JP2011091586A - Piezoelectric vibrator, and electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric vibrator and an electronic component, which can assure airtightness and sufficient bonding strength in a package. <P>SOLUTION: The piezoelectric vibrator 10 includes a base substrate 44, a piezoelectric vibration piece layer 12, and a lid 42 laminated sequentially, wherein the piezoelectric vibration piece layer has a piezoelectric vibration piece 14 having an excitation electrode, a support frame 24 which supports the piezoelectric vibration piece, a lead-out part which connects the piezoelectric vibration piece and the support frame, a lead-out electrode which is connected with the excitation electrode, led out to the surface of the lead-out part facing the base substrate and connected with the first metal layer formed on the first surface 44a of the base substrate, and second metal layers 21a and 21b which are formed in a region where the joint of the first metal layer and the lead-out electrode is projected to the main surface of the piezoelectric vibration piece layer on the lid side, the lid has the third metal layer on the main surface facing the second metal layers, the base substrate has an electrode which is formed in a through hole for connection with an external electrode, and the electrode is connected with the fourth metal layer extended from the first metal layer. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component having a laminated structure such as a piezoelectric vibrator and a force detection element, which can maintain the reliability of electrical connection of electrodes between other layers and improve the yield. Concerning structure.

  Conventionally, there is an electronic component formed by stacking a plurality of substrates. Patent Document 1 relates to a package structure in which a vibrating element layer integrally formed with a crystal vibrating piece and a frame portion that supports the quartz vibrating piece, and two covers that cover both main surfaces of the vibrating piece layer are stacked. A three-layer package is disclosed in which the metal films are directly bonded and hermetically sealed by bonding them at the atomic level.

  In the prior art of Patent Document 2, as a method for manufacturing a three-layer package, as shown in FIG. 11A, an extraction electrode 112 is provided at a connecting portion 114 that connects the frame portion 110 and the vibration portion 111. In order to electrically connect from 112 to the frequency adjustment terminal 116 formed on the other main surface side, as shown in FIG. 11B, which is a C′-C ′ cross section of FIG. The side electrode 118 is formed. However, the side electrode 118 is removed at the stage after the frequency adjustment and before the three layers are stacked (FIG. 11C). Thus, the connection part 114 of the three-layer package type piezoelectric vibrator, which is the final structure, does not have the side electrode 118 on the side wall, and the excitation electrodes 120 and 122 formed on the front and back of the crystal vibrator piece are electrically Are never connected.

By the way, a technique is known in which a lead electrode drawn out from an excitation electrode and an external electrode are made conductive by a through electrode penetrating a substrate.
In Patent Document 4 cited as the prior art of Patent Document 3, as shown in FIG. 12A, a piezoelectric substrate 203 made of quartz crystal in which a frame portion 203A and a vibrating portion 203B are integrally formed, A piezoelectric vibrator 200 is disclosed which is sandwiched between a glass lid 201 and a substrate 202, and a through hole 204 is formed in the substrate 202. The through-hole 204 is in contact with the extraction electrode of the intermediate layer connected to the excitation electrode formed in the vibration part 203B, and is tapered so that the diameter of the opening increases toward the outer surface of the lid 201. The external electrode 205 (the taper portion is a through electrode) composed of two layers of Cr and Au is formed on the surface by sputtering (FIG. 12B). In addition, a metal layer 203C electrically connected to the terminal electrode 205 provided in the through hole 204, and the metal layer 203C are formed on the front and back of the piezoelectric substrate 203 as an intermediate layer.

JP 2006-157369 A JP 2006-186666 A JP 2007-96777 A Japanese Patent No. 3390348

  When eutectic bonding of a package having such a laminated structure with a metal wax material, the terminal electrode 205 and the metal layer 203C as shown in FIG. 12 are simultaneously bonded. When a metal brazing material is formed between the terminal electrode 205 provided in the through hole 204 and the metal layer 203C and is melted under pressure to be eutectic bonded, the metal is pressed and melted between the through hole of the substrate and the intermediate element layer. However, at this time, the molten metal brazing material flows out into the through hole, and there is a possibility that a shortage of the metal brazing material between the substrate and the intermediate element layer may occur. Therefore, there is a problem that the airtightness in the package cannot be ensured or sufficient bonding strength cannot be ensured.

  Therefore, in order to solve the above-mentioned problems of the prior art, the present invention can improve the yield and reduce the cost when providing the through electrode for conducting the extraction electrode of the intermediate layer to the terminal electrode formed on the substrate side. An object of the present invention is to provide a piezoelectric vibrator and an electronic component.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
Application Example 1 A piezoelectric vibrator in which a base substrate, a piezoelectric vibrating piece layer, and a lid are stacked in this order, and the piezoelectric vibrating piece layer includes a piezoelectric vibrating piece having an excitation electrode and a support that supports the piezoelectric vibrating piece. A frame, a lead portion connecting the piezoelectric vibrating piece and the support frame, and the excitation electrode are connected to the surface of the lead portion facing the base substrate, and are formed on the first surface of the base substrate. A lead electrode connected to the first metal layer, and a second metal layer formed in a region in which a junction between the first metal layer and the lead electrode is projected onto the lid-side main surface of the piezoelectric vibrating piece layer The lid has a third metal layer on a main surface facing the second metal layer, and the base substrate has an electrode formed in a through hole connected to an external electrode. , The fourth metal layer extending from the first metal layer to the fourth metal layer The piezoelectric vibrator, wherein a pole is connected.

  With the above configuration, in the connection between the first metal layer formed on the first surface of the base substrate and the extraction electrode, the gap between the lid and the piezoelectric vibrating piece layer is eliminated by the second and third metal layers. When eutectic bonding is performed by pressurization and melting, the pressure is sufficiently transmitted to ensure bonding.

Application Example 2 The piezoelectric vibrator according to Application Example 1, wherein the electrode is formed at a position that does not overlap the first metal layer in plan view of the piezoelectric vibrating reed layer.
With the above configuration, when the through electrode formed in the through hole and the metal layer are arranged at a position where they do not overlap in a plan view, the molten metal wax material reaches the through hole when being melted under pressure and eutectic bonded. Connection reliability can be improved by preventing the flow out and minimizing the connection area between the first metal layer formed on the first surface of the base substrate and the extraction electrode.

  Application Example 3 An electronic component formed by mounting an electronic element piece having an electrode between a first substrate and a second substrate, the electronic element piece supporting an electronic element having an electrode and the electronic element A support frame that connects to the electrode, is pulled out to a surface of the support frame facing the first substrate, and is connected to a first metal layer formed on the first surface of the first substrate; A second metal layer formed in a region in which a junction between the first metal layer and the lead electrode is projected onto the second substrate side main surface of the electronic element piece, and the second substrate is The first metal layer has a third metal layer on a main surface facing the second metal layer, and the first substrate has a through electrode formed in a through hole connected to an external electrode, and the first metal layer The through-electrode is connected to a fourth metal layer extending from the electronic component.

  With the above configuration, in the connection between the first metal layer formed on the first surface of the first substrate and the extraction electrode, there is no gap between the second substrate and the electronic element piece by the second and third metal layers. Therefore, when pressure melting and eutectic bonding are performed, the pressure is uniformly transmitted and the connection can be made reliably.

It is a schematic diagram of the piezoelectric vibrator according to the first embodiment. It is a schematic diagram of the piezoelectric vibrator according to the first embodiment. 1 is an exploded perspective view of a piezoelectric vibrator according to a first embodiment. It is a figure which shows the manufacturing process of the piezoelectric vibrator which concerns on 1st Embodiment. It is a figure which shows the manufacturing process of the piezoelectric vibrator which concerns on 1st Embodiment. It is a figure which shows the manufacturing process of the piezoelectric vibrator which concerns on 1st Embodiment. It is a figure which shows the manufacturing process of the piezoelectric vibrator which concerns on 1st Embodiment. It is a schematic diagram of the force detection element according to the second embodiment. It is the disassembled perspective view seen from the board | substrate side of the force detection element which concerns on 2nd Embodiment. It is the disassembled perspective view seen from the diaphragm side of the force detection element which concerns on 2nd Embodiment. It is a schematic diagram of the piezoelectric vibrator according to the first prior art. It is a schematic diagram of the piezoelectric vibrator which concerns on a 2nd prior art.

Embodiments of a piezoelectric vibrator and an electronic component of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a side view of a piezoelectric vibrator according to a first embodiment, FIG. 1A is a side sectional view of the piezoelectric vibrator viewed from the side, and FIG. 1B is a piezoelectric vibrating piece constituting the piezoelectric vibrator. 1C is a bottom view of the piezoelectric vibrating reed layer, FIG. 2A is a plan view of the base substrate constituting the piezoelectric vibrator, FIG. 2B is a bottom view of the base substrate, and FIG. FIG. 2C shows a bottom view of the lid constituting the piezoelectric vibrator. FIG. 3A shows an exploded perspective view seen from the lid side, and FIG. 3B shows an exploded perspective view seen from the base substrate side.

  The piezoelectric vibrator 10 of the first embodiment has a three-layer structure including a base substrate 44, the piezoelectric vibrating reed layer 12, and a lid 42. In the following description including the drawings, an orthogonal coordinate system (X axis, Y axis, Z axis) is used.

  The piezoelectric vibrating reed layer 12 is formed of a piezoelectric substrate such as quartz, and includes the piezoelectric vibrating reed 14, a connecting portion (first connecting portion 16, second connecting portion 18), and a leading portion (first leading portion 20, second leading portion). 22) and is formed by the support frame 24, and the outer shape of the piezoelectric vibrating reed layer 12 can be formed by using both a photolithographic technique and an etching technique.

  The piezoelectric vibrating piece 14 is formed as a tuning fork type vibrating piece, a thickness sliding vibrating piece, or the like, but in this embodiment, an inverted mesa type thickness sliding vibrating piece formed thinner than the support frame 24 is used. . The piezoelectric vibrating piece 14 extends from two corners on the −X direction side in the support frame at both ends of one side in the longitudinal direction (± X direction), and is connected to the −X direction corner of the support frame 24. Connected to the first connecting portion 16 and the second connecting portion 18, the piezoelectric vibrating piece 14 is supported by the support frame 24 with one end in the longitudinal direction (one end in the −X direction) being cantilevered.

  Excitation electrodes (first excitation electrode 26 and second excitation electrode 30) are formed on both surfaces of the piezoelectric vibrating piece 14 by sputtering or the like, and the first excitation electrode 26 facing the lid 42 is similarly first sputtered by sputtering or the like. The extraction electrode 28 is connected, and the second extraction electrode 32 is also connected to the second excitation electrode 30 facing the base substrate 44 by sputtering or the like.

  The piezoelectric vibrating piece layer 12 is formed with a first lead portion 20 and a second lead portion 22. The first lead portion 20 is a corner on the −X direction side in the support frame 24 and is formed integrally with the first connecting portion 16. The second lead portion 22 is also a corner on the −X direction side in the support frame 24 and is formed integrally with the second connecting portion 18.

  In the present invention, the bonding of the base substrate 44, the piezoelectric vibrating reed layer 12, and the lid 42 and the electrodes are performed by temporarily melting and liquefying the metal brazing material or the insert metal disposed between the metallizations to be bonded. A so-called liquid phase diffusion bonding method (hereinafter referred to as TLP (Transient Liquid Phase) bonding) is employed.

  The first lead electrode 28 connected to the first excitation electrode 26 is routed to the base substrate 44 side via the side surface in the first connecting portion 16, and on the side facing the base substrate 44 of the first lead portion 20. Pulled out. Further, the second extraction electrode 32 connected to the second excitation electrode 30 is extracted to the second connecting portion 18 on the same surface as the second excitation electrode 30 (surface facing the base substrate 44).

  One end of each of the first lead portion 20 and the second lead portion 22 is joined to the first surface 44a of the base substrate 44 by a brazing material 36 that is a conductive first metal layer formed of eutectic metal. Yes. Further, the peripheral edge of the base substrate 44 and the support frame 24 are joined by the second wax material 38, and the peripheral edges of the support frame 24 and the lid 42 are also joined by the second wax material 38. The brazing material 36 and the second brazing material 38 are patterned on the lid 42 and the base substrate 44 by sputtering or the like. On the other hand, metallization 40 is applied to both surfaces of the support frame 24 in contact with the second brazing material 38 to facilitate the joining with the second brazing material 38, and the metallization 40 is simultaneously formed with the excitation electrode and the extraction electrode. It can be carried out. Here, as shown in FIG. 1B, second metal layers 21 a and 21 b are formed on the support frame 24 on the surface side facing the lid of the piezoelectric vibrating reed layer 12. The second metal layer 21a, 21b is a region obtained by projecting the joint portion between the brazing material 36 serving as the first metal layer and the lead electrodes 28, 32 onto the lid-side main surface of the piezoelectric vibrating piece layer 12, or this region. It is formed to cover at least. In FIG. 1B, the second metal layer 21a is formed on the upper surface of the first lead portion 20 where the first lead electrode 28 is not in contact. On the other hand, the second metal layer 21 b is formed on the upper surface of the second lead portion 22.

  Then, after the base substrate 44, the piezoelectric vibrating reed layer 12, and the lid 42 are laminated, the joining with the brazing material 36 and the second brazing material 38 can be performed by heating and pressing. The wax material 36 and the second wax material 38 may be the same material or different materials.

  The base substrate 44 is a substrate that supports one main surface of the piezoelectric vibrating reed layer 12, and a brazing material 38 is applied on the metallized 40 at the periphery joined to the piezoelectric vibrating reed layer 12. A fourth metal layer is connected to the first surface 44a of the base substrate 44 from a position facing the end portions of the first and second lead electrodes 28 and 32 to first and second electrodes 50 and 52 described later. Third and fourth lead electrodes 51a and 51b are formed. In addition, the end portions of the third and fourth lead electrodes 51a and 51b that become the fourth metal layer and the portions that face the first and second lead electrodes 28 and 32 are waxes that become the first metal layer. A material 36 is formed. As a result, the fourth metal layer is extended from the first metal layer.

  In addition, holes (first hole 46, second hole 48) are formed in a tapered shape that gradually decreases the inner diameter from the second surface 44b opposite to the first surface 44a of the base substrate 44 toward the first surface 44a. . 1A and 2A, when the piezoelectric vibrating reed layer 12 and the base substrate 44 are laminated, the hole overlaps with one end of the first and second lead electrodes 28 and 32 in plan view. It is formed at a portion that does not become necessary, that is, an offset portion. The holes can be formed by a sandblast technique, a combination of a photolithographic technique and an etching technique, or the like. Electrodes (first electrode 50 and second electrode 52) are formed on the inner wall of the hole, the first electrode 50 is formed in the first hole 46, and the second electrode 52 is formed in the second hole 48. ing. Therefore, the side surface of the first electrode 50 and the end surface of the third extraction electrode 51a are connected, and the side surface of the second electrode 52 and the end surface of the fourth extraction electrode 51b are connected. A first external electrode 54 and a second external electrode 56 are formed on the second surface 44 b of the base substrate 44, the first external electrode 54 is connected to the first electrode 50, and the second external electrode 56 is the second electrode 52. Connected with.

  Therefore, the first excitation electrode 26 is connected to the first external electrode 54 via the first extraction electrode 28, the third extraction electrode 51a, and the first electrode 50, and the second excitation electrode 30 is connected to the second extraction electrode 32, The fourth lead electrode 51 b and the second electrode 52 are connected to the second external electrode 56. Therefore, by connecting a drive circuit (not shown) for driving the piezoelectric vibrating piece 14 to the first external electrode 54 and the second external electrode 56, the piezoelectric vibrating piece 14 can vibrate at a specific resonance frequency.

In addition, since the brazing material 36 has conductivity, it can be a medium for electrical connection between the extraction electrode and the first electrode 50 and the second electrode 52.
The lid 42 is a substrate that supports the other main surface of the piezoelectric vibrating piece layer 12, and a second brazing material 38 is applied on the metallized 40 at the periphery that is joined to the piezoelectric vibrating piece layer 12. Also, the lid 42 has a wax on the metallization 40 at a location at least covering the first lead portion 20 and the second lead portion 22 of the piezoelectric vibrating reed layer 12 in plan view, that is, a position facing the second metal layers 21a and 21b. Two third metal layers 39a and 39b in which the material 38 is laminated are formed.

  Since the base substrate 44, the piezoelectric vibrating reed layer 12, and the lid 42 are made of the same material (piezoelectric material such as quartz), the linear expansion coefficients are the same for each layer. Can be suppressed, and an error in the oscillation frequency of the piezoelectric vibrating piece 14 can be suppressed.

  In the TLP bonding, Sn or SnIn may be used as the insert metal as well as the Au—In bonding, and the bonding metal layer may be Cu. Further, the bonding metal layer may be directly formed of eutectic metal such as Au-20Sn (melting point: 280 degrees), Au-12Ge (melting point: 375 degrees), Au-6Si (melting point: 370 degrees).

4, 5, 6, and 7 show the manufacturing process of the piezoelectric vibrator 10 according to the first embodiment.
As shown in FIG. 4A, the support frame 24 (not shown) of the piezoelectric vibrating reed layer 12 (not shown) and the periphery of the surface of the lid 42 facing the piezoelectric vibrating piece layer 12 (not shown). A metallized layer 37 and a third metal layer 39 are formed at positions facing the two metal layers 21a and 21b (not shown) (FIG. 4B). Next, a second wax material 38 is formed on the metallized layer 37 and the third metal layer 39 formed (FIG. 4C).

  Next, as shown in FIG. 5A, a crystal substrate 58 for the piezoelectric vibrating reed layer 12 is prepared, and the support frame 24, the first connecting portion 16 (not shown), and the second connecting portion 18 ( (Not shown), half etching is performed to the thickness of the piezoelectric vibrating piece 14 while leaving the outer shapes of the first lead portion 20 and the second lead portion 22 (not shown) (FIG. 5B), the support frame 24, the first connection Etching until part 16 (not shown), second connecting part 18 (not shown), first lead part 20, second lead part 22 (not shown), and piezoelectric vibrating piece 14 pass through crystal substrate 58, leaving the outer shape of piezoelectric vibrating piece 14. As a result, the outer shape of the piezoelectric vibrating reed layer 12 is formed (FIG. 5C), and the first excitation electrode 26, the second excitation electrode 30, the first extraction electrode 28, A second lead electrode 32 (not shown) and a second metal layer 21 are formed; Forming a metallization 40 on both sides of the support frame 24 as (FIG 5 (d)).

  Then, as shown in FIG. 6A, the first hole 46 and the second hole 48 are formed in the base substrate 44 by using a sandblast technique, a photolithography technique and an etching technique or the like (FIG. 6B). At this time, the first hole 46 and the second hole 48 are formed at locations where the piezoelectric vibrating reed layer 12 and the base substrate 44 do not overlap with one end of the first and second lead electrodes 28 and 32 when viewed in plan. is doing.

  Next, external electrodes 54 and 56 and first and second electrodes 50 and 52 are formed on the second surface 44b of the base substrate 44 by sputtering or the like using a metal such as Cr or Au (FIG. 6C). Then, metallization is performed on the first surface 44a of the base substrate 44 by using a metal such as Cr or Au by sputtering or the like to the third and fourth extraction electrodes 51a and 51b and the support frame 24 which are to be the fourth metal layer. It forms (FIG.6 (d)).

  Further, on the first surface 44 a, which is the surface facing the piezoelectric vibrating reed layer 12 of the base substrate 44, the third and fourth extraction electrodes 51 a and 51 b that are positions corresponding to the first extraction electrode 28 and the second extraction electrode 32. A brazing material 36 serving as a first metal layer is formed at the end portion by a sputter or the like, and a second brazing material 38 is provided at a position on the periphery of the first surface 44 a and facing the support frame 24 of the piezoelectric vibrating reed layer 12. It forms (FIG.6 (e)). Here, when the brazing material 36 and the second brazing material 38 are made of the same material, they can be formed at the same time, and it becomes easy to form the same thickness of the brazing material.

  Next, the joining of the piezoelectric vibrating reed layer 12, the base substrate 44, and the lid 42 will be described. As shown in FIG. 7A, first, a drive circuit (not shown) is connected to the first extraction electrode 28 and the second extraction electrode 32 (not shown) to drive the piezoelectric vibrating piece 14, and the first excitation electrode 26. A part of the film is thickened by vapor deposition or thinned by dry etching using argon plasma irradiation to adjust the frequency.

  Then, as shown in FIG. 7B, the base substrate 44, the piezoelectric vibrating reed layer 12, and the lid 42 are laminated. At this time, in the base substrate 44 and the piezoelectric vibrating reed layer 12, the wax material 36 and the first extraction electrode 28, the wax material 36 and the second extraction electrode 32 (not shown), and the second wax material formed on the base substrate 44. 38 and metallized 40 are brought into contact with each other. Further, the metallized 40 and the second brazing material 38 are brought into contact with each other in the piezoelectric vibrating reed layer 12 and the lid 42. Then, the brazing material 36 and each lead-out electrode are joined by pressurizing and heating the piezoelectric vibrator 10 in the ± Z direction in such a laminated state, and the second brazing material 38 and the metallized 40 are joined. At this time, the brazing material 36 and the first extraction electrode 28, and the brazing material 36 and the second extraction electrode 32 are both the third and fourth extraction electrodes 51 a and 51 b and the base substrate that form the fourth metal layer from the base substrate 44 side. 44 and the second metal layer 21a, 21b, the third metal layer 39a, 39b, and the lid 42 from the lid 42 side, there is no gap between the substrates, and the through hole 46 , 48 is eccentric (offset), so that uniform pressure can be applied during pressure melting.

  Next, as shown in FIG. 7C, a solder ball 49 is inserted into the first hole 46 and the second hole 48, and the solder ball 49 is melted by irradiating the solder ball 49 with a laser or the like to seal the hole. As a result, the piezoelectric vibrator 10 is formed (FIG. 7D).

  According to the piezoelectric vibrator having the above configuration, there is no gap between the lid and the piezoelectric vibrating piece layer, and the through hole can be formed eccentrically (offset) with the first metal layer. Therefore, in the connection between the first metal layer formed on the first surface of the base substrate and the extraction electrode, the pressure is evenly transmitted and reliably bonded when melted under pressure and eutectic bonding is performed.

  FIG. 8, FIG. 9, and FIG. 10 are force detection elements that are electronic components according to the second embodiment. 8A is a side sectional view of the force detection element as viewed from the side, FIG. 8B is a bottom view of the pressure-sensitive element piece constituting the force detection element, and FIG. 9 is an exploded perspective view as viewed from the base substrate side. FIG. 10 is an exploded perspective view as seen from the diaphragm side.

  For example, a piezoelectric vibrator mounted on a diaphragm having a flexible portion that bends by receiving a force directly, for example, by receiving a pressure to be measured via a support portion, has an electrode pattern on a plate-like piezoelectric substrate, for example. Formed, the detection axis is set in the direction of detecting the force, and when the pressure to be measured is received by the pressure receiving portion of the diaphragm from the direction orthogonal to the direction of the detection axis, the flexible portion bends, and via the support portion When a force is applied to the piezoelectric vibrator, a tensile stress is generated in the direction of the detection axis, so that the resonance frequency of the piezoelectric vibrator changes, and the pressure value of the pressure to be measured is determined from the change in the resonance frequency. To detect. It has a pressure sensor, a diaphragm as a pressure receiving means, and a pressure sensitive element (double tuning fork vibrator) mounted on a support portion formed on the diaphragm, and the pressure receiving surface of the diaphragm faces the outer surface while accommodating these in a container. Thus, the structure is vacuum-sealed.

  The force detection element 700 includes an excitation electrode 701 formed on two columnar beams of a double tuning fork vibrator 705 as a pressure sensitive element, and an extraction electrode (first extraction electrode 702, second extraction electrode) connected to the excitation electrode 701. A double tuning fork vibrator 705 mounted on a support portion 706 formed on a main surface 704b on the inner side opposite to the pressure receiving surface 704a of the diaphragm 704 with a pressure sensitive element piece layer 772 having an electrode 703); The double tuning fork vibrator 705 includes a metallization 750 that connects the first and second lead electrodes 702 and 703 and the first surface 742 a of the base substrate 742, and includes the base substrate 742 and the pressure-sensitive element single layer 772. The diaphragm 704 has a three-layer structure having an internal space. The metallization 750 on the surface side of the pressure-sensitive element piece layer 772 on which the excitation electrode 701 is formed is formed at a predetermined interval so as not to contact the first and second extraction electrodes 702 and 703.

  The diaphragm 704 has a flexible portion 704c and a thick portion 704d surrounding the outer edge of the flexible portion 704c. A metallized 750 is formed on the supporting part 706 and the thick part 704d by sputtering or the like using a metal such as Cr or Au, and a wax material 751 is formed on the formed metallized 750.

  A pressure-sensitive element piece layer 772 serving as an electronic element piece includes a double tuning fork vibrator 705 including a vibrating portion 705a made of two columnar beams and base portions 705b positioned at both ends of the vibrating portion 705a, and the double tuning fork. It has a rectangular support frame portion 773 surrounding the vibrator 705, and a beam 707 connecting the support frame portion 773 and the base portion 705b. In FIG. 8, the excitation electrode 701 is depicted as being formed only on the base substrate 742 side, but it is assumed that it is actually formed on both sides.

The base substrate 742 is a substrate that supports the other main surface of the pressure-sensitive element piece layer 772, and a brazing material 751 is applied on the metallized 750 at the periphery joined to the pressure-sensitive element piece layer 772.
A fourth metal is connected to the first surface 742a of the base substrate 742 from a position facing the ends of the first and second lead electrodes 702 and 703 to first and second through electrodes 760 and 762 described later. Third and fourth lead electrodes 51a and 51b are formed as layers. In addition, the end portions of the third and fourth lead electrodes 51a and 51b that become the fourth metal layer and the portions that face the first and second lead electrodes 702 and 703 are waxes that become the first metal layer. A material 752 is formed.

In the base substrate 742, holes (first hole 46 and second hole 48) are formed in a tapered shape that gradually decreases the inner diameter from the second surface 742b toward the first surface 742a. Electrodes (first through electrode 760 and second through electrode 762) are formed on the inner wall of the hole, the first through electrode 760 is formed in the first hole 46, and the second through electrode 762 is formed in the second hole 48. Is formed. Therefore, the side surface of the first through electrode 760 and the end surface of the third lead electrode 51a are connected, and the side surface of the second through electrode 762 and the end surface of the fourth lead electrode 51b are connected. A first external electrode 54 and a second external electrode 56 are formed on the second surface 742b of the base substrate 742. The first external electrode 54 is connected to the first through electrode 760, and the second external electrode 56 is connected to the second through electrode. The electrode 762 is connected.
The thick portion 704b of the diaphragm 704 and the outer edge portion of the base substrate 742 are joined to both surfaces of the support frame portion 773 of the pressure-sensitive element piece layer 772, respectively.

  According to the force detection element having the above-described configuration, there is no gap between the base substrate and the electronic element piece, and the through hole can be formed eccentrically (offset) with the first metal layer. Therefore, in the connection between the first metal layer formed on the first surface of the base substrate and the extraction electrode, the pressure is evenly transmitted and reliably connected when the eutectic bonding is performed by melting under pressure.

  As described above, the embodiment has been described on the premise of the piezoelectric vibrator and the force detection element. However, the present invention is not limited to this, and in an electronic component having a laminated structure, an electronic element piece constituting an electronic component and having an electrode Even in the case of stacking on a substrate constituting an electronic component, electrical connection can be realized with high reliability.

DESCRIPTION OF SYMBOLS 10 ......... Piezoelectric vibrator, 12 ......... Piezoelectric vibrating piece layer, 14 ......... Piezoelectric vibrating piece, 16 ......... First connecting portion, 18 ......... Second connecting portion, 20 ......... First drawer , 21 ......... second metal layer, 22 ......... second extraction part, 24 ......... support frame, 26 ......... first excitation electrode, 28 ......... first extraction electrode, 30 ......... Second excitation electrode, 32 ......... second extraction electrode, 34 ......... extension part, 36 ......... wax material, 37 ......... metallized, 38 ......... second wax material, 39 ......... third Metal layer, 40 ......... Metalized, 42 ......... Lid, 44 ......... Base substrate, 45 ......... Substrate, 46 ......... First hole, 48 ......... Second hole, 49 ......... Solder Ball, 50 ......... First electrode, 52 ......... Second electrode, 54 ......... First external electrode, 56 ......... Second external electrode, 58 ......... Quartz substrate, 110 ... ... Frame part, 111 ......... Vibration part, 114 ......... Connecting part, 112 ...... Extraction electrode, 116 ......... Frequency adjustment terminal, 118 ...... Side electrode, 120 ...... Excitation electrode, 122 ... ... Excitation electrode, 200 ......... Piezoelectric vibrator, 201 ......... Cover, 202 ...... Substrate, 203 ......... Piezoelectric substrate, 203A ......... Frame part, 203B ......... Vibration part, 203C ......... Drawer Electrode 204... Through hole 205 205 External electrode 700 Force detecting element 701 Excitation electrode 702 First extraction electrode 703 Second extraction electrode 704 ......... Diaphragm, 705 ......... Double tuning fork vibrator, 706 ......... Supporting part, 707 ......... Beam, 742 ......... Base substrate, 750 ......... Metalized, 751 ......... Wax material, 752 ... ... wax material, 772 ... ... pressure sensitive element Layer, 773 ......... support frame portion.

Claims (3)

A piezoelectric vibrator laminated in the order of a base substrate, a piezoelectric vibrating piece layer, and a lid,
The piezoelectric vibrating reed layer is
A piezoelectric vibrating piece having an excitation electrode;
A support frame for supporting the piezoelectric vibrating piece;
A lead portion connecting the piezoelectric vibrating piece and the support frame;
An extraction electrode connected to the excitation electrode, extracted to a surface of the extraction portion facing the base substrate, and connected to a first metal layer formed on the first surface of the base substrate;
A second metal layer formed in a region in which a joint portion between the first metal layer and the lead electrode is projected onto the lid-side main surface of the piezoelectric vibrating piece layer;
Have
The lid has a third metal layer on a main surface facing the second metal layer,
The base substrate is
A piezoelectric vibrator having an electrode formed in a through hole connected to an external electrode, wherein the electrode is connected to a fourth metal layer extending from the first metal layer.   2. The piezoelectric vibrator according to claim 1, wherein the electrode is formed at a position that does not overlap the first metal layer in plan view of the piezoelectric vibrating reed layer. An electronic component formed by mounting an electronic element piece having an electrode between the first and second substrates,
The electronic element piece is
An electronic device having an electrode;
A support frame for supporting the electronic element;
An extraction electrode connected to the electrode, drawn out to a surface of the support frame facing the first substrate, and connected to a first metal layer formed on the first surface of the first substrate;
A second metal layer formed in a region in which a junction between the first metal layer and the lead electrode is projected onto the second substrate side main surface of the electronic element piece;
Have
The second substrate has a third metal layer on a main surface facing the second metal layer,
The first substrate is
An electronic component comprising a through electrode formed in a through hole connected to an external electrode, wherein the through electrode is connected to a fourth metal layer extending from the first metal layer.