JP2011082260A5 - - Google Patents
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- Publication number
- JP2011082260A5 JP2011082260A5 JP2009231637A JP2009231637A JP2011082260A5 JP 2011082260 A5 JP2011082260 A5 JP 2011082260A5 JP 2009231637 A JP2009231637 A JP 2009231637A JP 2009231637 A JP2009231637 A JP 2009231637A JP 2011082260 A5 JP2011082260 A5 JP 2011082260A5
- Authority
- JP
- Japan
- Prior art keywords
- etching
- sio
- anisotropic
- sin
- proceed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009231637A JP5466468B2 (ja) | 2009-10-05 | 2009-10-05 | ドライエッチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009231637A JP5466468B2 (ja) | 2009-10-05 | 2009-10-05 | ドライエッチング方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011082260A JP2011082260A (ja) | 2011-04-21 |
| JP2011082260A5 true JP2011082260A5 (https=) | 2012-11-22 |
| JP5466468B2 JP5466468B2 (ja) | 2014-04-09 |
Family
ID=44076030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009231637A Active JP5466468B2 (ja) | 2009-10-05 | 2009-10-05 | ドライエッチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5466468B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140065834A1 (en) * | 2011-03-25 | 2014-03-06 | Hoya Corporation | Method of manufacturing mold for nano-imprint and substrate fabricating method |
| JP6529357B2 (ja) * | 2015-06-23 | 2019-06-12 | 東京エレクトロン株式会社 | エッチング方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0855857A (ja) * | 1994-08-15 | 1996-02-27 | Yamaha Corp | 絶縁膜加工法 |
| JP2002217285A (ja) * | 2001-01-15 | 2002-08-02 | Canon Inc | 半導体装置の製造方法 |
| JP2003151956A (ja) * | 2001-11-19 | 2003-05-23 | Sony Corp | 半導体装置製造工程における窒化シリコン膜のエッチング方法 |
| US7291446B2 (en) * | 2004-03-17 | 2007-11-06 | Tokyo Electron Limited | Method and system for treating a hard mask to improve etch characteristics |
| KR101220641B1 (ko) * | 2008-01-25 | 2013-01-10 | 아사히 가세이 가부시키가이샤 | 심리스 몰드의 제조 방법 |
-
2009
- 2009-10-05 JP JP2009231637A patent/JP5466468B2/ja active Active
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