JP2011066342A5 - - Google Patents

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Publication number
JP2011066342A5
JP2011066342A5 JP2009217854A JP2009217854A JP2011066342A5 JP 2011066342 A5 JP2011066342 A5 JP 2011066342A5 JP 2009217854 A JP2009217854 A JP 2009217854A JP 2009217854 A JP2009217854 A JP 2009217854A JP 2011066342 A5 JP2011066342 A5 JP 2011066342A5
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JP
Japan
Prior art keywords
wafer
hole
absence
detecting
image processing
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JP2009217854A
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English (en)
Japanese (ja)
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JP5541770B2 (ja
JP2011066342A (ja
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Priority to JP2009217854A priority Critical patent/JP5541770B2/ja
Priority claimed from JP2009217854A external-priority patent/JP5541770B2/ja
Priority to KR1020100089936A priority patent/KR101657316B1/ko
Priority to CN201010287709.6A priority patent/CN102019581B/zh
Publication of JP2011066342A publication Critical patent/JP2011066342A/ja
Publication of JP2011066342A5 publication Critical patent/JP2011066342A5/ja
Application granted granted Critical
Publication of JP5541770B2 publication Critical patent/JP5541770B2/ja
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JP2009217854A 2009-09-18 2009-09-18 ウェーハ研磨装置およびウェーハの製造方法 Active JP5541770B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009217854A JP5541770B2 (ja) 2009-09-18 2009-09-18 ウェーハ研磨装置およびウェーハの製造方法
KR1020100089936A KR101657316B1 (ko) 2009-09-18 2010-09-14 웨이퍼 연마 장치 및 웨이퍼의 제조 방법
CN201010287709.6A CN102019581B (zh) 2009-09-18 2010-09-17 晶圆研磨装置和晶圆的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009217854A JP5541770B2 (ja) 2009-09-18 2009-09-18 ウェーハ研磨装置およびウェーハの製造方法

Publications (3)

Publication Number Publication Date
JP2011066342A JP2011066342A (ja) 2011-03-31
JP2011066342A5 true JP2011066342A5 (ru) 2012-10-25
JP5541770B2 JP5541770B2 (ja) 2014-07-09

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ID=43861573

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JP2009217854A Active JP5541770B2 (ja) 2009-09-18 2009-09-18 ウェーハ研磨装置およびウェーハの製造方法

Country Status (3)

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JP (1) JP5541770B2 (ru)
KR (1) KR101657316B1 (ru)
CN (1) CN102019581B (ru)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101616464B1 (ko) 2014-11-18 2016-04-29 주식회사 엘지실트론 웨이퍼 연마장비의 웨이퍼 로딩장치 및 웨이퍼 로딩위치 조정 방법
CN109434671A (zh) * 2018-10-11 2019-03-08 德淮半导体有限公司 一种晶圆加工设备及加工方法
JP2020059095A (ja) * 2018-10-11 2020-04-16 株式会社ブイ・テクノロジー ウェハの研磨装置および研磨方法
CN111347061B (zh) * 2018-12-24 2021-03-30 有研半导体材料有限公司 一种硅环加工的工艺方法
CN110752169B (zh) * 2019-10-21 2022-03-22 西安奕斯伟材料科技有限公司 一种晶圆处理装置和上下料方法
CN110767587B (zh) * 2019-10-21 2022-04-01 西安奕斯伟材料科技有限公司 一种晶圆处理装置和上下料方法
CN110695840B (zh) * 2019-11-07 2021-02-02 许昌学院 一种基于光电检测的半导体研磨装置
CN110900342B (zh) * 2019-11-29 2020-12-08 上海磐盟电子材料有限公司 一种磨片机
JP2022106193A (ja) 2021-01-06 2022-07-19 不二越機械工業株式会社 ウェハ研磨用キャリアおよびウェハ研磨装置
CN113579989B (zh) * 2021-08-13 2024-01-26 西安奕斯伟材料科技股份有限公司 滑片检测装置和抛光系统
CN117260450B (zh) * 2023-11-22 2024-01-23 连云港弘鼎石英有限公司 一种具有防尘机构的石英制品加工用磨边设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5679055A (en) * 1996-05-31 1997-10-21 Memc Electronic Materials, Inc. Automated wafer lapping system
JP4030247B2 (ja) * 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
JP3663348B2 (ja) * 2000-09-26 2005-06-22 Ｔｏｗａ株式会社 研磨装置及び研磨方法
JP4337581B2 (ja) * 2004-02-27 2009-09-30 信越半導体株式会社 半導体ウエーハの両面研磨装置及び割れ検査方法
JP2005288648A (ja) * 2004-04-02 2005-10-20 Sumco Corp 両面研磨装置の異物検出方法
JP4522360B2 (ja) * 2005-12-02 2010-08-11 日東電工株式会社 半導体ウエハの位置決定方法およびこれを用いた装置
JP2009123790A (ja) * 2007-11-13 2009-06-04 Disco Abrasive Syst Ltd 研削装置

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