JP2011107413A - Actuator, drive module, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an actuator which can suppress cutting of a shape memory alloy wire, and to provide a drive module and electronic equipment. <P>SOLUTION: The actuator includes: a body to be driven; a supporting body supporting the body to be driven; and a driving means moving the body to be driven along a fixed direction with respect to the supporting body. The drive means includes: a shape memory alloy wire engaged with the engagement part of the body to be driven and moving the body to be driven by being shrunk owing to heat generation upon energizing; and holding terminals 15A, 15B holding both the edge parts of the shape memory alloy wire. In the actuator where the holding terminals are supported by the supporting body and fixed to it, holding parts 15b holding the shape memory alloy wire between them are formed at the holding terminals, and curved surface parts 63 are formed at the holding parts in such a manner that each side face 61 on the side in which the shape memory shape alloy wire in the holding part is extended and the shape memory alloy wire are not brought into contact with each other. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an actuator, a drive module, and an electronic device. For example, the present invention relates to an actuator that adjusts a focal position by driving an optical system and a movable member, a drive module, and an electronic apparatus using them.

Conventionally, in a small electronic device such as a mobile phone with a camera function, as an actuator for driving a driven body such as an imaging lens unit, driving that drives the driven body using expansion and contraction of a shape memory alloy wire Various modules have been proposed (see, for example, Patent Document 1).
For example, the drive module of Patent Document 1 is a shape memory alloy (hereinafter abbreviated as SMA) in which a driven body movably provided on a support body (chassis) expands and contracts in accordance with the amount of energization. A drive module that is locked to an intermediate portion of a wire, and includes a holding terminal having a wire holding portion that holds each end of the SMA wire in a conductive manner, and the holding terminal is supported and fixed to the support. .

JP 2009-19507 A

  By the way, a conventional drive module (actuator) employs a configuration in which an SMA wire is sandwiched and supported between wire holding portions of holding terminals. When the SMA wire supported and fixed to the wire holding portion in this manner repeatedly expands and contracts, the SMA wire and the side surface of the wire holding portion where the SMA wire extends are rubbed, and the SMA wire is in contact with the metal fatigue or holding portion. There is a risk of cutting due to scratches caused by contact. Even in the region where the wire holding part and the SMA wire are in contact, if the SMA wire repeatedly expands and contracts, the wire holding part and the SMA wire may rub against each other and the SMA wire may be cut due to metal fatigue. .

  Therefore, the present invention has been made in view of the above-described circumstances, and provides an actuator, a drive module, and an electronic device that can suppress the cutting of the shape memory alloy wire.

In order to solve the above problems, the present invention provides the following means.
An actuator according to the present invention includes a driven body, a support body that supports the driven body, and a drive unit that moves the driven body along a certain direction with respect to the support body, A driving means is engaged with the engagement portion of the driven body, and holds the shape memory alloy wire that moves the driven body by contraction due to heat generation when energized, and both ends of the shape memory alloy wire And a holding portion for holding the shape memory alloy wire in the holding terminal in an actuator in which the holding terminal is supported and fixed to the support, and the shape memory alloy in the holding portion is formed. A curved surface portion is formed in the holding portion so that the side surface on the side where the wire is extended and the shape memory alloy wire are not in contact with each other.

  By comprising in this way, when a shape memory alloy wire repeats expansion and contraction, it can prevent that a shape memory alloy wire and the side surface of a holding | maintenance part rub against each other. In addition, stress concentration on the shape memory alloy wire can be reduced at the end of the holding portion. That is, the shape memory alloy wire can be prevented from being cut during use of the actuator. Therefore, it is possible to provide an actuator having excellent durability and reliability.

  The actuator according to the present invention includes a driven body, a support body that supports the driven body, and a drive unit that moves the driven body along a certain direction with respect to the support body. A shape memory alloy wire that moves the driven body when the driving means is engaged with the engaging portion of the driven body and contracts due to heat generated during energization, and both ends of the shape memory alloy wire. A holding terminal for holding the shape memory alloy wire in the holding terminal in an actuator in which the holding terminal is supported and fixed to the support. A region that contacts the shape memory alloy wire is gold-plated with a thickness of 0.1 μm or more.

With this configuration, since the gold plating is interposed between the holding portion of the holding terminal and the shape memory alloy wire, the holding terminal and the shape memory alloy are supported when the shape memory alloy wire is supported and fixed to the holding terminal. Direct contact with the wire can be prevented. Accordingly, since the shape memory alloy wire does not come into contact with a burr or the like that may be formed on the holding terminal, it is possible to prevent the shape memory alloy wire from being damaged.
Further, when the shape memory alloy wire repeatedly expands and contracts, the shape memory alloy wire can be prevented from being cut by rubbing between the holding portion and the shape memory alloy wire. In addition, when the thickness of the gold plating is 0.1 μm or more, the shape memory alloy wire can be more reliably suppressed from being cut over time.

  The actuator according to the present invention includes a driven body, a support body that supports the driven body, and a drive unit that moves the driven body along a certain direction with respect to the support body. A shape memory alloy wire that moves the driven body when the driving means is engaged with the engaging portion of the driven body and contracts due to heat generated during energization, and both ends of the shape memory alloy wire. A holding terminal for holding the shape memory alloy wire in the holding terminal in an actuator having the holding terminal supported and fixed to the support body. A curved surface portion is formed in the holding portion so that the side surface on which the memory alloy wire is extended and the shape memory alloy wire are not in contact with each other, and at least the shape memory alloy in the holding portion The ear abutting region, is characterized by more gold thickness 0.1μm is applied.

By comprising in this way, when a shape memory alloy wire repeats expansion and contraction, it can prevent that a shape memory alloy wire and the side surface of a holding | maintenance part rub against each other. That is, the shape memory alloy wire can be prevented from being cut during use of the actuator.
Further, since gold plating is interposed between the holding portion of the holding terminal and the shape memory alloy wire, the holding terminal and the shape memory alloy wire are in direct contact when the shape memory alloy wire is supported and fixed to the holding terminal. Can be prevented. Accordingly, since the shape memory alloy wire does not come into contact with a burr or the like that may be formed on the holding terminal, it is possible to prevent the shape memory alloy wire from being damaged.
Further, when the shape memory alloy wire repeatedly expands and contracts, the shape memory alloy wire can be prevented from being cut by rubbing between the holding portion and the shape memory alloy wire. In addition, when the thickness of the gold plating is 0.1 μm or more, the shape memory alloy wire can be more reliably suppressed from being cut over time.
Therefore, it is possible to provide an actuator having excellent durability and reliability.

  In addition, a curved surface portion is formed in the holding portion so that the side surface of the holding portion opposite to the side on which the shape memory alloy wire extends is not in contact with the shape memory alloy wire. Yes.

  By comprising in this way, it can prevent that a shape memory alloy wire and the side surface on the opposite side of a holding | maintenance part rub against each other. That is, the end portion of the shape memory alloy wire can be prevented from breaking, and the durability of the shape memory alloy wire can be further improved.

  In addition, the drive module according to the present invention includes a cylindrical or columnar driven body, a support body that supports the driven body, and the driven body that is movable along a certain direction with respect to the support body. A leaf spring member that is elastically held; and a drive unit that drives the driven body along a certain direction against a restoring force of the plate spring member, wherein the drive unit is associated with the driven body. A shape memory alloy wire that is engaged with a joint portion and contracts due to heat generated during energization to drive the driven body against the restoring force of the leaf spring member, and both ends of the shape memory alloy wire A holding module for holding the shape memory alloy wire in the holding terminal, wherein the holding terminal is supported and fixed to the support. Shape memory alloy wire extended The side surface of the side to be, is characterized in that the curved portion is formed on the holding portion such that said shape memory alloy wire is not in contact.

  By comprising in this way, when a shape memory alloy wire repeats expansion and contraction, it can prevent that a shape memory alloy wire and the side surface of a holding | maintenance part rub against each other. That is, it is possible to suppress the shape memory alloy wire from being cut during use of the drive module. Therefore, it is possible to provide a drive module that is rich in durability and reliability.

  The drive module according to the present invention includes a driven body, a support body that supports the driven body, and a drive unit that moves the driven body along a certain direction with respect to the support body. And a shape memory alloy wire that moves the driven body when the driving means is engaged with the engaging portion of the driven body and contracts due to heat generated during energization, and both ends of the shape memory alloy wire. A drive module in which the holding terminal is supported and fixed to the support body, and a holding portion for holding the shape memory alloy wire is formed on the holding terminal, at least the holding portion. A region that contacts the shape memory alloy wire is gold-plated with a thickness of 0.1 μm or more.

With this configuration, since the gold plating is interposed between the holding portion of the holding terminal and the shape memory alloy wire, the holding terminal and the shape memory alloy are supported when the shape memory alloy wire is supported and fixed to the holding terminal. Direct contact with the wire can be prevented. Accordingly, since the shape memory alloy wire does not come into contact with a burr or the like that may be formed on the holding terminal, it is possible to prevent the shape memory alloy wire from being damaged.
Further, when the shape memory alloy wire repeatedly expands and contracts, the shape memory alloy wire can be prevented from being cut by rubbing between the holding portion and the shape memory alloy wire. In addition, when the thickness of the gold plating is 0.1 μm or more, the shape memory alloy wire can be more reliably suppressed from being cut over time.

  The drive module according to the present invention includes a driven body, a support body that supports the driven body, and a drive unit that moves the driven body along a certain direction with respect to the support body. And a shape memory alloy wire that moves the driven body when the driving means is engaged with the engaging portion of the driven body and contracts due to heat generated during energization, and both ends of the shape memory alloy wire. A drive module in which the holding terminal is supported and fixed to the support body, and a holding portion for holding the shape memory alloy wire is formed on the holding terminal. A curved surface portion is formed in the holding portion so that the side surface on which the shape memory alloy wire is extended and the shape memory alloy wire are not in contact with each other, and at least the shape memory alloy in the holding portion The ear abutting region, is characterized by more gold thickness 0.1μm is applied.

By comprising in this way, when a shape memory alloy wire repeats expansion and contraction, it can prevent that a shape memory alloy wire and the side surface of a holding | maintenance part rub against each other. That is, it is possible to suppress the shape memory alloy wire from being cut during use of the drive module.
Further, since gold plating is interposed between the holding portion of the holding terminal and the shape memory alloy wire, the holding terminal and the shape memory alloy wire are in direct contact when the shape memory alloy wire is supported and fixed to the holding terminal. Can be prevented. Accordingly, since the shape memory alloy wire does not come into contact with a burr or the like that may be formed on the holding terminal, it is possible to prevent the shape memory alloy wire from being damaged.
Further, when the shape memory alloy wire repeatedly expands and contracts, the shape memory alloy wire can be prevented from being cut by rubbing between the holding portion and the shape memory alloy wire. In addition, when the thickness of the gold plating is 0.1 μm or more, the shape memory alloy wire can be more reliably suppressed from being cut over time.
Therefore, it is possible to provide a drive module that is rich in durability and reliability.

  In addition, a curved surface portion is formed in the holding portion so that the side surface of the holding portion opposite to the side on which the shape memory alloy wire extends is not in contact with the shape memory alloy wire. Yes.

  By comprising in this way, it can prevent that a shape memory alloy wire and the side surface on the opposite side of a holding | maintenance part rub against each other. That is, the end portion of the shape memory alloy wire can be prevented from breaking, and the durability of the shape memory alloy wire can be further improved.

  In addition, an electronic apparatus according to the present invention includes the drive module described above.

  In the electronic device according to the present invention, a drive module capable of suppressing the cutting of the shape memory alloy wire is used. Therefore, it is possible to provide a highly accurate electronic device with improved durability and reliability of the product.

  The actuator according to the present invention can prevent the shape memory alloy wire from rubbing against the side surface of the holding portion when the shape memory alloy wire repeatedly expands and contracts. In addition, stress concentration on the shape memory alloy wire can be reduced at the end of the holding portion. That is, the shape memory alloy wire can be prevented from being cut during use of the actuator. Therefore, it is possible to provide an actuator having excellent durability and reliability.

It is a perspective view of the drive module in the embodiment of the present invention. It is a disassembled perspective view which shows the structure of the drive module in embodiment of this invention. It is a disassembled perspective view which shows the structure of the drive unit in embodiment of this invention. It is a perspective view which shows the drive unit in embodiment of this invention. It is sectional drawing which follows the AA line of FIG. It is a side view of the drive module in the embodiment of the present invention. It is a perspective view of the wire holding member (before SMA wire support fixation) in the embodiment of the present invention. It is sectional drawing which follows the BB line of FIG. It is a perspective view which shows the shape of the wire holding member at the time of attaching a wire holding member to a module frame in the manufacturing process of the drive module in embodiment of this invention. It is a figure (1) explaining the process of attaching an SMA wire to a wire holding member in the manufacturing process of the drive module in the embodiment of the present invention. It is a side view which shows the positional relationship of the module frame and SMA wire in FIG. It is a figure (2) explaining the process of attaching an SMA wire to a wire holding member in the manufacturing process of the drive module in embodiment of this invention. It is a side view which shows the positional relationship of the module frame and SMA wire in FIG. It is a figure (3) explaining the process of attaching an SMA wire to a wire holding member in the manufacturing process of the drive module in embodiment of this invention. It is a side view which shows the positional relationship of the module frame and SMA wire in FIG. FIG. 4B is a side view illustrating a positional relationship between the module frame and the SMA wire, illustrating a process of attaching the SMA wire to the wire holding member in the manufacturing process of the drive module in the embodiment of the present invention. It is sectional drawing seen from the wire extension direction which shows the state which crimped and supported the SMA wire to the wire holding part in the manufacturing process of the drive module in embodiment of this invention. It is sectional drawing which follows the CC line of FIG. It is drawing of the electronic device in embodiment of this invention, (a) Front surface perspective view, (b) Back surface perspective view, (c) It is sectional drawing which follows the FF line | wire of (b).

  Next, an embodiment according to the present invention will be described with reference to FIGS. In the present embodiment, a drive module that functions as an actuator that drives a driven body such as an imaging lens unit in a small electronic device such as a mobile phone with a camera function, and a manufacturing method thereof will be described.

  FIG. 1 is a perspective view of a drive module according to an embodiment of the present invention. FIG. 2 is an exploded perspective view showing a schematic configuration of the drive module according to the embodiment of the present invention. FIG. 3 is an exploded perspective view showing a schematic configuration of the drive unit according to the embodiment of the present invention. FIG. 4 is a perspective view of the drive unit according to the embodiment of the present invention. FIG. 5 is a cross-sectional view taken along the line AA in FIG. FIG. 6 is a side view of the drive module according to the embodiment of the present invention. In some of the drawings, for the sake of clarity, for example, components such as the lens unit 12 are omitted as appropriate.

  As shown in FIGS. 1 and 2, the drive module 1 of the present embodiment is formed in a box shape as a whole. The drive module 1 is assembled and completed, and is attached to an electronic device or the like. The drive module 1 is fixed on a board (not shown) for supplying a control signal or power to the drive module 1 by bonding or bonding. The The drive module 1 includes an adapter 30 located on the substrate, a drive unit 31 disposed on the adapter 30, and a cover 11 disposed so as to cover the drive unit 31.

  As shown in FIG. 3, the drive unit 31 includes a lens frame 4 as a driven body, a module frame 5 as a support, an upper leaf spring 6 and a lower leaf spring 7 as leaf spring members, a module lower plate 8, and a power supply. The member 9 and the shape memory alloy (hereinafter abbreviated as SMA) wire 10 are the main constituent members, and these constituent members are laminated together to form one actuator.

  3 to 6, in the assembled state of these members, the lens frame 4 is inserted inward of the module frame 5, and the upper leaf spring 6 and the lower leaf spring 7 are connected to the lens frame 4 and the module frame. The module lower plate 8 and the power supply member 9 are stacked in this order from the lower side of the figure, and are fixed together by caulking from the lower side of the module frame 5. ing. A cover 11 that covers these laminates from above is fixed to the module lower plate 8.

  In addition, the code | symbol M in a figure is a virtual axis line of the drive module 1 which corresponds to the optical axis of the lens unit 12 (refer FIG. 5), and has shown the drive direction of the lens frame 4. FIG. Hereinafter, in order to simplify the description, in the description of each disassembled component member, the position and direction may be referred to based on the positional relationship with the axis M at the time of assembly. For example, even when there is no clear circle or cylindrical surface in the component, unless there is a risk of misunderstanding, the direction along the axis M is simply the axial direction, the radial direction of the circle centering on the axis M, and the circumferential direction. Sometimes simply referred to as the radial direction and the circumferential direction. Further, unless otherwise specified, the vertical direction refers to the vertical direction in the arrangement when the axis M is arranged in the vertical direction and the mounting surface of the drive module 1 is vertically downward.

  Among these components, the lens frame 4 as a driven body is formed in a cylindrical shape as a whole as shown in FIG. 3, and penetrates the center thereof and is formed coaxially with the axis M. A female screw is formed on the inner peripheral surface 4F of the cylindrical accommodating portion 4A (see FIG. 5). The housing unit 4A can be fixed by screwing a lens unit 12 holding an appropriate lens or lens group in a lens barrel having a male screw formed on the outer periphery thereof.

  On the outer wall surface 4B of the lens frame 4, a protruding portion 4C (convex portion) that protrudes outward in the radial direction is extended in the axial direction at an interval of approximately 90 degrees in the circumferential direction. The upper and lower fixing pins 13A and 13B projecting upward and downward along the axis M on the end surfaces 4a and 4b, which are planes orthogonal to the axis M, at the upper end and the lower end of the part 4C. There are four each. The upper fixing pin 13 </ b> A holds the upper leaf spring 6, and the lower fixing pin 13 </ b> B holds the lower leaf spring 7.

  The positions of the upper fixing pin 13A and the lower fixing pin 13B in plan view may be different from each other, but are arranged at a coaxial position parallel to the axis M in this embodiment. For this reason, the insertion positions of the upper fixing pin 13A and the lower fixing pin 13B in the upper plate spring 6 and the lower plate spring 7 are made common.

  Further, the center positions in the radial direction of the upper fixing pin 13A and the lower fixing pin 13B may be different, but in the present embodiment, they are arranged on the same circumference. For this reason, the respective center positions are arranged in a square lattice pattern.

  A guide protrusion 4D is provided on the radially outer side of the lens frame 4 so as to protrude radially outward from the lower end side of one protrusion 4C. As shown in FIG. 4, the guide protrusion 4D locks the SMA wire 10 to the distal end key portion (engagement portion) 4D1, and the guide protrusion 4D is moved upward (in the direction of the arrow (A)) by the contraction of the SMA wire 10. ) To lift and move. The guide protrusion 4D is formed with a columnar spring holding portion 33 extending upward in parallel with the axis M. A coil spring 34 (see FIG. 2) is inserted into the spring holding portion 33 and urges the lens frame 4 downward by the urging force of the coil spring 34. Accordingly, it is possible to suppress the movement of the SMA wire 10 that is contracted due to the influence of the surrounding environment and the like to raise the lens frame 4. The lens frame 4 is integrally formed of a thermoplastic resin that can be caulked by heat or ultrasonically, such as polycarbonate (PC) or liquid crystal polymer (LCP) resin.

  As shown in FIG. 3, the module frame 5 has a substantially rectangular outer shape in plan view, and a housing portion 5 </ b> A including a through hole formed coaxially with the axis M is formed at the center thereof. The lens frame 4 is accommodated in the accommodating portion 5A. At the upper and lower corners of the module frame 5, end surfaces 5a and 5b are formed, which are planes orthogonal to the axis M, and the upper fixing pin 14A extends downward from the end surface 5a and downward from the end surface 5b. Four side fixing pins 14B are provided.

  The upper fixing pin 14 </ b> A holds the upper leaf spring 6, and the lower fixing pin 14 </ b> B holds the lower leaf spring 7, the module lower plate 8, and the power feeding member 9. Note that the position of the upper fixing pin 14A in plan view may be different from the arrangement of the lower fixing pin 14B, but in this embodiment, they are arranged at coaxial positions parallel to the axis M, respectively. For this reason, the insertion positions of the upper fixing pin 14A and the lower fixing pin 14B in the upper leaf spring 6 and the lower leaf spring 7 are made common. Further, the distance between the end faces 5 a and 5 b is set to be the same distance as the distance between the end faces 4 a and 4 b of the lens frame 4.

  A notch 5B having a size in which the groove width in a plan view is fitted to the guide projection 4D of the lens frame 4 so as to be movable in the axial direction is formed at a lower portion of one corner of the module frame 5. The notch 5B penetrates the guide projection 4D of the lens frame 4 in a state in which the lens frame 4 is inserted and accommodated in the module frame 5 from below, and the tip key portion 4D1 of the guide projection 4D is inserted into the diameter of the module frame 5. This is for projecting outward in the direction and positioning the lens frame 4 in the circumferential direction.

  Further, a wire holding member (holding terminal) 15A for holding the SMA wire 10 is provided at two corners adjacent to the notch 5B of the module frame 5 on the side surface in the same direction as the corner provided with the notch 5B. , 15B (see FIGS. 3 and 4), a pair of locking grooves 5C is formed.

  Pins 35A and 35B are formed at positions where the wire holding members 15A and 15B are arranged on the side surface of the module frame 5, respectively. Further, a groove portion 36 that is filled with an adhesive and fixes the module frame 5 and the wire holding members 15A and 15B is formed below the pins 35A and 35B. And when fixing wire holding member 15A, 15B to the module frame 5, the wall part 35C which can suppress that wire holding member 15A, 15B rotates is formed. The wall portion 35 </ b> C extends laterally (perpendicular to the side surface) from the side surface of the module frame 5.

  Further, in the present embodiment, the module frame 5 is integrally formed of a thermoplastic resin capable of thermal caulking or ultrasonic caulking, for example, polycarbonate (PC), liquid crystal polymer (LCP) resin, or the like, in the same manner as the lens frame 4. .

  The wire holding member 15A is attached to the side surface on the side where the pair of terminal portions 9C of the power supply member 9 protrudes from the drive module 1, and the wire holding member 15B is connected to the pair of terminal portions 9C of the power supply member 9 from the drive module 1. It is attached to the side of the side that does not protrude.

  As shown in FIG. 4, the wire holding members 15 </ b> A and 15 </ b> B are conductive members such as a metal plate formed in a key shape formed by caulking the end of the SMA wire 10 to the wire holding portion 15 b. The wire holding members 15A and 15B are formed with through holes 36A and 36B that fit into the pins 35A and 35B of the module frame 5, respectively. Further, through holes 37A and 37B for pouring the adhesive are formed below the through holes 36A and 36B in the axial direction. Then, when the module frame 5 and the wire holding members 15A and 15B are fixed, the arm portions 38A and 38B for contacting the wall portion 35C of the module frame 5 and suppressing the rotation of the wire holding members 15A and 15B. Are formed respectively. The end portion of the SMA wire 10 is positioned and held by fitting the locking portion 5C and the pins 35A and 35B from the side and bringing the wall portion 35C and the arm portions 38A and 38B into contact with each other.

  The wire holding members 15 </ b> A and 15 </ b> B are provided with a piece-like terminal portion 15 a on the side opposite to the wire holding portion 15 b (crimping position) of the SMA wire 10, and the terminal portion 15 a is below the module frame 5 when attached to the module frame 5. It protrudes slightly below the module lower plate 8 stacked on the board.

  Here, as shown in FIG. 7 and FIG. 8, the wires are arranged so that the SMA wire 10 is not in direct contact with both side surfaces 61, 62 of the wire holding portion 15 b where the SMA wire 10 is sandwiched in the wire holding members 15 </ b> A, 15 </ b> B. Curved portions 63 and 64 are formed on the holding portion 15b. The curved surface portions 63 and 64 are formed by chamfering or chamfering. Further, when comparing the curved surface portion 63 formed on the side surface 61 on the side where the SMA wire 10 is extended with the curved surface portion 64 formed on the side surface 62 on the opposite side, the curvature radius of the curved surface portion 63 is greater. The radius of curvature of the curved surface portion 64 is larger. Here, by forming the curved surface portion 64, burrs generated when the wire holding portion 15b is manufactured by press work can damage the SMA wire 10, or the burrs can come into contact with each other to hold the SMA wire 10 with a uniform force. It can be suppressed from disappearing. 7 and 8 illustrate the wire holding member 15A, the wire holding member 15B is also formed with the same configuration.

  Further, a gold plating P having a thickness of 0.1 μm is applied to the region 65 in contact with the SMA wire 10 in the wire holding portion 15b of the wire holding members 15A and 15B. In other words, the SMA wire 10 is supported and fixed to the wire holding portion 15b by bending and holding the wire holding portion 15b, but the area 65 which is the inner surface of the wire holding portion 15b is plated with gold.

  Furthermore, the wire holding part 15b is curvedly formed in a plan view (see FIG. 4). In the wire holding portion 15b of the present embodiment, after the wire holding portion 15b is crimped and the SMA wire 10 is supported and fixed, the wire holding portion 15b is further crimped in another process to bend the wire holding portion 15b. By thus forming the wire holding portion 15b in a curved manner, the holding force between the SMA wire 10 and the wire holding portion 15b is enhanced more firmly.

  Further, the SMA wire 10 held at both ends by the pair of wire holding members 15A and 15B is locked from below to the front end key portion 4D1 of the guide projection 4D of the lens frame 4 protruding from the notch 5B of the module frame, The lens frame 4 is urged upward by the tension of the SMA wire 10 via the distal end key portion 4D1.

  As shown in FIGS. 3 and 4, an upper leaf spring 6 and a lower leaf spring 7 are laminated on the upper and lower portions of the module frame 5 and the lens frame 4 inserted into the module frame 5, respectively. The upper leaf spring 6 and the lower leaf spring 7 are flat plate spring members punched into substantially the same shape, and are made of a metal plate such as a stainless steel (SUS) steel plate.

  The shape of the upper leaf spring 6 (lower leaf spring 7) has a substantially rectangular shape in plan view, similar to the upper (lower) end of the module frame 5, and is coaxial with the axis M at the center. A circular opening 6C (7C) that is slightly larger than the inner peripheral surface 4F of the frame 4 is formed, and has a ring shape as a whole.

  In the vicinity of the corner of the upper leaf spring 6 (lower leaf spring 7), the upper fixing pins 14A (lower fixing pins 14B) formed in the vicinity of the corners of the module frame 5 correspond to the positions of the upper fixing pins 14A. Four through holes 6B (7B) that can be inserted through the pins 14A (lower fixing pins 14B) are formed. Thereby, positioning in the plane orthogonal to the axis line M with respect to the module frame 5 is possible.

  Further, the upper plate spring 6 (lower plate spring 7) has upper fixing pins 13A (lower fixing pins) corresponding to the positions of the upper fixing pins 13A (lower fixing pins 13B) formed on the lens frame 4. Four through holes 6A (7A) that can be respectively inserted into the pins 13B) are formed.

  Further, a ring portion 6F (7F) is formed on the outer side in the radial direction of the opening 6C (7C), and in the circumferential direction from a position in the vicinity of the through holes 6A (7A) that face each other diagonally across the axis M. Four slits 6D (7D) extending in a substantially semicircular arc shape are formed so as to overlap each other in the radial direction by a substantially quadrant arc.

  Thereby, four spring parts 6E (7E) extended from the rectangular frame outside the upper leaf | plate spring 6 (lower leaf | plate spring 7) to the substantially quadrant arc shape one each through-hole 6A ( 7A) A leaf spring member extending in the vicinity is formed.

  Thus, the outer shape of the upper leaf spring 6 (lower leaf spring 7) is provided in a rectangular shape substantially matching the outer shape of the module frame 5, and the spring portion 6E (7E) and the ring portion 6F (7F) are formed in the opening 6C ( 7C) is formed in a ring-shaped region. Then, depending on the arrangement of the upper fixing pin 14A (lower fixing pin 14B) for fixing the upper leaf spring 6 (lower leaf spring 7) to the module frame 5, a through-hole that is a fixed portion is provided at a corner having a sufficient space. Since the hole 6B (7B) is provided, the shape of the through-hole 6B (7B) can be separated from the spring portion 6E (7E), so that manufacturing by precise punching or etching is easy.

  The module lower plate 8 allows the lower fixing pins 14B of the module frame 5 to pass through the through holes 7B of the lower leaf spring 7, and the lower fixing pins 13B of the lens frame 4 accommodated in the module frame 5 are lower plates. The lower plate spring 7 is stacked between the module frame 5 with the lower plate spring 7 sandwiched from the lower side in a state of passing through the through hole 7A of the spring 7, and the rectangular outer frame of the lower plate spring 7 is attached to the end surface of the module frame 5. It fixes to a pressing state with respect to 5b.

  The shape of the module lower plate 8 is a plate-like member having a rectangular outer shape that is substantially the same as the outer shape of the module frame 5, and a substantially circular opening 8 </ b> A centering on the axis M penetrates in the center in the thickness direction. Is formed. Then, on the upper surface 8a side laminated on the lower leaf spring 7 at the time of assembly, four positions for avoiding interference with a caulking portion described later are provided at positions corresponding to the positions of the lower fixing pins 13B of the lens frame 4. A U-shaped recess 8B is formed. In addition, through holes 8C through which the lower fixing pins 14B are inserted are formed at the corners located on the periphery of the module lower plate 8 corresponding to the positions of the lower fixing pins 14B of the module frame 5. ing. The material of the module lower plate 8 is, for example, a synthetic resin having electrical insulation and light shielding properties. Further, since the module lower plate 8 has electrical insulation, it is an insulating member that fixes the power supply member 9 to the lower plate spring 7 in an electrically insulated state.

  The power supply member 9 includes a pair of electrodes 9a and 9b each formed of a plate-shaped metal plate. Each of the electrodes 9a and 9b includes a substantially L-shaped wiring portion 9B that follows the outer shape of the module lower plate 8, and a terminal portion 9C that protrudes outside the outer shape of the module lower plate 8 from the end of the wiring portion. It consists of a polygonal metal plate. Each of the wiring portions 9B has two lower fixing pins adjacent to each other along the outer shape of the module lower plate 8 out of the lower fixing pins 14B of the module frame 5 protruding downward from the lower surface of the module lower plate 8. Two through holes 9A for positioning the electrodes 9a and 9b with respect to the module frame 5 by inserting the pins 14B, respectively, are provided.

  As shown in FIG. 4, the terminal portions 9C of the electrodes 9a and 9b are provided in the module frame 5 so as to protrude in parallel in the axially downward direction from the side surface on the side where the wire holding member 15A is attached. Yes.

  For this reason, the electrode 9a is conductively cut in a concave shape to electrically connect the terminal portion 15a of the wire holding member 15A to the side surface on the wiring portion 9B between the through hole 9A and the terminal portion 9C. A connecting portion 9D is provided.

  On the other hand, the electrode 9b is provided with a conductive connection portion 9D that is cut out at a connection location with the terminal portion 15a of the wire holding member 15B on the side surface of the wiring portion 9B. In the conductive connection portion 9D, the electrode 9b and the wire holding member 15B are electrically connected.

  As means for electrically connecting each conductive connection portion 9D to the terminal portion 15a, for example, soldering or adhesion using a conductive adhesive can be employed.

  Returning to FIG. 2, the cover 11 is a member in which a side wall portion 11 </ b> D that covers the module frame 5 so as to be externally fitted is extended from the outer edge portion of the upper surface 11 </ b> E, and a rectangular opening 11 </ b> C is formed on the lower side. There is a circular opening 11A centering on the axis M at the center of the upper surface 11E. The size of the opening 11A is set so that the lens unit 12 can be taken in and out.

A method for manufacturing the drive module 1 configured as described above will be described in order.
In the first step, first, the lens frame 4 is inserted into the housing portion 5A of the module frame 5 from below, and the end surfaces 5a of the module frame 5 and the end surfaces 4a of the lens frame 4 are aligned at the same height. Then, the through holes 6B and 6A of the upper leaf spring 6 are inserted into the upper fixing pins 14A of the module frame 5 and the upper fixing pins 13A of the lens frame 4, respectively.

  Thereafter, the top ends of the upper fixing pins 13A and 14A protruding upward through the through holes 6A and 6B of the upper leaf spring 6 are caulked with a heater chip (not shown), and the first fixing portions are respectively provided. And a caulking part 17 as a second fixing part are formed (see FIGS. 4 and 5).

  At this time, the end face 4a of the lens frame 4 and the end face 5a of the module frame 5 are aligned on the same plane, and the plate-like upper leaf spring 6 is arranged without being deformed to perform heat caulking. it can. Therefore, since it is not necessary to hold down the upper leaf spring 6 that is deformed, it can be easily crimped. Further, the occurrence of floating or the like due to the deformation of the upper leaf spring 6 can be prevented. Moreover, since the height of each heater chip can be made common, even if the crimping portions 16 and 17 are formed at the same time, variations in the crimping accuracy can be reduced.

  Next, in the second step, the through holes 7A of the lower leaf spring 7 are inserted into the lower fixing pins 13B of the lens frame 4, respectively. At that time, the through holes 7B of the lower leaf spring 7, the through holes 8C of the module lower plate 8, and the through holes 9A of the power supply member 9 are inserted into the lower fixing pins 14B of the module frame 5 at the same time. Thereafter, the tip end portion of each lower fixing pin 13B penetrating through each through hole 7A of the lower leaf spring 7 is caulked with a heater chip, and a caulking portion 18 (a first fixing portion) ( (See FIG. 5).

  At this time, since the axial distance between the end faces 4a and 4b of the lens frame 4 is equal to the axial distance between the end faces 5a and 5b of the module frame 5, the end faces 4b and 5b are aligned on the same plane. Since the module lower plate 8 can be stacked and disposed without deforming the flat lower plate spring 7 and heat caulking can be performed, the occurrence of floating or the like due to the deformation of the lower plate spring 7 can be prevented. Moreover, since the height of each heater chip can be made common, even if the crimping portion 18 is formed at the same time, variations in the crimping accuracy can be reduced.

  Next, in the third step, the lower end portion of each lower fixing pin 14B penetrating through the through holes 7B, 8C, and 9A is thermally caulked with a heater chip, and the second fixing portion is used. A certain crimping portion 19 (see FIG. 5) is formed.

  At this time, since the height of each heater chip can be made common, even if the crimping portion 19 is formed at the same time, variations in the crimping accuracy can be reduced. Further, since the recess 8 </ b> B is formed in the module lower plate 8, the caulking portion 18 formed in the second step does not contact the module lower plate 8.

  By performing the operations in the first to third steps, the upper plate spring 6, the lower plate spring 7, the module lower plate 8, and the power supply member 9 are laminated and fixed to both ends of the lens frame 4 and the module frame 5.

  Since the upper fixing pin 13A and the lower fixing pin 13B, and the upper fixing pin 14A and the lower fixing pin 14B are provided coaxially, in the caulking in the first to third steps, the caulking portions 16, 18 are provided. The positions on the plane of the heater chip for forming the crimping portions 17 and 19 are the same. For this reason, it is not necessary to change the heater chip position in each caulking, so that the caulking operation can be performed efficiently.

  Thus, by caulking the leaf spring members (upper leaf spring 6 and lower leaf spring 7), the caulking portions 16 to 19 can be sandwiched and fixed between the module frame 5 and the lens frame 4. Therefore, the time required for solidification is shorter than in the case of fixing by bonding or the like, and the assembly time can be reduced. Moreover, there is no possibility of contaminating parts due to generation of gas when the adhesive is cured. In addition, stable fixation over time can be performed. As a result, the reliability of the fixed part can be improved.

  In addition, since no fixed parts such as screws are used, a simple configuration with a reduced number of parts is achieved, and further weight reduction and downsizing are possible. In particular, since the lens frame 4 that is a driven body is reduced in weight, it can be driven at high speed and with low power consumption.

  Next, in a fourth step (arrangement step), the pair of wire holding members 15 </ b> A and 15 </ b> B are fixed to the module frame 5. Specifically, the through holes 36A and 36B of the wire holding members 15A and 15B are fitted to the two pins 35A and 35B formed on the module frame 5, and the wire holding members 15A and 15B are fitted to the locking grooves 5C. Lock each one. The terminal portions 15a of the wire holding members 15A and 15B protrude below the module lower plate 8, and are respectively connected to the conductive connection portions 9D of the electrodes 9a and 9b, which are power supply members 9 fixed to the module lower plate 8. Locked or placed close together.

  Here, as shown in FIG. 9, the wire holding portions 15 b of the wire holding members 15 </ b> A and 15 </ b> B at this time have already been bent by about 90 °, and the bent pieces 15 c are outward with respect to the module frame 5. It is bent towards. Further, the wire holding portion 15b has a curved surface portion so that the both side surfaces 61 and 62 of the wire holding portion 15b between which the SMA wire 10 is held in the wire holding members 15A and 15B of the present embodiment and the SMA wire 10 are not in direct contact. 63, 64 are formed. The curved surface portions 63 and 64 are formed by chamfering or chamfering. Further, a gold plating P having a thickness of 0.1 μm is applied to the region 65 in contact with the SMA wire 10 in the wire holding portion 15b of the wire holding members 15A and 15B.

  Next, in the fifth step (fixing step), a thermosetting adhesive is poured into the through holes 37 </ b> A and 37 </ b> B and filled in the groove portion 36 of the module frame 5. When the groove portion 36 is filled with the thermosetting adhesive, it is placed in a heating furnace in order to cure the adhesive. In the heating furnace, for example, by heating at about 100 ° C. for about 20 to 30 minutes, the adhesive is cured and the module frame 5 and the wire holding members 15A and 15B are bonded and fixed.

  After the module frame 5 and the wire holding members 15A and 15B are bonded and fixed, each terminal portion 15a is electrically connected to the conductive connection portion 9D using, for example, soldering or a conductive adhesive. .

  Subsequently, in the sixth step (wire attachment step), the SMA wire 10 is supported and fixed to the wire holding members 15A and 15B.

Specifically, as shown in FIG. 10, one side 10 a is gripped by a gripping member 51 and the other 10 b side is placed on a jig 53 with respect to the SMA wire 10 tensioned by a weight 52. The module frame 5 (through the fifth step) is brought closer. At this time, as shown in FIG. 11, the module frame 5 is disposed obliquely upward with respect to the SMA wire 10, and the module frame 5 is moved obliquely downward toward the SMA wire 10.
Then, as shown in FIGS. 12 and 13, the module frame 5 is moved obliquely downward until the SMA wire 10 is locked to the tip key portion 4 </ b> D <b> 1 of the lens frame 4.

  Subsequently, as shown in FIGS. 14 and 15, the module frame 5 is further moved obliquely downward until the SMA wire 10 reaches a desired position of the wire holding portion 15 b of the wire holding members 15 </ b> A and 15 </ b> B.

  Subsequently, as shown in FIG. 16, the module frame 5 is moved downward using a jig 54. At this time, since both ends of the SMA wire 10 do not move, the SMA wire 10 comes into contact with the bent piece 15c of the wire holding portion 15b with a desired tension.

  In this manner, the SMA wire 10 is supported and fixed by crimping the wire holding portion 15b in a state where the SMA wire 10 is disposed at a predetermined position of the wire holding members 15A and 15B. At this time, the wire holding portion 15b of the wire holding member 15B previously arranged on the one 10a side of the SMA wire 10 is crimped, and the extra protruding wire is cut. After the crimping on the wire holding member 15B side is completed, the wire holding portion 15b of the wire holding member 15A disposed on the other 10b side is crimped, and the extra protruding wire is cut. By crimping the wire holding members 15B and 15A in this order, the SMA wire 10 can be crimped in a state where a predetermined tension is applied. That is, there is no error for each product, and the SMA wire 10 can be attached to the module frame 5 while maintaining a substantially constant tension.

  In addition, as shown in FIG. 17, in this embodiment, since the gold plating P is applied to the region 65 of the wire holding portion 15b, it is possible to prevent the wire holding portion 15b and the SMA wire 10 from coming into direct contact during caulking. Can do. Therefore, since the SMA wire 10 does not come into contact with burrs or the like that may be formed on the wire holding members 15A and 15B, it is possible to prevent the SMA wire 10 from being damaged. Further, when the SMA wire 10 repeatedly expands and contracts, it is possible to prevent the SMA wire 10 from being cut by rubbing between the wire holding portion 15 b and the SMA wire 10. That is, the gold plating P functions as a lubricating material. Moreover, when the thickness of the gold plating P is 0.1 μm or more, the SMA wire 10 can be more reliably suppressed from being cut over time.

  Further, as shown in FIG. 18, in this embodiment, the wire holding members 15 </ b> A and 15 </ b> B are arranged so that the side surface 61 of the wire holding portion 15 b on the side where the SMA wire 10 extends and the SMA wire 10 do not come into direct contact. Since the curved surface portion 63 is formed in the holding portion 15b, it is possible to prevent the SMA wire 10 and the side surface 61 of the wire holding portion 15b from rubbing when the SMA wire 10 repeatedly expands and contracts. That is, it is possible to prevent the SMA wire 10 from being cut during use of the drive module 1. Therefore, it is possible to provide the drive module 1 having excellent durability and reliability.

  Subsequently, the crimping of the wire holding portion 15b is performed. In this caulking of the wire holding part 15b, the wire holding part 15b to which the SMA wire 10 is supported and fixed is bent in a plan view. Specifically, the wire holding part 15b is crimped so that it may curve with respect to the direction in which the SMA wire 10 expands and contracts. By performing the caulking in this way, the holding force between the SMA wire 10 and the wire holding portion 15 can be further increased. Therefore, the SMA wire 10 can be prevented from dropping from the wire holding members 15A and 15B with time, and the life of the drive module 1 can be extended.

  Next, in the seventh step, the cover 11 is covered from above the module frame 5, and the side wall portion 11 </ b> D and the module lower plate 8 are joined. For example, an engaging claw or the like is provided on the side wall part 11D and joined by fitting, or the side wall part 11D and the module lower plate 8 are bonded or welded to join. Before covering the cover 11, the coil spring 34 is inserted through the spring holding portion 33 of the guide protrusion 4D. By arranging the coil spring 34 in this way, one end of the coil spring 34 is brought into contact with the back surface of the upper surface 11E of the cover 11, and the other end is brought into contact with the guide protrusion 4D, so that the lens frame 4 is moved downward in the axial direction. Configured to be energized. In this embodiment, the coil spring 34 has a biasing force that resists the force that the SMA wire 10 tends to contract when the ambient temperature is 70 ° C. Further, the crimping portions 16 and 17 are in a state of being separated from the back surface of the upper surface 11E of the cover 11, respectively. In this way, the assembly of the drive module 1 main body is completed.

  Thereafter, the adapter 30 is attached below the drive unit 31 and then attached onto the substrate. For mounting the drive module 1 on the substrate, fixing means such as adhesion and fitting can be employed.

  Note that the substrate may be an independent member attached to the drive module 1 or a member connected to and disposed on an electronic device or the like.

  Further, the lens unit 12 is screwed into the lens frame 4 through the opening 11 </ b> A of the cover 11.

  As described above, the lens unit 12 is attached last because the lens of the lens unit 12 is not soiled or dust is attached by the assembling work. For example, the drive module 1 is attached to the lens unit 12. This process is performed at an early stage (seventh step) when the product is shipped in a product state where the lens is attached or when the opening 11A of the cover 11 is desired to be smaller than the outer shape of the lens unit 12, for example, when the aperture stop is also used. It may be carried out before the process).

  By configuring the manufacturing process of the drive module 1 as described above, it becomes possible to automate the manufacture of the drive module 1. That is, the wire holding members 15A and 15B are attached to the module frame 5 in advance, and then the SMA wire 10 is held to the wire holding members 15A and 15B so as to attach the SMA wire 10 having a substantially constant tension. Can be automated. Therefore, it is possible to provide a highly accurate drive module 1 with a small product characteristic error.

Next, the operation of the drive module 1 will be described.
In the state where power is not supplied to the terminal portion 9 </ b> C, the driving module 1 has a tension from the SMA wire 10 and a biasing force of the coil spring 34, a restoring force from the upper leaf spring 6 and the lower leaf spring 7 at the crimping portions 16 and 18, and the like. The forces acting on the lens frame 4 are balanced, and the lens frame 4 to which the lens unit 12 is attached is held at a fixed position in the axial direction.

  When power is supplied from the terminal portion 9C to the power supply member 9, for example, the electrode 9a, the wire holding member 15A, the SMA wire 10, the wire holding portion 15b, and the electrode 9b are electrically connected, so that a current flows through the SMA wire 10. . As a result, Joule heat is generated in the SMA wire 10 and the temperature of the SMA wire 10 rises. When the transformation start temperature of the SMA wire 10 is exceeded, the SMA wire 10 contracts to a length corresponding to the temperature.

  As a result, the guide protrusion 4D of the lens frame 4 moves upward (in the direction (A) in the figure). As a result, the coil spring 34, the upper leaf spring 6, and the lower leaf spring 7 are deformed, and an elastic restoring force corresponding to the amount of deformation is urged to the lens frame 4. Then, the lens frame 4 stops at a position where this elastic restoring force is balanced with the tension of the SMA wire 10.

  At this time, since the upper leaf spring 6 and the lower leaf spring 7 constitute a parallel spring, the lens frame 4 accurately moves along the axis M without being along an axial guide member or the like. Is done. For this reason, it is possible to reduce the number of parts and reduce the size. Further, since no sliding load is generated on the guide member, low power consumption can be realized.

Further, when the supply of power is stopped, the SMA wire 10 can be extended, and the lens frame 4 moves to a balanced position in the downward direction (the (B) direction in the figure).
Thus, the lens frame 4 can be driven in the direction of the axis M by controlling the power supply amount.

  Next, the effectiveness of the presence / absence of the curved surface portion 63 and the thickness of the gold plating P will be described with reference to Table 1.

  Table 1 shows that the surface holding width (the size of the curved surface portion) of the wire holding members 15A and 15B and the thickness of the gold plating P are different, and the SMA wire 10 is attached to the wire holding members 15A and 15B formed under the respective conditions. This is a measurement of how much the SMA wire 10 is cut when the SMA wire 10 is expanded and contracted a predetermined number of times by crimping and supporting and fixing the SMA wire 10.

  As shown in Table 1, when the surface pressing width is 0 mm, that is, the curved surface portion 63 is not formed and the thickness of the gold plating P is 0.05 μm, Example 1 has a surface pressing width of 0.25 mm, When the thickness of the gold plating P is 0.05 μm as in the comparative example, Example 2 is the case where the surface pressing width is 0.25 mm as in Example 1, and the thickness of the gold plating P is 0.1 μm.

In Comparative Example 1, 6 SMA wires 10 out of 20 samples were cut by operating 100,000 times (expanding and contracting the SMA wire 10 100,000 times).
In Example 1, two SMA wires 10 out of 20 samples were cut at 300,000 operations. That is, it can be seen that by forming the curved surface portion 63, the durability of the SMA wire 10 is improved as compared with the comparative example.
Furthermore, in Example 2, the SMA wire 10 of all the 20 samples was not cut | disconnected by the operation frequency of 1 million times. That is, it can be seen that the durability of the SMA wire 10 is further improved by setting the thickness of the gold plating P to 0.1 μm.

  Therefore, the durability of the SMA wire 10 can be improved by forming the curved surface portion 63 on the wire holding members 15A and 15B and applying the gold plating P having a thickness of 0.1 μm or more to the region 65.

  According to this embodiment, since the curved surface portions 63 and 64 are formed in the wire holding portion 15b of the wire holding members 15A and 15B of this embodiment, when the SMA wire 10 expands and contracts, the SMA wire 10 and the wire holding portion. It can prevent that the side surfaces 61 and 62 of 15b contact directly. That is, burrs and the like are often formed on the side surfaces 61 and 62 when the wire holding members 15A and 15B are manufactured, but it is possible to prevent such burrs from rubbing against the SMA wire 10. Therefore, it is possible to prevent the SMA wire 10 from being broken due to metal fatigue during use of the drive module 1. Even when no burr occurs, stress concentration on the SMA wire 10 can be avoided at the end of the wire holding portion 15b by forming the curved surface portions 63 and 64.

  Further, since the region 65 in contact with the SMA wire 10 in the wire holding portion 15b is gold-plated P having a thickness of 0.1 μm, the wire holding is performed when the SMA wire 10 is supported and fixed to the wire holding members 15A and 15B. It is possible to prevent the members 15A and 15B and the SMA wire 10 from coming into direct contact. Therefore, since the SMA wire 10 does not contact a burr or the like that may be formed on the wire holding members 15A and 15B, it is possible to prevent the SMA wire 10 from being damaged.

Moreover, when the thickness of the gold plating P is 0.1 μm or more, the SMA wire 10 can be more reliably suppressed from being cut over time. That is, the durability of the SMA wire 10 can be improved.
Therefore, it is possible to provide the drive module 1 having excellent durability and reliability.

Next, an electronic apparatus according to an embodiment of the present invention will be described.
19A and 19B are perspective external views of the front surface and the back surface of the electronic apparatus according to the embodiment of the present invention. FIG.19 (c) is FF sectional drawing in FIG.19 (b).

The camera-equipped mobile phone 20 of this embodiment shown in FIGS. 19A and 19B is an example of an electronic device including the drive module 1 of the above-described embodiment.
The camera-equipped mobile phone 20 includes a known mobile phone device configuration inside and outside the cover 22 such as a reception unit 22a, a transmission unit 22b, an operation unit 22c, a liquid crystal display unit 22d, an antenna unit 22e, and a control circuit unit (not shown). ing.

  Further, as shown in FIG. 19 (b), a window 22A through which external light is transmitted is provided in the cover 22 on the back surface side on which the liquid crystal display unit 22d is provided, and as shown in FIG. 19 (c), The drive module 1 of the first embodiment is installed so that the opening 11A of the drive module 1 faces the window 22A of the cover 22 and the axis M is along the normal direction of the window 22A.

  The drive module 1 is mechanically and electrically connected to the substrate 2. The substrate 2 is connected to a control circuit unit (not shown) so that power can be supplied to the drive module 1.

  According to such a configuration, the light transmitted through the window 22 </ b> A can be collected by the lens unit 12 (not shown) of the drive module 1 and imaged on the image sensor 30. Then, by supplying appropriate power from the control circuit unit to the drive module 1, the lens unit 12 can be driven in the direction of the axis M, and the focal position can be adjusted to perform photographing.

  Moreover, according to such a camera-equipped mobile phone 20, since the drive module 1 of the above embodiment is provided, the SMA wire 10 can be prevented from being cut during use, and the reliability of the product can be improved. An improved camera phone 20 with high accuracy can be provided. Moreover, since the manufacturing of the drive module 1 can be automated, the production efficiency of the product can be improved.

  Note that the present invention is not limited to the above-described embodiment, and includes various modifications made to the above-described embodiment without departing from the spirit of the present invention. That is, the specific shapes, configurations, and the like given in the embodiment are merely examples, and can be changed as appropriate.

  For example, in the present embodiment, the upper fixing pins 13A and 14A and the lower fixing pins 13B and 14B are inserted through the upper plate spring 6 and the lower plate spring 7 which are plate spring members for urging the lens frame 4, Although the example in the case of carrying out the heat crimping of the front-end | tip part of these fixing pins was demonstrated, the fixing method of a leaf | plate spring member is not limited to this. For example, it may be fixed by ultrasonic caulking or the like, or a leaf spring member may be bonded to the lens frame 4 or the module frame 5. According to this structure, a large bonding area can be secured, so that a large strength can be obtained even if an adhesive is used.

  In the above description, the module frame 5 has been described as a substantially rectangular member as a whole, but is not limited to a substantially rectangular shape, and may be a polygonal shape.

  In the above description, the drive module 1 is described as an example in the case of using the focus position adjusting mechanism of the lens unit. However, the use of the drive module is not limited to this. For example, you may use for another part as an appropriate actuator which moves a to-be-driven body to a target position. For example, instead of the lens unit 12, a rod member or the like can be screwed, or the lens frame 4 can be changed to another shape and used as an appropriate actuator. That is, the driven body is not limited to a cylindrical member, and may be a columnar member.

  In the above description, the example of the camera-equipped mobile phone is described as the electronic device using the drive module, but the type of the electronic device is not limited to this. For example, it may be used in an optical device such as a digital camera or a camera built in a personal computer, or in an electronic device such as an information reading storage device or a printer, and can also be used as an actuator for moving a driven body to a target position.

  In the present embodiment, the curved portion is formed in the wire holding portion of the wire holding member and the case where the SMA wire in the wire holding portion is in contact with the SMA wire has been described. However, only one of them is supported. A wire holding member may be used.

  Furthermore, in this embodiment, although the case where the curved surface part was formed in the both sides | surfaces of the wire holding part of a wire holding member was demonstrated, using what formed the curved surface part only in the side surface by which the SMA wire is extended is used. Also good.

  DESCRIPTION OF SYMBOLS 1 ... Drive module 4 ... Lens frame (driven body) 4D1 ... Tip key part (engagement part) 5 ... Module frame (support body) 6 ... Upper leaf spring (leaf spring member) 7 ... Lower leaf spring (leaf spring member) 10 ... SMA wire (shape memory alloy wire, drive means) 15A, 15B ... Wire holding member (holding terminal) 15b ... Wire holding part (holding part) 20 ... Mobile phone with camera (electronic device) 61,62 ... Side 63 , 64 ... curved surface portion

Claims (9)

A driven body;
A support for supporting the driven body;
Driving means for moving the driven body along the fixed direction with respect to the support;
The drive means is engaged with the engagement portion of the driven body, and holds the shape memory alloy wire that moves the driven body by contraction due to heat generation when energized, and both ends of the shape memory alloy wire A holding terminal, wherein the holding terminal is supported and fixed to the support.
A holding portion for holding the shape memory alloy wire is formed on the holding terminal,
An actuator characterized in that a curved surface portion is formed in the holding portion so that the side surface of the holding portion on which the shape memory alloy wire is extended and the shape memory alloy wire are not in contact with each other. A driven body;
A support for supporting the driven body;
Driving means for moving the driven body along the fixed direction with respect to the support;
The drive means is engaged with the engagement portion of the driven body, and holds the shape memory alloy wire that moves the driven body by contraction due to heat generation when energized, and both ends of the shape memory alloy wire A holding terminal, wherein the holding terminal is supported and fixed to the support.
A holding portion for holding the shape memory alloy wire is formed on the holding terminal,
An actuator characterized in that at least a region of the holding portion in contact with the shape memory alloy wire is gold-plated with a thickness of 0.1 μm or more. A driven body;
A support for supporting the driven body;
Driving means for moving the driven body along the fixed direction with respect to the support;
The drive means is engaged with the engagement portion of the driven body, and holds the shape memory alloy wire that moves the driven body by contraction due to heat generation when energized, and both ends of the shape memory alloy wire A holding terminal, wherein the holding terminal is supported and fixed to the support.
A holding portion for holding the shape memory alloy wire is formed on the holding terminal,
A curved surface portion is formed in the holding portion so that the shape memory alloy wire is not in contact with a side surface of the holding portion on which the shape memory alloy wire is extended, and
An actuator characterized in that at least a region of the holding portion in contact with the shape memory alloy wire is gold-plated with a thickness of 0.1 μm or more.   The curved surface part is formed in the said holding part so that the side surface on the opposite side to the side where the said shape memory alloy wire is extended in the said holding part and the said shape memory alloy wire do not contact. Item 4. The actuator according to any one of Items 1 to 3. A cylindrical or columnar driven body;
A support for supporting the driven body;
A leaf spring member that elastically holds the driven body movably along a fixed direction with respect to the support;
Driving means for driving the driven body along a certain direction against the restoring force of the leaf spring member;
The shape memory alloy wire that drives the driven body against the restoring force of the leaf spring member by the driving means being engaged with the engaging portion of the driven body and contracting due to heat generated during energization And a holding terminal that holds both ends of the shape memory alloy wire, and the holding terminal is supported and fixed to the support in the drive module,
A holding portion for holding the shape memory alloy wire is formed on the holding terminal,
A drive module, wherein a curved surface portion is formed in the holding portion so that a side surface of the holding portion on which the shape memory alloy wire extends is not in contact with the shape memory alloy wire. A driven body;
A support for supporting the driven body;
Driving means for moving the driven body along the fixed direction with respect to the support;
The drive means is engaged with the engagement portion of the driven body, and holds the shape memory alloy wire that moves the driven body by contraction due to heat generation when energized, and both ends of the shape memory alloy wire And a holding module, and the holding terminal is supported and fixed to the support body.
A holding portion for holding the shape memory alloy wire is formed on the holding terminal,
A drive module, wherein at least a region in contact with the shape memory alloy wire in the holding portion is plated with gold of a thickness of 0.1 μm or more. A driven body;
A support for supporting the driven body;
Driving means for moving the driven body along the fixed direction with respect to the support;
The drive means is engaged with the engagement portion of the driven body, and holds the shape memory alloy wire that moves the driven body by contraction due to heat generation when energized, and both ends of the shape memory alloy wire And a holding module, and the holding terminal is supported and fixed to the support body.
A holding portion for holding the shape memory alloy wire is formed on the holding terminal,
A curved surface portion is formed in the holding portion so that the shape memory alloy wire is not in contact with a side surface of the holding portion on which the shape memory alloy wire is extended, and
A drive module, wherein at least a region in contact with the shape memory alloy wire in the holding portion is plated with gold of a thickness of 0.1 μm or more.   The curved surface part is formed in the said holding part so that the side surface on the opposite side to the side where the said shape memory alloy wire is extended in the said holding part and the said shape memory alloy wire do not contact. Item 8. The drive module according to any one of Items 5 to 7.   An electronic apparatus comprising the drive module according to claim 5.

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