JP2010020177A - Drive module and electronic device having the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a drive module that can be reduced in size and suppress plastic deformation of a plate spring member due to drop impact, and to provide an electronic device having the same. <P>SOLUTION: The drive module includes: a tubular or cylindrical driven body 4; a tubular support 5 accommodating the driven body therein; and a plate spring member 7 elastically holding the driven body so as to move along a fixed direction relative to the support. The plate spring member includes: an outer ring 7G fixed to the axial end of the support; an inner ring 7F fixed to the axial end of the driven body; and a spring 7E extending circumferentially between the outer ring and inner ring and connected to the outer ring and inner ring at both ends thereof. In such a drive module, the support has a recess 5F in a circumferential position corresponding to at least a central part of the spring in the lengthwise direction. The recess is formed from the axial end to the axial central part of the support, and from radially inside to outside of the support. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a drive module and an electronic apparatus including the drive module. For example, the present invention relates to a drive module that is suitable for adjusting the focal position by driving an optical system or a movable member, or using the actuator as an actuator, and an electronic apparatus including the drive module.

Conventionally, in a small electronic device such as a mobile phone with a camera function, a driven body such as an imaging lens unit, a module frame provided with the driven body on the inner periphery, and held on both end faces of the module frame A lens driving device including a leaf spring has been proposed (see, for example, Patent Document 1).
For example, in the lens driving device disclosed in Patent Document 1, a plate spring (holder spring) that can be in contact with both end surfaces of a driven body (movable member) is held by a module frame (optical system housing), and the plate spring is not covered. By urging from both sides of the driving body, the position of the driven body is held at an optimum position. The leaf spring is configured such that the outer ring is held by the module frame, the inner ring is held by the driven body, and a portion connecting the outer ring and the inner ring functions as a spring.
JP 2005-173431 A

  In recent years, since such electronic devices are going to be further miniaturized, lens drive devices are also being miniaturized. When trying to reduce the size in the lens driving device of Patent Document 1, the outer ring portion of the leaf spring becomes smaller, and the gap between the spring portion connecting the outer ring and the inner ring and the wall portion of the module frame decreases. Become. As shown in FIG. 8, in the lens driving device having such a configuration, when a drop impact S is applied from a direction perpendicular to the optical axis (in the direction of the side wall 5E of the module frame 5), the direction opposite to the direction of the drop impact S is applied. The lens frame 4 moves in the direction of the arrow M. Then, since the leaf spring 7 is joined to the lens frame 4 and the fixing pin 13B, a force is applied in a direction in which a part (7Ea) of the spring portion 7E of the leaf spring 7 is compressed, and the spring portion 7Ea is connected to the outer ring 7G. The buckling deformation occurred in the direction (arrow Z direction), and contacted with the side wall 5E of the module frame 5, and the spring portion 7Ea might be plastically deformed. When the spring portion 7Ea is plastically deformed, the driven body is tilted or floated with respect to the optical axis direction. For example, when the floating occurs, the initial position of the driven body changes, so that the focal point at infinity is shifted, and the amount of movement of the driven body (lens unit) is also reduced.

  Therefore, the present invention has been made in view of the above circumstances, and provides a drive module capable of reducing the size and suppressing plastic deformation of a leaf spring member due to a drop impact, and an electronic apparatus including the drive module. Is.

In order to solve the above problems, the present invention provides the following means.
A drive module according to the present invention includes a cylindrical or columnar driven body, a cylindrical support body that accommodates the driven body inside, and the driven body along a certain direction with respect to the support body. A leaf spring member that is elastically held so as to be movable, the leaf spring member being fixed to an axial end portion of the support body, and an inner side being fixed to the axial end portion of the driven body In the drive module having a ring and a spring portion extending in a circumferential direction between the outer ring and the inner ring and having both ends connected to the outer ring and the inner ring, the support body includes A concave portion is provided at a circumferential position corresponding to at least a central portion in the length direction of the spring portion, and the concave portion is directed from the axial end portion of the support toward the axial central portion, and Radial inner side to radial outer side of support It is characterized in that it is headed formed.

With this configuration, when a drop impact is applied to the drive module from a direction perpendicular to the axis of the support, the spring portion of the leaf spring member is deformed laterally (in the radial direction of the support). By forming the recessed portion in the upper surface, the collision between the spring portion and the support can be avoided. Therefore, even if a drop impact is applied to the drive module, it is possible to suppress plastic deformation from occurring in the spring portion of the leaf spring member, and it is possible to suppress the tilting and floating of the driven body.
Moreover, since the amount of deformation of the spring portion can be suppressed in the recessed portion by enlarging the recessed portion, the support can be reduced in size. As a result, since it is not necessary to increase the gap between the support and the spring portion, the drive module can be reduced in size.

Further, the recessed portion is formed at a predetermined height from the axial end portion of the support body toward the axial center portion, and penetrates in the radial direction of the support body. The support body is formed to a height corresponding to at least a movable range of the driven body from the axial end portion of the support body toward the axial center portion, and from the radially inner side of the support body to the radial direction. And a step portion formed toward the outside.
By configuring in this way, for the vicinity of the initial position where the driven body is likely to be located, a through portion having a predetermined height in the axial direction is formed by penetrating the support body in the radial direction. Further, it is possible to more reliably suppress the occurrence of plastic deformation of the spring portion against a drop impact on the drive module. In addition, by forming a stepped portion at a position corresponding to the movable range of the driven body, the plastic deformation of the spring portion due to the drop impact of the drive module can be generated at any position within the movable range of the driven body. Can be suppressed. Moreover, the strength of the support can be ensured by forming the through portion and the step portion in this manner. Therefore, it is possible to reduce the size of the drive module and to suppress the occurrence of problems due to drop impact.

In addition, an electronic apparatus according to the present invention includes the above-described drive module.
In the electronic device according to the present invention, a drive module that can be downsized and can suppress plastic deformation of the leaf spring member due to a drop impact is used. Therefore, a small and highly accurate electronic device can be provided.

According to the drive module according to the present invention, when a drop impact is applied to the drive module from the direction perpendicular to the axis of the support, the spring portion of the leaf spring member is deformed laterally (in the radial direction of the support). A collision between the spring portion and the support can be avoided by forming the recess in the support. Therefore, even if a drop impact is applied to the drive module, it is possible to suppress plastic deformation from occurring in the spring portion of the leaf spring member, and it is possible to suppress the tilting and floating of the driven body.
Moreover, since the amount of deformation of the spring portion can be suppressed in the recessed portion by enlarging the recessed portion, the support can be reduced in size. As a result, since it is not necessary to increase the gap between the support and the spring portion, the drive module can be reduced in size.

Next, an embodiment of a drive module according to the present invention will be described with reference to FIGS.
FIG. 1 is a perspective view of a drive module according to the first embodiment of the present invention. FIG. 2 is an exploded perspective view showing a schematic configuration of the drive module according to the first embodiment of the present invention. FIG. 3 is an exploded perspective view showing a schematic configuration of the drive unit according to the first embodiment of the present invention. FIG. 4 is a perspective view of the drive unit according to the first embodiment of the present invention. FIG. 5 is a cross-sectional view taken along the line AA in FIG. FIG. 6 is a side view of the drive module according to the first embodiment of the present invention. FIG. 7 is a rear perspective view of the module frame according to the first embodiment of the present invention. FIG. 8 is a rear perspective view showing a state where even the lower leaf spring of the drive unit according to the first embodiment of the present invention is attached. FIG. 9 is a plan view of the upper leaf spring according to the first embodiment of the present invention. In some of the drawings, for the sake of clarity, for example, components such as the lens unit 12 are omitted as appropriate.

  As shown in FIGS. 1 and 2, the drive module 1 of the present embodiment is formed in a box shape as a whole. The drive module 1 is assembled and completed, and is attached to an electronic device or the like. The drive module 1 is fixed on a board (not shown) for supplying a control signal or power to the drive module 1 by bonding or bonding. The The drive module 1 includes an adapter 30 located on the substrate, a drive unit 31 disposed on the adapter 30, and a cover 11 disposed so as to cover the drive unit 31.

  As shown in FIG. 3, the drive unit 31 includes a lens frame 4 as a driven body, a module frame 5 as a support, an upper leaf spring 6 and a lower leaf spring 7 as leaf spring members, a module lower plate 8, and a power supply. The member 9 and the shape memory alloy (hereinafter abbreviated as SMA) wire 10 are the main constituent members, and these constituent members are laminated together to form one actuator.

  3 to 6, in the assembled state of these members, the lens frame 4 is inserted inward of the module frame 5, and the upper leaf spring 6 and the lower leaf spring 7 are connected to the lens frame 4 and the module frame. The module lower plate 8 and the power supply member 9 are stacked in this order from the lower side of the figure and are fixed together by caulking from the lower side of the module frame 5. ing. A cover 11 that covers these laminates from above is fixed to the module lower plate 8.

  In addition, the code | symbol M in a figure is a virtual axis line of the drive module 1 which corresponds to the optical axis of the lens unit 12 (refer FIG. 5), and has shown the drive direction of the lens frame 4. FIG. In the following, for the sake of simplicity of explanation, in the explanation of each disassembled component member, the position and direction may be referred to based on the positional relationship with the axis M at the time of assembly. For example, even when there is no clear circle or cylindrical surface in the component, unless there is a risk of misunderstanding, the direction along the axis M is simply the axial direction, the radial direction of the circle centering on the axis M, and the circumferential direction. Sometimes simply referred to as the radial direction and the circumferential direction. Further, unless otherwise specified, the vertical direction refers to the vertical direction in the arrangement when the axis M is arranged in the vertical direction and the mounting surface of the drive module 1 is vertically downward.

  Among these components, the lens frame 4 as a driven body is formed in a cylindrical shape as a whole as shown in FIG. 3, and penetrates the center thereof and is formed coaxially with the axis M. A female screw is formed on the inner peripheral surface 4F of the cylindrical accommodating portion 4A (driven body). The housing unit 4A can be fixed by screwing a lens unit 12 holding an appropriate lens or lens group in a lens barrel having a male screw formed on the outer periphery thereof.

  On the outer wall surface 4B of the lens frame 4, a protruding portion 4C (convex portion) that protrudes outward in the radial direction is extended in the axial direction at an interval of approximately 90 degrees in the circumferential direction. The upper and lower fixing pins 13A and 13B projecting upward and downward along the axis M on the end surfaces 4a and 4b, which are planes orthogonal to the axis M, at the upper end and the lower end of the part 4C. There are four each. The upper fixing pin 13 </ b> A holds the upper leaf spring 6, and the lower fixing pin 13 </ b> B holds the lower leaf spring 7.

  The positions of the upper fixing pin 13A and the lower fixing pin 13B in plan view may be different from each other, but are arranged at a coaxial position parallel to the axis M in this embodiment. For this reason, the insertion positions of the upper fixing pin 13A and the lower fixing pin 13B in the upper plate spring 6 and the lower plate spring 7 are made common.

  Further, the center positions in the radial direction of the upper fixing pin 13A and the lower fixing pin 13B may be different, but in the present embodiment, they are arranged on the same circumference. For this reason, the respective center positions are arranged in a square lattice pattern.

  On the radially outer side of the lens frame 4, a guide protrusion 4D (protrusion) is provided so as to protrude radially outward from the lower end side of one protrusion 4C. As shown in FIG. 4, the guide protrusion 4D locks the SMA wire 10 to the distal end key portion 4D1, and moves the guide protrusion 4D upward (in the direction of the arrow (A)) by contraction of the SMA wire 10. It is for making it happen. The guide protrusion 4D is formed with a columnar spring holding portion 33 extending upward in parallel with the axis M. A coil spring 34 (see FIG. 2) is inserted into the spring holding portion 33 and urges the lens frame 4 downward by the urging force of the coil spring 34. Accordingly, it is possible to suppress the movement of the SMA wire 10 that is contracted due to the influence of the surrounding environment and the like to raise the lens frame 4. The lens frame 4 is integrally formed of a thermoplastic resin capable of thermal caulking or ultrasonic caulking, such as polycarbonate (PC) or liquid crystal polymer (LCP) resin.

As shown in FIG. 3, the module frame 5 has a substantially rectangular outer shape in plan view, and a housing portion 5 </ b> A including a through hole formed coaxially with the axis M is formed at the center thereof. Moreover, it is a cylindrical member, Comprising: The lens frame 4 is accommodated in this accommodating part 5A.
At the upper and lower corners of the module frame 5, end faces 5a and 5b made of a plane orthogonal to the axis M are formed, and an upper fixing pin 14A (second fixing pin part) is formed upward from the end face 5a. Four lower fixing pins 14B (second fixing pin portions) are provided from the end surface 5b downward.

  The upper fixing pin 14 </ b> A holds the upper leaf spring 6, and the lower fixing pin 14 </ b> B holds the lower leaf spring 7, the module lower plate 8, and the power feeding member 9. Note that the position of the upper fixing pin 14A in plan view may be different from the arrangement of the lower fixing pin 14B, but in this embodiment, they are arranged at coaxial positions parallel to the axis M, respectively. For this reason, the insertion positions of the upper fixing pin 14A and the lower fixing pin 14B in the upper leaf spring 6 and the lower leaf spring 7 are made common. Further, the distance between the end faces 5 a and 5 b is set to be the same distance as the distance between the end faces 4 a and 4 b of the lens frame 4.

  A notch 5B having a size in which the groove width in a plan view is fitted to the guide projection 4D of the lens frame 4 so as to be movable in the axial direction is formed at a lower portion of one corner of the module frame 5. The notch 5B penetrates the guide projection 4D of the lens frame 4 in a state in which the lens frame 4 is inserted and accommodated in the module frame 5 from below, and the tip key portion 4D1 of the guide projection 4D is inserted into the diameter of the module frame 5. This is for projecting outward in the direction and positioning the lens frame 4 in the circumferential direction.

  Further, at two corners adjacent to the notch 5B of the module frame 5, wire holding members 15A and 15B for holding the SMA wire 10 on the side surface on the same direction side as the corner provided with the notch 5B (see FIG. A pair of locking grooves 5C for attaching 3) and 4) is formed.

  Further, pins 35A and 35B are formed on the side wall 5E of the module frame 5 at positions where the wire holding members 15A and 15B are arranged. Further, a groove portion 36 that is filled with an adhesive and fixes the module frame 5 and the wire holding members 15A and 15B is formed below the pins 35A and 35B. And when fixing wire holding member 15A, 15B to the module frame 5, the wall part 35C which can suppress that wire holding member 15A, 15B rotates is formed. The wall portion 35 </ b> C extends from the side wall 5 </ b> E of the module frame 5 to the side (perpendicular to the side surface).

Here, as shown in FIGS. 3 to 7, notches 5 </ b> F are formed on all four sides at the lower end of the side wall 5 </ b> E of the module frame 5 (on the side where the lower leaf spring 7 is disposed). The width W1 of the cutout portion 5F is a size corresponding to a region where the spring portion 7E (detailed later) can be deformed in the event of a drop impact, and has a size that does not hinder the structure (in terms of strength) of the module frame 5. Is formed. Further, as shown in FIG. 7, the height H1 of the notch portion 5F is such that the spring portion 7E is disposed at the initial position and the lens frame 4 is moved and the spring portion 7E is deformed. It is formed at a height corresponding to a region where the spring portion 7E can be deformed in the case of a drop impact, and at a height that does not hinder the structure of the module frame 5.
Furthermore, a stepped portion 5H is formed on the inner surface 5G of the side wall 5E of the module frame 5 along the axial direction of the module frame 5 connected to the notch portion 5F and from the inside to the outside of the module frame 5. ing. The width of the step portion 5H is formed to be substantially the same as that of the notch portion 5F, and the height H2 of the step portion 5H is a height that can cover the entire movable range of the lens frame 4, that is, the height H1. And H <b> 2 are formed so as to be greater than or equal to the movable range of the lens frame 4. Further, the width and height H2 of the stepped portion 5H are formed with a height that does not hinder the structure of the module frame 5.

  Further, in the present embodiment, the module frame 5 is integrally formed of a thermoplastic resin capable of thermal caulking or ultrasonic caulking, for example, polycarbonate (PC), liquid crystal polymer (LCP) resin, or the like, similarly to the lens frame 4. .

  As shown in FIG. 4, the wire holding member 15 </ b> A is attached to the side surface on the side where the pair of terminal portions 9 </ b> C of the power supply member 9 protrudes from the drive module 1, and the wire holding member 15 </ b> B is attached from the drive module 1 to the power supply member 9. The pair of terminal portions 9C are attached to the side surface (surface adjacent to the surface on which the terminal portions 9C are disposed) on the side where the terminal portions 9C are not projected.

  The wire holding members 15A and 15B are conductive members such as a metal plate formed in a key shape in which the end of the SMA wire 10 is caulked to the wire holding portion 15b. The wire holding members 15A and 15B are formed with through holes 36A and 36B that fit into the pins 35A and 35B of the module frame 5, respectively. Further, through holes 37A and 37B for pouring the adhesive are formed below the through holes 36A and 36B, respectively. Then, when the module frame 5 and the wire holding members 15A and 15B are fixed, the arm portions 38A and 38B for contacting the wall portion 35C of the module frame 5 and suppressing the rotation of the wire holding members 15A and 15B. Are formed respectively. The end portion of the SMA wire 10 is positioned and held by fitting the locking portion 5C and the pins 35A and 35B from the side and bringing the wall portion 35C and the arm portions 38A and 38B into contact with each other.

  As shown in FIG. 4, the wire holding members 15 </ b> A and 15 </ b> B are provided with a piece-like terminal portion 15 a on the side opposite to the crimping position of the SMA wire 10, and the terminal portion 15 a is attached to the module frame 5. It protrudes slightly below the module lower plate 8 stacked below.

  Further, the SMA wire 10 held at both ends by the pair of wire holding members 15A and 15B is locked from below to the front end key portion 4D1 of the guide projection 4D of the lens frame 4 protruding from the notch 5B of the module frame, The lens frame 4 is urged upward by the tension of the SMA wire via the distal end key portion 4D1.

As shown in FIGS. 3 and 4, an upper leaf spring 6 and a lower leaf spring 7 are laminated on the upper and lower portions of the module frame 5 and the lens frame 4 inserted into the module frame 5, respectively.
The upper leaf spring 6 and the lower leaf spring 7 are flat plate spring members punched into substantially the same shape, and are metal plates made of, for example, a stainless steel (SUS) steel plate. Below, although the structure of the lower leaf | plate spring 7 is demonstrated, the structure of the upper leaf | plate spring 6 is also substantially the same.

  As shown in FIGS. 8 and 9, the shape of the lower leaf spring 7 (upper leaf spring 6) is a substantially rectangular shape whose outer shape in plan view is similar to the lower (upper) end of the module frame 5. A circular opening 7C (6C) that is coaxial with the axis M and is slightly larger than the inner peripheral surface 4F of the lens frame 4 is formed in the central portion, and has a ring shape as a whole.

  In the vicinity of the corner of the lower leaf spring 7 (upper leaf spring 6), the lower fixing pin 14B (upper fixing pin 14A) formed in the vicinity of the corner of the module frame 5 corresponds to the position of each lower side. Four through holes 7B (6B) that can be respectively inserted into the fixing pins 14B (upper fixing pins 14A) are formed. Thereby, positioning in the plane orthogonal to the axis line M with respect to the module frame 5 is possible.

  Further, the lower plate spring 7 (upper plate spring 6) corresponds to the position of the lower side fixing pin 13B (upper side fixing pin 13A) formed on the lens frame 4, and each lower side fixing pin 13B (upper side fixing). Four through-holes 7A (6A) that can be respectively inserted into the pins 13A) are provided.

  Further, a ring portion 7F (6F) is formed on the outer side in the radial direction of the opening 7C (6C), and in a circumferential direction from a position in the vicinity of the through holes 7A (6A) that face each other diagonally across the axis M. Four slits 7D (6D) extending in a substantially semicircular arc shape are formed so as to overlap each other in a radial direction by approximately a quarter arc.

  As a result, four spring portions 7E (6E) extended in a substantially quadrant arc shape from the rectangular frame 7G (6G) outside the lower leaf spring 7 (upper leaf spring 6), one by one. A leaf spring member extending in the vicinity of the through hole 7A (6A) is formed.

  Thus, the outer shape of the lower leaf spring 7 (upper leaf spring 6) is provided in a rectangular shape substantially matching the outer shape of the module frame 5, and the spring portion 7E (6E) and the ring portion 7F (6F) are formed in the opening 7C ( 6C) is formed in a ring-shaped region. Then, depending on the arrangement of the lower fixing pin 14B (upper fixing pin 14A) for fixing the lower leaf spring 7 (upper leaf spring 6) to the module frame 5, a through-hole that is a fixed portion is provided at a corner having a sufficient space. Since the hole 7B (6B) is provided, the shape of the through-hole 7B (6B) can be separated from the spring portion 7E (6E), and therefore manufacturing by precision punching or etching is facilitated.

  The module lower plate 8 allows the lower fixing pins 14B of the module frame 5 to pass through the through holes 7B of the lower leaf spring 7, and the lower fixing pins 13B of the lens frame 4 accommodated in the module frame 5 are lower plates. The lower plate spring 7 is stacked between the module frame 5 with the lower plate spring 7 sandwiched from the lower side in a state of passing through the through hole 7A of the spring 7, and the rectangular outer frame of the lower plate spring 7 is attached to the end surface of the module frame 5. It fixes to a pressing state with respect to 5b.

  The shape of the module lower plate 8 is a plate-like member having a rectangular outer shape that is substantially the same as the outer shape of the module frame 5, and a substantially circular opening 8 </ b> A centering on the axis M penetrates in the center in the thickness direction. Is formed. Then, on the upper surface 8a side laminated on the lower leaf spring 7 at the time of assembly, four positions for avoiding interference with a caulking portion described later are provided at positions corresponding to the positions of the lower fixing pins 13B of the lens frame 4. A U-shaped recess 8B is formed. In addition, through holes 8C through which the lower fixing pins 14B are inserted are formed at the corners located on the periphery of the module lower plate 8 corresponding to the positions of the lower fixing pins 14B of the module frame 5. ing. The material of the module lower plate 8 is, for example, a synthetic resin having electrical insulation and light shielding properties. Further, since the module lower plate 8 has electrical insulation, it is an insulating member that fixes the power supply member 9 to the lower plate spring 7 in an electrically insulated state.

  The power supply member 9 includes a pair of electrodes 9a and 9b each formed of a plate-shaped metal plate. Each of the electrodes 9a and 9b includes a substantially L-shaped wiring portion 9B that follows the outer shape of the module lower plate 8, and a terminal portion 9C that protrudes outside the outer shape of the module lower plate 8 from the end of the wiring portion. It consists of a polygonal metal plate. Each of the wiring portions 9B has two lower fixing pins adjacent to each other along the outer shape of the module lower plate 8 out of the lower fixing pins 14B of the module frame 5 protruding downward from the lower surface of the module lower plate 8. Two through-holes 9 </ b> A for positioning the electrodes 9 a and 9 b with respect to the module frame 5 by inserting the pins 14 </ b> B are provided.

  In the present embodiment, as shown in FIG. 4, the terminal portions 9C of the electrodes 9a and 9b are projected in parallel downward in the axial direction from the side surface of the module frame 5 on which the wire holding member 15A is attached. Is provided.

  For this reason, the electrode 9a is conductively cut in a concave shape to electrically connect the terminal portion 15a of the wire holding member 15A to the side surface on the wiring portion 9B between the through hole 9A and the terminal portion 9C. A connecting portion 9D is provided.

  In addition, the electrode 9b is formed with a conductive connection portion 9D that is notched at a connection portion with the terminal portion 15a of the wire holding member 15B on the side surface of the wiring portion 9B. In the conductive connection portion 9D, the electrode 9b and the wire holding member 15B are electrically connected.

  As means for electrically connecting each conductive connection portion 9D to the terminal portion 15a, for example, soldering or adhesion using a conductive adhesive can be employed.

  The cover 11 is a member having a side wall portion 11D extending from the outer edge portion of the upper surface 11E to the lower side so as to cover the module frame 5 so that the module frame 5 can be fitted, and having a rectangular opening 11C formed on the lower side. A circular opening 11A centering on the axis M is provided at the center. The size of the opening 11A is set so that the lens unit 12 can be taken in and out.

The assembly method of the drive module 1 having such a configuration will be described in order.
In the first step, first, the lens frame 4 is inserted into the housing portion 5A of the module frame 5 from below, and the end surfaces 5a of the module frame 5 and the end surfaces 4a of the lens frame 4 are aligned at the same height. Then, the through holes 6B and 6A of the upper leaf spring 6 are inserted into the upper fixing pins 14A of the module frame 5 and the upper fixing pins 13A of the lens frame 4, respectively.

  Thereafter, the tip end portions of the upper fixing pins 13A and 14A protruding upward through the through holes 6A and 6B of the upper leaf spring 6 are heat caulked by a heater chip (not shown), respectively. The caulking portion 16 and the caulking portion 17 as the second fixing portion are formed (see FIGS. 4 and 5).

At this time, the end surface 4a of the lens frame 4 and the end surface 5a of the module frame 5 are aligned on the same plane, and the plate-like upper leaf spring 6 is arranged without being deformed to perform heat caulking. it can. Therefore, it is not necessary to press the upper plate spring 6 that is deformed, and therefore it is possible to easily perform caulking. Further, the occurrence of floating or the like due to the deformation of the upper leaf spring 6 can be prevented.
Moreover, since the height of each heater chip can be made common, even if the caulking portions 16 and 17 are formed at the same time, variation in caulking accuracy can be reduced.

  Next, in the second step, the through holes 7A of the lower leaf spring 7 are inserted into the lower fixing pins 13B of the lens frame 4, respectively. At that time, the through holes 7B of the lower plate spring 7, the through holes 8C of the module lower plate 8, and the through holes 9A of the power supply member 9 are inserted into the lower fixing pins 14B of the module frame 5 at the same time. Thereafter, the tip end portion of each lower fixing pin 13B penetrating through each through hole 7A of the lower leaf spring 7 is heat caulked by a heater chip, and a caulking portion 18 (first fixing portion) ( (See FIG. 5).

At this time, since the axial distance between the end faces 4a and 4b of the lens frame 4 is equal to the axial distance between the end faces 5a and 5b of the module frame 5, the end faces 4b and 5b are aligned on the same plane. Since the module lower plate 8 can be stacked and arranged without deforming the flat lower plate spring 7 and heat caulking can be performed, the occurrence of floating or the like due to the deformation of the lower plate spring 7 can be prevented.
Moreover, since the height of each heater chip can be made common, even if the caulking portion 18 is formed at the same time, variation in caulking accuracy can be reduced.

  Next, in the third step, the lower fixing pins 14B penetrating through the through holes 7B, 8C, and 9A and projecting downward are heat caulked by a heater chip, and the second fixing portions are used. A certain caulking portion 19 (see FIG. 5) is formed.

At this time, since the height of each heater chip can be made common, even if the caulking portion 19 is formed at the same time, variation in caulking accuracy can be reduced.
Further, since the recess 8 </ b> B is formed in the module lower plate 8, the caulking portion 18 formed in the second step does not contact the module lower plate 8.

  By performing the operations in the first to third steps, the upper plate spring 6, the lower plate spring 7, the module lower plate 8, and the power supply member 9 are laminated and fixed to both ends of the lens frame 4 and the module frame 5.

  Since the upper fixing pin 13A and the lower fixing pin 13B, and the upper fixing pin 14A and the lower fixing pin 14B are provided coaxially, the caulking portions 16 and 18 are caulked in the first to third steps. The positions on the plane of the heater chip for forming the caulking portions 17 and 19 are the same. Therefore, since it is not necessary to change the heater chip position in each caulking, the caulking operation can be performed efficiently.

  Thus, by caulking the leaf spring member, it can be clamped and fixed between the support and the driven body by the caulking portion, so that solidification is required as compared with the case of fixing by adhesion or the like. Since the time is short, the assembly time can be reduced. Moreover, there is no possibility of contaminating parts due to generation of gas when the adhesive is cured. In addition, stable fixation over time can be performed. As a result, the reliability of the fixed part can be improved.

  In addition, since no fixed parts such as screws are used, a simple configuration with a reduced number of parts can be achieved, and the weight can be further reduced. In particular, since the lens frame 4 that is a driven body is reduced in weight, it can be driven at high speed and with low power consumption.

  Next, in the fourth step, the pair of wire holding members 15 </ b> A and 15 </ b> B to which the SMA wire 10 is attached are fixed to the module frame 5. Specifically, the through holes 36A and 36B of the wire holding members 15A and 15B are fitted to the two pins 35A and 35B formed on the module frame 5, and the wire holding members 15A and 15B are fitted to the locking grooves 5C. Lock each one. At that time, the center portion of the SMA wire 10 is engaged with the distal end key portion 4D1 of the guide protrusion 4D, and the distal end key portion 4D1 is supported so as to be supported from below. The terminal portions 15a of the wire holding members 15A and 15B protrude below the module lower plate 8, and are respectively connected to the conductive connection portions 9D of the electrodes 9a and 9b, which are power supply members 9 fixed to the module lower plate 8. Locked or placed close together.

  Next, in the fifth step, a thermosetting adhesive is poured into the through holes 37 </ b> A and 37 </ b> B and filled into the groove portion 36 of the module frame 5. When the groove portion 36 is filled with the thermosetting adhesive, it is placed in a heating furnace in order to cure the adhesive. In the heating furnace, for example, by heating at about 100 ° C. for about 20 to 30 minutes, the adhesive is cured and the module frame 5 and the wire holding members 15A and 15B are bonded and fixed.

  Here, since the SMA wire 10 is also heated when the adhesive is heated and fixed, the SMA wire 10 contracts. Therefore, the wire holding members 15A and 15B try to rotate in the direction of the guide projection 4D (the direction in which the SMA wire 10 contracts) around the pins 35A and 35B. In the present embodiment, the wall portion 35C is formed on the module frame 5, the arm portions 38A and 38B are formed on the wire holding members 15A and 15B, and the wall portion 35C and the arm portions 38A and 38B come into contact with each other. Thus, it is possible to prevent the wire holding members 15A and 15B from rotating. That is, the adhesive can be cured in a state where the rotation of the wire holding members 15A and 15B is suppressed (the state where the positions of the wire holding members 15A and 15B are fixed), and the wire holding members 15A and 15B can be made accurate. It can be positioned well.

  After the module frame 5 and the wire holding members 15A and 15B are bonded and fixed, each terminal portion 15a is electrically connected to the conductive connection portion 9D using, for example, soldering or a conductive adhesive. .

Next, in the sixth step, the cover 11 is covered from above the module frame 5, and the side wall portion 11 </ b> D and the module lower plate 8 are joined. For example, an engaging claw or the like is provided on the side wall part 11D and joined by fitting, or the side wall part 11D and the module lower plate 8 are bonded or welded to join. Before covering the cover 11, the coil spring 34 is inserted through the spring holding portion 33 of the guide protrusion 4D. By arranging the coil spring 34 in this way, one end of the coil spring 34 is brought into contact with the back surface of the upper surface 11E of the cover 11, and the other end is brought into contact with the guide protrusion 4D, so that the lens frame 4 is moved downward in the axial direction. It is configured to be energized. In this embodiment, the coil spring 34 has a biasing force that resists the force that the SMA wire 10 tends to contract when the ambient temperature is 70 ° C. The caulking portions 16 and 17 are in a state of being separated from the back surface of the upper surface 11E of the cover 11, respectively.
This completes the assembly of the drive module 1 main body.

  Thereafter, the adapter 30 is attached below the drive unit 31 and then attached onto the substrate. For mounting the drive module 1 on the substrate, fixing means such as adhesion and fitting can be employed.

  Note that the substrate may be an independent member attached to the drive module 1 or a member connected to and disposed on an electronic device or the like.

  Further, the lens unit 12 is screwed into the lens frame 4 through the opening 11 </ b> A of the cover 11.

  As described above, the lens unit 12 is attached last because the lens of the lens unit 12 is not soiled or dust is attached by the assembling work. For example, the drive module 1 is attached to the lens unit 12. This process is performed at an early stage (sixth stage) when the product is shipped in a product state where the lens is attached, or when the opening 11A of the cover 11 is desired to be smaller than the outer shape of the lens unit 12, for example, when the aperture stop is also used. It may be carried out before the process).

Next, the operation of the drive module 1 will be described.
The drive module 1 is elastically attached from the upper leaf spring 6 and the lower leaf spring 7 by the tension from the SMA wire 10 and the urging force of the coil spring 34 and the caulking portions 16 and 18 in a state where power is not supplied to the terminal portion 9C. The forces acting on the lens frame 4 such as an urging force to be balanced are balanced, and the lens frame 4 to which the lens unit 12 is attached is held at a fixed position in the axial direction.

  When power is supplied from the terminal portion 9C to the power supply member 9, for example, the electrode 9a, the wire holding member 15A, the SMA wire 10, the wire holding portion 15b, and the electrode 9b are electrically connected, so that a current flows through the SMA wire 10. . As a result, Joule heat is generated in the SMA wire 10 and the temperature of the SMA wire 10 rises. When the transformation start temperature of the SMA wire 10 is exceeded, the SMA wire 10 contracts to a length corresponding to the temperature.

  As a result, the guide protrusion 4D of the lens frame 4 moves upward (in the direction (A) in the figure). As a result, the coil spring 34, the upper leaf spring 6, and the lower leaf spring 7 are deformed, and an elastic restoring force corresponding to the amount of deformation is urged to the lens frame 4. Then, the lens frame 4 stops at a position where this elastic restoring force is balanced with the tension of the SMA wire 10.

  At this time, since the upper leaf spring 6 and the lower leaf spring 7 constitute a parallel spring, the lens frame 4 accurately moves along the axis M without being along an axial guide member or the like. Is done. For this reason, it is possible to reduce the number of parts and reduce the size. Further, since no sliding load is generated on the guide member, low power consumption can be realized.

Further, when the supply of power is stopped, the SMA wire 10 can be extended, and the lens frame 4 moves to a balanced position in the downward direction (the (B) direction in the figure).
Thus, the lens frame 4 can be driven in the direction of the axis M by controlling the power supply amount.

  Next, the movement of the drive unit 31 (particularly the lower leaf spring 7) when the drive module 1 falls will be described.

  First, as shown in FIG. 8, the lens frame 4 is in an initial position, that is, the spring portion 7E, the ring portion 7F, and the frame body 7G of the lower leaf spring 7 are substantially flush with each other, and the urging force of the lower leaf spring 7 is working. A description will be given of a case where the drive module 1 is dropped from the side wall 5E of the module frame 5 when the drive module 1 is not present. When the drop impact S is applied from the direction of the arrow, that is, when dropped with the side wall 5Ea of the module frame 5 down, the lens frame 4 moves in a direction opposite to the direction of the drop impact S (arrow M direction). At this time, since the lower leaf spring 7 and the lens frame 4 are joined by the lower fixing pin 13B, the ring portion 7F also tries to move in the arrow M direction. On the other hand, since the module frame 5 and the lower leaf spring 7 are joined by the lower fixing pin 14B, the frame portion 7G tends to move in the same direction as the direction of the drop impact S. Then, one spring portion 7Ea located at a position corresponding to both side walls 5E of the side wall 5Ea of the module frame 5 is compressed and deformed so as to swell radially outward (in the direction of arrow Z), and the other spring portion 7Eb extends in the circumferential direction. Try to be deformed to be pulled. Further, the spring portion 7Ea that deforms so as to bulge outward in the radial direction tries to deform so as to further bulge outward in the radial direction so as to climb over the frame body 7G (on the upper plate spring 6 side).

  Here, in the present embodiment, since the notch 5F is formed in the module frame 5, the spring portion 7Ea deformed so as to bulge radially outward does not collide with the inner surface 5G of the module frame 5, and the spring portion 7E is plastically deformed. Generation | occurrence | production of a deformation | transformation location can be suppressed. When the influence of the drop impact is eliminated, the lens frame 4 and the lower leaf spring 7 return to the initial positions. Since the notch 5F has an axial height H1, even if the drop impact S is similarly applied in a state where the lens frame 4 is arranged at a position other than the initial position, the spring is similarly applied. 7E plastic deformation can be suppressed.

  In the conventional drive unit, the spring portion 7E deformed so as to bulge outward in the radial direction collides with the inner surface 5G of the module frame 5 and hits any part of the spring portion 7E (the root portion of the spring portion 7E is many). An upward protrusion was formed by plastic deformation.

  Next, a description will be given of a case where the drive module 1 falls and falls from the side wall 5E of the module frame 5 when the lens frame 4 is positioned near the upper limit of the movable range. When the module frame 5 is dropped with one side 5Ea having the side wall 5E down, the spring portions 7Ea and 7Eb of the lower leaf spring 7 are deformed in the same manner as described above.

  Here, in the present embodiment, since the step portion 5H is formed in the module frame 5 so as to be continuous with the notch portion 5F, the spring portion 7Ea is radially outward if it is within the region where the step portion 5H of the module frame 5 is formed. Even if it deform | transforms so that it may swell, since it can avoid colliding with the module frame 5, it can suppress that the deformation | transformation location by plastic deformation generate | occur | produces in the spring part 7Ea. Further, when the influence of the drop impact S is eliminated, the lens frame 4 and the lower leaf spring 7 return to the radial initial positions.

  Further, the notch portion 5F and the stepped portion 5H formed in the module frame 5 are formed after securing the structural strength of the module frame 5, and thus are not damaged by dropping.

  According to this embodiment, when a drop impact is applied to the drive module 1 from the direction perpendicular to the axis of the module frame 5 (side wall 5E side of the module frame 5), the spring portion 7E of the lower leaf spring 7 is radially outward. Although it deform | transforms so that it may swell, since the notch part 5F and the level | step-difference part 5H were formed in the side wall 5E, the collision with the spring part 7E and the side wall 5E can be suppressed. Therefore, even if a drop impact is applied to the drive module 1, it is possible to suppress plastic deformation from occurring in the spring portion 7 </ b> E of the lower leaf spring 7, and it is possible to suppress the tilting and floating of the lens frame 4.

  Further, in the vicinity of the initial position where the probability that the lens frame 4 is located is high, a notch portion 5F penetrating the side wall 5E of the module frame 5 is formed, so that a drop impact to the drive module 1 is prevented. On the other hand, it can suppress more reliably that the plastic deformation of the spring part 7E of the lower leaf | plate spring 7 generate | occur | produces. Further, by forming the step portion 5H on the side wall 5E (inner surface 5G) of the module frame 5 corresponding to the movable range of the lens frame 4, the lens module 4 can be located at any position within the movable range of the drive module 1. Generation | occurrence | production of the plastic deformation of the spring part 7E by a drop impact can be suppressed. Moreover, the strength of the module frame 5 can be ensured by forming the notch portion 5F and the step portion 5H in this way. Therefore, it is possible to reduce the size of the drive module 1 and to suppress the occurrence of defects due to a drop impact.

Next, an electronic apparatus according to an embodiment of the present invention will be described.
10A and 10B are perspective external views of the front surface and the back surface of the electronic apparatus according to the embodiment of the present invention. FIG.10 (c) is FF sectional drawing in FIG.10 (b).

The camera-equipped mobile phone 20 of this embodiment shown in FIGS. 10A and 10B is an example of an electronic device including the drive module 1 of the above-described embodiment.
The camera-equipped mobile phone 20 includes a known mobile phone device configuration inside and outside the cover 22 such as a reception unit 22a, a transmission unit 22b, an operation unit 22c, a liquid crystal display unit 22d, an antenna unit 22e, and a control circuit unit (not shown). ing.

  Further, as shown in FIG. 10B, a window 22A that transmits external light is provided in the cover 22 on the back surface side on which the liquid crystal display unit 22d is provided, and as shown in FIG. The drive module 1 of the first embodiment is installed so that the opening 11A of the drive module 1 faces the window 22A of the cover 22 and the axis M is along the normal direction of the window 22A.

  The drive module 1 is mechanically and electrically connected to the substrate 2. The substrate 2 is connected to a control circuit unit (not shown) so that power can be supplied to the drive module 1.

According to such a configuration, the light transmitted through the window 22 </ b> A can be collected by the lens unit 12 (not shown) of the drive module 1 and imaged on the image sensor 30. Then, by supplying appropriate power from the control circuit unit to the drive module 1, the lens unit 12 can be driven in the direction of the axis M, and the focal position can be adjusted to perform photographing.
According to such a camera-equipped mobile phone 20, since the drive module 1 that can reduce the size of the above-described embodiment and suppress the occurrence of defects due to a drop impact is provided, the size can be reduced and Accuracy and high reliability can be secured.

  Note that the present invention is not limited to the above-described embodiment, and includes various modifications made to the above-described embodiment without departing from the spirit of the present invention. That is, the specific shapes, configurations, and the like given in the embodiment are merely examples, and can be changed as appropriate.

  For example, in the present embodiment, the case where the SMA wire 10 is used as the driving means has been described. However, the present invention can also be adopted when a driving means such as a voice coil system using a driving coil and a magnet or a linear motor is used. . That is, the drive means is not limited to these as long as it is a drive means for driving the lens frame 4 along the fixed direction with respect to the module frame 5. The present invention can be applied to a structure in which a leaf spring member is employed to bias the lens frame 4.

  Further, in the present embodiment, the upper fixing pins 13A and 14A and the lower fixing pins 13B and 14B are inserted through the upper plate spring 6 and the lower plate spring 7 which are plate spring members for urging the lens frame 4, Although the example in the case of thermally caulking the tip portions of these fixing pins has been described, the fixing method of the leaf spring member is not limited to this. For example, it may be fixed by ultrasonic caulking or the like, or a leaf spring member may be bonded to the lens frame 4 or the module frame 5. According to this structure, a large bonding area can be secured, so that a large strength can be obtained even if an adhesive is used.

  In the above description, the module frame 5 has been described as a substantially rectangular member as a whole, but is not limited to a substantially rectangular shape, and may be a polygonal shape.

  In the above description, the drive module 1 is described as an example in the case of using the focus position adjusting mechanism of the lens unit. However, the use of the drive module is not limited to this. For example, you may use for another part as an appropriate actuator which moves a to-be-driven body to a target position. For example, instead of the lens unit 12, a rod member or the like can be screwed, or the lens frame 4 can be changed to another shape and used as an appropriate actuator. That is, the driven body is not limited to a cylindrical member, and may be a columnar member.

  In the above description, the example of the camera-equipped mobile phone is described as the electronic device using the drive module, but the type of the electronic device is not limited to this. For example, it may be used in an optical device such as a digital camera or a camera built in a personal computer, or in an electronic device such as an information reading storage device or a printer, and can also be used as an actuator for moving a driven body to a target position.

  Further, in the present embodiment, the cutout portion 5F and the stepped portion 5H are formed in the module frame 5. However, the cutout portion 5F may be formed as a recessed portion having the same thickness as the stepped portion 5H. Moreover, the notch part 5F may be enlarged and the level | step-difference part 5H may be eliminated.

It is a perspective view of the drive module in a first embodiment of the present invention. It is a disassembled perspective view which shows the structure of the drive module in 1st embodiment of this invention. It is a disassembled perspective view which shows the structure of the drive unit in 1st embodiment of this invention. It is a perspective view which shows the drive unit in 1st embodiment of this invention. It is sectional drawing which follows the AA line of FIG. It is a side view of the drive module in a first embodiment of the present invention. It is a back perspective view of the module frame in a first embodiment of the present invention. It is a back perspective view which shows the state attached to the lower leaf | plate spring of the drive unit which concerns on 1st embodiment of this invention. It is a top view of the upper leaf | plate spring in 1st embodiment of this invention. It is drawing of the electronic device in embodiment of this invention, (a) Front surface perspective view, (b) Back surface perspective view, (c) It is sectional drawing which follows the FF line | wire of (b).

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Drive module 4 ... Lens frame (driven body) 5 ... Module frame (support body) 5F ... Notch part (concave part, penetration part) 5H ... Step part (concave part) 6 ... Upper leaf | plate spring (leaf spring member) 7 ... Lower leaf spring (leaf spring member) 6E, 7E ... Spring portion 6F, 7F ... Ring portion (inner ring) 6G, 7G ... Frame (outer ring) 20 ... Mobile phone with camera (electronic equipment)

Claims (3)

A cylindrical or columnar driven body;
A cylindrical support for accommodating the driven body inside;
A leaf spring member that elastically holds the driven body so as to be movable along a fixed direction with respect to the support body,
Between the outer ring and the inner ring, the outer ring fixed to the axial end of the support, the inner ring fixed to the axial end of the driven body, and the leaf spring member A drive module having a spring portion extending in a circumferential direction and having both ends connected to the outer ring and the inner ring, respectively;
The support includes a recessed portion at a circumferential position corresponding to at least a central portion in the length direction of the spring portion,
The recessed portion is formed from the end in the axial direction of the support toward the center in the axial direction and from the inside in the radial direction to the outside in the radial direction of the support. . The recess is
A through-hole formed at a predetermined height from the axial end of the support toward the axial center and penetrating in the radial direction of the support;
The support member is formed so as to be connected to the penetrating portion from the axial end portion to the central portion in the axial direction to at least a height corresponding to a movable range of the driven member, and in the radial direction of the support member The drive module according to claim 1, comprising a step portion formed from the inside toward the outside in the radial direction.   An electronic apparatus comprising the drive module according to claim 1.

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