JP2011086857A - Component feeder and electronic component mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly reliable component feeder that can simplify the recovery of a feeding tape or can perform secure automatic mounting of the feeding tape, to provide a component feeder allowing easy arrangement such where a cover tape does not interfere with mounting by the component feeder, and to provide a component mounting apparatus that improves operation rate using the component feeder. <P>SOLUTION: A first feature is that when an electronic component is sucked, with a fusion section to which a carrier tape and a cover tape are fused at the outside along the longitudinal direction of both sides of a feeding tape of an electronic component housing section, at a position of one of fusion sections and its proximity region, the cover tape is cut. A second feature is that, in addition to the first feature, the proximity region is a region inside the first fusion section and up to the end section of the electronic component. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component supply device and an electronic component mounting device, and more particularly to a component supply device and an electronic component mounting device that can easily process a used supply tape.

The electronic component mounting apparatus supplies an electronic component with a supply tape, sucks the electronic component from the supply tape, and mounts the electronic component on a printed board. The supply tape after adsorbing the electronic components is discarded as waste. As shown in FIG. 3, the supply tape includes a carrier tape 61 that houses electronic components and a cover tape 62 that prevents the electronic components from popping out.
As a prior art relating to the processing of the supply tape, there is Patent Document 1. In Patent Document 1, the cover tape is peeled off from the carrier tape and stored in a storage portion provided on the rear side of the component supply device so as not to obstruct the suction portion on the tip side of the component supply device. On the other hand, the carrier tape is sent out from the tip of the component supply device, cut and discarded.

  In recent years, it has been desired to improve the operating rate of the electronic component mounting apparatus. For this purpose, it is important to reliably supply the electronic components and complete the replenishment time or setup change of the electronic components in a short time. As one method for that purpose, as shown in Patent Document 2, it has been proposed to automatically attach a supply tape.

JP 2009-88039 A JP 2005-539370 A

In order to reliably perform the automatic mounting of the supply tape, it is necessary to secure a working space in the vicinity of the supply tape insertion port on the rear side of the component supply device. However, in the method according to the prior art disclosed in Patent Document 1, the storage portion becomes an obstacle.
In addition, the number and type of electronic components to be mounted on a single printed circuit board increase, and the number of component supply devices used increases accordingly. Therefore, it is desired to simplify the collection of the supply tape, instead of collecting the cover tape and the carrier tape separately at two locations.

Accordingly, a first object of the present invention is to provide a component supply apparatus that can simplify the collection of a supply tape.
A second object of the present invention is to provide a highly reliable component supply apparatus capable of automatically mounting a supply tape reliably.
Furthermore, a third object of the present invention is to provide a component supply device that can be easily set up without the cover tape hindering automatic mounting of the supply tape, and by using it, an electronic component mounting device having a high operating rate is provided. Is to provide.

  In order to achieve the first or second object of the present invention, when an electronic component is adsorbed, a fusion portion for fusing a carrier tape and a cover tape to the outside on both sides in the longitudinal direction of the supply tape of the electronic component storage portion The first feature is that the cover tape is cut at a position within one of the fused portions and its adjacent region.

  In order to achieve the first or second object of the present invention, when the electronic component is sucked, the cover tape is cut at any position outside the both sides in the longitudinal direction of the supply tape of the electronic component. This is the second feature.

  Furthermore, in order to achieve the first or second object of the present invention, in addition to the first feature, the proximity region is a region inside the one fused portion to an end portion of the electronic component. Is the third feature.

  In order to achieve the first or second object of the present invention, in addition to the second feature, a fourth feature is that the adjacent region is an adjacent portion of the one fused portion.

  Furthermore, in order to achieve the first or second object of the present invention, in addition to the first or second feature, the cut cover tape is prevented from coming to the upper part of the suction hole of the electronic component. The fifth feature.

  In order to achieve the first or second object of the present invention, in addition to the first or second feature, the cut cover tape avoids contact with a sprocket of the supply tape driving means. Six features.

  Furthermore, in order to achieve the first or second object of the present invention, in addition to the first or second feature, the seventh feature is that the cutting is performed by pressing the cover tape against a cutting means. .

In order to achieve the first or second object of the present invention, in addition to the first feature, the component supply device has an eighth feature in which the supply tape is automatically mounted from the outside.
Finally, in order to achieve the third object of the present invention, in the electronic component mounting apparatus including the component supply apparatus having any one of the first to eighth features, the electronic component mounting apparatus is based on information from the component supply apparatus. A ninth feature is to control the mounting of the component supply device or the electronic component.

ADVANTAGE OF THE INVENTION According to this invention, the components supply apparatus which can simplify collection | recovery of a supply tape can be provided.
Further, according to the present invention, it is possible to provide a highly reliable component supply apparatus that can automatically and reliably mount a supply tape.
Furthermore, according to the present invention, it is possible to provide a component supply device that can be easily set up without the cover tape hindering automatic mounting of the supply tape, and by using the component supply device, it is possible to provide an electronic component mounting device with a high operating rate.

It is a top view of the electronic component mounting apparatus in this embodiment. It is a perspective view of the components supply cart in this embodiment. It is a figure which shows the example of the supply tape used by this embodiment. It is a figure which shows 1st Embodiment of a components supply apparatus. It is a figure which shows embodiment of the supply tape pressing part. It is a figure which shows 1st Embodiment of a pressing part with a cutting means. It is BB sectional drawing in FIG. It is a figure explaining operation | movement of the pressing part with a cutting means which is 1st Embodiment. It is a figure which shows 2nd Embodiment of the pressing part with a cutting means. It is a figure explaining operation | movement of the pressing part with a cutting means which is 2nd Embodiment. It is a figure which shows 3rd Embodiment of a components supply apparatus and a pressing part with a cutting means.

  Hereinafter, an embodiment of an electronic component mounting apparatus and a component supply cart 50 will be described with reference to the drawings. In the present invention, the electronic component mounting apparatus 1 refers to an apparatus that does not include the component supply cart 50. In the following description, the electronic component mounting apparatus 1 is simply referred to as a main body 1 as necessary. FIG. 1 is a plan view of the main body 1. The main body 1 has a total of four blocks (two symbols LU and LD on the upper left and lower left, two upper and lower blocks RU and RD on the right) (a reference is basically written only for the LU block) and a control device 80. Each block has a component supply area 13 provided with a large number of tape feeders, a mounting head 6, a mounting head body 11 that moves the mounting head, and a component recognition camera 19 that captures the suction holding state of electronic components in the suction head. Is provided. The mounting head body 11 moves to the left and right on the left / right moving rail 18 constituted by the linear motor, and moves the up / down moving rail 16 constituted by the linear motor up and down like the left / right moving rail 18.

  With such a configuration, the mounting head 6 fixed to the mounting head body 11 sucks the electronic component from the component supply area 13, monitors the suction holding state of the electronic component by the component recognition camera 19, The electronic component moved to the position and attached to the substrate P is mounted.

  Such an operation is performed in four blocks. Therefore, in the center, there are four substrate chutes 5a to 5d for transporting the substrate P, the upper two substrate chutes 5c and 5d pass the upper block substrate transport line U, the lower two substrate chutes 5a, 5b constitutes a substrate transport line D for the lower block. The substrate P is distributed by the delivery unit 7 and carried into the substrate transport line U or D. In the following drawings, the conveyance of the substrate P is defined as the X direction, the direction perpendicular to X as the Y direction, and the direction perpendicular to X and Y as the Z direction. A direction in which the component supply cart 50 is mounted on the main body 1 in the lower block is defined as a Y + direction.

  FIG. 2 is a perspective view showing the configuration of the component supply cart 50 in the present embodiment. The component supply cart 50 is mounted in the component supply area 3 shown in FIG.

  The component supply cart 50 is roughly composed of a base portion 51, a component supply device fixing portion 52 for fixing the component supply device shown in FIG. 4, a handle portion 53, and a component supply reel storage portion 54 for storing a component supply reel. ing. The base portion 51 has four wheel fixing portions 51a for fixing moving wheels (not shown) at four corners, and the component supply cart 50 is fixed when the component supply cart 50 is fixed to the main body of the electronic component mounting apparatus 1. It has the lock pin 51b which fixes 50 to a floor surface. The component supply device fixing unit 52 is provided at the upper part of the component supply cart 50, and the component supply device fixing unit guide 52c guides the component supply device fixing unit 2k of the component supply device 2 shown in FIG. The component supply device connector 2d of the component supply device 2 is connected to the component supply device signal connector 52d. The component supply device fixing portion connector 52c is regularly arranged on the component supply device base 52a so that a large number of component supply devices can be mounted. Each component supply device is supplied with a supply tape 60 loaded with electronic components from the supply reel storage unit 54 to each component supply device 2.

  Further, both ends of the component supply device base 52a are provided with component supply device guides 52e that play a role of sliding a cart guide plate (not shown) provided on the main body 1 when the component supply cart is inserted into the main body 1. is there. Further, the component supply device guide 52 e has a positioning hole 52 b for fixing the component supply cart 50 to the main body 1. Finally, there is a handle portion 53 so that the component supply cart 50 can be moved, and the component supply cart 50 is inserted into the main body by being moved in the Y direction which is the direction of the main body 1 by the handle 53a. At this time, the front end 53c of the side plate 53b of the handle portion 53 serves as a stopper that prevents the component supply cart 50 from being inserted any further.

  FIG. 3 is a view showing an example of the supply tape 60 used in the present apparatus. The supply tape basically includes a carrier tape 61 having a recessed storage portion 63 for storing the electronic component 4 and a cover tape 62 covering the carrier tape. On both ends of the storage portion 63, there are belt-like fusion portions 65a and 65b for fusing both tapes 61 and 62 together. Further, the carrier tape has a sprole hole 64 for moving the supply tape 60 by engaging with a sprocket of a component supply device described later.

  Next, the structure of 1st Embodiment of the components supply apparatus 2 is demonstrated using FIG. The component supply device 2 has a structure that can automatically mount a supply tape and suck an electronic component. Accordingly, the component supply apparatus is roughly classified into a supply tape automatic mounting unit 20 that automatically mounts the supply tape 60 on the component supply device 2, a sprocket drive unit 30 that moves the electronic component 4 to the suction position S, and automatic mounting. A supply tape pressing unit 70 that presses the supply tape 60 against a cutting means, which will be described later, and a signal from an internal sensor, which will be described later, are controlled to control these units, and signals are exchanged with the main body 1 via the interface 81. It comprises a supply device control unit 28 for performing In addition, 2k is a component supply apparatus fixing | fixed part which mounts the component supply apparatus 2 in the component supply cart 50, 2d comprises the interface 81, and the signal of the main body 1 via the component supply cart 50 and the component supply cart 50 is received. It is a component supply device connector for giving and receiving.

  The component supply apparatus having the above-described configuration detects the supply tape 60 inserted by the worker by the supply tape automatic mounting unit 20 and moves it to the suction position S side, and the supply tape pressing unit 70 performs cutting means described later. The supply tape is pressed against 41, and the electronic component is picked up by the sprocket drive unit 30. These controls are performed by the supply device control unit 28 in cooperation with the control device 80 of the main body 1.

  Next, each part will be briefly described. First, the supply tape automatic mounting unit 20 will be described. The role of the automatic supply tape mounting unit 20 is primarily to set the supply tape 60 in the component supply device 2 and secondly, during the electronic component suction operation by the mounting head 6 (see FIG. 1). An auxiliary supply tape drive is performed in cooperation with the drive of a sprocket drive unit 30 described later.

  The supply tape automatic mounting unit 20 has two systems A and B so that even if one supply tape runs out, the remaining supply tape can be dealt with immediately. The A and B systems are different in arrangement but have the same configuration, and the same configuration is indicated by the same number and is distinguished by subscripts A and B. Here, the A system will be described as a representative. In the description, the subscript A is omitted.

  The supply tape automatic mounting unit 20 includes a mounting roller 21 that is a rotating unit in contact with the supply tape 60, a mounting roller drive motor 23 that is a rotation driving unit that drives the mounting roller 21 via the timing belt 22, and a mounting roller 21. A mounting pressing means (pressing means) 25 for pressing the supply tape 60, an insertion detection sensor 26 for detecting that the supply tape 60 is inserted into the mounting pressing means 25 side, and the supply tape 60 are joined positions of the A and B systems. It consists of an insertion confirmation sensor 27 that confirms that it has been inserted before M.

  When the supply reel (not shown) of the supply tape automatic mounting unit 20 is installed in the supply reel storage unit 54 of the component supply apparatus cart 50 and one end of the supply tape 60 is inserted from the opening 26c, the insertion detection is performed. The sensor 26 detects the supply tape 60, and the supply device controller 28 drives the mounting roller drive motor 23. The supply tape 60 is reliably delivered to the suction position side by the mounting roller 21 and the mounting pressing means 25. When the leading end of the supply tape 60 comes to the position of the insertion confirmation sensor 27, the supply device control unit 28 stops the mounting roller drive motor 23 according to the confirmation result. Thereafter, the tip of the supply tape of the system selected from the two systems A and B is sent to the next supply tape pressing unit 70 by the mounting roller drive motor 23. In the above embodiment, the mounting roller is used as the rotating portion of the supply tape automatic mounting portion 20, but a sprocket may be used.

Next, the configuration and operation of the supply tape pressing unit 70 will be described. The supply tape pressing unit 70 has two roles. First, when the leading end of the supply tape comes, the leading end of the cover tape 62 is pressed against the cutting means in a stable or reliable manner as will be described later, and the cover tape is cut. Secondly, the cover tape 62 is reliably fed to the sprocket drive unit 30 and the roles of driving the supply tape and cutting the cover tape 62 are handed over, so that it does not become a load for driving the supply tape of the sprocket drive unit. That is.
For this purpose, the supply tape pressing unit 70 in this embodiment engages with the sprocket hole 64 of the supply tape 60 to move the supply tape, and the rotational drive that drives the insertion roller 71 via the timing belt 72 or the like. An insertion roller drive motor 73 as means and an insertion portion tape guide pressing means 75 shown in FIG. 5 are provided.

  When cutting the end of the cover tape, as shown in FIG. 5, a plurality of rollers 71 provided at equal intervals corresponding to the pitch of the sprocket holes 64 are pressed by springs 75, and a plurality of rollers 71 are driven by an insertion roller drive motor 73. Rotate to move the supply tape. On the other hand, the rotation of the insertion roller drive motor is stopped when the electronic component is attracted, and the supply tape 60 moves while sliding on the roller 71 by the drive of the sprocket drive unit, thereby reducing the load of the supply tape drive of the sprocket drive unit. . The insertion portion tape guide pressing means 75 is a guide that facilitates engagement of the roller 71 with the supply tape 60, and is constituted by a leaf spring in this figure. Reference numeral 76 denotes an insertion roller rotating body that holds and rotates the insertion roller 71.

  Next, the configuration and operation of the sprocket drive unit 30 in the present embodiment and an embodiment of the pressing unit 40 with cutting means that is the most characteristic of the component supply device 2 according to the present embodiment will be described.

  In FIG. 4, the sprocket drive unit 30 controls the movement of the supply tape 60 in accordance with the movement of the mounting head of the main body 1 when the electronic component is picked up from the component supply device.

  For this purpose, the sprocket drive unit 30 includes a sprocket 31 having a steep gear for driving a sprocket hole 64 (see FIG. 3) provided in the supply tape 60, a worm wheel 32 and a worm gear 33 provided concentrically. The sprocket drive motor 34 that drives the sprocket 31 via the spring, and the supply tape 60 is pressed against the tape chute (moving path along which the supply tape 60 moves while sliding) 2S by the spring 35 so that the sprocket can reliably deliver the supply tape 60. It has a pressing unit 40 with cutting means and a positioning correction sensor 36 for positioning the suction position. The positioning correction sensor 36 provided in front of the pressing unit 40 with the cutting means images the LED 37 and the sprocket hole 64 that are illuminated from above in order to detect the position of the sprocket hole 64 provided on the side of the supply tape 60. Imaging camera 84.

  As shown in FIG. 3, the supply tape 60 is provided with sprockets 64 at equal intervals in two places of the storage part 63 for electronic components. Therefore, when the sprocket 64 arrives at the suction position S, the position of the sprocket (not shown) N (integer) before the sprocket (not shown) is detected by the imaging camera 84, and the suction position is determined from the detected position. S is converted and the position of the supply tape 60 is controlled by the sprocket drive unit 30.

  FIG. 6 is a perspective view showing an embodiment of the pressing unit 40 with cutting means, which is opened for viewing the state of the cover tape guide 42. FIG. 7 is a cross-sectional view taken along the line BB in FIG. 6 and shows the posture after the cover tape 62 is cut as will be described later. The pressing unit with cutting means will be described with reference to FIG.

  The pressing part 40 with cutting means is a posture of the pressing cover 46 pressed against the tape chute 2S which is the moving path, the cutter 41 which is cutting means for cutting the cover tape 62, and the cover tape 62 being peeled off from the carrier tape 61 after being cut. And a cover tape guide 42 having a function of a suction hole avoiding means for avoiding the cover tape from reaching the top of the suction hole of the electronic component, and a guide having the suction hole 45 of the electronic component fixed to the cover tape guide 42 A fixing plate 43, spring mounting holes 44 for attaching springs 35 (see FIG. 4) provided at the four corners on both sides for pressing the pressing cover 46 against the supply tape, and an outlet guide 47 for guiding the supply tape coming out of the pressing cover 46 are provided. . A plurality of 46a shown in FIG. 7 are provided on the pressing cover 46 and play a role of pressing the supply tape 60 together with the cover tape guide 42 against the tape chute 2S.

  Next, operation | movement of the pressing part 40 with a cutting means is demonstrated using FIG. 8 (a) to 8 (d) are AA to DD sectional views shown in FIG.

First, as shown in FIG. 8A, when the supply tape 60 comes to the pressing portion 40 with the cutting means, the cover tape 62 on the upper surface of the supply tape 60 is cut by the cutter 41 from its tip. The cut position is in the proximity region 67 indicated by a broken line inside the belt-like fused portion 65a shown in FIG. Cutting at the fused portion 65a is not preferable because the fused portion contaminates the cover tape guide 42. On the other hand, if the carrier tape 61 is cut on the center side of the storage portion 63 (see FIG. 3), in other words, on the center side of the storage portion movement path 48 that is the movement path of the storage portion 63, the electronic component 4 is caused by vibration or the like accompanying movement. Will move up and down, and the possibility of damaging electronic components increases. The size of the electronic component 4 is slightly smaller than the size of the storage portion 63, and the distance between the electronic component 4 and the storage portion 63 is small. For this reason, the electronic component 4 does not move much in the left-right direction, and is sucked by the suction nozzle 17 (see FIG. 4) near the center of the storage portion 63.
Therefore, it is desirable to set the proximity region 67 at a position where there is a low possibility of damaging the electronic component inside the fused portion 65a, for example, a region up to the end of the electronic component. In particular, an adjacent portion adjacent to the fused portion 65a is desirable. In short, it is important to cut the cover tape 62 at a position where the electronic components are not damaged.

  The cut cover tape 62 rises while being rolled as shown in FIG. 8B along the cover tape guide 42 formed substantially vertically as shown in FIG. The cover tape sliding surface of the cover tape guide has a guide curve that first draws a curve toward the center and then draws a line parallel to the side of the pressing cover 46. In the present embodiment, the cover tape hits the upper guide fixing plate 43 while the cover tape 62 is curved, and is then wound along the guide fixing plate 43. And as shown in FIG.8 (c), it is rolled up to the welding part 65 (c). After that, the robot moves while maintaining this posture. FIG. 8D shows a state in the suction hole 45 of the electronic component. The cover tape 62 moves between the suction hole and the sprocket 31 of the sprocket drive unit 30. Since the cut surface side of the cover tape is wound up in a spiral shape, the cover tape may be bent downward, and in order to avoid contact with the sprocket 31, a contact avoiding plate 49 as a sprocket avoiding means is provided. You may provide from the position before that according to the bending condition. After that, it proceeds in the posture shown in FIG. 8D and comes out from the outlet guide 47 at the tip of the pressing portion 40 with cutting means. When coming out from the exit guide, the cover tape 62 is joined together with the carrier tape 61 on which the electronic components are adsorbed, and is collected by a collection unit (not shown).

  As described above, according to the present embodiment of the component supply device 2 having the pressing means 40 with the cutting means according to the present embodiment described above, the cover tape of the supply tape can be used after being removed from the component supply device 2 by being provided with a cutter. The carrier tape is integrated and can be collected together for easy disposal.

  In addition, according to the present embodiment, the cutting position of the cover tape by the cutter is the region inside the fusion part opposite to the sprocket hole, so that the electronic component can be supplied stably and reliably without being damaged. It is possible to provide a highly efficient component supply device.

  Furthermore, according to this embodiment, it is possible to provide a component supply device that can automatically and reliably mount a supply tape.

  In addition, according to the present invention, a component supply device that can be easily set up without the cover tape hindering the mounting of the component supply device is provided, and by using this, the operating rate of the electronic component mounting device can be improved.

  Next, a second embodiment of the component supply device and the pressing unit with the cutting means according to the present invention will be described with reference to FIGS. In 2nd Embodiment, the components supply apparatus 2 is the same as 1st Embodiment, and the pressing part with a cutting means differs. FIG. 9 shows a pressing unit with cutting means 40B according to the second embodiment, and FIG. 10 is a view corresponding to FIG. 8 for explaining the first embodiment, from the AA sectional view in FIG. D sectional drawing is shown. In FIG. 9 and FIG. 10, those having the same functions as those of the first embodiment are denoted by the same reference numerals.

  The difference from the first embodiment of the pressing means with cutting means 40B according to the second embodiment is that the cut position of the cover tape 62 is provided on the sprocket hole 64 side as shown in FIG. . For this purpose, as shown in FIG. 9, the cutter 41, which is a cutting means, moves to the center side, and the cover tape guide 42 has a line-symmetric curve with respect to the moving direction of the supply tape.

  Accordingly, the cover tape 62 cut at the position shown in FIG. 10 (a) moves while being lifted to the right side in the drawing as shown in FIGS. 10 (b) and 10 (c), unlike FIG. As shown in FIG. 10 (d), at the position of the suction hole, it passes through the side portion so as not to hinder the suction processing and moves toward the outlet guide 47. As shown in FIG. 10D, this embodiment has an advantage that there is no risk of contact between the cover tape and the sprocket. In the present embodiment, a tape chute 2S intended for small electronic components as compared with the first embodiment is used. In the case of a small electronic component, it is undeniable that it becomes easy to provide a cutter on the center side, but there is no problem in providing it on the center side even if the electronic component becomes large.

  As described above, the second embodiment also exhibits the same effects as those of the first embodiment except for the effects unique to the second embodiment.

  Finally, a third embodiment of the component supply device and the pressing unit with the cutting means will be described with reference to FIG. The component supply device 2A according to the second embodiment is not a type that automatically mounts a supply tape, but includes a supply reel that winds the supply tape and a take-up reel that winds up the used supply tape after the electronic components are adsorbed. This is a so-called cassette type.

  The electronic component supply apparatus 2A presses a supply reel 131 for storing a supply tape 60 for supplying electronic components to a case 139 having a handle 138 for carrying, and a supply tape 60 from a supply reel against a tape chute (not shown). After the electronic component is adsorbed by the pressing portion 40A with cutting means for cutting the cover tape, the sprocket 31 for feeding the supply tape 60 from the supply reel, and the adsorption nozzle 17 of the mounting head 6 of the main body 1 before the sprocket 31, The supplied supply tape 60U is brought into a substantially vertical state, and a space roller 135 that secures and avoids an insertion space for a camera support 83S, which will be described later, and the supply tape 60U are wound through a pair of horizontal conversion guide rollers 136A and 136B. A take-up reel 133.

  In this embodiment, the sprocket 31 and the take-up reel 133 are driven by the sprocket drive unit 84M or the take-up reel drive unit 82M in the cassette control unit 80A placed on the component supply cart 50. Positioning of the suction position by the sprocket hole 64 is performed by imaging the sprocket hole with the imaging camera 84 and the LED 37 provided on the camera support 83S.

  The pressing unit with cutting means 40A according to the second embodiment has the same basic structure as the pressing unit with cutting means 40 shown in FIG. First, since the sprocket 31 is not inside, the contact avoidance plate 49 is unnecessary. Secondly, the position of the suction hole 45 is more on the tip side.

  As described above, according to this embodiment of the component supply device 2A having the pressing unit with cutting means 40A of the present embodiment described above, the cover of the supply tape is provided after coming out of the pressing unit with cutting means 40A by being provided with a cutter. The tape and carrier tape are integrated and can be collected together on a take-up reel for easy disposal.

  In addition, according to the present embodiment, the cutting position of the cover tape by the cutter is the region inside the fusion part opposite to the sprocket hole, so that the electronic component can be supplied stably and reliably without being damaged. It is possible to provide a highly efficient component supply device.

  Furthermore, according to the present embodiment, it is possible to provide a highly reliable component supply device and use it to improve the operating rate of the electronic component mounting device.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

1: Electronic component mounting device 2, 2A: Component supply device 2S: Tape chute 3: Component supply area 4: Electronic component 5: Substrate chute 11: Mounting head body 16: Mounting head 17: Suction nozzle 20: Supply tape automatic mounting unit 25: Mounting pressing means 25a: Pressing plate 26: Insertion detection sensor 27: Insertion confirmation sensor 28, 28A: Supply device control section 30, 84M: Sprocket drive section 31: Sprocket 34: Sprocket drive motor 40, 40A: Press with cutting means Part 41: Cutting means (cutter)
42: Adsorption hole avoidance means (cover tape guide)
45: suction hole 46: pressing plate with cutter 49: sprocket avoiding means (contact avoiding plate)
50: Component supply cart 52: Component supply device fixing portion 60: Supply tape 61: Carrier tape 62: Cover tape 64: Sprocket hole 70: Supply tape pressing portion 71: Insertion roller 73: Insertion roller drive motor 80: Control device 80A : Supply device control unit 82M: take-up reel drive unit 131: supply reel 133: take-up reel.

Claims (15)

A carrier tape having a storage portion for storing an electronic component and a cover tape covering the carrier tape, and rotated by engaging with a sprocket hole of a supply tape moving on a tape chute, In the component supply device having a driving means for moving the suction tape to the suction position where the tape is sucked from the outside, and a pressing portion that presses the supply tape against the tape chute,
The supply tape has a fusion part for fusing the carrier tape and the cover tape to the outside of both sides of the supply part in the longitudinal direction of the storage part, and the pressing part is one of the fusion parts, A component supply device comprising cutting means for cutting the cover tape at a position within the proximity region.   2. The component supply device according to claim 1, wherein the one fusion part is a fusion part on a side opposite to the sprocket hole.   2. The component supply device according to claim 1, wherein the one fusion part is a fusion part on the sprocket hole side.   2. The component supply device according to claim 1, wherein the proximity region is a region inside the one fusion-bonded portion and reaching an end portion of the electronic component.   The component supply apparatus according to claim 1, wherein the proximity region is an adjacent portion of the one fusion portion. A driving means for moving a supply tape that moves on a tape chute to a suction position where the electronic component is sucked from the outside, comprising a carrier tape having a storage portion for storing the electronic component and a cover tape covering the carrier tape; In the component supply apparatus having a pressing portion that presses the supply tape against the tape chute,
A component supply apparatus comprising cutting means for cutting the cover tape at any position outside the both sides in the longitudinal direction of the supply tape of the electronic component.   The component feeding apparatus according to claim 1, wherein the pressing unit includes a suction hole avoiding unit that prevents the cut cover tape from reaching an upper portion of a suction hole of an electronic component.   2. The driving means includes a sprocket that engages with the supply tape under the pressing portion, and the pressing portion includes sprocket avoiding means for avoiding contact of the cut cover tape with the sprocket. Or the component supply apparatus of 6.   The component supply apparatus according to claim 1, further comprising a supply tape pressing unit that presses the cover tape against the cutting unit.   The said supply tape pressing part has the pressing means which comprises the engagement means which has many engagement parts which engage with the sprocket hole on the outer periphery, and the rotation drive means which rotates the engagement means. The component supply apparatus described.   The component supply apparatus according to claim 10, wherein the engagement portion is an engagement roller, and the supply tape pressing portion includes a load reduction unit that reduces a load of the driving unit.   The component supply apparatus according to claim 1, wherein the component supply apparatus includes an automatic supply tape mounting unit that automatically mounts the supply tape from the outside.   The component supply apparatus according to claim 1, wherein the component supply apparatus includes a supply reel that stores the supply tape and a take-up reel that winds the supply tape after the electronic component is sucked.   14. The component supply device according to claim 1, further comprising an interface for transmitting information on the component supply device to the electronic component mounting device or receiving a command signal from the electronic component mounting device. .   An electronic component mounting apparatus comprising the component supply device according to claim 14, wherein the mounting of the component supply device or the electronic component is controlled based on the information.

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