JP2010262065A - Drive module and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To move a driven body as straight as possible along an axial direction while suppressing inclination of the driven body. <P>SOLUTION: The drive module includes: a driven body 4; a support 5 accommodating the driven body inside; a pair of plate spring members 6 and 7 elastically holding the driven body with respect to the support so that the driven body can move along the axis line M; a protrusion 4D formed on the external wall of the driven body; and a shape memory alloy wire (actuator) 10, fixed on the support, for driving the driven body in the direction of the axial direction against the resilience of the plate spring member by applying a generation force to the projection. The plate spring member includes a first connection part 50 connected to the support, a second connection part 51 connected to the driven body, and a plurality of spring parts 52 for connecting both the connection parts. The spring parts are connected to the second connection part in the position where they perpendicularly intersect a connection line connecting the projection and the axis line along the radial direction of the driven body and where they are away in the direction of the circumference around the axis line from an imaginary line L passing through the axis line. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a drive module and an electronic device. In particular, the present invention relates to a drive module and an electronic device suitable for driving an optical system or a movable member to adjust a focal position or to use as an actuator.

Conventionally, in a small electronic device such as a mobile phone with a camera function, in order to drive a driven body such as an imaging lens unit and perform autofocus, zoom, etc., it is driven using expansion and contraction of a shape memory alloy wire Various drive modules have been proposed (see Patent Document 1).
As shown in FIG. 12, in the driving device 100 of Patent Document 1, a leaf spring 101 is used to support the lens so as to be movable in the optical axis direction. Further, both end portions of the shape memory alloy wire 102 are supported by the support body 103, and the substantially central portion of the shape memory alloy wire 102 is arranged to be hooked on the hook 105 of the driven body 104. Then, by supplying electric power to the shape memory alloy wire 102, the temperature of the shape memory alloy wire 102 rises and contracts so that the driven body 104 can be moved up and down.

International Publication No. 07/113478 Pamphlet

By the way, in the drive apparatus of patent document 1, when driving the to-be-driven body 104, there existed a possibility that the optical axis M might incline. If the inclination of the optical axis M becomes large, there is a high possibility that inconveniences such as so-called blurring in which one side of the captured image is not in focus will occur.
The point where the optical axis M is inclined will be described in detail.

First, the driving device 100 has a structure in which the driven body 104 is driven using one shape memory alloy wire 102 disposed along the two side surfaces of the driven body 104. A force acts on one point of the corner of the body 104, and a force that lifts the lifting side (the side on which the hook 105 is formed) and lowers the opposite side acts on the driven body 104.
More specifically, as shown in FIG. 13, when trying to move the driven body 104 up and down by contracting the shape memory alloy wire 102 hooked on the hook 105 of the driven body 104, the shape memory A force F <b> 10 is generated by the contraction of the alloy wire 102. That is, F11 force is generated in the vertical direction (axial direction) and F12 force is generated in the horizontal direction.

  On the other hand, when the driven body 104 is going to rise, a force F21 is generated in the downward direction from the center of gravity position of the driven body 104 by the leaf spring 101 disposed on the upper surface of the driven body 104. This is because the leaf spring is formed so that a force is applied equally to the circumferential direction of the driven body 104 so that the axial direction of the lens attached to the driven body 104 does not shift. Accordingly, a force F21 is generated downward from the center of gravity of the driven body 104. Further, although the force F12 is generated in the horizontal direction due to the contraction of the shape memory alloy wire 102, the leaf spring 101 is not displaced in the horizontal plane so that the axial direction of the lens attached to the driven body 104 is not shifted. In order to control, force F22 which repels force F12 occurs.

As a result, moment A is generated in the driven body 104 by the forces F11 and F21 acting in the vertical direction, and the moment B is generated by the forces F12 and F22 acting in the horizontal direction. Although the directions of moment A and moment B are opposite, the absolute value of moment A is larger than the absolute value of moment B because the force applied in the vertical direction is dominant.
Therefore, as shown in FIG. 14, the driven body 104 tends to tilt so that the lifting side (side on which the hook 105 is formed) is lifted and the opposite side is lowered. That is, as shown in FIG. 12, the driven body 104 tends to incline so as to rotate around the imaginary line L connecting the two fixed points P of the shape memory alloy wire 102 in the direction of the arrow K.

Here, the attachment relationship between the leaf spring 101 and the driven body 104 will be described.
The leaf spring 101 is disposed on the inner side in the radial direction of the frame portion 101a, the ring portion 101b fixed to the driven body 104, and four springs that connect the frame portion 101a and the ring portion 101b. It is mainly composed of a portion 101 c and is fixed to the driven body 104 via a pin 106.
The four spring portions 101c are disposed 90 degrees apart in the circumferential direction, and both ends are connected to the frame portion 101a and the ring portion 101b, respectively. And the said pin 106 is provided in the connection point of the spring part 101c and the ring part 101b. That is, the position of the pin 106 is a fixing point of the spring portion 101 c with respect to the driven body 104. By the way, since the driven body 104 is supported by the four spring portions 101c, the driven body 104 has a structure that easily rotates around two support lines S that connect two opposing fixed points.

  Here, in the driving device 100, the leaf spring 101 and the driven body 104 are attached in a state where one of the two support lines S is coincident with the virtual line L described above. For this reason, the driven member 104 is designed to be very easy to rotate in the direction of the arrow K described above, whereby the optical axis M is easily inclined. Therefore, inconveniences such as blurring are likely to occur.

  The present invention has been made in view of such circumstances, and an object thereof is a drive module capable of moving the driven body as straight as possible along the axial direction while suppressing the inclination of the driven body. And providing an electronic device including the same.

The present invention provides the following means in order to solve the above problems.
(1) A drive module according to the present invention is provided with a cylindrical or columnar driven body, a cylindrical support that accommodates the driven body inside, and above and below the driven body. A pair of leaf spring members that elastically hold the driving body so as to be movable along the axial direction with respect to the support body; and a protrusion provided on the outer wall surface of the driven body so as to protrude radially outward An actuator that is fixed to the support and drives the driven body in an axial direction against a restoring force of the leaf spring member by exerting a generating force on the protrusion, and the leaf spring member Is a frame-like first connecting part connected on the end face of the support, and a second connected on the end face of the driven body in a state of being arranged radially inside the first connecting part. Both ends are connected to the connecting portion, the first connecting portion, and the second connecting portion, respectively, and both connecting portions are connected. A plurality of spring portions, wherein the spring portions are orthogonal to a connecting line connecting the projection portion and the axis along the radial direction of the driven body, and from above an imaginary line passing through the axis. It is connected to the second connecting portion at a position deviated in the circumferential direction around the axis.

In the drive module according to the present invention, the driven body can be moved relative to the support body by operating the actuator and exerting a generated force against the restoring force of the leaf spring member on the protrusion. The movement in the axial direction can be performed.
When the driven body moves, the pair of leaf spring members are deformed, and an elastic restoring force corresponding to the amount of deformation acts on the driven body. Specifically, the second connecting portion connected to the driven body moves with the movement of the driven body. For this reason, the spring portion connecting the first connecting portion and the second connecting portion connected to the support body is deformed, and the elastic restoring force of the spring portion acts on the driven body. Then, the movement of the driven body stops at a position where the elastic restoring force from the pair of leaf spring members balances the tension of the shape memory alloy wire.

  By the way, when the driven body is moved, the driven body is moved by applying a generated force to the protruding portion, so that the force acts on one point of the driven body as in the conventional case, and the lifting is formed with the protruding portion formed. A force that lifts the side and lowers the opposite side acts on the driven body. That is, the driven body tends to rotate and tilt around a virtual line that passes through the axis and is perpendicular to the connecting line connecting the protrusion and the axis along the radial direction of the driven body.

On the other hand, since the driven body is cantilevered by a plurality of spring portions, these spring portions are easy to rotate around the support line connecting the connection points connected to the second connecting portion, and the other directions The structure is difficult to rotate.
Here, the spring portion is connected to the second connecting portion at a position deviated from the above-described imaginary line in the circumferential direction centering on the axis. Therefore, unlike the conventional one, the support line connecting the connection points and the virtual line are designed not to coincide with each other. Thereby, the driven body is supported by the plurality of spring portions in a state where it is difficult to rotate around the imaginary line. Therefore, when the driven body moves, even if the driven body tries to rotate and tilt around the imaginary line, the movement of the tilt can be prevented. As a result, the driven body can be moved as straight as possible along the axial direction while suppressing the inclination of the driven body.

(2) The drive module according to the present invention is the drive module according to the present invention, wherein the actuator is positioned at the both ends on the imaginary line in a state in which the actuator is engaged with the projection, and the axis It is a shape memory alloy wire that is fixed to the support body so as to face each other and is displaced by heat generated during energization to drive the driven body.

In the drive module according to the present invention, when the shape memory alloy wire is heated by energization, the wire contracts to a length corresponding to the temperature. Then, since the both ends of the shape memory alloy wire are fixed to the support while the middle is locked to the protrusion, the protrusion can be moved in the axial direction by contraction. Thereby, a to-be-driven body can be moved relatively with respect to a support body, and the movement to an axial direction can be performed.
Note that the wire can be extended by stopping energization of the shape memory alloy wire. As a result, the driven body can be moved in the opposite direction to the previous one. Thus, by controlling the heat generation amount of the shape memory alloy wire, the driven body can be moved in two directions along the axial direction.

By the way, since both ends of the shape memory alloy wire are fixed to the support so as to be positioned on the imaginary line and to face each other across the axis, the driven body tries to rotate and tilt around this imaginary line. As described above, the inclination movement can be prevented by the plurality of spring portions. Therefore, even if the shape memory alloy wire is used as the actuator, the driven body can be moved as straight as possible along the axial direction while suppressing the inclination of the driven body.
In particular, since the shape memory alloy wire can be used as an actuator, the configuration can be simplified and the cost can be reduced.

(3) The drive module according to the present invention is the drive module of the present invention described above, wherein four spring portions are formed so as to face each other across the axis, and 45 degrees from the imaginary line in the circumferential direction. It is connected to the second connecting portion at a rotated position.

In the drive module according to the present invention, since the four spring portions are respectively connected to the second connecting portion at a position rotated 45 degrees in the circumferential direction from the imaginary line, the support line connecting the connection points of the opposing spring portions. Can be tilted approximately 45 degrees with respect to the virtual line. Therefore, it is possible to more effectively suppress the movement of the driven body that rotates around the virtual line and tries to tilt.
Therefore, it is possible to move the driven body further straight along the axial direction while further suppressing the inclination of the driven body.

(4) The drive module according to the present invention is the drive module according to the present invention, wherein the spring portion closest to the protruding portion among the plurality of spring portions is adjusted to have a higher spring constant than the other spring portions. It is characterized by being.

  In the drive module according to the present invention, the spring part closest to the projection part among the plurality of spring parts has a higher spring constant than the other spring parts, so when the driven body is moved through the projection part, The movement itself that the driven body tends to tilt can be suppressed. Accordingly, it is possible to further improve the straightness of the driven body.

(5) The drive module according to the present invention is the drive module according to the present invention described above, wherein the spring portion closest to the protruding portion of the plurality of spring portions and the position facing the spring portion across the axis. The provided spring part is adjusted so as to have a higher spring constant than the remaining two spring parts.

In the drive module according to the present invention, the spring part closest to the protrusion part among the four spring parts and the spring part disposed at a position facing the spring part are more spring constant than the remaining two spring parts. Therefore, when the driven body is moved via the protrusion, the movement itself that the driven body tends to tilt can be suppressed. Accordingly, it is possible to further improve the straightness of the driven body.
Furthermore, when the protrusion is moved by the actuator, a component force that causes the driven body to slide in the radial direction is transmitted to the driven body. However, the two spring portions having a high spring constant cause the driven body to slide. It is possible to suppress movement. Therefore, unnecessary behavior such as rattling of the driven body can be suppressed, and in this respect as well, it is possible to improve straightness.

(6) An electronic apparatus according to the present invention includes the drive module according to the present invention.

  The electronic device according to the present invention includes a drive module that can move the driven body as straight as possible along the axial direction while suppressing the inclination of the driven body, thereby improving the operating performance. Therefore, a highly reliable and highly accurate electronic device can be obtained.

According to the drive module of the present invention, the driven body can be moved as straight as possible along the axial direction while suppressing the inclination of the driven body.
Further, according to the electronic device according to the present invention, since the drive module is provided, the operation performance can be improved, and a highly reliable and highly accurate electronic device can be obtained.

It is an appearance perspective view of a drive module showing an embodiment concerning the present invention. It is a disassembled perspective view of the drive module shown in FIG. It is a disassembled perspective view which shows the structure of the drive unit which comprises the drive module shown in FIG. FIG. 3 is an external perspective view of a drive unit constituting the drive module shown in FIG. 2. It is sectional drawing which follows the AA line of FIG. It is a top view of the upper leaf | plate spring which comprises the drive unit shown in FIG. It is a top view of the lower leaf | plate spring which comprises the drive unit shown in FIG. It is a top view which shows the modification of an upper leaf | plate spring. It is a top view which shows another modification of an upper leaf | plate spring. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure of the electronic device which shows embodiment which concerns on this invention, Comprising: (a) is an external appearance perspective view of a surface, (b) is an external appearance perspective view of a back surface, (c) is B- of (b). It is sectional drawing which follows a B line. It is a top view which shows the modification of the upper leaf | plate spring (lower leaf | plate spring) which concerns on this invention. It is a perspective view of the conventional drive module. It is explanatory drawing explaining the effect | action at the time of the conventional lens frame movement. It is explanatory drawing explaining the malfunction at the time of the conventional lens frame movement.

(Drive module)
Hereinafter, an embodiment of a drive module according to the present invention will be described with reference to FIGS. In the present embodiment, a case where a shape memory alloy wire is used will be described as an example of an actuator that drives a driven body.

As shown in FIG.1 and FIG.2, the drive module 1 of this embodiment is comprised by the box shape as a whole. FIG. 1 is an external perspective view of the drive module 1. FIG. 2 is an exploded perspective view showing a schematic configuration of the drive module 1.
The drive module 1 is attached to an electronic device or the like after assembly is completed, and is fixed on a board that supplies a control signal and electric power to the drive module 1. An adapter 30 located on the board, and an adapter 30 And a cover 11 disposed so as to cover the drive unit 31.

As shown in FIGS. 3 to 5, the drive unit 31 includes a lens frame (driven body) 4, a module frame (support body) 5, an upper leaf spring 6 and a lower leaf spring 7 (a pair of leaf spring members). And a module lower plate 8, a power supply member 9, and a shape memory alloy (hereinafter abbreviated as SMA) wire 10, and these components are laminated together. Thus, one actuator is configured.
FIG. 3 is an exploded perspective view showing a schematic configuration of the drive unit 31. FIG. 4 is an external perspective view of the drive unit 31. FIG. 5 is a cross-sectional view taken along the line AA in FIG. In some drawings, some components are appropriately omitted for the sake of clarity.

  As shown in FIGS. 3 to 5, the lens frame 4 is inserted inside the module frame 5 in the assembled state. The upper plate spring 6 and the lower plate spring 7 are arranged above and below the lens frame 4 and the module frame 5 and fixed by caulking while the lens frame 4 and the module frame 5 are sandwiched from above and below. Has been. The module lower plate 8 and the power supply member 9 are laminated in this order from the lower side, and are fixed together by caulking from the lower side of the module frame 5. A cover 11 that covers these laminated bodies from above is fixed to the module lower plate 8.

  In addition, the code | symbol M in a figure is an axis line of the drive module 1 which corresponds to the optical axis of the lens unit 12, and has shown the drive direction of the lens frame 4. FIG. Hereinafter, in the description of each disassembled component, the position and direction may be referred to based on the positional relationship with the axis M at the time of assembly. For example, even when there is no clear circle or cylindrical surface in the component, unless there is a risk of misunderstanding, the direction along the axis M is simply the axial direction, the radial direction of the circle around the axis M, and the circumferential direction. Sometimes simply referred to as the radial direction and the circumferential direction. Further, unless otherwise specified, the vertical direction refers to the vertical direction in the arrangement when the axis M is arranged in the vertical direction and the mounting surface of the drive module 1 is vertically downward.

Next, each component will be described in detail.
The lens frame 4 of the present embodiment is formed in a cylindrical shape as a whole as shown in FIG. 3, and a cylindrical accommodating portion 4A penetrating along the axis M is formed in the center thereof. A female screw is formed on the inner peripheral surface of the accommodating portion 4A (see FIG. 5). Then, in the housing portion 4A, a lens unit 12 having an appropriate lens or lens group and a lens barrel that holds the lens or the lens group and that has a male screw that is screwed to the female screw is formed on the outer peripheral portion. And can be fixed.

On the outer wall surface of the lens frame 4, a protruding portion 4 </ b> C that protrudes outward in the radial direction is extended in the direction of the axis M with an interval of approximately 90 degrees in the circumferential direction. On the upper end surface 4a and the lower end surface 4b of the lens frame 4 at the upper end portion and the lower end portion of each of the projecting portions 4C, an upper fixing pin 13A projecting upward and downward along the axis M, respectively, and lower fixing Four pins 13B are provided.
Among these, the upper fixing pin 13 </ b> A holds the upper leaf spring 6, and the lower fixing pin 13 </ b> B holds the lower leaf spring 7.

  The positions of the upper fixing pin 13A and the lower fixing pin 13B in plan view may be different from each other, but are arranged at a coaxial position parallel to the axis M in this embodiment. For this reason, the insertion positions of the upper fixing pin 13A and the lower fixing pin 13B in the upper plate spring 6 and the lower plate spring 7 are made common.

  In addition, the radial center positions of the upper fixing pin 13A and the lower fixing pin 13B may be different from each other, but are arranged on the same circumference in this embodiment. For this reason, the respective center positions are arranged in a square lattice pattern.

Further, a guide protrusion (protrusion part) 4D is provided on the outer wall surface of the lens frame 4 so as to protrude outward in the radial direction. At this time, the guide protrusion 4D is provided between the two protrusions 4C, that is, at a position shifted by 45 degrees in the circumferential direction.
As shown in FIG. 4, the guide protrusion 4D locks the SMA wire 10 to the distal end key portion 4D1, and the guide protrusion 4D is lifted upward (in the direction of the arrow Z1) by the contraction of the SMA wire 10 to move it. belongs to. The lens frame 4 is integrally formed of a thermoplastic resin capable of thermal caulking or ultrasonic caulking, such as polycarbonate (PC) or liquid crystal polymer (LCP) resin.

As shown in FIG. 3, the module frame 5 has a generally rectangular outer shape in plan view, and a housing portion 5 </ b> A including a through hole formed coaxially with the axis M is formed at the center. It is a cylindrical member. And the lens frame 4 is accommodated in this accommodating part 5A.
At the upper and lower four corners of the module frame 5, an upper end surface 5a and a lower end surface 5b, which are planes orthogonal to the axis M, are formed. Further, four upper fixing pins 14A are formed on the upper end surface 5a upward, and four lower fixing pins 14B are formed on the lower end surface 5b downward. Among these, the upper fixing pin 14 </ b> A holds the upper plate spring 6, and the lower fixing pin 14 </ b> B holds the lower plate spring 7, the module lower plate 8, and the power feeding member 9.

  Note that the position of the upper fixing pin 14A in plan view may be different from the arrangement of the lower fixing pin 14B, but in this embodiment, the upper fixing pin 14A is arranged at a coaxial position parallel to the axis M. For this reason, the insertion positions of the upper fixing pin 14A and the lower fixing pin 14B in the upper plate spring 6 and the lower plate spring 7 are made common. The distance between the upper end surface 5a and the lower end surface 5b is set to be the same distance as the distance between the upper end surface 4a and the lower end surface 4b of the lens frame 4.

  In addition, a notch 5B having a groove width in a plan view so that the groove width of the lens frame 4 is movably fitted in the direction of the axis M is formed at a lower portion of one corner of the module frame 5. The notch 5B penetrates the guide projection 4D of the lens frame 4 when the lens frame 4 is inserted into the module frame 5 from below, and the distal end key portion 4D1 of the guide projection 4D is inserted in the radial direction of the module frame 5. This is for projecting outside and positioning the lens frame 4 in the circumferential direction.

  Further, at two corners adjacent to the notch 5B of the module frame 5, wire holding members 15A and 15B for holding the SMA wire 10 on the side surface on the same direction side as the corner provided with the notch 5B (see FIG. A pair of locking grooves 5C for attaching (see 3 and 4) is formed.

  The wire holding members 15 </ b> A and 15 </ b> B are attached by being inserted through pins 35 </ b> A and 35 </ b> B formed on the side surfaces of the module frame 5. Below the pins 35 </ b> A and 35 </ b> B formed on the side surface of the module frame 5, a groove 36 is formed that is filled with an adhesive and fixes the module frame 5 and the wire holding members 15 </ b> A and 15 </ b> B. Moreover, when fixing wire holding member 15A, 15B to the module frame 5, the wall part 35C which can suppress that wire holding member 15A, 15B rotates is formed. The wall portion 35C extends from the side surface of the module frame 5 to the side (perpendicular to the side surface).

In the present embodiment, the module frame 5 is integrally formed of a thermoplastic resin capable of thermal caulking or ultrasonic caulking, for example, polycarbonate (PC), liquid crystal polymer (LCP) resin, or the like in the present embodiment. .
The wire holding member 15 </ b> A is attached to a side surface on the side where the pair of terminal portions 9 </ b> C of the power supply member 9 protrudes from the drive module 11, and the wire holding member 15 </ b> B is connected to the pair of terminal portions of the power supply member 9 from the drive module 11. 9C is attached to the side surface that does not protrude.

Furthermore, the wire holding members 15A and 15B are conductive members such as a metal plate formed in a key shape by caulking the end portion of the SMA wire 10 to the wire holding portion 15b.
The wire holding members 15A and 15B are formed with through holes 36A and 36B that fit into the pins 35A and 35B of the module frame 5, respectively. Further, through holes 37A and 37B for pouring the adhesive are formed below the through holes 36A and 36B in the direction of the axis M.

  When the module frame 5 and the wire holding members 15A and 15B are fixed, the arm portions 38A and 38B for contacting the wall portion 35C of the module frame 5 and suppressing the rotation of the wire holding members 15A and 15B. Are formed respectively. The end portion of the SMA wire 10 is positioned and held by fitting the locking portion 5C and the pins 35A and 35B from the side and bringing the wall portion 35C and the arm portions 38A and 38B into contact with each other.

  Furthermore, the wire holding members 15A and 15B are provided with a wire holding portion 15b (caulking position) for holding the SMA wire 10 and a piece-like terminal portion 15a located on the opposite side of the holding portion 15b. In the mounted state, the terminal portion 15 a slightly protrudes below the module lower plate 8 stacked below the module frame 5.

Further, the SMA wire 10 held at both ends by the pair of wire holding members 15A and 15B is fixed to the lens frame 4 and exerts a generating force on the guide projection 4D, thereby causing the lens frame 4 to move to the upper plate spring 6 and the lower plate spring 6. It functions as an actuator that is driven in the direction of the axis M against the restoring force of the leaf spring 7.
More specifically, the SMA wire 10 is locked from below at the front end key portion 4D1 of the guide projection 4D of the lens frame 4 whose intermediate portion protrudes from the notch 5B of the module frame 5. That is, the SMA wire 10 has the intermediate portion locked to the distal end key portion 4D1 of the guide projection 4D, and the both ends are opposed to each other with the axis M interposed therebetween via the wire holding members 15A and 15B. It is fixed to. And the lens frame 4 is urged | biased upwards by the tension | tensile_strength of this SMA wire 10 via the front-end | tip key part 4D1. The SMA wire 10 is displaced by heat generation when energized through the power supply member 9, and drives the lens frame 4 in the direction of the axis M against the restoring force of the upper plate spring 6 and the lower plate spring 7. Have a role.

By the way, in this embodiment, as shown in FIG. 4 and FIG. 6 to be described later, it is orthogonal to the connecting line N connecting the guide projection 4D and the axis M along the radial direction of the lens frame 4 and passes through the axis M. The line is an imaginary line L.
And the position of each wire holding part 15b of a pair of wire holding member 15A, 15B is made into the fixed point P which is fixing the both ends of the SMA wire 10, This fixed point P is on the virtual line L It is supposed to be located. That is, the SMA wire 10 of the present embodiment is designed so that both ends are positioned on the imaginary line L.

  As shown in FIGS. 3 and 4, an upper leaf spring 6 and a lower leaf spring 7 are laminated on the upper and lower portions of the module frame 5 and the lens frame 4 inserted into the module frame 5, respectively. . In the present embodiment, the upper plate spring 6 and the lower plate spring 7 are flat plate spring members punched into substantially the same shape in plan view, and are made of a metal plate such as a stainless steel (SUS) steel plate.

As shown in FIGS. 6 and 7, the shape of the upper leaf spring 6 (lower leaf spring 7) is a substantially rectangular shape whose outer shape in plan view is the same as the upper end portion (lower end portion) of the module frame 5. A circular opening 6 </ b> C (7 </ b> C) that is coaxial with the axis M and slightly larger than the housing portion 4 </ b> A of the lens frame 4 is formed in the part, and has a ring shape as a whole.
FIG. 6 is a plan view of the upper leaf spring 6. FIG. 7 is a plan view of the lower leaf spring 7.

  The upper leaf spring 6 (lower leaf spring 7) includes a frame-shaped frame body portion (first coupling portion) 50 connected on the upper end surface 5a (lower end surface 5b) of the module frame 5, and the frame body portion 50. Both ends of the ring portion (second connecting portion) 51 connected on the upper end surface 4 a (lower end surface 4 b) of the lens frame 4, the frame body portion 50, and the ring portion 51 in a state of being disposed radially inside. Are connected to each other, and are mainly composed of a spring portion 52 that connects the two.

In the vicinity of the corner of the frame 50, each upper fixing pin 14A (lower fixing) corresponds to the arrangement position of the upper fixing pin 14A (lower fixing pin 14B) formed near the corner of the module frame 5. Four through holes 6B (7B) that can be respectively inserted into the pins 14B) are formed. Thereby, positioning in the plane orthogonal to the axis line M with respect to the module frame 5 is possible.
Similarly, the ring portion 51 is inserted into each upper fixing pin 13A (lower fixing pin 13B) corresponding to the arrangement position of the upper fixing pin 13A (lower fixing pin 13B) formed on the lens frame 4. Four possible through holes 6A (7A) are formed.

  At this time, in this embodiment, the four through-holes 6A (7A) and the SMA wire 10 are connected to an imaginary line L (that is, orthogonal to the connecting line N) connecting the two fixed points P where the both ends of the SMA wire 10 are fixed to the module frame 5. And an imaginary line L passing through the axis M) is formed at a position deviated by approximately 45 degrees in the circumferential direction around the axis M. Further, the four through-holes 6A (7A) are designed so as to be displaced by about 45 degrees in the circumferential direction with respect to the four through-holes 6B (7B).

The spring part 52 is formed in a substantially quadrant shape and is disposed between the ring part 51 and the frame part 50. One end portion of the spring portion 52 is connected to the ring portion 51 in the vicinity of the four through holes 6A (7A), and the other end portion is connected to the frame body portion 50 in the vicinity of the four through holes 6A (7A).
That is, four spring portions 52 of the present embodiment are formed so as to face each other with the axis M interposed therebetween, and an imaginary line L connecting two fixed points P where both ends of the SMA wire 10 are fixed to the module frame 5. It is connected to the ring portion 51 at a position deviated from the top by about 45 degrees in the circumferential direction around the axis M.

  Here, of the four spring portions 52, the spring portion 52 closest to the guide protrusion 4D is defined as a first spring portion 52a, and the spring portion 52 that faces the first spring portion 52a across the axis M is a second spring portion. 52b. Of the remaining two spring portions 52, the spring portion 52 close to the wire holding member 15A is the third spring portion 52c, and the spring portion 52 facing the third spring portion 52c across the axis M is the fourth spring portion. 52d.

  Next, the module lower plate 8 allows the lower fixing pins 14B of the module frame 5 to pass through the through holes 7B of the lower plate spring 7, and the lower fixing pins 13B of the lens frame 4 accommodated in the module frame 5. With the lower plate spring 7 being passed through the through hole 7A of the lower plate spring 7, the lower plate spring 7 is sandwiched between the module frame 5 from the lower side, and the rectangular frame body portion 50 of the lower plate spring 7 is formed. The module frame 5 is fixed to the lower end surface 5b in a pressed state.

The shape of the module lower plate 8 is a plate-like member having a rectangular outer shape that is substantially the same as the outer shape of the module frame 5, and a substantially circular opening 8 </ b> A centering on the axis M penetrates in the thickness direction in the center. Is formed. Then, on the upper surface 8a side laminated on the lower leaf spring 7 at the time of assembly, 4 for avoiding interference with a caulking portion 18 described later at a position corresponding to the arrangement position of each lower fixing pin 13B of the lens frame 4. Two U-shaped concave portions 8B are formed.
In addition, through holes 8 </ b> C through which the lower fixing pins 14 </ b> B are inserted are formed at the corners located on the periphery of the module lower plate 8 corresponding to the arrangement positions of the lower fixing pins 14 </ b> B of the module frame 5. Has been.

  In addition, the material of the module lower plate 8 employs, for example, a synthetic resin having electrical insulation and light shielding properties. Further, since the module lower plate 8 has electrical insulation, it is an insulating member that fixes the power supply member 9 to the lower plate spring 7 in an electrically insulated state.

The power supply member 9 is composed of a pair of electrodes 9a and 9b each made of a plate-like metal plate. Each of the electrodes 9a and 9b includes a substantially L-shaped wiring portion 9B that follows the outer shape of the module lower plate 8, a terminal portion 9C that protrudes outside the outer shape of the module lower plate 8 from the end of the wiring portion 9B, It consists of a polygonal metal plate provided with.
Each of the wiring portions 9B has two lower fixing pins adjacent to each other along the outer shape of the module lower plate 8 out of the lower fixing pins 14B of the module frame 5 protruding downward from the lower surface of the module lower plate 8. Two through holes 9A for positioning the electrodes 9a and 9b with respect to the module frame 5 by inserting the pins 14B, respectively, are provided.

  As shown in FIG. 4, the terminal portions 9C of the electrodes 9a and 9b are provided in the module frame 5 so as to protrude in parallel downward from the side surface on the side where the wire holding member 15A is attached in the axis M direction. . For this reason, the electrode 9a is conductively cut in a concave shape to electrically connect the terminal portion 15a of the wire holding member 15A to the side surface on the wiring portion 9B between the through hole 9A and the terminal portion 9C. A connecting portion 9D is provided.

In addition, the electrode 9b is formed with a conductive connection portion 9D that is notched at a connection portion with the terminal portion 15a of the wire holding member 15B on the side surface of the wiring portion 9B. In the conductive connection portion 9D, the electrode 9b and the wire holding member 15B are electrically connected.
In addition, as means for electrically connecting each conductive connection portion 9D to the terminal portion 15a, for example, soldering or adhesion using a conductive adhesive can be employed.

  As shown in FIG. 2, the cover 11 has a side wall portion 11D extending from the outer edge portion of the upper surface 11E to the lower side so as to cover the module frame 5 so that the module frame 5 can be fitted, and a rectangular opening 11C is formed on the lower side. A circular opening 11A centering on the axis M is provided at the center of the upper surface 11E. The size of the opening 11A is, for example, a size that allows the lens unit 12 to be taken in and out.

  Next, a method for assembling the drive module 11 configured as described above will be described below. In the present embodiment, the assembly is performed mainly through six steps from the first step to the sixth step. Hereinafter, each step will be described in detail.

First, in the first step, the lens frame 4 is inserted into the housing portion 5A of the module frame 5 from below, and the upper end surfaces 5a of the module frame 5 and the upper end surfaces 4a of the lens frame 4 are aligned at the same height. . Then, the through holes 6B and 6A of the upper leaf spring 6 are inserted into the upper fixing pins 14A of the module frame 5 and the upper fixing pins 13A of the lens frame 4, respectively.
Thereafter, the tip ends of the upper fixing pins 13A and 14A protruding upward through the through holes 6A and 6B of the upper leaf spring 6 are heat caulked by a heater chip (not shown), respectively, The caulking portion 16 and the caulking portion 17 as the second fixing portion are respectively formed (see FIGS. 4 and 5).

At this time, the upper end surface 4a of the lens frame 4 and the upper end surface 5a of the module frame 5 are aligned on the same plane, and the flat upper plate spring 6 is arranged without being deformed to perform heat caulking. be able to. Therefore, it is not necessary to press the upper plate spring 6 that is deformed, and therefore it is possible to easily perform caulking. Further, the occurrence of floating or the like due to the deformation of the upper leaf spring 6 can be prevented. Moreover, since the height of each heater chip can be made common, even if the caulking portions 16 and 17 are formed at the same time, variation in caulking accuracy can be reduced.
At this point, the first step is finished.

Next, the second step is performed.
First, the through holes 7A of the lower leaf spring 7 are inserted into the lower fixing pins 13B of the lens frame 4, respectively. At this time, the through holes 7B of the lower plate spring 7, the through holes 8C of the module lower plate 8, and the through holes 9A of the power supply member 9 are respectively inserted into the lower fixing pins 14B of the module frame 5. Thereafter, the tip end portion of each lower fixing pin 13B penetrating through each through hole 7A of the lower leaf spring 7 is caulked with a heater chip, and the caulking portion 18 (first fixing portion) ( (See FIG. 5).

At this time, since the axial distance between the upper end surface 4a and the lower end surface 4b of the lens frame 4 is equal to the axial distance between the upper end surface 5a and the lower end surface 5b of the module frame 5, the lower end surfaces 4b and 5b are The module lower plate 8 can be stacked and arranged without deforming the flat plate-like lower plate spring 7 and can be heat-caulked. Therefore, the occurrence of floating or the like due to the deformation of the lower leaf spring 7 can be prevented. Moreover, since the height of each heater chip can be made common, even if the caulking portion 18 is formed at the same time, variation in caulking accuracy can be reduced.
At this point, the second step is finished.

Next, the third step is performed.
First, a lower end portion of each lower fixing pin 14B penetrating through the above-described through holes 7B, 8C, and 9A is caulked with a heater chip, and a caulking portion 19 serving as a second fixing portion. (See FIG. 5). At this time, since the height of each heater chip can be made common, even if the caulking portion 19 is formed at the same time, variation in caulking accuracy can be reduced. Further, since the recess 8 </ b> B is formed in the module lower plate 8, the caulking portion 18 formed in the second step does not contact the module lower plate 8.

  At this point, the third step is finished. By performing the operations from the first process to the third process described above, the upper plate spring 6, the lower plate spring 7, the module lower plate 8, and the power supply member 9 are laminated and fixed to both ends of the lens frame 4 and the module frame 5. can do.

  In addition, since the upper fixing pin 13A and the lower fixing pin 13B, and the upper fixing pin 14A and the lower fixing pin 14B are provided coaxially, respectively, in the caulking from the first fixing to the third process, The positions of the heater chips on the plane for forming the caulking portions 16 and 18 and the caulking portions 17 and 19 are common. Therefore, since it is not necessary to change the heater chip position in each caulking, the caulking operation can be performed efficiently.

Next, a fourth step (arrangement step) is performed.
First, the pair of wire holding members 15 </ b> A and 15 </ b> B to which the SMA wire 10 is attached are fixed to the module frame 5. Specifically, the through holes 36A and 36B of the wire holding members 15A and 15B are fitted to the two pins 35A and 35B formed on the module frame 5, and the wire holding members 15A and 15B are fitted to the locking grooves 5C. Lock each one. At this time, the intermediate portion of the SMA wire 10 is engaged with the distal end key portion 4D1 of the guide projection 4D, and the distal end key portion 4D1 is supported so as to be supported from below. The terminal portions 15a of the wire holding members 15A and 15B protrude below the module lower plate 8, and are respectively connected to the conductive connection portions 9D of the electrodes 9a and 9b, which are power supply members 9 fixed to the module lower plate 8. Locked or placed close together.
At this point, the fourth step ends.

Next, a fifth step (fixing step) is performed.
First, a thermosetting adhesive is poured into the through holes 37 </ b> A and 37 </ b> B and filled into the groove portion 36 of the module frame 5. After the groove 36 is filled with a thermosetting adhesive, it is placed in a heating furnace in order to cure the adhesive. In the heating furnace, for example, the adhesive is cured by heating at about 100 ° C. for about 20 to 30 minutes, and the module frame 5 and the wire holding members 15A and 15B are bonded and fixed. Subsequently, after the module frame 5 and the wire holding members 15A and 15B are bonded and fixed, the terminal portions 15a are electrically connected to the conductive connection portions 9D by using, for example, soldering or a conductive adhesive. Connect to.
At this point, the fifth step is finished.

Finally, the sixth step is performed.
First, the cover 11 is put on the module frame 5 from above, and the side wall portion 11D and the module lower plate 8 are joined. As this method, for example, an engagement claw or the like is provided on the side wall portion 11D and joined by fitting, or the side wall portion 11D and the module lower plate 8 are bonded or welded to join. The caulking portions 16 and 17 are in a state of being separated from the back surface of the upper surface 11E of the cover 11, respectively.
Thus, the assembly of the drive module main body is completed.

  Thereafter, the adapter 30 is attached below the drive unit 31 and then attached onto the substrate. For mounting on the substrate, fixing means such as adhesion and fitting can be employed. The substrate may be an independent member attached to the drive module 1 or a member connected to and disposed on an electronic device or the like.

  Further, the lens unit 12 is screwed into the lens frame 4 through the opening 11 </ b> A of the cover 11. As described above, the lens unit 12 is attached last because the lens of the lens unit 12 is not soiled or dust is attached by the assembling work. For example, the drive module 1 is attached to the lens unit 12. This process is performed at an early stage (sixth stage) when the product is shipped in a product state where the lens is attached, or when the opening 11A of the cover 11 is desired to be smaller than the outer shape of the lens unit 12, for example, when the aperture stop is also used. It may be carried out before the process).

Next, the operation of the drive module 1 will be described.
First, in a state where no power is supplied to the terminal portion 9C, the tension from the SMA wire 10 and the force acting on the lens frame 4 such as the restoring force from the upper plate spring 6 and the lower plate spring 7 are balanced. The lens frame 4 to which the lens unit 12 is attached is held at a fixed position in the axis M direction.

  Here, when the SMA wire 10 is heated by energization, the SMA wire 10 contracts to a length corresponding to the temperature. More specifically, when power is supplied to the power supply member 9 through the terminal portion 9C, the electrode 9a, the wire holding member 15A, the SMA wire 10, the wire holding member 15B, and the electrode 9b are electrically connected to each other. A current flows through 10. Thereby, Joule heat is generated in the SMA wire 10 and the temperature of the SMA wire 10 rises. When the temperature exceeds the transformation start temperature of the SMA wire 10, the SMA wire 10 contracts to a length corresponding to the temperature.

  Then, since both ends of the SMA wire 10 are fixed to the module frame 5 via the wire holding members 15A and 15B in a state in which the middle is locked to the guide protrusion 4D, the generated force ( Driving force), and the guide protrusion 4D can be moved upward (in the direction of arrow Z1 in FIGS. 4 and 5) along the direction of the axis M. Thereby, the lens frame 4 can be moved relative to the module frame 5 and can be moved up along the axis M direction.

  When the lens frame 4 moves, the upper leaf spring 6 and the lower leaf spring 7 are deformed, and an elastic restoring force corresponding to the amount of deformation acts on the lens frame 4. Specifically, the ring portion 51 connected to the lens frame 4 moves as the lens frame 4 moves. Therefore, the spring part 52 that connects the frame part 50 and the ring part 51 connected to the module frame 5 is deformed, and the elastic restoring force of the spring part 52 acts on the lens frame 4. Then, the movement of the lens frame 4 stops at a position where the elastic restoring force from the upper plate spring 6 and the lower plate spring 7 balances the tension of the SMA wire 10.

  Further, when the supply of power is stopped and the energization to the SMA wire 10 is stopped, the SMA wire 10 can be extended. Thereby, the lens frame 4 can be moved downward (in the direction of arrow Z2 in FIGS. 4 and 5) in the opposite direction to the previous one. In this way, by controlling the power supply amount, that is, controlling the heat generation amount of the SMA wire 10, the lens frame 4 can be moved in two directions (upward direction and downward direction) along the axis M direction.

  By the way, when the lens frame 4 is moved, the lens frame 4 is moved by contracting the SMA wire 10 formed on the distal end key portion 4D1 of the guide protrusion 4D. Thus, the lifting side on which the guide protrusion 4D is formed is lifted, and the force that the opposite side is lowered acts on the lens frame 4. That is, the lens frame 4 rotates around an imaginary line L (an imaginary line L orthogonal to the connecting line N and passing through the axis M) that connects two fixed points P where both ends of the SMA wire 10 are fixed to the module frame 5. Try to tilt.

On the other hand, since the lens frame 4 is cantilevered by a plurality of spring portions 52, the support portion S is connected around the connection points where the spring portions 52 are connected to the ring portion 51 (see FIGS. 6 and 7). ), And is difficult to rotate in other directions.
Here, the four spring portions 52 are located at positions that deviate in the circumferential direction about the axis M from the imaginary line L connecting the two fixed points P where the both ends of the SMA wire 10 are fixed to the module frame 5. And connected to the ring portion 51. Therefore, unlike the conventional one, the support line S connecting the connection points and the virtual line L connecting the fixed point P of the SMA wire 10 are designed not to coincide with each other. Accordingly, the lens frame 4 is supported by the four spring portions 52 in a state in which it is difficult to rotate around the virtual line L.

  Therefore, even when the lens frame 4 is rotated around the imaginary line L and is inclined when the lens frame 4 is moved, the movement of the inclination can be prevented. As a result, the lens frame 4 can be moved as straight as possible along the direction of the axis M while suppressing the inclination of the lens frame 4.

  In addition, in the present embodiment, the four spring portions 52 are respectively connected to the ring portion 51 at a position rotated approximately 45 degrees in the circumferential direction from the virtual line L, so that connection points of the opposing spring portions 52 are connected to each other. The support line S can be inclined about 45 degrees with respect to the virtual line L. Therefore, the movement of the lens frame 4 that rotates around the imaginary line L and tries to tilt can be more effectively suppressed.

Furthermore, according to the drive module 1 of the present embodiment, when the SMA wire 10 is contracted and the lens frame 4 is moved upward, the lens frame 4 can be prevented from sliding in the radial direction. is there.
Specifically, when the SMA wire 10 contracts, the guide protrusion 4D is lifted obliquely, so that the force that moves the guide protrusion 4D in the radial direction simultaneously with the force that moves the guide protrusion 4D upward. F1 (refer FIG. 6) will act. Therefore, a force F2 that slides in the radial direction acts on the lens frame 4. Then, this force F2 acts on the upper fixing pin 13A (lower fixing pin 13B) that connects the lens frame 4 and the ring portion 51, and therefore the force F2 acts on the pin 13A (13B). . In FIG. 6, illustration of pins is omitted.

  Here, since the spring portion 52 of the present embodiment is connected to the ring portion 51 at a position rotated approximately 45 degrees in the circumferential direction around the axis M from the virtual line L, the spring portion 52 and the ring portion 51 are connected. And the connection point of the SMA wire 10 can be set to a position deviated in the circumferential direction from the action point of the SMA wire 10 (position of the guide protrusion 4D). If the connection point between the spring part 52 and the ring part 51 and the action point of the SMA wire 10 coincide with each other in the circumferential direction, a force perpendicular to the extending direction of the spring part 52 is applied to the spring part. The spring portion 52 is easily deformed in the radial direction.

However, in the present embodiment, as described above, the connection point between the spring portion 52 and the ring portion 51 is located in a position deviated from the action point of the SMA wire 10 in the circumferential direction. Difficult to deform. Therefore, the lens frame 4 has a structure that is difficult to move in the radial direction. As a result, when the SMA wire 10 is contracted and the lens frame 4 is moved upward, the lens frame 4 can be prevented from sliding in the radial direction.
Therefore, the lens frame 4 can be moved up while suppressing unnecessary behavior such as rattling. In this respect as well, it is possible to improve the straight traveling performance.

In the above embodiment, the spring portion 52 closest to the guide projection 4D among the four spring portions 52 of the upper leaf spring 6 and the lower leaf spring 7, that is, the first spring portion 52a is more than the other spring portions 52. You may design so that a spring constant may become high.
Specifically, the upper leaf spring 6 will be described as an example. As shown in FIG. 8, the width D1 of the first spring portion 52a is formed to be thicker than the width D2 of the other spring portions 52. Thereby, the spring constant of the first spring portion 52 a can be set higher than that of the other spring portions 52.

By doing so, it is possible to suppress the movement itself that the lens frame 4 tends to tilt around the imaginary line L when the lens frame 4 is moved via the guide protrusion 4D. Therefore, the straightness of the lens frame 4 can be further improved.
Although the spring constant is set high by changing the width, the invention is not limited to this case, and the spring constant may be designed to be high by changing the plate thickness or using other means.

Further, not only the first spring portion 52a but also the first spring portion 52a and the second spring portion 52b are set so that the spring constant is higher than the remaining two third spring portions 52c and fourth spring portions 52d. It doesn't matter.
Specifically, the upper leaf spring 6 will be described as an example. As shown in FIG. 9, the width D1 of the first spring portion 52a and the second spring portion 52b is formed to be thicker than the width D2 of the other spring portions 52. To do. Thereby, the spring constants of the first spring part 52 a and the second spring part 52 b can be set higher than those of the other spring parts 52.

By doing so, it is possible to more effectively suppress the movement itself that the lens frame 4 tends to incline around the imaginary line L when the lens frame 4 is moved via the guide protrusion 4D. Therefore, the straightness of the lens frame 4 can be further improved.
Furthermore, when the guide protrusion 4D is moved by the SMA wire 10, the lens frame 4 is more effectively prevented from sliding in the radial direction by the first spring portion 52a and the second spring portion 52b having a high spring constant. be able to. Therefore, unnecessary behavior such as rattling of the lens frame 4 can be further suppressed, and the straightness of the lens frame 4 can be further improved.

(Electronics)
Next, an embodiment of an electronic device according to the present invention will be described with reference to FIG. In the present embodiment, as an example of an electronic device, a camera-equipped mobile phone including the drive module 1 of the above embodiment will be described as an example.

As shown in FIG. 10, the camera-equipped mobile phone 20 according to the present embodiment includes a receiver 22a, a transmitter 22b, an operation unit 22c, a liquid crystal display 22d, an antenna 22e, and a control circuit (not shown). And an electronic part of a well-known mobile phone such as a part and the like inside and outside the cover 22.
FIG. 10A is an external perspective view of the front side of the camera-equipped mobile phone 20. FIG. 10B is an external perspective view of the back side of the camera-equipped mobile phone 20. FIG.10 (c) is BB sectional drawing in FIG.10 (b).

  As shown in FIG. 10B, the cover 22 on the back surface side on which the liquid crystal display unit 22d is provided is provided with a window 22A that allows external light to pass through. Then, as shown in FIG. 10C, the drive module 1 is installed such that the opening 11A of the drive module 1 faces the window 22A of the cover 22, and the axis M is along the normal direction of the window 22A. .

  At this time, the drive module 1 is mechanically and electrically connected to the substrate 2. The substrate 2 is connected to a control circuit unit (not shown) so that power can be supplied to the drive module 1.

  With this configuration, the light transmitted through the window 22 </ b> A can be collected by the lens unit 12 (not shown) of the drive module 1 and imaged on the image sensor 30. Then, by supplying appropriate power from the control circuit unit to the drive module 1, the lens unit 12 can be driven in the direction of the axis M, and the focal position can be adjusted to perform photographing.

  In particular, the camera-equipped mobile phone 20 of the present embodiment includes the drive module 1 that can move the lens frame 4 as straight as possible along the axis M direction while suppressing the inclination of the lens frame 4. Therefore, it is possible to improve the operation performance, that is, to improve the focus position adjustment performance, and it is possible to provide the highly reliable camera phone 20 with a camera.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the above embodiment, the lens frame 4 is driven in the direction of the axis M by applying a generating force to the guide protrusion 4D using the SMA wire 10. However, the present invention is not limited to this. The lens frame 4 may be driven by using the above as an actuator.

Moreover, in the said embodiment, although comprised so that the spring part 52 might be connected to the ring part 51 in the position rotated about 45 degree | times to the circumferential direction from the virtual line L, it is not limited to 45 degree | times. The spring part 52 may be connected to the ring part 51 at a position deviated from the imaginary line L in the circumferential direction around the axis M, and the angle may be shifted by 20 degrees, 30 degrees, or 40 degrees. .
In particular, the smaller the deviation angle (for example, 20 degrees), the closer the positions of the through holes 6A and 7A are to the corners where there is excess space in the frame 50, so the size of the upper leaf spring 6 and the lower leaf spring 7 Miniaturization can be achieved.

In the above-described embodiment, the upper leaf spring 6 and the lower leaf spring 7 having four spring portions 52 are used. However, as shown in FIG. Even in this case, both ends of the SMA wire 10 are spring portions at positions deviated from the imaginary line L connecting the two fixed points P supported by the module frame 5 in the circumferential direction around the axis M. 52 should just be connected to the ring part 51. Thereby, the same operation effect can be produced.
Furthermore, even in this case, it is preferable to set the spring constant of the spring portion 52 closest to the guide protrusion 4 </ b> D higher than the other spring portions 52.

  In the above embodiment, the upper fixing pins 13A and 14A and the lower fixing pins 13B and 14B are inserted through the upper plate spring 6 and the lower plate spring 7 which are plate spring members for urging the lens frame 4, Although the example of heat caulking the tips of the fixing pins has been described, the method for fixing the leaf spring member is not limited to this. For example, it may be fixed by ultrasonic caulking or the like, or a leaf spring member may be bonded to the lens frame 4 or the module frame 5. In this case, since a large adhesion area can be secured, a large strength can be obtained even if an adhesive is used.

  Moreover, although the module frame 5 was demonstrated as a substantially rectangular member as a whole in the said embodiment, it is not limited to a substantially rectangular shape, A polygonal shape may be sufficient.

  Moreover, although the said embodiment demonstrated the example in the case of using the drive module 1 for the focus position adjustment mechanism of the lens unit 12, the use of the drive module 1 is not limited to this. For example, you may use for another part as an appropriate actuator which moves a to-be-driven body to a target position. For example, instead of the lens unit 12, a rod member or the like can be screwed or the lens frame 4 can be changed to another shape and used as an appropriate actuator. That is, the driven body is not limited to a cylindrical member, and may be a columnar member.

  Moreover, although the said embodiment demonstrated the example of the mobile phone 20 with a camera as an electronic device using the drive module 1, the kind of electronic device is not limited to this. For example, it may be used in an optical device such as a digital camera or a camera built in a personal computer, or in an electronic device such as an information reading storage device or a printer, and can also be used as an actuator for moving a driven body to a target position.

L ... Virtual line M ... Axis line N ... Connecting line P ... Shape memory alloy wire fixed point 1 ... Drive module 20 ... Mobile phone with camera (electronic equipment)
4 ... Lens frame (driven body)
4D ... Guide protrusion (protrusion)
5 ... Module frame (support)
6 ... Upper leaf spring (leaf spring member)
7 ... Lower leaf spring (leaf spring member)
10 ... SMA wire (shape memory alloy wire, actuator)
50 ... Frame part (first connecting part)
51. Ring part (second connecting part)
52 ... Spring part

Claims (6)

A cylindrical or columnar driven body;
A cylindrical support for accommodating the driven body inside;
A pair of leaf spring members disposed above and below the driven body and elastically holding the driven body so as to be movable along the axial direction with respect to the support;
A protrusion provided on the outer wall surface of the driven body so as to protrude radially outward;
An actuator that is fixed to the support and drives the driven body in the axial direction against the restoring force of the leaf spring member by exerting a generating force on the protrusion.
The leaf spring member is connected to the end surface of the driven body in a state of being arranged on the inner side in the radial direction of the first connection portion and a frame-shaped first connection portion connected to the end surface of the support body A plurality of spring portions, both ends of which are connected to the first connecting portion and the second connecting portion, respectively, and connecting both connecting portions;
The spring portion is perpendicular to a connecting line connecting the protrusion and the axis along the radial direction of the driven body, and is disengaged from a virtual line passing through the axis in a circumferential direction around the axis. The driving module is connected to the second connecting portion at a position. The drive module according to claim 1, wherein
The actuator is fixed to the support so that both ends are positioned on the imaginary line and are opposed to each other across the axis, with the middle being locked to the protrusion, and heat is generated during energization. A drive module comprising a shape memory alloy wire that drives the driven body by being displaced. The drive module according to claim 1 or 2,
Four spring portions are formed so as to face each other across the axis, and are connected to the second connecting portion at a position rotated 45 degrees in the circumferential direction from the virtual line. Driving module. The drive module according to any one of claims 1 to 3,
The drive module characterized in that a spring part closest to the protrusion part among the plurality of spring parts is adjusted to have a higher spring constant than the other spring parts. The drive module according to claim 3, wherein
Among the plurality of spring portions, the spring portion closest to the projection portion and the spring portion disposed at a position facing the spring portion across the axis are higher in spring constant than the remaining two spring portions. A drive module characterized by being adjusted to be.   An electronic apparatus comprising the drive module according to any one of claims 1 to 5.

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