JP2011091167A - Heating component housing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low-cost heating component housing with high heat dissipation efficiency. <P>SOLUTION: A fusible link 2 is stored in the heating component housing so that the connection terminal 21 of the fusible link 2 comes into direct contact with the housing body 1A. The housing body 1A and the cover 1B of the heating component housing are formed of a high heat conductive materials. Heat generated by the fusible link 2 is conducted directly to the housing body 1A not through inside air but through the connection terminal 21, so that the heat can be efficiently conducted from the fusible link 2 to the housing body 1A. Consequently, the amount of heat dissipated from a case to outside air becomes large to obtain the heating component housing with high heat dissipation efficiency. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a heat generating component storage body, and more particularly to a storage body in which an electronic component having heat generation is incorporated.

  Conventionally, as a storage body containing a heat-generating component, the heat-generating component is fixed to a heat transport flat plate containing a meandering capillary tube in which a refrigerant such as butane or water is enclosed, and the heat transport flat plate radiator is used to move it outside the housing. A lamp cooling system that dissipates heat by natural convection into a housing is known (see, for example, Patent Document 1). In this lamp cooling system, a cushioning material having high thermal conductivity and elasticity is arranged as a heat conductive sheet on the joint surface between the lamp base and the heat transport flat plate to improve the adhesion between the lamp base and the heat transport flat plate, It is considered to further reduce the thermal resistance. In addition to this, in a heat dissipation structure including a heat-generating component, a heat dissipation sheet that dissipates the heat of the heat-generating component in the internal space (for example, see Patent Document 2), or between a plurality of terminal portions thermally. The thing (for example, refer patent document 3) which provided the heat-transfer member which enables transmission is known.

JP 2005-62373 A JP 2007-12913 A JP-A-2005-304163 JP 2002-305271 A

  In the above-described prior art, as shown in FIG. 9, heat generated from a heat-generating component (heat source) disposed inside the housing 100 is sequentially transferred to the internal air, the housing wall 101, and the external air. Go. However, as shown in FIG. 10, since the housing 100 has an internal air layer, heat from the heat source is reflected at the boundary with the housing wall 101 or convected by the internal air layer. It cannot be said that the heat reaches the casing wall 101 efficiently. Therefore, the amount of heat conducted through the housing 100 is significantly less than the amount of heat from the heat source, and the amount of heat transmitted to the external air is small. Thus, since the amount of heat conducted to the housing wall 101 is originally small, even if the constituent material of the housing 100 is changed from the general-purpose resin to the high heat conducting material, the heat radiation effect is not improved so much. .

  Accordingly, an object of the present invention is to provide a low-cost heat-generating component storage body with high heat dissipation efficiency without increasing the number of constituent members.

  A feature of the present invention is a heat-generating component storage body including a heat-generating electronic component having a connection terminal and a housing for storing the heat-generating electronic component so that the connection terminal abuts. The gist of the present invention is that the base polymer is formed of a highly heat-conductive material obtained by blending an inorganic component having high heat conductivity with a base polymer having electrical insulation.

  In the present invention, heat generated in the heat-generating electronic component is directly conducted to the housing wall through the connection terminal without passing through the internal air, and heat from the heat-generating electronic component is transferred to the housing. It is possible to conduct efficiently. Therefore, the amount of heat dissipated from the housing to the outside air is increased, and a heat generating component housing having high heat dissipation efficiency is obtained.

According to the present invention, heat generated in the heat-generating electronic component can be smoothly conducted to the external air without stagnation in the internal air, and the heat can be dissipated, thereby improving the reliability of the heat-generating electronic component. Can do.
Moreover, according to this invention, the increase in the score of a structural member can be suppressed.

It is a perspective view which shows schematic structure of the heat-emitting component storage body which concerns on embodiment of this invention. It is II-II sectional drawing of FIG. It is explanatory drawing which shows the thermal radiation mechanism of the heat-emitting component storage body which concerns on embodiment of this invention. It is explanatory drawing which shows the temperature measurement state at the time of interposing an aluminum plate. It is VV sectional drawing of FIG. It is explanatory drawing which shows the temperature measurement state when not interposing an aluminum plate. It is a figure which shows the result of a measurement test for 2 minutes. It is a figure which shows the result of the measurement test between ten. It is explanatory drawing of the conventional heat-emitting component storage body. It is explanatory drawing which shows the mechanism of heat dissipation of the conventional heat-emitting component storage body.

  Hereinafter, the detail of the heat-emitting component storage body which concerns on embodiment of this invention is demonstrated based on drawing. The heat generating component housing according to the present embodiment is an application of the present invention to a fusible link. However, the drawings are schematic, and the dimensional ratio of each member, the number of members, and the like are different from actual ones. Moreover, the part from which the relationship and ratio of a mutual dimension differ also in between drawings is contained.

  As shown in FIGS. 1 and 2, in the heat generating component housing 1 according to the present embodiment, the fusible link 2 as a heat generating electronic component including the connection terminal 21 and the connection terminal 21 are fixed through. The wiring board 3 and the housing 1 that houses the wiring board 3 and the heat-generating electronic component 2 are provided so that the connection terminals 21 come into contact with each other.

  As shown in FIG. 1, the heat generating component storage body 1 according to the present embodiment includes a rectangular parallelepiped container-shaped storage body main body 1A and a lid body 1B that closes the upper opening of the storage body main body 1A. A printed wiring board 3 on which a plurality of fusible links 2 and the like are mounted is housed in the body main body 1A.

  Here, the constituent material of the housing 1 is highly filled with high thermal conductivity (10 to 80 W / mK) ceramics (for example, alumina, zirconia, etc.) into polyphenylene sulfide as a base polymer having electrical insulation (60 % Or more).

  The fusible link 2 incorporates a fusible portion of a fuse element including a pair of connection terminals 21 in a housing 22.

  As shown in FIG. 2, in the present embodiment, a pair of connection terminals 21 protruding from the housing 22 in the fusible link 2 pass through the wiring board 3. These connection terminals 21 are made of aluminum.

  The connection terminal 21 is set so that the wiring board 3 is positioned at the center of the length of the connection terminal 21 through the pad portion 31 patterned on the wiring board 3. The end surface of the distal end portion 21A of the connection terminal 21 is formed in a rectangular shape, and the vertical and horizontal dimensions are set to 20 mm or more. Incidentally, the connection board 21 and the pad part 31 are fixedly connected to each other by the solder 32 at a position where the connection terminal 21 having a length of about 3 mm protrudes from the front and back of the wiring board 3. The pad portion 31 is connected to a circuit pattern (not shown).

  And as shown in FIG. 2, the front-end | tip part 21A of the connecting terminal 21 is set so that it may contact | abut to the bottom part (casing wall part) 1Ab of the storage body main body 1A. Thus, in order to maintain the state in which the tip 21A of the connection terminal 21 is in contact with the bottom 1Ab of the storage body main body 1A, it is preferable to fix the wiring board 3 to the storage body main body 1A.

  As shown in FIGS. 2 and 3, in the heat generating component housing 1 having such a configuration, the heat generated in the fusible link 2 as the heat generating electronic component is transferred to the tip portion 21 </ b> A via the connection terminal 21 made of aluminum. To the bottom 1Ab of the container body 1A. Therefore, in the fusible link 2, a large amount of heat, excluding a small amount of heat transmitted to the internal air, is efficiently conducted from the bottom 1Ab to the housing body 1A. The connection terminal 21 conducts a large amount of heat to the housing body 1A, but heat is transferred from the fusible link 2 to the housing body 1A and the lid body 1B by heat radiation. The heat conducted to the housing body 1A is also conducted to the lid body 1B, and heat is dissipated from the entire surface of the heat generating component housing 1 to the external air.

  As described above, in the heat generating component housing according to the present embodiment, the heat generated in the fusible link 2 can be quickly dissipated to the external air, so that the characteristics of the fusible link 2 are not disturbed and safety is ensured. There is an effect of improving the reliability as a vessel. Moreover, in the heat-emitting component storage body 1 according to the present embodiment, the tip 21A of the connection terminal 21 of the fusible link 2 is merely brought into direct contact with the bottom 1Ab of the storage body main body 1A. The increase can be suppressed.

(Measurement test)
Hereinafter, in order to explain the operation and effect of the heat generating component housing according to the present invention, measurement tests performed when a metal is interposed between the heat generating portion and the housing and when a metal is not interposed are shown in FIGS. 8 will be used for explanation. Further, in this measurement test, the casing member 11 has a high thermal conductivity (polypropylene sulfide as a high thermal conductive material) (10) containing talc as a general-purpose resin (trade name: CJ233, manufactured by Prime Polymer Co., Ltd.). ˜80 W / mK) materials (trade name: IDEMITSU PPS, manufactured by Idemitsu Kosan Co., Ltd.) that were highly filled (60% or more) with ceramics (for example, alumina, zirconia, etc.) were prepared. The thermal conductivity of this high thermal conductive material is 3 W / mK.

  First, as shown in FIG. 4, an aluminum plate (purity 99%, No. 1000 series) 12 is placed on a plate-like housing member 11, and further a silicon rubber heater (100W, 10W, 25 ×) is placed thereon. 50 mm, manufactured by Three High Co., Ltd.) 13 is prepared. The casing member 11 has a thickness of 2 mm and a vertical and horizontal dimension of 60 mm × 60 mm. The aluminum plate 12 has a thickness of 3 mm and a vertical and horizontal dimension of 20 mm × 20 mm. The silicon rubber heater 13 has a vertical and horizontal dimension of 25 mm × 50 mm. A digital temperature controller (trade name: THC-15, manufactured by Three High Co., Ltd.) 14 is connected to the silicon rubber heater 13 via wires 14a and 14b.

  And the silicon rubber heater 13 was hold | maintained at 100 degreeC with the digital temperature controller 14, and the temperature of the lower surface center of the area | region in which the aluminum plate 12 in the housing member 11 was mounted was measured.

  That is, the measurement was performed for 10 minutes when the aluminum plate 12 was interposed (see FIG. 5), when it was not interposed (see FIG. 6), and when the high thermal conductive material and the general-purpose resin were used.

  The results are shown in FIGS. FIG. 7 shows the result of the temperature increase for 2 minutes, and FIG. 8 shows the result of the temperature increase for 10 minutes. As shown in FIG. 7, it can be seen that when the aluminum plate 12 is interposed, both the high thermal conductivity material and the general-purpose resin have a higher rate of heat transfer. In addition, as shown in FIG. 8, it can be seen that the amount of heat transfer increases with the aluminum plate 12 in both the high thermal conductivity material and the general-purpose resin. 7 and 8, it can be seen that the highly heat-conductive material conducts heat better and also has a higher rate of conducting heat.

  Thus, by directly conducting the heat from the heat-generating electronic component to the housing side without passing through the internal air of the heat-generating component housing 1, the conduction efficiency is high and the amount of heat passing is increased. In addition, heat conduction speed was increased by conducting heat without intervening internal air. Furthermore, more heat can be transferred by using a high thermal conductive material than by general-purpose resin. In addition, heat can be transferred faster by using a high thermal conductive material than by general-purpose resin.

(Other embodiments)
The discussion and drawings which form part of the disclosure of the above-described embodiments do not limit the present invention.

  For example, in the above-described embodiment, the fusible link 2 is applied as the heat-generating electronic component. However, the present invention is not limited to the fusible link 2, and is not limited to a fuse, a coil, a resistance element, a lamp, a solenoid, and an LED. Various electronic components such as a package and an LED socket can be applied.

  Moreover, in the said embodiment, as a constituent material of the housing | casing 1, polyphenylene sulfide is highly filled (60-80% or more) with high thermal conductivity (10-80 W / mK) ceramics (for example, alumina, zirconia, etc.). However, the present invention is not limited to this as long as it is an electrically insulating material having high thermal conductivity.

DESCRIPTION OF SYMBOLS 1 ... Heat generating component storage body 1A ... Storage body main body 1Ab ... Bottom part 1B ... Cover body 2 ... Fusible link 3 ... Wiring board 21 ... Connection terminal 21A ... Tip part 31 ... Pad part 32 ... Solder

Claims (1)

A heat-generating electronic component including a connection terminal; and a housing that stores the heat-generating electronic component so that the connection terminal comes into contact therewith,
The casing is formed of a highly heat-conductive material obtained by blending an inorganic component having high heat conductivity with a base polymer having electrical insulation properties.

Images