JP2011066407A5 - - Google Patents

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Publication number
JP2011066407A5
JP2011066407A5 JP2010200806A JP2010200806A JP2011066407A5 JP 2011066407 A5 JP2011066407 A5 JP 2011066407A5 JP 2010200806 A JP2010200806 A JP 2010200806A JP 2010200806 A JP2010200806 A JP 2010200806A JP 2011066407 A5 JP2011066407 A5 JP 2011066407A5
Authority
JP
Japan
Prior art keywords
wall
extension
internal
module
wedge clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010200806A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011066407A (ja
Filing date
Publication date
Priority claimed from US12/557,277 external-priority patent/US8223497B2/en
Application filed filed Critical
Publication of JP2011066407A publication Critical patent/JP2011066407A/ja
Publication of JP2011066407A5 publication Critical patent/JP2011066407A5/ja
Pending legal-status Critical Current

Links

JP2010200806A 2009-09-10 2010-09-08 モジュール−シャシー・インタフェースのための熱橋拡張 Pending JP2011066407A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/557,277 US8223497B2 (en) 2009-09-10 2009-09-10 Thermal bridge extensions for a module-chassis interface

Publications (2)

Publication Number Publication Date
JP2011066407A JP2011066407A (ja) 2011-03-31
JP2011066407A5 true JP2011066407A5 (enExample) 2013-10-24

Family

ID=43332643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010200806A Pending JP2011066407A (ja) 2009-09-10 2010-09-08 モジュール−シャシー・インタフェースのための熱橋拡張

Country Status (3)

Country Link
US (1) US8223497B2 (enExample)
EP (1) EP2296452A3 (enExample)
JP (1) JP2011066407A (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2956280A1 (fr) * 2010-02-09 2011-08-12 Kontron Modular Computers Sa Dispositif auxiliaire d'evacuation par conduction de la chaleur produite par une carte electronique
FR2956557B1 (fr) * 2010-02-18 2013-01-04 Airbus Operations Sas Module electronique et ensemble electronique comportant un tel module
US8559178B2 (en) * 2010-10-11 2013-10-15 Lockheed Martin Corporation Cardlock clamp
TWI445483B (zh) * 2010-12-23 2014-07-11 仁寶電腦工業股份有限公司 殼體結構及具有其之電子裝置
US20130003316A1 (en) * 2010-12-28 2013-01-03 Elma Electronic Inc. Card Lock Retainer For Pluggable Conduction Cooled Circuit Card Assemblies
US8482929B2 (en) * 2011-05-17 2013-07-09 General Electric Company Systems for circuit board heat transfer and method of assembling same
US9437518B2 (en) * 2012-10-29 2016-09-06 Samsung Electronics Co., Ltd. Semiconductor module
US9253925B1 (en) * 2013-01-11 2016-02-02 L-3 Communications Corp. Panel for enhancing thermal conduction in an electronic assembly
US9426931B2 (en) 2014-02-07 2016-08-23 Lockheed Martin Corporation Fluid-flow-through cooling of circuit boards
US9730352B2 (en) * 2014-08-26 2017-08-08 Honeywell International Inc. Clamp for panel-mounted electronics modules or other devices
US10327357B2 (en) * 2014-09-18 2019-06-18 Artesyn Embedded Computing, Inc. Thermal conduction to a cylindrical shaft
DE102017222148A1 (de) 2017-12-07 2019-06-13 Siemens Mobility GmbH Lüfterloses Kühlsystem
JP6945948B2 (ja) * 2018-05-21 2021-10-06 三菱電機株式会社 電子機器
US11395429B2 (en) * 2019-01-14 2022-07-19 Simon Industries, Inc. Wedge clamp for circuit board
US11917797B2 (en) * 2019-12-03 2024-02-27 The Florida State University Research Foundation, Inc. Integrated thermal-electrical component for power electronics converters
US12050352B2 (en) * 2020-09-17 2024-07-30 Te Connectivity Solutions Gmbh Heat exchange assembly for a pluggable module
US11864353B2 (en) * 2021-09-15 2024-01-02 Te Connectivity Solutions Gmbh Heat exchange assembly
US20230239993A1 (en) * 2022-01-26 2023-07-27 Microsoft Technology Licensing, Llc Cooling systems for a circuit board
US12075587B2 (en) * 2022-02-17 2024-08-27 Hamilton Sundstrand Corporation Heat transfer interfaces for circuit card assembly (CCA) modules

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5895896A (ja) * 1981-12-02 1983-06-07 株式会社日立製作所 電子部品の冷却装置
US4721155A (en) * 1986-05-07 1988-01-26 United Technologies Corporation Sawtooth card retainer
DE8811949U1 (de) 1988-09-21 1988-12-01 Standard Elektrik Lorenz Ag, 7000 Stuttgart Vorrichtung zur Wärmeableitung und Versteifung von Leiterplatten-Baugruppen
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
US5224016A (en) * 1990-05-31 1993-06-29 Calmark Corporation Retainer for electronic modules
US5184281A (en) * 1992-03-03 1993-02-02 Digital Equipment Corporation Heat dissipation apparatus
US5407297A (en) * 1993-02-24 1995-04-18 Eg&G Birtcher, Inc. Circuit board retainer having a spring body member
DE4334127C1 (de) * 1993-10-07 1995-03-23 Mtu Muenchen Gmbh Metallkernleiterplatte zum Einschieben in das Gehäuse eines Elektronikgerätes
US5472353A (en) * 1995-04-13 1995-12-05 Hristake; Val Isobaric expandable thermal clamp for printed circuit board
US5892660A (en) * 1996-08-29 1999-04-06 Micron Technology, Inc. Single in line memory module adapter
US6535387B2 (en) * 2001-06-28 2003-03-18 Intel Corporation Heat transfer apparatus
US6687130B2 (en) * 2001-09-10 2004-02-03 Corvis Corporation Integrated wedge lock and elastic member
US6873528B2 (en) * 2002-05-28 2005-03-29 Dy 4 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
US6771504B2 (en) * 2002-12-23 2004-08-03 Eastman Kodak Company Thermal transport element for use with a heat dissipating electrical assemblage
US6765798B1 (en) * 2003-06-19 2004-07-20 Curtiss-Wright Controls, Inc. Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between
KR100558065B1 (ko) * 2004-03-15 2006-03-10 삼성전자주식회사 방열체가 구비된 반도체 모듈
US7079396B2 (en) * 2004-06-14 2006-07-18 Sun Microsystems, Inc. Memory module cooling
US7031167B1 (en) * 2004-11-24 2006-04-18 Elta Systems Ltd. Wedgelock for electronic circuit card module
US7322843B1 (en) * 2006-07-11 2008-01-29 Harris Corporation Cam activated circuit card clamp
US7349221B2 (en) * 2006-07-20 2008-03-25 Honeywell International Inc. Device for increased thermal conductivity between a printed wiring assembly and a chassis
EP2061296B1 (en) 2007-11-16 2014-05-14 GE Aviation Systems LLC Conduction cooled circuit board assembly
DE102007056952B4 (de) * 2007-11-27 2011-04-28 Qimonda Ag Vorrichtung und Verfahren zur Montage eines Kühlkörpers
US20100039770A1 (en) * 2008-08-15 2010-02-18 Danello Paul A Pneumatic presssure wedge

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