JP2011114100A - Usage of thin body and method for adjusting characteristic impedance of wiring member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To connect a grounding line for a wiring member to a conductive part having a characteristic-impedance adjusting function in a layer configuring a thin body without the interposition of other conductive materials such as a conductive adhesive only by laminating the thin body on a wiring member, and to enable the accurate adjustment of characteristic impedance. <P>SOLUTION: In the thin body, a base-material sheet, a nonconductive pressure-sensitive adhesive layer, and a release sheet are laminated in order, a pattern-shaped conductive part including a number of openings with adjusted opening ratio is formed between the nonconductive pressure-sensitive adhesive layer and the release sheet and the release sheet is stuck in a releasable manner by a nonconductive pressure-sensitive adhesive so that a surface on the release-sheet side of the pattern-shaped conductive part is directly brought into contact with the release sheet. The characteristic impedance of the wiring member is adjusted by sticking the pattern-shaped conductive part and the grounding line so that they are electrically connected in the state releasing the release sheet for the thin body on the surface of the wiring member wiring a signal line and the grounding line by using the thin body. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to the use of thin leaves and a method for adjusting the characteristic impedance of a wiring member.

  The inventor previously laminated a base sheet, a non-conductive pressure-sensitive adhesive layer, and a release sheet in order, and a patterned conductive portion is formed between the non-conductive pressure-sensitive adhesive layer and the release sheet, and A method for producing a thin leaf body having an antistatic function, wherein the release sheet side surface of the patterned conductive portion is in direct contact with the release sheet, and the release sheet is adhered to the release sheet with a non-conductive adhesive. (Patent Documents 1 and 2).

JP 2008-75072 A JP 2008-106242 A JP 2006-24824 A

  The inventor paid attention to the fact that the thin-leaf body disclosed in Patent Documents 1 and 2 described above is exposed on the surface of the thin-leaf body in a state where the release sheet is peeled off. The present invention has been intensively studied and found that when this thin leaf is used for adjusting the characteristic impedance of the wiring member, a remarkable effect described later can be obtained, and the present invention has been achieved.

  In view of this, the present invention provides a conductive material for a conductive portion having a characteristic impedance adjustment function in a layer constituting the thin leaf body by simply laminating the thin leaf body on a wiring member that is an object of characteristic impedance adjustment. PROBLEM TO BE SOLVED: To provide a method for adjusting a characteristic impedance of a wiring member and a wiring member that can be connected to a ground line of a wiring member without using another conductive material such as an adhesive and enables accurate characteristic impedance adjustment. And

  Another object of the present invention is to provide use of a thin leaf body having a function of suppressing unwanted radiation and noise in addition to the above problems.

  Furthermore, the other subject of this invention becomes clear by the following description.

  The above problems are solved by the following inventions.

(Claim 1)
A base sheet, a non-conductive pressure-sensitive adhesive layer, and a release sheet are sequentially laminated, and a patterned conductive portion having a large number of openings with an adjusted opening ratio is provided between the non-conductive pressure-sensitive adhesive layer and the release sheet. A thin leaf body formed and adhered to the release sheet so as to be peelable by the non-conductive adhesive so that the surface of the patterned conductive portion on the release sheet side is in direct contact with the release sheet. The patterned conductive portion and the ground line are in an electrically connected state with the release sheet of the thin leaf body peeled off on the surface of the wiring member on which the signal line and the ground line are used. The use of a thin leaf body, wherein the characteristic impedance of the wiring member is adjusted by adhering in such a manner.

(Claim 2)
An electromagnetic wave suppression sheet having an electromagnetic wave suppression function, a non-conductive pressure-sensitive adhesive layer, and a release sheet are sequentially laminated, and a large number of openings with an adjusted opening ratio are provided between the non-conductive pressure-sensitive adhesive layer and the release sheet. The release sheet is adhered to the release sheet by the non-conductive pressure-sensitive adhesive so that a patterned conductive part is formed and the surface of the patterned conductive part on the release sheet side is in direct contact with the release sheet. In the state where the release sheet of the thin leaf body is peeled off on the surface of the wiring member on which the signal line and the ground line are wired, the patterned conductive portion and the ground wire are electrically connected to each other. Use of a thin leaf body characterized by adhering to a connected state to suppress electromagnetic waves of the wiring member and adjusting characteristic impedance.

(Claim 3)
A base sheet, a non-conductive pressure-sensitive adhesive layer, and a release sheet are sequentially laminated, and a patterned conductive portion having a large number of openings with an adjusted opening ratio is provided between the non-conductive pressure-sensitive adhesive layer and the release sheet. A thin leaf body formed and adhered to the release sheet so as to be peelable by the non-conductive adhesive so that the surface of the patterned conductive portion on the release sheet side is in direct contact with the release sheet. Using a method of adjusting the characteristic impedance of the wiring member in which the signal line and the ground line are wired,
Pull out a ground wiring that is electrically connected to the ground line outside the wiring member;
The thin leaf body from which the release sheet has been peeled is placed on the surface of the wiring member in a state in which the pattern-shaped conductive portion of the thin leaf body and the ground wiring drawn out of the wiring member are electrically connected. A method for adjusting the characteristic impedance of a wiring member, wherein the non-conductive adhesive layer is used for adhesion.

  According to the present invention, the thin leaf body is simply laminated on the wiring member that is the target of characteristic impedance adjustment, and the conductive portion having the characteristic impedance adjustment function in the layer constituting the thin leaf body is electrically conductive. It is possible to provide a method for adjusting the characteristic impedance of a wiring member and a wiring member that can be connected to the ground wire of the wiring member without using another conductive material such as an adhesive and enables accurate characteristic impedance adjustment. .

  Moreover, according to this invention, in addition to the said effect, the use of the thin body which also has a function to suppress unnecessary radiation and noise, and the characteristic impedance adjustment method of a wiring member can be provided.

Sectional view showing an example of thin leaf A plan view showing a pattern example of a patterned conductive portion Sectional view showing the method of adjusting the characteristic impedance of the signal cable by the thin leaf The figure which shows an example of the manufacturing method of a thin leaf body The figure which shows the other example of the manufacturing method of a thin body Cross section of impedance control film according to conventional example Sectional drawing which shows the adjustment method of characteristic impedance using the impedance control film which concerns on a prior art example

  Embodiments of the present invention will be described below.

  FIG. 1 is a cross-sectional view showing an example of a thin sheet used in the present invention. In FIG. 1, the thin sheet 1 is formed by laminating a base sheet 11, a non-conductive adhesive layer 12, and a release sheet 14 in this order. A pattern-like conductive portion 13 is formed between the non-conductive pressure-sensitive adhesive layer 12 and the release sheet 14.

  The thin leaf body 1 of the present invention has such a shape that the dimension in the thickness direction is extremely smaller than the dimension in the length and / or width direction, specifically, a film, a sheet, a tape, a ribbon, and A thin plate etc. can be illustrated preferably.

  As a material used for the base sheet 11, when the thin leaf body 1 is intended only for impedance adjustment, for example, cellophane, celluloid, synthetic paper, art paper, a retroreflective sheet, a polyethylene cloth, or a thermoplastic resin. Etc. can be used.

  Examples of the thermoplastic resin include high-pressure low-density polyethylene, high-density polyethylene, linear low-density polyethylene, ethylene-based polymers such as ethylene / vinyl acetate copolymer, or propylene / α-propylene mainly composed of polypropylene and propylene. A propylene polymer such as an olefin copolymer, or a thermoplastic resin such as polyvinyl chloride, polyester, polyamide, polyimide, or an acrylic resin can be used.

  Since the thin leaf body of the present invention is attached to the wiring member as an adherend with an adhesive, it can be easily and instantaneously bonded at room temperature, and as a result, deterioration of the wiring member as the adherend can be prevented. . Moreover, since the thin leaf body of this invention can be processed into arbitrary shapes in advance, it is economical. Furthermore, it has excellent heat resistance.

  The nonconductive pressure-sensitive adhesive layer 12 is laminated in contact with one surface of the base sheet 11. The pressure-sensitive adhesive used for the non-conductive pressure-sensitive adhesive layer 12 has tackiness at room temperature, and is different from that which exhibits an adhesive function by being cured by a curing treatment like an adhesive.

The pressure-sensitive adhesive used for the non-conductive pressure-sensitive adhesive layer 12 preferably has a storage elastic modulus measured using a dynamic viscoelasticity measuring device having a conical / disc-shaped measuring surface at a temperature of 23 ° C. and a frequency of 1 Hz. The range is from 10 ³ Pa to 10 ⁷ Pa, more preferably from 10 ⁴ Pa to 10 ⁶ Pa. If it is in said range, since an appropriate balance of adhesive force and cohesive force is maintained without adhesiveness becoming insufficient, it is preferable as a thin leaf body for impedance adjustment.

  The glass transition temperature of the pressure-sensitive adhesive used for the non-conductive pressure-sensitive adhesive layer 12 is preferably −20 ° C. or lower, more preferably −30 ° C. or lower. If the glass transition temperature is not more than this upper limit value, it has excellent adhesiveness and is easy to adhere to a wiring member, and thus is preferable as a thin leaf body for impedance adjustment.

  The weight average molecular weight of the pressure-sensitive adhesive used for the non-conductive pressure-sensitive adhesive layer 12 is preferably 50,000 or more, more preferably 150,000 to 1,500,000, and most preferably 200,000 to The range is 1,000,000. If this lower limit or more, since the adhesive strength and cohesive force of the obtained non-conductive pressure-sensitive adhesive layer has a good balance, it is preferable as a thin body for impedance adjustment, if below the upper limit, When coating the pressure-sensitive adhesive solution when forming the non-conductive pressure-sensitive adhesive layer, a suitable coating viscosity can be obtained without reducing the solid content so much, so that the non-conductive pressure-sensitive adhesive can be dried in a relatively short time. Since the layer can be formed and the amount of the organic solvent to be volatilized can be suppressed, it is preferable economically and environmentally hygienicly as a thin leaf body for impedance adjustment.

  That is, the thin leaf member 1 is not adhered and hardened by the non-conductive adhesive layer 12 to the wiring member that is the target of characteristic impedance adjustment, and thus the wiring member is a flexible case such as a signal cable. Even if there is, it does not impair its flexibility.

  Specific adhesives used for the non-conductive adhesive layer 12 include, for example, acrylic resin adhesives, rubber adhesives such as natural rubber and synthetic rubber, styrene-butadiene-styrene block copolymers, and styrene- Isoprene-styrene block copolymers and block copolymer adhesives such as hydrogenated products, ethylene-vinyl acetate copolymer adhesives, polyvinyl ether resin adhesives, silicone resin adhesives, etc. An acrylic resin-based pressure-sensitive adhesive that is excellent in durability and weather resistance and has little dirt during handling is preferably used. These pressure-sensitive adhesives may be used alone or in combination of two or more.

  As the acrylic resin adhesive, for example, an acrylic polymer obtained by polymerizing a carboxyl group-containing monomer and a (meth) acrylic acid alkyl ester monomer is used. The number of carbon atoms of the alkyl group of the (meth) acrylic acid alkyl ester monomer is preferably about 4 to 12, and specifically, n-butyl (meth) acrylate, isobutyl (meth) acrylate, n-octyl (meth) acrylate. , Isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isononyl (meth) acrylate, and the like. Examples of the carboxyl group-containing monomer include monocarboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, and itaconic acid; dicarboxylic acids such as fumaric acid and maleic acid, and monoesters thereof.

  The polymerization method of the acrylic resin-based pressure-sensitive adhesive is not particularly limited, and a known method such as solution polymerization, emulsion polymerization, suspension polymerization or the like can be adopted, but it is preferable to employ solution polymerization having excellent durability.

  In addition, the form of these pressure-sensitive adhesives is not particularly limited. For example, a solvent-type pressure-sensitive adhesive, an emulsion-type pressure-sensitive adhesive, a hot-melt-type pressure-sensitive adhesive, a reactive pressure-sensitive adhesive, a photopolymerizable monomer-type pressure-sensitive adhesive, etc. Either form may be sufficient. There is no restriction | limiting in a coating means and a drying method, A well-known method is employable.

  The non-conductive pressure-sensitive adhesive layer is preferably crosslinked with a crosslinking agent such as a polyvalent isocyanate compound, a polyvalent epoxy compound, an amino resin, or a polyvalent metal chelate compound in order to improve the cohesive force. Among these cross-linking agents, the use of polyisocyanate compound is used for impedance adjustment for reasons such as the pot life of the pressure-sensitive adhesive used for forming the non-conductive pressure-sensitive adhesive layer and the speed of the crosslinking speed. Preferred above.

  In addition, these pressure-sensitive adhesives may be provided with a tackifier, a coupling agent, a filler, a softener, a plasticizer within the range that does not impair the object or purpose of the present invention, in particular, the range that does not impair flexibility. Agent, surfactant, antioxidant (anti-aging agent), heat stabilizer, light stabilizer, ultraviolet absorber, colorant, antifoaming agent, flame retardant, antistatic agent (metal powder such as copper powder, nickel powder) 1 type, or 2 or more types of additives such as carbon (excluding conductive fillers such as carbon) may be added.

  However, in the present invention, the non-conductive pressure-sensitive adhesive layer 12 does not require conductivity. Therefore, a conductive filler such as a metal powder such as copper powder or nickel powder or carbon is not added to the non-conductive pressure-sensitive adhesive layer 12. These impair flexibility and cause variation in characteristic impedance due to non-uniformity of the conductive filler. By not having the layer in which the conductive filler is dispersed in the thin leaf body 1, there is no possibility of causing variation in characteristic impedance due to non-uniformity of the conductive filler, and the aperture ratio of the patterned conductive portion 13 to be described later is increased. By adjusting appropriately, the characteristic impedance can be adjusted accurately.

  As a method for forming the non-conductive pressure-sensitive adhesive layer 12, a conventionally known method such as application of a pressure-sensitive adhesive can be appropriately employed. The thickness of the non-conductive pressure-sensitive adhesive layer 12 is not particularly limited, but is preferably 1 μm to 0.5 mm, more preferably 10 to 200 μm. If the thickness of the non-conductive pressure-sensitive adhesive layer 12 is less than 1 μm, the adhesion to the wiring member and the unevenness followability are insufficient, which is not preferable for maintaining the flexibility of the impedance adjustment thin body, and conversely the thickness is 0. If the thickness exceeds 0.5 mm, the adhesive force is no longer improved, but the cost becomes high.

  When the thin leaf member 1 is laminated on the wiring member whose characteristic impedance is to be adjusted, the pattern-like conductive portion 13 is electrically connected to the ground line of the wiring member and maintained at the ground potential, thereby the wiring member. The characteristic impedance is defined by the capacitance between the signal line and the characteristic impedance, and the characteristic impedance is adjusted. The non-conductive adhesive layer 12 is exposed to the surface opposite to the surface in contact with the base material sheet 11. Is provided.

  Examples of the conductive material used for the patterned conductive portion 13 include metals such as copper, silver, nickel, aluminum, and stainless steel; metal oxides such as conductive zinc oxide, conductive indium oxide, conductive titanium oxide, and conductive tin oxide. A conductive carbon such as acetylene black, oil furnace black, thermal black, graphite, and carbon nanotube; a conductive polymer such as polypyrrole and polyaniline, etc., or a combination of two or more of them can be used. Among these, silver, copper, aluminum, and the like are preferable in terms of excellent conductivity and flexibility.

  The pattern-like conductive part 13 is a conductive part having a large number of openings and formed in a pattern. The pattern-like conductive portion 13 is formed in a continuous layer shape on the surface of the non-conductive pressure-sensitive adhesive layer 12. The continuous layer shape means that a portion where the pattern-like conductive portion 13 is continuous from one end to the other end of the non-conductive pressure-sensitive adhesive layer 12 exists in a layer shape (in the drawing, a line shape). It means that the non-conductive pressure-sensitive adhesive layer 12 is electrically connected from one end to the other end. Therefore, a discontinuous and discontinuous pattern such as a dot-like pattern is not included.

  Moreover, an opening part is a site | part used as the nonelectroconductive part in the layer of the pattern-like electroconductive part 13, and is a site | part which the nonelectroconductive adhesive layer 12 is exposed to the inside in this invention.

  An example of the pattern-like conductive portion 13 is shown in FIGS. 2A to 2C as a plan view. In the figure, reference numeral 13a denotes an opening serving as a non-conductive portion.

  FIG. 2A shows an example in which a pattern having a lattice shape is formed, and an opening 13a having a rectangular shape is formed by a pattern-shaped conductive portion 13 formed by straight lines intersecting the lattice.

  FIG. 2B shows an example in which a hexagonal honeycomb pattern is formed, and a hexagonal opening 13a is formed by a pattern-shaped conductive portion 13 made of lines forming a continuous honeycomb shape. .

  FIG. 2C is an example in which the pattern is formed into a round shape, and a circular opening 13 a is partially formed in the patterned conductive portion 13 on one surface.

  The pattern-like conductive portion 13 is preferable because the distribution of the openings 13a is almost uniform, the shape is simple, and the shape is easy to form, since the characteristic impedance is uniform and the manufacture is easy. Is merely an example of the pattern-shaped conductive portion 13 and may be any conductive portion that has a large number of openings and is formed in a pattern, and is not limited thereto.

  The thickness of the layer to be the patterned conductive portion 13 is preferably in the range of 0.1 to 100 μm, and more preferably in the range of 0.3 to 20 μm, from the viewpoint of maintaining flexibility as the impedance adjustment thin leaf body.

  In the thin leaf body 1 shown in FIG. 1, the patterned conductive portion 13 is formed so as to be embedded in the surface of the non-conductive pressure-sensitive adhesive layer 12 (the surface opposite to the base sheet 11), and is formed in the opening 13 a. Is filled with non-conductive adhesive. For this reason, the pattern-shaped electroconductive part 13 becomes the form exposed on the surface of the side which contacts the peeling sheet 14 of the nonelectroconductive adhesive layer 12 on the same surface.

  Such a patterned conductive portion 13 can be formed by pattern printing using a printing ink containing the conductive material, which is a preferred mode. As the pattern printing method, for example, flexographic printing, gravure printing, screen printing, offset printing, inkjet printing, or the like can be used.

  The release sheet 14 is laminated so as to be in contact with the surface exposed from the nonconductive pressure-sensitive adhesive layer 12 of the patterned conductive portion 13. Specifically, the release sheet 14 directly contacts the non-conductive pressure-sensitive adhesive layer 12 through the opening 13a in the layer of the patterned conductive part 13 so as to be peelable, thereby the release sheet 14 side of the patterned conductive part 13 It is laminated so as to be in direct contact with the surface.

  As the release sheet 14, polyethylene laminated paper, kraft paper, high-quality paper, glassine paper, polyvinyl chloride film, polyester film, etc. that are generally used for that purpose can be used, and overlap with the non-conductive pressure-sensitive adhesive layer 12. The surface is subjected to peeling treatment such as silicon treatment.

  The thin leaf body 1 having the pattern-like conductive portion 13 formed so as to have a desired aperture ratio is obtained by peeling the release sheet 14 and then sticking it to a wiring member to be subjected to characteristic impedance adjustment. It adheres with the agent layer 12. The wiring member in the present invention is preferably a flexible signal cable, but is not limited thereto, and can be used for all wiring members that require adjustment of characteristic impedance and capacitance.

  The usage mode of the thin leaf member 1 includes not only simply laminating the wiring member so as to be laminated in a layered manner, but also a mode of winding around the wiring member.

  Hereinafter, the example applied to the flexible flat cable (henceforth "FFC") as a wiring member is demonstrated.

  FIG. 3 is a cross-sectional view showing a state in which the release sheet 14 of the thin leaf body 1 is peeled and laminated on the FFC 3.

  The FFC 3 is obtained by sequentially providing a wiring layer 32 and an insulating layer 33 on a base film 31, and the wiring layer 32 has a signal line 32a and a ground line 32b. When laminating the thin body 1, first, the wiring 33 b electrically connected to the ground line 32 b is drawn to the surface of the insulating layer 33 (lamination surface of the thin body 1). The wiring 33b drawn out in this way can be formed by forming a through hole in the insulating layer 33 and filling the through hole with a conductive material such as a conductive paste. Alternatively, a through hole may be formed in the insulating layer 33, and a wiring electrically connected to the ground line 32b through the through hole may be drawn to the surface of the insulating layer 33. In addition, the other end of the wiring whose one end is electrically connected to the ground line 32b does not pass through the insulating layer 33, for example, is led out to the surface of the insulating layer 33 through one end of the FFC 3. Also good.

  The state where the patterned conductive portion 13 of the thin leaf body 1 from which the release sheet 14 has been peeled is electrically connected to the wiring 33b drawn to the surface of the insulating layer 33 with respect to the surface of the insulating layer 33 of the FFC 3 Thus, the impedance control cable 4 is obtained by adhering with the non-conductive pressure-sensitive adhesive layer 12 through the opening 13a and pasting and integrating them. As a result, the patterned conductive portion 13 of the thin leaf body 1 is maintained at the ground potential by the ground line 32b, and the pattern-shaped conductive portion 13 has a preliminarily adjusted aperture ratio so that the signal line 32a and the patterned conductive portion 13 can be connected to each other. The capacitance is determined and the characteristic impedance is adjusted.

  By the way, an ordinary thin leaf body having a pressure-sensitive adhesive layer or an adhesive layer on its surface entrains air when sticking to the adherend member, and bubbles are partially formed between the thin leaf body and the adherend member. easy. Further, even when bubbles are not formed at the time of pasting, the thin leaf body or the adherend member deteriorates due to long-term use and generates gas, and gas bubbles are formed between the thin leaf body and the adherend member. In some cases. Since the air bubbles formed in this way are surrounded by an adhesive part or an adhesive part, they are held between the thin leaf body and the adherend member.

  On the other hand, according to the present invention, in a state where the thin leaf body 1 is attached to the wiring member, a region where the adhesive portion is not formed is formed on the contact surface between the pattern-like conductive portion 13 and the wiring member. Therefore, the air entrained at the time of pasting or the gas generated by the deterioration is released to the outside through this region, and the formation of bubbles between the thin leaf body and the wiring member is prevented.

  The present inventor pays attention to such a function of releasing air or gas, and intensively studies the use of the thin leaf body 1 that can effectively exhibit this function, and finds that a remarkable effect can be obtained in the use of characteristic impedance adjustment. This has led to the present invention.

  That is, in the application of characteristic impedance adjustment, the value of the specific impedance to be adjusted is determined by the capacitance between the signal line and the patterned conductive surface. It is greatly influenced by the distance between the parts and the electrochemical properties (dielectric constant, etc.) of the substances intervening there.

  That is, when bubbles are partially formed between the thin leaf and the wiring member as in the case where the general thin leaf is pasted, the distance between the signal line and the pattern-shaped conductive portion In addition, the dielectric constant becomes non-uniform due to the partial interposition of air or gas having a dielectric constant different from that of the adhesive. As a result, the capacitance cannot be controlled, and the accurate characteristic impedance is reduced. Although adjustment cannot be performed, according to the present invention, formation of bubbles between the thin leaf body and the wiring member is prevented, so that non-uniform elements are excluded and the aperture ratio of the pattern-shaped conductive portion is set appropriately. By doing so, it is possible to accurately adjust the characteristic impedance.

  Conventionally, Patent Document 3 discloses an impedance control film used for controlling the characteristic impedance of the signal wiring of the wiring board. Therefore, by contrasting the characteristic impedance adjustment method using the thin leaf body of the present invention described above with the characteristic impedance adjustment method using the impedance control film described in Patent Document 3, the present invention further stands out. The effect will be described in detail.

  First, FIG. 6 is a cross-sectional view of an impedance control film according to Patent Document 3. The impedance control film 100 is obtained by sequentially providing an insulating film 101, a patterned conductive portion 102, and a conductive adhesive layer 103.

  FIG. 7 shows a method for adjusting the characteristic impedance of the signal cable 400 using the impedance control film 100.

  In the signal cable 400, a wiring layer 402 and an insulating layer 403 are sequentially provided on a base film 401. The wiring layer 402 includes a signal line 402a and a ground line 402b. In order to adjust the characteristic impedance of the signal cable 400 using the impedance control film 400, the non-insulating portion 403a is formed in a part of the insulating layer 403 on the ground line 402b of the signal cable 400 so that the ground line 402b is exposed. In addition, the impedance control film 100 is covered on the insulating layer 403 of the signal cable 400, and the conductive adhesive layer 103 is filled in the non-insulating portion 403a and heated and pressed so as to be in contact with the ground wire 402b. To do.

  As a result, the patterned conductive portion 102 of the impedance control film 100 is connected to the ground line 402b of the signal cable 400 via the conductive adhesive layer 103 and kept at the ground potential, and the patterned conductive portion 102 and the signal line 402a. The characteristic impedance is defined by the capacitance between and. Therefore, the characteristic impedance can be adjusted by appropriately adjusting the aperture ratio of the opening of the patterned conductive portion 102.

  This conventional impedance control film 100 has a layer structure in which the pattern-like conductive portion 102 is sandwiched between the insulating film 101 and the conductive adhesive layer 103 and is not exposed on the surface. In order to electrically connect the patterned conductive portion 102 to the 400 ground lines 402b, the conductive adhesive layer 103 must be used. However, since the conductive adhesive 103 generally contains a conductive filler such as metal powder (copper powder, nickel powder, etc.) and carbon in the adhesive, the adhesive layer is inferior in flexibility and bendability and is bent. If it is attached to a cable, harness or electric wire, it may crack or become rigid, and there is a problem that it cannot be used especially when the wiring member to be adjusted is flexible such as a signal cable. It was. In contrast, in the present invention, the thin leaf body 1 is in direct contact with the electrical connection with the ground wire because the patterned conductive portion 13 is exposed on the surface of the thin leaf body with the release sheet 14 peeled off. In addition, the non-conductive pressure-sensitive adhesive layer 12 can adhere to the wiring member through the opening 13a and can be attached and integrated. Therefore, there is no need to provide a conductive adhesive layer that is inferior in flexibility and bendability as in Patent Document 3, and it is excellent in flexibility and may crack or become rigid even if it is attached to a bent portion, harness or electric wire. This is particularly suitable when the wiring member to be adjusted is a flexible member requiring flexibility such as a signal cable.

  In addition, the characteristic impedance value adjusted by the conventional impedance control film 100 is influenced not only by the pattern-like conductive portion 102 but also by the conductive adhesive 103. However, the conductive adhesive layer 103 can define the characteristic impedance with a certain degree of stability if the conductive filler is uniformly dispersed in the adhesive, but it is difficult to uniformly disperse, and there is a limit. is there. Therefore, the adjustment of the characteristic impedance includes an error and lacks accuracy, and there is a problem that it is difficult to accurately adjust to a desired characteristic impedance. On the other hand, in the present invention, the thin leaf body 1 is exposed to the wiring member, which is the target of characteristic impedance adjustment, because the patterned conductive portion 13 is exposed on the thin leaf body surface with the release sheet 14 peeled off. For the patterned conductive portion 13 having a characteristic impedance adjusting function in the layer constituting the thin leaf body 1 only by being laminated, the ground of the wiring member is not interposed through another conductive material such as a conductive adhesive. Since it is not necessary to consider the conductive characteristics that can be connected to the line and the conductive adhesive tends to be non-uniform, it is possible to accurately adjust the characteristic impedance.

  Furthermore, in the conventional impedance control film 100, the patterned conductive portion 102 is embedded in the conductive adhesive 103 and is not exposed on the surface of the conductive adhesive 103. The air or gas discharge function cannot be achieved, and air bubbles are formed between the impedance control film 100 and the signal cable 400, which makes it difficult to accurately adjust the desired characteristic impedance.

  By the way, the patterned conductive portion 13 has a certain electromagnetic wave suppressing function by itself, but as the aperture ratio is increased, the electromagnetic wave suppressing function is lowered, and the shielding effect against unwanted radiation and the shielding effect against noise are lowered. . On the other hand, in this invention, the base material sheet 11 is made into the electromagnetic wave suppression sheet | seat which has an electromagnetic wave suppression function, and can improve the shielding effect with respect to such unnecessary radiation and the shielding effect with respect to noise.

  As the electromagnetic wave suppression sheet, a resin in which a conductive filler is contained in the resin to be the base sheet 11, a metal thin film formed on the surface of the base sheet 11 by vapor deposition, sputter coating, or plating can be preferably used. .

As the conductive filler, metal particle powder and / or powder of conductive material is used. As the metal particle powder, one or more alloys selected from aluminum, copper, nickel, silver, zinc, tin, chromium, gold, platinum, iron, cobalt, zirconium, molybdenum, titanium, halides, complexes Among them, magnetite (Fe ₃ O ₄ ), which is magnetic powder, and an alloy such as Fe—Si—Al and Fe ₃ Si are preferable. An example of the conductive powder is carbon black.

  In addition, such an electromagnetic wave suppression sheet includes “Metal Bee 1010”, “Metal Bee 1050”, “8400” and “8421” manufactured by Komatsu Seiren Co., Ltd. "R4N", "Bustaleido FK2" and "Bustaraido EFR", "Flexshield IRJ17", "FlexShield IRJ09", "FlexShield IRJ04", "Flexshield IFL10M" and "FlexShield IRE02" manufactured by TDK, Daido Steel “DPR-HV”, “DPR-HTV”, “DPR-SPV”, “DPR-MF3”, “DPR-H”, “DPR-HT”, “DPR-HN” and “DPR-NRC” Commercial products such as these can also be used.

  The impedance control thin leaf body of the present invention is provided with an electromagnetic wave suppression function, so that in addition to a characteristic impedance adjustment function, an electromagnetic wave suppression function, for example, shielding electromagnetic waves to suppress noise and / or suppressing unnecessary radiation. Can have functions.

  The conventional impedance control film 100 shown in FIG. 6 has a structure in which the pattern-like conductive portion 102 is in direct contact with the insulating film 101. Therefore, in order to provide an electromagnetic wave suppressing function, a separate layer from the insulating film 101 is used. In addition, a layer having an electromagnetic wave suppression function must be separately laminated on the surface, the layer structure increases, further hinders flexibility, prevents lightness and shortening, and complicates the layer structure. Therefore, there is also a problem of reducing productivity.

  However, in the present invention, the thin leaf body makes the base sheet 11 have an electromagnetic wave suppressing function by making the non-conductive pressure-sensitive adhesive layer 12 to which the base sheet 11 is stuck, thereby suppressing the electromagnetic wave. The sheet also has little influence on the adjustment of the characteristic impedance, and in addition to the above-described effect that allows the characteristic impedance to be adjusted accurately, the effect of shielding unwanted radiation and the effect of shielding noise can be enhanced.

  According to the use for adjusting the characteristic impedance of the thin leaf body 1 and the method for adjusting the characteristic impedance of the wiring member according to the present invention, the peeling sheet 14 of the thin leaf body 1 is peeled, and the pattern-like conductive portion 13 is connected to the ground wire of the wiring member. Since it is only necessary to affix to the wiring member by the non-conductive adhesive layer 12 in an electrically connected state, the number of steps for manufacturing the wiring member capable of adjusting the characteristic impedance can be greatly reduced. High productivity can be obtained.

  The thin leaf body may be in the form of a wound body wound in a roll shape on the outer periphery of the core. In that case, a peeling sheet can be shared by the thin-leaf base material sheet | seat distribute | arranged to the inner periphery or outer periphery. A peeling treatment is performed on the surface of such a base sheet. By adopting such a form of a wound body, it is excellent in handleability and is also suitable for productivity, particularly continuous production.

  Next, an example of the manufacturing method of the thin leaf body 1 is demonstrated based on FIG.

  First, the release sheet 14 is prepared (FIG. 4A), and the pattern-like conductive portion 13 is printed on the release sheet 14 in a continuous layer pattern by printing (FIG. 4B). After pattern printing, on the release sheet 14 and the non-adhesive patterned conductive portion 13 layer, the non-conductive adhesive is coated and dried while wrapping the patterned conductive portion 13, and the non-conductive adhesive The layer 12 is formed (FIG. 4C). The surface of the patterned conductive portion 13 is formed in the same plane as the surface of the non-conductive pressure-sensitive adhesive layer 12. Thereafter, the base sheet 11 is pressure-bonded to the surface of the non-conductive pressure-sensitive adhesive layer 12 opposite to the pattern-shaped conductive portion 13 and bonded to form the thin leaf body 1 (FIG. 4D).

  Another manufacturing method will be described with reference to FIG.

  As shown in the figure, a laminate is prepared in which a base sheet 11 and a release sheet 14 are bonded together with a non-conductive pressure-sensitive adhesive layer 12 interposed therebetween (FIG. 5 (a)). The release sheet 14 is peeled off from the pressure-sensitive adhesive layer 12 (FIG. 5B), and then the pattern-shaped conductive portion 13 is placed on the surface of the non-conductive pressure-sensitive adhesive layer 12 from which the release sheet 14 has been peeled off. Pattern printing is performed from the surface (FIG. 5C). At this time, the patterned conductive portion 13 is provided in a convex shape on the surface of the non-conductive pressure-sensitive adhesive layer 12.

  Next, the release sheet 14 is pressure-bonded again to the surface of the non-conductive pressure-sensitive adhesive layer 12 on which the patterned conductive portion 13 is formed. The pattern-like conductive portion 13 is provided in a state of protruding from the non-conductive pressure-sensitive adhesive layer 12, but the non-conductive pressure-sensitive adhesive layer 12 is configured in the opening portion 13 a by the pressure-bonding of the release sheet 14. The non-conductive pressure sensitive adhesive is distorted in the direction of the release sheet 14, and the opening 13a is filled with the non-conductive pressure sensitive adhesive. For this reason, the release sheet 14 is made to be the non-conductive pressure-sensitive adhesive layer 12 through the opening 13a, and is attached so as to be in direct contact with the surface of the pattern-like conductive part 13 (FIG. 5 (d)). .

Example 1
<Preparation of non-conductive adhesive>
To 100 parts by weight (solid content) of a copolymer based on 2-ethylhexyl acrylate (“Sybinol AT-D52” manufactured by Seiden Chemical), an isocyanate-based curing agent (“Coronate L” manufactured by Nippon Polyurethane Industry) ) Was blended and kneaded to prepare a non-conductive non-conductive pressure-sensitive adhesive.

<Preparation of printing ink>
To 80 parts by weight of silver powder, 2.0 parts by weight of polyester resin, 2.0 parts by weight of rosin resin, 7.5 parts by weight of diethylene glycol ethyl ether acetate, 7.0 parts by weight of carbitol acetate are added. And kneading using a three-roll mill. Further, 0.5 parts by weight of bismuth oxide powder was added to produce a printing ink (silver powder content: about 80% by weight). The viscosity of this ink was 40,000 mPa · S, and the surface resistance of the dry ink was 1.0 × 10 ⁻² Ω.

<Production of thin leaf body>
The figure in which the above-mentioned printing ink is used on the release-treated surface of a release sheet made of a polyester resin (Unitika “Embret SC-38R”), and the aperture ratio (area of metal portion / total area × 100) is 91.6%. A grid-shaped patterned conductive portion (line width: 0.3 mm, pitch: 7 mm) shown in 2 (a) was formed by screen printing. The thickness after drying was about 3 μm.

  Next, the said nonelectroconductive adhesive was apply | coated to the peeling process surface of a peeling sheet (solid content reference | standard coating thickness 15 micrometers). After drying with a circulation dryer at 100 ° C. for 1 minute, a polyester film (thickness 9 μm) was bonded as a base sheet and crosslinked for 7 days under the conditions of 23 ° C. and 65% RH to obtain a thin leaf body.

  The thin sheet release sheet obtained was peeled off, and a 20-core flat cable (Oki Electric Cable “UL2651FRX”: hereinafter simply referred to as a flat cable) from which the ground wire was pulled out was used as a ground wire. An impedance control cable was obtained by pasting in an electrically connected state.

  Although the characteristic impedance of the flat cable alone was 70Ω, the characteristic impedance of the impedance control cable with the thin leaf attached was 100Ω, and it was confirmed that the characteristic impedance was adjusted by attaching the thin leaf.

  Moreover, when the shield characteristic of the impedance control cable with the thin leaf attached was measured at 1 GHz according to the copper pipe method, it was 0.5 [dB].

(Example 2)
Example 1 except that a polyester film surface of a copper vapor-deposited polyester film (polyester film thickness 6 μm, copper vapor deposition thickness 1 μm), which is an electromagnetic wave suppression sheet, was bonded in place of the polyester film (thickness 9 μm) which is a base sheet. In the same manner, an impedance control cable was obtained.

  The characteristic impedance of the impedance control cable with the thin leaf attached was 100Ω, and it was confirmed that the characteristic impedance was adjusted by attaching the thin leaf.

  Moreover, when the shield characteristic of the impedance control cable with the thin leaf attached was measured at 1 GHz according to the copper pipe method, it was 65 [dB]. Compared to the shield characteristics of Example 1, it can be seen that the electromagnetic wave suppression is achieved.

(Example 3)
Impedance control is performed in the same manner as in Example 1 except that the non-conductive surface of “Metal Bee 1010” (manufactured by Komatsu Seiren), which is an electromagnetic wave suppression sheet, is bonded instead of the polyester film (thickness 9 μm) as the base sheet. Got the cable.

  The characteristic impedance of the impedance control cable with the thin leaf attached was 100Ω, and it was confirmed that the characteristic impedance was adjusted by attaching the thin leaf.

  Moreover, when the shield characteristic of the impedance control cable with the thin leaf attached was measured at 1 GHz according to the copper pipe method, it was 78 [dB]. Compared to the shield characteristics of Example 1, it can be seen that the electromagnetic wave suppression is achieved.

Example 4
An impedance control cable was obtained in the same manner as in Example 1 except that “noise suppression sheet 8400” (manufactured by Komatsu Seiren), which is an electromagnetic wave suppression sheet, was used instead of the polyester film (thickness 9 μm) which was the base material sheet. It was.

  The characteristic impedance of the impedance control cable with the thin leaf attached was 100Ω, and it was confirmed that the characteristic impedance was adjusted by attaching the thin leaf.

  Moreover, when the shield characteristic of the impedance control cable with the thin leaf attached was measured at 1 GHz according to the copper pipe method, it was 23 [dB]. Compared to the shield characteristics of Example 1, it can be seen that the electromagnetic wave suppression is achieved.

1: Thin leaf body 11: Substrate sheet 12: Non-conductive adhesive layer 13: Patterned conductive portion 13a: Opening portion 14: Release sheet 3: Flexible flat cable (FFC)
4: Impedance control cable

Claims (3)

  A base sheet, a non-conductive pressure-sensitive adhesive layer, and a release sheet are sequentially laminated, and a patterned conductive portion having a large number of openings with an adjusted opening ratio is provided between the non-conductive pressure-sensitive adhesive layer and the release sheet. A thin leaf body formed and adhered to the release sheet so as to be peelable by the non-conductive adhesive so that the surface of the patterned conductive portion on the release sheet side is in direct contact with the release sheet. The patterned conductive portion and the ground line are in an electrically connected state with the release sheet of the thin leaf body peeled off on the surface of the wiring member on which the signal line and the ground line are used. The use of a thin leaf body, wherein the characteristic impedance of the wiring member is adjusted by adhering in such a manner.   An electromagnetic wave suppression sheet having an electromagnetic wave suppression function, a non-conductive pressure-sensitive adhesive layer, and a release sheet are sequentially laminated, and a large number of openings with an adjusted opening ratio are provided between the non-conductive pressure-sensitive adhesive layer and the release sheet. The release sheet is adhered to the release sheet by the non-conductive pressure-sensitive adhesive so that a patterned conductive part is formed and the surface of the patterned conductive part on the release sheet side is in direct contact with the release sheet. In the state where the release sheet of the thin leaf body is peeled off on the surface of the wiring member on which the signal line and the ground line are wired, the patterned conductive portion and the ground wire are electrically connected to each other. Use of a thin leaf body characterized by adhering to a connected state to suppress electromagnetic waves of the wiring member and adjusting characteristic impedance. A base sheet, a non-conductive pressure-sensitive adhesive layer, and a release sheet are sequentially laminated, and a patterned conductive portion having a large number of openings with an adjusted opening ratio is provided between the non-conductive pressure-sensitive adhesive layer and the release sheet. A thin leaf body formed and adhered to the release sheet so as to be peelable by the non-conductive adhesive so that the surface of the patterned conductive portion on the release sheet side is in direct contact with the release sheet. Using a method of adjusting the characteristic impedance of the wiring member in which the signal line and the ground line are wired,
Pull out a ground wiring that is electrically connected to the ground line outside the wiring member;
The thin leaf body from which the release sheet has been peeled is placed on the surface of the wiring member in a state in which the pattern-shaped conductive portion of the thin leaf body and the ground wiring drawn out of the wiring member are electrically connected. A method for adjusting the characteristic impedance of a wiring member, wherein the non-conductive adhesive layer is used for adhesion.

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