JP2011060487A - Optical device, manufacturing method thereof, and inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection method for efficiently inspecting a formation state of a liquid-repellent layer. <P>SOLUTION: In this inspection method, after a solution is applied to a partitioning area P of a dummy region, a surface shape of a solution pool k2 of the solution applied on the partitioning area is measured in three dimensions, and is compared with a reference surface shape defined beforehand. Since the surface shape of the solution pool is changed by a formation state of a liquid-repellent layer, a condition of the formation state of the liquid-repellent layer can be judged by the shape. Moreover, when the surface shape of the measured solution pool is nearly the same as the reference surface shape, a solution with an organic material dissolved is also applied onto a partitioning area of a display region V. Therefore, the inspection method of a display device capable of efficiently inspecting the formation state of the liquid-repellent layer can be provided. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an optical device, a manufacturing method thereof, and an inspection method.

A technique for forming a light emitting pixel by using a so-called droplet discharge method is known in which a solution in which an organic EL (Electro Luminescence) material is dispersed or dissolved is discharged into a recess surrounded by a partition wall (bank) by an inkjet method and dried. ing.
When forming a light emitting pixel by a droplet discharge method, it is necessary to impart liquid repellency to the upper surface of the partition wall that divides each partition region when one recessed portion partitioned by the partition wall is used as the partition region. . In other words, it is necessary to provide liquid repellency to the upper surface of the partition wall that partitions the plurality of partition regions in a lattice shape. This is performed in order to prevent the mixing (color mixing) of the solution between the adjacent partition regions by the partition wall whose height is set to about several μm. That is, by imparting liquid repellency to the upper surface of the partition wall, the solution applied to one partition region remains in a polka dot shape in the partition region, thereby preventing color mixing. In addition, there is also a significance of making the thickness of the formed organic film uniform by making the shape of the applied solution reservoir uniform.

As a method for imparting liquid repellency to the upper surface of the partition wall, for example, it is known to use a transfer method as in Patent Document 1.
In this document, after laminating a film on which a liquid repellent layer is formed on the upper surface of a lattice-shaped partition formed on a substrate, the liquid repellent layer is selectively formed on the upper surface of the partition by peeling only the film. Are supposed to be transferred. In addition, according to this method, color mixing can be prevented. In other words, the liquid repellent layer can be uniformly formed on the upper surface of the partition wall.

JP 2008-139378 A

However, whether or not the liquid repellent layer formed by the method of Patent Document 1 is uniform cannot be understood without actually discharging the solution. In other words, in this method, in order to inspect the formation state of the liquid-repellent layer, there is only a means for actually manufacturing a display panel and confirming whether the display quality is good or bad.
That is, there has been a problem that a method for efficiently inspecting the formation state of the liquid repellent layer has not been created.
Further, there has been a demand for an efficient manufacturing method that can inspect the formation state of the liquid repellent layer in-line without manufacturing a completed display panel as in the conventional method. In other words, there has been a problem that an efficient manufacturing method including an inspection process of the formation state of the liquid repellent layer has not been created.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples or forms.

(Application example)
A method of manufacturing an optical device having at least a display area in which a plurality of light-emitting pixels including an organic material is formed and a plurality of dummy pixels formed outside the display area, the substrate including a plurality of light-emitting pixels, And a step of forming a partition partitioning the plurality of dummy pixels, a step of forming a liquid repellent layer on the top surface of the partition, and each of the plurality of regions partitioned by the partition is defined as a partition region, A step of applying a solution in which an organic material is dissolved by a droplet discharge method to a partition region to be formed, and a step of three-dimensionally measuring a surface shape of a solution reservoir of a solution applied to the partition region to be a dummy pixel; A step of comparing the measured surface shape of the solution reservoir with a reference surface shape defined in advance, and if the measured surface shape of the solution reservoir is substantially the same as the reference surface shape, a light emitting pixel When That in defined areas, method of manufacturing an optical device, which comprises applying a solution of an organic material.

According to this manufacturing method, after applying the solution to the partition area to be the dummy pixel, the surface shape of the solution pool of the solution applied to the partition area is three-dimensionally measured, and a predefined reference surface Compare with shape.
Here, since the surface shape of the solution reservoir changes depending on the formation state of the liquid repellent layer, it is possible to determine whether the formation state of the liquid repellent layer is good or bad.
When the measured surface shape of the solution reservoir is substantially the same as the reference surface shape, a solution in which an organic material is dissolved is also applied to the partition region that becomes a light emitting pixel.
In other words, when the reference surface shape, which is the surface shape of the solution reservoir when the liquid repellent layer is appropriately formed, and the surface shape of the solution reservoir formed in the partition region that becomes the dummy pixel are substantially the same. Therefore, it is determined that the liquid repellent layer has been appropriately formed, and the solution in which the organic material is dissolved is also applied to the partition region that becomes the light emitting pixel. In other words, according to the manufacturing method according to the application example, unlike the conventional method in which the display panel is actually manufactured and the formation state of the liquid repellent layer is inspected, the liquid repellent layer formation state is inspected. The formation state of the liquid repellent layer can be in-line inspected using dummy pixels.
Therefore, it is possible to provide an efficient manufacturing method including an inspection process of the formation state of the liquid repellent layer.

In addition, before the partition forming step, a step of forming a plurality of wirings on the substrate is further included. The partition is formed on the wiring, and the light emitting pixel is provided below the partition for partitioning the dummy pixels. It is preferable that a wiring having a different thickness or a different width is formed with respect to the wiring formed under the partition wall.
In addition, it is preferable that the wiring formed under the partition wall that partitions the dummy pixel is thicker and / or wider than the wiring formed under the partition wall that partitions the light emitting pixel.
In the partition formation process, a grid-like partition is formed on the wiring using a photolithography method, and in the liquid repellent layer formation process, a liquid repellent layer is selectively formed on the upper surface of the partition using a transfer method. It is preferable to form.
In addition, in the step of comparing the measured surface shape of the solution reservoir and a predefined reference surface shape, if the measured surface shape of the solution reservoir is different from the reference surface shape, a liquid repellent layer forming step It is preferable to perform the liquid repellent layer forming step again under the step of reviewing the forming conditions in step 1 and the reviewed forming conditions.

  In an optical device having at least a display area in which a plurality of light-emitting pixels including an organic material are formed and a plurality of dummy pixels formed outside the display area, the plurality of light-emitting pixels and a partition partitioning the plurality of dummy pixels A method for inspecting the formation state of the liquid repellent layer formed on the upper surface of the substrate, wherein each of the plurality of regions partitioned by the partition walls is defined as a partition region, and an organic material is dissolved in the partition region that becomes a dummy pixel. The step of applying the solution by the droplet discharge method, the step of measuring the surface shape of the solution reservoir of the solution applied to the partition area serving as the dummy pixel in three dimensions, and the surface shape of the measured solution reservoir are defined in advance. And comparing the measured reference surface shape with the reference surface shape, and if the measured surface shape of the solution reservoir is substantially the same as the reference surface shape, it is determined that the liquid repellent layer is appropriately formed. Method of inspecting an optical device according to claim.

An optical device having a display area on which a plurality of light emitting pixels are formed and a plurality of dummy pixels formed outside the display area on a substrate, the plurality of wirings formed on the substrate, and on the wiring And a partition wall that partitions the plurality of light emitting pixels and the plurality of dummy pixels, a liquid repellent layer formed on the top surface of the partition wall, and a droplet discharge method in a plurality of regions partitioned by the partition wall. And a wiring having a different thickness or a width different from a wiring formed under the partition for partitioning the light emitting pixel is formed below the partition for partitioning the dummy pixel. An optical device characterized by that.
In addition, it is preferable that the wiring formed under the partition wall that partitions the dummy pixel is thicker and / or wider than the wiring formed under the partition wall that partitions the light emitting pixel.
Moreover, it is preferable that the wiring formed under the partition wall that partitions the dummy pixel includes a disconnected portion.

  A method of manufacturing an optical device having at least a filter region in which a plurality of color filters containing an organic material is formed and a plurality of dummy filters formed outside the filter region, the substrate including a plurality of color filters on a substrate, And a step of forming a partition for partitioning the plurality of dummy filters, a step of forming a liquid repellent layer on the upper surface of the partition, and each of the plurality of regions partitioned by the partitions is defined as a partition filter, A step of applying a solution in which an organic material is dissolved by a droplet discharge method, and a step of three-dimensionally measuring a surface shape of a solution pool of a solution applied to the partition region to be a dummy filter. A step of comparing the measured surface shape of the solution reservoir with a predefined reference surface shape, wherein the measured surface shape of the solution reservoir is If the reference surface shape and substantially the same, even the segmented region as a color filter, method of manufacturing an optical device, which comprises applying a solution of an organic material.

FIG. 3 is a perspective view illustrating one aspect of the optical device according to the first embodiment. The top view of an element substrate. FIG. 3 is a side sectional view of a display panel taken along a line ii in FIG. 2. The flowchart figure which shows the manufacturing process of a display panel. The figure which shows the one aspect | mode in a manufacturing process. The figure which shows the one aspect | mode in a (a)-(c) manufacturing process. (A) Sectional drawing of the partition vicinity in the dummy area | region which concerns on Embodiment 2, (b) Sectional drawing of the partition vicinity in the display area V. Sectional drawing of the partition vicinity in the dummy area | region which concerns on Embodiment 3. FIG. (A) The enlarged plan view of the element substrate which concerns on the modification 1, (b) is sectional drawing of the j cross section in (a). The top view of the element substrate which concerns on the modification 2. FIG. The top view of CF board | substrate as an optical apparatus which concerns on the modification 4. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the scales are different for each layer and each member so that each layer and each member can be recognized on the drawing.

(Embodiment 1)
"Overview of display device"
FIG. 1 is a perspective view showing an aspect of the display device according to the present embodiment.
First, the outline | summary of the display apparatus 100 as an optical apparatus which concerns on Embodiment 1 of this invention is demonstrated.

The display device 100 is an organic EL display device, and includes a display panel 18, a flexible substrate 20, and the like. The display panel 18 is a bottom emission type organic EL display panel in which a functional layer including a light emitting layer is sandwiched between the element substrate 1 and the counter substrate 16, and emits display light from the element substrate 1 side.
The display panel 18 includes a display region V composed of a plurality of pixels arranged in a matrix. As shown in the upper right portion of FIG. 1, the display region V includes blue (B), green (G), and red (R) pixels that are periodically arranged, and each pixel emits light. A full color image is displayed by light. Each pixel is a light-emitting pixel, but is called a pixel. Further, the display panel is not limited to a display panel that performs color display, and may be a display panel that performs monochrome display. The display area V has a vertically long rectangle. In each drawing including FIG. 1, the vertical direction is defined as the Y-axis direction, and the horizontal direction shorter than the vertical direction is defined as the X-axis direction. The thickness direction of the display panel 18 is the Z-axis direction. Further, the Y-axis (+) and (−) directions are defined as the vertical direction, and the X-axis (−) and (+) directions are defined as the horizontal direction.

As will be described in detail later, the plurality of organic layers including the light emitting layer in each pixel of the display region V are formed by a droplet discharge method.
Here, according to the display device 100, since the liquid repellent layer is uniformly formed on the upper surface of the partition wall by the characteristic manufacturing method according to the present embodiment, the RGB color pixels are not mixed, and the organic layer The thickness is substantially uniform, and brightness unevenness and emission color unevenness are reduced.
Moreover, since the manufacturing method incorporates an inspection process for confirming the formation state of the liquid repellent layer, the display panel 18 (element substrate 1) can be efficiently manufactured by in-line inspection.

In the display panel 18, a flexible substrate 20 is connected to an extended region where the element substrate 1 extends from the counter substrate 16. The flexible board is an abbreviation for a flexible printed circuit board having flexibility in which an iron foil wiring or the like is formed on a polyimide film base. In addition, a driving IC (Integrated Circuit) 21 is mounted on the flexible substrate 20, and a plurality of terminals for connection to a dedicated controller or an external device (none of which are shown) are formed at the end thereof. Has been.
The display panel 18 displays images, characters, and the like in the display region V by receiving control signals including power and image signals from an external device via the flexible substrate 20.

"Detailed configuration of the display panel"
FIG. 2 is a plan view of the element substrate. FIG. 3 is a side sectional view of the display panel taken along line ii of FIG.
Next, a detailed configuration of the display panel will be described with reference to FIGS.
FIG. 2 is a plan view of the element substrate 1 when viewed from the Z-axis (+) direction in FIG. For this reason, the X-axis direction is reversed compared to FIG. Further, when the element substrate 1 in a completed state is observed from this direction, a uniform common electrode (cathode) is observed. Here, for convenience of explanation, a plane in the previous stage of forming the organic layer is used. An embodiment is shown.
On the element substrate 1, lattice-like partition walls 7 are formed. Specifically, the partition walls 7 are formed so as to partition the opening portions 5e of the pixel electrodes (anodes) arranged in a matrix one by one. A plurality of regions partitioned by the partition walls 7 are referred to as partitioned regions P.
Here, the plurality of partition areas P are all formed in a vertically long rectangle having substantially the same size, but the partition areas that are (light emission) pixels arranged in the display area V and the outside of the display area It is divided into partition areas which are dummy pixels formed in the above. Specifically, a dummy area D is formed above the display area V (Y axis (+) side), and a plurality of partition areas P corresponding to two rows of dummy pixels are arranged.

In the present embodiment, a description will be given on the assumption that two rows of dummy pixels are formed above the display region V as a suitable example, but the dummy pixels may be formed anywhere as long as they are outside the display region V. The number of formation may be one row or one column or more. For example, a configuration in which two dummy areas are formed on the left and right sides of the display area V may be employed.
In this embodiment, as a preferred example, the configuration of the dummy pixel formed in the dummy region D is the same as the pixel structure of the display region V. In other words, the dummy pixel can also emit light. The structure which does not light-emit may be sufficient.
In FIG. 2, as a preferred example, the partition region P is a vertically long rectangle, and the size is a length n in the Y-axis direction and a length (width) m in the X-axis direction. In addition, it is not limited to a rectangle, A track shape, an ellipse, etc. may be sufficient. The opening 5e is also elliptical, but it may be a track, circle, rectangle, or the like.

  A red organic EL layer is formed in the column of the partition region P at the left end (X axis (−) side) of the display region V, and the column of the partition region P on the right side (X axis (+) side) thereof. A green organic EL layer is formed, and a blue organic EL layer is formed in the column of the partition region P adjacent to the right. Thereafter, the organic EL layers of the respective colors are periodically formed in this order for each partition region P row.

Subsequently, a cross-sectional configuration of the display panel 18 will be described with reference to FIG. FIG. 3 is a side sectional view in a completed state in which an organic layer, a common electrode (cathode), and a counter substrate are attached to the element substrate 1 on which the partition region P of FIG. 2 is formed. The side sectional view shows a cross section of the (light emitting) pixel in the display area V, but the cross sectional shape of the dummy pixel in the dummy area D is the same.
The display panel 18 includes an element substrate 1, an element layer 2, a planarizing layer 4, a pixel electrode 5, a wiring 6, a partition wall 7, an organic EL layer 8, a common electrode 9, an adhesive layer 11, a counter substrate 16, and the like. . A portion sandwiched between the element substrate 1 and the counter substrate 16 is referred to as a functional layer 15 as an electro-optical layer. In other words, the laminated structure from the element layer 2 to the adhesive layer 11 is referred to as a functional layer 15.
The element substrate 1 is made of transparent inorganic glass. In this embodiment, alkali-free glass is used as a suitable example. Note that the substrate is not limited to glass, and a transparent substrate such as quartz or resin (plastic or plastic film) may be used.
In the element layer 2, a pixel circuit for actively driving each pixel is formed. The pixel circuit includes a selection transistor for selecting a pixel made of a TFT (Thin Film Transistor), a driving transistor 3 for flowing a current to the organic EL layer 8, and the like, which are formed corresponding to each pixel. Has been. The pixel circuit uses low-temperature polysilicon as the active layer as a preferred example, but may have a configuration using amorphous silicon as the active layer.

On the upper layer (Z-axis (+) direction) of the element layer 2, for example, a planarization layer 4 that is an insulating layer made of an acrylic resin or the like is formed.
In the upper layer of the flattening layer 4, pixel electrodes 5 (openings 5 e) serving as anodes divided for each pixel and a plurality of wirings 6 are formed.
The pixel electrode 5 is composed of a transparent electrode such as ITO (Indium Tin Oxide) or ZnO. As shown in the leftmost red pixel in FIG. 3, the pixel electrode 5 is connected to the drain terminal of the driving transistor 3 of the element layer 2 for each pixel. They are connected by contact holes that penetrate the planarization layer 4. Although omitted in FIG. 3, an insulating layer such as SiO ₂ may be formed on the pixel electrode 5. In the case of this configuration, the opening of the insulating layer becomes the opening 5e, and the area where the pixel electrode 5 and the organic EL layer 8 are in contact is defined by the size of the opening of the insulating layer.
The plurality of wirings 6 are formed to display and drive each pixel such as a scanning line that supplies a selection signal for sequentially selecting the selection transistors described above, a data line that supplies a data signal to the driving transistor 3, or a power supply wiring. Wiring.
The wiring 6 is wired by sewing the gap between the pixel electrodes 5 in a plane. In other words, the display area V and the dummy area D are arranged at a position overlapping the partition wall 7.
The partition wall 7 is the lattice-like partition wall described above, and the cross-sectional shape is a trapezoidal shape wide on the element substrate 1 side. In addition, wiring is formed under the partition wall 7 (on the element substrate 1 side). Note that the cross-sectional shape of the partition wall 7 may be rectangular or semicircular. As a material in a preferred example, a photocurable acrylic resin, polyimide resin, fluorine resin, or the like is used.
Here, although omitted in FIG. 3, a liquid repellent layer 10 (FIG. 6) is formed on the upper surface of the partition wall 7. In addition, the kind of liquid repellent layer, a formation method, etc. are mentioned later.

The organic EL layer 8 as an organic layer is an organic EL light emitting layer formed from a plurality of organic (thin film) layers including a hole injection layer and a light emitting layer.
The organic EL layer 8 in the preferred example has a configuration in which a hole injection layer, an intermediate layer, and each color light emitting layer are laminated in this order.
As a material of the hole injection layer in a preferred example, for example, a mixture (PEDOT / PSS) in which polystyrene sulfonic acid (PSS) as a dopant is added to a polythiophene derivative such as polyethylenedioxythiophene (PEDOT) is used. Further, polystyrene, polypyrrole, polyaniline, polyacetylene, or a derivative thereof may be used.
As a material for the intermediate layer in the preferred example, for example, a polyolefin polymer fluorescent material having good hole transportability is used. Alternatively, a triphenylamine polymer may be used.

As a material for the light emitting layer, it is preferable to use a light emitting material that emits red, green, blue fluorescence or phosphorescence for each of the organic EL layers 8R, 8G, and 8B.
As a preferred example, a polyolefin polymer fluorescent material corresponding to red, green, and blue is used. Alternatively, polythiophenylene derivatives (PF), polyparaphenylene vinylene derivatives (PPV), polyphenylene derivatives (PP), polyparaphenylene derivatives (PPP), polythiophenylene derivatives such as polyvinylcarbazole (PVK), polymethylphenylenesilane (PMPS) ) Etc. may be used. In addition to these polymer materials, polymer materials such as perylene dyes, coumarin dyes, rhodamine dyes, rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, nile red, coumarin 6, quinacdrine, etc. A low molecular material may be doped.

The common electrode 9 as a cathode is a cathode formed in common so as to cover all the organic EL layers 8 and the partition walls 7, and may have a single-layer configuration or a multi-layer configuration.
As a preferred example, a multi-layer structure is used, a thin lower layer (electron injection layer) on the light emitting layer side is formed from a material having a low work function (for example, calcium), and a thick upper layer is formed from a material having a large work function (for example, aluminum). Form.
In the preferred example, the adhesive layer 11 uses a thermosetting epoxy adhesive. However, the present invention is not limited to this, and in particular, any adhesive may be used as long as it has a barrier property that prevents moisture from entering and an adhesive property of the counter substrate, and a silicon or acrylic adhesive may be used. . Alternatively, the adhesive layer 11 may be filled after an inorganic barrier layer such as a silicon nitride film or a silicon oxide film is further formed on the common electrode 9.
The counter substrate 16 is a glass substrate for sealing the functional layer 15. Alternatively, a metal substrate may be used. The counter substrate 16 is not an essential component, and the substrate may be omitted. In this case, it is preferable to form the above-described inorganic barrier layer thickly on the common electrode 9.

"Manufacturing method of display panel"
FIG. 4 is a flowchart showing the manufacturing process of the display panel. FIG. 5 is a diagram showing an aspect in the manufacturing process. FIGS. 6A to 6C are diagrams showing one embodiment in the manufacturing process.
Here, the manufacturing method of the display panel 18 will be described focusing on the formation process and the inspection process of the liquid repellent layer 10.

First, in step S1, the element substrate 1 having the openings 5e formed therein is formed by using a known manufacturing method such as a photolithography method, a vapor deposition method, a CVD (Chemical Vapor Deposition) method or the like. In other words, the element substrate 1 in which the openings 5e are formed is prepared.
In step S2, lattice-like partition walls 7 are formed using a photolithographic method. Specifically, after applying the above-described photo-curing resin to the entire surface of the element substrate 1 by a spin coat method or the like, the lattice-shaped partition walls 7 are formed by exposing and developing using a lattice-shaped mask. In the preferred example, a black photocurable resin is used.
Thereby, as shown in FIG. 2, the partition wall 7 which partitions the plurality of openings 5e one by one is formed. In other words, the partition 7 that partitions the display region V and the dummy region D into a plurality of partition regions P is formed.

In step S3, the display area V including the opening 5e and the exposed surface of the dummy area D are subjected to a lyophilic process. Specifically, plasma processing using oxygen as a processing gas (O ₂ plasma processing) is performed in an air atmosphere. By this process, hydroxyl groups are introduced into the exposed surfaces of the display area V and the dummy area D including the opening 5e to impart lyophilicity.
In step S4, as shown in FIG. 5, the transfer film 85 is overlaid on the element substrate 1 (preparation body), and a liquid repellent layer is formed on the upper surface of the partition wall 7 using the transfer method.
Here, the transfer film 85 is a film member in which a liquid repellent layer is laminated on one surface of a resin film serving as a base material. As the resin film, a polyolefin film, a polystyrene film, a nylon film, a fluororesin film, or the like can be used. As the liquid repellent layer, a liquid repellent containing a fluorine compound or a silicon compound can be used.
In this embodiment, as a preferable example, a PET film made of polyethylene terephthalate (PET) having a thickness of about 20 μm is used as a resin film, and a liquid repellent containing a fluorine-based compound is formed on the PET film with a bar coater of about 80 nm. A transfer film 85 is formed by applying a thickness and heating and drying at about 100 ° C. to form a liquid repellent layer 86. As a specific liquid repellent, for example, Novec (registered trademark) EGC-1720 manufactured by Sumitomo 3M Limited can be used.

Then, as shown in FIG. 5, a transfer film 85 is overlaid on the element substrate 1 with the partition wall 7 face up, with the liquid repellent layer 86 side down, to form a preparation.
In this embodiment, as a suitable example, the liquid repellent layer is selectively formed on the upper surface of the partition wall 7 by laminating the prepared body with a laminating apparatus. FIG. 5 shows only the pressure rollers 81 and 82 made of an elastomer such as silicon rubber having heat conductivity in the laminating apparatus. Lamination is a kind of transfer method. As specific laminating conditions, the temperature of the pressure rollers 81 and 82 was about 130 ° C., and the conveyance speed (laminating speed) of the prepared body was 0.5 m / min.
Note that the transfer method is not limited to the laminating method using a roller, and any transfer method capable of selectively forming a liquid repellent layer on the upper surface of the partition wall 7 may be used. For example, a method of selectively forming a liquid repellent layer on the upper surface of the partition wall 7 by pressing a flat plate heated from above the preparation body may be used.

Thereby, as shown in FIG. 6A, the liquid repellent layer 10 is selectively formed on the upper surface of the partition wall 7. The upper surface of the partition wall 7 refers to the upper bottom in the cross-sectional shape of the partition wall 7 having a substantially trapezoidal shape with a long lower base and a short upper base, and has a convex shape including a curved surface. Specifically, it has a shape in which the height of the substantially normal distribution curve is lowered, and includes two oppositely curved surfaces (shoulders) that are mountain hems at both ends of the curved surface that is the top (top). Yes. These shapes change according to the thickness and width of the wiring 6 formed under the partition wall 7.
FIGS. 6A to 6C are enlarged views of the partition region in which the red pixel of FIG. 3 is formed. The thickness of the wiring 6 in this embodiment is set to the thickness t1, and the width is the width w1. Is set to Therefore, the distance from the end of the wiring 6 to the end of the partition wall 7 is the length f1, and the height of the upper surface from the shoulder to the top (top) of the partition wall 7 is the height h1. . These dimensions are common to the display area V and the dummy area D.

In step S5, using a droplet discharge method (inkjet method), a solution in which an organic material is dissolved is discharged to the uppermost partition region (Y-axis (+) side) of the dummy region D in FIG. In other words, the solution is selectively discharged to the outermost partition area P row of the dummy area D. In the present embodiment, the hole injection layer material is used as the organic material, but any material similar to the organic material forming the organic layer may be used. For example, an organic material having a color tone with excellent visibility may be used, or a dye may be added. According to this, it is possible to easily identify the solution pool of the discharged solution.
Note that the present invention is not limited to the ink jet method, and any coating method capable of discharging the solution to a predetermined position may be used. For example, a dispenser method such as a jet dispenser method or a needle dispenser method may be used.

FIG. 6A shows a state in which the discharged solution becomes a solution pool in the partition region P. Since the shape (size) of the partition area P in the display area V and the dummy area D is the same, the outermost partition area P of the dummy area D is used with reference to FIGS. Explain.
The droplet k1 of the solution discharged from the discharge head 510 of the droplet discharge device (not shown) lands in the partition region P, and as shown in the figure, a convex (polka dot) solution reservoir k2 and Become.
Here, the solution reservoir k2 has a convex shape because the opening 5e and the like forming the bottom of the partition region P have lyophilic properties and the lyophobic layer 10 has lyophobic properties. The filled solution accumulates in the partition region P with a polka dot-like bulge due to its surface tension. In other words, when the liquid repellent layer 10 is appropriately formed on the upper surface of the partition wall 7, the solution reservoir k <b> 2 becomes a convex solution reservoir k <b> 2 with the shoulder portion of the partition wall 7 as the peripheral edge.

FIG. 6B is a comparison diagram of FIG. 6A and shows a state of solution accumulation when the liquid repellent layer 10 is poorly formed. As shown in the figure, the liquid repellent layer 10 is formed only on the uppermost portion (top) of the upper surface of the partition wall 7 and is not formed on the shoulder portions at both ends.
The surface of the solution reservoir k3 formed in the partition region P in this state is substantially flat or slightly concave. This is because the solution is filled covering the shoulder of the partition wall 7. In other words, the capacity (area) of the partition region P defined by the liquid repellent layer 10 is increased.
When the solution reservoir k2 in FIG. 6A and the solution reservoir k3 in FIG. 6B are dried under the same conditions to form an organic layer, the organic layer formed in the partition region P in FIG. However, it becomes thinner than the organic layer formed in the partition region P of (a). In other words, when the display area V includes a partition area P in which the liquid repellent layer 10 is poorly formed, there is a problem that uneven brightness or uneven emission color occurs.
Moreover, as a failure mode, a case where the liquid repellent layer 10 is not formed on the upper surface of the partition wall 7 is also assumed. In this case, there is a problem that color mixture occurs.

Returning to FIG.
In step S6, the surface shape (shape profile) of the solution reservoir k2 applied to the partition region P of the dummy region D is measured three-dimensionally. Specifically, the measurement is performed using a scanning white interferometer capable of measuring a three-dimensional dimension in a non-contact manner by irradiating the partition region P including the solution reservoir k2 with high-intensity white light. The principle of the scanning white interferometer is a CCD (Charge Coupled Device) corresponding to the surface to be measured using white light with little coherence as a light source and using an optical path interferometer such as a Mirau type or a Michelson type. The optical path position of each pixel (the position where the interference intensity is maximized) is detected by vertically scanning (scanning) the interferometer objective lens.
In the present embodiment, as a suitable example, the surface shape for one line in the dummy region D is measured, but it is not necessary to measure all the lines. For example, it may be measured every one or more, or may be measured only with a solution pool having a sense of incongruity when observed with a microscope.

In step S7, the measured surface shape of the solution reservoir is compared with a predefined reference surface shape. If the measured surface shape of the solution reservoir is substantially the same (within the standard) as the reference surface shape, the process proceeds to step S8. When the surface shapes are different (for example, FIG. 6B), the process proceeds to step S10.
The reference surface shape is stored, for example, with a width (threshold value) that allows a suitable surface shape measured in advance by a computer for comparison.

In step S8, the organic EL layer 8 is formed in all the partition areas P of the display area V by using a droplet discharge method. The organic EL layer 8 is formed by repeating the solvent coating step and the drying step for each organic layer.
In the drying process, vacuum drying and heat treatment are performed. First, the element substrate 1 on which the solution has been applied is transferred to a vacuum chamber and vacuum dried. As a result, the boiling point of the solvent in the solution decreases and the solvent evaporates at a low temperature, so that the solute is deposited and a hole injection layer is formed. Further, heat treatment is performed to remove the remaining solvent. In a preferred example, heat treatment is performed at about 200 ° C. for about 10 minutes in a nitrogen gas atmosphere.
In the drying process, the element substrate 1 may be heated. For example, a method of heating the substrate on a hot plate or a method of irradiating an infrared lamp from above the display region V can be employed. Further, these methods may be combined. According to such a method, drying can be performed more efficiently.

FIG. 6C shows an organic EL layer 8R having a stacked structure in which three layers of a hole injection layer, an intermediate layer, and a light emitting layer are stacked in the partition region P in this way.
In step S9, the common electrode 9 (FIG. 3) is formed to cover all the organic EL layers 8 and the partition walls 7 (the liquid repellent layer 10). In a preferred example, the common electrode 9 is formed by laminating calcium as an electron injection layer and aluminum as a cathode layer by vapor deposition in this order. Although not shown in the flowchart of FIG. 4, after the common electrode 9 is formed, the counter substrate 16 is bonded by the adhesive layer 11 to complete the display panel 18.

Next, a case where the surface shape is different in step S7 will be described.
Step S10 is a subroutine and includes a step of reviewing the formation conditions in the liquid repellent layer forming step (step S4) and a step of performing the liquid repellent layer forming step again under the reexamined formation conditions. Yes.
In the process of reviewing the forming conditions, review all the laminating conditions such as the shape of the partition wall 7, the quality of the transfer film 85, the temperature of the pressure rollers 81 and 82, the conveying speed of the prepared body, and investigate the cause of the formation failure. Take necessary measures.
In the step of forming the liquid repellent layer again, the steps after step S4 are performed again under the conditions after countermeasures. Note that the same element substrate 1 may be used because there is no functional problem even if the liquid repellent layers are formed in a double layer. Further, in this case, in step S5, a solution in which an organic material is dissolved is discharged to the partition region P row below the uppermost stage (second stage) of the dummy area D in FIG.

According to the results of a long-term experiment in the mass production process employing the above flow by the inventors, no formation failure was detected in step S7 from the start of the experiment to 3 months. After three months, formation defects were detected in step S7, and as a result of reviewing the formation conditions in step S10, it was found that the silicon rubber of the pressure rollers 81 and 82 was deteriorated.
When this silicon rubber was replaced with a new one, the formation failure in step S7 was not detected.
Further, the steps from step S5 to step S7 correspond to the display device inspection method in the present embodiment.
In the above description, the wiring 6 is formed under the partition wall 7. However, the wiring 6 may be omitted. If the cross-sectional shapes of the partition walls 7 in the display area V and the dummy area D are the same, the above flow can be applied.

"Dimensions in the preferred example"
The dimensions of each part according to the above-described preferred example will be introduced with reference to FIG. 2 and FIG.
First, “length n × width m” of the partition region was set to “about 300 μm × about 150 μm”.
Further, the opening 5e has a length of about 200 μm and a width of about 100 μm.
The height (thickness) of the partition wall 7 was about 3 μm.
The thickness of the liquid repellent layer 10 was about 80 nm.
The thickness t1 of the wiring 6 was about 1.0 μm.
The height h1 of the upper surface from the shoulder to the top (top) of the partition wall 7 was about 0.5 μm.

As described above, according to the display device 100 and the manufacturing method (inspection method) according to the present embodiment, the following effects can be obtained.
According to the manufacturing method described above, after applying the solution to the partition region of the dummy region D, the surface shape of the solution pool of the solution applied to the partition region is three-dimensionally measured, and a predefined standard It is compared with the surface shape (steps S4 to S7).
Since the surface shape of the solution reservoir changes depending on the formation state of the liquid repellent layer, whether the liquid repellent layer is formed or not can be determined based on the shape.
When the measured surface shape of the solution reservoir is substantially the same as the reference surface shape, the solution in which the organic material is dissolved is also applied to the partition region of the display region V (steps S7 to S8).
That is, when the reference surface shape that is the surface shape of the solution reservoir when the liquid repellent layer is appropriately formed and the surface shape of the solution reservoir formed in the partition region of the dummy region D are substantially the same. Therefore, it is determined that the liquid repellent layer is appropriately formed, and the solution in which the organic material is dissolved is also applied to the partition region of the display region V. In other words, according to the manufacturing method (inspection method) according to the present embodiment, the liquid repellent layer formation state is different from the conventional method in which the display panel is actually manufactured and the liquid repellent layer formation state is inspected. The formation state of the liquid repellent layer can be in-line inspected using a dummy pixel for inspecting.
Accordingly, it is possible to provide an efficient method for manufacturing a display device including a step of inspecting the formation state of the liquid repellent layer. Further, it is possible to provide an inspection method for a display device that can efficiently inspect the formation state of the liquid repellent layer.

In step S7, if the measured shape profile is out of specification, the process proceeds to step S10, where the formation conditions in the liquid repellent layer formation step (step S4) are reviewed and the reexamined formation conditions again. And a step including a step of forming a liquid layer.
In the process of reviewing the forming conditions, the flow of the product is stopped and all the laminating conditions are reviewed, so that the generation of defective products can be suppressed to the minimum.
When the cause of the formation failure is investigated, necessary measures are taken, and the steps after the liquid repellent layer forming step (step S4) are performed again. At this time, since the same element substrate 1 can be used, generation of defective products can be reduced.
Therefore, a method for manufacturing a display device with high yield can be provided.

Further, according to the display device 100 manufactured by the above manufacturing method, no color mixing occurs in the display region V, and the thickness of the organic layer in each pixel is substantially uniform.
Therefore, it is possible to provide the display device 100 in which the luminance unevenness and the emission color unevenness are suppressed.

(Embodiment 2)
FIG. 7A is a cross-sectional view of the vicinity of the partition wall in the dummy region according to the second embodiment, and FIG. 7B is a cross-sectional view of the vicinity of the partition wall in the display region V, both corresponding to FIG. Moreover, both figures have shown the state before forming a liquid repellent layer.
The display device according to Embodiment 2 of the present invention will be described below. In addition, about the component same as Embodiment 1, the same number is attached | subjected and the overlapping description is abbreviate | omitted.
In the display device of the present embodiment, the cross-sectional shape of the partition wall 7 in the display region V is different from the cross-sectional shape of the partition wall 7 in the dummy region D. Specifically, the liquid repellent layer in the dummy area D is more difficult to form than the display area V by making the thickness of the wiring 6 below the partition wall 7 in the dummy area D larger than the thickness of the wiring 6 in the display area V. is doing. Other than that, it is substantially the same as the description of the display device 100.

First, FIG. 7B shows a cross-sectional shape of the partition wall 7 in the partition region P in the display region V, and this dimensional relationship is the same as that described in the first embodiment (FIG. 6A).
FIG. 7A shows the cross-sectional shape of the partition wall 7 in the partition region P in the dummy region D. FIG.
Here, the thickness of the wiring 6 is thicker than the thickness t1 of (b). For this reason, the height of the upper surface from the shoulder to the top (top) of the partition wall 7 is a height h2 that is higher than the height h1 in FIG.
In a preferred example, when the thickness t1 of the wiring 6 in the display region V is about 1.0 μm, the thickness t2 of the wiring 6 in the dummy region D is about 1.3 μm.
The height h of the upper surface of the partition wall 7 is a dimension serving as an index of the difficulty in forming the liquid repellent layer. The higher the height (the thicker the wiring 6), the more the liquid repellent layer is formed (transferred). ) Becomes difficult. That is, the thickness of the wiring 6 is set so that it is more difficult to form the liquid repellent layer in the dummy area D than in the display area V.
The standard surface shape uses the same standard (threshold) setting as in the first embodiment.
Other configurations and manufacturing methods are the same as those described in the first embodiment.

As described above, according to the optical device and the manufacturing method according to the present embodiment, the following effects can be obtained in addition to the effects of the first embodiment.
According to the configuration described above, the thickness t of the wiring 6 is set so that the formation (transfer) of the liquid repellent layer in the dummy region D is more difficult than in the display region V.
That is, in the dummy area D, the formation of the liquid repellent layer is more likely to occur than in the display area V, so that the formation state of the liquid repellent layer can be inspected under more severe detection conditions. In other words, it can be said that the formation state of the liquid repellent layer in the display area V is appropriate with high accuracy if no defective formation of the liquid repellent layer is detected in the dummy area D where it is difficult to form the liquid repellent layer.
Therefore, it is possible to provide an inspection method for a display device that can detect the formation state of the liquid repellent layer with higher accuracy.

(Embodiment 3)
FIG. 8 is a cross-sectional view of the vicinity of the partition wall in the dummy region according to the third embodiment, and corresponds to FIGS. 6 and 7. Further, the drawing shows a state before the liquid repellent layer is formed.
The display device according to Embodiment 3 of the present invention will be described below. In addition, about the component same as Embodiment 1, the same number is attached | subjected and the overlapping description is abbreviate | omitted.
Also in the display device of this embodiment, the cross-sectional shape of the partition wall 7 in the display region V and the cross-sectional shape of the partition wall 7 in the dummy region D are different. Specifically, the width of the wiring 6 below the partition wall 7 in the dummy area D is made wider than the width of the wiring 6 in the display area V, thereby making it difficult to form the liquid repellent layer in the dummy area D than in the display area V. ing. Other than that, it is substantially the same as the description of the display device 100.

First, the cross-sectional shape of the partition wall 7 in the partition region P in the display region V is the same as the cross-sectional shape in FIG. 7B, and will be described below in comparison with the figure.
FIG. 8 shows a cross-sectional shape of the partition wall 7 in the partition region P in the dummy region D of the present embodiment, and the width of the wiring 6 is wider than the width w1 in FIG. 7B. For this reason, the distance from the end of the wiring 6 to the end of the partition wall 7 is a length f2 that is shorter than the length f1 of FIG.
Similarly to the height h of the upper surface of the partition wall 7, the length f2 from the end of the wiring 6 to the end of the partition wall 7 is a dimension serving as an index of the difficulty in forming the liquid repellent layer. The shorter the length (the wider the wiring 6), the more difficult it is to form (transfer) the liquid repellent layer. This is because the curved surface of the shoulder portion (bottom portion) on the upper surface of the partition wall 7 becomes small and transfer to the portion becomes difficult.
Thus, the width of the wiring 6 is set so that the formation (transfer) of the liquid repellent layer in the dummy area D is more difficult than in the display area V.
The standard surface shape uses the same standard (threshold) setting as in the first embodiment.
Other configurations and manufacturing methods are the same as those described in the first embodiment.

As described above, according to the optical device and the manufacturing method according to the present embodiment, the following effects can be obtained in addition to the effects of the first embodiment.
According to the configuration described above, the width w of the wiring 6 is set so that it is more difficult to form (transfer) the liquid repellent layer in the dummy region D than in the display region V.
That is, in the dummy area D, the formation of the liquid repellent layer is more likely to occur than in the display area V, so that the formation state of the liquid repellent layer can be inspected under more severe detection conditions. In other words, it can be said that the formation state of the liquid repellent layer in the display area V is appropriate with high accuracy if no defective formation of the liquid repellent layer is detected in the dummy area D where it is difficult to form the liquid repellent layer.
Therefore, it is possible to provide an inspection method for a display device that can detect the formation state of the liquid repellent layer with higher accuracy.

  Note that the present invention is not limited to the above-described embodiment, and various modifications and improvements can be added to the above-described embodiment. A modification will be described below.

(Modification 1)
FIG. 9A is an enlarged plan view of an element substrate according to the first modification, and corresponds to FIG. FIG. 9B is a cross-sectional view taken along the line j-j in FIG.
In each of the above embodiments, the surface shape of the solution pool of the solution is measured and then compared with the reference surface shape to determine whether or not the liquid repellent layer is formed. However, the present invention is not limited to this method. For example, the quality may be determined by visually observing the application mode of the solution in the dummy region D with a microscope or the like.
The element substrate 31 according to the first modification differs from the configuration of the first embodiment only in the configuration of the partition region P in the dummy region D. Further, the inspection method (manufacturing method) of the formation state of the liquid repellent layer is also different from the description in the first embodiment.
First, in the partition region P in the dummy region D, a portion without the wiring 6 is formed under the partition wall 7. In other words, a disconnected portion of the wiring 6 is formed under the partition wall 7.
Specifically, as shown by hatching in FIG. 9A, a disconnection portion of the wiring 6 is formed at the center of the partition wall 7 that partitions the partition regions P adjacent in the X-axis direction. In other words, the wiring 6 (not shown) extending in the Y-axis direction so as to overlap the partition wall 7 is disconnected at a portion indicated by hatching in the dummy region D. Further, the length u of the disconnected portion of the wiring 6 is set to be shorter than the width m of the partition region P.

FIG. 9B is a cross-sectional view of the disconnected portion of the partition wall 7. Since the wiring 6 is not formed in this part, the upper surface of the partition wall 7 is compared with the reference section of FIG. 7B. The shape is flat, and the height of the upper surface is also a height h3 which is lower than the height h1 in the reference cross section. The cross-sectional shape other than the broken portion is the reference cross-sectional shape of FIG. 7B for both the dummy region D and the display region V.
Moreover, if the lamination conditions in the formation process of the liquid repellent layer mentioned above are an intended condition, it is the condition setting which can form a liquid repellent layer without trouble also in this disconnection part. In other words, the disconnection portion has a configuration in which a poor formation of the liquid repellent layer is more likely to occur than in the display region V.
Then, in the inspection process of the formation state of the liquid repellent layer, the partition regions P to which the solution is applied are set as the partition regions P every other row in the dummy region D in step S5 of FIG. For example, as shown in FIG. 9A, each color name is circled, and the green (G) partitioned area P row, the red (R) partitioned area P row, and the blue (B) partitioned area in the dummy area D The solution is applied to every other partition area P in the uppermost partition area P row of the dummy area D, such as P columns.

Subsequently, in step S6, the dummy region D is visually observed using a microscope or a magnifying glass, and it is inspected whether or not the applied solution has entered the partition region P in the adjacent row. In other words, whether or not the applied solution has entered the adjacent partition region P is inspected.
If entry into the adjacent partition area P is not recognized, the process proceeds to step S8. If entry into the adjacent partition area P is recognized, the process proceeds to step S10.
Except for these steps, the process is the same as that described in the first embodiment (the flowchart in FIG. 4).

As described above, according to the inspection method (manufacturing method) according to this modification, in addition to the effects of the first embodiment, the following effects can be obtained.
According to the inspection method (manufacturing method) according to this modification, since the inspection of the formation state of the liquid repellent layer can be performed visually, it is simple and efficient. Further, a measuring device for measuring the surface shape of the solution reservoir is not necessary.
Therefore, it is possible to provide an inspection method for a display device that can easily and efficiently inspect the formation state of the liquid repellent layer. It is possible to provide a simple and efficient method for manufacturing a display device including a step of inspecting the formation state of the liquid repellent layer.
Further, since the dummy region D is configured such that the formation of the liquid repellent layer is more likely to occur than in the display region V, the formation state of the liquid repellent layer can be inspected under more severe detection conditions. Therefore, it is possible to provide an inspection method for a display device that can detect the formation state of the liquid repellent layer with higher accuracy.

(Modification 2)
FIG. 10 is a plan view of an element substrate according to the second modification, and corresponds to FIG.
In each of the above embodiments, one partition region P is formed for each opening 5e by the partition wall 7. However, the present invention is not limited to this configuration. For example, as shown in FIG. 10, a partition 77 configuration in which one partition region is formed for the plurality of openings 5e may be employed.
The element substrate 51 of Modification 2 includes a partition wall 77 different from the partition wall 7 (FIG. 2) of the first embodiment. Specifically, the partition 77 has a configuration in which one partition region P (common bank) is formed for two openings 5e adjacent in the Y-axis direction. For this reason, the length of the partition region P in the vertical direction is the length 2n. Except this point, it is the same as the description in the first embodiment.

Even with this configuration, since it is possible to determine the formation state of the liquid repellent layer from the surface shape of the solution pool in the dummy region D, the same effects as those of the first embodiment can be obtained. In this case, the reference surface shape needs to be measured and set in advance using the partition region P having a length of 2n.
Note that the present invention is not limited to the configuration in which one partition region P is formed for two openings 5e, and that one partition region P is formed for three or more openings 5e. Also good. Alternatively, one partition region P may be formed in the peripheral portion with respect to the plurality of openings 5e, and one partition region P may be formed in the center portion with respect to one opening 5e. . Even if it is these structures, if the comparison object is clarified, the same effect can be acquired.
Note that the configuration of the present modification can be applied to the above-described embodiments and modifications other than the first embodiment, and the same operational effects can be obtained.

(Modification 3)
This will be described with reference to FIG.
In the above embodiments and modifications, the display panel 18 has been described as a bottom emission type organic EL panel. However, the display panel 18 may be a top emission type organic EL panel, and is formed by applying and drying an organic layer. Any optical device may be used.
Specifically, when the display panel 18 is a top emission type, a total reflection layer is formed on the element substrate 1 side of the opening 5e (pixel electrode 5). Further, the common electrode 9 is thinned to form a half mirror layer. As a result, display light is emitted from the counter substrate 16 side.
Even if it is these structures, the effect similar to each said embodiment can be acquired.

(Modification 4)
FIG. 11 is a plan view of a CF substrate as an optical device according to the fourth modification, and corresponds to FIG.
In the above embodiments, the display panel 18 that is an organic EL panel has been described. However, the display panel 18 may be applied to a CF substrate as an optical device. In addition, about the component same as Embodiment 1, the same number is attached | subjected and the overlapping description is abbreviate | omitted.
The CF substrate 116 according to the modification 4 is a substrate on which a color filter used for a liquid crystal panel or a top emission type organic EL panel is formed. For this reason, the pixel electrode 5 (opening 5e), the element layer 2 (FIG. 3), etc. are not formed.
When the manufacturing method of the first embodiment (FIG. 4) is applied to the CF substrate 116, a transparent solid substrate is used (step S1). Further, the organic layer forming step (step S8) is changed, and the common electrode forming step (step S9) is not necessary. The other steps are the same.

Specifically, in the organic layer forming step (step S8), a solution in which the material constituting the color filter is dissolved need only be applied once by the droplet discharge method. In other words, the organic layer has only one layer. In FIG. 11, a region where a plurality of color filters are formed is a region V (corresponding to the display region V), and three color filters of RGB are arranged in stripes, but the number of colors is further increased. May be more. Also, different color arrangements such as a delta arrangement may be used.
Even if it is these structures, the effect similar to each said embodiment can be acquired.

  1, 31, 51: Element substrate as substrate, 5: Pixel electrode, 5e: Opening, 6 ... Wiring, 7, 77 ... Partition, 8, 8R, 8G, 8B ... Organic EL layer as a plurality of organic layers, DESCRIPTION OF SYMBOLS 9 ... Common electrode, 10 ... Liquid repellent layer, 18 ... Display panel, 100 ... Display apparatus as an optical apparatus, 116 ... CF board | substrate as an optical apparatus, D ... Dummy area | region, k2, k3 ... Solution reservoir, P ... Partition area | region , V ... display area.

Claims (10)

A method of manufacturing an optical device having at least a display area in which a plurality of light emitting pixels including an organic material is formed and a plurality of dummy pixels formed outside the display area,
Forming a plurality of light emitting pixels and a partition partitioning the plurality of dummy pixels on a substrate;
Forming a liquid repellent layer on the upper surface of the partition;
When each of the plurality of regions partitioned by the partition walls is defined as a partitioned region, a step of applying a solution in which the organic material is dissolved to the partitioned region serving as the dummy pixel by a droplet discharge method;
Three-dimensionally measuring the surface shape of the solution pool of the solution applied to the partition region to be the dummy pixels;
Comparing the measured surface shape of the solution reservoir with a predefined reference surface shape,
When the measured surface shape of the solution reservoir is substantially the same as the reference surface shape, the solution in which the organic material is dissolved is also applied to the partition region serving as the light emitting pixel. Device manufacturing method. Before the step of forming the partition wall, the method further includes a step of forming a plurality of wirings on the substrate.
The partition is formed on the wiring,
A wiring having a different thickness or a different width from the wiring formed under the partition for partitioning the light emitting pixel is formed under the partition for partitioning the dummy pixel. The method of manufacturing an optical device according to claim 1.   The wiring formed under the partition partitioning the dummy pixel is thicker and / or wider than the wiring formed under the partition partitioning the light emitting pixel. The method of manufacturing an optical device according to claim 2. In the partition formation step, using a photolithography method, the grid-shaped partition is formed on the wiring,
4. The optical according to claim 1, wherein, in the liquid repellent layer forming step, the liquid repellent layer is selectively formed on an upper surface of the partition wall using a transfer method. Device manufacturing method. In the step of comparing the measured surface shape of the solution reservoir and a predefined reference surface shape,
When the measured surface shape of the solution reservoir is different from the reference surface shape,
Reviewing the formation conditions in the liquid repellent layer forming step;
The method for manufacturing an optical device according to claim 1, wherein the liquid repellent layer is formed again under the reexamined formation conditions. In an optical device having at least a display area in which a plurality of light-emitting pixels including an organic material are formed and a plurality of dummy pixels formed outside the display area, the plurality of light-emitting pixels and the plurality of dummy pixels are A method for inspecting the formation state of a liquid repellent layer formed on the upper surface of a partition wall,
Applying each of the plurality of regions partitioned by the partition walls as a partitioned region by applying a solution in which the organic material is dissolved to the partitioned region serving as the dummy pixel by a droplet discharge method;
Three-dimensionally measuring the surface shape of the solution pool of the solution applied to the partition region to be the dummy pixels;
Comparing the measured surface shape of the solution reservoir with a predefined reference surface shape,
A method for inspecting an optical device, comprising: determining that the liquid repellent layer is appropriately formed when the measured surface shape of the solution reservoir is substantially the same as the reference surface shape. An optical device having a display area on which a plurality of light emitting pixels are formed and a plurality of dummy pixels formed outside the display area on a substrate,
A plurality of wirings formed on the substrate;
A partition that is formed on the wiring and partitions the plurality of light emitting pixels and the plurality of dummy pixels,
A liquid repellent layer formed on the upper surface of the partition;
An organic layer formed by a droplet discharge method in a plurality of regions partitioned by the partition wall,
A wiring having a different thickness or a different width from the wiring formed under the partition for partitioning the light emitting pixel is formed under the partition for partitioning the dummy pixel. Optical device characterized.   The wiring formed under the partition partitioning the dummy pixel is thicker and / or wider than the wiring formed under the partition partitioning the light emitting pixel. The optical device according to claim 7.   The optical device according to claim 7, wherein the wiring formed under the partition that partitions the dummy pixel includes a disconnected portion. A method of manufacturing an optical device having at least a filter region in which a plurality of color filters containing an organic material is formed and a plurality of dummy filters formed outside the filter region,
Forming a partition that partitions the plurality of color filters and the plurality of dummy filters on a substrate;
Forming a liquid repellent layer on the upper surface of the partition;
When each of the plurality of regions partitioned by the partition walls is defined as a partitioned region, a step of applying a solution in which the organic material is dissolved to the partitioned region serving as the dummy filter by a droplet discharge method;
A step of three-dimensionally measuring the surface shape of the solution pool of the solution applied to the partition region to be the dummy filter;
Comparing the measured surface shape of the solution reservoir with a predefined reference surface shape,
When the measured surface shape of the solution reservoir is substantially the same as the reference surface shape, the solution in which the organic material is dissolved is also applied to the partition region serving as the color filter. Device manufacturing method.

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