JP2011097041A5 - - Google Patents

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Publication number
JP2011097041A5
JP2011097041A5 JP2010217176A JP2010217176A JP2011097041A5 JP 2011097041 A5 JP2011097041 A5 JP 2011097041A5 JP 2010217176 A JP2010217176 A JP 2010217176A JP 2010217176 A JP2010217176 A JP 2010217176A JP 2011097041 A5 JP2011097041 A5 JP 2011097041A5
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JP
Japan
Prior art keywords
semiconductor
manufacturing
compound semiconductor
indium
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010217176A
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English (en)
Japanese (ja)
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JP2011097041A (ja
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Publication date
Application filed filed Critical
Priority to JP2010217176A priority Critical patent/JP2011097041A/ja
Priority claimed from JP2010217176A external-priority patent/JP2011097041A/ja
Priority to US12/896,471 priority patent/US20110079507A1/en
Publication of JP2011097041A publication Critical patent/JP2011097041A/ja
Publication of JP2011097041A5 publication Critical patent/JP2011097041A5/ja
Pending legal-status Critical Current

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JP2010217176A 2009-10-02 2010-09-28 半導体素子の製造方法 Pending JP2011097041A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010217176A JP2011097041A (ja) 2009-10-02 2010-09-28 半導体素子の製造方法
US12/896,471 US20110079507A1 (en) 2009-10-02 2010-10-01 Manufacturing method of semiconductor element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009230730 2009-10-02
JP2010217176A JP2011097041A (ja) 2009-10-02 2010-09-28 半導体素子の製造方法

Publications (2)

Publication Number Publication Date
JP2011097041A JP2011097041A (ja) 2011-05-12
JP2011097041A5 true JP2011097041A5 (enExample) 2011-08-04

Family

ID=43822362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010217176A Pending JP2011097041A (ja) 2009-10-02 2010-09-28 半導体素子の製造方法

Country Status (2)

Country Link
US (1) US20110079507A1 (enExample)
JP (1) JP2011097041A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5272390B2 (ja) * 2007-11-29 2013-08-28 豊田合成株式会社 Iii族窒化物半導体の製造方法、iii族窒化物半導体発光素子の製造方法、及びiii族窒化物半導体発光素子、並びにランプ
KR102637922B1 (ko) * 2016-03-10 2024-02-16 에이에스엠 아이피 홀딩 비.브이. 플라즈마 안정화 방법 및 이를 이용한 증착 방법
CN112639158A (zh) * 2018-12-28 2021-04-09 株式会社爱发科 成膜装置以及成膜方法
TWI818151B (zh) * 2019-03-01 2023-10-11 美商應用材料股份有限公司 物理氣相沉積腔室及其操作方法
JP7677731B2 (ja) * 2021-12-14 2025-05-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN117265475A (zh) * 2022-06-20 2023-12-22 芝浦机械电子装置株式会社 成膜装置
KR20230174172A (ko) 2022-06-20 2023-12-27 시바우라 메카트로닉스 가부시끼가이샤 성막 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5525199A (en) * 1991-11-13 1996-06-11 Optical Corporation Of America Low pressure reactive magnetron sputtering apparatus and method
JPH06158305A (ja) * 1992-11-27 1994-06-07 Shimadzu Corp インラインスパッタリング装置
WO2001033643A1 (en) * 1999-10-29 2001-05-10 Ohio University BAND GAP ENGINEERING OF AMORPHOUS Al-Ga-N ALLOYS
AU2003207295A1 (en) * 2002-02-14 2003-09-04 Honda Giken Kogyo Kabushiki Kaisha Light absorbing layer forming method
US7172681B2 (en) * 2003-02-05 2007-02-06 Bridgestone Corporation Process for producing rubber-based composite material
JP2005019742A (ja) * 2003-06-26 2005-01-20 Matsushita Electric Ind Co Ltd 太陽電池
US20080121924A1 (en) * 2006-11-24 2008-05-29 Showa Denko K.K. Apparatus for manufacturing group iii nitride compound semiconductor light-emitting device, method of manufacturing group iii nitride compound semiconductor light-emitting device, group iii nitride compound semiconductor light-emitting device, and lamp
US20080223434A1 (en) * 2007-02-19 2008-09-18 Showa Denko K.K. Solar cell and process for producing the same
US8383439B2 (en) * 2007-10-25 2013-02-26 Showa Denko K.K. Apparatus for manufacturing group-III nitride semiconductor layer, method of manufacturing group-III nitride semiconductor layer, group-III nitride semiconductor light-emitting device, method of manufacturing group-III nitride semiconductor light-emitting device, and lamp
JP4997448B2 (ja) * 2007-12-21 2012-08-08 独立行政法人産業技術総合研究所 窒化物半導体の製造方法および窒化物半導体デバイス
US8894826B2 (en) * 2009-09-24 2014-11-25 Jesse A. Frantz Copper indium gallium selenide (CIGS) thin films with composition controlled by co-sputtering

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