a moving unit 17 that moves along a moving surface 16a on the fixed unit 16. Further, the moving unit 17, the base member 14, and the driving device 15 constitute a planar motor device. In the following description, the driving device 15 is referred to as a planar motor device 15 for convenience.

  Wafer W is fixed on stage units WST1 and WST2 by, for example, vacuum suction. Further, the side surfaces of the stage units WST1 and WST2 are reflection surfaces that reflect the laser beam from the laser interferometer 18 (see FIG. 7), and the stage units WST1 and WST2 are arranged by the laser interferometer 18 arranged outside. The position in the XY plane is always detected with a resolution of about 0.5 to 1 nm, for example.

  In FIG. 7, the laser interferometer 18 is representatively shown. However, actually, the laser interferometer that detects the position of the stage units WST1 and WST2 in the Y direction and the laser interference that detects the position in the X direction. It consists of a total.

  The position information (or speed information) of the stage units WST1 and WST2 is sent to the stage control system SCS and the main controller MCS via this. In the stage control system SCS, in the XY plane of the stage units WST1 and WST2 via the planar motor device 15 based on the position information (or speed information) of the stage units WST1 and WST2 according to an instruction from the main controller MCS. Control each move.

  Here, the configuration of wafer stage WST will be described. FIG. 9 is a plan view of stage unit WST1 provided on wafer stage WST, and FIG. 10 is a sectional view taken along the line AA in FIG. 9 and 10, the same members as those shown in FIGS. 7 and 8 are denoted by the same reference numerals. Since stage unit WST1 and stage unit WST2 have the same configuration, stage unit WST1 will be described as a representative here.

  As shown in FIGS. 9 and 10, the first stage 25 that forms a part of the stage unit WST1 has a predetermined distance (about several μm) from the fixed part 16 on the fixed part 16 provided on the upper part of the base member 14. Is supported by levitation. Fixed portion 16 forming a part of wafer stage WST has coil 21 wound around it and includes core members 22 arranged at a predetermined pitch in the XY plane. The core member 22 is formed of, for example, a magnetic material such as SS400-equivalent low carbon steel or stainless steel, and includes a head portion 22a and a column portion 22b. The head 22a has a rectangular cross-sectional shape in the XY plane, and the cross-sectional shape in the XY plane of the column portion 22b is a circular shape. The head portion 22a and the column portion 22b are integrated, and the coil 21 is wound around the column portion 22b.

  FIG. 11 is an enlarged view of the core member 22. As shown in FIG. 11, the coil 21 is wound around the support portion 22 b of the core member 22 via the heat insulating material Ti. This is to prevent the positioning error of the stage units WST1 and WST2 caused by the heat generated when a current is passed through the coil 21 being transmitted to the core member 22. In addition, as the heat insulating material Ti, a resin excellent in heat insulating properties and heat resistance can be used.

  The core member 22 is arranged on the base member 14 so that the front end portion of the head portion 22a is included in substantially one surface. At this time, the support member 22 b of the core member 22 is magnetically connected to the base member 14. A separator 23 made of a non-magnetic material is provided between the heads 22 a of the core member 22. The separator 23 is made of, for example, SUS or ceramics, and prevents the magnetic circuit from being formed between adjacent core members 22.

  Since the height position of the upper portion of the separator 23 is set to be the same as the height position of the distal end portion of the head portion 22a of the core member 22, the upper surface (moving surface) of the fixed portion 16 is substantially flat. Become. Further, the separator 23 is provided between the head portion 22 a of the core member 22, and a space in which the vertical direction is sandwiched between the base member 14, the head portion 22 a of the core member 22 and the separator 23 is formed. The coil 21 can be cooled by introducing the refrigerant into this space.

A guide member 24 is provided on the upper surface of the fixed portion 16. The guide member 24 serves as a guide plate for moving the stage units WST1 and WST2 in the XY plane, and is formed of a nonmagnetic material. The guide member 24 is formed, for example, by spraying alumina (Al ₂ O ₃ ) on the upper surface of the flat fixed portion 16 and spraying it on the metal surface with a high-pressure gas.

The coil 21 provided in the fixed portion 16 is supplied with a three-phase alternating current composed of a U phase, a V phase, and a W phase. By applying the current of each phase to each of the coils 21 arranged in the XY plane at a predetermined timing in a predetermined order, the stage units WST1 and WST2 can be moved in a desired direction at a desired speed. 12 is a cross-sectional arrow view taken along line BB in FIG. As shown in FIG. 12, the head portions 22a of the core member 22 having a rectangular cross-sectional shape are arranged in a matrix in the XY plane, and a separator 23 is provided between the head portions 22a.
In FIG. 12, each phase of the three-phase alternating current applied to the coil 21 wound around each core member 22 is illustrated in association with the head portion 22 a of the core member 22. Referring to FIG. 12, it can be seen that the U-phase, V-phase, and W-phase are regularly arranged in the XY plane.

  The moving unit 17 forming part of the wafer stage WST includes a first stage 25, a permanent magnet 26, an air pad 27, a second stage 28, a horizontal drive mechanism 29, and a vertical drive mechanism 30. Permanent magnets 26 and air pads 27 are regularly arranged on the bottom surface of the first stage 25. As the permanent magnet 27, a rare earth magnet such as a neodymium / iron / cobalt magnet, an aluminum / nickel / cobalt (alnico) magnet, a ferrite magnet, a samarium / cobalt magnet, or a neodymium / iron / boron magnet can be used.

  13 is a cross-sectional arrow view taken along the line CC in FIG. As shown in FIG. 13, the permanent magnets 26 are arranged at predetermined intervals in the XY plane so that adjacent magnets have different poles. With this arrangement, an alternating magnetic field is formed in both the X and Y directions. A vacuum preload type air pad 27 is provided between the permanent magnets 26. The air pad 27 blows air (air) toward the guide member 24, and thereby supports the moving unit 17 to float (non-contact) with respect to the fixed unit 16 through a clearance of, for example, several microns.

The second stage 28 is supported on the first stage 25 by the vertical drive mechanism 30.
Here, the vertical drive mechanism 30 includes support mechanisms 30a, 30b, and 30c (see FIG. 9) including, for example, a voice coil motor (VCM). The second stage 28 is supported by these support mechanisms 30a, 30b, and 30c. Supports three different points. The support mechanisms 30a, 30b, and 30c are configured to be extendable and contractible in the Z direction, and the second stage 28 can be moved in the Z direction by driving the support mechanisms 30a, 30b, and 30c with the same expansion / contraction amount. The rotation of the second stage 28 around the X axis and the rotation around the Y axis can be controlled by driving the support mechanisms 30a, 30b, 30c independently or by driving different amounts of expansion and contraction. Can do.

  The horizontal drive mechanism 29 includes drive mechanisms 29a, 29b, 29c (see FIG. 9) including, for example, a voice coil motor (VCM), and the XY plane of the second stage 28 by these drive mechanisms 29a, 29b, 29c. The position inside and the rotation around the Z axis are controlled. Specifically, the position of the second stage 28 in the Y direction can be varied by driving the drive mechanisms 29a and 29b with the same expansion / contraction amount, and the X of the second stage 28 can be changed by driving the drive mechanism 29c. The direction position can be varied, and the rotation of the second stage 28 about the Z-axis can be varied by driving the drive mechanisms 29a and 29b with different expansion / contraction amounts. That is, it can be said that the first stage 25 driven by the planar motor 17 described above is a coarse movement stage, and the second stage 28 driven by the horizontal drive mechanism 29 is a fine movement stage. The horizontal drive mechanism 29 and the vertical drive mechanism 30 adjust the position of the second stage 28 in the XY plane and the position in the Z direction under the control of the stage control system SCS.

  Returning to FIG. 7, the exposure apparatus 10 of the present embodiment includes an air pump 40 for supplying pressurized air to the air pad 27 shown in FIG. Air pump 40 and stage units WST1 and WST2 are connected to each other via tubes 41 and 42, and air from air pump 40 is supplied to stage unit WST1 via tube 41 and via tube 42. To the stage unit WST2. Further, a cooling device 43 for cooling the coil 21 shown in FIG. 10 is provided. The cooling device 43 is connected to the base member 14 by a refrigerant supply pipe 44 and a refrigerant discharge pipe 45. The refrigerant from the cooling device 43 is supplied to the base member 14 (the portion where the coil 21 in the fixed portion 16 is provided) via the refrigerant supply pipe 44, and the refrigerant via the base member 14 passes through the refrigerant discharge pipe 45. And recovered by the cooling device 43. For example, in FIG. 10, the upper and lower sides are sandwiched between the guide member 24 and the base 14, and a coolant such as water is supplied to a space in which the coil 21, the core member 22, and the separator 23 are disposed. Can do.

  Although not shown in FIG. 7, the exposure apparatus 10 includes an off-axis type wafer alignment sensor for measuring positional information of alignment marks formed on the wafer W, on the projection optical system PL side. A TTL (through-the-lens) type alignment sensor that measures positional information of alignment marks formed on the wafer W via the projection optical system PL is provided. Further, slit-like detection light is irradiated to the wafer W from an oblique direction, and the reflected light is measured to detect the position and posture (rotation about the X and Y axes) of the wafer W in the Z direction. An autofocus mechanism and an auto leveling mechanism are provided that correct the position and orientation of the wafer W in the Z direction based on the detection result and align the surface of the wafer W with the image plane of the projection optical system PL.

  When the stage units WST1 and WST2 configured as described above are moved, a driving method similar to that of a known linear motor driven by three-phase AC can be used. That is, when the stage units WST1 and WST2 are considered to be composed of a linear motor configured to be movable in the X direction and a linear motor configured to be movable in the Y direction, the stage units WST1 and WST2 are moved in the X direction. When applying the same three-phase alternating current as the linear motor configured to be movable in the X direction to the coils 21 arranged in the X direction and moving the stage units WST1 and WST2 in the Y direction, the Y direction What is necessary is just to apply the same three-phase alternating current as the linear motor comprised so that a movement to the Y direction was possible with respect to each coil 21 arranged in this.

  Further, during scanning, a part of the pattern image of the reticle R is projected onto the exposure area IA, and is synchronized with the movement of the reticle R in the −X direction (or + X direction) at the speed V with respect to the projection optical system PL. Thus, the wafer W moves in the + X direction (or -X direction) at a speed β · V (β is a projection magnification). When the exposure process for one shot area is completed, main controller MCS moves stage unit WST1 to step the next shot area to the scanning start position, and thereafter, similarly to each shot area by the step-and-scan method. Exposure processing is performed sequentially.

  Here, when the stage unit WST1 moves on the base member 14 (on the fixed portion 16), the tube carrier TC1 moves following the Y direction according to the position of the stage unit WST1 in the Y direction, By rotating the robot arm RB1 according to the position of the stage unit WST1 in the X direction, it is possible to prevent an error factor such as vibration from being transmitted to the stage unit WST1 due to deformation of cables or the like accompanying the movement of the stage unit WST1.

  As described above, in the present embodiment, since the tube carriers TC1 and TC2 are driven by the shaft motor SM, the tube carriers TC1 and TC2 can be moved with high accuracy without increasing the size and cost of the apparatus. Is possible.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

For example, in the above embodiment, the coil body CD is provided, and the axial positions of the shaft shaft 60 and the cylindrical body 70 are adjusted coaxially by energization control to the coil body CD. However, the present invention is not limited to this. 14, for example, as shown in FIG. 14, a housing 72 having magnets (second magnetomotive members) 62 as position adjusting devices along the circumferential direction on both sides in the L direction of the housing 71 provided with the coil body CL, or The structure which provides the housing 72 formed with the magnet 62 may be sufficient.
In this configuration, since the magnet 62 generates a repulsive force or an attractive force in the D direction uniformly with the magnet 61 provided on the shaft shaft 60, the distance between the shaft shaft 60 and the magnet 62, that is, the shaft. It becomes possible to keep the distance between the shaft 60 and the cylinder 70 constant.
In this case, power consumption does not occur as in the case of using the coil body CD, and position adjustment with high energy efficiency becomes possible.

Moreover, in the said embodiment, although it was set as the structure which provides the position adjustment apparatus which adjusts an axis line position in any one of the shaft axis | shaft 60 and the cylinder 70, it is not limited to this, For example, FIG. As shown, a plurality of position adjusting devices 80 may be provided around the cylinder body along the L direction.
In this configuration, when a coil body is provided on the shaft 60 and a magnet is provided on the cylinder 70, a coil body that applies thrust in the D direction to the magnet of the cylinder 70 is provided as the position adjusting device 80. Or the 2nd magnetomotive body of the polarity which produces a repulsive force between the magnets of the cylinder 70 should just be provided.
On the other hand, when the shaft shaft 60 is provided with a magnet and the cylindrical body 70 is provided with a coil body, the above-described coil body CD is provided on the outer peripheral side of the cylindrical body 70, and the second magnetic generator is provided as the position adjusting device 80. Just do it.

Moreover, in the said embodiment, although the shaft axis 60 was used as the stator and the structure which used the cylinder 70 as a needle | mover was demonstrated, contrary to this, the shaft axis 60 was used as a needle | mover and the cylinder 70 was used as a stator. It may be a configuration.
In this case, the tube carriers TC <b> 1 and TC <b> 2 shown in FIG. 8 are connected to the shaft 60.

  Furthermore, in the said embodiment, although it is set as the structure which uses an electromagnetic force for the position adjustment of the shaft 60 and the cylinder 70, it is not restricted to this, For example, the structure using fluid pressures, such as an air pressure, may be sufficient. In this case, the fluid may be ejected from either the shaft 60 or the cylinder 70. However, in consideration of the adverse effect of the ejected fluid, the cylinder 70 and the shaft 60 overlap in the L direction. It is preferable to eject the fluid only.

  In the above-described embodiment, the configuration in which the shaft motor SM according to the present invention is applied to the wafer stage WST and the exposure apparatus is exemplified. However, the present invention can be applied to various measuring apparatuses, machine tools, and the like.

  As the exposure apparatus 10, in addition to a step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the reticle R by synchronously moving the reticle R and the wafer W, the reticle R and the wafer W It can also be applied to a step-and-repeat projection exposure apparatus (stepper) in which the pattern of the reticle R is collectively exposed while the wafer is stationary and the wafer W is sequentially moved stepwise. The present invention can also be applied to a step-and-stitch type exposure apparatus that partially transfers at least two patterns on the wafer W.

  In addition to the semiconductor wafer for manufacturing semiconductor devices, the substrate of the above embodiment includes a glass substrate for display devices, a ceramic wafer for thin film magnetic heads, or an original mask (reticle) used in an exposure apparatus (synthesis). Quartz, silicon wafer) or the like is applied.

The light source of the exposure apparatus to which the present invention is applied includes not only KrF excimer laser (248 nm), ArF excimer laser (193 nm), F ₂ laser (157 nm), but also g-line (436 nm) and i-line (365 nm). ) Can be used. Further, the magnification of the projection optical system may be not only a reduction system but also an equal magnification or an enlargement system. In the above embodiment, the refraction type projection optical system is exemplified, but the present invention is not limited to this. For example, a catadioptric or refractive optical system may be used.

  The exposure apparatus of the present invention is an exposure apparatus that is used for manufacturing a semiconductor element to transfer a device pattern onto a semiconductor substrate, an exposure apparatus that is used for manufacturing a liquid crystal display element to transfer a circuit pattern onto a glass plate, The present invention can also be applied to an exposure apparatus that is used for manufacturing a thin film magnetic head and transfers a device pattern onto a ceramic wafer, and an exposure apparatus that is used to manufacture an image sensor such as a CCD.

  Further, the present invention is applied to a so-called immersion exposure apparatus in which a liquid is locally filled between the projection optical system and the substrate, and the substrate is exposed through the liquid. It is disclosed in the publication No. 99/49504 pamphlet. Further, in the present invention, the entire surface of the substrate to be exposed as disclosed in JP-A-6-124873, JP-A-10-303114, US Pat. No. 5,825,043 and the like is in the liquid. The present invention is also applicable to an immersion exposure apparatus that performs exposure while being immersed.

In the above embodiment, a configuration in which a plurality of (two) stage units are provided is illustrated. However, the configuration is not limited to this, and a configuration in which a single unit is provided may be used.
In addition, a plurality of stage units are not provided, but a reference member on which a substrate stage for holding a substrate and a reference mark are formed, as disclosed in Japanese Patent Application Laid-Open No. 11-135400 and Japanese Patent Application Laid-Open No. 2000-164504. In addition, the present invention can also be applied to an exposure apparatus that includes a measurement stage that measures information related to exposure by mounting various photoelectric sensors.

  As described above, the exposure apparatus 10 of the embodiment of the present application maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

Next, an embodiment of a manufacturing method of a micro device using the exposure apparatus and the exposure method according to the embodiment of the present invention in the lithography process will be described. FIG. 16 is a flowchart illustrating a manufacturing example of a micro device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, or the like).
First, in step S10 (design step), function / performance design (for example, circuit design of a semiconductor device) of a micro device is performed, and pattern design for realizing the function is performed. Subsequently, in step S11 (mask manufacturing step), a mask (reticle) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S12 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.
Next, in step S13 (wafer processing step), using the mask and wafer prepared in steps S10 to S12, an actual circuit or the like is formed on the wafer by lithography or the like, as will be described later. Next, in step S14 (device assembly step), device assembly is performed using the wafer processed in step S13. This step S14 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S15 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S14 are performed. After these steps, the microdevice is completed and shipped.

FIG. 17 is a diagram illustrating an example of a detailed process of step S13 in the case of a semiconductor device.
In step S21 (oxidation step), the surface of the wafer is oxidized. In step S22 (CVD step), an insulating film is formed on the wafer surface. In step S23 (electrode formation step), an electrode is formed on the wafer by vapor deposition. In step S24 (ion implantation step), ions are implanted into the wafer. Each of the above steps S21 to S24 constitutes a pre-processing process at each stage of the wafer processing, and is selected and executed according to a necessary process at each stage.
At each stage of the wafer process, when the above pre-process is completed, the post-process is executed as follows. In this post-processing process, first, in step S25 (resist formation step), a photosensitive agent is applied to the wafer. Subsequently, in step S26 (exposure step), the circuit pattern of the mask is transferred to the wafer by the lithography system (exposure apparatus) and the exposure method described above. Next, in step S27 (development step), the exposed wafer is developed, and in step S28 (etching step), exposed members other than the portion where the resist remains are removed by etching. In step S29 (resist removal step), the resist that has become unnecessary after the etching is removed. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the wafer.

  In addition, not only microdevices such as liquid crystal display elements or semiconductor elements, but also mother reticles for manufacturing reticles or masks used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc. The present invention can also be applied to an exposure apparatus that transfers a pattern to a glass substrate or silicon wafer. Here, in an exposure apparatus using DUV (deep ultraviolet), VUV (vacuum ultraviolet) light, or the like, a transmission type reticle is generally used. As a reticle substrate, quartz glass, fluorine-doped quartz glass, fluorite, Magnesium fluoride or quartz is used. In proximity-type X-ray exposure apparatuses, electron beam exposure apparatuses, and the like, a transmissive mask (stencil mask, membrane mask) is used, and a silicon wafer or the like is used as a mask substrate. Such an exposure apparatus is disclosed in WO99 / 34255, WO99 / 50712, WO99 / 66370, JP-A-11-194479, JP-A2000-12453, JP-A-2000-29202, and the like. .

  DESCRIPTION OF SYMBOLS 10 ... Exposure apparatus, 60 ... Shaft shaft (shaft body, stator), 61 ... Magnet (magnet generator), 62 ... Magnet (second magnet generator, position adjusting device), 65 ... Distance sensor (measuring device), 70 ... Cylindrical body (mover), CD ... Coil body (second coil body), CL ... Coil body, SM ... Shaft motor, WST ... Wafer stage (stage device)

Claims (8)

A shaft motor in which a magnetomotive member is provided on one of the shaft body and the cylinder, and a coil body is provided on the other of the shaft body and the cylinder,
The shaft motor which has a position adjustment apparatus which adjusts the axial line position of the said shaft body, and the axial line position of the said cylinder so that it may become coaxial. The magnetomotive body is provided on the shaft body,
2. The shaft motor according to claim 1, wherein the position adjusting device includes a second magnetism member that is provided along the circumferential direction in the cylindrical body and applies a force in a direction substantially orthogonal to the axis between the magnetism generator. .   The shaft motor according to claim 2, wherein the second magnetism member is provided on the cylindrical body so as to be separated from the coil body in the axial direction. The magnetomotive body is provided on the shaft body,
2. The shaft motor according to claim 1, wherein the position adjusting device includes a second coil body that is provided in a plurality in the circumferential direction on the cylindrical body and applies thrust in a direction substantially orthogonal to the axis to the magnetomotive body.   The shaft motor according to claim 4, further comprising a control device that controls an energization amount to the second coil bodies in accordance with a current value flowing through each of the plurality of second coil bodies. A measuring device that measures a relative positional relationship between the shaft body and the cylindrical body in a direction substantially orthogonal to the axis;
The shaft motor according to claim 4, further comprising: a control device that controls an energization amount to the second coil body based on a measurement result of the measurement device.   A stage device comprising the shaft motor according to claim 1 as a drive device.   An exposure apparatus comprising the stage apparatus according to claim 7.

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