JP2011066407A - モジュール−シャシー・インタフェースのための熱橋拡張 - Google Patents

モジュール−シャシー・インタフェースのための熱橋拡張 Download PDF

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Publication number
JP2011066407A
JP2011066407A JP2010200806A JP2010200806A JP2011066407A JP 2011066407 A JP2011066407 A JP 2011066407A JP 2010200806 A JP2010200806 A JP 2010200806A JP 2010200806 A JP2010200806 A JP 2010200806A JP 2011066407 A JP2011066407 A JP 2011066407A
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JP
Japan
Prior art keywords
extension
module
pba
wall
chassis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010200806A
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English (en)
Japanese (ja)
Other versions
JP2011066407A5 (enExample
Inventor
Lance Leroy Sundstrom
ランス・リロイ・サンドストロム
Mike Gillespie
マイク・ギレスピー
Randolph Hook
ランドルフ・フック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
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Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of JP2011066407A publication Critical patent/JP2011066407A/ja
Publication of JP2011066407A5 publication Critical patent/JP2011066407A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Of Plates (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP2010200806A 2009-09-10 2010-09-08 モジュール−シャシー・インタフェースのための熱橋拡張 Pending JP2011066407A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/557,277 US8223497B2 (en) 2009-09-10 2009-09-10 Thermal bridge extensions for a module-chassis interface

Publications (2)

Publication Number Publication Date
JP2011066407A true JP2011066407A (ja) 2011-03-31
JP2011066407A5 JP2011066407A5 (enExample) 2013-10-24

Family

ID=43332643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010200806A Pending JP2011066407A (ja) 2009-09-10 2010-09-08 モジュール−シャシー・インタフェースのための熱橋拡張

Country Status (3)

Country Link
US (1) US8223497B2 (enExample)
EP (1) EP2296452A3 (enExample)
JP (1) JP2011066407A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019225601A1 (ja) * 2018-05-21 2019-11-28 三菱電機株式会社 電子機器

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FR2956280A1 (fr) * 2010-02-09 2011-08-12 Kontron Modular Computers Sa Dispositif auxiliaire d'evacuation par conduction de la chaleur produite par une carte electronique
FR2956557B1 (fr) * 2010-02-18 2013-01-04 Airbus Operations Sas Module electronique et ensemble electronique comportant un tel module
US8559178B2 (en) * 2010-10-11 2013-10-15 Lockheed Martin Corporation Cardlock clamp
TWI445483B (zh) * 2010-12-23 2014-07-11 仁寶電腦工業股份有限公司 殼體結構及具有其之電子裝置
US20130003316A1 (en) * 2010-12-28 2013-01-03 Elma Electronic Inc. Card Lock Retainer For Pluggable Conduction Cooled Circuit Card Assemblies
US8482929B2 (en) * 2011-05-17 2013-07-09 General Electric Company Systems for circuit board heat transfer and method of assembling same
US9437518B2 (en) * 2012-10-29 2016-09-06 Samsung Electronics Co., Ltd. Semiconductor module
US9253925B1 (en) * 2013-01-11 2016-02-02 L-3 Communications Corp. Panel for enhancing thermal conduction in an electronic assembly
US9426931B2 (en) 2014-02-07 2016-08-23 Lockheed Martin Corporation Fluid-flow-through cooling of circuit boards
US9730352B2 (en) * 2014-08-26 2017-08-08 Honeywell International Inc. Clamp for panel-mounted electronics modules or other devices
US10327357B2 (en) * 2014-09-18 2019-06-18 Artesyn Embedded Computing, Inc. Thermal conduction to a cylindrical shaft
DE102017222148A1 (de) 2017-12-07 2019-06-13 Siemens Mobility GmbH Lüfterloses Kühlsystem
US11395429B2 (en) * 2019-01-14 2022-07-19 Simon Industries, Inc. Wedge clamp for circuit board
US11917797B2 (en) * 2019-12-03 2024-02-27 The Florida State University Research Foundation, Inc. Integrated thermal-electrical component for power electronics converters
US12050352B2 (en) * 2020-09-17 2024-07-30 Te Connectivity Solutions Gmbh Heat exchange assembly for a pluggable module
US11864353B2 (en) * 2021-09-15 2024-01-02 Te Connectivity Solutions Gmbh Heat exchange assembly
US20230239993A1 (en) * 2022-01-26 2023-07-27 Microsoft Technology Licensing, Llc Cooling systems for a circuit board
US12075587B2 (en) * 2022-02-17 2024-08-27 Hamilton Sundstrand Corporation Heat transfer interfaces for circuit card assembly (CCA) modules

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5895896A (ja) * 1981-12-02 1983-06-07 株式会社日立製作所 電子部品の冷却装置
JPH09503347A (ja) * 1993-10-07 1997-03-31 エムテーウー・モートレン−ウント・ツルビーネン−ウニオン・ミュンヘン・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング 電子機器のケーシングに装入するための金属コアプリント回路板
JP2009200467A (ja) * 2007-11-16 2009-09-03 Ge Aviation Systems Llc 伝導冷却回路基板構体

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US4721155A (en) * 1986-05-07 1988-01-26 United Technologies Corporation Sawtooth card retainer
DE8811949U1 (de) 1988-09-21 1988-12-01 Standard Elektrik Lorenz Ag, 7000 Stuttgart Vorrichtung zur Wärmeableitung und Versteifung von Leiterplatten-Baugruppen
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
US5224016A (en) * 1990-05-31 1993-06-29 Calmark Corporation Retainer for electronic modules
US5184281A (en) * 1992-03-03 1993-02-02 Digital Equipment Corporation Heat dissipation apparatus
US5407297A (en) * 1993-02-24 1995-04-18 Eg&G Birtcher, Inc. Circuit board retainer having a spring body member
US5472353A (en) * 1995-04-13 1995-12-05 Hristake; Val Isobaric expandable thermal clamp for printed circuit board
US5892660A (en) * 1996-08-29 1999-04-06 Micron Technology, Inc. Single in line memory module adapter
US6535387B2 (en) * 2001-06-28 2003-03-18 Intel Corporation Heat transfer apparatus
US6687130B2 (en) * 2001-09-10 2004-02-03 Corvis Corporation Integrated wedge lock and elastic member
US6873528B2 (en) * 2002-05-28 2005-03-29 Dy 4 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
US6771504B2 (en) * 2002-12-23 2004-08-03 Eastman Kodak Company Thermal transport element for use with a heat dissipating electrical assemblage
US6765798B1 (en) * 2003-06-19 2004-07-20 Curtiss-Wright Controls, Inc. Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between
KR100558065B1 (ko) * 2004-03-15 2006-03-10 삼성전자주식회사 방열체가 구비된 반도체 모듈
US7079396B2 (en) * 2004-06-14 2006-07-18 Sun Microsystems, Inc. Memory module cooling
US7031167B1 (en) * 2004-11-24 2006-04-18 Elta Systems Ltd. Wedgelock for electronic circuit card module
US7322843B1 (en) * 2006-07-11 2008-01-29 Harris Corporation Cam activated circuit card clamp
US7349221B2 (en) * 2006-07-20 2008-03-25 Honeywell International Inc. Device for increased thermal conductivity between a printed wiring assembly and a chassis
DE102007056952B4 (de) * 2007-11-27 2011-04-28 Qimonda Ag Vorrichtung und Verfahren zur Montage eines Kühlkörpers
US20100039770A1 (en) * 2008-08-15 2010-02-18 Danello Paul A Pneumatic presssure wedge

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5895896A (ja) * 1981-12-02 1983-06-07 株式会社日立製作所 電子部品の冷却装置
JPH09503347A (ja) * 1993-10-07 1997-03-31 エムテーウー・モートレン−ウント・ツルビーネン−ウニオン・ミュンヘン・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング 電子機器のケーシングに装入するための金属コアプリント回路板
JP2009200467A (ja) * 2007-11-16 2009-09-03 Ge Aviation Systems Llc 伝導冷却回路基板構体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019225601A1 (ja) * 2018-05-21 2019-11-28 三菱電機株式会社 電子機器
JPWO2019225601A1 (ja) * 2018-05-21 2020-12-10 三菱電機株式会社 電子機器

Also Published As

Publication number Publication date
EP2296452A3 (en) 2011-07-13
EP2296452A2 (en) 2011-03-16
US8223497B2 (en) 2012-07-17
US20110058336A1 (en) 2011-03-10

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