JP2011066342A5 - - Google Patents
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- JP2011066342A5 JP2011066342A5 JP2009217854A JP2009217854A JP2011066342A5 JP 2011066342 A5 JP2011066342 A5 JP 2011066342A5 JP 2009217854 A JP2009217854 A JP 2009217854A JP 2009217854 A JP2009217854 A JP 2009217854A JP 2011066342 A5 JP2011066342 A5 JP 2011066342A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- hole
- absence
- detecting
- image processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009217854A JP5541770B2 (ja) | 2009-09-18 | 2009-09-18 | ウェーハ研磨装置およびウェーハの製造方法 |
KR1020100089936A KR101657316B1 (ko) | 2009-09-18 | 2010-09-14 | 웨이퍼 연마 장치 및 웨이퍼의 제조 방법 |
CN201010287709.6A CN102019581B (zh) | 2009-09-18 | 2010-09-17 | 晶圆研磨装置和晶圆的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009217854A JP5541770B2 (ja) | 2009-09-18 | 2009-09-18 | ウェーハ研磨装置およびウェーハの製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011066342A JP2011066342A (ja) | 2011-03-31 |
JP2011066342A5 true JP2011066342A5 (fr) | 2012-10-25 |
JP5541770B2 JP5541770B2 (ja) | 2014-07-09 |
Family
ID=43861573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009217854A Active JP5541770B2 (ja) | 2009-09-18 | 2009-09-18 | ウェーハ研磨装置およびウェーハの製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5541770B2 (fr) |
KR (1) | KR101657316B1 (fr) |
CN (1) | CN102019581B (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101616464B1 (ko) | 2014-11-18 | 2016-04-29 | 주식회사 엘지실트론 | 웨이퍼 연마장비의 웨이퍼 로딩장치 및 웨이퍼 로딩위치 조정 방법 |
JP2020059095A (ja) * | 2018-10-11 | 2020-04-16 | 株式会社ブイ・テクノロジー | ウェハの研磨装置および研磨方法 |
CN109434671A (zh) * | 2018-10-11 | 2019-03-08 | 德淮半导体有限公司 | 一种晶圆加工设备及加工方法 |
CN111347061B (zh) * | 2018-12-24 | 2021-03-30 | 有研半导体材料有限公司 | 一种硅环加工的工艺方法 |
CN110752169B (zh) * | 2019-10-21 | 2022-03-22 | 西安奕斯伟材料科技有限公司 | 一种晶圆处理装置和上下料方法 |
CN110767587B (zh) * | 2019-10-21 | 2022-04-01 | 西安奕斯伟材料科技有限公司 | 一种晶圆处理装置和上下料方法 |
CN110695840B (zh) * | 2019-11-07 | 2021-02-02 | 许昌学院 | 一种基于光电检测的半导体研磨装置 |
CN110900342B (zh) * | 2019-11-29 | 2020-12-08 | 上海磐盟电子材料有限公司 | 一种磨片机 |
JP2022106193A (ja) | 2021-01-06 | 2022-07-19 | 不二越機械工業株式会社 | ウェハ研磨用キャリアおよびウェハ研磨装置 |
CN113579989B (zh) * | 2021-08-13 | 2024-01-26 | 西安奕斯伟材料科技股份有限公司 | 滑片检测装置和抛光系统 |
CN117260450B (zh) * | 2023-11-22 | 2024-01-23 | 连云港弘鼎石英有限公司 | 一种具有防尘机构的石英制品加工用磨边设备 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5679055A (en) * | 1996-05-31 | 1997-10-21 | Memc Electronic Materials, Inc. | Automated wafer lapping system |
JP4030247B2 (ja) * | 1999-05-17 | 2008-01-09 | 株式会社荏原製作所 | ドレッシング装置及びポリッシング装置 |
JP3663348B2 (ja) * | 2000-09-26 | 2005-06-22 | Towa株式会社 | 研磨装置及び研磨方法 |
JP4337581B2 (ja) * | 2004-02-27 | 2009-09-30 | 信越半導体株式会社 | 半導体ウエーハの両面研磨装置及び割れ検査方法 |
JP2005288648A (ja) * | 2004-04-02 | 2005-10-20 | Sumco Corp | 両面研磨装置の異物検出方法 |
JP4522360B2 (ja) * | 2005-12-02 | 2010-08-11 | 日東電工株式会社 | 半導体ウエハの位置決定方法およびこれを用いた装置 |
JP2009123790A (ja) * | 2007-11-13 | 2009-06-04 | Disco Abrasive Syst Ltd | 研削装置 |
-
2009
- 2009-09-18 JP JP2009217854A patent/JP5541770B2/ja active Active
-
2010
- 2010-09-14 KR KR1020100089936A patent/KR101657316B1/ko active IP Right Grant
- 2010-09-17 CN CN201010287709.6A patent/CN102019581B/zh active Active
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