JP2000348932A - Stage device and aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to obtain the strong thrust of the electromagnetic actuator of a stage device without increasing the heating value of the actuator, by a method wherein the stage device is provided with a control unit, by which a current is made to flow to the coils selected from among a plurality of element coils according to the position of a stage. SOLUTION: An element coil group 84A is divided into a plurality of units 84#1, 84#2,..., which respectively consist of 6 element coils 84Ai, and a stage control unit 68 changes the element coils 84Ai to which currents are made to flow for respective units. The current is made to flow to the coils only selected from among the coils of the group 84A according to the position of a wafer stage. The selection of the coils to respond to the position of the stage is made on the basis of the detected value detected by a position detecting unit for detecting the position of the stage. As the position detecting unit, a laser interferrometer 44 for measuring the X coordinate is used and in a linear motor for making the unit 68 drive in the Y direction, an interferrometer 46 for measuring the Y coordinate is used. As the element coils, flat coils are used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention generally relates to a stage apparatus for moving a stage by an electromagnetic actuator, and more particularly, to moving a moving object such as a mask (reticle) or a wafer used in an exposure apparatus with high precision. And an exposure apparatus to which the stage device is applied.

[0002]

2. Description of the Related Art Conventionally, in a lithography process for manufacturing a semiconductor device, a liquid crystal display device, or the like, a pattern formed on a mask or a reticle (hereinafter, collectively referred to as a “reticle”) is resisted through a projection optical system. There is used an exposure apparatus that transfers the image onto a substrate such as a wafer or a glass plate (hereinafter, appropriately referred to as a “photosensitive substrate or wafer”) on which the substrate is coated. As such an exposure apparatus, a stationary exposure type projection exposure apparatus such as a so-called stepper and a scanning exposure type projection exposure apparatus such as a so-called scanning stepper are mainly used. These types of projection exposure apparatuses are provided with a wafer stage that can hold the wafer and can move two-dimensionally because the pattern formed on the reticle must be sequentially transferred to a plurality of shot areas on the wafer.
In the case of a scanning exposure type projection exposure apparatus, a reticle stage for holding a reticle is also movable in the scanning direction.

In a recent projection exposure apparatus, an electromagnetic actuator such as a so-called linear motor is used as a driving source in a stage device such as a reticle stage and a wafer stage. This is the electromagnetic actuator
The structure is simple, the number of parts is small, the frictional resistance in driving is small, the operation accuracy is high, and since the linear driving is performed directly, the moving operation can be performed quickly. This is because it is suitable for responding to requests for improvement in throughput and positioning accuracy regarding a reticle stage, a wafer stage, and the like.

In a static exposure type projection exposure apparatus, the performance required of an electromagnetic actuator for driving a wafer stage is summarized in the following items: (A) How to move a wafer to a target position quickly (B) High accuracy of how accurately the wafer is stopped at the target position; and (C) Stop stability of how stable the wafer is stopped when the wafer is stopped.

In a scanning type exposure apparatus, the performance required of an electromagnetic actuator for driving a wafer stage in a scanning direction is summarized in the following items: (D) How fast the wafer reaches a target speed. (E) Constant speed of how fast and uniform the wafer is scanned; and (F) High accuracy of maintaining a relative positional relationship between the wafer stage and the reticle stage in a predetermined positional relationship. sex.

Various linear motors have been developed to satisfy many of the performance requirements described above. Typically,
A linear motor is composed of a stator fixed to a predetermined member and a mover fixed on a member that moves with respect to the predetermined member. When the stator includes a coil, the mover is a permanent magnet. When the stator includes a magnet, the mover includes a coil. Those in which the magnet is included in the mover and the coil is included in the stator are called moving magnet type linear motors, while the coil is included in the mover and the magnet is included in the stator. This is called a moving coil type linear motor.

[0007]

By the way, in a reticle stage and a wafer stage in an exposure apparatus,
Since precise positioning is required, when a linear motor is used, a subtle temperature change due to heat generation of the coil may affect the accuracy of peripheral devices and cause a problem. For example, the heat in the coil may cause fluctuations in the gas in the surrounding atmosphere, and the accuracy of position measurement by the laser interferometer may decrease. Also, with the increase in the size of devices to be manufactured, the size of the reticle stage and the size of the wafer stage are increasing, and the weight is also increasing. Therefore, a linear motor that drives a reticle stage or a wafer stage is desired to have a large thrust.

In order to increase the thrust of the linear motor,
Increasing the number of turns of the armature coil, passing a large current through the armature coil, increasing the magnetic force of the permanent magnet, and the like can be considered. However, since these conditions are mutually restricted, it is necessary to set optimal conditions. For example, if the number of turns of the armature coil is increased to increase the thrust, more air gaps are required, and the thrust does not always increase in proportion to the increase in the number of turns. In order to increase the number of turns without changing the air gap, the linearity of the coil wire should be reduced.However, if the linearity is reduced, the resistance increases, and the resistance increases with the increase in the number of turns. Will increase. Even if the current is increased, the heat generation also increases. Thus, when the size or scale of the linear motor is determined, the maximum current, the number of turns,
Conditions such as armature coil resistance and air gap were also determined, and there was a limit to increasing thrust by these changes.

In order to remove the heat generated from the coil,
There are known methods of providing a cooling pipe around a coil and using a heat insulating material for blocking heat transmission. However, these methods have a problem that the temperature stability required for precise positioning in the exposure apparatus cannot be obtained, and that the apparatus becomes large.

In the case where a large current is required for increasing the thrust, the above-mentioned conventional method requires a large amount of refrigerant to be supplied under high pressure and high pressure.
It must flow at high speed and the cooling passage must be large. In order to make the refrigerant flow at a high speed, a high-pressure circulation pump must be used, which places a burden on the welded portion and the connection portion of the circulation route, which may lead to an accident such as leakage of the refrigerant.

Accordingly, an object of the present invention is to provide a stage device having an electromagnetic actuator capable of obtaining a large thrust without increasing the amount of heat generated.

Another object of the present invention is to provide an exposure apparatus having high exposure accuracy by applying a stage apparatus having such an electromagnetic actuator having a small amount of generated heat.

[0013] Still other objects of the present invention will become apparent from the following description.

[0014]

Hereinafter, in the examples shown in this section, for ease of understanding, each constituent element of the present invention will be described with typical reference numerals shown in the drawings of the embodiments. The configuration of the present invention or each component requirement is not limited to those restricted by these reference numerals.

According to the present invention, the stage (36) is controlled by the electromagnetic actuator (24) including the mover (24B) connected to the stage (36) and the stator (24A) having a plurality of element coils (84). A stage device for moving a selected one of the plurality of element coils (84) in accordance with the position of the stage (36). Is done.

According to this configuration, since the control device for energizing the element coil selected according to the position of the stage is employed, for example, energizing only the element coil related to the mover connected to the stage is performed. Efficient driving can be performed, and a large thrust can be obtained without increasing the heat generation amount.

According to another aspect of the present invention, there is provided an exposure apparatus for exposing a photosensitive substrate (W) through a reticle (R) on which a pattern is formed. At least one of the reticle (R) and the photosensitive substrate (W) is moved by the stage device according to the present invention.

According to this configuration, since the amount of heat generated by the electromagnetic actuator of the stage device can be reduced according to the present invention, a decrease in the position measurement accuracy by the laser interferometer due to the fluctuation of the gas in the atmosphere around the stage is prevented. In addition, thermal expansion of peripheral parts such as a stage can be suppressed to a small value, and as a result, exposure accuracy is improved.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 schematically shows the overall configuration of an exposure apparatus 100 according to the present embodiment. The exposure apparatus 100 is a projection exposure apparatus of a so-called step-and-scan exposure system.

The exposure apparatus 100 includes an illumination system IOP, a reticle stage RST for holding a reticle R, a projection optical system PL, a wafer stage device 15 as a stage device for driving a wafer W in XY two-dimensional directions within an XY plane, and These control systems are provided.

The illumination system IOP includes a light source unit, a shutter, a secondary light source forming optical system, a beam splitter, a condenser lens system, a reticle blind, an image forming lens system, and the like (all not shown). The configuration and the like of this illumination system IOP are disclosed in, for example, Japanese Patent Application Laid-Open No. 9-320956. The illumination light IL output from the illumination system IOP illuminates a rectangular illumination area on the reticle R held on the reticle stage RST after being reflected by the bending mirror 62.

On reticle stage RST, reticle R
Are fixed, for example, by vacuum suction. A reticle laser interferometer (hereinafter, referred to as reticle stage RST)
A movable mirror 64 that reflects the laser beam from a “reticle interferometer” 66 is fixed, and the position of the reticle stage RST in the stage movement plane is the reticle interferometer 6.
6 always detects with a resolution of, for example, about 0.5 to 1 nm.

The position information of the reticle stage RST from the reticle interferometer 66 is sent to the stage controller 68 and the main controller 60 via the stage controller 68, and the stage controller 68
Drives the reticle stage RST via a reticle driving unit (not shown) based on the position information of the reticle stage RST in response to an instruction from the main controller 60.

The projection optical system PL includes a reticle stage RS
The optical axis AX (corresponding to the optical axis IX of the illumination optical system) is disposed below T in FIG. 1 and is the Z-axis direction. Here, a refracting optical system including a plurality of lens elements arranged at predetermined intervals along the optical axis AX direction so as to have a telecentric optical arrangement on both sides is used. The projection optical system PL has a predetermined projection magnification, for example, 1 /
This is a reduction optical system having 5 (or 1/4). Therefore, the reticle R by the illumination light IL from the illumination optical system.
Is illuminated, a reduced image (partially inverted image) of the circuit pattern of the reticle R in the illuminated area is projected on the surface by the illumination light IL passing through the reticle R via the projection optical system PL. The resist is formed on an exposed area conjugate to the illumination area on the wafer W to which the resist is applied.

The wafer stage device 15 includes the driving device 10
And a wafer stage 36 as a stage.

The driving device 10 is, as shown in FIG.
A surface plate 12, an X guide 14 as a guide bar fixed on the surface plate 12, a movable body 16 movable in the X direction along the upper surface of the surface plate 12 and the X guide 14, and a movable body 16
And a Y guide 22 as a moving guide.

As the surface plate 12, for example, a rectangular plate made of alumina ceramics which is lighter than iron and is hardly damaged is used. The upper surface of the surface plate 12 is a reference surface.

As the X guide 14, for example, one made of alumina ceramics is used. This X guide 14
Are arranged along the X direction near one end surface of the surface plate 12 in the Y direction. The surface of the other end of the X guide 14 in the Y direction is a reference surface.

The moving body 16 is placed on the surface plate 12 with an X guide 14.
A first Y-guide carrier 18 formed of an L-shaped cross-section member disposed in the X direction in the vicinity of the first Y-guide carrier at a predetermined distance from the first Y-guide carrier 18 A second Y guide transport body 20 composed of an elongated plate-like member disposed on the surface plate 12 in parallel with the first and second Y guide transport members 20;
And the Y guide 22 extending in the Y direction and provided between the Y guide carriers 18 and 20.

On one side of the X guide 14 on the surface plate 12 in the Y direction, an armature unit 24A as a stator of the first X linear motor 24 extends in the X direction close to the X guide 14. Have been. An armature unit 26A as a stator of the second X linear motor 26 is provided on the other side in the Y direction of the second Y guide carrier 20 near the other end in the Y direction on the surface plate 12. It extends in the X direction. In the present embodiment, so-called moving magnet type linear motors are used as the first and second X linear motors 24 and 26.

A magnetic pole unit 24B as a mover of the first X linear motor 24 is connected to one end of the Y guide 22 via a connecting member 28, and a magnetic pole as a mover of the second X linear motor 26 is provided. The unit 26B is connected to the other end of the Y guide 22 via a connecting member 30. Therefore, the moving body 16 is moved by the movement of the magnetic pole units 24B and 26B of the first and second X linear motors 24 and 26.
It is driven in the direction.

On one side and the other side of the Y guide 22 in the X direction,
Armature units (stators) 32A and 34A of the first and second Y linear motors 32 and 34 are arranged along the Y direction, and are suspended between the first and second Y guide transporters 18 and 20. I have. However, in FIG. 2, the magnetic pole unit of the second Y linear motor on the far side is not shown. 1st, 2nd
A moving magnet type linear motor is also used as the Y linear motor.

The wafer stage 36 is provided with a top plate 38 and a bottom plate 40 which are arranged in parallel with each other while sandwiching the Y guide 22 from above and below and substantially parallel to the upper surface (reference surface) of the surface plate 12.
And a pair of Y-direction bearing bodies 42, 42 for interconnecting the top plate 38 and the bottom plate 40 on both sides of the Y guide 22. These Y-direction bearing members 42, 42 have a predetermined gap formed between them and the Y guide 22,
2 are arranged in parallel. These Y-direction bearing bodies 4
On the outer surfaces of the first and second Y linear motors 32 and 3 constituting driving means of the wafer stage 36,
4 magnetic pole units (movable elements) 32B, 34B (3
4B (not shown) is attached, and the movement of the magnetic pole units 32B and 34B of the Y linear motors 32 and 34 drives the wafer stage 36 in the Y direction. In addition, an air outlet (not shown) is provided on the inner surface of the Y-direction bearing body 42. Further, the dimension of these Y-direction bearing members 42 in the height direction is set larger than that of the Y guide 22.

The top plate 38 also serves as a substrate table.
On the upper surface of the top plate 38, an X movable mirror 4 for reflecting the laser light emitted from the laser interferometer 44 for measuring the X coordinate and the laser interferometer 46 for measuring the Y coordinate fixed on the surface plate 12.
8, the Y movable mirror 50 and the wafer W are mounted. Note that this wafer W is actually moved up and down (Z direction),
And mounted on a top plate 38 via a Z-leveling stage (not shown) that can rotate around the X, Y, and Z axes. The position of the top plate 38 in the stage movement plane is constantly detected by the laser interferometer 44 for measuring X coordinates and the laser interferometer 46 for measuring Y coordinates, for example, with a resolution of about 0.5 to 1 nm.

Referring back to FIG. 1, the laser interferometer 4 for measuring the X coordinate
The position information of the top plate 38 from the laser interferometer 4 and the Y coordinate measuring laser interferometer 46 (not shown in FIG. 1, see FIG. 2) is sent to the stage control device 68 and the main control device 60 via the stage control device 68. The control device 68 responds to the instruction from the main control device 60 and transmits the armature units 24A, 26A, 3 from the current driving device 70 based on the position information of the top plate 38.
The wafer stage device 15 is controlled by adjusting the direction and magnitude of the current supplied to 2A and 34A.

In order to control the wafer stage device 15, the current driving device 70 supplies the armature units 24A, 24A, 2
When current is supplied to 6A, 32A, and 34A, armature units 24A, 26A, 32A, and 34A generate heat. Therefore, the armature units 24A, 26A, 32A, 34A
Liquid (water (pure water) or Fluorinert (Sumitomo 3M Co., Ltd., fluorine inert liquid), etc.)
Is supplied from the cooling controller 71 to the wafer stage device 15, and the cooling liquid used for cooling is returned from the wafer stage device 15 to the cooling controller 71, and cooled again by the cooling controller 71. The wafer is supplied to the wafer stage device 15. However, the cooling liquid after heat absorption may be discharged to the outside without necessarily configuring such a cooling liquid circulation path.

Further, in the wafer stage device 15, a vacuum preload type static pressure air bearing having an air ejection portion and a vacuum preload portion is provided in various places, and an air pump (not shown) for controlling the air pressure is provided. Is the wafer stage device 15
It is connected to the.

Further, the apparatus shown in FIG. 1 has an oblique incident light type focus detection system (for detecting the position in the Z direction (optical axis AX direction) of the portion in the exposure area on the surface of the wafer W and the area in the vicinity thereof. A multipoint focus position detection system (not shown), which is one of the focus detection systems, is provided. The detailed configuration of the multi-point focus position detection system is disclosed in, for example, Japanese Patent Application Laid-Open No. Hei 6-283403.

In the exposure apparatus 100 of the present embodiment configured as described above, the reticle R is illuminated in a slit-shaped illumination area having a longitudinal direction perpendicular to the reticle R scanning direction. When the reticle R and the wafer W move synchronously in opposite directions, the entire pattern formed in the pattern area of the reticle R is transferred to the shot area on the wafer W at an accurate projection magnification.

Next, the linear motors 24, 26, 32 mounted on the wafer stage device 15 shown in FIG.
34 will be described with reference to FIGS. In addition,
Since the linear motors 24, 26, 32, and 34 have the same configuration, the following description will be made using the linear motor 24 as an example.

As described above, the linear motor 24 includes the armature unit 24A as a stator and the magnetic pole unit 24B as a mover.

As shown in FIG. 3, the magnetic pole unit 24B is made of a magnetic material and has a U-shaped end face and a magnetic pole base 72 extending in the stroke direction (X-axis direction). And a field magnet group 74 embedded on one side of the inner wall facing each other and a field magnet group 76 embedded on the other side of the inner wall facing each other.

Here, the magnet group 74 includes a field magnet 74N having an exposed magnetic pole surface of an N pole and a field magnet 74S having an exposed magnetic pole surface of an S pole.
And are alternately arranged in the stroke direction.
The exposed magnetic pole surface of the field magnet 74N and the exposed magnetic pole surface of the field magnet 74S have the same rectangular shape, and one side of the rectangle defines the width (l) of each magnetic pole surface in the stroke direction. The field magnet 74N and the field magnet 74S are arranged with a space having a width (L-1) in the stroke direction.

The field magnet group 76 has an exposed magnetic pole surface of S
Pole field magnet 76S and the exposed magnetic pole surface are N pole field magnet 76
N are alternately arranged in the stroke direction. The exposed magnetic pole surface of the field magnet 76N and the field magnet 7
The exposed magnetic pole surface of 6S has the same shape as the exposed magnetic pole surface of the field magnet 74N or the exposed magnetic pole surface of the field magnet 74S.

The field magnet 74S and the field magnet 76N
Are arranged such that the field magnet 74N and the field magnet 76S face each other with a gap therebetween. For this reason, the gap between the field magnet group 74 and the field magnet group 76 has a period L along the stroke direction and a field in which an alternating magnetic flux is generated in the direction perpendicular to the stroke direction (Y-axis direction). It is a void. A magnetic circuit is configured by the field magnet group 74, the field magnet group 76, the magnetic pole base 72, and the field gap.

In the magnetic pole unit 24B of this embodiment, the field magnet group 74 and the field magnet group 76 are
2, the opposing inner walls of the magnetic pole base 72 are made flat, and the field magnet groups 74 and 76 are attached to the opposing inner walls of the magnetic pole base 72 with an adhesive or the like to form a magnetic pole unit. Can also.

The schematic configuration of the armature unit 24A is as follows.
This is shown in FIG. Here, FIG. 4A is a cross-sectional view of the armature unit 24A taken along a plane parallel to the XZ plane.
4B is a cross-sectional view taken along line BB in FIG. 4A, and FIG. 4C is a cross-sectional view taken along line CC in FIG. 4A.

As shown in FIG. 4, the armature unit 24A is composed of an armature base 78 made of a non-magnetic metal or resin, and a non-magnetic material. And a can 80 whose opening is fixed to the + Z direction side surface of the armature base 78.

In a closed space formed by the armature base 78 and the can 80 (hereinafter referred to as “the inside of the can”), an element coil group 84A including _N element coils 84A ₁ ,. N element coils 84B ₁ ,..., 84B provided on the + Y direction side of the element coil group 84A.
_N flat coil groups 84B.

Each of the element coils 84Ai, 84Bi (i = 1 to
N) (hereinafter, any one is referred to as “element coil 84”)
Are similarly configured, and a schematic configuration thereof is shown in FIG. Here, when the element coil 84 is viewed from the front side of FIG. 4A, the front view is shown in FIG. 5A, the right side view is shown in FIG. The figure is shown in FIG. Although FIG. 5 shows a case where the number of windings is three due to the drawing, the number of windings is usually a number sufficiently larger than three because the electric wire is usually sufficiently thinner than the width L / 3. (For example, 10).

5A to 5C, the element coil 84 has a hexagonal shape having a predetermined width in a front view and is a flat coil (flat coil) suitable for thinning. Is configured as More specifically, the electric wire 90 has a hexagonal shape having two vertices at both ends in the Z-axis direction, and has a width of approximately 1/3 (= L / 3) of the period L of the alternating magnetic flux in the magnetic pole unit 24B. , And the maximum width of the hollow portion in the stroke direction (X-axis direction) is approximately 2L / 3. The element coil 84 is configured to be substantially line-symmetric with respect to an axis extending in the stroke direction passing through the coil center.

As a result, the element coil 84 is arranged in the field gap in which the alternating magnetic flux having the period L along the stroke direction formed by the magnetic pole unit 72 is generated. When (I) is supplied, only a force parallel to the stroke direction acts on the entire element coil as a resultant of the Lorentz electromagnetic force generated on each side.
The direction and magnitude of the force acting on the element coil 84 are determined by the direction and magnitude of the current supplied from the current driver 70 to the element coil 84 and the positional relationship between the element coil and the alternating magnetic field.

The element coil 84 is bent at both ends in the Z-axis direction, but is gently bent at the folded portion so that the electric wire 90 is not broken. As a result, as clearly shown in FIG. 5B, in each of the bent portions, spaces 921 and 922 extending in the stroke direction are formed therein.

The element coil 84 as described above can be manufactured by winding a coil electric wire 90, forming a coil having a hexagonal column-shaped hollow portion, and crushing the coil into a flat plate.

Referring back to FIG. 4, the element coil group 84A is sequentially arranged such that the element coils 84Ai configured as described above are arranged along the stroke direction such that sides parallel to the Z axis of the element coils 84Ai are adjacent to each other. It is composed. Similarly to the element coil group 84A, the element coil group 84B is configured such that the element coils 84Bi are sequentially arranged along the stroke direction such that sides parallel to the Z axis of the element coil 84Bi are adjacent to each other.

As a method for holding the element coil 84, a holding plate is attached inside the can 80, and the element coil 8 is attached to the holding plate.
4, a method of surrounding and holding the whole of the arranged element coils 84, a method of passing a wire through the element coils 84, and the like. In the present embodiment, is adopted, and this will be specifically described.

[0057] As best shown in Figure 4, the element coils 84A is space 9 of the support wire 86A ₁ and the coil elements 84Ai through the space 921 of each element coil 84Ai
22 is supported by the support wire 86A ₂ that penetrates the. One end of each of the support wires 86A ₁ and 86A ₂ is fixed to the can 80 via a spacer 82A, and the other end is fixed to the can 80 via a spacer 82B. The element coil group 84B is composed of the element coil group 84A.
Similarly, one end is fixed to the can 80 via the spacer 82A, and the other end is supported by the supporting wires 86B ₁ and 86B ₂ fixed to the can 80 via the spacer 82B.

The can 80 is provided with an inlet 88A and an outlet 88B for a coolant (refrigerant). Then, the cooling liquid is supplied from the cooling controller 71 shown in FIG.
, And heat is exchanged between the element coils 84Ai and 84Bi when passing through the inside of the can 80, and the heat generated in the element coils 84Ai and 84Bi is absorbed to increase the temperature of the cooling. The liquid is discharged outside through the outlet 88B. in this case,
The cooling liquid discharged through the outlet 88B is returned to the cooling controller 71 through the liquid passage, where it is cooled again and sent into the can 80.

In the linear motor 24, the armature unit 2
By controlling the current supplied to each of the element coils 84Ai, 84Bi of 4A by the current driver 70, the magnetic pole unit 24B is driven by the reaction force of the Lorentz electromagnetic force generated in each of the element coils 84Ai, 84Bi. In driving the magnetic pole unit 24B, the element coil group 84
Since the width L / 3 of the current path side of each of the element coils 84Ai and 84Bi of A and 84B is substantially 1/3 of the period L of the alternating magnetic flux in the magnetic pole unit 24B, the element coils 84Ai and 84Bi are sequentially arranged in the stroke direction. A three-phase current is supplied by the current driver 70 to the three element coil sets of 84Bi.

Hereinafter, the current supply control characteristic of the present embodiment will be described by taking the element coil group 84A as an example. FIG. 6 is a block diagram showing a control system related to the element coil group 84A. In the present embodiment, the element coil group 8
4A is divided into a plurality of units 84 # 1, 84 # 2,... Each including six element coils 84Ai, and the stage control device 68 changes the element coils 84Ai to be energized in units. For example, unit 84 # 1 includes the element coils _84A 1 _{~84A 6,} the coil elements _84A 1, 84A ₄ are connected in series to the U phase of the three-phase AC power source in the current driver 70, the coil elements 84
A _2, 84A ₅ are connected in series to the V-phase, the coil elements _84A 3, 84A ₆ are connected in series with the W-phase. The units 84 # 2, 84 # 3,... Are also connected to the current driver 70 in the same manner as the unit 84 # 1.

[0061] When the magnetic pole unit 24B as the movable element toward the element coils 84A ₁ to the element coils 84A _N (from left shown in FIG. 4 (A) toward the right) moves, first, the first to third unit 84 # 1, 84 # 2, 84 #
3 is supplied with current. Before the magnetic pole unit 24B completely passes through the first unit 84 # 1, the fourth unit 84 #
4, the magnetic pole unit 24B is completely
When passing through the unit 84 # 1, the first unit 84 #
The supply of current to 1 is stopped. The magnetic pole unit 24B is further moved in the above-described direction by the fourth unit 84 # 4 to which current is newly supplied. Next, the magnetic pole unit 24B
Is completely supplied to the fifth unit 84 # 5 before passing completely through the second unit 84 # 2, and when the magnetic pole unit 24B has completely passed the second unit 84 # 2, the current is supplied to the second unit 84 # 2. Is stopped. The magnetic pole unit 24B further moves in the above-described direction by the fifth unit 84 # 5 to which a current is newly supplied. Such driving is sequentially repeated, and the magnetic pole unit 24B moves smoothly.

To effectively perform such an operation, the length of each of the units 84 # 1, 84 # 2,... And the magnetic pole unit 24B in the stroke direction (mL + (m when the number of the field magnets is m) L-1)) is preferably set to be equal.

As described above, in the present embodiment, the position of the magnetic pole unit 24B, and thus the wafer stage 36 (FIG.
(See FIG. 2), only the selected coil in the element coil group 84A is energized, so that the amount of heat generated by the coil is greatly reduced as compared with the case where current is constantly supplied to the entire coil. be able to. The selection of the coil according to the position of the wafer stage 36 can be performed based on a value detected by a position detection device that detects the position of the wafer stage 36. FIG. 6 shows the element coil group 84A in the linear motor 24 for driving in the X direction, so that the X coordinate measuring laser interferometer 44 can be used as the above-described position detecting device. In the linear motor 32 for driving in the Y direction (see FIG. 2),
The Y-coordinate measuring laser interferometer 46 can be used as a position detecting device.

By reducing the amount of heat generated in this way, the wafer stage apparatus 15 of the present embodiment using the linear motor 24 and the linear motors 26, 32, and 34 constructed similarly as the driving force source can be used. Wafer stage device 1 that reduces the accuracy of position detection by laser interferometer
5 can be driven with a large thrust while suppressing the fluctuation due to the heat of the air around the wafer 5 and the thermal expansion of the members constituting the wafer stage device 15 itself. Therefore, the wafer W mounted on the wafer stage device 15 can be quickly moved in the XY two-dimensional plane, and
The position of the wafer W can be accurately controlled.

According to the projection exposure apparatus 100 of the present embodiment configured as described above, since the movement and positioning of the wafer W are performed by the wafer stage device 15,
The quick and accurate movement and position control of the wafer W are performed, and the throughput and the exposure accuracy are improved.
Can be transferred to the shot area of the wafer W.

In the above embodiment, the linear motor according to the present invention is applied to the wafer stage device 15, but it is also possible to apply a linear motor having a similar configuration to the reticle stage RST. In this case, it is possible to drive the reticle stage RST with a large thrust while suppressing fluctuations due to heat in the air around the reticle stage RST and thermal expansion of members constituting the reticle stage RST. Therefore, the reticle mounted on reticle stage RST can be quickly moved in the Y-axis direction,
The position control of the reticle R can be accurately performed.

In the above embodiment, a flat coil is used as an element coil. However, a coil having, for example, a winding bobbin can be similarly applied.

In the above embodiment, a so-called moving magnet type linear motor is constituted by using an armature unit as a stator and a magnetic pole unit as a movable element, so that piping for cooling and the like can be fixed. In addition, the device configuration can be simplified.

Further, in the above embodiment, the shape of the element coils is hexagonal, but other shapes can be used as long as they can be arranged in the stroke direction. Further, the width of the current path side of the element coil is set to 1/3 of the cycle of the alternating magnetic flux by the magnetic pole unit, and the three-phase current is supplied. / N (n is an integer of 2 or more and other than 3), and thrust performance can be improved by supplying an n-phase current.

In the above embodiment, the permanent magnet is used as the field magnet of the magnetic pole unit. However, an electromagnet that generates magnetic force lines in the same direction as the permanent magnet can be used instead of the permanent magnet. .

Further, in the above embodiment, the cooling liquid is used for cooling the armature coil. However, a gas refrigerant can be used as long as it is a fluid serving as a refrigerant.

The present invention is not limited to application to an exposure apparatus, but can also be applied to various apparatus driving devices and various apparatuses using flat coils.

Further, in the above embodiment, the plurality of element coils (element coil group 84A) are divided into at least two units (units 84 # 1, 84 # 2,...), And the control device (stage control device 68) Although the case where the element coils to be energized are changed in units of units has been described, the control device may change the element coils to be energized in units of element coils.

The embodiments described above are described for the purpose of facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, in the above embodiment, the steps
Although the description has been given of the reduction projection type exposure apparatus of the AND scan method, the entire surface of the reticle pattern is irradiated with exposure illumination light while the reticle and the wafer are stationary, and the wafer on which the reticle pattern is to be transferred. The same applies to a step-up-repeat type reduction projection exposure apparatus (stepper) that collectively exposes one upper partitioned area (shot area), and also to an exposure apparatus such as a mirror projection type, a proximity type, or a contact type. The present invention can be applied.

The present invention can be applied to a step-and-stitch type reduction projection type exposure apparatus using far ultraviolet light or vacuum ultraviolet light as exposure light. In this exposure apparatus, a circuit pattern to be formed on a substrate (for example, a reticle substrate) is enlarged by a reciprocal multiple of the reduction ratio, the enlarged pattern is divided into a plurality of parts, each of which is formed on a plurality of reticles. Each pattern of the reticle is projected in a reduced size, and is connected and transferred on a substrate. When transferring the pattern of each reticle onto the substrate, either a scanning exposure method or a static exposure method may be adopted. Further, the connecting portion may not be provided between a plurality of patterns transferred adjacently on the substrate. That is, the step-and-stitch method is to transfer a reticle pattern to a plurality of exposure areas that partially overlap on a substrate, regardless of the presence or absence of a pattern connection.

Further, a semiconductor device, a liquid crystal display,
An exposure apparatus for transferring a circuit pattern to a glass substrate or a silicon wafer for manufacturing a reticle or a mask, as well as an exposure apparatus used for manufacturing a plasma display, a thin-film magnetic head, and an imaging device (such as a CCD). The present invention can also be applied to That is, the present invention is applicable irrespective of the exposure method and application of the exposure apparatus.

As a light source of an exposure apparatus to which the present invention is applied
Is not particularly limited, and a KrF excimer laser (wavelength 24
8 nm), ArF excimer laser (wavelength 193 nm),
F₂ Laser (wavelength 157 nm), Kr₂Laser (wavelength
146 nm), KrAr laser (wavelength 134 nm), A
r₂Laser (wavelength 126nm) can be used
You.

For example, a single-wavelength laser in the infrared or visible range oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with erbium (or both erbium and yttrium), and further amplified. It is also possible to use a harmonic whose wavelength has been converted to ultraviolet light using a nonlinear optical crystal. Note that an ytterbium-doped fiber laser is used as the single-wavelength oscillation laser.

A reduction projection exposure apparatus using soft X-rays having a wavelength of about 10 nm as a light source, and an X-ray projection apparatus using a light source having a wavelength of about 1 nm.
The present invention can be applied to a line exposure apparatus, an exposure apparatus using an EB (electron beam) or an ion beam, and the like.

By the way, the steps of designing the function and performance of the circuit of the semiconductor element, the step of manufacturing a reticle, the step of manufacturing a silicon wafer based on the design step, and the exposure apparatus described in the above embodiment are used. The reticle is manufactured through a step of transferring a reticle pattern onto a wafer, an assembling step (including a dicing step, a package step, and the like), an inspection step, and the like.

The exposure apparatus of the present embodiment assembles a stage device composed of a number of components such as a reticle stage RST and a wafer stage device 15, and also forms an optical system of an illumination system IOP and a projection optical system PL composed of a plurality of lenses. It can be manufactured by performing adjustment and further performing overall adjustment (electrical adjustment, operation confirmation, etc.).

It is desirable that the exposure apparatus be manufactured in a clean room in which the temperature, cleanliness, etc. are controlled.

[0084]

As described above, according to the present invention,
There is an effect that it is possible to provide a stage device provided with an electromagnetic actuator capable of obtaining a large thrust without increasing the heat generation amount. Further, according to the present invention, there is an effect that it becomes possible to provide an exposure apparatus with high exposure accuracy by applying a stage device having an electromagnetic actuator having a small amount of generated heat.

When a laser interferometer is used as a position detecting device for detecting the position of the stage, fluctuations due to the heat of the air around the stage and thermal expansion of the stage, which lower the accuracy of position detection by the laser interferometer, are suppressed. Meanwhile, the stage can be driven. Therefore, the position of the stage can be accurately controlled.

Further, when the element coils are unitized as described above, current can be supplied only to the unit to be driven, so that the amount of heat generation can be extremely small.

Further, since a large current can be applied only to a specific unit, a large thrust can be obtained as compared with a conventional stage device using an electromagnetic actuator. When some of the element coils are damaged, there is an advantage that only the element coil or a unit including the element coil can be replaced.

Further, a large-sized linear motor can be easily manufactured only by sequentially arranging a plurality of units. Furthermore, if there is a variation in the resistance value of each element coil, the variation is averaged by unitization,
The linear motor can be controlled with higher accuracy.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an exposure apparatus showing an embodiment of the present invention.

FIG. 2 is a perspective view showing a detailed configuration of a wafer stage device of the device shown in FIG.

FIG. 3 is a perspective view showing a schematic configuration of a magnetic pole unit of a linear motor used in the wafer stage device of FIG. 2;

FIG. 4 is a sectional view showing a schematic configuration of an armature unit of a linear motor used in the wafer stage device of FIG.

FIG. 5 is a view for explaining a configuration of an element coil used in the armature unit of FIG. 4;

6 is a block diagram illustrating a control system for controlling current supply to the element coil group illustrated in FIG. 4 and the like;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Drive device 15 ... Wafer stage device 24, 26, 32, 34 ... Linear motor 24A, 26A, 32A, 34A ... Armature unit 24B, 26B, 32B, 34B ... Magnetic pole unit 36 ... Wafer stage 60 ... Main control device 68 ... Stage control device 70 ... Current drive circuit 84Ai, 84Bi ... Element coil

Claims (7)

[Claims] 1. A stage apparatus for moving said stage by an electromagnetic actuator including a mover connected to the stage and a stator having a plurality of element coils, wherein said plurality of element coils are moved in accordance with a position of said stage. A stage device comprising a control device for energizing the selected coil. 2. The stage apparatus according to claim 1, wherein the plurality of element coils are divided into at least two units, and the control device changes an element coil to be energized for each unit. 3. The apparatus according to claim 2, further comprising a position detecting device for detecting a position of the stage, wherein the control device selects an element coil to be energized based on a value detected by the position detecting device. 3. The stage device according to 1 or 2. 4. The stage apparatus according to claim 3, wherein said position detecting device is a laser interferometer. 5. The stage device according to claim 1, wherein the element coil is a flat coil. 6. The stage device according to claim 1, wherein the stator has a passage through which a refrigerant for cooling the coil element flows. 7. An exposure apparatus for exposing a photosensitive substrate through a mask on which a pattern is formed, wherein at least one of the mask and the photosensitive substrate is exposed by the stage device according to claim 1. An exposure apparatus that moves.