JP2011088360A - Apparatus and method for cutting nonmetallic substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To overcome the problem that, while cutting a substrate scribed by laser provides a finished product having very high strength owing to scratch-free cut surfaces, with minute scratches deteriorating the breaking strength. <P>SOLUTION: An apparatus and a method for cutting a nonmetallic substrate carry out cutting a nonmetallic substrate into first and second portions along a predetermined cutting line. The apparatus includes a first substrate holding means of holding a first portion of the substrate, a second substrate holding means of holding a second portion of the substrate after cutting, a means of forming a scribe line on the surface of the substrate from the starting end to the terminal end of the predetermined cutting line, and a means of applying a bending moment to extend the scribe line while following the means of forming the scribe line, and also has a mechanism holding the first and second cut portions of the substrate at predetermined intervals while holding the first portion of the substrate with the first substrate holding means. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to an apparatus and method for cleaving non-metallic substrates such as glass and ceramics.

  In the manufacturing process of flat panel displays and semiconductor chips, in order to increase manufacturing efficiency, a method in which a number of products are formed on one wafer or substrate (hereinafter referred to as a substrate) and then divided into a predetermined size is adopted. Yes. The flat panel display and the semiconductor chip are formed of a brittle non-metallic substrate such as glass, ceramics, or silicon, and the non-metallic substrate is divided (hereinafter, cleaved) as follows.

  First, scribe lines are formed on the substrate surface. A scribe line is a shallow crack formed continuously on a planned cutting line in a non-metallic substrate (hereinafter, a substrate to be cut).

  Next, a bending moment is applied to both sides of the formed scribe line and a shallow crack is extended in the thickness direction of the substrate, whereby the substrate to be cut is cleaved at the planned cutting line.

  One method of forming the scribe line is a laser scribe method.

  In the laser scribing method, a planned cutting line is set for the substrate to be cut, and then a minute initial crack is formed at one end of the planned cutting line. Subsequently, the substrate surface is heated for a predetermined time by a laser beam with a predetermined irradiation range from the start end to the end of the substrate to be cut so as to follow the planned cutting line, and then the heating end portion of the laser beam Following this, a scribe line is formed by spraying mist on the surface of the substrate to be cut and rapidly cooling the substrate to be cut.

  After the scribe line is formed, the substrate to be cut is cleaved by means of cleaving the substrate to be cut using an apparatus dedicated to cleaving or a bending moment applying means that follows the formation of the scribe line.

  The apparatus and method for cleaving the substrate to be cut by the bending moment applying means that follows the formation of the scribe line includes a device dedicated for scribing and a device dedicated for cleaving from the viewpoint of installation location, introduction cost, and processing time. There are many advantages over introduction, and the introduction is progressing.

  According to Patent Literature 1, a substrate to be cut is placed by placing a substrate to be cut on a step, and pressing a movable body that is movably provided following the formation of a scribe line. Is disclosed.

  According to Patent Document 2, a substrate to be cut is placed on a table having a concavo-convex shape, and a bending moment using a pressing roller or compressed air is applied following the formation of a scribe line. A technique for cleaving a cleaved substrate is disclosed.

JP 10-338534 A WO2007 / 142264

  When a laser-scribed substrate is cleaved, the cut surface including the edge portion is very smooth with few irregularities and no scratches. Since there is no scratch on the cut surface, when stress is applied to the substrate from the outside, there is no portion where stress is concentrated, so that the breaking strength is dramatically improved and a product with extremely high strength is finished. However, the edge portion of the cut surface is substantially perpendicular, and if the edges are rubbed, they are made of the same material, so that a minute scratch is attached to the contacted portion.

If a minute scratch is attached, when the external stress is applied, the stress tends to concentrate on the scratched part, and the breaking strength may be reduced as compared with the case where there is no scratch.
Therefore, there has been a problem that the edges are not re-contacted after the substrate is cleaved.

In order to solve the above problems, the invention described in claim 1
A device that cleaves a non-metal substrate into a first portion and a second portion along a cleaving line set on the substrate,
First substrate holding means for holding a first portion of the substrate;
Second substrate holding means for holding the second portion of the substrate after cleaving;
Means for forming a scribe line on the surface of the substrate from the start end to the end of the planned cutting line;
A moment applying means for applying a bending moment so as to spread the scribe line by following the means for forming the scribe line;
While holding the first portion of the substrate by the first substrate holding means,
The second part of the cleaved substrate is held by the second substrate holding means by deformation after cleaving, and the first part of the cleaved substrate and the second part of the cleaved substrate Is a non-metal substrate cleaving apparatus, characterized in that a mechanism capable of holding the above at a predetermined interval is provided.

The invention described in claim 2
A method of cleaving a non-metallic substrate into a first portion and a second portion along a planned cutting line set on the substrate,
Placing the first part of the substrate on the first substrate holding means and the second part of the substrate on the second substrate holding means;
Forming a scribe line on the surface of the substrate from the start to the end of the planned cutting line;
Applying a bending moment so as to spread the scribe line while following the formation of the scribe line, and cleaving the substrate,
While holding the first portion of the substrate by the first substrate holding means,
The second portion of the cleaved substrate deforms after cleaving;
The second portion of the substrate cleaved by the deformation has a step of being held by the second substrate holding means,
A method for cleaving a non-metallic substrate, comprising the step of holding the second portion of the cleaved substrate at a predetermined interval.
By using the apparatus and method of the present invention, after the substrate is cleaved, the second portion of the substrate is deformed to move away from the first portion of the substrate, and the second portion of the substrate is deformed by the deformation. This portion is held by the second substrate holding means and is held in a state where a predetermined interval is maintained as it is.

The invention according to claim 3
A device that cleaves a non-metal substrate into a first portion and a second portion along a cleaving line set on the substrate,
First substrate holding means for holding a first portion of the substrate;
Second substrate holding means for holding a second portion of the substrate;
Means for forming a scribe line on the surface of the substrate from the start end to the end of the planned cutting line;
A moment applying means for applying a bending moment so as to spread the scribe line by following the means for forming the scribe line;
While holding the first portion of the substrate by the first substrate holding means,
A cleaving apparatus for a non-metallic substrate, comprising a mechanism capable of maintaining a posture of the cleaved second portion of the substrate in accordance with deformation after cleaving.

The invention according to claim 4
A method of cleaving a non-metallic substrate into a first portion and a second portion along a planned cutting line set on the substrate,
Placing the substrate on first substrate holding means for holding a first portion of the substrate;
Forming a scribe line on the surface of the substrate from the start to the end of the planned cutting line;
Applying a bending moment so as to spread the scribe line while following the formation of the scribe line, and cleaving the substrate,
While holding the first portion of the substrate by the first substrate holding means,
A method for cleaving a non-metallic substrate, comprising a step of maintaining the posture of the cleaved second portion of the substrate following deformation after cleaving.
By using the apparatus and method of the present invention, after the substrate is cleaved, the second portion of the substrate is moved away from the first portion of the substrate while being held by the second substrate holding means. It is deformed like this, and is held in a state where a predetermined interval is maintained as it is.

  By using the apparatus and method of the present invention, after cutting the substrate to be cut, it is possible to send to the next step without bringing the edges of the first and second portions of the cut substrate into contact with each other. I can do it.

  The substrate cut using the apparatus and method of the present invention can prevent the occurrence of scratches due to recontact of the cut edges, and can maintain the strength of the cut substrate to be cut.

It is a perspective view which shows the outline of the cleaving apparatus by this invention. It is a block diagram which shows the system configuration | structure of the cleaving apparatus by this invention. It is a side view which shows the structure of the board | substrate holding means by this invention. It is a front view which shows the structure of the board | substrate holding means by this invention. It is a side view which shows the structure of the board | substrate holding means of another embodiment by this invention. It is a front view which shows the structure of the board | substrate holding means of another embodiment by this invention. It is a flowchart which shows the cleaving method by this invention.

DESCRIPTION OF EMBODIMENTS Embodiments for carrying out the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing an example of an embodiment of the present invention.
In the figure, the three axes of the orthogonal coordinate system are X, Y, and Z, the XY plane is the horizontal plane, and the Z direction is the vertical direction. In particular, in the Z direction, the direction of the arrow is represented as the top, and the opposite direction is represented as the bottom. The rotation direction of the XY plane with the Z direction as the rotation axis is θ.

  The substrate cleaving apparatus 1 includes a slider mechanism unit 2, a scribe line forming unit 3, a moment applying unit 4, a first substrate holding unit 5, a second substrate holding unit 6, and a control unit 9. It is configured.

  The slider mechanism 2 extends in the X direction, which is attached to the beam portion 22 and a portal-type structure composed of a pair of columns 21 and a beam portion 22 attached so as to connect the columns 21. The structure includes a rail 23 and a slider 24 that can freely move on the rail 23. Further, each support column 21 is mounted on a Y-axis slider mechanism 51 including a rail and a slider extending in the Y direction, which is mounted on the apparatus base 20 of the substrate cutting apparatus 1, and is mounted on the slider 24. The apparatus is structured such that it can freely move in the XY directions on the apparatus base 20 of the substrate cleaving apparatus 1.

  The scribe line forming means 3 is attached on the slider 24, and is in the order of the initial crack forming means 30, the heating beam irradiation means 33, and the cooling means 34 when viewed from the direction of the cutting direction 3v. Arranged.

The initial crack forming means 30 includes an actuator, a wheel holder attached to the actuator, and a scribe wheel attached to the wheel holder. When the actuator moves downward in the Z direction, the wheel holder and the scribe wheel move downward in the Z direction, the scribe wheel is pressed against the substrate 10, and a minute initial crack is made at the cleave start end of the substrate 10. I can do things. The scribe wheel is preferably made of a material harder than the substrate 10, and artificial diamond, tungsten carbide, super hard metal, super hard metal compound, or super hard metal treatment is used.

  The heating beam irradiating means 33 shapes the laser beam emitted from the laser transmitter 31 so as to be a heating beam 33a having a predetermined shape and energy distribution, and can irradiate the heating beam 33a toward the substrate 10. In addition, optical parts such as lenses and mirrors are provided.

  The cooling unit 34 includes a coolant supply unit that supplies a cooling mist 34 a such as a refrigerant made of air, water, other fluids or a mixture, and a cooling nozzle that is a unit that blows the cooling mist 34 a toward the substrate 10. It consists of

  Accordingly, the scribe line forming means 3 has a structure capable of forming a scribe line on the substrate 10 while moving in the direction of the cutting direction 3v.

  The moment applying means 4 is mounted on the slider 24 and can move so as to follow the scribe line forming means 3. The roller 40 can be pressed downward in the Z direction so as to spread the scribe line of the substrate 10 formed by the scribe line forming means 3.

The first substrate holding means 5 includes a θ-axis rotating mechanism 52 attached on the apparatus base 20 and a table 50 attached on the θ-axis rotating mechanism 52.
The substrate 10 is called a first portion 10a of the substrate and a second portion 10b of the substrate across the planned cutting line 11 set on the substrate 10, and the first portion 10a side of the substrate is the first portion 10a. Is held by the table 50 of the substrate holding means 5. Further, the table 50 holds the first portion 10a of the substrate 10 and has a structure that can be rotated in the θ direction.

  The second substrate holding means 6 has a structure capable of holding the second portion 10b of the substrate 10 as will be described in detail later.

  The control unit 9 includes an information input unit 91, an information output unit 92, and a reporting unit 93.

FIG. 2 is a block diagram showing the system configuration of the cleaving apparatus according to the present invention.
As shown in FIG. 2, the control unit 9 includes a control computer 90, and includes an information input unit 91, an information output unit 92, a notification unit 93, an information recording unit 94, It is connected. The control unit 9 includes a device control unit 95, and is connected to the control computer 90 and each device of the cleaving device 1 described later.

Examples of the control computer 90 include those equipped with a numerical operation unit such as a microcomputer, a personal computer, and a workstation.
Examples of the information input means 91 include a keyboard, a mouse, and a switch.
Examples of the information output unit 92 include an image display display and a lamp.

Examples of the reporting means 93 include those that can alert the operator, such as a buzzer, a speaker, and a lamp.
Examples of the information recording means 94 include semiconductor recording media, magnetic recording media, magneto-optical recording media, such as memory cards and data disks.
Examples of the device control unit 95 include devices called programmable controllers and motion controllers.

The equipment control unit 95 includes the slider 24, the initial crack forming means 30, the laser 31, the heating beam irradiation means 33, the cooling means 34, the moment applying means 4, the Y-axis slider mechanism 51, the θ-axis rotating mechanism 52, and the second substrate. By connecting to the holding means 6 and sending a control signal to each device, the following control can be performed.
1) In the slider 24, the scribe line forming means 3 and the moment applying means 4 are accelerated in the X direction at a predetermined speed, moved in a predetermined section at a predetermined speed, decelerated, and stopped. It can be made.
2) The initial crack forming means 30 can be moved up and down in the Z direction.
3) In the laser 31, it is possible to adjust the energy of the heating beam 33a or perform ON / OFF control by adjusting the output or opening / closing an associated shutter.
4) In the heating beam irradiation means 33, the shape and irradiation position of the heating beam 33a can be adjusted.
5) In the cooling means 34, spraying and stopping of the cooling mist 34a can be controlled.
6) In the moment applying means 4, the roller 40 can be moved up and down.
7) In the Y-axis slider mechanism 51, the table 50 is accelerated in the Y direction at a predetermined speed, moved in a predetermined section at a predetermined speed, and then decelerated and stopped, or at a predetermined pitch. It can be stationary after being moved.
8) The θ-axis rotation mechanism 52 can be stationary after rotating the table 50 or changing the angle with the Z direction as the rotation axis.
In addition, other control devices (not shown) such as actuators and pressure switches are connected so that these devices can be operated and stopped.

Setting and changing of the cleaving position and cleaving speed of the substrate 10 and the heating beam 33a are performed using the information input means 91 connected to the control computer 90, and can be confirmed by the information display means 92.
The set application conditions can be registered in the information recording means 94 connected to the control computer 90, and can be read out, edited, and changed as appropriate.

Since the cleaving apparatus 1 has the above-described structure and equipment configuration, it can cleave any place on the substrate 10 along the planned cutting line 11 set on the substrate 10.
[Details of substrate holding mechanism: suction cup holding, pull-in]

  FIG. 3 is a side view showing the structure of the substrate holding means according to the present invention. FIG. 3 is a view of the cleaving apparatus 1 shown in FIG. 1 as viewed from the left side, that is, from the side opposite to the arrow in the X direction. The roller 40 of the moment applying means 4 A state is shown in which the first portion 10a and the second portion 10b of the substrate are pressed downward in the Z direction.

The moment applying means 4 has the following structure in order to hold the roller 40 and the slider 24 used for cleaving the scribed substrate while maintaining a predetermined distance. That is, the breaker support bracket 41 is attached to the side surface of the slider 24, and the roller support bracket 43 is attached via the breaker support shaft 42.
The roller support bracket 43 can be exemplified by a substantially U-shape, and the roller 40 is attached via a roller support shaft 45.

  A stopper 44 is attached to the breaker support bracket 41 so that the roller support bracket does not swing more than necessary, and the roller can swing in the Y direction as long as the roller support bracket does not hit the stopper 44. I am doing. Therefore, after the roller 40 is pressed against the substrate 10 and the substrate 10 is cut, the first portion 10a of the substrate is further sandwiched and held between the roller 40 and the table 50, and further the second portion 10b of the substrate. Can continue to be pressed by the roller 40.

  The optimum condition of the pressing amount is determined based on the result of testing in advance, and is set and registered in the control computer 90 and the information recording means 94.

  The second substrate holding means 6 includes an actuator 61a attached on the apparatus base 20 and a suction cup 60a attached on the actuator 61a. The actuator 61a has a structure that can move the suction cup 60a in the Z direction. Furthermore, a position detector 62a is provided inside the actuator 61a, and has a structure that can move the suction cup 60a to a predetermined position in the Z direction so as to be stationary.

  In a state where the substrate 10 is placed on the table 50, the second portion 10b of the substrate is held at a predetermined interval from the suction cup 60a.

When a scribe line is formed and the substrate 10 is cut by pressing the roller 40, the second portion 10b of the substrate moves downward in the Z direction and contacts the suction cup 60a.
If the inside of the suction cup 60a is previously communicated with a vacuum source, the second board 10b and the suction cup 60a come into contact with each other, so that the inside of the suction cup 60a is in a predetermined negative pressure state.

  The pressure in the suction cup 60a is measured, it is detected that the predetermined negative pressure is reached, and the actuator 61a is moved downward in the Z direction using the occurrence of the predetermined negative pressure as a trigger so that the state can be maintained. Keep it. By doing so, after the board | substrate 10 is cut, the 2nd board | substrate 10b can be moved to a Z direction, and the state can be hold | maintained.

  The suction cup 60a can be exemplified by a suction cup made of an elastic resin, or a flat metal or resin provided with holes and grooves on the upper surface so that negative pressure adsorption can be performed. It is preferable to use a material.

  FIG. 4 is a front view showing the structure of the substrate holding means according to the present invention. FIG. 4 is a view of the cleaving apparatus 1 shown in FIG. 1 as viewed from the front side of the page, that is, from the side opposite to the arrow in the Y direction.

The second substrate holding means 6 has suction cups 60b to 60h and air cylinders 61b to 61h having the same configuration as the suction cup 60a and the air cylinder 61a so as to hold the second portion 10b of the cut substrate. Are arranged and arranged in the cleaving direction 3v.
The suction cups 60a to 60h are mounted on the air cylinders 61a to 61h mounted on the apparatus base 20, and the upper ends of the suction cups 60a to 60h and the lower surface of the second portion 10b of the substrate 10 are predetermined. It is aligned with a gap between them.

  The suction cups 60a to 60h are each connected to a vacuum source via an air pipe and an open / close valve. Pressure switches 62a to 62h are connected between the suction cups 60a to 60h and the corresponding open / close valves, and the pressure inside the suction cups 60a to 60h can be detected. The air cylinders 61a to 61h are provided with position detectors 63a to 63h for detecting upper and lower limit positions, respectively, and each cylinder vertical movement air pipe is connected to each cylinder vertical movement control valve 64a to h. Via an air supply source.

As shown in FIG. 2, the air cylinders 61a to 61h, the position detectors 63a to 63h, and the cylinder vertical movement control valves 64a to 64h are connected to the device control unit 95, and are disposed inside the suction cups 60a to 60h. The pressure and the positions of the air cylinders 61a to h can be understood by the control unit 9.
Since the cleaving apparatus 1 of the present invention has the above-described structure, the second portion 10b of the cleaved substrate is divided into the first portion of the substrate while cleaving the substrate 10 following the formation of the scribe line. It can be retreated to move away from 10a. Therefore, the cleaving apparatus 1 can hold the cleaved first portion 10a and the second portion 10b of the substrate 10 at a predetermined interval without recontacting each other.
The second portion 10b of the cleaved substrate 10 has a structure that allows the negative pressure of the suction cups 60a to 60h to be released to the atmosphere and taken out.
[Another embodiment: Profile maintenance]

  FIG. 5 is a side view showing the structure of the substrate holding means according to another embodiment of the present invention. The substrate cleaving apparatus 1 can be configured to include the second substrate holding means 7 of another embodiment instead of the second substrate holding means 6 described above.

The suction pad 70a is attached on the actuator 71a attached on the apparatus base 20, and the substrate 10 is supported by the suction pad 70a.
The suction pad 70a can be exemplified by a suction cup made of an elastic resin, or a flat metal or resin provided with holes and grooves on the upper surface so that negative pressure suction can be performed. It is preferable to use these materials.
The actuator 71a is provided with a position detector 72a inside, and has a structure capable of moving the suction pad 70a to a predetermined position in the Z direction so as to be stationary.

  Further, the suction pad 70a of the second substrate holding means 7 is arranged so as to come into contact with the second portion 10b of the substrate when the substrate 10 is placed on the table 50 of the first substrate holding means 5. Yes. Here, after the substrate 10 is placed and before the alignment operation is performed, the suction pad 70a is not suctioned by negative pressure, and the second portion 10b of the substrate can freely move in the XYθ direction. Then, after the alignment operation of the substrate 10 is performed, the second portion 10b of the substrate is held by the suction pad 70a by negative pressure suction and cannot move freely in the XYθ direction.

FIG. 6 is a front view showing the structure of the substrate holding means according to another embodiment of the present invention.
The second substrate holding means 7 has the same configuration as the suction pad 70a, the actuator 71a, and the position detector 72a described above so that the second portion 10b of the substrate can be held. 71b-h and position detectors 72b-h are arranged and arranged in a cleaving direction 3v.
Although not shown, the actuators 71a to 71h and the position detectors 72a to 72h are connected to the device control unit 95, and the current position information when the actuators 71a to 71h are moved up and down is the control unit. It can be seen at 9.

  The distance between the breaking point and the actuators 71a to 71h is calculated from the current position of the slider 24 or the relationship between the breaking speed and the time after passing through the roller 40, and the actuators 71a to 71h are appropriately moved downward in the Z direction.

The descent operation settings such as the descent timing, descent movement amount of the actuators 71a to 71h, and whether or not the movement amount is changed with time (so-called descent speed profile is set), refer to empirical rules and prior test results. And set in advance.
It can be said that the lowering operation setting is optimal under the condition that the actual cleaving point can keep an appropriate distance from the scribe line forming point (generally near the spray position of the cooling mist 34a). By setting to such a condition, a gap between the substrates after the cleaving is maintained, and a good fractured surface can be obtained.
[Operation flow]

FIG. 7 is a flowchart showing the cleaving method according to the present invention.
The substrate 10 is placed on the first substrate holding means 5 and the second substrate holding means 6 (s101).
The substrate 10 is sucked and held by the first substrate holding means 5 (s102). In the second substrate holding means 6, the suction cups 60a to 60h are communicated with a vacuum source to be in a negative pressure state. Further, in the case of using another form of the second substrate holding means 7 instead of the second substrate holding means 6, the inside of the suction pads 70a to 70h is brought into a negative pressure state so that the second portion 10b of the substrate is Hold by adsorption.

Subsequently, the alignment mark of the substrate 10 is read (s103), and the scribe line forming means 3 is run along the preset cutting line 11 (s104), so that the initial crack forming means 30 is formed at the edge portion of the substrate 10. Use the to make a small crack.
In this state, the substrate 10 is irradiated with the heating beam 33a, followed by the heating beam 33a, the cooling mist 34a is sprayed on the substrate 10, and laser scribing of the substrate 10 is performed (s105).

The roller 40 of the bending moment applying means 4 that moves following the scribe line forming means 3 is pressed against the substrate 10 to extend the cracks on the surface so that the laser-scribed portion is opened, and the substrate 10 is cleaved. . (S106)
The suction cups 60a to 60h of the second substrate holding means are gradually displaced downward in the Z direction to hold the position (s107).

It is determined whether or not the cutting of one line has been completed (s108), and if cutting is in progress, steps s105 to s107 are repeated.
When the cutting of the substrate 10 is completed, the travel of the scribe line forming means is stopped (s109).
The adsorption of the second substrate holding means 6 is released (s110), and the second portion 10b of the substrate is taken out (s111).

It is determined whether or not all lines have been cleaved (s112). If cleaving still occurs, the placement location of the substrate 10 is changed, and s104 to s111 are repeated.
When all the cleaving is completed, the suction of the first substrate holding means 5 is released (s113), and the first portion 10a of the substrate is taken out from the table 50 (s114).

The cleaved substrate 10 is cleaved using the method of steps s101 to s114 described above.
By doing so, the first portion 10a of the cleaved substrate and the second portion 10b of the cleaved substrate do not contact each other's edges after cleaving.
After the substrate 10 (in particular, a brittle material such as glass) is cleaved using the above-described apparatus and method, it is possible to prevent a decrease in strength, thereby contributing to an improvement in yield and product quality in the production process.

DESCRIPTION OF SYMBOLS 1 Cleaving device 2 Slider mechanism 3 Scribe line forming means 3v Cleaving direction 4 Moment applying means 5 First substrate holding means 6 Second substrate holding means 7 Second substrate holding means 9 Control unit 10 Substrate 10a First substrate Part 10b Second part of substrate 11 Planned cutting line 20 Device base 21 Column 22 Beam part 23 Rail 24 Slider 30 Initial crack forming means 31 Laser 33 Heating beam irradiation means 33a Heating beam 34 Cooling means 34a Cooling mist 40 Roller 41 Breaker support Bracket 42 Breaker support shaft 43 Roller support bracket 44 Stopper 45 Roller support shaft 50 Table 51 Y-axis slider mechanism 52 θ-axis rotation mechanism 60a-h Suction cup 61a-h Air cylinder 62a-h Pressure switch 63a-h Position detector 64a-h Control valve 70a-h Contact pads 71a-h Actuators 72a-h Position detector 90 Control computer 91 Information input means 92 Information display means 93 Information means 94 Information recording means 95 Device control unit

Claims (4)

A device that cleaves a non-metal substrate into a first portion and a second portion along a cleaving line set on the substrate,
First substrate holding means for holding a first portion of the substrate;
Second substrate holding means for holding the second portion of the substrate after cleaving;
Means for forming a scribe line on the surface of the substrate from the start end to the end of the planned cutting line;
A moment applying means for applying a bending moment so as to spread the scribe line by following the means for forming the scribe line;
While holding the first portion of the substrate by the first substrate holding means,
The second part of the cleaved substrate is held by the second substrate holding means by deformation after cleaving, and the first part of the cleaved substrate and the second part of the cleaved substrate And a non-metallic substrate cleaving apparatus, comprising a mechanism capable of holding at a predetermined interval. A method of cleaving a non-metallic substrate into a first portion and a second portion along a planned cutting line set on the substrate,
Placing the first part of the substrate on the first substrate holding means and the second part of the substrate on the second substrate holding means;
Forming a scribe line on the surface of the substrate from the start to the end of the planned cutting line;
Applying a bending moment so as to spread the scribe line while following the formation of the scribe line, and cleaving the substrate,
While holding the first portion of the substrate by the first substrate holding means,
The second portion of the cleaved substrate deforms after cleaving;
The second portion of the substrate cleaved by the deformation has a step of being held by the second substrate holding means,
A method for cleaving a non-metal substrate, comprising the step of holding the second portion of the cleaved substrate at a predetermined interval. A device that cleaves a non-metal substrate into a first portion and a second portion along a cleaving line set on the substrate,
First substrate holding means for holding a first portion of the substrate;
Second substrate holding means for holding a second portion of the substrate;
Means for forming a scribe line on the surface of the substrate from the start end to the end of the planned cutting line;
A moment applying means for applying a bending moment so as to spread the scribe line by following the means for forming the scribe line;
While holding the first portion of the substrate by the first substrate holding means,
A cleaving apparatus for a non-metallic substrate, comprising a mechanism capable of maintaining a posture of the cleaved second portion of the substrate in accordance with deformation after cleaving. A method of cleaving a non-metallic substrate into a first portion and a second portion along a planned cutting line set on the substrate,
Placing the substrate on first substrate holding means for holding a first portion of the substrate;
Forming a scribe line on the surface of the substrate from the start to the end of the planned cutting line;
Applying a bending moment so as to spread the scribe line while following the formation of the scribe line, and cleaving the substrate,
While holding the first portion of the substrate by the first substrate holding means,
A method for cleaving a non-metallic substrate, comprising the step of maintaining the posture of the cleaved second portion of the substrate following deformation after cleaving.

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