JP2011069837A - 電流センサ - Google Patents
電流センサ Download PDFInfo
- Publication number
- JP2011069837A JP2011069837A JP2010281804A JP2010281804A JP2011069837A JP 2011069837 A JP2011069837 A JP 2011069837A JP 2010281804 A JP2010281804 A JP 2010281804A JP 2010281804 A JP2010281804 A JP 2010281804A JP 2011069837 A JP2011069837 A JP 2011069837A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductor portion
- current
- current conductor
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 381
- 239000000758 substrate Substances 0.000 claims abstract description 289
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 230000008878 coupling Effects 0.000 claims description 35
- 238000010168 coupling process Methods 0.000 claims description 35
- 238000005859 coupling reaction Methods 0.000 claims description 35
- 229920000642 polymer Polymers 0.000 claims description 32
- 239000011810 insulating material Substances 0.000 claims description 22
- 239000000919 ceramic Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 16
- 150000004767 nitrides Chemical class 0.000 claims description 9
- 230000005355 Hall effect Effects 0.000 description 200
- 239000010410 layer Substances 0.000 description 154
- 230000004907 flux Effects 0.000 description 48
- 230000004044 response Effects 0.000 description 37
- 230000035945 sensitivity Effects 0.000 description 32
- 238000000034 method Methods 0.000 description 30
- 230000008569 process Effects 0.000 description 26
- 239000012212 insulator Substances 0.000 description 25
- 229910000679 solder Inorganic materials 0.000 description 18
- 230000008901 benefit Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 238000009413 insulation Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229920002160 Celluloid Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- QQWICBKIBSOBIT-WXUKJITCSA-N [(e)-2-(4-bicyclo[4.2.0]octa-1(6),2,4-trienyl)ethenyl]-[[(e)-2-(4-bicyclo[4.2.0]octa-1(6),2,4-trienyl)ethenyl]-dimethylsilyl]oxy-dimethylsilane Chemical compound C1=C2CCC2=CC(/C=C/[Si](C)(O[Si](C)(C)\C=C\C=2C=C3CCC3=CC=2)C)=C1 QQWICBKIBSOBIT-WXUKJITCSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- -1 but not limited to Substances 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000013598 vector Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
- G01R15/202—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using Hall-effect devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/37099—Material
- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/37147—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73221—Strap and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
【解決手段】本発明の集積回路は、複数のリード線を有するリードフレームであって、前記複数のリード線のうちの少なくとも二つを備える電流導体部を有する、リードフレームと、第1の表面および反対の第2の表面を有する基板であって、前記第1の表面が前記電流導体部の近位にあり、前記第2の表面が前記電流導体部から遠位にあり、前記リード線の各一つがそれぞれの長さを有し、前記リード線の各一つが、前記リード線の前記長さ全体にわたって、前記基板の前記第2の表面よりも前記基板の前記第1の表面に近くなるように選択された方向に湾曲部を有する、基板と、前記基板および前記リードフレームの前記電流導体部の間に配設された絶縁層と、前記基板の前記第1の表面上に配設された一つまたは複数の磁場変換器とを備える。
【選択図】図12
Description
磁束曲線56、58は、300μmに中心があるホール素子の近くで実質的に平らであるものと特徴付けることができる。したがって、z軸34の方向での磁場に敏感なホール効果素子18の出力は、x軸30およびy軸32に沿ったホール効果素子18の位置には比較的鈍感である。
同じ利点を実現するために、図3の実施形態以外の実施形態で上に示した他のリードフレームに薄層化部分を適用することもできることを理解されたい。
これらの構成では、ホール効果素子308は、電流導体部304の近傍に、電流導体部304に関して所定の位置に配設され、それにより、電流導体部304を通過する電流316によって発生される磁場は、ホール効果素子308の最大応答軸に実質的に整列された方向となる。ここでは、ホール効果素子308は、z軸326に整列された最大応答軸を有する。したがって、図示されるように、ホール効果素子308は、電流導体部304の横に(すなわち、y軸324に沿ってわずかにオフセットされて)配設され、ここで磁場は、z軸326に沿って向けられる。しかし、別の方向に整列された最大応答軸を有するホール効果素子、または別のタイプの磁場センサ、例えば磁気抵抗素子を、電流導体部304に関して別の位置に、例えば電流導体部304の(z軸326の方向で)上に配設することができる。
リードフレーム302は、回路板への表面実装に適した湾曲リード線302a〜302hを有するように示されているが、直線形状を有するスルーホールリード線を含めた、しかしそれに限定されない他の形状を有するリード線を有するリードフレームを使用することもできることを理解されたい。
絶縁層402が、リードフレーム302と関連付けられたリードフレーム絶縁層であるいくつかの実施形態では、絶縁層402は、テーピングプロセスによって形成されるリードフレームテープ絶縁層である。リードフレームテープ絶縁層は、ポリマーテープ、例えばKapton(商標)テープを含めた、しかしそれに限定されないリードフレームに貼付されるテープから構成することができる。
隆起部454a、454bは、過電流状態を検出するように適合された、すなわち所定の電流レベルまたは電流しきい値よりも大きい電流導体部452aを通過する電流を検出するように適合された回路に電流導体部454を結合する接続を提供することができることは、図13Aおよび図15に関連した以下の論述から明らかになろう。このために、回路は、所定の電圧降下または電圧しきい値よりも大きい第1の隆起部454aと第2の隆起部454bとの間の電圧差を検出することができる。
次に図16を参照すると、別の例示的な電流センサ650は、図14の電流センサ500と同様であり、しかし電流センサ650は、より完全に以下に説明する第2の基板655を含む。電流センサ650は、複数のリード線552a〜552hを有するリードフレーム652を含む。また、電流センサ650は、第1の表面656aと反対の第2の表面656bとを有する基板656を含む。電流導体部655を有する導電性留め具654が、リード線652a〜652dに結合される。電流導体部605は、二つの隆起部655a、655bを含む。磁場感知素子、例えば磁気抵抗素子(図示せず)が上に配設された第2の基板666を、電流導体部655の上に配設することができる。第2の基板666上の磁場感知素子は、ワイヤ結合部668a、668bなどを用いて、基板656の第1の表面656aに結合することができる。
電磁シールド950の利点は、上の論述から明らかであろう。
本発明の好ましい実施形態を説明してきたが、ここで、それらの概念を組み込む他の実施形態が使用されることもあることは当業者に明らかであろう。したがって、これらの実施形態は、開示された実施形態に限定されるべきではなく、頭記の特許請求の範囲の精神および範囲によってのみ限定されるべきであると考えられる。本明細書で引用した参考文献は全て、それらの全体を参照として本明細書に組み込む。
Claims (18)
- 集積回路において、
複数のリード線を有するリードフレームであって、前記複数のリード線のうちの少なくとも二つを備える電流導体部を有する、リードフレームと、
第1の表面および反対の第2の表面を有する基板であって、前記第1の表面が前記電流導体部の近位にあり、前記第2の表面が前記電流導体部から遠位にあり、前記リード線の各一つがそれぞれの長さを有し、前記リード線の各一つが、前記リード線の前記長さ全体にわたって、前記基板の前記第2の表面よりも前記基板の前記第1の表面に近くなるように選択された方向に湾曲部を有する、基板と、
前記基板および前記リードフレームの前記電流導体部の間に配設された絶縁層と、
前記基板の前記第1の表面上に配設された一つまたは複数の磁場変換器とを備える、集積回路。 - 前記絶縁層が、ポリマーテープから構成される、請求項1に記載の集積回路。
- 前記絶縁層が、セラミック層から構成される、請求項1に記載の集積回路。
- 前記絶縁層が、前記電流導体部上に配設された絶縁材料を備える、請求項1に記載の集積回路。
- 前記絶縁材料が、ポリマーテープ、ポリマー、セラミック、または酸化物の少なくとも一つを備える、請求項4に記載の集積回路。
- 前記絶縁層が、前記基板上に配設された絶縁材料を備える、請求項1に記載の集積回路。
- 前記絶縁材料が、ポリマーテープ、ポリマー、セラミック、窒化物、または酸化物の少なくとも一つを備える、請求項6に記載の集積回路。
- 前記電流導体部が、前記複数のリード線のうちの前記少なくとも二つの結合を備える、請求項1に記載の集積回路。
- 集積回路において、
複数のリード線を有するリードフレーム部であって、前記複数のリード線のうちの少なくとも二つを備える第1の電流導体部を有する、リードフレーム部と、
第1の表面および反対の第2の表面を有する基板であって、前記第1の表面が前記第1の電流導体部の近位にあり、前記第2の表面が前記第1の電流導体部から遠位にある、基板と、
前記基板の前記第1の表面上に配設された一つまたは複数の磁場変換器と、
前記基板の前記第1の表面の近位に被覆された第2の電流導体部であって、前記一つまたは複数の磁場変換器の近位に配設され、前記第1の電流導体部に結合された、第2の電流導体部と、
前記第2の電流導体部および前記基板の前記第1の表面の間に配設された絶縁層とを備える、集積回路。 - 前記絶縁層が、ポリマーテープから構成される、請求項9に記載の集積回路。
- 前記絶縁層が、セラミック層から構成される、請求項9に記載の集積回路。
- 前記絶縁層が、前記リードフレーム上に配設された絶縁材料を備える、請求項9に記載の集積回路。
- 前記絶縁材料が、ポリマーテープ、ポリマー、セラミック、または酸化物の少なくとも一つを備える、請求項12に記載の集積回路。
- 前記絶縁層が、前記基板の前記第1の表面上に配設された絶縁材料を備える、請求項9に記載の集積回路。
- 前記絶縁材料が、ポリマーテープ、ポリマー、セラミック、窒化物、または酸化物の少なくとも一つを備える、請求項14に記載の集積回路。
- 前記絶縁層の材料が、ポリマー、セラミック、窒化物、または酸化物の少なくとも一つを備える、請求項14に記載の集積回路。
- 集積回路において、
複数のリード線を有するリードフレームであって、前記複数のリード線のうちの少なくとも二つを備える電流導体部を有する、リードフレームと、
第1の表面および反対の第2の表面を有する基板であって、前記第1の表面が前記電流導体部の近位にあり、前記第2の表面が前記電流導体部から遠位にある、基板と、
前記基板の前記第1の表面上に配設された一つまたは複数の磁場変換器と、
前記基板および前記リードフレームの前記電流導体部の間に配設された絶縁層とを備えており、
前記絶縁層は、
セラミック層を備える介在絶縁層、あるいは
前記リードフレームと関連付けられたリードフレーム絶縁層であって、リードフレーム溶射絶縁層、リードフレーム被覆絶縁層、またはリードフレーム酸化物絶縁層の少なくとも一つを備える、リードフレーム絶縁層、あるいは
前記基板と関連付けられた基板絶縁層であって、基板被覆絶縁層または基板酸化物絶縁層の少なくとも一つを備える、基板絶縁層、
の少なくとも一つを備える、集積回路。 - 前記基板の前記第1の表面の近位に被覆された第2の電流導体部であって、前記一つまたは複数の磁場変換器の近位に配設され、前記電流導体部に結合された、第2の電流導体部をさらに備える、請求項17に記載の集積回路。
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/140,250 | 2005-05-27 | ||
US11/140,250 US6995315B2 (en) | 2003-08-26 | 2005-05-27 | Current sensor |
US11/144,970 | 2005-06-03 | ||
US11/144,970 US7166807B2 (en) | 2003-08-26 | 2005-06-03 | Current sensor |
US11/336,602 US7075287B1 (en) | 2003-08-26 | 2006-01-20 | Current sensor |
US11/336,602 | 2006-01-20 | ||
US11/401,160 US7476816B2 (en) | 2003-08-26 | 2006-04-10 | Current sensor |
US11/401,160 | 2006-04-10 | ||
US11/383,021 | 2006-05-12 | ||
US11/383,021 US20060219436A1 (en) | 2003-08-26 | 2006-05-12 | Current sensor |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008513632A Division JP5468776B2 (ja) | 2005-05-27 | 2006-05-23 | 電流センサ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011069837A true JP2011069837A (ja) | 2011-04-07 |
JP2011069837A5 JP2011069837A5 (ja) | 2012-07-12 |
JP5248587B2 JP5248587B2 (ja) | 2013-07-31 |
Family
ID=44015214
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010281804A Active JP5248587B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
JP2010281841A Active JP5248588B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
JP2010281828A Active JP4904427B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
JP2010281774A Active JP5255046B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010281841A Active JP5248588B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
JP2010281828A Active JP4904427B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
JP2010281774A Active JP5255046B2 (ja) | 2005-05-27 | 2010-12-17 | 電流センサ |
Country Status (1)
Country | Link |
---|---|
JP (4) | JP5248587B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014521935A (ja) * | 2011-07-22 | 2014-08-28 | アレグロ・マイクロシステムズ・エルエルシー | 磁界変換器を有する電流センサの強化絶縁 |
US10345343B2 (en) | 2013-03-15 | 2019-07-09 | Allegro Microsystems, Llc | Current sensor isolation |
US11644485B2 (en) | 2021-10-07 | 2023-05-09 | Allegro Microsystems, Llc | Current sensor integrated circuits |
US11768230B1 (en) | 2022-03-30 | 2023-09-26 | Allegro Microsystems, Llc | Current sensor integrated circuit with a dual gauge lead frame |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH707687B1 (de) * | 2013-03-08 | 2016-09-15 | Melexis Technologies Nv | Stromsensor. |
US9190606B2 (en) | 2013-03-15 | 2015-11-17 | Allegro Micosystems, LLC | Packaging for an electronic device |
US9810721B2 (en) * | 2015-12-23 | 2017-11-07 | Melexis Technologies Sa | Method of making a current sensor and current sensor |
JP2017134022A (ja) * | 2016-01-29 | 2017-08-03 | 旭化成エレクトロニクス株式会社 | 電流センサ及び製造方法 |
CN113866475A (zh) * | 2021-09-30 | 2021-12-31 | 意瑞半导体(上海)有限公司 | 电流传感器的引线框架及电流传感器 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001165963A (ja) * | 1999-12-09 | 2001-06-22 | Sanken Electric Co Ltd | ホール素子を備えた電流検出装置 |
WO2003038452A1 (fr) * | 2001-11-01 | 2003-05-08 | Asahi Kasei Emd Corporation | Capteur de courant et procede de fabrication associe |
US20050045359A1 (en) * | 2003-08-26 | 2005-03-03 | Michael Doogue | Current sensor |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4425596A (en) * | 1980-09-26 | 1984-01-10 | Tokyo Shibaura Denki Kabushiki Kaisha | Electric circuit breaker |
JP2002267692A (ja) * | 2001-03-08 | 2002-09-18 | Yazaki Corp | 電流センサ |
-
2010
- 2010-12-17 JP JP2010281804A patent/JP5248587B2/ja active Active
- 2010-12-17 JP JP2010281841A patent/JP5248588B2/ja active Active
- 2010-12-17 JP JP2010281828A patent/JP4904427B2/ja active Active
- 2010-12-17 JP JP2010281774A patent/JP5255046B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001165963A (ja) * | 1999-12-09 | 2001-06-22 | Sanken Electric Co Ltd | ホール素子を備えた電流検出装置 |
WO2003038452A1 (fr) * | 2001-11-01 | 2003-05-08 | Asahi Kasei Emd Corporation | Capteur de courant et procede de fabrication associe |
US20050045359A1 (en) * | 2003-08-26 | 2005-03-03 | Michael Doogue | Current sensor |
JP2007503584A (ja) * | 2003-08-26 | 2007-02-22 | アレグロ・マイクロシステムズ・インコーポレーテッド | 電流センサ |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014521935A (ja) * | 2011-07-22 | 2014-08-28 | アレグロ・マイクロシステムズ・エルエルシー | 磁界変換器を有する電流センサの強化絶縁 |
US10345343B2 (en) | 2013-03-15 | 2019-07-09 | Allegro Microsystems, Llc | Current sensor isolation |
US10753963B2 (en) | 2013-03-15 | 2020-08-25 | Allegro Microsystems, Llc | Current sensor isolation |
US11644485B2 (en) | 2021-10-07 | 2023-05-09 | Allegro Microsystems, Llc | Current sensor integrated circuits |
US11768230B1 (en) | 2022-03-30 | 2023-09-26 | Allegro Microsystems, Llc | Current sensor integrated circuit with a dual gauge lead frame |
Also Published As
Publication number | Publication date |
---|---|
JP5255046B2 (ja) | 2013-08-07 |
JP2011075576A (ja) | 2011-04-14 |
JP5248588B2 (ja) | 2013-07-31 |
JP2011069838A (ja) | 2011-04-07 |
JP2011102807A (ja) | 2011-05-26 |
JP4904427B2 (ja) | 2012-03-28 |
JP5248587B2 (ja) | 2013-07-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5468776B2 (ja) | 電流センサ | |
JP4904427B2 (ja) | 電流センサ | |
US7476816B2 (en) | Current sensor | |
US7075287B1 (en) | Current sensor | |
JP2011069837A5 (ja) | ||
JP2011075576A5 (ja) | ||
US11262385B2 (en) | Systems and methods for integrated shielding in a current sensor | |
US7166807B2 (en) | Current sensor | |
US10753963B2 (en) | Current sensor isolation | |
US6995315B2 (en) | Current sensor | |
JP2013079973A (ja) | 電流センサ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110519 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110816 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110819 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110921 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111214 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120314 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120319 |
|
A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20120530 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120924 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121204 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130325 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130410 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5248587 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160419 Year of fee payment: 3 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |