KR20070035602A - Planar motor equipment, stage equipment, exposure equipment and device manufacturing method - Google Patents

Abstract

The present invention provides a planar motor device and the like that can move at high acceleration, realize high positioning accuracy, and can drive efficiently. The planar motor 15 is comprised including the fixed part 16 formed in the base member 14, and the moving part 17 formed in the stage unit WST1. The fixed part 16 is equipped with the core member 22 arrange | positioned at predetermined intervals in XY plane, and the coil 21 wound around, and the front-end | tip part of the head part 22a of this core member 22 is substantially It is set to be included in one side. On the bottom face of the first stage 25 included in the stage unit WST1, permanent magnets 26 arranged in the X direction and the Y direction at predetermined intervals are provided.

Planar motor device, stage device, exposure device,

Description

Planar Motor Device, Stage Device, Exposure Device and Manufacturing Method of Device {PLANAR MOTOR EQUIPMENT, STAGE EQUIPMENT, EXPOSURE EQUIPMENT AND DEVICE MANUFACTURING METHOD}

Field of technology

The present invention relates to a planar motor device for driving a moving unit two-dimensionally with respect to a fixed part, a stage device including the planar motor device as a driving means, and an exposure device provided with the stage device.

This application claims priority with respect to Japanese Patent Application No. 2004-208574 for which it applied on July 15, 2004, and uses the content here.

Background

In the photolithography process formed as one of the manufacturing processes of a semiconductor device, a liquid crystal display device, an imaging device such as a CCD (Charge Coupled Device), a thin film magnetic head, and various other devices, a mask or a reticle (a mask in the case of these generically referred to as a mask) The exposure apparatus which transfers the pattern formed in FIG. 2 to the board | substrate, such as a glass plate or a wafer to which photoresist was apply | coated via the projection optical system, is used. In this exposure apparatus, since it is necessary to position a board | substrate at high exposure position with high precision, a board | substrate is hold | maintained by vacuum suction etc. on a board | substrate holder, and this board | substrate holder is fixed on the board | substrate table.

In recent years, it is required to move a substrate at a higher speed in order to improve the throughput (the number of substrates that can be exposed in a unit time). Further, by miniaturization of the pattern transferred to the substrate, it is also required to realize the positioning of the substrate with high accuracy without being affected by the precision of the mechanical guide surface or the like. In addition, in order to reduce the chance of maintenance and increase the operating time of the exposure apparatus, it is also required to prolong the life by avoiding mechanical friction. In order to satisfy these requirements, the stage apparatus which performs positioning of a board | substrate is developed by driving the board | substrate table in which the board | substrate is mounted in a two-dimensional direction non-contact. As a drive source of this stage device of non-contact driving, for example, a planar motor having a structure in which a linear pulse motor of a variable magnetoresistive drive system is biaxially coupled is known.

As the planar motor of the variable magnetoresistance driving method described above, in the present state, a structure in which two axes of a variable magnetoresistance driving type linear pulse motor are combined such as a Sawyer motor is mainstream. In this variable magneto-resistive linear pulse motor, for example, a stator composed of a plate-shaped magnetic body having uneven teeth formed at equal intervals along the longitudinal direction thereof faces the uneven teeth of the stator. A plurality of armature coils having concave-convex portions of different phases from the negative part have a movable element connected through a permanent magnet, and are operated using a force generated by minimizing the magnetic resistance between the stator and the movable element at each time point. It is a motor that drives the ruler.

In recent years, for example, a fixed part including two-dimensionally arranged coils and a moving part having two-dimensionally arranged permanent magnets are used and the Lorentz force generated by flowing a current through the coil is used. The planar motor which drives a moving part two-dimensionally with respect to the fixed part is devised. For details of this planar motor, see, for example, Japanese Patent Application Laid-Open No. Hei 11-164543, Japanese Patent Application Laid-Open No. 2003-224961, and US Patent No. 5677758. Insofar as permitted by the national legislation of the designated country (or selected selected country) specified in this International Application, this publication and the disclosure of US patents are incorporated herein by reference.

By the way, in recent years, further improvement of the throughput is required, and therefore, the substrate stage is required to move at a higher acceleration. In order to increase the acceleration of the substrate stage, it is necessary to increase the thrust applied to the substrate stage.However, in order to increase the thrust, the magnetic flux density formed by the permanent magnet by increasing the current flowing through the coil or increasing the size of the permanent magnet is increased. You can make it higher. However, in the planar motor described above, when a large current flows through the coil, the amount of heat is increased, and for example, a mechanical error due to expansion of a member constituting the substrate stage occurs due to heat generated from the coil, resulting in a position. Deterioration of the determination precision is caused.

On the other hand, when the permanent magnet is enlarged and the magnetic flux density is increased, the weight of the moving part increases. If the weight of the moving part is increased, the acceleration cannot be increased even if the thrust is increased, but there is a possibility that the positioning accuracy of the substrate stage is deteriorated. Moreover, when the weight of a moving part increases, it is necessary to flow a large electric current further to a coil in order to raise acceleration, and efficiency will worsen. On the contrary, when the permanent magnet is downsized, the moving part becomes lighter, but the magnetic flux density formed by the permanent magnet is lowered, and if the same thrust is to be obtained, more current needs to flow through the coil.

This invention is made | formed in view of the said situation, The plane motor apparatus which can move at high acceleration, can realize high positioning precision, and can drive efficiently, The said planar motor apparatus is used as a drive means. An object of the present invention is to provide a stage apparatus provided and an exposure apparatus including the stage apparatus.

Disclosure of the Invention

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, the planar motor apparatus of this invention is a planar motor apparatus provided with the fixing part 16 which forms a predetermined moving surface, and the moving part 17 which can move along the said moving surface, The said fixed part is And a plurality of core members 22 disposed along the moving surface, each comprising a magnetic body, and a coil 21 magnetically connected to each of the core members, wherein the moving portion faces the fixed portion. The magnetic member 26 arrange | positioned along the said moving surface is provided on the side to be made, It is characterized by the above-mentioned.

According to the present invention, the magnetic flux generated from each of the coils is guided to the moving surface through the magnetically connected core member, and repels or sucks with the magnetic flux generated from the magnet provided in the moving portion. Thrust is generated in the moving part by this repulsive force and suction force, and the moving part moves along a moving surface.

Moreover, the stage apparatus of this invention is stage apparatus (RST, WST) provided with the stages 25 and 28 which mount the object R, W, and is provided with said planar motor apparatus as a drive means of the said stage. It is characterized by.

Moreover, the exposure apparatus of this invention is equipped with the mask stage RST which hold | maintains the mask R, and the substrate stage WST which hold | maintains the board | substrate W, and transfers the pattern formed in the said mask on the said board | substrate. As said exposure apparatus 10, said stage apparatus is provided as at least one of the said mask stage and the said substrate stage. It is characterized by the above-mentioned.

According to the present invention, since the magnetic flux generated from the coil is guided through the core member to the moving surface facing the magnet provided in the moving part, the magnet of the moving part can be miniaturized without lowering the thrust, so that the moving part can be reduced in weight. have. Thereby, while moving a moving part with high acceleration, there exists an effect that a high positioning precision can be implement | achieved. Moreover, since the magnetic flux generated from the coil can be used effectively, there is an effect that the moving unit can be driven efficiently.

Moreover, according to this invention, since a stage can be moved with high acceleration, there exists an effect that a target can be conveyed at high speed in a short time.

Furthermore, according to the present invention, at least one of the mask stage and the substrate stage formed in the exposure apparatus can be moved with high acceleration and high accuracy by the above-mentioned planar motor, so that the fine pattern can be transferred at high throughput with high accuracy. It can be effective.

Brief description of the drawings

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows schematic structure of the exposure apparatus by one Embodiment of this invention.

2 is a top view illustrating the configuration of the wafer stage WST.

3 is a top view of the stage unit WST1 formed in the wafer stage WST.

4 is a cross-sectional view taken along the line A-A in FIG.

5 is an enlarged view of the core member 22.

FIG. 6 is a cross-sectional view taken along line B-B in FIG. 4.

7 is a cross-sectional view taken along the line C-C in FIG.

8 is a flowchart showing a part of a manufacturing step of manufacturing a liquid crystal display element as a micro device.

9 is a flowchart showing a part of a manufacturing process for manufacturing a semiconductor element as a micro device.

FIG. 10 is a diagram illustrating an example of a detailed flow of step S13 of FIG. 9.

To practice the invention  Best form for

EMBODIMENT OF THE INVENTION Hereinafter, with reference to drawings, the planar motor apparatus, stage apparatus, and exposure apparatus by one Embodiment of this invention are demonstrated in detail. 1 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. The exposure apparatus 10 shown in FIG. 1 is an exposure apparatus for manufacturing a semiconductor element, and moves the pattern formed in the reticle R on the sequential wafer W while synchronously moving the reticle R and the wafer W. FIG. It is a reduction projection type exposure apparatus of a transfer step and scan system.

In addition, in the following description, if necessary, an XYZ rectangular coordinate system is set in the figure, and the positional relationship of each member is demonstrated, referring this XYZ rectangular coordinate system. This XYZ rectangular coordinate system is set so that the X-axis and Z-axis become parallel to the ground, and the Y-axis is set in the direction perpendicular to the ground. In the figure, the XYZ coordinate system is actually set to a plane in which the XY plane is parallel to the horizontal plane, and the Z axis is set in the vertically upward direction. In addition, the synchronous movement direction (scanning direction) of the wafer W and the reticle R at the time of exposure shall be set to the Y direction.

As shown in FIG. 1, the exposure apparatus 10 includes an illumination optical system ILS, a reticle stage RST holding a reticle R as a mask, a projection optical system PL, and a wafer W as a substrate. It comprises a wafer stage WST as a stage apparatus which has stage units WST1 and WST2 which move a to two-dimensional directions of an X direction and a Y direction in an XY plane, and the main control unit MCS which controls them. . In addition, although illustration is abbreviate | omitted in FIG. 1, in addition to stage unit WST1, WST2 in wafer stage WST, the stage unit WST3 provided with the various measuring apparatuses which measure the performance of the exposure apparatus 10 ( 2) is also provided. This stage unit WST3 is mentioned later.

The illumination optical system ILS performs uniformity of shaping and illuminance distribution of the exposure light emitted from a light source unit (for example, a laser light source such as an ultra-high-pressure halogen lamp or an excimer laser) not shown in the drawing, and thus the image on the reticle R Irradiation with uniform illuminance to the rectangular (or arc-shaped) illumination region IAR. The reticle stage RST is a configuration in which the stage movable portion 11 is formed on a reticle base (not shown), and during exposure, the stage movable portion 11 moves on the reticle base along a predetermined scanning direction at a predetermined scanning speed. do.

Moreover, the reticle R is hold | maintained by the vacuum suction, for example on the upper surface of the stage movable part 11. An exposure light passage hole (not shown) is formed below the reticle R of the stage movable part 11. The reflecting mirror 12 is arrange | positioned at the end of this stage movable part 11, and the position of the stage movable part 11 is detected by the laser interferometer 13 measuring the position of this reflecting mirror 12. As shown in FIG. The detection result of the laser interferometer 13 is output to the stage control system SCS. The stage control system SCS drives the stage movable part 11 based on the detection result of the laser interferometer 13 and the control signal from the main control apparatus MCS based on the movement position of the stage movable part 11. In addition, although illustration is abbreviate | omitted in FIG. 1, the mark (reticle mark) formed in the reticle R and the reference mark formed in the reference member which determines the reference position of the wafer stage WST are simultaneously located above the reticle stage RST. A reticle alignment sensor is installed to observe and measure their relative positional relationship.

The projection optical system PL is, for example, a reduction optical system whose reduction magnification is α (α is 4 or 5, for example), is disposed below the reticle stage RST, and the direction of the optical axis AX is Z. It is set in the axial direction. Here, a refractive optical system composed of a plurality of lens elements arranged at predetermined intervals along the optical axis (AX) direction so as to have a telecentric optical arrangement is used. In addition, an appropriate lens element is selected according to the wavelength of light emitted from the light source unit. When the illumination region IAR of the reticle R is illuminated by the illumination optical system ILS, a reduced image (partially inverted image) of the pattern in the illumination region IAR of the reticle R is obtained from the wafer ( It is formed in the conjugated exposure area IA in the illumination area IAR on W).

2 is a top view illustrating the configuration of the wafer stage WST. As shown in FIG. 1, FIG. 2, the wafer stage WST is supported by the air slider mentioned later through the clearance of about several micrometers above the base member 14 and the upper surface of this base member 14. The stage unit WST1-WST3 and the drive device 15 which drive each of these stage units WST1-WST3 in a two-dimensional direction in XY plane are comprised. The stage units WST1 and WST2 are provided for holding and conveying the wafer W, and the stage unit WST3 is provided for conveying various measuring instruments for measuring the performance of the exposure apparatus 10. Moreover, various measuring instruments are attached to the stage unit WST3. By individually driving the drive devices 15 provided in each of the stage units WST1 to WST3, each of the stage units WST1 to WST3 can be individually moved in any direction within the XY plane.

In the example shown in FIG. 2, the position where the stage unit WST2 is disposed is a loading position of the wafer W, and when the unloaded wafer W is unloaded, and the unexposed wafer W is When loading, either one of the stage units WST1 and WST2 is arrange | positioned at this position. In addition, in the example shown in FIG. 2, the position where the stage unit WST1 is arrange | positioned is an exposure position, and either one of the stage units WST1 and WST2 which hold | maintain the wafer W which performs an exposure process at the time of exposure. Is placed in this position. As described above, the stage units WST1 and WST2 can be individually moved in any direction in the XY plane, so that the loading position and the exposure position can be changed alternately. Moreover, you may comprise so that the focusing information of a wafer may be detected in a loading position.

Various measuring apparatuses installed in the stage unit WST3 are, for example, an illuminance nonuniformity measuring an illuminance unevenness of the illuminance sensor for measuring the illuminance of the exposure light irradiated onto the wafer stage WST through the projection optical system PL and the exposure light. A spatial image measuring device for measuring a spatial image of an optical image projected onto the wafer stage WST through a sensor, a projection optical system PL, an aberration measuring device for measuring aberrations of the projection optical system PL, and a wafer stage WST An apparatus for measuring the polarization state of the exposure light irradiated on the). Moreover, the reference member in which the reference mark which defines the reference position, reference plane, etc. of the wafer stage WST is formed in the wafer stage WST3. As described above, since the stage unit WST3 can move in any direction in the XY plane separately from the stage units WST1 and WST2, for example, before the exposure process of the wafer W is started. The illuminance or illuminance unevenness of the exposure light irradiated onto the wafer stage WST can be measured by moving below the projection optical system PL (-Z direction).

Here, the drive device 15 includes a fixed portion 16 (embedded) formed in the upper portion of the base member 14 and a moving portion fixed to the bottom (base opposing surface side) of the stage units WST1 to WST3. 17) is provided with a planar motor configured to include. Moreover, the plane motor apparatus is comprised by the moving part 17, the base member 14, and the drive apparatus 15. As shown in FIG. In addition, in the following description, the said drive apparatus 15 shall be called the plane motor 15 for convenience.

The wafer W is fixed on the stage units WST1 and WST2 by vacuum suction, for example. Also, at one end on the stage units WST1 to WST3, a moving mirror 19 that reflects the laser beam from the laser interferometer 18 is fixed, and the stage units WST1 to WST1 are fixed by the laser interferometer 18 disposed outside. The position in the XY plane of WST3) is always detected by the resolution of about 0.5-1 nm, for example.

In addition, although the illustration is simplified in FIG. 1, on the stage units WST1-WST3, the movement which has a reflection surface orthogonal to the Y-axis direction which is a scanning direction, and the movement which has a reflection surface orthogonal to the X-axis direction which is a non-scanning direction is shown. A mirror is provided, and the laser interferometer 18 is provided in one axis in the scanning direction and two axes in the non-scanning direction. However, in Fig. 1, they are representatively shown as a moving mirror 19 and a laser interferometer 18. In addition, although FIG. 1 shows the state in which the laser beam from the laser interferometer 18 is irradiated to the moving mirror 19 provided in the stage unit WST1, the same laser interferometer also applies to stages WST2 and WST3. It is installed.

The positional information (or speed information) of the stage units WST1 to WST3 is sent to the stage control system SCS and the main controller MCS through it. In the stage control system SCS, on the basis of the positional information (or speed information) of each of the stage units WST1 to WST3 in accordance with an instruction from the main control device MCS, the stage units WST1 to WST3 are provided. Control the movement in the XY plane of each.

Here, the configuration of the wafer stage WST will be described in detail. FIG. 3 is a top view of the stage unit WST1 installed in the wafer stage WST, and FIG. 4 is a cross-sectional perspective view along the line A-A in FIG. 3. In addition, in FIG. 3, FIG. 4, the same code | symbol is attached | subjected about the member same as the member shown in FIG. In addition, since the stage unit WST1 and the stage unit WST2 have the same structure, it demonstrates here as the representative of the stage unit WST1.

As shown in FIG. 3, FIG. 4, the 1st stage 25 which comprises a part of stage unit WST1 is on the fixing part 16 formed in the upper part of the base member 14, The fixing part 16 And are floated at a predetermined interval (a few m). The fixed part 16 which forms a part of wafer stage WST is equipped with the core member 22 wound around the coil 21, and arrange | positioned by predetermined pitch in XY plane. This core member 22 is formed of magnetic bodies, such as low carbon steel and stainless steel, which correspond to SS400, for example, and consists of the head part 22a and the support part 22b. The cross-sectional shape in the XY plane of the head part 22a is rectangular shape, and the cross-sectional shape in the XY plane of the support part 22b is circular shape. The head part 22a and the support part 22b are integrated, and the coil 21 is wound around the support part 22b. In addition, the shape (the said XY cross section etc.) of the core member 22 is not specifically limited. Moreover, the head part 22a and the support part 22b may be integrally formed, and may be bonded after separately manufacturing.

5 is an enlarged view of the core member 22. As shown in FIG. 5, the coil 21 is wound around the support part 22b of the core member 22 via the heat insulating material Ti. This is because the positioning error of the stage units WST1 to WST3 generated when heat generated when the current flows through the coil 21 is transmitted to the core member 22 is prevented. That is, when heat from the coil 21 is transmitted to the core member 22, the core member 22 expands and a position shift in the XY plane of the core member 22 occurs, or it expands later in the Z direction. This is because unevenness of the guide surface 24 to be produced occurs, thereby causing positioning errors of the stage units WST1 to WST3. Moreover, as heat insulation material (Ti), resin excellent in heat insulation and heat resistance can be used. In addition, in this embodiment, although heat insulation process is performed between both by providing the heat insulating material Ti between the core member 22 and the coil 21, this invention is not limited to this. For example, while maintaining the magnetic connection of the core member 22 and the coil 21, you may support each of these in the state which is non-contact. In that case, the heat of the coil 21 may be less likely to be transmitted to the core member 22 by flowing the temperature-controlled air or the refrigerant described later between the core member 22 and the coil 21. Moreover, you may arrange | position by using a heat sink etc.

The core member 22 is arrange | positioned on the base member 14 so that the front-end | tip part of the head part 22a may be contained in substantially one surface. At this time, the support member 22b is magnetically connected to the base member 14 in the core member 22. A separator 23 made of a nonmagnetic material is provided between the head portions 22a of the core member 22. The separator 23 is formed of, for example, SUS or ceramic, and is intended to prevent a magnetic circuit from being formed between adjacent core members 22. Moreover, in order to prevent the position shift of the head part 22a of the core member 22, it is provided. The separator 23 can be comprised, for example with one sheet-like member in which the some opening in which each head part 22a in the some core member 22 is inserted is formed. However, it is not limited to this, You may divide and install into a some member.

Since the height position of the upper part of the separator 23 is set to be the same as the height position of the tip part of the head part 22a of the core member 22, the upper surface (moving surface) of the fixing part 16 is a substantially flat surface. Becomes Moreover, the separator 23 is provided between the head part 22a of the core member 22, and is moved up and down by the base member 14 and the head part 22a and the separator 23 of the core member 22. As shown in FIG. The space between them is formed. By introducing a refrigerant into this space, the coil 21 can be cooled. Here, the refrigerant may be water (pure) or an organic solvent such as alcohol, ether, HFE (hydrofluoroether) or fluorine inert, as a liquid having good electrical insulation. The coolant is supplied to the space by being adjusted to maintain a predetermined temperature by a circulator not shown. In this embodiment, the head part 22a and the separator 23 of the core member 22 comprise the wall surface which forms a part of the flow path of the said refrigerant | coolant. In addition, in flowing a refrigerant | coolant, appropriate waterproofing etc. are given to the head part 22a, the separator 23, etc. of these core members 22, and the like.

The guide member 24 is formed in the upper surface of the fixing part 16. The guide member 24 serves as a guide plate for moving the stage units WST1 to WST3 in the XY plane, and is formed of a nonmagnetic material. In addition, since the thickness of the guide member 24 is as thin as several hundred micrometers, when a nonmagnetic material is not available, you may use a magnetic body. The guide member 24 is formed by spraying alumina (Al ₂ O ₃ ) on the upper surface of the fixing portion 16 which is a flat surface, for example, and spraying the surface of the metal with a high pressure gas. Moreover, the guide member 24 may be formed with other ceramics, and SUS etc. may be used.

Three-phase alternating current consisting of a U phase, a V phase, and a W phase is supplied to the coil 21 provided in the fixed portion 16. By applying the current of each phase to each of the coils 21 arranged in the XY plane at a predetermined timing in a predetermined order, the stage units WST1 to WST3 can be moved at a desired speed in a desired direction. FIG. 6 is a cross-sectional perspective view along the line B-B in FIG. 4. As shown in FIG. 6, the head part 22a of the core member 22 whose cross-sectional shape is rectangular shape is arrange | positioned in matrix form in XY plane, and the separator 23 is provided between the head parts 22a. have.

상,

상, 및

상의 각 상을 포함한다.) 의 각 상이 XY 면내에서 규칙적으로 배열되어 있는 것을 알 수 있다. Here, attention is paid to one of the core members 22, between the head portion 22a of the core member 22, which is noted, and the head portions of the core members 22 neighboring each other with respect to the X direction (first direction). The separator 23 is provided in the separator 23, and the separator 23 is provided between the head part 22a of the core member 22 which is paying attention, and the head part of the core member 22 which adjoins each other with respect to a Y direction (2nd direction). ) Is installed. In FIG. 6, each phase of three-phase alternating current applied to the coil 21 wound by each core member 22 is shown corresponding to the head part 22a of the core member 22. In FIG. Referring to FIG. 6, the U phase, V phase, and W phase (

Prize,

Phase, and

It can be seen that each phase of is included in the XY plane regularly.

Next, the moving part 17 which forms a part of wafer stage WST is the 1st stage 25, the permanent magnet 26, the air pad 27, the 2nd stage 28, and the horizontal drive mechanism 29 ), And a vertical drive mechanism 30. On the bottom of the first stage 25, the permanent magnet 26 and the air pad 27 are regularly arranged. As the permanent magnet 27, it is possible to use rare earth magnets such as neodymium iron cobalt magnet, aluminum nickel cobalt (alnico) magnet, ferrite magnet, samarium cobalt magnet, or neodymium iron boron magnet. Do.

FIG. 7 is a cross-sectional perspective view along the line C-C in FIG. 4. FIG. As shown in FIG. 7, the permanent magnets 26 are arranged at predetermined intervals in the XY plane so that adjacent ones are poles different from each other. By this arrangement, alternating magnetic fields are formed in both directions in the X direction and the Y direction. In addition, an air pad 27 is provided between the permanent magnets 26. The air pad 27 sprays the air (air) toward the guide member 24, thereby allowing the moving part 17 to float against the fixed part 16 through a clearance of, for example, several microns. It functions as a part of the air bearing. Moreover, you may use the pressurization type bearing which gives pressurization by vacuum etc.

The second stage 28 is supported on the first stage 25 by the vertical drive mechanism 30. Here, the vertical drive mechanism 30 is provided with the support mechanisms 30a, 30b, 30c (refer FIG. 3) containing a voice coil motor (VCM) etc., for example, and these support mechanisms 30a, 30b. , 30c) supports three different points of the second stage 28. The support mechanisms 30a, 30b and 30c are freely stretched in the Z direction, and the second stage 28 can be moved in the Z direction by driving these support mechanisms 30a, 30b and 30c in the same amount of expansion and contraction. By driving the support mechanisms 30a, 30b, and 30c independently or with different amounts of expansion and contraction, the rotation about the X axis and the rotation about the Y axis of the second stage 28 can be controlled.

The horizontal drive mechanism 29 is provided with drive mechanisms 29a, 29b, 29c (see FIG. 3) including, for example, a voice coil motor (VCM) and the like, and to these drive mechanisms 29a, 29b, 29c. This controls the position in the XY plane of the second stage 28 and the rotation around the Z axis. Specifically, the position in the Y direction of the second stage 28 can be changed by driving the drive mechanisms 29a and 29b at the same amount of expansion and contraction, and the X of the second stage 28 is driven by driving the drive mechanism 29c. The position in the direction can be varied, and the rotation around the Z axis of the second stage 28 can be varied by driving the drive mechanisms 29a and 29b at different amounts of expansion and contraction. That is, it can be said that the 1st stage 25 driven by the planar motor 17 mentioned above is a coarse motion stage, and the 2nd stage 28 driven by the horizontal drive mechanism 29 is a fine movement stage. In addition, the horizontal drive mechanism 29 and the vertical drive mechanism 30 adjust the position in the XY plane of the second stage 28 and the position in the Z direction under the control of the stage control system SCS.

When moving the stage unit WST1 of the structure demonstrated above, the drive method similar to the well-known linear motor driven by three-phase alternating current can be used. That is, it can be considered that the stage unit WST1 is composed of a linear motor configured to be movable in the X direction and a linear motor configured to be movable in the Y direction. When the stage unit WST1 is moved in the X direction, the X direction is In the case of applying the same three-phase alternating current as that of the linear motor configured to be movable in the X direction with respect to each of the coils 21 arranged in the X direction, and moving the stage unit WST1 in the Y direction, each coil ( 21, the same three-phase alternating current as that of the linear motor configured to be movable in the Y direction may be applied. For example, when the alternating current of each phase is applied to the corresponding coil 21, respectively, the core member 22 wound by the coil 21 functions as an electromagnet. A suction force and a repulsion force act between the magnetic force (magnetic flux) generated from this electromagnet and the permanent magnet 26 disposed in the stage unit WST (moving part 17). This action occurs between each core member 22 and the permanent magnet 26, and by controlling the alternating current of the three phases, the stage unit WST can be moved toward a desired position.

In the wafer stage WST having the above configuration, the core member 22 is arranged in the XY plane so that the front end portion of the head portion 22a is included in one surface in the fixing portion 16, and the periphery of the core member 22 is maintained. Since the coil 21 is wound around, the magnetic flux generated by flowing a current through the coil 21 can be effectively guided to the bottom face of the stage unit WST1 with a small loss. For this reason, the permanent magnet 26 of the bottom face of the 1st stage 25 with which the stage unit WST1 is equipped can be made thin, and the stage unit WST1 can be reduced in weight. Here, even if the magnetic flux generated from the permanent magnet 26 is weakened by thinning the permanent magnet 26, the magnetic flux generated from the coil 21 by the core member 22 is reduced to the bottom surface of the stage unit WST1. Since it can be induced, it does not cause the thrust to fall.

In the present embodiment, since the stage unit WST1 is reduced in weight without causing a decrease in thrust, the stage unit WST1 can be accelerated with high acceleration, and the positioning accuracy can be improved. Here, the heat generated by flowing a current through the coil 21 is introduced into the space in which the base member 14 and the head part 22a and the separator 23 of the core member 22 are pinched. It can be removed by the refrigerant. Moreover, since the coil 21 is wound by the support part 22b of the core member 22 via the heat insulating material Ti, heat from the coil 21 is transmitted to the core member 22, and the core member 22 is carried out. The deterioration of the positioning accuracy caused by the expansion or deformation of the can be prevented. As mentioned above, in this embodiment, the stage unit WST1 can be driven efficiently. In addition, the above effects are similarly obtained with respect to the stage units WST2 and WST3.

Returning to FIG. 1, the exposure apparatus 10 of this embodiment is equipped with the air pump 40 for supplying pressurized air with respect to the air pad 27 shown in FIG. The air pump 40 and the stage units WST1 and WST2 are connected via the tubes 41 and 42, respectively, and the air from the air pump 40 is supplied to the stage unit WST1 via the tube 41. In addition, it is supplied to the stage unit WST2 via the tube 42. Moreover, this cooling apparatus 43 in which the cooling apparatus 43 for cooling the coil 21 shown in FIG. 4 is provided is connected to the base member 14 by the refrigerant supply pipe 44 and the refrigerant discharge pipe 45. Connected. The coolant from the cooling device 43 is supplied to the base member 14 (the part where the coil 21 in the fixing part 16 is installed) through the coolant supply pipe 44, and through the base member 14. The coolant is recovered to the cooling device 43 through the coolant discharge pipe 45. For example, in FIG. 4, water and the like are placed in a space where the coil 21, the core member 22, and the separator 23 are disposed therebetween with the upper and lower sides between the guide member 24 and the base 14. It can be configured to supply a refrigerant of.

In addition, although illustration is abbreviate | omitted in FIG. 1, in the exposure apparatus 10, the off-axis type wafer alignment sensor for measuring the positional information of the alignment mark formed in the wafer W is located in the side of the projection optical system PL. An alignment sensor of the TTL (through-the-lens) type which is provided or measures the positional information of the alignment mark formed in the wafer W via the projection optical system PL is provided. In addition, the slit detection light is irradiated to the wafer W from the inclined direction, the reflected light is measured, and the position and attitude (rotation around the X and Y axes) of the Z direction of the wafer W are detected. On the basis of the detection result, an autofocus mechanism and an autoleveling mechanism are provided which correct the position and attitude of the wafer W in the Z direction so as to align the surface of the wafer W with the image plane of the projection optical system PL.

As mentioned above, although the structure of the planar motor apparatus, stage apparatus, and exposure apparatus by one Embodiment of this invention was demonstrated, operation | movement at the time of exposure is demonstrated easily. When performing exposure processing with respect to the wafer W for one lot, exposure processing is started after performance measurement of the exposure apparatus using the various measuring apparatuses provided in the stage unit WST3 was performed, for example. When the performance measurement of the exposure apparatus is started, the main controller MCS, for example, retracts the stage units WST1 and WST2 together from the exposure position, and instead places the stage unit WST3 in the exposure position. In addition, a reticle loader (not shown) is controlled to load a reticle (test reticle) on which the pattern is not formed on the reticle stage RST.

In this state, the main control device MCS sets the optical characteristics of the illumination optical system ILS (the numerical aperture of the opening tightening, the illumination conditions, and the like), emits the exposure light from the light source unit not shown, and the reticle R and Measurement of illuminance and illuminance unevenness of the exposure light irradiated onto the stage unit WST3 via the projection optical system PL in order is measured using an illuminance sensor and an illuminance nonuniformity sensor, respectively. In addition, the residual aberration of the projection optical system PL is measured using an aberration measuring apparatus. When these measurements are complete | finished, main control apparatus MCS adjusts the optical characteristic of illumination optical system ILS using the obtained measurement result, and also one or more of the lens elements provided in projection optical system PL. The imaging performance of the projection optical system PL is adjusted by moving in the optical axis AX direction or eccentric with respect to the optical axis AX.

When the above process is complete | finished, baseline measurement is implemented, for example. Here, a base line means the distance of the center position of the projection image by the projection optical system PL of the pattern formed in the reticle R, and the measurement visual field center distance of the wafer alignment sensor provided in the side of the projection optical system PL, for example. Say. To perform the baseline measurement, first, the main controller MCS controls a reticle loader (not shown) to unload the reticle held on the reticle stage RST, and to use the reticle R for the first time in the exposure process. Is loaded onto the reticle stage (RST).

Next, the reticle mark formed in the reticle R and the reference mark of the reference member formed in the stage unit WST3 arranged in the exposure position are simultaneously observed using a reticle alignment sensor (not shown). The amount of misalignment of the reticle mark with respect to is measured. Next, the main control device MCS moves the stage unit WST3 by a predetermined amount and arranges it below the wafer alignment sensor, and arranges the reference mark formed on the reference member within the measurement field of the wafer alignment sensor. The positional information of the reference mark is measured using the wafer alignment sensor. The base line amount is required from the measurement result of the reticle alignment sensor and the measurement result of the wafer alignment sensor.

When the various measurement mentioned above is complete | finished, main control apparatus MCS evacuates stage unit WST3 from an exposure position, and arranges stage unit WST1 in a loading position, for example. And the stage unit WST1 in which the wafer W of the lot head was hold | maintained is arrange | positioned under the wafer alignment sensor, and position measurement is performed about the number (about 3-9 pieces) of the alignment mark on the wafer W. . Based on this measurement result, the main control device MCS performs an EGA (enhanced global alignment) operation to determine the regularity of the arrangement of all the shot regions set on the wafer W. Here, the EGA calculation is based on the positional information of the mark (alignment mark) formed along with each of the representative portions (3 to 9) of the short regions set in advance on the wafer W, and the design information based on the design information. W) refers to a calculation method that determines the regularity of the arrangement of all the shot regions set on the statistical method.

When the arrangement of the shot regions on the wafer W is obtained by the above EGA calculation, the main controller MCS obtains the coordinate values obtained by correcting the coordinate values of the obtained shot regions by the above-described baseline amount. When the stage unit WST1 is driven using this corrected coordinate value, each shot region on the wafer W can be aligned with the exposure region IA of the projection optical system PL. Since the exposure apparatus 10 of this embodiment is an exposure apparatus of a step-and-scan system, when exposing a shot area, the reticle stage RST and the stage unit WST1 are accelerated and each predetermined After synchronizing at the speed, the main controller MCS emits exposure light from the illumination optical system ILS to illuminate the reticle R, and the image of the pattern of the reticle R is transferred through the projection optical system PL. Project onto (W).

At the time of scanning, a part of the pattern image of the reticle R is projected on the exposure area IA, and the reticle R moves at a speed V in the -X direction (or + X direction) with respect to the projection optical system PL. In synchronization with this, the wafer W moves at a speed β · V (β is a projection magnification) in the + X direction (or -X direction). When the exposure process to the 1 shot area is completed, the main control device MCS moves the stage unit WST1 to move the next shot area to the scan start position, in a step-and-scan manner as follows. Exposure processing to each shot region is performed in turn.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, A change can be made freely within the scope of the present invention. For example, in the said embodiment, although the case where this invention was applied to the exposure apparatus of a step-and-scan system was demonstrated as an example, the exposure apparatus of the step and repeat system which transfers the pattern of a reticle collectively (so-called , Stepper) can also be applied to the present invention.

Moreover, in the said embodiment, the so-called moving magnet type wafer stage WST by which the permanent magnet 26 was provided in the moving part 17 of the stage unit WST1, and the coil 21 was provided in the fixing part 16 was carried out. It was described by way of example. However, the present invention can also be applied to a wafer stage of a so-called moving coil type in which a coil is provided in the moving part of the stage unit and a permanent magnet is provided in the fixed part. In addition, in the above embodiment, the case where the present invention is applied to the wafer stage WST has been described, but the present invention can also be applied to the reticle stage RST and further applied to both stages of the reticle stage RST and the wafer stage WST. It is also possible.

Moreover, as a light source unit provided in an exposure apparatus, it is not limited to excimer lasers, such as KrF excimer laser (248 nm) and ArF excimer laser (193 nm), and g line | wire (436 nm) emitted from an ultrahigh pressure mercury lamp, and i Line (365 nm), laser light emitted from F ₂ laser (157 nm), laser light emitted from Kr ₂ laser (146 nm), laser light emitted from Ar ₂ laser (126 nm), and furthermore, X-ray or electron beam Charged particle beams, such as these, can be used.

Moreover, the exposure apparatus of this invention is used for manufacture of a semiconductor element, The exposure apparatus which transfers a device pattern onto a semiconductor substrate, The exposure apparatus used for manufacture of a liquid crystal display element, The transfer apparatus which transfers a circuit pattern onto a glass plate, Thin film magnetic The present invention can also be applied to an exposure apparatus used for manufacturing a head and transferring a device pattern onto a ceramic wafer, and an exposure apparatus used for manufacturing an imaging device such as a CCD.

Next, the manufacturing method of the liquid crystal display element using the exposure apparatus which concerns on one Embodiment of this invention is demonstrated. 8 is a flowchart showing a part of a manufacturing step of manufacturing a liquid crystal display element as a micro device. In the pattern formation process S1 in FIG. 8, what is called a photolithography process which transfer-exposes the pattern of a mask on the wafer W using the exposure apparatus of this embodiment is performed. By this photolithography step, a predetermined pattern including a plurality of electrodes and the like is formed on the wafer W. As shown in FIG. Thereafter, the exposed wafer W is subjected to each step such as a developing step, an etching step, a peeling step, and the like, and a predetermined pattern is formed on the wafer W, and the next color filter forming step S2 is performed. To fulfill.

In the color filter forming step (S2), three dot sets corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or three stripe filter sets of R, G, and B are arranged. To form a color filter arranged in a plural horizontal scanning line directions.

And after the color filter formation process S2, the cell granulation process S3 is performed. In this cell assembly step (S3), the liquid crystal panel (liquid crystal cell) is assembled using the wafer W having the predetermined pattern obtained in the pattern forming step (S1), the color filter obtained in the color filter forming step (S2), and the like. do.

In the cell granulation step (S3), for example, a liquid crystal is injected between the wafer W having the predetermined pattern obtained in the pattern forming step (S1) and the color filter obtained in the color filter forming step (S2) to form a liquid crystal panel ( Liquid crystal cell). Then, in the module assembly process S4, each component, such as an electric circuit and a backlight which perform the display operation of the assembled liquid crystal panel (liquid crystal cell), is attached and completed as a liquid crystal display element. According to the manufacturing method of the liquid crystal display element mentioned above, the liquid crystal display element which has a very fine pattern can be obtained with good throughput.

Next, the exposure apparatus which concerns on embodiment of this invention is applied to the exposure apparatus which manufactures a semiconductor element, and the method of manufacturing a semiconductor element using this exposure apparatus is demonstrated. 9 is a flowchart showing a part of the manufacturing process for manufacturing a semiconductor element as a micro device. As shown in FIG. 9, first, in step S10 (design stage), the function and performance design of a semiconductor element are implemented, and pattern design for realizing the function is implemented. Subsequently, in step S11 (mask preparation step), a mask (reticle) having a designed pattern is produced. In step S12 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.

Next, in step S13 (wafer processing step), an actual circuit or the like is formed on the wafer by lithography or the like as described later using the mask and the wafer prepared in steps S10 to S12. Next, in step S14 (device assembly step), device assembly is performed using the wafer processed in step S13. This step S14 includes processes such as a dicing step, a bonding step, and a packaging step (chip encapsulation) as necessary. Finally, in step S15 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S14 are performed. After this process, the micro device is completed and shipped.

FIG. 10 is a diagram illustrating an example of a detailed flow of step S13 of FIG. 9. In Fig. 10, the surface of the wafer is oxidized in step S21 (oxidation step). In step S22 (CVD step), an insulating film is formed on the wafer surface. In step S23 (electrode formation step), an electrode is formed on the wafer by vapor deposition. In step S24 (ion implantation step), ions are implanted into the wafer. Each of the above steps S21 to S24 constitutes a pretreatment step of each step of wafer processing, and is selected and executed according to the necessary processing in each step.

In each step of the wafer process, when the above-described pretreatment step is completed, the post-treatment step is executed as follows. In this post-treatment step, first, a photosensitive agent is applied to the wafer in step S25 (resist formation step). Subsequently, in step S26 (exposure step), the pattern of the mask is transferred to the wafer in accordance with the lithography system (exposure apparatus) and the exposure method described above. Next, in step S27 (development process), the exposed wafer is developed, and in step S28 (etching step), the exposed members of portions other than the portion where the resist remains are removed by etching. And in step S29 (resist removal step), the resist which was etched and unnecessary is removed. By repeating these pretreatment steps and post-treatment steps, a pattern is formed on the wafer multiplely.

Using the microdevice manufacturing method of this embodiment demonstrated above, the stage and plate (wafer) which hold a reticle (mask) using said exposure apparatus in a pattern formation process (step S1) or an exposure process (step S26). The stage to keep is scanned. For this reason, the movement time of a reticle (mask) and a plate (wafer) can be shortened, and the overlapping precision can be improved, and a fine device can be produced efficiently and efficiently.

Moreover, in order to manufacture the reticle or mask used not only in microdevices, such as a liquid crystal display element or a semiconductor element, but a photoexposure apparatus, EUV exposure apparatus, an X-ray exposure apparatus, an electron beam exposure apparatus, etc., from a mother reticle, a glass substrate and silicon The present invention can also be applied to an exposure apparatus that transfers a pattern onto a wafer or the like. Here, in an exposure apparatus using DUV (deep ultraviolet), VUV (vacuum ultraviolet) light, or the like, a transmission type reticle is generally used, and as a reticle substrate, quartz glass, fluorine-doped quartz glass, fluorite, magnesium fluoride, or quartz is used. Etc. are used. Moreover, in a proximity X-ray exposure apparatus, an electron beam exposure apparatus, etc., a transmissive mask (stencil mask, membrane mask) is used, and a silicon wafer etc. are used as a mask substrate. Moreover, such exposure apparatus is each pamphlet of international publication 99/34255, international publication 99/50712, and international publication 99/66370, and Unexamined-Japanese-Patent No. 11-194479, Unexamined-Japanese-Patent No. 11-194479. Each publication of Unexamined-Japanese-Patent No. 2000-12453 and Unexamined-Japanese-Patent No. 2000-29202 is disclosed. As long as it is permitted by the national legislation of the designated country (or selected selected country) specified in this international application, the disclosure in the pamphlet and the publication is incorporated herein by reference.

In addition, in this embodiment, although the exposure apparatus which has several stage was demonstrated to the example, the exposure apparatus provided with only one stage may be sufficient.

As an exposure apparatus which has a some stage like this embodiment, Unexamined-Japanese-Patent No. 10-163099, Unexamined-Japanese-Patent No. 10-214783, US Patent No. 6,400,441 corresponding to these, and Japan Publication No. 2000-505958 and its corresponding US Pat. No. 5,969,441 and US Pat. No. 6,262,796. As long as permitted by the national legislation of the designated country (or selected selected country) specified in this international application, the disclosure in the above publication or US patent is incorporated herein by reference.

In addition, in this embodiment, although the exposure apparatus provided with the exposure stage which hold | maintains and moves a to-be-processed substrate, such as a wafer, and the measurement stage provided with various measurement members and a sensor, such an exposure apparatus is an example, for example. And Japanese Unexamined Patent Application Publication No. 11-135400. As long as the national legislation of the designated country (or selected selected country) specified in this international application is permitted, the disclosure in the above publication is incorporated herein by reference as a part of the description.

In the embodiment described above, a light transmissive mask having a predetermined light shielding pattern (or a phase pattern and a photosensitive pattern) formed on a light transmissive substrate, or a predetermined reflective pattern light reflecting mask on a light reflective substrate is used. However, it is not limited to these. For example, instead of such a mask, you may use the electronic mask (referred to as a kind of optical system) which forms a transmission pattern, a reflection pattern, or a light emission pattern based on the electronic data of the pattern to expose. Such electronic masks are disclosed, for example, in US Pat. No. 6,778,257. As long as it is permitted by the national legislation of the designated country (or selected selected country) specified in this international application, the disclosure in each of the above-described US patents is incorporated herein by reference as a part of the description. In addition, the above-mentioned electronic mask is a concept including both a non-emission type image display element and a self-emission type image display element.

Moreover, it is applicable also to the exposure apparatus which exposes the interference fringe produced by the interference of several light beams to a board | substrate, for example, called two-beam interference exposure. Such exposure methods and exposure apparatuses are disclosed, for example, in International Publication No. 01/35168 pamphlet. As long as it is permitted by domestic legislation of the designated country (or selected selected country) specified in this international application, the disclosure in this pamphlet is used as part of the description of the present specification.

Moreover, this invention is applicable also to the liquid immersion exposure apparatus which performs exposure by filling between a projection optical system PL and a board | substrate (wafer W) with a liquid. As such a liquid immersion exposure apparatus, for example, a method disclosed in a pamphlet of International Publication No. 2004/053958 is known as a method of locally filling a space between a projection optical system 30 and a substrate W with a liquid. As long as it is permitted by domestic legislation of the designated country (or selected selected country) specified in this international application, the disclosure in this pamphlet is used as part of the description of the present specification.

Moreover, this invention is the liquid immersion exposure apparatus which moves the stage which hold | maintained the board | substrate (wafer; W) of exposure object in a liquid tank, and the liquid immersion which forms the liquid tank of predetermined depth on a stage, and holds the board | substrate W in it. It is applicable to an exposure apparatus. About the structure and exposure operation | movement of the liquid immersion exposure apparatus which moves the stage which hold | maintained the board | substrate to which exposure target was carried out in a liquid tank, For example, Unexamined-Japanese-Patent No. 6-124873 forms the liquid tank of predetermined depth on a stage, The liquid immersion exposure apparatus which holds a board | substrate among them is disclosed, for example in Unexamined-Japanese-Patent No. 10-303114 and US Patent 5,825,043. As long as it is permitted by the national legislation of the designated country (or selected selected country) specified in this international application, the disclosure in the above publication or US patent is incorporated herein by reference.

Moreover, it is not limited to the structure which exposes the board | substrate (wafer; W) by filling the optical path space of the exit side of the terminal optical member of the projection optical system 30 with liquid (pure), and is disclosed by the international publication 2004/019128 pamphlet. As shown, the optical path space on the incidence side of the terminal optical member of the projection optical system may also be filled with liquid (pure). As long as it is permitted by domestic legislation of the designated country (or selected selected country) specified in this international application, the disclosure in this pamphlet is used as part of the description of the present specification.

In addition, as described in JP-A-8-166475 (USP5,528,118), the reaction force generated by the movement of the wafer stage WST is not transmitted to the projection optical system PL. May be mechanically exported to the floor (ground). Moreover, as described in JP-A-8-330224 (US S / N08 / 416,558), the reaction force generated by the movement of the reticle stage RST is not transmitted to the projection optical system PL. The frame member may be used to mechanically export to the floor (ground).

Claims (17)

A flat motor device having a fixed portion forming a predetermined moving surface and a moving portion movable along the moving surface, The fixing portion includes a plurality of core members disposed along the moving surface, each comprising a magnetic body, and a coil magnetically connected to each of the core members, The said moving part is provided with the magnetic member arrange | positioned along the said moving surface in the side facing the said fixed part, The plane motor apparatus characterized by the above-mentioned. The method of claim 1, The fixing unit includes a base member that supports each of the core members and magnetically connects each of the core members. The method according to claim 1 or 2, And the fixing portion includes a separator made of a nonmagnetic material formed between the core members. The method of claim 3, wherein The plurality of core members are arranged in a matrix in a plane substantially parallel to the moving surface, Between at least one core member and core members neighboring each other in a first direction with respect to the at least one core member and substantially perpendicular to the first direction with respect to the at least one core member and the at least one core member A separator made of the nonmagnetic material is disposed between each of the core members adjacent to each other in the second direction. The method according to any one of claims 1 to 4, And the fixed portion has a plane substantially parallel to the moving surface and includes a guide member disposed between the core member and the moving portion. The method of claim 5, And the guide member comprises a ceramic. The method according to claim 5 or 6, The ceramic is a flat motor device, characterized in that formed by thermal spraying. The method according to any one of claims 1 to 7, The said core member and the said separator comprise the wall surface which forms a part of the flow path of the refrigerant | coolant which cools the said coil, The flat motor apparatus characterized by the above-mentioned. The method according to any one of claims 1 to 8, The moving unit includes a stage for mounting an object, And an adjusting mechanism for adjusting at least one of the position and the posture of the stage. The method of claim 9, And the adjustment mechanism adjusts the position of the table in at least one direction intersecting in the plane parallel to the moving surface and in the direction crossing the moving surface. The method of claim 9, The adjustment mechanism adjusts the attitude of the stage by adjusting an amount of rotation of the table around two directions intersecting in the plane parallel to the moving surface and at least one direction in a direction crossing the moving surface. Device. The method according to any one of claims 1 to 11, The moving unit includes a plurality of air blowing holes on the side facing the fixed part. The method according to any one of claims 1 to 12, The plane motor device characterized by the heat insulation process between the said core member and the said coil. The method according to any one of claims 1 to 13, And a plurality of the moving parts configured to be movable along the moving surface. A stage device having a stage on which an object is mounted, The stage apparatus provided with the planar motor apparatus in any one of Claims 1-14 as a drive means of the said stage. An exposure apparatus including a mask stage for holding a mask and a substrate stage for holding a substrate, and transferring a pattern formed on the mask onto the substrate, At least one of the said mask stage and the said substrate stage is provided, The stage apparatus of Claim 15 characterized by the above-mentioned. A device manufacturing method comprising a lithography step, wherein the exposure apparatus according to claim 16 is used in the lithography step.

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