JP2011086615A - 照明装置 - Google Patents

照明装置 Download PDF

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Publication number
JP2011086615A
JP2011086615A JP2010204269A JP2010204269A JP2011086615A JP 2011086615 A JP2011086615 A JP 2011086615A JP 2010204269 A JP2010204269 A JP 2010204269A JP 2010204269 A JP2010204269 A JP 2010204269A JP 2011086615 A JP2011086615 A JP 2011086615A
Authority
JP
Japan
Prior art keywords
heat
substrate
light emitting
lighting device
heat radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010204269A
Other languages
English (en)
Japanese (ja)
Inventor
秉佑 ▲シン▼
Ping-Yu Chen
Eiketsu Ro
英傑 呂
Zheng-Jay Hunag
正杰 黄
Hsin-Fei Huang
▲きん▼斐 黄
Ying-Ching Chen
穎慶 陳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxsemicon Integrated Technology Inc
Original Assignee
Foxsemicon Integrated Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxsemicon Integrated Technology Inc filed Critical Foxsemicon Integrated Technology Inc
Publication of JP2011086615A publication Critical patent/JP2011086615A/ja
Pending legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2010204269A 2009-10-16 2010-09-13 照明装置 Pending JP2011086615A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009103083471A CN102042517A (zh) 2009-10-16 2009-10-16 照明装置

Publications (1)

Publication Number Publication Date
JP2011086615A true JP2011086615A (ja) 2011-04-28

Family

ID=43127826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010204269A Pending JP2011086615A (ja) 2009-10-16 2010-09-13 照明装置

Country Status (4)

Country Link
EP (1) EP2312197A1 (zh)
JP (1) JP2011086615A (zh)
KR (1) KR20110041992A (zh)
CN (1) CN102042517A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160247951A1 (en) * 2013-10-22 2016-08-25 Sumitomo Electric Industries, Ltd. Epitaxial wafer and method for manufacturing same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001243809A (ja) * 2000-02-28 2001-09-07 Mitsubishi Electric Lighting Corp Led電球
JP2006244725A (ja) * 2005-02-28 2006-09-14 Atex Co Ltd Led照明装置
JP3133586U (ja) * 2007-04-02 2007-07-19 禎圖 謝 Ledランプの放熱構造
JP3139851U (ja) * 2007-12-11 2008-03-06 呉祖耀 Ledライト
JP2008293753A (ja) * 2007-05-23 2008-12-04 Sharp Corp 照明装置
JP2009170114A (ja) * 2008-01-10 2009-07-30 Toshiba Lighting & Technology Corp Led電球及び照明器具
JP2009206104A (ja) * 2005-04-08 2009-09-10 Toshiba Lighting & Technology Corp 電球型ランプ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6787999B2 (en) * 2002-10-03 2004-09-07 Gelcore, Llc LED-based modular lamp
EP1914470B1 (en) * 2006-10-20 2016-05-18 OSRAM GmbH Semiconductor lamp
KR101317429B1 (ko) * 2007-01-31 2013-10-10 잘만테크 주식회사 히트파이프를 이용한 냉각장치를 구비한 led조명 조립체

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001243809A (ja) * 2000-02-28 2001-09-07 Mitsubishi Electric Lighting Corp Led電球
JP2006244725A (ja) * 2005-02-28 2006-09-14 Atex Co Ltd Led照明装置
JP2009206104A (ja) * 2005-04-08 2009-09-10 Toshiba Lighting & Technology Corp 電球型ランプ
JP3133586U (ja) * 2007-04-02 2007-07-19 禎圖 謝 Ledランプの放熱構造
JP2008293753A (ja) * 2007-05-23 2008-12-04 Sharp Corp 照明装置
JP3139851U (ja) * 2007-12-11 2008-03-06 呉祖耀 Ledライト
JP2009170114A (ja) * 2008-01-10 2009-07-30 Toshiba Lighting & Technology Corp Led電球及び照明器具

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160247951A1 (en) * 2013-10-22 2016-08-25 Sumitomo Electric Industries, Ltd. Epitaxial wafer and method for manufacturing same
US9773932B2 (en) * 2013-10-22 2017-09-26 Sumitomo Electric Industries, Ltd. Epitaxial wafer and method for manufacturing same

Also Published As

Publication number Publication date
EP2312197A1 (en) 2011-04-20
KR20110041992A (ko) 2011-04-22
CN102042517A (zh) 2011-05-04

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