JP2014157899A - Drive device, exposure device, and method of manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently discharge heat of an armature coil.SOLUTION: In a surface plate 21, only for a cooling tube 71b among cooling tubes 71a and 71b respectively provided at a substrate stage side (+Z side) and the other side (-Z side) of an armature coil 38 configuring a planar motor, a fin-like projection part is provided on the inner wall of the cooling tube 71b to form the inner wall having a larger contact area with cooling medium compared with the cooling tube 71a. Thereby, a main heat transfer path for heat generated by the armature coil 38 is directed toward the cooling tube 71b side to discharge most of the heat generated by the armature coil 38 by cooling medium supplied to the cooling tube 71b. The remaining heat propagated to the surface plate 21 side is discharged by the cooling medium supplied to the cooling tube 71a, and thus, the heat generated by the armature coil 38 can be prevented from being transferred to an upper part of the surface plate 21. The armature coil 38 configuring the planar motor can be cooled, and fluctuation of an atmosphere around a substrate stage WST on the surface plate 21 can be suppressed.

Description

  The present invention relates to a driving apparatus, an exposure apparatus, and a device manufacturing method, and more particularly, to a driving apparatus that drives a moving body, an exposure apparatus that includes the driving apparatus, and a device manufacturing method that uses the exposure apparatus.

  In lithography processes for manufacturing electronic devices (microdevices) such as semiconductor elements and liquid crystal display elements, a step-and-repeat reduction projection exposure apparatus (so-called stepper) and a step-and-scan reduction projection exposure are mainly used. Devices (so-called scanning steppers (also called scanners)) are used. In these exposure apparatuses, illumination light is formed on a reticle by projecting it onto a wafer (or a glass plate or the like) coated with a photosensitive agent (resist) via a reticle (or mask) and a projection optical system. The pattern (reduced image) is sequentially transferred to a plurality of shot areas on the wafer.

  A planar motor that drives a wafer stage that holds and moves the wafer in a two-dimensional direction to improve wafer positioning accuracy and throughput, for example, a variable magnetoresistive drive system that can drive the wafer stage in a non-contact manner A flat motor using a structure in which two linear pulse motors are coupled for two axes or a Lorentz electromagnetic force drive in which a linear motor is developed in a two-dimensional direction has been developed (for example, Patent Document 1).

  However, in any planar motor, heat generation of the coil unit becomes a problem by flowing a large current through the coil unit (the armature coil included therein) in order to obtain a large driving force. The heat generated by the coil unit, for example, causes fluctuations in the atmosphere around the wafer stage, causing measurement errors in the position measurement system of the wafer stage configured using an interferometer, and positioning accuracy of the wafer (wafer stage). This leads to a decrease in throughput.

US Pat. No. 5,196,745

  The present invention has been made under the circumstances described above. From a first viewpoint, the present invention is a drive device that applies a drive force between a base and a movable member that is movable relative to the base. A first member provided on one of the movable body and the base; a second member provided on the other of the movable body and the base and generating the driving force in cooperation with the first member; A temperature control device that is installed on a side of the moving body and the base where the second member is provided and adjusts the temperature of the second member using a refrigerant, and the temperature control device includes the temperature control device, A first flow path and a second flow path to which a refrigerant is supplied, wherein one of the first flow path and the second flow path is disposed closer to the first member than the other, and An inner wall having a larger contact area with the refrigerant than the first flow path is formed in the second flow path. It is a dynamic system.

  According to this, one of the first flow path and the second flow path is disposed closer to the first member than the other, and the second flow path has a larger contact area with the refrigerant than the first flow path. Since the inner wall is formed, most of the heat generated by the second member is exhausted by the refrigerant supplied to the second flow path, and the remaining heat transmitted to the first member side by the refrigerant supplied to the first flow path. By exhausting heat, heat transfer to the base of heat generated by the second member can be prevented. Thereby, while cooling the 2nd member, it becomes possible to suppress fluctuation of the atmosphere around the moving body on the base.

  According to a second aspect of the present invention, there is provided a driving device for applying a driving force between a base and a moving member movable with respect to the base, the driving device being provided on one of the moving body and the base. A second member that is provided on the other of the first member, the movable body, and the base and that generates the driving force in cooperation with the first member; and the second of the movable body and the base. A temperature control device that is installed on the side where the member is provided and adjusts the temperature of the second member using a refrigerant, wherein the temperature control device includes a first flow path to which the refrigerant is supplied, and a second temperature control device. A first flow path is disposed on one side of the second member with respect to the first member, and the second flow path is the second member with respect to the first member. Between the second member and the first flow path, and between the second member and the first flow path. The heat transfer is a second driving device being arranged heat insulating member to lower than the heat transfer between the second flow path and said second member.

  According to this, since the heat insulation member is provided between the second member and the first flow path, the heat insulation member prevents the heat generated by the second member from being transmitted to the base, The heat transmitted to the base side through the second member can be exhausted by the refrigerant supplied to the first flow path, and much of the heat generated by the second member can be exhausted by the refrigerant supplied to the second flow path. Thereby, while cooling the 2nd member, it becomes possible to suppress fluctuation of the atmosphere around the moving body on the base.

  According to a third aspect of the present invention, there is provided a driving device that applies a driving force between a base and a moving member that can move with respect to the base, and is provided on one of the moving body and the base. A second member that is provided on the other of the first member, the movable body, and the base and that generates the driving force in cooperation with the first member; and the second of the movable body and the base. And a temperature control device that adjusts the temperature of the second member using a refrigerant that is installed on the side where the member is provided, and the temperature control device forms a flow path to which the refrigerant is supplied. An extending member disposed in the tubular member and extending along at least a part of the flow path, and a first connecting member connecting the first side of the extending member and the tubular member And a second connecting member for connecting the second side of the extending member and the second member, And the thermal conductivity of the first connecting member is a third driving device is smaller than the thermal conductivity of the second connecting member.

  According to this, since the contact area with the refrigerant is increased by arranging the extending member in the tubular member of the temperature control device, the heat generated by the second member by the refrigerant supplied to the flow path can be more efficiently performed. Heat can be exhausted.

  According to a fourth aspect of the present invention, there is provided an exposure apparatus for irradiating an energy beam to form a pattern on an object, which is mounted on any one of the first to third driving apparatuses of the present invention and the movable body. And a projection optical system that irradiates an energy beam onto a placed substrate.

  According to this, since any of the first to third driving devices of the present invention is provided, fluctuations in the atmosphere around the moving body on the base can be suppressed, so that positioning accuracy of the moving body is improved and throughput is improved. It becomes possible to improve.

  According to a fifth aspect of the present invention, there is provided a device manufacturing method comprising: forming a pattern on an object using the exposure apparatus according to the present invention; and developing the object on which the pattern is formed. is there.

It is a figure which shows schematically the structure of the exposure apparatus in 1st Embodiment. It is a top view which shows a substrate stage apparatus. It is sectional drawing (the AA sectional view taken on the line in FIG. 2) which shows the structure in a surface plate. It is an enlarged view which shows the internal structure of a surface plate. It is a figure which shows the simulation result of the change of the exhaust heat degree with respect to the protrusion length and heat conductivity of a fin-shaped protrusion part. FIG. 2 is a block diagram showing a main configuration of a control system of the exposure apparatus in FIG. 1. It is sectional drawing (the AA sectional view taken on the line of FIG. 2) which shows the structure in the surface plate in the exposure apparatus of 2nd Embodiment. FIG. 8A and FIG. 8B are diagrams showing a configuration of a driving device that performs a heat conduction simulation for confirming the effectiveness of the heat insulating layer (comparison configuration and first configuration for comparison, respectively). is there. FIG. 9A and FIG. 9B are diagrams showing a configuration (second configuration and third configuration, respectively) of a driving device that performs a heat conduction simulation for confirming the effectiveness of the heat insulating layer. It is sectional drawing (the AA sectional view taken on the line of FIG. 2) which shows the structure in the surface plate in the exposure apparatus of 3rd Embodiment. It is sectional drawing which shows the deformation | transformation structure of the cooling pipe in the exposure apparatus of 3rd Embodiment.

<< First Embodiment >>
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 schematically shows the overall configuration of an exposure apparatus 100 according to the first embodiment. The exposure apparatus 100 is a so-called step-and-scan exposure type scanning exposure apparatus.

  The exposure apparatus 100 holds an illumination system 10, a reticle stage RST that holds a reticle (mask) R, a reticle stage drive system 11 (see FIG. 6) that drives the reticle stage RST, a projection optical system PL, and a wafer W as a substrate. A substrate stage apparatus 30 including a substrate stage WST to be performed, a stage drive system (planar motor) 50 (see FIG. 3 and the like) for driving the substrate stage WST, etc., and a control system for these.

  The illumination system 10 includes, for example, a light source unit, a shutter, a secondary light source forming optical system, a beam splitter, a condensing lens system, a reticle blind, and an imaging lens system as disclosed in JP-A-9-320956. Both of them are not shown) and emit illumination light for exposure with a substantially uniform illuminance distribution. With this illumination light, the rectangular (or arc-shaped) illumination area IAR on the reticle R is illuminated with uniform illuminance.

  On reticle stage RST, reticle R is fixed, for example, by vacuum suction. The reticle stage RST is designated in a predetermined scanning direction (here, Y-axis direction) by a reticle stage drive system 11 (see FIG. 6) constituted by a linear motor or the like on a reticle base (not shown). It can be driven at the scanning speed.

  A movable mirror 15 that reflects a laser beam from a reticle laser interferometer (hereinafter referred to as “reticle interferometer”) 16 is fixed on the reticle stage RST, and the position of the reticle stage RST in the stage moving surface is determined by reticle interference. The total 16 is always detected with a resolution of about 0.5 to 1 nm, for example. Position information of reticle stage RST from reticle interferometer 16 is sent to main controller 20. Main controller 20 drives reticle stage RST via reticle stage drive system 11 (see FIG. 6) based on position information of reticle stage RST.

  The projection optical system PL is arranged below the reticle stage RST, and the direction of the optical axis AX (coincidence with the optical axis IX of the illumination optical system) is the Z-axis direction. Here, the both sides are telecentric optical arrangement. A refractive optical system comprising a plurality of lens elements arranged at a predetermined interval along the optical axis AX direction is used. The projection optical system PL is a reduction optical system having a predetermined projection magnification, for example, 1/5 (or 1/4). For this reason, when the illumination area IAR of the reticle R is illuminated by the illumination light from the illumination system 10, the circuit pattern in the illumination area IAR of the reticle R is projected via the projection optical system PL by the illumination light that has passed through the reticle R. The reduced image (partially inverted image) is formed in the exposure area IA conjugate to the illumination area IAR on the wafer W whose surface is coated with the photoresist.

  As shown in FIG. 1, the substrate stage apparatus 30 includes a base plate 12, a surface plate 21 disposed on the base plate 12, and a surface plate drive system 63 that drives the surface plate 21 on the base plate 12 (see FIG. 6). ), A substrate stage WST disposed on the surface plate 21, a stage drive system (planar motor) 50 for driving the substrate stage WST on the surface plate 21, and the like. The stage drive system includes a cooling device 70 (see FIG. 3 and the like) that cools the heat generating portion (for example, the armature coil 38) of the stage drive system.

  The base board 12 is supported substantially horizontally (parallel to the XY plane) on the floor surface F via an anti-vibration mechanism (not shown). On the upper surface side of the base board 12, a coil unit (not shown) including a plurality of coils arranged in a matrix with the XY two-dimensional direction as the row direction and the column direction is accommodated.

  The surface plate 21 is supported on the base plate 12 via an air bearing (not shown). The bottom of the surface plate 21 is composed of a plurality of permanent magnets and yokes arranged in a matrix with the XY two-dimensional direction as the row direction and the column direction corresponding to the coil unit housed on the upper surface side of the base plate 12. A magnet unit (not shown) is accommodated. Further, a stator 60 described later is accommodated in the upper part of the surface plate 21.

  From the above-described coil unit (not shown) in the base board 12 and magnet unit (not shown) in the surface plate 21, for example, a Lorentz electromagnetic force drive system disclosed in US Patent Application Publication No. 2003/0085676, etc. A platen drive system 63 (see FIG. 6) composed of a flat motor is constructed. The surface plate drive system 63 drives the surface plate 21 on the base plate 12 in directions of three degrees of freedom (X, Y, θz) in the XY plane.

  The position information of the surface plate 21 in the three-degree-of-freedom direction is measured by a surface plate position measurement system 69 (see FIG. 6) composed of an interferometer or an encoder, for example. The output of the surface plate position measurement system 69 is supplied to the main controller 20 (see FIG. 6). The main control device 20 controls the magnitude and direction of the current supplied to each coil constituting the coil unit of the surface plate drive system 63 based on the output of the surface plate position measurement system 69, and the XY plane of the surface plate 21. The position in the direction of three degrees of freedom is controlled. When the surface plate 21 functions as a counter mass, the main controller 20 drives the surface plate 21 so that the amount of movement of the surface plate 21 from the reference position is within a predetermined range. That is, the surface plate drive system 63 is used as a trim motor.

  As will be described later, substrate stage WST includes mover 51, support mechanisms 32a, 32b, and 32c, substrate table 18 and the like. A planar motor including a stator 60 accommodated in the upper part of the surface plate 21 and a movable element 51 fixed to the bottom (base facing surface side) of the substrate stage WST is used as the stage drive system 50. Hereinafter, the stage drive system 50 is referred to as a planar motor 50 for convenience.

  A wafer W is fixed on the substrate table 18 by, for example, vacuum suction. A movable mirror 27 that reflects a laser beam from a wafer laser interferometer (hereinafter referred to as “wafer interferometer”) 31 is fixed on the substrate table 18, and the substrate table 18 is arranged by the wafer interferometer 31 arranged outside. Is always detected with a resolution of about 0.5 to 1 nm, for example. In practice, as shown in FIG. 3, the movable mirror 27Y having a reflecting surface orthogonal to the Y-axis direction that is the scanning direction is orthogonal to the X-axis direction that is the non-scanning direction. A moving mirror 27X having a reflecting surface is provided, and the wafer interferometer 31 is provided with one axis in the scanning direction and two axes in the non-scanning direction. In FIG. A total of 31 is shown. The position information (or speed information) of the substrate table 18 is sent to the main controller 20. Main controller 20 controls movement of substrate stage WST in the XY plane via planar motor 50 based on the position information (or speed information).

  The components of the substrate stage WST, particularly the planar motor 50, will be described in detail.

  FIG. 2 shows a plan view of the substrate stage device 30. FIG. 3 is an enlarged view of a cross-sectional view taken along line AA of FIG. As shown in FIGS. 2 and 3, the substrate table 18 includes a support mechanism 32 a including a voice coil motor and the like on the upper surface (surface opposite to the surface facing the surface plate 21) of the mover 51 constituting the planar motor 50. It is supported at three different points depending on 32b and 32c, and can be tilted and driven in the Z-axis direction with respect to the XY plane. The support mechanisms 32a to 32c are independently controlled by the main controller 20 (see FIG. 6).

  The mover 51 includes an air slider 57 that is a kind of aerostatic bearing device, a flat plate-like magnet generator 53 that is partly fitted and integrated with the air slider 57 from above, and a plate-like magnet generator 53. And a magnetic member 52 made of a magnetic material engaged from above. The flat magnet generator 53 is composed of a plurality of flat magnets arranged in a matrix so that the polarities of adjacent magnetic pole faces are different from each other, and constitutes a magnet unit together with the magnetic member 52. The substrate stage WST is levitated and supported on the upper surface of the surface plate 21 by an air slider 57 via a clearance of about 5 μm, for example (see FIGS. 1 and 3).

  As shown in FIG. 3, the surface plate 21 includes a hollow main body 35 whose upper surface is open, and a ceramic plate 36 that closes the opening of the main body 35. On the surface (upper surface) of the ceramic plate 36 facing the mover 51, a moving surface 21a of the mover 51 is formed.

  In the internal space 41 formed by the main body 35 and the ceramic plate 36, 9 × 9 = 81 armature coils 38 are arranged in a 9 × 9 matrix in the XY two-dimensional direction along the moving surface 21a. (See FIG. 2). As the armature coil 38, as shown in FIG. 2, a square coil wound around a member (heat conduction member) 39 having high thermal conductivity is used. These armature coils 38 constitute a stator 60 of the planar motor 50. In addition, the magnitude | size and direction of the electric current supplied to each armature coil 38 are controlled by the main controller 20 (refer FIG. 6).

  Next, the cooling device 70 that cools the heat generating portion of the planar motor 50 will be described in detail.

  The cooling device 70 includes cooling pipes 71 a and 71 b provided in the main body portion 35 of the surface plate 21, and a pump (not shown) that supplies a coolant such as water to them.

  The cooling pipes 71a and 71b are made of a high thermal conductive material such as SiC or alumina, and are provided on the + Z side and the −Z side of the main body 35 of the surface plate 21, respectively, as shown in FIG. Between the cooling pipes 71a and 71b, the above-described armature coil 38 is disposed via adhesion layers 72a and 72b made of a high thermal conductive resin or the like. The cooling pipes 71a and 71b are disposed in the main body 35 so as to connect, for example, the upper and lower surfaces of all armature coils 38 (heat conducting members 39). The armature coil 38 is cooled by supplying the refrigerant to each of the cooling pipes 71a and 71b in the direction of the white arrow (see FIG. 4).

  Here, by providing the close contact layers 72a and 72b, the armature coil 38 is in close contact with the cooling pipes 71a and 71b without any gap, and the heat generated by the armature coil 38 is efficiently transmitted to the cooling pipes 71a and 71b. .

FIG. 4 shows an enlarged configuration of the cooling pipes 71a and 71b that are in close contact with the armature coil 38, particularly the cooling pipe 71b. A cooling pipe 71b only, on its inner wall, the so-called fin-like projection 71b ₀ is formed with a plurality disposed in the refrigerant and projects its flow path. In this embodiment, the projecting portion 71b ₀ is assumed to be formed integrally with the same high thermal conductivity member and the cooling pipe 71b. A case, as described later, will select the protruding length h of the thermal conductivity of the protrusion 71b ₀ of the cooling tube 71b as appropriate. Further, the projecting portion 71b ₀ is may be constituted by fixing a member different from the inner wall of the cooling pipe 71b. In such a case, a member having a thermal conductivity higher than that of the cooling pipe 71b is selected.

By configuring the cooling pipes 71a and 71b using a high heat conductive member, the heat generated by the armature coil 38 can be efficiently transmitted to the refrigerant, that is, exhausted. However, there is a limit to increasing the thermal conductivity by appropriately selecting the material of the high thermal conductivity member. Therefore, as described above, the protrusion 71b ₀ is provided on the inner wall of the cooling pipe 71b to increase the contact area between the cooling pipe 71b and the refrigerant, so that the heat generated by the armature coil 38 can be efficiently exhausted. It becomes.

5 shows, the thermal conductivity simulation result of a change in Hainetsudo is shown for projecting length and the thermal conductivity of the projections 71b _0. Here, the degree of exhaust heat is the amount of exhaust heat normalized using the amount of exhaust heat when the projection length is zero (the amount of exhaust heat when the amount of exhaust heat when the projection length is zero is 1.). Waste heat of it can be seen that improves as the projection length of the projecting portion 71b ₀ is long. Here, if the thermal conductivity of the projecting portion 71b ₀ is low (e.g., about 20), discharge Netsudo in projection length several mm whereas saturated at about 2.3, when the thermal conductivity is high (for example 200 As mentioned above, even if the protrusion length is 10 mm or more, it is improved to 5 or more without being saturated. The protruding length is usually determined by the structure, size, etc. of the cooling pipe 71b. Therefore, from the results of the simulation, the projecting portion 71b ₀ shall be be configured with a member of high thermal conductivity for short protrusion length h.

As described above, by providing the protruding portion 71b ₀ only for the cooling pipe 71b, most of the heat generated by the armature coil 38 is transmitted to the refrigerant in the cooling pipe 71b, that is, the heat generated by the armature coil 38 is mainly the cooling pipe. Heat is exhausted by the refrigerant in 71b. In the cooling device 70 configured as described above, by supplying the refrigerant to the cooling pipe 71b, most of the heat generated by the armature coil 38 is exhausted, and by supplying the refrigerant to the cooling pipe 71a, the remaining heat transmitted to the surface plate 21 side. It serves to prevent heat transfer to the surface plate 21.

For the purpose of preventing heat transfer to the surface plate 21, instead of providing the cooling pipe 71a, for example, a heat insulating layer having a sufficient thickness is provided between the armature coil 38 and the ceramic plate 36, or Structures such as members constituting the cooling device 70 can also be provided. However, this impairs the exhaust heat performance of the cooling device 70, so that the purpose of cooling the armature coil 38 cannot be sufficiently achieved. In addition, the performance of the planar motor 50 that precisely drives the substrate stage WST on the surface plate 21 is impaired. On the other hand, by providing the protrusion 71b ₀ only for the cooling pipe 71b, the exhaust heat performance of the cooling device 70 is not impaired, but rather the exhaust heat performance is improved, and in addition, the main heat generated by the armature coil 38 is increased. A simple heat transfer path is directed toward the cooling pipe 71b, that is, toward the opposite side of the substrate stage WST with respect to the armature coil 38.

The shape of the protrusion 71b ₀ is not particularly limited as long as the contact area with the refrigerant is increased, for example cylindrical, prismatic, etc., it can be adopted any shape. Also, to be able to determine appropriately the projecting length of the projecting portion 71b _0, different cooling pipes 71a and size (width of the channel are different) may be used a cooling tube 71b.

  FIG. 6 shows the main configuration of the control system of the exposure apparatus 100. The control system is mainly configured of a main controller 20 including a microcomputer (or workstation) that performs overall control of the entire apparatus.

  Next, the flow of the exposure operation in the exposure apparatus 100 including the substrate stage apparatus 30 described above will be briefly described.

  First, under the control of the main controller 20, a reticle loader and a wafer loader (both not shown) perform reticle loading and wafer loading, respectively, and a reticle microscope (not shown) and a reference mark plate (on the substrate table 18) Preliminary operations such as reticle alignment and baseline measurement are performed according to a predetermined procedure using an alignment detection system (not shown).

  After that, the main controller 20 performs alignment measurement such as EGA (Enhanced Global Alignment) using an alignment detection system (not shown).

  After the alignment measurement is completed, a step-and-scan exposure operation is performed as follows. In the exposure operation, first, the substrate table 18 is moved so that the XY position of the wafer W becomes the scanning start position for the exposure of the first shot region (first shot) on the wafer W. At the same time, the reticle stage RST is moved so that the XY position of the reticle R becomes the scanning start position. Then, based on the XY position information of the reticle R measured by the reticle interferometer 16 and the XY position information of the wafer W measured by the wafer interferometer 31, the main controller 20 performs a reticle driving unit (not shown) and a planar motor. Scanning exposure is performed by moving the reticle R and the wafer W synchronously via the lens 50. The movement of the wafer W is performed by controlling at least one of the current value supplied to the armature coil 38 and the current direction by the main controller 20.

  In this way, when the transfer of the reticle pattern for one shot area is completed, the substrate table 18 is stepped by one shot area, and scanning exposure is performed for the next shot area. In this way, stepping and scanning exposure are sequentially repeated, and a pattern having the required number of shots is transferred onto the wafer W.

As described above, the cooling device 70 in the exposure apparatus 100 of the first embodiment is provided on the surface plate 21 on the substrate stage WST side and the other side of the armature coil 38 constituting the planar motor 50. cooling pipes 71a, among 71b, the cooling pipe 71b only, a large inner wall of the contact area with the refrigerant from the condenser 71a by providing the protruding portion 71b ₀ fin shape is formed on the inner wall. Thereby, the main heat transfer path of the heat generated by the armature coil 38 is directed toward the cooling pipe 71b, and most of the heat generated by the armature coil 38 is exhausted by the refrigerant supplied to the cooling pipe 71b. By exhausting the remaining heat transmitted to the surface plate 21 side by the refrigerant supplied to the heat, heat transfer from the armature coil 38 to the surface plate 21 can be prevented. Then, the armature coil 38 constituting the planar motor 50 can be cooled, and fluctuations in the atmosphere around the substrate stage WST on the surface plate 21 can be suppressed.

  Further, since the cooling device 70 is provided, fluctuations in the atmosphere around the substrate stage WST on the surface plate 21 can be suppressed, so that the positioning accuracy of the substrate stage WST can be improved and the throughput can be improved.

In addition to the provision of the projecting portion 71b ₀ only for cooling pipe 71b, the cooling pipe 71a, the temperature of the refrigerant supplied to each of the 71b, the pressure, it is also possible to adjust the flow rate or the like. For example, the temperature of the refrigerant supplied to the cooling pipe 71a may be lowered or the flow rate may be increased with respect to the refrigerant supplied to the cooling pipe 71a. In addition, since the structure can be disposed on the opposite side of the substrate stage WST with respect to the armature coil 38 due to the configuration of the planar motor 50, for example, the size of the cooling pipe 71b is increased with respect to the cooling pipe 71a. More cooling pipes 71b may be arranged. In addition to providing the protrusion 71b ₀ only for the cooling pipe 71b, a heat insulating layer 73 may be provided between the cooling pipe 71a and the armature coil 38, as in the second embodiment described later. . Thereby, the heat transfer path of the heat generated by the armature coil 38 can be directed to the opposite side of the substrate stage WST with respect to the armature coil 38.

<< Second Embodiment >>
A second embodiment of the present invention will be described with reference to FIGS. 7 to 9B.

  FIG. 7 shows the structure in the surface plate 21 of the exposure apparatus 100 of the second embodiment. As in the first embodiment, the cooling device 70 in the present embodiment includes cooling pipes 71a and 71b provided in the main body 35 of the surface plate 21, and a pump (not shown) that supplies a coolant such as water to these. And. Between the cooling pipes 71a and 71b, the armature coil 38 is disposed via adhesion layers 72a and 72b such as high thermal conductive resin. However, a heat insulating layer 73 is provided between the cooling pipe 71a and the adhesion layer 72a (armature coil 38).

  By providing the heat insulating layer 73 between the cooling pipe 71a and the armature coil 38 as described above, the main heat transfer path of the heat generated by the armature coil 38 is directed toward the cooling pipe 71b. In the cooling device 70 having this configuration, by supplying the refrigerant to the cooling pipe 71b, most of the heat generated by the armature coil 38 is exhausted, and by supplying the refrigerant to the cooling pipe 71a, the platen 21 passes through the heat insulating layer 73. Residual heat transmitted to the side is exhausted, thereby preventing heat transfer to the surface plate 21.

  A heat conduction simulation performed to confirm the effectiveness of the heat insulating layer 73 will be described.

  FIG. 8A shows a cooling configuration for comparison, that is, a configuration in which only the cooling pipes 71a and 71b are disposed on the + Z side and the −Z side of the armature coil 38, respectively. The amount of heat generated by the armature coil 38 is, for example, 150 W, and the flow rate of the refrigerant in the cooling pipes 71a, 71b is, for example, 0.25 liter / m. Details such as the size of the cooling pipes 71a and 71b are omitted. In this cooling configuration, when the armature coil 38 is excited to generate heat, the temperature of the refrigerant supplied to the cooling pipes 71a and 71b rises. From the heat conduction simulation, the temperature rise was determined to be 4.3K. That is, in this cooling configuration, it was found that the surface temperature of the surface plate 21 increased by 4.3K.

  In FIG. 8B, cooling pipes 71a and 71b are provided on the first cooling configuration in which the heat insulating layers 73a and 73b are provided, that is, on the + Z side and the −Z side of the armature coil 38, respectively. The structure in which the heat insulation layers 73a and 73b are provided on the + Z side of the cooling pipe 71b and the -Z side of the cooling pipe 71b, respectively, is shown. The thickness of the heat insulation layers 73a and 73b is 1 mm. Other simulation conditions are the same as above. In this cooling configuration, the rising temperature of the refrigerant supplied to the cooling pipes 71a and 71b when the armature coil 38 is excited to generate heat was determined to be 3.1K from the heat conduction simulation. That is, in the first cooling configuration, it was found that the surface temperature of the surface plate 21 increased by 3.1K.

  Compared with the result for the cooling structure for comparison, the increase in the surface temperature of the surface plate 21 is decreased from 4.3K to 3.1K, so the effectiveness of the heat insulating layers 73a and 73b is recognized. However, the effect is not sufficient for the purpose of changing the heat transfer path of the heat generated by the armature coil 38 to prevent heat transfer to the surface plate 21.

  In FIG. 9 (A), the cooling pipes 71c and 71b are provided on the + Z side of the heat insulating layer 73a and the -Z side of the heat insulating layer 73b in the second cooling structure in which the heat insulating layers 73a and 73b are provided, that is, in the first cooling structure. A configuration provided with 71d is shown. The thickness of the heat insulation layers 73a and 73b is 0 to 0.5 mm. The flow rate of the refrigerant in the cooling pipes 71c and 71d is equal to the flow rate of the refrigerant in the cooling pipes 71a and 71b. Other simulation conditions are the same as above. In this cooling configuration, when the armature coil 38 is excited to generate heat, the rising temperature of the refrigerant supplied to the cooling pipes 71c and 71d is 3.3 with respect to the thickness 0 mm of the heat insulating layers 73a and 73b, based on the heat conduction simulation. 2K is required. Therefore, it was found that the surface temperature of the surface plate 21 increased by 3.2K in the second cooling configuration. This result is substantially the same as that of the first cooling configuration, and suggests that the purpose of preventing heat transfer onto the surface plate 21 cannot be sufficiently achieved by providing a large number of cooling pipes.

  On the other hand, when the heat conduction simulation is performed with the heat insulating layers 73a and 73b having a finite thickness, the rising temperature of the refrigerant supplied to the cooling pipes 71c and 71d is 1.4K with respect to the thickness of 0.1 mm. The thickness was determined to be 0.9 K for a thickness of 0.2 mm and 0.4 K for a thickness of 0.5 mm. That is, it was found that the increase in the surface temperature of the surface plate 21 can be suppressed to 0.4K by providing the heat insulating layers 73a and 73b. Therefore, sufficient effectiveness of the heat insulating layers 73a and 73b is recognized in order to prevent heat transfer to the surface plate 21.

  In FIG. 9B, the third cooling configuration in which the heat insulating layers 73a and 73b are provided, that is, the heat insulating layers 73a and 73b in the second cooling configuration are the + Z side of the cooling pipe 71c and −Z of the cooling pipe 71d, respectively. The configuration provided on the side is shown. The thickness of the heat insulation layers 73a and 73b is 0.5 mm. Other simulation conditions are the same as above. In this cooling configuration, the rising temperature of the refrigerant supplied to the cooling pipes 71c and 71d when the armature coil 38 is excited to generate heat was determined to be 2.7K from the heat conduction simulation. That is, by providing the heat insulating layers 73a and 73b, the surface temperature of the surface plate 21 increases by 2.7K.

  This result suggests that the heat insulation layers 73a and 73b are provided inside the cooling pipes 71c and 71d (on the armature coil 38 side) and are effective by comparing with the result in the second cooling configuration. ing.

  Here, in the second cooling configuration described above, when the heat insulating layers 73a and 73b have a thickness of 0.1 mm, the rising temperature of the refrigerant supplied to the cooling pipes 71c and 71d is 1.4K. The rising temperature of the refrigerant supplied to the cooling pipes 71a and 71b was determined to be 7.2K. Similarly, when the heat insulating layers 73a and 73b have a thickness of 0.2 mm, the rising temperature of the refrigerant supplied to the cooling pipes 71c and 71d is 0.9K, but is supplied to the cooling pipes 71a and 71b. When the rising temperature of the refrigerant is 7.7 K and the thickness of the heat insulating layers 73 a and 73 b is 0.5 mm, the rising temperature of the refrigerant supplied to the cooling pipes 71 c and 71 d is 0.4 K, whereas the cooling pipe 71 a , 71b, the rising temperature of the refrigerant is determined to be 8.2K. As a result, the heat insulating layers 73a and 73b change the heat transfer path of the heat generated by the armature coil 38, and most of the heat is exhausted by the refrigerant supplied to the cooling pipes 71a and 71b, and passes through the heat insulating layers 73a and 73b. It is suggested that the remaining heat transmitted to the surface plate side is exhausted by the refrigerant supplied to the cooling pipes 71c and 71d, thereby preventing the heat transfer to the surface plate 21.

  As described above, the cooling device 70 in the exposure apparatus 100 of the second embodiment is provided on the substrate stage WST side and the other side of the armature coil 38 constituting the flat motor 50 in the surface plate 21. A heat insulating layer 73 is provided between the cooling pipe 71 a of the cooling pipes 71 a and 71 b and the armature coil 38. Thereby, the main heat transfer path of the heat generated by the armature coil 38 is directed toward the cooling pipe 71b, and most of the heat generated by the armature coil 38 is exhausted by the refrigerant supplied to the cooling pipe 71b. By exhausting the remaining heat transmitted to the surface plate 21 side through the heat insulating layer 73 by the refrigerant supplied to the heat, heat transfer from the armature coil 38 to the surface plate 21 can be prevented. Then, the armature coil 38 constituting the planar motor 50 can be cooled, and fluctuations in the atmosphere around the substrate stage WST on the surface plate 21 can be suppressed.

  Further, since the cooling device 70 is provided, fluctuations in the atmosphere around the substrate stage WST on the surface plate 21 can be suppressed, so that the positioning accuracy of the substrate stage WST can be improved and the throughput can be improved.

  A third embodiment of the present invention will be described with reference to FIG.

  FIG. 10 shows the structure inside the surface plate 21 in the exposure apparatus 100 of the third embodiment. As in the first embodiment, the cooling device 70 in the present embodiment includes cooling pipes 71a and 71b provided in the main body 35 of the surface plate 21, and a pump (not shown) that supplies a coolant such as water to these. And. Note that an adhesion layer for closely attaching the cooling pipes 71a and 71b to the armature coil 38 is omitted.

  On the inner wall of the cooling pipe 71a (71b) on the −Z side (+ Z side), that is, on the armature coil 38 side, a high thermal conductive thin plate 74a (74b) is interposed via a plurality of high thermal conductive support members 75a (75b). It extends in the X-axis direction. With this configuration, a plurality of flow paths through which the refrigerant flows are formed in the cooling pipes 71a and 71b. The refrigerant is supplied in the X-axis direction into the cooling pipes 71a and 71b. In addition to the inner wall surface on the −Z side (+ Z side) of the cooling pipe 71a (71b), the front and back surfaces of the thin plate 74a (74b) are in contact with the refrigerant, so that the contact area between the cooling pipes 71a and 71b and the refrigerant is increased. The heat generated by the armature coil 38 can be exhausted more efficiently.

  Further, the thin plate 74 a (74 b) is fixed to the + Z side (−Z side) of the cooling pipe 71 a (71 b), that is, the inner wall on the opposite side of the armature coil 38 using a plurality of support members 76 a (76 b). . As the plurality of support members 76a and 76b, a low thermal conductive member such as a resin is used. Thereby, the heat generated by the armature coil 38 is prevented from being transmitted to the + Z side of the cooling pipe 71a, that is, on the surface plate 21, particularly via the plurality of support members 75a and the thin plate 74a.

  In addition, the contact area between the cooling pipes 71a and 71b including the thin plates 74a and 74b and the refrigerant is usually determined by the structure and size of the cooling pipes 71a and 71b. Therefore, when the contact area between the cooling pipes 71a and 71b including the thin plates 74a and 74b and the refrigerant is small according to the analogy of the heat conduction simulation result of FIG. 5, the thin plates 74a and 74b are configured using members having high thermal conductivity. I will do it.

  As described above, in the cooling device 70 in the exposure apparatus 100 of the third embodiment, a plurality of cooling pipes 71 a and 71 b provided in the armature coil 38 constituting the planar motor 50 are provided in the surface plate 21. A plurality of flow paths are formed by the high heat conductive thin plates 74a and 74b extended in the X-axis direction through which the refrigerant flows using the high heat conductive support members 75a and 75b. As a result, the heat generated by the armature coil 38 can be exhausted more efficiently by the refrigerant supplied to the cooling pipes 71a and 71b.

  Further, since the cooling device 70 is provided, fluctuations in the atmosphere around the substrate stage WST on the surface plate 21 can be suppressed, so that the positioning accuracy of the substrate stage WST can be improved and the throughput can be improved.

  In the present embodiment, the structure in which the cooling pipes 71a and 71b are brought into contact with the armature coil 38 is adopted, but instead of this, the armature coil is placed in the cooling pipe 71 as in the modification shown in FIG. It is also possible to adopt a configuration in which 38 is arranged. In such a case, the armature coil 38 is disposed in the internal space 41 of the surface plate 21, and the high heat conductive thin plate 74a (74b) is disposed on the + Z surface (−Z surface) via a plurality of high heat conductive support members 75a (75b). ) In the X-axis direction. The armature coil 38 (and the thin plate 74a (74b)) covers the internal space 41 using the ceramic plate 36a (36b), so that a plurality of low thermal conductive support members 76a fixed on the thin plate 74a (74b). It is fixed in the internal space 41 via (76b). In this configuration, the cooling pipe 71 functions by supplying the refrigerant in the X-axis direction into the internal space 41 of the surface plate 21 sealed by the ceramic plates 36a and 36b.

  In the above-described embodiment, the case where the present invention is applied to a dry type exposure apparatus that exposes the wafer W without using liquid (water) has been described. No. 99/49504, European Patent Application No. 1,420,298, International Publication No. 2004/055803, US Pat. No. 6,952,253, etc. The present invention can also be applied to an exposure apparatus that forms an immersion space including an optical path of illumination light between the wafer and the wafer, and exposes the wafer with illumination light through the projection optical system and the liquid in the immersion space. . The present invention can also be applied to an immersion exposure apparatus disclosed in, for example, US Patent Application Publication No. 2008/0088843.

  In the above embodiment, the case where the present invention is applied to a scanning exposure apparatus such as a step-and-scan method has been described. However, the present invention is not limited to this, and the present invention is applied to a stationary exposure apparatus such as a stepper. May be. The present invention can also be applied to a step-and-stitch reduction projection exposure apparatus, a proximity exposure apparatus, or a mirror projection aligner that synthesizes a shot area and a shot area. Further, as disclosed in, for example, US Pat. No. 6,590,634, US Pat. No. 5,969,441, US Pat. No. 6,208,407, etc. The present invention can also be applied to a multi-stage type exposure apparatus provided with a stage. Further, as disclosed in, for example, US Pat. No. 7,589,822, an exposure including a measurement stage including a measurement member (for example, a reference mark and / or a sensor) separately from the wafer stage. The present invention can also be applied to an apparatus.

  Further, the projection optical system in the exposure apparatus of the above embodiment may be not only a reduction system but also any of the same magnification and enlargement systems, and the projection optical system PL may be any of a reflection system and a catadioptric system as well as a refraction system. The projected image may be either an inverted image or an erect image. In addition, the illumination area and the exposure area described above are rectangular in shape, but the shape is not limited to this, and may be, for example, an arc, a trapezoid, or a parallelogram.

The light source of the exposure apparatus of the above embodiment is not limited to the ArF excimer laser, but is a KrF excimer laser (output wavelength 248 nm), F ₂ laser (output wavelength 157 nm), Ar ₂ laser (output wavelength 126 nm), Kr ₂ laser ( It is also possible to use a pulse laser light source with an output wavelength of 146 nm, an ultrahigh pressure mercury lamp that emits a bright line such as g-line (wavelength 436 nm), i-line (wavelength 365 nm), and the like. A harmonic generator of a YAG laser or the like can also be used. In addition, as disclosed in, for example, US Pat. No. 7,023,610, a single wavelength laser beam in an infrared region or a visible region oscillated from a DFB semiconductor laser or a fiber laser is used as vacuum ultraviolet light. For example, a harmonic that is amplified by a fiber amplifier doped with erbium (or both erbium and ytterbium) and wavelength-converted into ultraviolet light using a nonlinear optical crystal may be used.

  In the above embodiment, it is needless to say that the illumination light IL of the exposure apparatus is not limited to light having a wavelength of 100 nm or more, and light having a wavelength of less than 100 nm may be used. For example, the present invention can be applied to an EUV exposure apparatus that uses EUV (Extreme Ultraviolet) light in a soft X-ray region (for example, a wavelength region of 5 to 15 nm). In addition, the present invention can be applied to an exposure apparatus using a charged particle beam such as an electron beam or an ion beam.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two reticle patterns are synthesized on a wafer via a projection optical system, and 1 on the wafer by one scan exposure. The present invention can also be applied to an exposure apparatus that double exposes two shot areas almost simultaneously.

  In the above embodiment, the object on which the pattern is to be formed (the object to be exposed to which the energy beam is irradiated) is not limited to the wafer, but may be another object such as a glass plate, a ceramic substrate, a film member, or a mask blank. good.

  The use of the exposure apparatus is not limited to the exposure apparatus for semiconductor manufacturing, but for example, an exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern to a square glass plate, an organic EL, a thin film magnetic head, an image sensor (CCD, etc.), micromachines, and exposure apparatuses for manufacturing DNA chips can be widely applied. Further, in order to manufacture reticles or masks used in not only microdevices such as semiconductor elements but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates or silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern.

  An electronic device such as a semiconductor element includes a step of designing a function / performance of the device, a step of manufacturing a reticle based on the design step, a step of manufacturing a wafer from a silicon material, and the exposure apparatus (pattern forming apparatus) of the above-described embodiment. And a lithography step for transferring the mask (reticle) pattern to the wafer by the exposure method, a development step for developing the exposed wafer, and an etching step for removing the exposed member other than the portion where the resist remains by etching, It is manufactured through a resist removal step for removing a resist that has become unnecessary after etching, a device assembly step (including a dicing process, a bonding process, and a packaging process), an inspection step, and the like. In this case, in the lithography step, the exposure method described above is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the wafer. Therefore, a highly integrated device can be manufactured with high productivity.

21 ... platen, 30 ... substrate stage device, 38 ... armature coil, 41 ... inner space 50 ... stage drive system (planar motor), 70 ... cooling device, 71a, 71b ... condenser, 71b 0 _... protruding portion, 73 ... heat insulation layer, 74a, 74b ... thin plate, 100 ... exposure apparatus, W ... wafer, WST ... substrate stage.

Claims (8)

A driving device for applying a driving force between a base and a movable member movable relative to the base,
A first member provided on one of the movable body and the base;
A second member provided on the other of the movable body and the base and generating the driving force in cooperation with the first member;
A temperature control device that is installed on a side of the movable body and the base on which the second member is provided and adjusts the temperature of the second member using a refrigerant;
The temperature control device has a first channel and a second channel to which the refrigerant is supplied,
One of the first flow path and the second flow path is disposed closer to the first member than the other, and the second flow path is in contact with the refrigerant rather than the first flow path. A drive device in which an inner wall having a large area is formed.   The drive device according to claim 1, wherein a protrusion disposed in the refrigerant is provided on an inner wall of the second flow path.   The drive device according to claim 1, further comprising a heat insulating layer provided between the first flow path and the second member. A driving device for applying a driving force between a base and a movable member movable relative to the base,
A first member provided on one of the movable body and the base;
A second member provided on the other of the movable body and the base and generating the driving force in cooperation with the first member;
A temperature control device that is installed on a side of the movable body and the base on which the second member is provided and adjusts the temperature of the second member using a refrigerant;
The temperature control device has a first channel and a second channel to which the refrigerant is supplied,
The first flow path is disposed on one side of the second member with respect to the first member, and the second flow path is disposed on the other side of the second member with respect to the first member. ,
Between the second member and the first flow path, heat transfer between the second member and the first flow path is performed by heat transfer between the second member and the second flow path. The drive device in which the heat insulation member which also reduces is arranged. A driving device for applying a driving force between a base and a movable member movable relative to the base,
A first member provided on one of the movable body and the base;
A second member provided on the other of the movable body and the base and generating the driving force in cooperation with the first member;
A temperature control device that is installed on a side of the movable body and the base on which the second member is provided and adjusts the temperature of the second member using a refrigerant;
The temperature control device includes a tubular member forming a flow path to which the refrigerant is supplied, an extending member disposed in the tubular member and extending along at least a part of the flow path, and the extension A first connecting member that connects the first side of the member and the tubular member; and a second connecting member that connects the second side of the extending member and the second member;
The drive device in which the thermal conductivity of the first connection member is smaller than the thermal conductivity of the second connection member.   The drive device according to claim 5, wherein the first side is disposed closer to the first member than the second side. An exposure apparatus that irradiates an energy beam to form a pattern on an object,
The drive device according to any one of claims 1 to 6,
An exposure apparatus comprising: a projection optical system that irradiates an energy beam onto a substrate placed on the moving body. Using the exposure apparatus according to claim 7 to form a pattern on the object;
Developing the object on which the pattern is formed;
A device manufacturing method including:

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