CN108111724B - Memory alloy wire implantation method for micro optical camera module - Google Patents
Memory alloy wire implantation method for micro optical camera module Download PDFInfo
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- CN108111724B CN108111724B CN201711380507.4A CN201711380507A CN108111724B CN 108111724 B CN108111724 B CN 108111724B CN 201711380507 A CN201711380507 A CN 201711380507A CN 108111724 B CN108111724 B CN 108111724B
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- 229910001285 shape-memory alloy Inorganic materials 0.000 title claims abstract description 94
- 230000003287 optical effect Effects 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000002513 implantation Methods 0.000 title claims abstract description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 239000011229 interlayer Substances 0.000 claims description 21
- 238000003825 pressing Methods 0.000 claims description 5
- 230000003044 adaptive effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B5/06—Swinging lens about normal to the optical axis
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
- H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Lens Barrels (AREA)
- Adjustment Of Camera Lenses (AREA)
Abstract
The invention relates to a memory alloy wire implanting method of a micro optical camera module, which comprises the steps of S1, providing a jig, placing the memory alloy wire in a wire groove formed in the jig, and positioning one end of the memory alloy wire; s2, changing a track line of the wire groove in the jig, enabling the memory alloy wire to deform along with the wire groove, changing the length of the memory alloy wire in the wire groove, cutting a movable end of the memory alloy wire, and obtaining the memory alloy wire with a certain length to be parked in the wire groove of the jig; s3, restoring a wire groove track line in the jig, transferring the memory alloy wire to the micro optical camera module through the jig, and fixedly connecting two ends of the memory alloy wire with the micro optical camera module; and S4, withdrawing the jig, namely completing the implantation of the memory alloy wire on the micro optical camera module. The invention realizes the fixed connection of the memory alloy wire on the micro optical camera module after the grabbing, the adaptive adjustment and the cutting on the jig, has simple process and easy operation, and improves the assembly efficiency and the quality.
Description
Technical Field
The invention relates to the technical field of cameras, in particular to a memory alloy wire implantation method of a micro optical camera module with an optical correction function.
Background
The miniature automatic focusing camera is widely applied to products such as mobile phones, automobiles, unmanned planes, security monitoring, smart homes and the like. The common micro automatic focusing camera module is driven by a micro voice coil motor to drive a lens to move up and down in the direction of an optical axis, and the voice coil motor is driven to move through a control chip during photographing, so that the automatic focusing function is realized. When taking a picture or taking a picture, the camera lens can not keep absolutely steady because of the shake of people or other reasons, produces certain skew, and the focus and the light inlet amount of camera all can receive the influence this moment, and then influences the quality that the camera acquireed the image. Generally, such lens deflection occurs in a direction perpendicular to the optical axis, and the auto-focus voice coil motor can only drive the lens to move in the optical axis direction, so that the problem caused by such lens deflection cannot be solved. An optical anti-shake actuator is added on the basis of an automatic focusing voice coil motor to drive a lens to move in two directions vertical to an optical axis, so that the deflection of the lens can be compensated, and the camera is helped to acquire better image quality.
The real sense of the miniature optical anti-shake camera motor is a closed-loop control system, the gyroscope detects the shake parameters of the lens and feeds the shake parameters back to the camera module control chip, and the camera module control chip calculates the corrected angle or displacement according to the position information provided by the lens position sensor and sends an instruction to drive the anti-shake actuator to reach the specified position, so that the displacement deflection of the lens caused by shake is corrected, and better image quality is obtained by photographing or shooting.
In the prior art, the same method can be adopted in two directions perpendicular to the optical axis as driving the lens to move in the optical axis direction, that is, the method can be realized by adopting a miniature voice coil motor. The common miniature voice coil motor generates Lorentz magnetic force in a magnetic field by an electrified coil to drive the lens to move; however, to realize optical anti-shake, the lens needs to be driven in at least two directions, which means that a plurality of coils need to be arranged, and thus, the miniaturization of the whole structure is challenging. For this reason, the micro-actuator using the voice coil motor principle for optical anti-shake generally integrates a plurality of coils on one circuit board, which is called as FP coil, thereby solving the size problem of the optical anti-shake actuator. However, the micro vcm optical anti-shake actuator and the autofocus micro vcm are separate, and the lens is usually mounted in the autofocus micro vcm, and the lens is moved in a direction perpendicular to the optical axis, that is, the lens moves along with the autofocus micro vcm. Therefore, the assembly process of the micro optical anti-shake camera module is more difficult, and the structural reliability of the whole micro motor is reduced. Subsequently, a micro optical camera module using a memory alloy wire to drive an auto-focus voice coil motor to move in a direction perpendicular to an optical axis is proposed, as shown in fig. 1, the module includes a protective cover 101, a lens 102, an auto-focus voice coil motor 103, an image sensor module 104, and a micro memory alloy optical anti-shake actuator 105, the lens 102 is fixed on the auto-focus voice coil motor 103, the micro memory alloy optical anti-shake actuator 105 includes a lens mounting hole adapted to mount the lens 102, and the image sensor module 104 transmits an image captured by the lens 102. The automatic focusing voice coil motor 103 is fixed on the micro memory alloy optical anti-shake actuator 105, and the control chip pulls the automatic focusing voice coil motor 103 to move based on the length change of the memory alloy wire 106 on the micro memory alloy optical anti-shake actuator 105, so as to realize shake compensation of the lens 102. However, in the conventional micro optical camera module using memory alloy wires, the memory alloy wire implantation assembly method is as follows: the memory alloy wire with the corresponding length is measured and cut, and then the memory alloy wire is grabbed and assembled on the micro memory alloy optical anti-shake actuator.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a memory alloy wire implantation method of a micro optical camera module, so that the assembly efficiency and quality are improved.
In order to achieve the purpose, the invention adopts the following technical scheme:
the memory alloy wire implanting method for micro optical camera module includes the following steps:
s1, providing a jig, placing the memory alloy wire in a wire groove formed in the jig, and positioning one end of the memory alloy wire;
s2, changing a track line of the wire groove in the jig, enabling the memory alloy wire to deform along with the wire groove, changing the length of the memory alloy wire in the wire groove, cutting a movable end of the memory alloy wire, and obtaining the memory alloy wire with a certain length to be parked in the wire groove of the jig;
s3, restoring a wire groove track line in the jig, transferring the memory alloy wire to the micro optical camera module through the jig, and fixedly connecting two ends of the memory alloy wire with the micro optical camera module;
and S4, withdrawing the jig, namely completing the implantation of the memory alloy wire on the micro optical camera module.
In the scheme, the change of the track line of the wire groove of the jig is obtained by moving the movable block on the jig, and the movable block pushes the middle section of the memory alloy wire to move and deform when moving.
In the above scheme, the movable block is provided with a groove, the groove belongs to one part of the wire groove of the jig, and the movable block moves linearly.
In the above scheme, the part of the micro optical camera module fixedly connected with the memory alloy wire is a wire grabbing part on the anti-shake actuator, the wire grabbing part is provided with an upper interlayer and a lower interlayer, the two interlayers clamp the end of the memory alloy wire, a pressing interface between the two interlayers presents a tooth-shaped occlusion point, and the end of the memory alloy wire is bent along with the occlusion point.
In the scheme, the upper interlayer and the lower interlayer of the line grabbing part are of a line grabbing part folding structure, and the occlusion point is formed by the upper interlayer and the lower interlayer based on the upper die sinking.
In the scheme, the occlusion point is in the form of a groove which is vertically crossed with the memory alloy wire.
In the scheme, the cross section of the occlusion point is in a concave arc shape.
By adopting the method, the memory alloy wire is implanted to the micro optical camera module to be fixedly connected after the memory alloy wire is grabbed, adaptively adjusted and cut on the jig, the process is simple, the operation is easy, and the assembly efficiency and the assembly quality are improved.
Description of the drawings:
FIG. 1 is a schematic diagram of a prior art structure;
FIG. 2 is a schematic assembly flow diagram of the present invention;
FIG. 3 is a schematic structural view of an embodiment of a portion of the micro optical camera module of the present invention fixedly connected to a memory alloy wire;
fig. 4 is an enlarged schematic view of the combined structure of the embodiment of fig. 3.
The specific implementation mode is as follows:
the conception, the specific structure and the technical effects of the present invention will be further described with reference to the accompanying drawings to fully understand the objects, the features and the effects of the present invention.
Referring to fig. 2, the present invention relates to a method for implanting a memory alloy wire of a micro optical camera module, the method comprising the steps of:
s1, providing a fixture 1, placing the memory alloy wire 2 in the slot 11 of the fixture, and positioning one end of the memory alloy wire 2. In this embodiment, a position sensor 5 is used to position the point B of the memory alloy wire 2, and the other end of the memory alloy wire 2 is fed by a roller 6.
S2, changing a track line of the wire groove in the jig 1, enabling the memory alloy wire 2 to deform along with the wire groove 11, changing the length of the memory alloy wire in the wire groove, cutting a movable end (namely point A) of the memory alloy wire, and obtaining the memory alloy wire 2 with a certain length to be parked in the wire groove 11 of the jig;
s3, restoring a wire groove track line in the jig 1, transferring the memory alloy wire 2 to the micro optical camera module through the jig, and fixedly connecting two ends of the memory alloy wire 2 with the micro optical camera module;
s4, withdrawing the jig 1, and completing the implantation of the memory alloy wire on the micro optical camera module.
The invention realizes that the memory alloy wire is implanted to the micro optical camera module to be fixedly connected after being grabbed, adaptively adjusted and cut on the jig, is suitable for adjusting the length of the memory alloy wire on line, meets the assembly requirements of different occasions, and simultaneously transfers the memory alloy wire 2 to the micro optical camera module by using the jig, and fixedly connects two ends of the memory alloy wire 2 with the micro optical camera module; no additional grasping step is required. Simple process, easy operation promotes packaging efficiency and quality.
As shown in fig. 2, the track line change of the wire groove of the jig 1 of the present embodiment is obtained by moving the movable block 12 on the jig, and the movable block 12 pushes the middle section of the memory alloy wire 2 to move and deform when moving. In the figure, the movable block 12 has a groove 121, the groove 121 belongs to a part of the wire casing 11 of the jig, and the movable block 12 moves linearly. The groove 121 is curved, so that the middle section of the memory alloy wire 2 is driven to move and deform conveniently when the movable block 12 moves, and the memory alloy wire is reduced from being damaged. The length of the memory alloy wire can be adjusted according to the assembly requirement by reciprocating the movable block 12, the adjustment is convenient and quick, and the assembly efficiency and the assembly quality are improved.
In the embodiment shown in fig. 3 and 4, the portion of the micro optical camera module fixedly connected with the memory alloy wire is the wire-grabbing portion 31 on the anti-shake actuator 3, the wire-grabbing portion 31 is provided with upper and lower interlayers 311, the two interlayers 311 clamp the end of the memory alloy wire 2, the pressing interface between the two interlayers 311 presents a tooth-shaped engagement point 312, and the end of the memory alloy wire 2 bends along with the engagement point 312. The anti-falling and anti-pulling memory alloy wire is simple in structure, stable and reliable in connection, the end of the memory alloy wire and the anti-falling actuator are connected with a plurality of clamping points, and the anti-falling and anti-pulling memory alloy wire has excellent anti-falling and anti-pulling performance. The end of the memory alloy wire is bent along with the occlusion point, so that the structure body of the memory alloy wire is maintained, beneficial alloy elements are not damaged, the use performance is ensured, and the service life is long.
As shown in fig. 3 and 4, the upper and lower layers 311 of the thread catching portion 31 of the present embodiment have a folded structure of the thread catching portion 31, and thus have an integral structure, a good structure, and a convenient manufacturing. The engagement point 312 is formed by the upper interlayer 311 and the lower interlayer 311 which are formed by being dented on the die 4, and the assembly structure is simplified and the cost is reduced through cold pressing assembly. The nip point 312 is in the form of a groove perpendicularly crossed with the memory alloy wire 2, and the cross section of the nip point 312 is in a concave arc shape. The structure is convenient for cold pressing and assembling, the memory alloy wire 2 is also stably and fixedly connected, excellent anti-falling and tensile properties are achieved, meanwhile, the structural body of the memory alloy wire is not damaged, and the use performance is ensured.
The present invention has been described in detail with reference to the embodiments, but the technical concept and the features of the present invention are not limited thereto, and it is intended that the present invention is implemented by those skilled in the art, and therefore, all equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (5)
1. The memory alloy wire implantation method of the micro optical camera module is characterized in that: the method comprises the following steps:
s1, providing a jig, placing the memory alloy wire in a wire groove formed in the jig, and positioning one end of the memory alloy wire; the change of the track line of the wire groove of the jig is obtained by moving a movable block on the jig, and the movable block pushes the middle section of the memory alloy wire to move and deform when moving; the movable block is provided with a groove, the groove belongs to one part of a wire groove of the jig, and the movable block moves linearly;
s2, changing a track line of the wire groove in the jig, enabling the memory alloy wire to deform along with the wire groove, changing the length of the memory alloy wire in the wire groove, cutting a movable end of the memory alloy wire, and obtaining the memory alloy wire with a certain length to be parked in the wire groove of the jig;
s3, restoring a wire groove track line in the jig, transferring the memory alloy wire to the micro optical camera module through the jig, and fixedly connecting two ends of the memory alloy wire with the micro optical camera module;
and S4, withdrawing the jig, namely completing the implantation of the memory alloy wire on the micro optical camera module.
2. The method for implanting a memory alloy wire of a micro optical camera module according to claim 1, wherein: the micro optical camera module is fixedly connected with the memory alloy wire, the wire grabbing part on the anti-shake actuator is provided with an upper interlayer and a lower interlayer, the two interlayers clamp the end of the memory alloy wire, the pressing interface between the two interlayers presents an occlusion point of a tooth shape, and the end of the memory alloy wire bends along with the occlusion point.
3. The method for implanting a memory alloy wire of a micro optical camera module according to claim 2, wherein: the upper interlayer and the lower interlayer of the line grabbing part are of a folded structure of the line grabbing part, and the occlusion point is formed by the upper interlayer and the lower interlayer based on the upper concave of the mold.
4. The method for implanting the memory alloy wire of the micro optical camera module according to claim 2 or 3, wherein: the bite point is in the form of a groove that intersects the memory alloy wire perpendicularly.
5. The method for implanting a memory alloy wire of a micro optical camera module according to claim 2, wherein: the cross section of the occlusion point is in a concave arc shape.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711380507.4A CN108111724B (en) | 2017-12-20 | 2017-12-20 | Memory alloy wire implantation method for micro optical camera module |
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| CN201711380507.4A CN108111724B (en) | 2017-12-20 | 2017-12-20 | Memory alloy wire implantation method for micro optical camera module |
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| CN108111724B true CN108111724B (en) | 2020-05-19 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109061827A (en) * | 2018-09-13 | 2018-12-21 | 昆山联滔电子有限公司 | Lens driving apparatus and camera module |
| CN111988453B (en) * | 2019-05-23 | 2021-11-05 | 荣耀终端有限公司 | Lifting mechanism, camera device and mobile terminal |
| CN112953160B (en) * | 2019-11-26 | 2022-02-11 | 华为技术有限公司 | Assembling system and assembling method of memory alloy motor module |
| CN110908066A (en) * | 2019-12-12 | 2020-03-24 | 东莞市亚登电子有限公司 | Multi-axis optical anti-shake and focusing device, camera module, and electronic apparatus |
| US20230229059A1 (en) * | 2022-01-14 | 2023-07-20 | Aac Optics (Suzhou) Co., Ltd. | Autofocus device based on movable sensor driven by sma wire |
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| CN205987121U (en) * | 2016-08-25 | 2017-02-22 | 东莞市亚登电子有限公司 | Miniature optical anti -vibration camera module structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US9454016B1 (en) * | 2015-03-06 | 2016-09-27 | Hutchinson Technology Incorporated | Camera lens suspension with integrated electrical leads |
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| GB2330545B (en) * | 1997-09-29 | 2001-03-14 | Whitaker Corp | Apparatus and method for preparing wires in a harness making machine |
| JP2011107413A (en) * | 2009-11-17 | 2011-06-02 | Morioka Seiko Instruments Inc | Actuator, drive module, and electronic equipment |
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