JP2011108948A5 - - Google Patents

Download PDF

Info

Publication number
JP2011108948A5
JP2011108948A5 JP2009264314A JP2009264314A JP2011108948A5 JP 2011108948 A5 JP2011108948 A5 JP 2011108948A5 JP 2009264314 A JP2009264314 A JP 2009264314A JP 2009264314 A JP2009264314 A JP 2009264314A JP 2011108948 A5 JP2011108948 A5 JP 2011108948A5
Authority
JP
Japan
Prior art keywords
silicon
resin layer
adhesive material
elastic resin
material supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009264314A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011108948A (ja
JP5500954B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009264314A priority Critical patent/JP5500954B2/ja
Priority claimed from JP2009264314A external-priority patent/JP5500954B2/ja
Publication of JP2011108948A publication Critical patent/JP2011108948A/ja
Publication of JP2011108948A5 publication Critical patent/JP2011108948A5/ja
Application granted granted Critical
Publication of JP5500954B2 publication Critical patent/JP5500954B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009264314A 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法 Active JP5500954B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009264314A JP5500954B2 (ja) 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009264314A JP5500954B2 (ja) 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2011108948A JP2011108948A (ja) 2011-06-02
JP2011108948A5 true JP2011108948A5 (https=) 2012-10-04
JP5500954B2 JP5500954B2 (ja) 2014-05-21

Family

ID=44232099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009264314A Active JP5500954B2 (ja) 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP5500954B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6088789B2 (ja) * 2012-10-26 2017-03-01 新光電気工業株式会社 粘着材供給装置及びその製造方法
KR102060831B1 (ko) 2013-02-27 2019-12-30 삼성전자주식회사 플립 칩 패키징 방법, 그리고 상기 플립 칩 패키징 방법에 적용되는 플럭스 헤드 및 그 제조 방법
KR101575641B1 (ko) 2014-04-21 2015-12-08 주식회사 루멘스 솔더 패터닝 시스템 및 솔더 패터닝 방법
WO2021194093A1 (ko) * 2020-03-27 2021-09-30 (주) 에스에스피 탄성패드를 이용한 플럭스툴
KR102206228B1 (ko) * 2020-03-27 2021-01-22 (주)에스에스피 탄성패드를 이용한 플럭스툴
JP7698537B2 (ja) * 2021-09-22 2025-06-25 ファスフォードテクノロジ株式会社 ディッピング装置、ダイボンディング装置および半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0720383Y2 (ja) * 1987-07-21 1995-05-15 株式会社明電舎 水車ガイドベ−ンの異常検出装置
JP2001135925A (ja) * 1999-11-04 2001-05-18 Nec Corp フラックス供給装置及び供給方法
JP2004047874A (ja) * 2002-07-15 2004-02-12 Nec Semiconductors Kyushu Ltd フラックス転写装置
JP4653787B2 (ja) * 2007-08-08 2011-03-16 株式会社東芝 複製スタンパおよびその製造方法

Similar Documents

Publication Publication Date Title
JP2011108948A5 (https=)
JP2013080813A5 (https=)
JP2006013454A5 (https=)
JP2009537970A5 (https=)
JP2009505424A5 (https=)
WO2002071150A3 (en) Lithographic template
JP2009130104A5 (https=)
JP2008529273A5 (https=)
JP2011515862A5 (https=)
JP2007150275A5 (https=)
JP2010523378A5 (https=)
JP2009529244A5 (https=)
JP2014120767A (ja) 半導体デバイスパッケージにおいて使用する基板の金属製コンタクトバンプにグラフェンシートを転写する方法
CN110349912A (zh) 一种用于通过转印将半导体组件耦合到目标衬底的方法
JP2017092411A5 (https=)
JP2015165533A5 (https=)
CN103337566A (zh) 一种图形化衬底制作方法
JP2008500727A5 (https=)
KR20150126218A (ko) 마스터 몰드 제조 방법
JP2014228708A5 (https=)
JP2009525898A5 (https=)
JP2010142972A5 (https=)
CN105655282A (zh) 用于半导体管芯的共同接合的卡盘
TWI559827B (zh) 可撓式電子模組及其製造方法
US9955584B2 (en) Stamp for printed circuit process and method of fabricating the same and printed circuit process