JP2011058048A5 - - Google Patents

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Publication number
JP2011058048A5
JP2011058048A5 JP2009208939A JP2009208939A JP2011058048A5 JP 2011058048 A5 JP2011058048 A5 JP 2011058048A5 JP 2009208939 A JP2009208939 A JP 2009208939A JP 2009208939 A JP2009208939 A JP 2009208939A JP 2011058048 A5 JP2011058048 A5 JP 2011058048A5
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Japan
Prior art keywords
film forming
vacuum
molding machine
forming apparatus
product
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Pending
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JP2009208939A
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Japanese (ja)
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JP2011058048A (en
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Priority to JP2009208939A priority Critical patent/JP2011058048A/en
Priority claimed from JP2009208939A external-priority patent/JP2011058048A/en
Publication of JP2011058048A publication Critical patent/JP2011058048A/en
Publication of JP2011058048A5 publication Critical patent/JP2011058048A5/ja
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Description

請求項1に記載された発明は、成形機から取り出された被成膜製品を40〜80℃に保ったまま真空成膜装置本体へ移載し、この真空成膜装置本体内で真空引きされた雰囲気下で被成膜製品に薄膜をドライコーティングする真空成膜方法である。 According to the first aspect of the present invention, the film forming product taken out from the molding machine is transferred to the vacuum film forming apparatus main body while maintaining the temperature at 40 to 80 ° C., and is evacuated in the vacuum film forming apparatus main body. This is a vacuum film formation method in which a thin film is dry-coated on a film-formed product in an atmosphere.

請求項2に記載された発明は、請求項1記載の真空成膜方法において、成形機から取り出された被成膜製品を40〜80℃に保ったまま被成膜製品の静電気を除去して真空成膜装置本体へ移載する方法である。 According to a second aspect of the present invention, in the vacuum film formation method according to the first aspect, static electricity of the film formation product is removed while the film formation product taken out from the molding machine is kept at 40 to 80 ° C. This is a method of transferring to a vacuum film forming apparatus main body.

請求項3に記載された発明は、成形機の傍に隣接して設置され、成形機から取り出された被成膜製品に真空引きされた雰囲気下で薄膜をドライコーティングする真空成膜装置本体と、成形機と真空成膜装置本体との間に設置されて被成膜製品を40〜80℃に保ったまま成形機から真空成膜装置本体へ移載する移載装置とを具備した真空成膜装置である。 The invention described in claim 3 is a vacuum film forming apparatus main body which is installed adjacent to a molding machine and dry coats a thin film in an atmosphere evacuated to a film forming product taken out from the molding machine. A vacuum forming apparatus provided with a transfer device installed between the molding machine and the vacuum film forming apparatus main body to transfer the film-formed product from the molding machine to the vacuum film forming apparatus main body while maintaining the film-formed product at 40 to 80 ° C. It is a membrane device.

請求項1記載の発明によれば、成形機から取り出された被成膜製品を40〜80℃に保ったまま真空成膜装置本体へ移載することで、被成膜製品の表面温度を成形機から取出した直後の温度に保ち被成膜製品に対する膜の密着性を上げると同時に、被成膜製品の水分吸蔵を抑制するようにしたので、この真空成膜装置本体内で被成膜製品に真空引きを施す際の真空度合を中真空で済ませることができるとともに真空引きに要する時間を短縮でき、薄膜作製時間の短縮と真空引きに消費するエネルギの低減とを図ることができるとともに、このような省エネルギ化を、成形機から取り出して真空成膜装置本体へ移載する段階で、すなわち成形機の外で実現できるので、既設成形機の利用を可能にした真空成膜方法を提供できる。 According to the first aspect of the present invention, the surface temperature of the film-formed product is molded by transferring the film-formed product taken out from the molding machine to the vacuum film forming apparatus main body while maintaining the temperature at 40 to 80 ° C. Maintaining the temperature immediately after removal from the machine to increase the adhesion of the film to the film-forming product and at the same time suppress the moisture occlusion of the film-forming product. The degree of vacuum when vacuuming can be reduced to medium vacuum, the time required for vacuuming can be shortened, the time required for thin film preparation can be shortened, and the energy consumed for vacuuming can be reduced. Such energy saving can be realized at the stage of taking out from the molding machine and transferring it to the vacuum film forming apparatus main body, that is, outside the molding machine, so that it is possible to provide a vacuum film forming method that enables the use of an existing molding machine. .

請求項3記載の発明によれば、成形機から取り出された被成膜製品を移載装置により40〜80℃に保ったまま真空成膜装置本体へ移載することで、成形機から取り出された被成膜製品の水分吸蔵を抑制するようにしたので、この真空成膜装置本体内で被成膜製品に真空引きを施す際の真空度合を中真空で済ませることができるとともに真空引きに要する時間を短縮でき、薄膜作製時間の短縮と真空引きに消費するエネルギの低減とを図ることができるとともに、このような省エネルギ化を、成形機から取り出して真空成膜装置本体へ移載する段階で、すなわち成形機の外で実現できるので、既設の成形機を有効利用できる真空成膜装置を提供できる。 According to the third aspect of the present invention, in the transfer to benzalkonium the vacuum deposition apparatus main body while maintaining a 40 to 80 ° C. by deposition target product taken out from the molding machine transfer device, from the molding machine Since the moisture occlusion of the film-deposited product that has been taken out is suppressed, the degree of vacuum when the film-deposited product is evacuated within the vacuum film-forming apparatus body can be reduced to medium vacuum, and evacuation can be performed. The time required for the process can be shortened, the time for thin film production can be shortened and the energy consumed for evacuation can be reduced, and such energy savings can be taken out of the molding machine and transferred to the vacuum film forming system. In other words, since it can be realized outside the molding machine, it is possible to provide a vacuum film forming apparatus that can effectively use the existing molding machine.

Claims (5)

成形機から取り出された被成膜製品を40〜80℃に保ったまま真空成膜装置本体へ移載し、
この真空成膜装置本体内で真空引きされた雰囲気下で被成膜製品に薄膜をドライコーティングする
ことを特徴とする真空成膜方法。
The film forming product taken out from the molding machine is transferred to the vacuum film forming apparatus main body while maintaining the temperature at 40 to 80 ° C. ,
A vacuum film-forming method comprising dry-coating a thin film on a film-formed product in an atmosphere evacuated in the vacuum film-forming apparatus body.
成形機から取り出された被成膜製品を40〜80℃に保ったまま被成膜製品の静電気を除去して真空成膜装置本体へ移載する
ことを特徴とする請求項1記載の真空成膜方法。
The vacuum film forming apparatus according to claim 1, wherein the film forming product taken out from the molding machine is transferred to a vacuum film forming apparatus body by removing static electricity from the film forming product while maintaining the temperature at 40 to 80 ° C. Membrane method.
成形機の傍に隣接して設置され、成形機から取り出された被成膜製品に真空引きされた雰囲気下で薄膜をドライコーティングする真空成膜装置本体と、
成形機と真空成膜装置本体との間に設置されて被成膜製品を40〜80℃に保ったまま成形機から真空成膜装置本体へ移載する移載装置とを具備した
ことを特徴とする真空成膜装置。
A vacuum film forming apparatus main body which is installed adjacent to the molding machine and dry coats a thin film in an atmosphere evacuated to the film forming product taken out from the molding machine,
Characterized by including a transfer device for transferring the vacuum deposition apparatus body from leaving the molding machine is installed maintaining a deposition target product 40 to 80 ° C. during the molding machine and the vacuum deposition apparatus body Vacuum film forming equipment.
移載装置は、
移載中の被成膜製品の移動経路に対して設けられて被成膜製品の静電気を除去する静電気除去装置を備えた
ことを特徴とする請求項3記載の真空成膜装置。
Transfer equipment is
The vacuum film forming apparatus according to claim 3, further comprising a static eliminating device that is provided with respect to a moving path of the film forming product being transferred and removes static electricity from the film forming product.
真空成膜装置本体は、複数の薄膜を重ねて形成する複数の成膜処理機構を内蔵した
ことを特徴とする請求項3または4記載の真空成膜装置。
The vacuum film forming apparatus according to claim 3 or 4, wherein the vacuum film forming apparatus main body includes a plurality of film forming processing mechanisms for forming a plurality of thin films on top of each other.
JP2009208939A 2009-09-10 2009-09-10 Vacuum film deposition method and device therefor Pending JP2011058048A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009208939A JP2011058048A (en) 2009-09-10 2009-09-10 Vacuum film deposition method and device therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009208939A JP2011058048A (en) 2009-09-10 2009-09-10 Vacuum film deposition method and device therefor

Publications (2)

Publication Number Publication Date
JP2011058048A JP2011058048A (en) 2011-03-24
JP2011058048A5 true JP2011058048A5 (en) 2012-06-07

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9297064B2 (en) * 2009-01-16 2016-03-29 Marca Machinery, Llc In-line metallizer assemblies and part-coating conveyor systems incorporating the same
JP5405549B2 (en) * 2011-10-20 2014-02-05 株式会社日本製鋼所 Vacuum film forming method and vacuum film forming apparatus
JP5450562B2 (en) * 2011-10-20 2014-03-26 株式会社日本製鋼所 Method and apparatus for producing molded product having thin film
WO2013136576A1 (en) * 2012-03-16 2013-09-19 島津エミット株式会社 Film forming device
JP6045031B2 (en) * 2013-05-13 2016-12-14 株式会社島津製作所 Deposition equipment
CN105555995B (en) * 2013-09-10 2017-11-07 株式会社岛津制作所 Film formation device and film build method
JP2016084495A (en) * 2014-10-24 2016-05-19 株式会社日本製鋼所 Film deposition method for forming metal film and protective film and film deposition apparatus
JP2017043803A (en) * 2015-08-26 2017-03-02 株式会社島津製作所 Film deposition apparatus and method
CN110819964A (en) * 2018-08-13 2020-02-21 中兴通讯股份有限公司 Vacuum coating equipment and method and preparation method of filter cavity film layer
JP7169200B2 (en) 2019-01-11 2022-11-10 株式会社ミツバ Method for manufacturing film-formed compact

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JPH0981976A (en) * 1995-09-11 1997-03-28 Toray Ind Inc Production of optical recording medium
JP3676624B2 (en) * 1998-08-05 2005-07-27 松下電器産業株式会社 Optical disc manufacturing method and manufacturing apparatus, and substrate manufacturing method
JP2002245689A (en) * 2000-12-13 2002-08-30 Ricoh Co Ltd Phase change information recording medium and its manufacturing method
JP2002298452A (en) * 2001-03-29 2002-10-11 Ricoh Co Ltd Method of manufacturing optical information recording medium, apparatus for manufacturing the same and optical information recording medium

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