JP2011069837A5 - - Google Patents
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- Publication number
- JP2011069837A5 JP2011069837A5 JP2010281804A JP2010281804A JP2011069837A5 JP 2011069837 A5 JP2011069837 A5 JP 2011069837A5 JP 2010281804 A JP2010281804 A JP 2010281804A JP 2010281804 A JP2010281804 A JP 2010281804A JP 2011069837 A5 JP2011069837 A5 JP 2011069837A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductor portion
- current
- current conductor
- hall effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 377
- 239000000758 substrate Substances 0.000 claims description 285
- 230000008878 coupling Effects 0.000 claims description 36
- 238000010168 coupling process Methods 0.000 claims description 36
- 238000005859 coupling reaction Methods 0.000 claims description 36
- 229920000642 polymer Polymers 0.000 claims description 26
- 239000011810 insulating material Substances 0.000 claims description 20
- 238000009413 insulation Methods 0.000 claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 3
- 239000012774 insulation material Substances 0.000 claims 2
- 230000005355 Hall effect Effects 0.000 description 200
- 239000010410 layer Substances 0.000 description 154
- 230000004907 flux Effects 0.000 description 48
- 230000004044 response Effects 0.000 description 37
- 230000035945 sensitivity Effects 0.000 description 32
- 238000000034 method Methods 0.000 description 30
- 230000008569 process Effects 0.000 description 26
- 239000012212 insulator Substances 0.000 description 25
- 229910000679 solder Inorganic materials 0.000 description 18
- 239000000463 material Substances 0.000 description 15
- 239000000919 ceramic Substances 0.000 description 13
- 230000008901 benefit Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 150000004767 nitrides Chemical class 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229920002160 Celluloid Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- QQWICBKIBSOBIT-WXUKJITCSA-N [(e)-2-(4-bicyclo[4.2.0]octa-1(6),2,4-trienyl)ethenyl]-[[(e)-2-(4-bicyclo[4.2.0]octa-1(6),2,4-trienyl)ethenyl]-dimethylsilyl]oxy-dimethylsilane Chemical compound C1=C2CCC2=CC(/C=C/[Si](C)(O[Si](C)(C)\C=C\C=2C=C3CCC3=CC=2)C)=C1 QQWICBKIBSOBIT-WXUKJITCSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- -1 but not limited to Substances 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000013598 vector Substances 0.000 description 1
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/140,250 US6995315B2 (en) | 2003-08-26 | 2005-05-27 | Current sensor |
| US11/140,250 | 2005-05-27 | ||
| US11/144,970 US7166807B2 (en) | 2003-08-26 | 2005-06-03 | Current sensor |
| US11/144,970 | 2005-06-03 | ||
| US11/336,602 US7075287B1 (en) | 2003-08-26 | 2006-01-20 | Current sensor |
| US11/336,602 | 2006-01-20 | ||
| US11/401,160 US7476816B2 (en) | 2003-08-26 | 2006-04-10 | Current sensor |
| US11/401,160 | 2006-04-10 | ||
| US11/383,021 US20060219436A1 (en) | 2003-08-26 | 2006-05-12 | Current sensor |
| US11/383,021 | 2006-05-12 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008513632A Division JP5468776B2 (ja) | 2005-05-27 | 2006-05-23 | 電流センサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011069837A JP2011069837A (ja) | 2011-04-07 |
| JP2011069837A5 true JP2011069837A5 (enExample) | 2012-07-12 |
| JP5248587B2 JP5248587B2 (ja) | 2013-07-31 |
Family
ID=44015214
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010281828A Active JP4904427B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
| JP2010281841A Active JP5248588B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
| JP2010281774A Active JP5255046B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
| JP2010281804A Active JP5248587B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010281828A Active JP4904427B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
| JP2010281841A Active JP5248588B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
| JP2010281774A Active JP5255046B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (4) | JP4904427B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8907437B2 (en) * | 2011-07-22 | 2014-12-09 | Allegro Microsystems, Llc | Reinforced isolation for current sensor with magnetic field transducer |
| CH707687B1 (de) | 2013-03-08 | 2016-09-15 | Melexis Technologies Nv | Stromsensor. |
| US9190606B2 (en) | 2013-03-15 | 2015-11-17 | Allegro Micosystems, LLC | Packaging for an electronic device |
| US10345343B2 (en) | 2013-03-15 | 2019-07-09 | Allegro Microsystems, Llc | Current sensor isolation |
| US9810721B2 (en) * | 2015-12-23 | 2017-11-07 | Melexis Technologies Sa | Method of making a current sensor and current sensor |
| JP2017134022A (ja) * | 2016-01-29 | 2017-08-03 | 旭化成エレクトロニクス株式会社 | 電流センサ及び製造方法 |
| CN113866475B (zh) * | 2021-09-30 | 2025-02-18 | 意瑞半导体（上海）有限公司 | 电流传感器的引线框架及电流传感器 |
| US11644485B2 (en) | 2021-10-07 | 2023-05-09 | Allegro Microsystems, Llc | Current sensor integrated circuits |
| US11768230B1 (en) | 2022-03-30 | 2023-09-26 | Allegro Microsystems, Llc | Current sensor integrated circuit with a dual gauge lead frame |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4425596A (en) * | 1980-09-26 | 1984-01-10 | Tokyo Shibaura Denki Kabushiki Kaisha | Electric circuit breaker |
| JP2001165963A (ja) * | 1999-12-09 | 2001-06-22 | Sanken Electric Co Ltd | ホール素子を備えた電流検出装置 |
| JP2002267692A (ja) * | 2001-03-08 | 2002-09-18 | Yazaki Corp | 電流センサ |
| TWI273266B (en) * | 2001-11-01 | 2007-02-11 | Asahi Kasei Emd Corp | Current sensor and current sensor manufacturing method |
| US7709754B2 (en) * | 2003-08-26 | 2010-05-04 | Allegro Microsystems, Inc. | Current sensor |
-
2010
- 2010-12-17 JP JP2010281828A patent/JP4904427B2/ja active Active
- 2010-12-17 JP JP2010281841A patent/JP5248588B2/ja active Active
- 2010-12-17 JP JP2010281774A patent/JP5255046B2/ja active Active
- 2010-12-17 JP JP2010281804A patent/JP5248587B2/ja active Active
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