JP2006149100A - Linear motor, stage device, and aligner - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress variation in the temperature of ambient air even when a motor is driven. <P>SOLUTION: A linear motor has a magnet unit 90 and a coil unit 80 disposed opposite to each other, and is so constructed that the magnet unit 90 and the coil unit 80 are moved relative to each other. The linear motor has sucking units 106 that are provided along the direction in which the magnet unit 90 and the coil unit 80 are moved relative to each other and suck in the air in proximity to the outer surface of the coil unit 80. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a linear motor having a magnet unit and a coil unit, a stage device provided with the linear motor as a driving device, and an exposure device that exposes a mask pattern onto a substrate using a stage that is moved by driving the linear motor. It is.

  For example, in an exposure apparatus used for manufacturing a semiconductor element or a liquid crystal display element, a reticle stage on which a mask (reticle etc.) is placed or a wafer stage on which a photosensitive substrate (wafer, glass plate, etc.) is placed. Many linear motors that can be driven in a non-contact manner are used as drive devices. This type of linear motor uses a coil body that generates heat when energized. However, since an exposure apparatus is generally used in an environment in which the temperature is controlled to be constant, it is desirable to suppress the amount of heat generated even with a linear motor. ing. For example, the heat generated by the linear motor may cause the measurement values to be in error by causing the surrounding members / devices to be thermally deformed or by changing the air temperature on the optical path of the optical interferometer used to detect the position of the stage. There is.

Therefore, a technique for absorbing heat generated from the coil body by housing the coil body in a cooling jacket and circulating a temperature adjusting medium (refrigerant) in the cooling jacket is disclosed (for example, see Patent Document 1). ).
JP 2002-186242 A

However, the following problems exist in the conventional technology as described above.
Stage driving requires high speed and high acceleration, but there is a concern that the cooling capacity will not be able to catch up as the acceleration increases further.
Further, since the heat is taken from the coil in the process of flowing the refrigerant, the temperature of the refrigerant becomes higher toward the refrigerant outlet side. Thereby, in the linear motor, a temperature gradient (temperature distribution) is generated in which the temperature increases toward the refrigerant outlet side due to heat exchange with the refrigerant. This temperature gradient (temperature difference) also leads to a temperature difference of the surrounding air, and the air drifts in the interferometer optical path, so that air fluctuations may occur and the measured value, that is, the positioning performance of the stage apparatus may be degraded. Further, there is a possibility that the temperature of each member of the apparatus is changed by the heat transfer of the air and is deformed.

  The present invention has been made in consideration of the above points, and an object thereof is to provide a linear motor, a stage apparatus, and an exposure apparatus that can suppress a temperature change such as a rise in ambient air temperature even when the motor is driven. To do.

In order to achieve the above object, the present invention adopts the following configuration corresponding to FIGS. 1 to 13 showing the embodiment.
The linear motor of the present invention has a magnet unit (90) and a coil unit (80) arranged to face each other, and the linear motor (90) and the coil unit (80) move relatively. XLM1), which is provided along the direction (X-axis direction) in which the magnet unit (90) and the coil unit (80) move relative to each other, and sucks the air near the outer surface of the coil unit (80) ( 106).

  Therefore, in the linear motor of the present invention, the temperature of the air near the outer surface of the coil unit (80) rises due to the heat generated from the coil unit (80) due to the relative movement between the magnet unit (90) and the coil unit (80). Even in this case, since this air can be sucked out by the suction portion (106), the temperature rise of the surrounding air can be suppressed, and air fluctuations and deformation of each member of the apparatus can be prevented.

The stage device of the present invention is characterized in that the linear motor (XLM1) is used as a driving device.
The exposure apparatus of the present invention is characterized in that, in the exposure apparatus (EX) that exposes a pattern onto the substrate (P) using the stage apparatus (50), the stage apparatus is used as a stage apparatus. It is.

  Therefore, in the stage apparatus and the exposure apparatus of the present invention, the temperature rise of the air around the linear motor is suppressed even when the stage (WST) is driven, and it is possible to prevent the air fluctuation and the deformation of each member of the apparatus.

  In order to explain the present invention in an easy-to-understand manner, the description has been made in association with the reference numerals of the drawings showing one embodiment, but it goes without saying that the present invention is not limited to the embodiment.

  In the present invention, it is possible to suppress the temperature change of the coil unit even when the motor is driven, and it is possible to prevent the peripheral device from being thermally deformed and the drive performance from being lowered. Further, according to the present invention, it is possible to prevent air fluctuation or the like from occurring due to the temperature distribution, and to avoid a decrease in pattern transfer accuracy.

  Embodiments of a linear motor, a stage apparatus, and an exposure apparatus according to the present invention will be described below with reference to FIGS. Here, the linear motor and the stage apparatus according to the present invention will be described using an example in which the linear motor and the stage apparatus are applied to a wafer stage in an exposure apparatus.

(First embodiment)
First, a stage apparatus including the linear motor according to the present embodiment as a driving apparatus will be described.
FIG. 1 is an external perspective view of the stage device 50.
The stage device 50 includes a frame caster FC, a base board (surface plate) 12 provided on the frame caster FC, and an upper surface (moving surface) 12a of the base board 12 disposed above the base board 12. Interferometer system 118 (see FIG. 5) including moving wafer stage WST and measurement stage MST, interferometers 16 and 18 for detecting the positions of these stages WST and MST, and stage drive unit for driving stages WST and MST 124 (see FIG. 5). On wafer stage WST, wafer W as a substrate is placed.

  The frame caster FC has a substantially flat plate shape in which protrusions FCa and FCb projecting upward with the Y-axis direction as the longitudinal direction are integrally formed in the vicinity of both ends in the X-axis direction. The base board (surface plate) 12 is disposed on a region sandwiched between the projections FCa and FCb of the frame caster FC. The upper surface 12a of the base board 12 is finished with very high flatness, and serves as a guide surface when the wafer stage WST and the measurement stage MST are moved along the XY plane.

  Wafer stage WST includes a wafer stage main body 28 disposed on base board 12 and a wafer table WTB mounted on wafer stage main body 28 via a Z / tilt drive mechanism (not shown). The Z / tilt drive mechanism is actually configured to include three actuators (for example, a voice coil motor and an EI core) that support the wafer table WTB at three points on the wafer stage main body 28, and drive each actuator. By adjusting, the wafer table WTB is finely driven in the three-degree-of-freedom directions of the Z-axis direction, the θx direction (the rotation direction around the X axis), and the θy direction (the rotation direction around the Y axis).

  The wafer stage main body 28 is configured by a hollow member having a rectangular cross section and extending in the X-axis direction. A plurality of, for example, four static gas bearings (not shown), for example, air bearings, are provided on the lower surface of the wafer stage main body 28, and the wafer stage WST is several μm above the guide surface 12a via these air bearings. It is levitated and supported without contact through a clearance of a certain degree.

  Above the protrusions FCa and FCb of the frame caster FC, Y-axis stators 86 and 87 extending in the Y-axis direction are disposed. These Y-axis stators 86 and 87 are levitated and supported by a static gas bearing (not shown) provided on each lower surface, for example, an air bearing, with a predetermined clearance from the upper surfaces of the protrusions FCa and FCb. Has been. This is because the stators 86 and 87 move as counter masses in the opposite direction due to the reaction force generated by the movement of wafer stage WST and measurement stage MST in the Y direction, and this reaction force is canceled by the law of conservation of momentum. is there. In this embodiment, the Y-axis stators 86 and 87 are configured as magnetic pole units including a plurality of permanent magnet groups.

  Inside the wafer stage main body 28, a magnet unit 90 having a permanent magnet group as a mover in the X-axis direction is provided. An X guide bar XG1 extending in the X axis direction is inserted into the internal space of the magnet unit 90. The X guide bar XG1 is provided with a stator 80 for the X axis. The X-axis stator 80 is configured by a coil unit that includes a plurality of coil bodies arranged at predetermined intervals along the X-axis direction. In this case, a moving magnet type X-axis linear motor (linear motor) XLM1 that drives wafer stage WST in the X-axis direction is constituted by magnet unit 90 and X-axis stator 80 formed of a coil unit.

FIG. 2 is a plan view of an X-axis linear motor XLM1 in which the stator 80 and the mover 90 are combined, and FIG. 3 is a cross-sectional view.
The stator 80 which is a coil unit includes a coil body C having a substantially oval shape (0 shape) in plan view and arranged in a plurality in a line in the X-axis direction which is a relative movement direction of the stator 80 and the mover 90, and a coil And a coil jacket (accommodating member) CJ that accommodates the body C in the internal space 1. The plurality of coil bodies C are integrally formed of a synthetic resin such as an epoxy resin.
Examples of the material for forming the coil jacket CJ include polycarbonate resin, polyphenylene sulfide resin, polyether ether ketone resin, polypropylene resin, polyacetal resin, glass fiber filled epoxy resin, glass fiber reinforced thermosetting plastic (GFRP), and carbon fiber reinforced. Examples thereof include a synthetic resin such as a thermosetting plastic (CFRP), a non-conductive and non-magnetic material such as a ceramic material, or a metal such as stainless steel and aluminum.

Then, the temperature of the internal space (inside) 1 of the stator 80 from the cooling device 2 (see FIG. 5) via the refrigerant supply port (supply part) 80a provided at the + X side end of the stator 80. The adjusted refrigerant is supplied. The refrigerant that has recovered the heat generated from the coil body C by heat exchange is discharged from the refrigerant discharge port 80 b provided at the −X side end of the stator 80 and returned to the cooling device 2. The driving of the cooling device 2 is controlled by the main controller 20 (see FIG. 5).
The refrigerant used is preferably a liquid or gas, such as pure water, which is particularly inert, such as hydrofluoroether (for example, “Novec HFE” manufactured by Sumitomo 3M Limited), fluorine-based inert liquid ( For example, “Fluorinert” (manufactured by Sumitomo 3M Limited) may be mentioned.

  The magnet unit 90 includes a plurality of magnets (magnet generators) 76 and includes a yoke portion 78 provided with the stator 80 interposed therebetween as shown in FIG. Each of the magnets 76 is a permanent magnet, and a plurality of magnets 76 are attached to the yoke portion 78 side by side in the Y-axis direction as shown in FIG. 2, and magnets having different magnetic poles are alternately arranged. Further, the magnet 76 is arranged such that different magnetic poles face each other across the stator 80.

  The X-axis linear motor XLM1 is provided with a suction device 100 for sucking air near the outer surface of the stator 80. The suction device 100 includes tube bodies 101 and 101 and a suction pump (negative pressure suction source) 103 connected to the tube bodies 101 and 101 via a tube 102. Each of the tube bodies 101 extends in the X-axis direction, and as shown in FIG. 3, both sides of the coil jacket CJ sandwiching the magnet 76 between the upper surface and the lower surface (+ Z side and −Z side). It is fastened and fixed by fastening means 104 such as a mounting screw (outside the region facing the magnet 76).

  As shown in FIG. 4, each tube body 101 is connected to the exhaust passage 105 extending in the X-axis direction and the exhaust passage 105, and the width direction center side (the magnet 76 side) of the coil jacket CJ (stator 80). ) And a suction hole (suction part) 106 that opens toward (). The suction holes 106 are formed so as to open close to the surface of the coil jacket CJ, and are formed at regular intervals over the entire length of the coil jacket CJ (stator 80). Further, the hole diameter of the exhaust passage 105 is formed sufficiently large with respect to the hole diameter of the suction hole 106 so as not to cause a pressure loss difference between the plurality of suction holes 106. The tube body 101 is formed with an exhaust hole 107 communicating with the exhaust flow path 105 and connected to the tube 102. The suction pump 103 is a tube under the control of the main controller 20 (see FIG. 5). A negative pressure is sucked into the exhaust flow path 105 through 102.

  Returning to FIG. 1, a mover 82 composed of an armature unit incorporating a plurality of armature coils arranged at predetermined intervals along the Y-axis direction, for example, at both longitudinal ends of the X-axis stator 80. , 83 are fixed. Each of these movers 82 and 83 is inserted into the Y-axis stators 86 and 87 described above from the inside. That is, in this embodiment, a moving coil type Y-axis linear driving the wafer stage WST in the Y-axis direction by the movers 82 and 83 made of an electric unit and the Y-axis stators 86 and 87 made of a magnet unit. A motor YLM1 is configured. As the Y-axis linear motor YLM1, a moving magnet type linear motor may be used instead of the moving coil type linear motor. In the present embodiment, the fine movement mechanism (not shown) that drives the Y-axis linear motor YLM1, the X-axis linear motor XLM1, and the wafer table WTB constitutes a part of the stage drive unit 124 shown in FIG. Various drive mechanisms constituting the stage drive unit 124 are controlled by the main controller 20 shown in FIG.

  A wafer holder 70 that holds the wafer W is provided on the wafer table WTB. Wafer holder 70 includes a plate-like main body and an auxiliary plate having liquid repellency (water repellency) fixed to the upper surface of the main body and having a circular opening larger than the diameter of wafer W at the center thereof. Yes. A large number (a plurality) of pins are arranged in the region of the main body portion inside the circular opening of the auxiliary plate, and the wafer W is vacuum-sucked while being supported by the large number of pins. In this case, when the wafer W is vacuum-sucked, the surface of the wafer W and the surface of the auxiliary plate are formed so as to have substantially the same height. Note that liquid repellency may be imparted to the surface of wafer table WTB without providing an auxiliary plate.

Further, as shown in FIG. 1, a reflection surface 17X orthogonal to the X-axis direction is provided at one end (+ X side end) of the wafer table WTB in the Y-axis direction, and one end in the Y-axis direction. At (+ Y side end), a reflecting surface 17Y orthogonal to the Y-axis direction is extended in the X-axis direction. Interferometer beams (measurement beams) from an X-axis interferometer 46 and a Y-axis interferometer 18 constituting an interferometer system 118 (see FIG. 5) described later are projected onto the reflecting surfaces 17X and 17Y, respectively. The interferometers 46 and 18 receive the respective reflected lights, and are fixed to the reference position of each reflecting surface (generally, the projection unit PU side surface to be described later and the side surface of the off-axis alignment system ALG (see FIG. 5)). Displacement in the measurement direction from a mirror is set and used as a reference plane.
The measurement stage MST provided in the stage apparatus 50 will be described in another embodiment described later.

  In stage device 50 configured as described above, wafer stage WST is driven in the X-axis direction by driving X-axis linear motor XLM1, and X-axis linear motors XLM1 and XLM1 and XLM are driven by a pair of Y-axis linear motors YLM1. Driven in the Y-axis direction integrally with the guide bar XG1. Wafer stage WST is also rotationally driven in the θz direction by slightly varying the driving force in the Y-axis direction generated by Y-axis linear motor YLM1. Therefore, by driving the three actuators supporting the wafer table WTB, the X-axis linear motor XLM1 and the Y-axis linear motor YLM1, the wafer table WTB is not in the six degrees of freedom direction (X, Y, Z, θx, θy, θz). It can be finely driven by contact.

  Here, when the wafer stage WST is driven in the X-axis direction along the moving surface 12a using the X guide bar XG1 as a guide, the coil 90 is energized, whereby the mover 90 in the X-axis linear motor XLM1 is moved. It moves relative to the stator 80. At this time, the coil body C generates heat when energized, but the heat is recovered by heat exchange with the refrigerant circulating in the internal space 1 of the coil jacket CJ by the cooling device 2. Since the refrigerant flowing in the internal space 1 of the stator 80 rises in temperature according to the amount of heat recovered from the coil body C as it goes to the refrigerant discharge port 80b, the coil jacket CJ also has a refrigerant inlet side due to the heat transmitted from the refrigerant. The temperature on the refrigerant outlet side becomes higher than this temperature.

  Thereby, a temperature change also occurs in the air near the surface of the coil jacket CJ according to the temperature of the refrigerant. Here, when the refrigerant supplied to the stator 80 is supplied to the stator 80 at the temperature of the atmosphere in which the stage device 50 is installed (for example, 23 ° C.), the refrigerant is shown in FIG. As described above, the refrigerant that has been at the reference temperature K at the time of supply generates a temperature gradient K <b> 1 whose temperature becomes higher than the reference temperature K as it flows through the internal space 1 of the stator 80. In addition, in order to avoid the temperature rise of the stator 80, when supplying the refrigerant at a low temperature in consideration of the temperature rise amount at the refrigerant outlet, at the refrigerant inlet portion so that the reference temperature K becomes substantially central. A temperature gradient K2 is generated that is lower than the reference temperature K and higher than the reference temperature K at the refrigerant outlet.

  Therefore, the air near the surface of the coil jacket CJ becomes higher than the reference temperature over the entire length direction when the refrigerant has a temperature gradient K1, and when the refrigerant has a temperature gradient K2, the air enters the refrigerant inlet side. A temperature change occurs in which (+ X side) is lower than the reference temperature and the refrigerant outlet side (−X side) is lower than the reference temperature.

  Here, when the wafer stage WST moves, that is, when the X-axis linear motor XLM1 is driven, the suction pump 103 in the suction device 100 operates, so that air near the surface of the coil jacket CJ is sucked into the suction hole 106. And is exhausted from the exhaust passage 105 through the tube 102. That is, since air near the surface of the coil jacket CJ in which the temperature change (temperature increase or temperature decrease) has occurred with respect to the reference temperature due to the energization of the coil body C is exhausted out of the conditioned space by the suction device 100, the stator A temperature around 80 is maintained.

  As described above, in the present embodiment, even when the X-axis linear motor XLM1 is driven, air near the surface of the coil jacket CJ is sucked, so that the outside of the coil jacket CJ is caused by the heat generated by the motor drive. Even when a temperature gradient occurs on the surface, the temperature fluctuation of the air around the stator 80 can be prevented. For this reason, even when the X-axis linear motor XLM1 (X guide bar XG1) moves in the vicinity of the optical path of the detection light in the laser interferometers 16, 18, and 46, air fluctuations are generated to reduce measurement accuracy, and surrounding members・ It is possible to prevent thermal deformation of the device.

  Further, in the present embodiment, since a plurality of suction holes 106 are provided along the moving direction of the mover 90, the air whose temperature has changed is sucked regardless of where the stator 80 generates heat. Even when the mover 90 is movable with a long stroke and the stator 80 is long, the temperature change of the air near the surface can be prevented.

(Second Embodiment)
Next, a second embodiment of the linear motor will be described with reference to FIGS.
In these drawings, the same components as those of the first embodiment described above are denoted by the same reference numerals, and the description thereof is simplified or omitted.
In the first embodiment, the exhaust passage 105 is provided in both of the pipe bodies 101 and 101 provided outside the coil jacket CJ, and each exhaust passage 105 is connected to the suction pump 103. In the present embodiment, the tube body 101A located on the + Y side shown in FIG. 7 is connected to the air supply passage 105A extending in the X-axis direction and the air supply passage 105A as shown in FIG. It has a blowout hole (blowing part) 106 </ b> A provided to face the hole 106.

  The blowout hole 106A is formed close to the surface of the coil jacket CJ so as to open toward the suction hole 106. The hole diameter of the air supply channel 105A is formed to be sufficiently larger than the hole diameter of the outlet hole 106A so as not to cause a pressure loss difference between the plurality of outlet holes 106A. The tube body 101A is formed with an air supply hole 107A that communicates with the air supply passage 105A and is connected to the tube 102A. The tube 102A supplies air to the air supply passage 105A under the control of the main controller 20. A supply air pump 103A is connected.

  In the X-axis linear motor XLM1 configured as described above, when the air supply pump 103A is operated, air (gas) is supplied through the air supply passage 105A when the motor is driven, and as shown by an arrow in FIG. Air is blown out from the hole 106 </ b> A toward the suction hole 106. On the other hand, since suction from the suction hole 106 is performed at a position facing the blowout hole 106A, air in the vicinity of the surface of the coil jacket CJ that has undergone a temperature change due to motor driving is from the tubular body 101A side (+ Y side) to the tubular body It moves to the 101 side (−Y side), is sucked from the suction hole 106, and is exhausted from the exhaust passage 105 through the tube 102.

  In the present embodiment, air in the vicinity of the surface of the coil jacket CJ flows in one direction, so that a fluidized layer of air can be formed on the surface of the coil jacket CJ. The influence of the temperature change can be prevented from reaching the surroundings.

(Third embodiment)
Next, a third embodiment of the linear motor will be described with reference to FIGS.
In the first and second embodiments, the present invention is applied to a moving magnet type linear motor. However, in the present embodiment, a case where the present invention is applied to a moving coil type linear motor will be described.
Here, description will be made assuming that the present invention is applied to a Y-axis linear motor YLM1 that drives (relatively moves) wafer stage WST in the Y-axis direction.

  FIG. 9 is a plan view showing a state in which a stator 87 that is a magnet unit and a mover 83 that is a coil unit are separated, and FIG. 10 is a cross-sectional view in which the stator 87 and the mover 83 are combined. It is. The present invention is similarly applied to the Y linear motor YLM1 including the stator 86 and the movable element 82. Here, the Y linear motor YLM1 including the stator 87 and the movable element 83 will be described.

As shown in FIG. 9, the mover 83 has a configuration in which a plurality of coil bodies C arranged in the Y-axis direction are accommodated in the coil jacket CJ, and between the coil body C and the coil jacket CJ. The temperature adjusting refrigerant is in circulation.
Further, as shown in FIG. 10, the stator 87 is formed in a U-shaped cross section in which a pair of yoke portions 78 are opposed to each other with a spacer 77 interposed therebetween, and each yoke portion 78 is spaced in the Y-axis direction. A plurality of magnets 76 are arranged with a gap. The yoke portion 78 is located between the magnets 76, and more specifically, every other gap between the magnets 76 has a plurality of suction holes 106 spaced apart according to the length of each magnet 76 ( In FIG. 9, three are provided. A suction pump 103 is connected to each suction hole 106 via a tube 102. Furthermore, the spacer 77 is provided with a suction hole 106B so as to be positioned between the suction holes 106 in the Y-axis direction.

  In the Y-axis linear motor YLM1 configured as described above, when the mover 83 is driven by energizing the coil body C of the mover 83, the coil body C generates heat and the temperature of the air near the surface of the coil jacket CJ is increased. Although a change occurs, air is sucked and exhausted from the suction holes 106 and 106B located in the vicinity of the coil jacket CJ. Therefore, in the present embodiment, the temperature around the mover 83 is maintained, and the same effect as in the first embodiment can be obtained.

(Fourth embodiment)
Next, a fourth embodiment of the linear motor will be described with reference to FIG.
In the present embodiment, in the stator 80 shown in the first embodiment, when a temperature gradient is generated according to the flow of the refrigerant, a heater for canceling the temperature gradient is provided.
Specifically, as shown in FIG. 11, the heater 4 is attached to the front surface and the back surface of the coil jacket CJ in the stator 80 (the heater on the back surface side is omitted in FIG. 11) between the tube bodies 101. Has been. The heater 4 is formed by patterning one conductive thin plate (conductive material) such as a copper plate so as to cancel out the temperature distribution based on the temperature distribution generated in the stator 80.

  That is, the refrigerant introduced from the refrigerant supply port 80a into the internal space of the coil jacket CJ flows through the internal space while recovering the heat of the coil body C, and the temperature rises as the flow proceeds. A temperature gradient is generated in which the temperature is lower on the + X side refrigerant supply port 80a side and higher on the −X side refrigerant discharge port 80b side. And the heater 4 in this embodiment has the shape which bent the strip | belt-shaped body of substantially the same width | variety into the ninety nine fold shape along the X-axis direction, is extended in the Y-axis direction, and is spaced apart in the X-axis direction. The strips arranged with the gaps open on the refrigerant inlet side so that the temperature gradient of the stator 80 (coil jacket CJ) cancels out the temperature gradient and develops a temperature distribution with a uniform predetermined temperature (for example, the temperature in the chamber). The pitch on the + X side that is is small, and the pitch on the −X side that is the refrigerant outlet side is set large.

  In the Y-axis linear motor YLM1 configured as described above, in addition to obtaining the same operation and effect as the first embodiment, the temperature gradient generated in the stator 80 is suppressed. Even if the air whose temperature has changed near the surface of the coil jacket CJ remains, the measurement accuracy of the laser interferometers 16, 18, 46 due to the temperature gradient of the stator 80 (coil jacket CJ) is reduced. The thermal deformation of the member / device can be prevented.

(Fifth embodiment)
Next, a fifth embodiment of the linear motor will be described with reference to FIG.
In the first embodiment, a plurality of suction holes 106 are provided in one tube body 101. However, in this embodiment, suction pipes 110 each having a suction hole 106 are provided as shown in FIG. Yes.
In this configuration, a configuration in which a plurality of suction pipes 110 are collectively connected to a suction pump, or a configuration in which each suction pipe 110 is individually connected to a suction pump can be employed.
In any configuration, the same operation and effect as in the first embodiment can be obtained, and when the suction pump 110 is individually provided, the suction amount is controlled according to the heat generation state in the stator 80, so that the minimum required It is possible to prevent the temperature rise around the stator 80 by sucking the air whose temperature has changed by the optimum pump drive.

(Exposure equipment)
Next, an exposure apparatus having the above stage apparatus 50 as a wafer stage will be described.
FIG. 13 shows a schematic configuration of the exposure apparatus EX of the present embodiment.
The exposure apparatus EX is a step-and-scan projection exposure apparatus, that is, a so-called scanning stepper. The exposure apparatus EX includes an illumination system 10, a reticle stage RST that holds a reticle R as a mask, a projection unit PU, the above-described stage apparatus 50 having a wafer stage WST and a measurement stage MST, and a control system thereof. . On wafer stage WST, wafer W as a substrate is placed.

  The illumination system 10 illuminates a slit-like illumination area on the reticle R defined by a reticle blind (not shown) with illumination light (exposure light) IL as an energy beam with substantially uniform illuminance. Here, as the illumination light IL, for example, ArF excimer laser light (wavelength 193 nm) is used.

  On reticle stage RST, reticle R on which a circuit pattern or the like is formed on its pattern surface (the lower surface in FIG. 13) is fixed, for example, by vacuum suction. Reticle stage RST is aligned with the optical axis of illumination system 10 (corresponding to optical axis AX of projection optical system PL described later) by reticle stage drive unit 11 (not shown in FIG. 13, see FIG. 5) including, for example, a linear motor. It can be finely driven in the vertical XY plane and can be driven at a scanning speed designated in a predetermined scanning direction (here, the Y-axis direction in the paper plane in FIG. 13 is the left-right direction).

  The position (including rotation around the Z axis) of the reticle stage RST in the stage moving plane is moved by a reticle laser interferometer (hereinafter referred to as a reticle interferometer) 116 to a movable mirror 15 (actually orthogonal to the Y axis direction). For example, a Y movable mirror having a reflecting surface and an X moving mirror having a reflecting surface orthogonal to the X-axis direction are provided). The measurement value of reticle interferometer 116 is sent to main controller 20 (not shown in FIG. 13, see FIG. 5). In main controller 20, the measurement value of reticle stage RST is based on the measurement value of reticle interferometer 116. The position (and velocity) of the reticle stage RST is calculated by calculating the positions in the X-axis direction, the Y-axis direction, and the θZ direction (rotation direction around the Z-axis) and controlling the reticle stage drive unit 11 based on the calculation result. ) To control.

  Above the reticle R, a pair of reticle alignment marks on the reticle R and a corresponding pair of reference marks (hereinafter referred to as first reference marks) on the measurement stage MST are simultaneously provided via the projection optical system PL. A pair of reticle alignment detection systems RAa and RAb each including a TTR (Through The Reticle) alignment system using light having an exposure wavelength for observation is provided at a predetermined distance in the X-axis direction. As these reticle alignment detection systems RAa and RAb, those having a configuration similar to that disclosed in, for example, Japanese Patent Laid-Open No. 7-176468 (corresponding US Pat. No. 5,646,413) is used. .

The projection unit PU includes a lens barrel 40 and a projection optical system PL including a plurality of optical elements held in the lens barrel 40 in a predetermined positional relationship. As the projection optical system PL, for example, a refractive optical system including a plurality of lenses (lens elements) having a common optical axis AX in the Z-axis direction is used.
Although not shown, a specific plurality of lenses among the plurality of lenses constituting the projection optical system PL is based on an instruction from the main controller 20, and the imaging characteristic correction controller 381 (FIG. 5). The optical characteristics (including the imaging characteristics) of the projection optical system PL, such as magnification, distortion, coma aberration, and field curvature (including the image plane inclination) can be adjusted.

Further, in the exposure apparatus EX of the present embodiment, in order to perform exposure applying the liquid immersion method, a lens (hereinafter referred to as a front lens) as an optical element on the most image plane side (wafer W side) constituting the projection optical system PL. In the vicinity of 91, a liquid supply nozzle 51A and a liquid recovery nozzle 51B constituting the liquid immersion device 132 are provided.
The liquid supply nozzle 51A is connected to the other end of a supply pipe (not shown) whose one end is connected to a liquid supply device 288 (not shown in FIG. 13, see FIG. 5), and connected to the liquid recovery nozzle 51B. The other end of a recovery pipe (not shown), in which one end of the groove is connected to a liquid recovery device 292 (not shown in FIG. 13, see FIG. 5), is connected.

As the liquid, ultrapure water (hereinafter simply referred to as “water” unless otherwise required) through which ArF excimer laser light (light having a wavelength of 193 nm) is transmitted is used here. Ultrapure water has the advantage that it can be easily obtained in large quantities at a semiconductor manufacturing plant or the like and has no adverse effect on the photoresist, optical lens, etc. on the wafer.
The refractive index n of water is approximately 1.44. In this water, the wavelength of the illumination light IL is shortened to 193 nm × 1 / n = about 134 nm.

  The liquid supply device 288 opens a valve connected to the supply pipe at a predetermined opening degree according to an instruction from the main control device 20, and supplies water between the leading ball 91 and the wafer W through the liquid supply nozzle 51A. To do. At this time, the liquid recovery apparatus 292 opens a valve connected to the recovery pipe at a predetermined opening degree in response to an instruction from the main control apparatus 20, and connects the leading ball 91 and the wafer W via the liquid recovery nozzle 51 </ b> B. Water is recovered in the interior of the liquid recovery device 292 (liquid tank). At this time, the main controller 20 always makes the amount of water supplied from the liquid supply nozzle 51 </ b> A between the front lens 91 and the wafer W equal to the amount of water recovered through the liquid recovery nozzle 51 </ b> B. In this manner, a command is given to the liquid supply device 288 and the liquid recovery device 292. Accordingly, a certain amount of water Lq (see FIG. 13) is held between the front ball 91 and the wafer W. In this case, the water Lq held between the leading ball 91 and the wafer W is always replaced.

As is apparent from the above description, the liquid immersion device 132 of this embodiment includes the liquid supply device 288, the liquid recovery device 292, the supply pipe, the recovery pipe, the liquid supply nozzle 51A, the liquid recovery nozzle 51B, and the like. It is a configured local immersion apparatus.
Even when the measurement stage MST is positioned below the projection unit PU, it is possible to fill water between the measurement table MTB and the front lens 91 in the same manner as described above.

  As shown in FIG. 1, the measurement stage MST provided in the stage apparatus 50 is not shown on the measurement main body 52 and the measurement stage main body 52 disposed on the base board 12 as shown in FIG. And a measurement table MTB mounted via a Z / tilt drive mechanism. The Z / tilt drive mechanism includes three actuators (for example, a voice coil motor and an EI core) that support the measurement table MTB at three points on the measurement stage main body 52, and adjusts the drive of each actuator. Thus, the measurement table MTB is finely driven in the three-degree-of-freedom directions of the Z-axis direction, the θx direction, and the θy direction.

  The measurement stage main body 52 is configured by a hollow member having a rectangular cross section and extending in the X-axis direction. A plurality of, for example, four static gas bearings (not shown), for example, air bearings, are provided on the lower surface of the measurement stage main body 52, and the measurement stage MST is several μm above the guide surface 12a via these air bearings. It is levitated and supported without contact through a clearance of a certain degree. Inside the measurement stage main body 52, a magnet unit 54 having a permanent magnet group as a mover in the X-axis direction is provided. An X-axis X guide bar XG2 extending in the X-axis direction is inserted into the internal space of the magnet unit 54. An X-axis stator 81 is provided on the X guide bar XG2. The X-axis stator 81 is constituted by a coil unit that houses a plurality of armature coils (coil bodies) arranged at predetermined intervals along the X-axis direction. In this case, a moving magnet type X-axis linear motor XLM2 for driving the measurement stage MST in the X-axis direction is constituted by the magnet unit 54 and the X-axis stator 81 formed of a coil unit.

  Although not shown, the X-axis linear motor XLM2 is also provided with a suction device that sucks air in the vicinity of the outer surface of the stator 81 as in the linear motor XLM1 described above. The action of the suction device on the stator 81 is the same as the action of the suction device on the stator 80, and is omitted here, but when the heat generated by driving the X-axis linear motor XLM2 is recovered (cooled). In addition, even when a temperature change occurs in the air near the outer surface of the stator 81, the measurement accuracy of the laser interferometer decreases due to the temperature change of the air by sucking and removing the air. It is possible to prevent the peripheral device from being thermally deformed.

  Movable elements 84 and 85 comprising coil units containing a plurality of armature coils (coil bodies) arranged at predetermined intervals along the Y-axis direction, for example, at both longitudinal ends of the X-axis stator 81. Are fixed respectively. Each of these movers 84 and 85 is inserted into the Y-axis stators 86 and 87 described above from the inside. That is, in the present embodiment, the moving coil type Y-axis linear motor YLM2 is configured by the movers 84 and 85 made of a coil unit and the Y-axis stators 86 and 87 made of a magnet unit. This Y linear motor YLM2 has the same configuration as the motor shown in FIGS. 9 and 10, and even when the temperature of the air near the outer surface of the mover 84 changes due to the drive of the mover 84. Air is aspirated and exhausted.

  The measurement stage MST is driven in the X-axis direction by the X-axis linear motor XLM2, and is driven in the Y-axis direction integrally with the X-axis linear motor XLM2 by the pair of Y-axis linear motors YLM2. Further, the measurement stage MST is also rotationally driven in the θz direction by slightly varying the driving force in the Y axis direction generated by the Y axis linear motor YLM2. Accordingly, by driving the three actuators supporting the measurement table MTB, the X-axis linear motor XLM2 and the Y-axis linear motor YLM2, the measurement table MTB does not move in the six degrees of freedom direction (X, Y, Z, θx, θy, θz). It can be finely driven by contact.

The measurement table MTB further includes measuring instruments for performing various measurements related to exposure. More specifically, a plate 109 made of a glass material such as quartz glass is provided on the upper surface of the measurement table MTB. The surface of the plate 109 is coated with chrome over the entire surface, and is disclosed in a region for a measuring instrument at a predetermined position or in JP-A-5-21314 (corresponding US Pat. No. 5,243,195). A reference mark region FM in which a plurality of reference marks are formed is provided.
Patterning is applied to the area for the measuring instrument, and various measurement opening patterns are formed. As the measurement aperture pattern, for example, an aerial image measurement aperture pattern (for example, a slit-shaped aperture pattern), an illuminance unevenness measurement pinhole aperture pattern, an illuminance measurement aperture pattern, and a wavefront aberration measurement aperture pattern are formed. Yes.

  In the present embodiment, it is used for the measurement using the illumination light IL in response to the immersion exposure for exposing the wafer W with the exposure light (illumination light) IL through the projection optical system PL and water. In the above illuminance monitor, illuminance unevenness measuring instrument, aerial image measuring instrument, wavefront aberration measuring instrument, etc., the illumination light IL is received through the projection optical system PL and water. Therefore, a water repellent coat is applied to the surface of the plate 109.

At one end (−Y side end) in the Y-axis direction of the measurement table MTB (plate 109), a reflecting surface 117Y orthogonal to the Y-axis direction (extending in the X-axis direction) is formed by mirror finishing. In addition, a reflection surface 117X orthogonal to the X-axis direction (extending in the Y-axis direction) is formed at one end (+ X side end) in the X-axis direction of the measurement table MTB by mirror finishing.
As shown in FIG. 1, an interferometer beam (measurement beam) from the Y-axis interferometer 16 constituting the interferometer system 118 is projected onto the reflection surface 117Y, and the interferometer 16 receives the reflected light. Thus, the displacement of the reflecting surface 117Y from the reference position is detected.
Further, the interferometer beam from the X-axis interferometer 46 that constitutes the interference system 118 is projected onto the reflection surface 117X, and the interferometer 46 receives the reflected light so that the reference surface of the reflection surface 117X is separated from the reference position. Detect displacement.

  In the exposure apparatus EX of the present embodiment, the holding member that holds the projection unit PU is provided with an off-axis alignment system (hereinafter referred to as an alignment system) ALG. As this alignment system ALG, for example, the target mark is irradiated with a broadband detection light beam that does not sensitize the resist on the wafer, and the target mark image formed on the light receiving surface by the reflected light from the target mark and an index (not shown) An image processing system FIA (Field Image Alignment) system that captures an image of (an index pattern on an index plate provided in the alignment system ALG) using an image sensor (CCD or the like) and outputs the image signals. These sensors are used. An imaging signal from the alignment system ALG is supplied to the main controller 20 shown in FIG.

  In the exposure apparatus EX of the present embodiment, although not shown in FIG. 13, for example, Japanese Laid-Open Patent Publication No. 6-283403 (corresponding to US Pat. No. 5) comprising an irradiation system 90a and a light receiving system 90b (see FIG. 5). , 448, 332) and the like, an oblique incidence type multi-point focal position detection system similar to that disclosed in Japanese Patent Laid-Open No.

FIG. 5 shows the main configuration of the control system of the exposure apparatus EX.
This control system is configured with a main controller 20 composed of a microcomputer (or a workstation) that controls the entire apparatus in an integrated manner. The main controller 20 is connected to a display DIS such as a memory MEM and a CRT display (or liquid crystal display).

Next, a parallel processing operation using wafer stage WST and measurement stage MST will be briefly described.
During this parallel processing operation, the main controller 20 controls the opening and closing of the valves of the liquid supply device 288 and the liquid recovery device 292 of the liquid immersion device 132 as described above, and the front lens 91 of the projection optical system PL is controlled. There is always water underneath.

When step-and-scan exposure is performed on wafer W on wafer stage WST, measurement stage MST stands by at a predetermined standby position where it does not collide (contact) with wafer stage WST.
The above exposure operation is performed based on the result of wafer alignment such as enhanced global alignment (EGA) performed in advance by the main controller 20 and the baseline measurement result of the latest alignment system ALG. Inter-shot moving operation in which wafer stage WST is moved to the scanning start position (acceleration start position) for exposure of each upper shot area, and the pattern formed on reticle R for each shot area are transferred by the scanning exposure method. This is performed by repeating the scanning exposure operation. The above exposure operation is performed in a state where water is held between the front lens 91 and the wafer W.

  Then, at the stage where the exposure to wafer W is completed on wafer stage WST side, main controller 20 controls Y-axis linear motor YLM2 and X-axis linear motor XLM2 to change measurement stage MST (measurement table MTB). The measurement table MTB is moved to a position where the + Y side surface of the measurement table MTB contacts the −Y side surface of the wafer table WTB. Note that the measurement table MTB and wafer table WTB may be separated from each other in the Y-axis direction by, for example, about 300 μm (a gap in which water does not leak due to surface tension) to maintain a non-contact state.

Next, main controller 20 drives both stages WST and MST in the + Y direction while maintaining the positional relationship between wafer table WTB and measurement table MTB in the Y-axis direction, leading lens 91 of projection unit PU and wafer W. As the wafer stage WST and measurement stage MST move to the + Y side, the water held between the wafer W and the wafer holder 70 is sequentially moved on the measurement table MTB. Thereby, it will be in the state where water was held between measurement stage MST and tip ball 91.
Thereafter, main controller 20 controls the driving of linear motors XLM1 and YLM1 to move wafer stage WST to a predetermined wafer exchange position and perform wafer exchange. At the same time, measurement stage MST is moved to the measurement stage MST. The predetermined measurement used (for example, baseline measurement of alignment system ALG performed after reticle replacement on reticle stage RST) is performed as necessary.

After that, main controller 20 drives wafer stages WST and MST simultaneously in the -Y direction while maintaining the positional relationship between wafer stage WST and measurement stage MST in the Y-axis direction, and wafer stage WST. After moving the (wafer) below the projection optical system PL, the measurement stage MST is retracted to a predetermined position.
Then, main controller 20 executes a step-and-scan exposure operation on a new wafer in the same manner as described above, and sequentially transfers the reticle pattern to a plurality of shot areas on the wafer.

  In the present embodiment, when the heat generated by driving the X-axis linear motors XLM1, XLM2 and the Y-axis linear motors YLM1, YLM2 is recovered (cooled), the stators 80, 81, the movers 82, 83, Even when a temperature change occurs in 84 and 85, air near the outer surface where the temperature has changed following the temperature change is sucked and collected, so that air fluctuations are caused by the temperature change and the measurement accuracy is lowered. It is possible to prevent thermal deformation of surrounding members / devices.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above-described embodiment, in any configuration of the moving magnet type linear motor and the moving coil type linear motor, the stator is provided with a suction hole for sucking air in which a temperature change has occurred. It is not limited to this, It is good also as a structure provided in a needle | mover or both a stator and a needle | mover.

  In the above embodiment, the arrangement pitch (arrangement interval) of the suction holes 106 and 106B (suction pipes) and the blowout holes 106A in the relative movement direction of the mover is made constant. However, the present invention is not limited to this. is not. If the distribution of the temperature change of the stator or the mover is known, it is also preferable to have a configuration in which more suction holes are arranged (closely) in the vicinity of the region where the temperature change amount is large. For example, in the linear motor XLM1 shown in FIG. 2, when the refrigerant flows in the coil jacket CJ parallel to the X-axis direction that is the moving direction of the mover 90, the −X side, which is the downstream side of the refrigerant, changes the temperature of the refrigerant. That is, the temperature change of the stator 80 increases. Therefore, in the tube body 101, the suction holes 106 may be arranged so that the interval between the adjacent suction holes becomes shorter on the downstream side (−X side) of the refrigerant.

The control of the main control device (control device) 20 is performed both when the suction holes are arranged at a constant arrangement interval and when the suction holes are arranged at an arrangement interval corresponding to the distribution of temperature changes of the stator and the mover. When the air suction operation / deactivation is selected for each suction hole, the suction operation of the suction hole may be switched according to the relative positional relationship between the coil unit and the magnet unit based on the exposure processing recipe. Specifically, when the mover 90 shown in FIG. 2 relatively moves in the vicinity of the central portion in the length direction of the stator 80, the main controller 20 determines the center portion according to the drive pattern of the mover 90. The air suction from the suction holes arranged in the vicinity may be operated, and the air suction from the suction holes arranged in other places may be stopped. When the mover 90 moves relatively on one end side of the stator 80 as in the case of performing exposure (edge exposure) on the peripheral portion of the wafer W, the main controller 20 moves the mover 90. Depending on the driving pattern, air suction from the suction holes arranged in the vicinity of the one end side may be operated, and air suction from the suction holes arranged in other locations may be stopped.
In this way, by controlling the air suction from the suction hole according to the relative positional relationship between the stator and the mover, efficient air suction can be achieved, and the drive power required for suction can be reduced. Can contribute.

Moreover, although the said embodiment demonstrated using the example of the three-phase motor, even if it is a single phase motor, if installation space can be ensured, it is applicable.
In each of the above embodiments, the refrigerant flows in the coil jacket that houses the coil unit in any case. However, the present invention is not limited to this. The present invention can also be applied to a linear motor.

  In the above embodiment, the stage apparatus 50 is configured to include both the wafer stage WST and the measurement stage MST. However, only the wafer stage WST may be configured. In the above-described embodiment, the exposure apparatus EX is configured to apply the present invention to the stage apparatus 50 on the wafer W side. However, the present invention can also be applied to a linear motor of the reticle stage RST on the reticle R side.

  The present invention can also be applied to a twin stage type exposure apparatus provided with a plurality of wafer stages. The structure and exposure operation of a twin stage type exposure apparatus are described in, for example, Japanese Patent Laid-Open Nos. 10-163099 and 10-214783 (corresponding US Pat. Nos. 6,341,007, 6,400,441, 6,549). , 269 and 6,590,634), JP 2000-505958 (corresponding US Pat. No. 5,969,441) or US Pat. No. 6,208,407. Furthermore, the present invention may be applied to the wafer stage disclosed in Japanese Patent Application No. 2004-168482 filed earlier by the present applicant.

  In addition, as a board | substrate hold | maintained at a moving stage in said each embodiment, it is used with not only the semiconductor wafer for semiconductor device manufacture but the glass substrate for display devices, the ceramic wafer for thin film magnetic heads, or exposure apparatus. A mask or reticle master (synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, a scanning exposure apparatus that does not use an immersion method, or a step-and-repeat method in which the pattern of the reticle R is collectively exposed while the reticle R and the wafer W are stationary, and the wafer W is sequentially moved stepwise. The present invention can also be applied to a projection exposure apparatus (stepper). The present invention can also be applied to a step-and-stitch type exposure apparatus that partially transfers at least two patterns on the wafer W. Furthermore, the present invention can also be applied to an exposure apparatus that exposes a pattern on the wafer W by projecting spot light by the projection optical system PL without using the mask M.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the wafer W, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

  When a linear motor (see USP5,623,853 or USP5,528,118) is used for wafer stage WST or reticle stage RST, either an air levitation type using air bearings or a magnetic levitation type using Lorentz force or reactance force is used. Also good. Each stage WST, RST may be a type that moves along a guide, or may be a guideless type that does not provide a guide.

  As a drive mechanism of each stage WST, RST, a planar motor that drives each stage WST, RST by electromagnetic force with a magnet unit having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil facing each other is provided. It may be used. In this case, one of the magnet unit and the armature unit may be connected to the stages WST and RST, and the other of the magnet unit and the armature unit may be provided on the moving surface side of the stages WST and RST.

As described in JP-A-8-166475 (USP 5,528,118), the reaction force generated by the movement of wafer stage WST is not transmitted to projection optical system PL, but mechanically using a frame member. You may escape to the floor (ground).
As described in JP-A-8-330224 (US S / N 08 / 416,558), a frame member is used so that the reaction force generated by the movement of the reticle stage RST is not transmitted to the projection optical system PL. May be mechanically released to the floor (ground).

  As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 14, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, exposure processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus 100 of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

FIG. 2 is a perspective view of a stage apparatus that constitutes an exposure apparatus, showing an embodiment of the present invention. It is a top view which shows schematic structure of the X-axis linear motor which concerns on this invention. It is sectional drawing of the same X-axis linear motor. It is a cross-sectional top view of the stator of the X-axis linear motor. It is a block diagram which shows the main structures of the control system of exposure apparatus. It is a figure which shows the relationship between the position of a coil jacket, and a temperature gradient. It is a top view which shows 2nd Embodiment of a linear motor. It is sectional drawing of the same linear motor. It is a top view which shows 3rd Embodiment of a linear motor. It is a fragmentary sectional view of the linear motor. It is a top view which shows 4th Embodiment of a linear motor. It is a top view which shows 5th Embodiment of a linear motor. 1 is a view showing an embodiment of the present invention, and is a schematic view showing an exposure apparatus. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device.

Explanation of symbols

C ... Coil body, CJ ... Coil jacket (accommodating member), EX ... Exposure apparatus, R ... Reticle (mask), XLM1 ... X-axis linear motor (linear motor), W ... Wafer (substrate), 1 ... Internal space (inside ), 20... Main control device (control device) 50... Stage device 76. Magnet (magnet generator) 80. Stator (coil unit) 80 a. Refrigerant supply port (supply unit) 82 and 83. (Coil unit), 86, 87 ... stator (magnet unit), 90 ... magnet unit (mover), 100 ... suction device, 106 ... suction hole (suction part), 106A ... outlet hole (outlet part)

Claims (11)

A linear motor having a magnet unit and a coil unit disposed opposite to each other, wherein the magnet unit and the coil unit move relatively;
A linear motor, comprising a suction unit that is provided along a direction in which the magnet unit and the coil unit move relative to each other and sucks air near an outer surface of the coil unit. The linear motor according to claim 1,
The linear motor according to claim 1, wherein a plurality of the suction portions are provided along the relative movement direction. The linear motor according to claim 1 or 2,
The coil unit has a coil body and a housing member that houses the coil body inside,
The linear motor according to claim 1, wherein the suction unit is provided outside the housing member and sucks air near an outer surface of the housing member. The linear motor according to claim 3,
The said coil unit is provided with the supply part which supplies the refrigerant | coolant which cools the said coil body to the inside of the said accommodating member, The linear motor characterized by the above-mentioned. The linear motor according to claim 4,
The supply unit supplies the refrigerant so that the refrigerant flows in the housing member in parallel with the relative movement direction,
The linear motor, wherein the plurality of suction portions are arranged such that an interval between the suction portions adjacent to each other is shortened on the downstream side of the refrigerant. In the linear motor according to any one of claims 1 to 5,
A linear motor comprising a control device that controls suction of the suction portion in accordance with a relative positional relationship between the coil unit and the magnet unit. The linear motor according to any one of claims 1 to 6,
The linear motor according to claim 1, wherein the suction unit is disposed outside a region where the coil unit faces the magnet unit. In the linear motor according to any one of claims 1 to 7,
A linear motor provided with a blow-out portion that is provided to face the suction portion and blows out gas toward the suction portion. The linear motor according to claim 1,
The magnet unit has a plurality of magnetism generators arranged along the relative movement direction,
The linear motor according to claim 1, wherein the attraction unit is provided between the plurality of magnetism generators.   10. A stage apparatus, wherein the linear motor according to claim 1 is used as a driving apparatus. In an exposure apparatus that exposes a pattern on a substrate using a stage device,
An exposure apparatus using the stage apparatus according to claim 10 as the stage apparatus.

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