JP2010258667A - Electronic component and manufacturing method thereof, and piezoelectric vibrator and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component which reliably connects a lead-out electrode to an electrode, and to provide a piezoelectric vibrator and methods for manufacturing them. <P>SOLUTION: There is provided a method for manufacturing the piezoelectric vibrator 10 formed by mounting a piezoelectric vibration piece 14 having an exciting electrode (first exciting electrode 26 and second exciting electrode 30) and a lead-out electrode (first lead-out electrode 28 and second lead-out electrode 32) on a base substrate 44. The method includes: bonding the lead-out electrode and a first face 44a of the base substrate 44 by wax material 36; digging the base substrate 44 and the wax material 36 from a second face 44b opposite to the first face 44a of the base substrate 44 toward the first face 44a; forming a hole (first hole 46 and second hole 48); and forming an electrode (first electrode 50 and second electrode 52) on inner walls 46a and 48a of the hole. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention improves the reliability of electrical connection of electrodes between other layers for electronic components having a laminated structure such as a piezoelectric vibrator and a force detection element, thereby improving yield and enabling cost reduction. The present invention relates to an electronic component and a manufacturing method.

  As mobile communication devices and mobile phones represented in recent years have become smaller, lighter and higher in frequency for personal mobile phones, piezoelectric vibrators and filters used in them have been required to be further reduced in size and frequency. ing. In order to meet this demand, conventional piezoelectric parts have been rapidly demanded to be applied to smaller and thinner packages. On the other hand, piezoelectric elements such as crystal resonators, crystal filters, and SAW filters may be damaged by changes in ambient temperature and humidity, or by fine foreign substances, and may be damaged by mechanical vibration or impact. Cheap. For this reason, the above-mentioned element is sealed for use in a package.

  In the conventional package, a package is formed for each element. On the other hand, after a plurality of elements are cut out at the same time, the package is sealed and then cut into individual elements (chips). There is also proposed a technology for making a packaged chip.

  As a first prior art, as shown in FIG. 15, Patent Document 1 discloses a three-layer package in which both sides of a crystal unit with a frame are sealed by directly bonding glass lids. Connecting and connecting the second electrode through the connecting portion 106 of the piezoelectric vibrator 102, forming the extracting electrode through the connecting portion 106 of the piezoelectric vibrator 102 and connecting the second electrode; A lid body with a notch is prepared at a location where it abuts against the lid body, a rectangular piezoelectric vibrating piece in which a frame portion 101 and a piezoelectric vibrator 102 disposed inside thereof are integrally formed, and a lead electrode of the piezoelectric vibrating piece A step of directly joining the first lid body 104 and the second lid body 105 having a notch at a position facing the lid body, and a notch portion of the lid body after the direct joining step is finished. For vapor deposition or wax material through the through hole in the lid A step of Rifutome method consisting is disclosed.

  Further, the technical idea of conducting electrical connection between the extraction electrode extracted from the excitation electrode and the external electrode by the through electrode penetrating the substrate and the manufacturing method for realizing the same are also proposed in the following patent documents. Has been.

  As a second conventional technique, as shown in FIG. 16A, in Patent Document 2, a piezoelectric substrate 203 made of crystal in which a frame portion 203A and a vibrating portion 203B are integrally formed is used as a lid made of glass. A piezoelectric vibrator 200 configured by being sandwiched between 201 and a substrate 202 is disclosed, and a through hole 204 is formed in the substrate 202. As disclosed in Patent Document 3 (FIG. 16B), the through hole 204 abuts on the extraction electrode 203C of the intermediate layer connected to the excitation electrode formed in the vibration part 203B, and the lid 201 The outer electrode 205 is formed with a taper so that the diameter of the opening increases, and the outer electrode 205 made of two layers of Cr and Au is formed on the surface by sputtering (the tapered portion is a through electrode). Is formed.

  As a third prior art, FIG. 17 shows a manufacturing process of the piezoelectric vibrator disclosed in Patent Document 4, and FIG. 18 shows a first crystal substrate constituting the piezoelectric vibrator disclosed in Patent Document 4. 18A is a plan view, and FIG. 18B is a cross-sectional view taken along line AA in FIG. 18A. As shown in FIG. 17, in Patent Document 4, the first crystal substrate 301a on which the piezoelectric vibrating piece 302 is formed by direct bonding using a siloxane bond is stacked in a manner sandwiched between the second crystal substrate 301b and the third crystal substrate 301c. In the three-layer All Quartz Package (FIGS. 17A and 17B), the electrode through-hole is first formed on the first crystal plate 301a using wet etching using hydrofluoric acid or a known dry etching technique. A through hole 306m is formed (FIG. 17C), and the first through hole 306m is filled with a conductive paste made of chromium and sintered to form a first through electrode 306a by a via hole (FIG. 17D). The first through electrode 306a is connected to the electrode pads 304 (xy) on both ends of one main surface of the first crystal substrate 301a, and the first crystal substrate It is disclosed that an electrode pad 307 (xy) near the outer periphery is formed by vapor deposition or the like (FIG. 17E) by connecting to the first through electrode 306a exposed on the other main surface of the plate 301a.

  Patent Documents 5 and 6 disclose that in a three-layer All Quartz Package stacked by direct bonding, a hermetically sealed recess is formed from a quartz substrate using sandblasting and etching. The etching process is performed to remove stress on the surface of the recess formed by sandblasting and to remove the work-affected layer, and only the surface of the recess is light-etched. The problem of creating an etch tunnel does not occur.

  As a fourth conventional technique, as shown in FIG. 19A, a lid 412, an insulating substrate 413 made of non-alkali glass, and a piezoelectric vibrating piece 411 fixed on the insulating substrate 413 with a conductive adhesive 418. In the piezoelectric vibrator 401 having a through hole, a through hole 414 having a taper is formed so that the diameter is gradually reduced by using sandblasting (FIGS. 19A and 19B) with respect to the insulating substrate 413 (FIG. 19). (C)) A chromium thin film (thickness: 0.1 μm) is formed on the surface (inner wall) of the through hole 414 by sputtering, and a palladium thin film (thickness: 0.05 μm) is formed on the chromium thin film by sputtering. ), A gold thin film (thickness: 0.5 to 1.0 μm) is formed on the palladium thin film by an electroplating method. A conductive film 430 made of a thin film of gold and a thin gold film is formed (FIG. 19D), and a connection electrode 415a, a through electrode 415b, and an external electrode 415c connected to the conductive adhesive 418 are formed by etching (FIG. 19E). )), A configuration in which the through hole 414 is sealed with a metal member 417 has been proposed (FIG. 19F).

JP 2006-211411 A JP 2007-96777 A Japanese Patent No. 3390348 JP 2008-182665 A Japanese Patent No. 3550822 JP-A-9-102721 JP 2006-295246 A

  In the above-described piezoelectric vibrator except for Patent Document 4, each layer is formed before stacking. Therefore, when stacked, a gap is formed between the lead electrode and the through electrode, and the lead electrode and the through electrode are in point contact. Therefore, it has been difficult to reliably conduct electricity.

  On the other hand, as shown in FIG. 17, in the method of Patent Document 4, the first crystal substrate 301a and the third crystal substrate 301c are directly bonded to each other, and then the first through hole 306m is formed by etching. A method has been proposed in which a conductive paste is filled in a through hole as a through electrode to ensure conduction between the lead electrode and the through electrode. However, as shown in FIG. 18, a piezoelectric vibrating piece 302 is formed on the first quartz substrate 301a, and a frame portion is formed on the outer periphery of the piezoelectric vibrating piece 302 with a gap therebetween. 302a and the tuning fork arm 302b made of two vibration beams extending from the base 302a, there is a gap between the slit of the tuning fork arm 302b or between the piezoelectric vibrating piece 302 and the frame. Therefore, unless these slits and gaps are filled, there is a problem that the third crystal substrate 301c side of the first crystal substrate 301a and the inside of the third crystal substrate 301c are etched, and a method for avoiding the problem is disclosed. Not. Further, when an excitation electrode, a side electrode, or the like is formed on the tuning fork arm 302b of the piezoelectric vibrating piece 302 of the first crystal substrate 301a, the excitation electrode facing the third crystal substrate 301c is masked in preparation for etching. In addition, the excitation electrode on the opposite side can be masked in preparation for etching, but a process of applying a mask and a process of removing the mask are required, leading to an increase in cost. Even if the gap between the first crystal substrate 301a is filled, the electrode pad 304x (304y) is in contact with the first crystal substrate 301a in the direct bonding between the first crystal substrate 301a and the third crystal substrate 301c. Since bonding by a siloxane bond is not possible, there is a problem that an etching solution leaks from between the electrode pad 304x (304y) and the first quartz substrate 301a when forming the first through hole 306m.

  Furthermore, when trying to form a through hole by dry etching, there is a problem that a long time is required for etching. In addition, it is well known that an artificial quartz generally used for a quartz part generates a linear lattice defect in a part of the crystal during its growth. This linear lattice defect has a problem of forming a tunnel-like hole or a through-hole called an etch channel when the quartz substrate is wet-etched. Furthermore, since the crystal etch channel progresses at an etching rate approximately twice that of normal etching, an increase in the amount of wet etching makes it easier to form an etch channel, and a desired degree of vacuum inside the pressure sensor 1 is increased. It may be difficult to implement or maintain. Therefore, in order to avoid these problems caused by etching, it has been proposed to form the above-mentioned through holes by sandblasting as shown in Patent Document 7.

  However, in any patent document, when a through hole (through hole) is formed using sandblasting, chipping due to the substrate material occurs on the side of the through hole facing the extraction electrode of the substrate. Since the base metal layer of the through electrode to be formed cannot be stably formed in the chipping portion, there is a risk of disconnection due to the formation of a gap (gap) between the through electrode and the extraction electrode. There is a problem that the external electrode and the extraction electrode connected to each other cannot be reliably connected, resulting in a decrease in yield. Furthermore, in order to reliably form a through electrode on a surface with unevenness by chipping, the thickness of the through electrode is increased, resulting in a problem of poor productivity and an increase in cost.

  Accordingly, the present invention pays attention to the above-mentioned problem, and in the piezoelectric vibrator having a configuration in which the lead electrode drawn from the excitation electrode formed on the piezoelectric vibrating piece and the external electrode are electrically connected by the through electrode penetrating the substrate, It is an object of the present invention to provide an electronic component, a piezoelectric vibrator, and a method for manufacturing the same, which can reliably conduct electricity between an electrode and a lead electrode to improve yield and reduce costs.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
Application Example 1 A method of manufacturing an electronic component formed by mounting an electronic element piece having an electrode on a substrate, wherein the electrode and the first surface of the substrate are joined by a wax material, and the substrate The substrate and the wax material are dug from the second surface opposite to the first surface toward the first surface to form a hole, and an electrode is formed on the inner wall of the hole. Manufacturing method for electronic parts.

  By the above method, since the through hole is formed in the region joined by the wax material on the second surface side of the substrate, the electrode formed in the hole is surely electrically connected to the extraction electrode. Therefore, the yield of electronic components can be increased.

  Application Example 2 An electronic component formed by mounting an electronic element piece having an electrode on a substrate, the electronic component including a brazing material that connects the electrode and the first surface of the substrate; A hole formed by digging the substrate and the wax material from a second surface opposite to the first surface of the substrate toward the first surface; and an electrode formed on an inner wall of the hole; The electronic component characterized by having.

  With the above configuration, since the hole is formed in the region joined by the wax material on the second surface side of the substrate, the through electrode formed in the hole is surely electrically connected to the extraction electrode. Therefore, an electronic component with improved yield is obtained.

  Application Example 3 A method for manufacturing a piezoelectric vibrator formed by mounting a piezoelectric vibrating piece having an excitation electrode and an extraction electrode connected to the excitation electrode on a substrate, the extraction electrode and the substrate The first surface of the substrate is joined with a wax material, and the substrate and the wax material are dug from the second surface opposite to the first surface of the substrate toward the first surface to form a hole. A method of manufacturing a piezoelectric vibrator, comprising forming an electrode on the inner wall of the hole.

  Since the hole is formed in the region joined by the wax material on the second surface side of the substrate by the above method, the electrode formed in the hole is surely electrically connected to the extraction electrode. Therefore, the yield of the piezoelectric vibrator can be increased.

  Application Example 4 A piezoelectric vibrator formed by mounting a piezoelectric vibrating piece having an excitation electrode and an extraction electrode connected to the excitation electrode on a substrate, the piezoelectric oscillator being the extraction electrode And a brazing material that connects the first surface of the substrate, and the substrate and the brazing material are dug in the direction of the first surface from the second surface opposite to the first surface of the substrate. A piezoelectric vibrator having a formed hole and an electrode formed on an inner wall of the hole.

  With the above configuration, since the hole is formed in the region joined by the wax material on the second surface side of the substrate, the electrode formed in the hole is surely electrically connected to the extraction electrode. Therefore, a piezoelectric vibrator having a high yield is obtained.

  [Application Example 5] The piezoelectric vibrator according to Application Example 4, wherein the hole is formed in a taper shape with a gradually decreasing inner diameter from the second surface toward the first surface by sandblasting.

  With the above configuration, the first surface and the wax material are joined, and a hole is formed in the joined region. Therefore, chipping does not occur in the region, and sandblasting proceeds to the wax material as it is. Therefore, a piezoelectric vibrator is obtained in which the yield is increased by avoiding the occurrence of disconnection due to chipping in the electrode formed in the hole. Further, since no chipping occurs, it is not necessary to use a large amount of metal material as an electrode to compensate for this, so that the piezoelectric vibrator can be reduced in cost. Furthermore, since the holes are formed in a tapered shape, the electrodes can be formed uniformly, so that variation in electrical characteristics among products can be suppressed.

[Application Example 6] The piezoelectric vibrator according to Application Example 5, wherein the hole is formed by sandblasting, and then the inner wall is etched.
Accordingly, the residual stress on the inner wall of the hole is reduced to prevent an adverse effect on the piezoelectric vibrator, and the electrode can be easily formed by smoothing the inner wall of the hole.

Application Example 7 In any one of Application Examples 4 to 6, wherein a convex portion is formed in a region where the wax material of the second surface is joined, and the hole penetrates the convex portion. The piezoelectric vibrator as described.
This increases the contact area of the brazing material with the substrate and stabilizes the joining, and saves the brazing material as much as the convex portions are formed, thereby reducing the cost.

Application Example 8 The piezoelectric vibrator according to any one of Application Examples 4 to 7, wherein the hole is formed by digging the extraction electrode together with the substrate and the wax material.
As a result, since the electrode and the extraction electrode are directly joined, it is not necessary to use a conductive wax material, and the cost can be reduced.

  Application Example 9 A piezoelectric vibrator in which a substrate, a piezoelectric vibrating piece layer, and a lid are stacked in this order, and the piezoelectric vibrating piece layer includes a piezoelectric vibrating piece having an excitation electrode and a support frame that supports the piezoelectric vibrating piece. A lead portion connected to the piezoelectric vibrating piece; a lead electrode connected to the excitation electrode and led to a surface of the lead portion facing the substrate; and a lead electrode joined to the first surface of the substrate by a wax material; The piezoelectric vibrator is formed by digging the substrate and the wax material by sandblasting from the second surface opposite to the first surface of the substrate toward the first surface. A piezoelectric vibrator having a hole and an electrode formed on an inner wall of the hole and having a fixing portion that fixes the lead portion to the lid.

  With the above configuration, the piezoelectric vibrator has a three-layer structure having an internal space. However, in order to form a hole in the region joined by the wax material on the second surface side of the substrate, sandblasting grinding particles are formed in the internal space. Never get in. Sand blasting is performed from the second surface side to the first surface side of the substrate. At that time, the lead portion is subjected to stress on the lid side by sand blasting, but by fixing the lead portion to the lid by the fixing portion, , Prevents damage to the drawer due to the impact of sandblasting, prevents the impact of sandblasting from concentrating on the boundary between the drawer and the wax material, prevents peeling of the drawer and wax material, and forms a hole. It can be done easily.

  [Application Example 10] The piezoelectric vibrator according to Application Example 9, wherein the fixing portion is a wax material. Thus, the cost can be reduced without increasing the number of materials by using the same material as the wax material in which the holes are formed.

  Application Example 11 The piezoelectric vibrator according to Application Example 9, wherein the fixing portion is a bump. Since the bump can firmly bond the lid and the lead portion, the vibration of the lead portion due to sand blasting can be suppressed and sand blasting can be performed effectively.

  [Application Example 12] The piezoelectric vibrator according to Application Example 9, wherein the fixing portion is a second convex portion formed in the drawer portion. As a result, the relative position between the lead portion and the lid is determined to be rigid, so that it is possible to effectively perform sandblasting by suppressing the vibration of the lead portion due to sandblasting, and to use the material that forms the piezoelectric vibrating piece layer. Since two convex portions are formed, the cost can be reduced.

It is a schematic diagram of the piezoelectric vibrator according to the first embodiment. It is a schematic diagram of the piezoelectric vibrator according to the first embodiment. 1 is an exploded perspective view of a piezoelectric vibrator according to a first embodiment. It is a figure which shows the manufacturing process of the piezoelectric vibrator which concerns on 1st Embodiment. It is a figure which shows the manufacturing process of the piezoelectric vibrator which concerns on 1st Embodiment. It is a figure which shows the manufacturing process of the piezoelectric vibrator which concerns on 1st Embodiment. It is a schematic diagram of the modification of the piezoelectric vibrator which concerns on 1st Embodiment. It is a schematic diagram of a piezoelectric vibrator according to a second embodiment. It is a schematic diagram of the 1st modification of the piezoelectric vibrator which concerns on 2nd Embodiment. It is a schematic diagram of the 2nd modification of the piezoelectric vibrator which concerns on 2nd Embodiment. It is a schematic diagram of the modification of the piezoelectric vibrating piece layer which comprises a piezoelectric vibrator. It is a schematic diagram of the force detection element which concerns on 3rd Embodiment. It is the disassembled perspective view seen from the board | substrate side of the force detection element which concerns on 3rd Embodiment. It is the disassembled perspective view seen from the diaphragm side of the force detection element which concerns on 3rd Embodiment. It is a schematic diagram of the piezoelectric vibrator according to the first prior art. It is a schematic diagram of the piezoelectric vibrator which concerns on a 2nd prior art. It is a schematic diagram of the piezoelectric vibrator according to the third prior art. It is a schematic diagram of the 1st crystal substrate which comprises the piezoelectric vibrator concerning a 3rd prior art. It is a schematic diagram of the piezoelectric vibrator which concerns on a 4th prior art.

  Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. However, the components, types, combinations, shapes, relative arrangements, and the like described in this embodiment are merely illustrative examples and not intended to limit the scope of the present invention only unless otherwise specified. .

  FIG. 1 shows a piezoelectric vibrator as a first embodiment of an electronic component according to the present invention. FIG. 1A is a side sectional view of the piezoelectric vibrator viewed from the side, and FIG. FIG. 1C is a bottom view of the piezoelectric vibrating piece, FIG. 2A is a plan view of the substrate constituting the piezoelectric vibrator, and FIG. 2B is a bottom view of the substrate. FIG. 2 and FIG. 2C show a plan view of the lid constituting the piezoelectric vibrator. FIG. 3A shows an exploded perspective view seen from the lid side, and FIG. 3B shows an exploded perspective view seen from the base substrate side.

  The method for manufacturing a piezoelectric vibrator according to the present embodiment includes an excitation electrode (first excitation electrode 26, second excitation electrode 30) and an extraction electrode (first extraction electrode 28, second extraction electrode 32) connected to the excitation electrode. ) Is formed on the main surface of the base substrate 44, and is a main surface of the lead electrode and the base substrate 44. The first surface 44a is joined by a metal brazing material 36, and is directed from the second surface 44b, which is the other main surface opposite to the first surface 44a, of the base substrate 44 toward the first surface 44a. The base substrate 44 and the wax material 36 are dug to form holes (first hole 46, second hole 48), and electrodes (first electrode 50, second electrode 52) are formed on the inner wall surfaces 46a, 48a of the holes. ).

  Therefore, the piezoelectric vibrator 10 according to the first embodiment which embodies this is provided with an excitation electrode (first excitation electrode 26, second excitation electrode 30) and an extraction electrode (first extraction electrode 28, which is connected to the excitation electrode). The piezoelectric vibrator 10 is formed by mounting the piezoelectric vibrating piece 14 having the second lead electrode 32) on the main surface of the base substrate 44, and the piezoelectric vibrator 10 includes the lead electrode and the base. The metal brazing material 36 that connects the first surface 44a of the substrate 44 and the second surface 44b that is the other main surface opposite to the first surface 44a of the base substrate 44 to the first surface 44a. A hole (first hole 46, second hole 48) formed by digging the base substrate 44 and the brazing material 36 toward the direction, and electrodes (first holes) formed on the inner wall surfaces 46a, 48a of the holes. Electrode 50 and second electrode 52) A shall, base substrate 44, the piezoelectric vibrating piece layer 12 has a three-layer structure having an internal space 10a by lid 42. In the following description including the drawings, an orthogonal coordinate system (X axis, Y axis, Z axis) is used.

  The piezoelectric vibrating reed layer 12 is formed of a piezoelectric substrate such as quartz, and includes the piezoelectric vibrating reed 14, a connecting portion (first connecting portion 16, second connecting portion 18), and a leading portion (first leading portion 20, second leading portion). 22) and is formed by the support frame 24, and the outer shape of the piezoelectric vibrating reed layer 12 can be formed by using both a photolithographic technique and an etching technique.

  The piezoelectric vibrating piece 14 is formed as a tuning fork type vibrating piece, a thickness sliding vibrating piece, or the like, but in this embodiment, an inverted mesa type thickness sliding vibrating piece formed thinner than the support frame 24 is used. . The piezoelectric vibrating piece 14 extends from two corners on the −X direction side in the support frame at both ends of one side in the longitudinal direction (± X direction), and is connected to the −X direction corner of the support frame 24. Connected to the first connecting portion 16 and the second connecting portion 18, the piezoelectric vibrating piece 14 is supported by the support frame 24 with one end in the longitudinal direction (one end in the −X direction) being cantilevered.

  Excitation electrodes (first excitation electrode 26 and second excitation electrode 30) are formed on both surfaces of the piezoelectric vibrating piece 14 by sputtering or the like, and the first excitation electrode 26 facing the lid 42 is similarly first sputtered by sputtering or the like. The extraction electrode 28 is connected, and the second extraction electrode 32 is also connected to the second excitation electrode 30 facing the base substrate 44 by sputtering or the like.

  The piezoelectric vibrating piece layer 12 is formed with a first lead portion 20 and a second lead portion 22. The first lead portion 20 is a corner on the −X direction side in the support frame 24 and is formed integrally with the first connecting portion 16. The second lead portion 22 is formed at a corner on the + X direction side in the support frame 24, and the first lead portion 20 and the second lead portion 22 are formed on a diagonal line of the support frame 24. The second lead portion 22 and the second connecting portion 18 are connected by an extending portion 34 connected to the support frame 24. Therefore, the second lead portion 22 is connected to the piezoelectric vibrating piece 14 via the extending portion 34 and the second connecting portion 18.

  The first lead electrode 28 connected to the first excitation electrode 26 is drawn to the base substrate 44 side in the first connecting portion 16 and drawn to the side of the first lead portion 20 facing the base substrate 44. On the other hand, the second extraction electrode 32 connected to the second excitation electrode 30 is extracted to the side of the second connecting portion 18 and the extending portion 34 that faces the substrate, and to the side of the second extraction portion 22 that faces the base substrate 44. Pulled out.

  The first lead portion 20 and the second lead portion 22 are joined to the first surface 44a of the base substrate 44 by a conductive wax material 36 made of eutectic metal. Further, the peripheral edge of the base substrate 44 and the support frame 24 are joined by the second wax material 38, and the peripheral edges of the support frame 24 and the lid 42 are also joined by the second wax material 38. The brazing material 36 and the second brazing material 38 are patterned on the lid 42 and the base substrate 44 by sputtering or the like. On the other hand, metallization 40 is applied to both surfaces of the support frame 24 in contact with the second brazing material 38 to facilitate the joining with the second brazing material 38, and the metallization 40 is simultaneously formed with the excitation electrode and the extraction electrode. It can be carried out. The base substrate 44, the piezoelectric vibrator layer 12, and the lid 42 are stacked and then heated and pressed to perform bonding with the wax material 36 and the second wax material 38. The wax material 36 and the second wax material 38 may be the same material or different materials.

  Also, holes (first hole 46, second hole 48) are formed in a tapered shape that gradually decreases the inner diameter from the second surface 44b opposite to the first surface 44a of the base substrate 44 toward the first surface 44a. The first hole 46 passes through the base substrate 44, the brazing material 38, and the first extraction electrode 28, reaches the first extraction portion 20, and extends to a predetermined depth. The second hole 48 penetrates through the base substrate 44, the brazing material 36, and the second lead electrode 32, reaches the second lead portion 22, and reaches a predetermined depth.

  Electrodes (first electrode 50 and second electrode 52) are formed on the inner wall of the hole, the first electrode 50 is formed in the first hole 46, and the second electrode 52 is formed in the second hole 48. ing. Therefore, the side surface of the first electrode 50 and the end surface of the first extraction electrode 28 are connected, and the side surface of the second electrode 52 and the end surface of the second extraction electrode 32 are connected. A first external electrode 54 and a second external electrode 56 are formed on the second surface 44 b of the base substrate 44, the first external electrode 54 is connected to the first electrode 50, and the second external electrode 56 is the second electrode 52. Connected with.

  Therefore, the first excitation electrode 26 is connected to the first external electrode 54 via the first extraction electrode 28 and the first electrode 50, and the second excitation electrode 30 is connected via the second extraction electrode 32 and the second electrode 52. Are connected to the second external electrode 56. Therefore, by connecting a drive circuit (not shown) for driving the piezoelectric vibrating piece 14 to the first external electrode 54 and the second external electrode 56, the piezoelectric vibrating piece 14 can vibrate at a specific resonance frequency.

  The tapered hole described above is formed by sandblasting. Sand blasting is performed by leaving a portion to be ground on the surface to be ground and masking, and spraying grinding particles such as SiC having a diameter of about 20 μm onto the grinding portion together with high-speed air. Here, when sandblasting is performed, the second surface 44b of the base substrate 44 is dug toward the first surface 44a and reaches the first surface 44a, and the brazing material 36 is dug. Since the material 36 is joined and a hole is formed in the joined region, no chipping occurs in the region, and sandblasting proceeds to the wax material 36 as it is. Therefore, the piezoelectric vibrator 10 is obtained in which the yield is increased by avoiding the occurrence of disconnection due to chipping in the first electrode 50 and the second electrode 52 formed in the hole. Further, since no chipping occurs, it is not necessary to use a large amount of metal material as the first electrode 50 and the second electrode 52 to compensate for this, and the piezoelectric vibrator 10 can be reduced in cost. Further, since the holes are formed in a tapered shape, the first electrode 50 and the second electrode 52 can be formed uniformly, so that variation in electrical characteristics among products can be suppressed. The brazing material 36 is in surface contact with the extraction electrode and the first electrode 50 and the second electrode 52, so that the conduction between the extraction electrode and the first electrode 50 and the second electrode 52 can be reliably performed. Further, since the hole is formed after the base substrate 44, the piezoelectric vibrating piece 14, and the lid 42 are laminated, it is possible to form a hole having no step on the inner wall surface.

  In addition, it is preferable to perform etching (light etching) on the inner wall of the hole after the hole is formed by sandblasting. Thereby, the residual stress on the inner wall of the hole is reduced to prevent adverse effects on the piezoelectric vibrator 10, and the through-electrode can be easily formed by smoothing the inner wall of the hole.

  Since the brazing material 36 has conductivity, it can serve as a medium for electrical connection between the extraction electrode and the first electrode 50 and the second electrode 52, so that the hole may be configured not to penetrate the extraction electrode. In addition, when the hole extends through the extraction electrode to reach the extraction portion, the first electrode 50, the second electrode 52, and the extraction electrode are directly connected, so that the brazing material 36 does not need to have conductivity.

  A sealing hole (not shown) is formed in the lid 42. After the base substrate 44, the piezoelectric vibrating reed layer 12, and the lid 42 are laminated in this order, the internal space 10a is evacuated by vacuum suction from the sealing hole (not shown). After that, a sealing hole (not shown) can be sealed.

  Since the base substrate 44, the piezoelectric vibrating reed layer 12, and the lid 42 are made of the same material (piezoelectric material such as quartz), the linear expansion coefficients are the same for each layer. Can be suppressed, and an error in the oscillation frequency of the piezoelectric vibrating piece 14 can be suppressed.

  4, 5, and 6 show the manufacturing process of the piezoelectric vibrator 10 according to the first embodiment. First, as shown in FIG. 4A, a brazing material is placed at a position corresponding to the first extraction electrode 28 and the second extraction electrode 32 on the first surface 44a which is the surface facing the piezoelectric vibrating reed layer 12 of the base substrate 44. 36 is formed by a sputter or the like, and a second wax material 38 is formed at a position on the periphery of the first surface 44a and facing the support frame 24 of the piezoelectric vibrating reed layer 12 (FIG. 4B). Here, when the brazing material 36 and the second brazing material 38 are made of the same material, they can be formed simultaneously. On the other hand, as shown in FIG. 5A, the second brazing material is similarly formed at the periphery of the surface of the lid 42 facing the piezoelectric vibrating reed layer 12 and at the position facing the support frame 24 of the piezoelectric vibrating reed layer 12. 38 is formed (FIG. 5B).

  Next, as shown in FIG. 6A, a crystal substrate 58 for the piezoelectric vibrating reed layer 12 is prepared, and the support frame 24, the first connecting portion 16 (not shown), and the second connecting portion 18 ( (Not shown), half etching is performed to the thickness of the piezoelectric vibrating piece 14 while leaving the outer shapes of the first lead portion 20 and the second lead portion 22 (FIG. 6B), and the support frame 24 and the first connecting portion 16 (not shown). The piezoelectric vibrating piece layer 12 is etched by leaving the outer shape of the second connecting portion 18 (not shown), the first drawing portion 20, the second drawing portion 22, and the piezoelectric vibrating piece 14 until it penetrates the quartz crystal substrate 58. (FIG. 6C), and the first excitation electrode 26, the second excitation electrode 30, the first extraction electrode 28, and the second extraction electrode 32 are formed by sputtering or the like using a metal such as Cr or Au. Similarly, the metallization 40 is formed on both sides of the support frame 24. Figure 6 (d)). In this state, since the piezoelectric vibrating piece 14 can oscillate at a specific oscillation frequency, a driving circuit (not shown) is connected to the first extraction electrode 28 and the second extraction electrode 30 to drive the piezoelectric vibrating piece 14. As shown in FIG. 6E, a part of the first excitation electrode 26 is thickened by a vapor deposition method or thinned by a dry etching method using argon plasma irradiation to adjust the frequency.

  Then, as shown in FIG. 6F, the base substrate 44, the piezoelectric vibrating reed layer 12, and the lid 42 are laminated. At this time, in the base substrate 44 and the piezoelectric vibrating reed layer 12, the brazing material 36 and the first extraction electrode 28, the brazing material 36 and the second extraction electrode 32, the second brazing material 38 and the metallized 40 formed on the base substrate 44. And abut. Further, the metallized 40 and the second brazing material 38 are brought into contact with each other in the piezoelectric vibrating reed layer 12 and the lid 42. Then, the brazing material 36 and each lead-out electrode are joined by pressurizing and heating the piezoelectric vibrator 10 from the ± Z direction in such a laminated state, and the second brazing material 38 and the metallized 40 are joined.

  Next, as shown in FIG. 6G, holes (first hole 46, second hole 48) are formed by sandblasting. In plan view, the second surface 44b is masked by leaving a region on the second surface 44b that overlaps with the first lead portion 20 and the second lead portion 22 and having a certain diameter, and the second surface 44b is exposed. Grinding particles such as SiC together with high-speed air to grind the region from the second surface 44b side of the base substrate 44, and grinding until reaching the brazing material 36 through the base substrate 44, or brazing material Grinding is performed until the lead electrode and the lead portion are reached through the hole 36. At this time, the hole is formed in a tapered shape that gradually decreases the inner diameter from the second surface 44b toward the first surface 44a. The diameter of the hole through the brazing material 36 is adjusted to be smaller than the outer shape of the brazing material 36 so as not to enter the internal space 10a. The inner wall surface 46a of the first hole 46 formed in this way is formed by the base substrate 44, the brazing material 36, the first lead electrode 28, and the first lead portion 20, and the inner wall surface 48a of the second hole 48 is formed by the base substrate 44, the wax member. The material 36, the second extraction electrode 32, and the second extraction portion 22 are formed. After the holes are formed, the inner wall surfaces 46a and 48a are etched (light etching) using hydrofluoric acid or the like to remove the residual stress on the inner wall surfaces 46a and 48a and improve the flatness. Then, a solder ball (not shown) is inserted into the hole, and the solder ball (not shown) is melted by irradiating the solder ball (not shown) with a laser or the like to form electrodes (first electrode 50, second electrode 52). Finally, external electrodes (first external electrode 54 and second external electrode 56) are formed around the hole of the second surface 44b and the hole of the second surface 44b by a sputtering method, plating, or the like, whereby the piezoelectric vibrator 10 is formed. Is formed (FIG. 6H).

  FIG. 7 shows a modification of the first embodiment. FIG. 7A is a front view, and FIG. 7 is a plan view of the substrate. As shown in FIG. 7, a convex portion 45 c may be formed in a region where the brazing material 36 of the first surface 45 a of the substrate 45 is joined, and the hole may penetrate the convex portion 45 c. When the substrate is formed of quartz, the convex portion 45c can be formed integrally with the substrate 45 by using both photolithography and etching. That is, half-etching is performed until the thickness of the substrate 45 reaches the thickness of the substrate 45, leaving the outer shape of the projection 45c on the side of the quartz base plate (not shown) serving as the material of the substrate 45 that is the first surface 45a. The outer shape of the substrate 45 is formed by etching so as to extract the substrate 45 while leaving the outer shapes of 45c and the substrate 45. Then, the brazing material 36 is formed by sputtering or the like so as to cover the convex portions 45 c, and the second brazing material 38 is formed on the periphery of the substrate 45, thereby forming the stacking substrate 45. By forming the convex portion 45c in this manner, the contact area of the brazing material 36 with the substrate 45 is increased and the bonding is stabilized, and the brazing material 36 can be saved by the amount of the convex portion 45c formed, thereby reducing the cost. Can be planned.

  A piezoelectric vibrator according to the second embodiment is shown in FIG. FIG. 8A is a front view of the piezoelectric vibrator, and FIG. 8B is a plan view of the piezoelectric vibrating piece layer. The piezoelectric vibrator 70 according to the second embodiment is basically the same as that of the first embodiment, but has a fixing portion that fixes the lead portions (the first lead portion 74 and the second lead portion 76) to the lid 42.

  A third brazing material 78 formed on the lid 42 as the material of the fixing portion can be used. The third brazing material 78 is formed at a position facing the first leading portion 74 and the second leading portion 76 on the surface facing the piezoelectric vibrating piece layer 72 side of the lid 42. By using the same material as the second brazing material 38 formed on the periphery of 42, it can be formed simultaneously with the second brazing material 38. On the other hand, a metallized 80 is formed on the surface side of the first lead portion 74 and the second lead portion 76 that faces the lid 42. The metallized 80 can be formed simultaneously with the metallized 40 formed on the support frame 24. Then, the third brazing material 78 is pressed against the metallized 80 and heated in the same manner as the other brazing materials during the lamination described in the first embodiment, whereby the first lead portion 74 and the second lead portion 76 are brought into the lid 42. Can be fixed. In the second embodiment, the holes are also formed by sand blasting. Sand blasting is performed from the second surface side 44b of the base substrate 44 toward the first surface 44a. At this time, the lead portion applies stress to the lid 42 side by sand blasting. However, the third wax material 78 (fixed portion) fixes the drawer portion to the lid 42 to prevent the drawer portion from being damaged due to the impact of sandblasting, and at the boundary between the drawer portion and the wax material 36. It is possible to avoid the concentration of impact due to sand blasting, to prevent separation of the drawer portion and the wax material 36, and to easily form a through hole. Further, by using the same material as the brazing material 36 in which the through holes are formed as the material of the fixing portion, it is possible to reduce the cost without increasing the number of materials.

  FIG. 9 shows a first modification of the fixed portion. 9A is a front view of the piezoelectric vibrator 70, FIG. 9B is a plan view of the lid 42, and a plan view of the piezoelectric vibrating piece layer 72 is the same as FIG. 8B. As a material of the fixing portion, a bump 82 formed on the lid 42 side of the first lead portion 74 and the second lead portion 76 and formed of Au or the like can be used. In addition, in order to facilitate the connection by the bumps 82, the metallized 84 is formed at the positions where the metallized 80 and the third wax material 78 of the lid 42 are formed as described above. As in the case of the other wax materials described in the first embodiment, the bumps 82 are crushed by heating or applying ultrasonic waves from the lid 42 side in a state where the bumps 82 are pressed against the lid 42 in the same manner as the other wax materials. 42 is fixed.

  FIG. 10 shows a second modification of the fixing portion. 10A is a front view of the piezoelectric vibrator, and FIG. 10B is a plan view of the piezoelectric vibrating piece layer. As the fixed portion, the second convex portion 86 formed in the drawer portion can be used. The second convex portion 86 is made of the same material as the piezoelectric vibrating piece layer 72, and the piezoelectric vibrating piece layer 72 can be formed integrally with the second convex portion 86. That is, half etching is performed on the quartz base plate (not shown), which is the material of the piezoelectric vibrating piece layer 72, leaving the outer shape of the second convex portion 86 until it has the same thickness as the support frame 24, and then the second convex portion. 86, half-etching is performed until the thickness of the piezoelectric vibrating piece 14 is the same, leaving the outer shapes of the support frame 24, the first connecting portion 16, the second connecting portion 18, the first drawing portion 20, and the second drawing portion 22. A crystal base plate (not shown) is left with the outer shapes of the two convex portions 86, the support frame 24, the first connecting portion 16, the second connecting portion 18, the first leading portion 20, the second leading portion 22, and the piezoelectric vibrating piece. The piezoelectric vibrating reed layer 72 can be formed by etching until it penetrates.

  By forming the second convex portion 86 in this way, the second convex portion 86 and the lid 42 come into contact with each other during the stacking described in the first embodiment. Accordingly, since the relative position between the lead portion and the lid 42 is determined to be rigid, the vibration of the lead portion due to sandblasting can be suppressed and sandblasting can be performed effectively, and a material for forming the piezoelectric vibrating piece layer 72 can be used. Since the 2nd convex part 86 will be formed, cost reduction can be aimed at.

  FIG. 11 shows a modification of the piezoelectric vibrating piece layer. 11A is a front view, FIG. 11B is a plan view of the piezoelectric vibrating piece layer, and FIG. 11C is a bottom view of the piezoelectric vibrating piece layer. As shown in FIG. 11, the piezoelectric vibrating piece layer 13 includes a piezoelectric vibrating piece 15, a connecting portion (first connecting portion 17, second connecting portion 19), and a drawing portion (first drawing portion 21, second drawing portion 23). The outer shape is formed by the support frame 25. The first lead portion 21 is a corner on the −X direction side in the support frame 25 and is formed integrally with the first connecting portion 17. The second lead portion 23 is formed at a corner on the + X direction side in the support frame 25, and the first lead portion 21 and the second lead portion 23 are formed on a diagonal line of the support frame 25. The second drawer portion 23 and the second connecting portion 19 are connected by an extending portion 35 connected to the support frame 25. Therefore, the second lead portion 23 is connected to the piezoelectric vibrating piece 14 via the extending portion 35 and the second connecting portion 19.

  Then, the first lead electrode 29 connected to the first excitation electrode 27 is routed to the base substrate 44 side in the first connecting portion 17, and to the base substrate 44 side of the second lead portion 23 via the extending portion 35. Pulled out. On the other hand, the second lead electrode 33 connected to the second excitation electrode 31 is formed in the second connecting portion 19 and the first lead portion 21 on the surface of the piezoelectric vibrating piece layer 13 on the base substrate 44 side.

  As shown in FIG. 11, the first drawer portion 21 and the second drawer portion 23 are based on a line passing through the center of the short side 25a of the support frame 25 with respect to the first drawer portion 20 and the second drawer portion 22, respectively. Since the relationship is reversed in the ± Y direction, the first hole 47 and the second hole 49 formed in the base substrate 44 are formed on the base substrate 44 at the positions reversed as described above. The piezoelectric vibrating reed layer 13 formed in this way can be applied to the first and second embodiments.

  12, 13, and 14 are force detection elements that are the third embodiment of the electronic component according to the present invention, and FIG. 12A is a side cross-sectional view of the force detection element as viewed from the side. FIG. 13B is a bottom view of the pressure-sensitive element piece constituting the force detection element, FIG. 13 is an exploded perspective view seen from the base substrate side, and FIG. 14 is an exploded perspective view seen from the diaphragm side.

  For example, a piezoelectric vibrator mounted on a diaphragm having a flexible portion that bends by receiving a force directly, for example, by receiving a pressure to be measured via a support portion, has an electrode pattern on a plate-like piezoelectric substrate, for example. Formed, the detection axis is set in the direction of detecting the force, and when the pressure to be measured is received by the pressure receiving portion of the diaphragm from the direction orthogonal to the direction of the detection axis, the flexible portion bends, and via the support portion When a force is applied to the piezoelectric vibrator, a tensile stress is generated in the direction of the detection axis, so that the resonance frequency of the piezoelectric vibrator changes, and the pressure value of the pressure to be measured is determined from the change in the resonance frequency. To detect. It has a pressure sensor, a diaphragm as a pressure receiving means, and a pressure sensitive element (double tuning fork vibrator) mounted on a support portion formed on the diaphragm, and the pressure receiving surface of the diaphragm faces the outer surface while accommodating these in a container. Thus, the structure is vacuum-sealed.

  A force detection element 700 according to the third embodiment includes an excitation electrode 701 formed on two columnar beams of a double tuning fork vibrator 705 as a pressure sensitive element, and an extraction electrode (first extraction) connected to the excitation electrode 701. A double tuning fork vibrator having a pressure sensitive element 772 having an electrode 702 and a second lead electrode 703) mounted on a support portion 706 formed on an inner main surface 704 b opposite to the pressure receiving surface 704 a of the diaphragm 704. 705, the double tuning fork vibrator 705 includes an adhesive means (for example, a wax material such as low-melting glass) 750 that connects the extraction electrode and the first surface 742a of the base substrate 742, and the base The base substrate 742 and the bonding means 750 are dug from the second surface 742b opposite to the first surface 742a of the substrate 742 toward the first surface 742a. And the electrodes (first electrode 50, second electrode 52) formed on the inner wall surfaces 46a, 48a of the holes. The base substrate 742, the pressure-sensitive element piece layer 772, and the diaphragm 704 form a three-layer structure having the internal space 10a.

The diaphragm 704 has a flexible portion 704c and a thick portion 704d surrounding the outer edge of the flexible portion 704c.
The pressure-sensitive element piece layer 772 surrounds the double tuning fork vibrator 705 composed of a vibrating part 705a made up of two columnar beams and bases 705b located at both ends of the vibrating part 705a, and the double tuning fork vibrator 705. It has a rectangular support frame portion 773, and a beam 707 connecting the support frame portion 773 and the base portion 705b. In FIG. 12, the excitation electrode 701 is depicted as being formed only on the base substrate 742 side, but it is assumed that it is actually formed on both sides.

  The thick portion 704b of the diaphragm 704 and the outer edge portion 742a of the base substrate 742 are bonded to both surfaces of the support portion frame 773 of the pressure-sensitive element piece layer 772 using the adhesive means 750, respectively. Holes (first hole 46, second hole 48) are formed in a tapered shape that gradually decreases the inner diameter from the second surface 742b opposite to the first surface 742a of the base substrate 742 toward the first surface 742a. The hole 46 passes through the base substrate 742, the bonding means 750, and the first extraction electrode 702, reaches the support frame portion 773, and reaches a position having a predetermined depth. The second hole 48 passes through the base substrate 44, the brazing material 36, and the second extraction electrode 703, reaches the support portion frame 773, and extends to a predetermined depth.

  What is necessary is just to form the above-mentioned taper-shaped hole similarly to the hole concerning the above-mentioned 1st Embodiment and 2nd Embodiment. Accordingly, the first surface 742a and the bonding unit 750 are bonded to each other, and a hole is formed in the bonded region. Therefore, chipping does not occur in the region, and sandblasting proceeds to the bonding unit 750 as it is. Therefore, in the first electrode 50 and the second electrode 52 formed in the hole, the force detection element 700 is obtained in which the yield is increased by avoiding the occurrence of disconnection due to chipping. Further, since chipping does not occur, it is not necessary to use a large amount of metal material for the first electrode 50 and the second electrode 52 to compensate for this, so that the force detecting element 700 capable of reducing the cost is obtained. Further, since the holes (first hole 46, second hole 48) are formed after the base substrate 742, the pressure sensitive element piece layer 772, and the diaphragm 704 are laminated, a hole having no step is formed on the inner wall surface. Can do. Further, since the first and second electrodes 50 and 52 are separated from the double tuning fork vibrator 705 which is a pressure sensitive element, the vibration of the double tuning fork vibrator 705 is not hindered.

  Further, it is preferable to perform etching processing (light etching) on the inner wall of the hole after the hole is formed by sandblasting, thereby reducing the residual stress on the inner wall of the hole and preventing an adverse effect on the force detection element 700. In addition, it goes without saying that the electrodes can be easily formed by smoothing the inner walls of the holes.

  As described above, the embodiment has been described on the premise of the piezoelectric vibrator and the force detection element. However, the present invention is not limited to this, and in an electronic component having a laminated structure, an electronic element piece that constitutes the electronic component and has an electrode is similarly used. Even when laminating on a substrate constituting an electronic component, the electrode of the electronic element piece is connected to the substrate using a brazing material or an adhesive means, and the substrate and the adhesive means are dug from the lower surface of the substrate by sandblasting. And an electrode is formed on the inner wall of the hole, so that the electrical connection between the electrode of the electronic element piece and the electrode on the substrate side can be realized with high reliability.

DESCRIPTION OF SYMBOLS 10 ......... Piezoelectric vibrator, 12 ......... Piezoelectric vibrating piece layer, 14 ......... Piezoelectric vibrating piece, 16 ......... First connecting portion, 18 ......... Second connecting portion, 20 ......... First drawer , 22 ......... second lead portion, 24 ......... support frame, 26 ......... first excitation electrode, 28 ......... first lead electrode, 30 ......... second excitation electrode, 32 ......... first 2 lead electrodes 34... Stretched portion 36... Wax material 38... Second wax material 40... Metallized 42... Lid 44... Base substrate 45. ... Substrate, 46 ......... First hole, 48 ......... Second hole, 50 ......... First electrode, 52 ......... Second electrode, 54 ......... First external electrode, 56 ......... Second External electrode 58... Quartz substrate 70... Piezoelectric vibrator 72... Piezoelectric vibrating piece layer 74 74 First lead portion 76 76 Second lead portion 78 ...... Third wax material, 80 ......... Metalized, 82 ......... Bump, 84 ......... Metallized, 86 ...... Second convex part, 101 ......... Frame part, 102 ......... Piezoelectric vibrator, 104 ......... First lid, 105 ......... Second lid, 106 ......... Connecting part, 200 ......... Piezoelectric vibrator, 201 ......... Lid, 202 ...... Substrate, 203 ... ... Piezoelectric substrate, 203A ......... Frame portion, 203B ......... Vibration portion, 203C ...... Extraction electrode, 204 ...... Through hole, 205 ...... External electrode, 301a ......... First crystal substrate, 301b ... ...... Second crystal substrate, 301c ......... Third crystal substrate, 302 ......... Piezoelectric vibrating piece, 302a ......... Base, 302b ......... Tuning fork arm, 304 (xy) ......... Electrode pad, 306a ... ... first through electrode, 306m ......... first through hole, 307 (xy) ......... electric Pad 401 ...... Piezoelectric vibrator 411 ...... Piezoelectric vibrating piece 412 ...... Lid body 413 ...... Insulating substrate 414 …… Through hole 415 a ...... Connection electrode 415 b ...... Through electrode, 415c ......... External electrode, 417 ......... Metal member, 418 ......... Conductive adhesive, 430 ......... Conductive film, 700 ......... Force detection element, 701 ... Excitation electrode, 702 ... …… First extraction electrode, 703 ......... Second extraction electrode, 704 ......... Diaphragm, 705 ......... Double tuning fork vibrator, 706 ......... Supporting portion, 707 ......... Beam, 742 ......... Base substrate 750... Adhesive means 772... Pressure sensitive element single layer 773.

Claims (12)

A method of manufacturing an electronic component formed by mounting an electronic element piece having an electrode on a substrate,
Bonding the electrode and the first surface of the substrate with a wax material;
Forming a hole by digging the substrate and the wax material from the second surface opposite to the first surface of the substrate toward the first surface;
An electrode is formed on the inner wall of the hole. An electronic component formed by mounting an electronic element piece having an electrode on a substrate,
The electronic component includes a brazing material that connects the electrode and the first surface of the substrate;
A hole formed by digging the substrate and the wax material from the second surface opposite to the first surface of the substrate toward the first surface;
And an electrode formed on the inner wall of the hole. A method of manufacturing a piezoelectric vibrator formed by mounting a piezoelectric vibrating piece having an excitation electrode and a lead electrode connected to the excitation electrode on a substrate,
Bonding the lead electrode and the first surface of the substrate with a wax material;
Forming a hole by digging the substrate and the wax material from the second surface opposite to the first surface of the substrate toward the first surface;
An electrode is formed on the inner wall of the hole. A piezoelectric vibrator formed by mounting on a substrate a piezoelectric vibrating piece having an excitation electrode and an extraction electrode connected to the excitation electrode,
The piezoelectric vibrator is
A brazing material connecting the extraction electrode and the first surface of the substrate;
A hole formed by digging the substrate and the wax material from the second surface opposite to the first surface of the substrate toward the first surface;
And an electrode formed on an inner wall of the hole.   5. The piezoelectric vibrator according to claim 4, wherein the hole is formed in a taper shape with a gradually decreasing inner diameter from the second surface toward the first surface by sandblasting.   The piezoelectric vibrator according to claim 5, wherein the inner wall is subjected to an etching process after the hole is formed by sandblasting.   7. The piezoelectric vibrator according to claim 4, wherein a convex portion is formed in a region of the second surface where the wax material is joined, and the hole penetrates the convex portion.   The piezoelectric vibrator according to claim 4, wherein the hole is formed by digging the extraction electrode together with the substrate and the wax material. A piezoelectric vibrator that is laminated in the order of a substrate, a piezoelectric vibrating piece layer, and a lid,
The piezoelectric vibrating reed layer is
A piezoelectric vibrating piece having an excitation electrode;
A support frame for supporting the piezoelectric vibrating piece;
A drawer connected to the piezoelectric vibrating piece;
An extraction electrode connected to the excitation electrode and extracted to a surface of the extraction portion facing the substrate, and joined to the first surface of the substrate by a wax material;
The piezoelectric vibrator is
A hole formed by digging the substrate and the wax material by sandblasting from the second surface opposite to the first surface of the substrate toward the first surface;
An electrode formed on the inner wall of the hole,
A piezoelectric vibrator having a fixing portion for fixing the lead portion to the lid.   The piezoelectric vibrator according to claim 9, wherein the fixing portion is a wax material.   The piezoelectric vibrator according to claim 9, wherein the fixing portion is a bump.   The piezoelectric vibrator according to claim 9, wherein the fixed portion is a second convex portion formed in the lead portion.