JP2011054529A - Led lighting device and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED lighting device having high durability and mass-producing, the lighting device quickly diffusing generated heat from a light-emitting diode (LED) light source, stopping temperature rise of the LED light source at a range of few degrees Celsius, sufficiently separating the LED light source from a high humidity environment such as a plant factory, and preventing deterioration of lifetime and luminance of the LED light source; and to provide a method of manufacturing the same. <P>SOLUTION: In the LED lighting device 1, LED light-emitting units 10 having many LED chips 11 are mounted on one surface of a cooling panel 2, spacers 7 are connected between the cooling panel 2 and a light-transmitting plate 8 such as a glass plate via primary seal materials 30, secondary seal materials 9 are arranged on outside respective spacers 7, channel-shaped right and left side frame members 13, 13 are fitted to the cooling panel 2 and a long side of the light-transmitting plate 8 so as to cover the secondary seal materials 9, 9, and the cooling panel 2 and both ends at front and back sides of the light-transmitting plate 8 are blocked with lid materials 14, 14 for covering the secondary seal materials 9, 9. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a highly durable LED lighting device used for lighting, for example, a plant cultivation factory, a road such as a tunnel, a stadium, a studio, or a theater, and a manufacturing method thereof.

  2. Description of the Related Art Conventionally, for example, in greenhouse cultivation of vegetables, in order to be able to ship when the commercial value is high by adjusting the cultivation time, lighting such as a fluorescent lamp is applied to plants to extend the sunshine hours.

  In addition, in the case of lighting fixtures such as traditional fluorescent lamps and high-pressure sodium lamps that are conventionally used in plant cultivation factories (hereinafter referred to as plant factories), which have developed rapidly in recent years, they consume a large amount of power, and therefore the cost of electricity is high. In addition, since the amount of heat generated is high, the power consumption of the cooling device increases. On the other hand, in the case of a lighting panel using a light emitting diode (LED), there is a problem that the LED tends to deteriorate due to heat generation of the LED and the humidity of the plant cultivation environment is high, and the durability is poor. .

  In the following Patent Document 1, a plant cultivation apparatus using a light source of an optical semiconductor such as an LED, and a light source composed of a panel-shaped optical semiconductor provided with a forced cooling device using a thermal refrigerant is applied to the plant cultivation surface. A plant cultivating apparatus installed in close proximity is disclosed. In addition, a multi-stage plant cultivation apparatus in which the optical semiconductor light sources are stacked and described is described, and an illumination panel for plant cultivation that can be used in an environment with low power consumption and high humidity is disclosed.

  In Patent Document 2 below, a space is provided between a base made of a metal, a substrate made of a thin metal plate in close contact with the base, a number of light emitting diodes arranged on the substrate, and the base. It is provided with a translucent cover to be disposed, a sealing material interposed between the base and the cover, and keeping the space airtight with respect to the outside, and the space is filled with dry air, An illumination panel for plant cultivation in which a desiccant is accommodated in a frame material is disclosed.

  Patent Document 3 below discloses an LED substrate in which an insulating layer having an LED mounting hole is bonded to a flat surface of a heat dissipation portion, and a wiring portion having a wiring pattern is provided on the insulating layer. Yes. In addition, there is described an LED package in which an LED chip is mounted on a heat dissipating part in the LED mounting hole of the LED substrate, and the LED chip is electrically connected to the wiring part.

JP-A-9-98665 JP 2000-207933 A JP 2006-339224 A

  However, any of the conventional LED lighting devices for plant factories of Patent Documents 1 to 3 described above often has a short life of several months due to the deterioration of the LED life due to the heat generation and humidity of the LED chip, and the luminance deterioration. Although it is used at the level, there are still many problems in practical use, and there has been a problem that it has not been put into practical use.

  The object of the present invention is to solve the above-mentioned problems of the prior art, to quickly dissipate heat generated by the LED light source, to stop the temperature rise of the LED light source within a range of several degrees, and to a plant factory, etc. The LED light source can be sufficiently isolated from the high humidity environment, the life of the LED light source and the luminance can be prevented from being deteriorated, and since it has high durability, it can be sufficiently put into practical use, Another object of the present invention is to provide a highly durable LED lighting device that can be mass-produced and can be supplied to the market at low cost, and a method for manufacturing the same.

  In order to achieve the above object, an LED lighting device according to claim 1 is an LED lighting unit comprising a plurality of light emitting diode (LED) chips on one side of a substantially square aluminum cooling panel as viewed from above. A reflector is attached so as to surround each LED chip of the LED light emitting unit, and spacers are joined to the left and right side edge portions and the front and rear side edge portions of the cooling panel via primary seal materials, respectively. The translucent plate is arranged so as to face the LED chip mounting surface, and the left and right side edge portions and the front and rear side edge portions of the translucent plate are respectively joined to the spacers via primary sealing materials, Outside the spacer, a secondary sealant is placed in the gap formed between the side edge of the cooling panel and the side edge of the light-transmitting plate. The left and right side edges of the cooling panel, the left and right side edges of the translucent board, and the left and right secondary seals are fitted with channel-shaped left and right side frame members, respectively. And a cover material covering the front and rear secondary seal materials is attached to both the front and rear ends of the cooling panel and the translucent plate.

  The invention of claim 2 is the LED lighting device according to claim 1, wherein the cooling panel is made of an aluminum hollow extruded shape, a hollow portion is provided on the other surface of the cooling panel, and the hollow portion is circulated. It is characterized in that the panel is cooled by the cooling fluid.

  A third aspect of the present invention is the LED lighting device according to the second aspect, wherein a copper water pipe is expanded and inserted into a hollow portion of a cooling panel made of an aluminum hollow extruded section. .

  The invention of claim 4 is the LED lighting device according to claim 1, wherein the cooling panel is made of an aluminum extruded shape, and has a substantially C-shaped cross section for fitting a copper water pipe to the other surface of the cooling panel. The fitting part is provided, The copper water pipe is attached to this fitting part in the fitting shape, It is characterized by the above-mentioned.

  The invention of claim 5 is the LED lighting device according to claim 1, wherein the cooling panel is made of an extruded aluminum material comprising a heat dissipation substrate and parallel fins integrally provided on one surface thereof. The panel is cooled by external air flowing in contact with the heat dissipation substrate and the parallel fins.

  According to a sixth aspect of the present invention, an LED light-emitting unit having a large number of light-emitting diode (LED) chips is attached to one side of a substantially square aluminum cooling panel as viewed from above, and each of the LED chips of the LED light-emitting unit is enclosed. In this way, the spacers are joined to the left and right side edge portions and the front and rear side edge portions of the cooling panel through primary sealing materials, and then the LED panel mounting surface of the cooling panel is faced. The step of arranging the light transmitting plate, joining the portions near the left and right side edges and the front and rear side edges of the light transmitting plate to each of the spacers via the primary sealing material, and outside the spacers, A secondary sealant is placed in the gap formed between the side edge and the side edge of the light-transmitting plate. A step of filling the left and right sides of the cooling panel, a right and left side edges of the light-transmitting plate, and a right and left secondary seal material, and attaching the left and right channel-shaped frame members in a fitting manner, and cooling. And a step of attaching a cover material covering the front and rear secondary seal materials at both front and rear ends of the panel and the translucent plate.

  The LED lighting device according to any one of claims 1 to 5 is used as lighting for a plant cultivation factory, a road (including the inside of a tunnel), a stadium, a studio, or a theater.

  According to the first aspect of the present invention, an LED light-emitting unit including a plurality of light-emitting diode (LED) chips is attached to one side of a substantially square aluminum cooling panel as viewed from above, and surrounds the LED chips of the LED light-emitting units. The reflectors are attached in such a way that the spacers are joined to the portions near the left and right side edges and the front and rear side edges of the cooling panel via primary sealing materials, respectively, so that the light transmitting plate faces the LED chip mounting surface of the cooling panel. Are arranged, and the portions near the left and right side edges and the front and rear side edges of the light-transmitting plate are joined to the spacers through primary sealants, respectively. A secondary sealant is filled in the gap formed between the side edges of the light plate over the entire circumference of the cooling panel and the light transmission plate, Channel-shaped left and right side frame members are attached to the left and right side edges of the panel, the left and right side edges of the light-transmitting plate, and the left and right secondary seals, respectively, and both front and rear ends of the cooling panel and light-transmitting plate According to the invention of claim 1, heat generated by the LED light source can be quickly dissipated, and the temperature rise of the LED light source is several degrees. In addition, for example, the LED light source can be sufficiently isolated from the high humidity environment in the plant factory, and the lifetime and luminance deterioration of the LED light source can be prevented, and high durability can be achieved. Therefore, since the LED lighting device can be easily manufactured, it can be mass-produced and can be supplied to the market at a low cost. .

  Furthermore, according to the LED lighting device of the present invention, the left and right side edges of the cooling panel, the left and right side edges of the light-transmitting plate, and the so-called long sides of the left and right secondary seal members are channel-shaped left and right side frame members. For example, it is possible to reliably prevent a decrease in adhesive force due to the weight of the light transmitting plate made of a glass plate or the like, and to prevent the light transmitting plate made of a glass plate or the like from falling. For example, the edge of the translucent plate made of, for example, a glass plate can be protected so as not to cut the hand.

  The invention of claim 2 is the LED lighting device according to claim 1, wherein the cooling panel is made of an aluminum hollow extruded shape, a hollow portion is provided on the other surface of the cooling panel, and the hollow portion is circulated. The panel is cooled by the cooling fluid, and according to the invention of claim 2, the heat generated by the LED light source can be quickly dissipated by the cooling fluid such as water, The temperature rise of the LED light source can be stopped within a range of several degrees, and there is an effect that it is possible to prevent deterioration of the life and brightness of the LED light source.

  A third aspect of the present invention is the LED lighting device according to the second aspect, wherein a copper water pipe is expanded and inserted into a hollow portion of a cooling panel made of an aluminum hollow extruded shape. According to the invention of 3, the heat generated by the LED light source can be quickly dissipated by the cooling fluid such as water, the temperature rise of the LED light source can be stopped within a range of several degrees, and the life of the LED light source is deteriorated. In addition, there is an effect that luminance deterioration can be prevented.

  The invention of claim 4 is the LED lighting device according to claim 1, wherein the cooling panel is made of an aluminum extruded shape, and has a substantially C-shaped cross section for fitting a copper water pipe to the other surface of the cooling panel. A fitting portion is provided, and a copper water pipe is fitted in the fitting portion. According to the invention of claim 4, the heat generated by the LED light source is generated by a cooling fluid such as water. The LED light source can be quickly diffused, the temperature rise of the LED light source can be stopped within a range of several degrees, and the effect that the life and luminance of the LED light source can be prevented from being deteriorated can be prevented.

  The invention of claim 5 is the LED lighting device according to claim 1, wherein the cooling panel is made of an extruded aluminum material comprising a heat dissipation substrate and parallel fins integrally provided on one surface thereof. The panel is cooled by the external air flowing in contact with the heat dissipating substrate and the parallel fins. According to the invention of claim 5, the heat generated by the LED light source is quickly generated by a so-called air cooling method. The temperature rise of the LED light source can be stopped within a range of several degrees, and the LED light source can be prevented from deteriorating its life and luminance.

  According to a sixth aspect of the present invention, an LED light-emitting unit having a large number of light-emitting diode (LED) chips is attached to one side of a substantially square aluminum cooling panel as viewed from above, and each of the LED chips of the LED light-emitting unit is enclosed. In this way, the spacers are joined to the left and right side edge portions and the front and rear side edge portions of the cooling panel through primary sealing materials, and then the LED panel mounting surface of the cooling panel is faced. The step of arranging the light transmitting plate, joining the portions near the left and right side edges and the front and rear side edges of the light transmitting plate to each of the spacers via the primary sealing material, and outside the spacers, A secondary sealant is placed in the gap formed between the side edge and the side edge of the light-transmitting plate. A step of filling the left and right sides of the cooling panel, a right and left side edges of the light-transmitting plate, and a right and left secondary seal material, and attaching the left and right channel-shaped frame members in a fitting manner, and cooling. And a step of attaching a cover material covering the front and rear secondary seal materials at both front and rear ends of the panel and the translucent plate. According to the invention of claim 6, since the manufacture of the LED lighting device is easy, It is possible, and there is an effect that it can be supplied to the market at a low cost.

  The LED lighting device obtained by the method of the present invention can quickly dissipate heat generated by the LED light source, can stop the temperature rise of the LED light source within a range of several degrees, and, for example, in a plant factory The LED light source can be sufficiently isolated from the high humidity environment in the environment, the life and brightness of the LED light source can be prevented from being deteriorated, and the high durability can be achieved. Is.

  And since the LED lighting apparatus as described in any one of the said Claims 1-5 has high durability, a plant cultivation factory, a road (including the inside of a tunnel), a stadium, a studio, or also a theater It is sufficiently put into practical use as illumination that requires high durability such as illumination.

It is a bottom view which shows one Embodiment of the LED lighting apparatus of this invention. It is the same side view. FIG. 2 is an enlarged cross-sectional view of the LED lighting device of FIG. 1. It is the principal part expansion longitudinal cross-sectional view. It is a principal part expanded sectional view which shows the attachment part of the LED chip of the LED lighting apparatus of this invention. It is an expansion exploded plan view for demonstrating the combination of the spacer of the LED lighting apparatus of FIG. FIG. 7a is a front view of an end cover member of the LED lighting device, and FIG. 7b is a side view thereof. It is explanatory drawing which shows one Embodiment of the manufacturing method of the LED lighting apparatus of this invention, FIG. 8a is a perspective view of an aluminum extrusion-shaped cooling panel, FIG. 8b inserts a copper water pipe into the hollow part of a cooling panel. FIG. 8c is an exploded cross-sectional view showing a state in which the LED light emitting unit is attached to the cooling panel and the secondary reflector is attached, and FIG. 8d is a left and right side edge portion of the cooling panel and the left and right sides of the translucent plate. FIG. 8e is an exploded cross-sectional view showing a state in which spacers are arranged and joined to the portions near both side edges, FIG. 8e shows that the right and left outer sides of both the left and right spacers are filled with secondary sealant, FIG. 8F is an exploded cross-sectional view showing a state in which a cover material covering the front and rear secondary seal materials is attached at both front and rear end portions of the cooling panel and the translucent plate. It is a cross-sectional view which shows the modification of the cooling panel used for the LED lighting apparatus of this invention. It is a cross-sectional view which shows another embodiment using the air-cooling type cooling panel in the LED lighting apparatus of this invention.

  Next, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

  1 to 4, in the LED lighting device (1) used in the plant cultivation factory according to the present invention, for example, the cooling panel (2) made of a substantially hollow aluminum hollow extruded shape when viewed from the plane is a flat plate. The heat dissipating base part (3) and a hollow part (4) provided integrally on the upper surface of the widthwise center part of the heat dissipating base part (3) are inserted into the hollow water pipe (6) and expanded. Is fixed.

  And the LED light emission unit (10) which comprises many light emitting diode (LED) chips (11) is attached to the lower surface of the flat heat radiation base part (3) of a cooling panel (2) in two right and left rows. A secondary reflector (12) having a specular reflection part (12a) is attached so as to surround the LED chip (11) of the LED light emitting unit (10).

  A large number of LED chips (11) as light sources attached to the lower surface of the flat heat radiation base (3) of the cooling panel (2) by cooling water flowing through the copper water pipe (6) of the cooling panel (2). The LED chip (11) is suppressed from being cooled and the heat generation is suppressed.

  An aluminum hollow extruded shape having a substantially rectangular cross section on the peripheral portion of the cooling panel (2), that is, on the lower surfaces of the left and right side edges and the front and rear side edges of the flat heat radiation base (3) of the cooling panel (2). The upper surface of the material spacer (7) is joined via a primary seal material (30) made of an adhesive seal tape.

  A translucent plate (8) made of a synthetic resin plate such as a glass plate or a polycarbonate resin is disposed so as to face the LED chip mounting surface of the cooling panel (2), and is close to the periphery of the translucent plate (8). The portions, that is, the portions near the left and right side edges and the front and rear side edges of the translucent plate (8) are respectively joined to the lower surface of each spacer (7) via a primary sealing material (30) made of an adhesive seal tape. Yes.

  Here, referring to FIG. 5, an LED light emitting unit (10) having a large number of LED chips (11) uses an LED light source, which is a heat generation source, aluminum, copper, etc., instead of a conventional shell type or surface mount package. The so-called chip-on-board (COB) in which the LED chip (11) is directly mounted on the heat dissipation substrate (20) made of a metal flat plate is used to efficiently transmit the heat generated by the LED to the back surface.

  Note that FIG. 5 is shown upside down from the usage state of the LED light emitting unit (10) for easy understanding.

  As shown in the figure, specifically, the LED light emitting unit (10) has the following configuration. That is, an insulating layer (21) was laminated on the surface of a heat dissipation substrate (20) made of a metal flat plate such as aluminum or copper via an adhesive layer (23), and a wiring pattern was formed on the insulating layer (21). The wiring part (22) which consists of copper foil is laminated | stacked, and the wiring board (24) is formed. A necessary number of reverse tapered LED mounting holes (25) are formed in the wiring board (24) at predetermined intervals, and an annular shape having a white highly reflective surface on the inner peripheral surface of each LED mounting hole (25). Primary reflector (reflecting member) (26) is provided.

  The LED chip (11) is mounted on the bottom of each LED mounting hole (25) of the LED light emitting unit (10), that is, on the heat dissipation substrate (20), and the LED chip (11) is wired via the bonding wire (27). It is electrically connected to the part (22). Moreover, each LED mounting hole (25) of the wiring board (24) is filled and sealed with a transparent sealing resin (28) so as to cover the LED chip (11) and the bonding wire (27). Yes.

  For bonding the LED chip (11), for example, a silicon adhesive, silver paste, or the like is used, and for the sealing resin (28), an acrylic resin, an epoxy resin, a silicon resin, or the like is used. Moreover, the kind of LED chip (11) is not limited at all, and an arbitrary LED chip can be used. For example, an LED chip in which a gallium nitride-based light emitting portion is formed on a sapphire substrate can be listed. Red light having a peak wavelength of 660 nm and the highest utilization efficiency for plant photosynthesis is preferred.

  In the LED light emitting unit (10), since the LED chip (11) is directly mounted on the heat dissipation substrate (20) without an insulating layer interposed therebetween, the heat generated in the LED chip (11) is quickly radiated from the heat dissipation substrate (20). ) Is absorbed and dissipated. The LED light emitting unit (10) is formed by forming the wiring board (24) without any processing on the flat surface of the heat dissipation substrate (20), so that the manufacturing process is simple and the productivity is good. Moreover, since the process for forming a recessed part and a protrusion part in a heat sink (20) is unnecessary, various existing metal plates can be utilized and the joining property of LED chip (11) is also good.

  Note that it is preferable to make the wiring board (24) thinner than the LED chip (11) because light can be efficiently extracted downward.

  Here, the LED light emitting unit (10) is attached to the lower surface of the cooling panel (2) between the adjacent LED chips (11) by, for example, screws (19) (see FIG. 4).

  FIG. 6 shows details of assembling the spacer (7). Referring to the drawing, the aluminum extruded shape cooling panel (2) having a substantially rectangular shape that is vertically long when viewed from the plane, is disposed near the peripheral edge of the cooling panel (2). The spacer (7) is made of an aluminum hollow extruded section having a substantially rectangular cross section, and is composed of two vertical members and two cross members formed into a square, and four synthetic resin corners. Connected at the corners by members (16). Each corner member (16) includes a first insertion part (16a) to be inserted into a hollow part of one spacer (7) of two spacers (7) connected to each other, and the other spacer (7). The first insertion part (16b) to be inserted into the hollow part and the substantially fan-shaped intermediate connection part (16c) as seen from the plane connecting them.

  And the upper surface of each spacer (7) assembled in a substantially square shape when viewed from the plane by the four corner members (16) is close to the periphery of the cooling panel (2) via the primary sealing material (30) made of adhesive seal tape. It is joined to the part. In addition, a large number of through holes (17) for ventilation are formed in the inner wall portion of each spacer (7), and as will be described later, a hygroscopic agent such as a molecular sieve is provided in each spacer (7). (18) is filled.

  As shown in detail in FIGS. 3 and 4, outside the spacers (7), gaps formed between the side edges of the cooling panel (2) and the side edges of the translucent plate (8). The secondary sealing material (9) is filled over the entire periphery of the cooling panel (2) and the light transmitting plate (8).

  Chamfered recesses (7a) and (7a) are provided over the entire length of the upper and lower side edges of the outer wall portion of each spacer (7) having a substantially square cross section, and each of the secondary sealing materials (9) to be described later is provided. Inner convex portions (9a) (9a) on both upper and lower side edges are fitted.

  The left and right side edges of the cooling panel (2) and the translucent plate (8), and the left and right secondary sealing materials (9) and (9) in between, the left and right sides of the channel shape made of extruded aluminum material. The frame members (13) and (13) are respectively attached in a covering shape.

  Here, each channel-shaped side frame member (13) is composed of an upper wall portion (13a) and a lower wall portion (13b), and an intermediate vertical wall portion (13c) between them, and has a substantially cross-sectional shape. It has a shape. In addition, in the center part of the height of the vertical wall part (13c) of each side frame member (13), an inward protrusion (13d) for screw screwing having a substantially C-shaped cross section is provided on the side frame member (13). It is provided over the entire length.

  In addition, a lower engagement convex portion (15) having a circular cross section is provided over the entire length of the side frame member (13) on the inner edge portion of the upper wall portion (13a) of each side frame member (13). Yes. Correspondingly, the left and right side edges (3a) and (3b) of the flat heat radiation base (3) of the cooling panel (2) are made thin, and these left and right side edges (3a) ( 3b) is provided with fitting recesses (5) and (5) each having an arcuate cross section at the inner edge of each of the inner recesses, and left and right side frame members (13) ( 13) The lower engaging projections (15) and (15) having an arcuate cross section at the inner edges of the upper wall portions (13a) and (13a) are respectively fitted into the channel-shaped left and right side frame members (13) ( 13) The cooling panel (2) and the left and right side edges of the translucent plate (8) and the left and right secondary sealing materials (9) and (9) between them are firmly held by 13) It is.

  When the channel-shaped side frame members (13) are fitted, it is desirable that the secondary sealing material (9) is in a soft state. At this time, the screw-inward projecting ridge (13d) having a substantially C-shaped cross section provided at the center of the vertical wall portion (13c) of each side frame member (13) is in a soft state. The secondary sealing material (9) is pushed into the secondary sealing material (9), and the secondary sealing material (9) is clamped by the vertical wall portion (13c) of each side frame member (13) and the spacer (7) inside thereof. The central part of the height of the secondary seal material (9) is deformed, and inward convex portions (9a) (9a) are formed on the upper and lower side edges of the secondary seal material (9). The convex portions (9a) and (9a) enter the concave and convex portions (7a) and (7a) of the upper and lower surfaces of the spacer (7), and then the secondary sealant (9) is cured, thereby achieving a more reliable seal. It is made to be.

  On the other hand, as shown in FIGS. 4 and 7, the front and rear end portions of the cooling panel (2) and the translucent plate (8) are substantially L-shaped as viewed from the side surfaces covering the front and rear secondary seal materials (9) and (9). A cover member (14) (14) made of an aluminum extruded profile is attached.

  Here, each cover material (14) is comprised by the vertical wall part (14a) and the horizontal part (14b) provided in a row by the lower end part, and it is near both right-and-left ends of the vertical wall part (14a). A tapping screw insertion through hole (31) (31) is formed in the portion.

  Then, the front and rear lid members (14) and (14) are disposed so as to cover the front and rear secondary seal materials (9) and (9), respectively, with these horizontal portions (14b) and (14b) being outside. The tapping screws (37) and (37) (see FIG. 8f) are inserted into the through holes (31) and (31) near the left and right ends of the vertical wall portions (14a) and (14a), and the tapping screws (37) and (37) are inserted. The front and rear lid members (13) and (13) are screwed into the front and rear end portions of the screw-inwardly projecting inner ridges (13d) and (13d) having a substantially C-shaped cross section of the left and right side frame members (13) and (13), respectively. 14) (14) and the left and right side frame members (13), (13) are firmly joined with the secondary sealing materials (9), (9) inside.

  It is desirable that the front and rear cover members (14) and (14) are attached in a state where the secondary seal materials (9) and (9) are soft. That is, when the front and rear lid members (14) and (14) are attached, the front and rear lid members (14) and (14) and these are attached to the channel-shaped side frame members (13). Each of the secondary sealing materials (9) and (9) is clamped by the inner spacers (7) and (7), so that each sealing material (9) is deformed and each secondary sealing material (9 ) Are formed on the upper and lower side edges, respectively, and these inwardly convex portions (9a) (9a) are the upper and lower double-sided concave portions (7a) (7a) of the spacer (7). After that, the secondary sealing material (9) is hardened, so that a more reliable sealing is achieved.

  The inside of each spacer (7) made of an aluminum hollow extruded member disposed near the peripheral edge of the cooling panel (2) is filled with a moisture absorbent (18) such as a molecular sieve, and each spacer (7) A number of through holes (17) for ventilation are formed in the inner wall, and the space in which the LED chip (11) inside the LED lighting device (1) is housed is always kept dry. Yes.

  Next, a method for manufacturing the LED lighting device of the present invention will be described with reference to FIG.

  The manufacturing method of the LED lighting device according to the present invention includes the following steps. Referring to the figure, first, as shown in FIG. 8b, a copper water pipe (6) is inserted into the hollow portion (4) of the cooling panel (2) made of a substantially hollow aluminum hollow extruded section as viewed from the plane shown in FIG. ) Is inserted, and this copper water pipe (6) is expanded and fixed.

  Next, as shown in FIG. 8c, the cooling panel (2) is placed face down so that the flat heat radiation base (3) of the cooling panel (2) is on the top, The LED light emitting units (10) having a large number of LED chips (11) on the upper surface of the flat heat radiation base (3) of the cooling panel (2) A secondary reflector (12) having a specular reflection part (12a) is attached so as to surround the LED chip (11) of the LED light emitting unit (10), for example, with screws (19) between (11).

  Then, as shown in FIG. 8d, the spacer (7) is joined to the peripheral portion of the cooling panel (2), that is, the left and right side edge portions and the front and rear side edge portions, respectively, via the primary sealing material (30). Then, a translucent plate (8) made of a glass plate is arranged so as to face the LED chip mounting surface of the cooling panel (2), and the left and right side edges of the translucent plate (8) and both front and rear side edges The close-up portions are joined to the spacer (7) via the primary sealant (30).

  Next, as shown in FIG. 8e, on the outer side of each spacer (7), the left and right side edges and front and rear side edges of the cooling panel (2), and the left and right side edges and front and rear sides of the translucent plate (8) The secondary sealing material (9) is filled over the entire circumference of the cooling panel (2) and the translucent plate (8) in the gaps formed between the edges. Thereafter, left and right side edges of the cooling panel (2), left and right side edges of the translucent plate (8), and left and right secondary seal members (9) and (9) are channel-shaped left and right side frame members (13 ) (13) is attached in a fitting shape.

  Finally, as shown in FIG. 8f, the cover members (14) and (14) cover the front and rear secondary seal materials (9) and (9) at the front and rear end portions of the cooling panel (2) and the translucent plate (8). Are attached by tapping screws (37) and (37).

  According to the LED lighting device (1) of the present invention, the heat generated by the LED light source can be quickly dissipated, the temperature rise of the LED light source can be stopped within a range of several degrees, and for example, in a plant factory The LED light source can be sufficiently isolated from the high humidity environment, the life of the LED light source can be prevented from being deteriorated, and the luminance can be prevented from being deteriorated. Since the LED lighting device (1) is easy to manufacture, it can be mass-produced and supplied to the market at a low cost.

  In addition, according to the LED lighting device (1) of the present invention, the left and right side edges of the cooling panel (2), the left and right side edges of the translucent plate (8) made of a glass plate, and the left and right secondary sealing materials. (9) Since the so-called long side of (9) is sandwiched between the channel-shaped left and right side frame members (13) and (13), the adhesive force due to the self-weight of the translucent plate (8) made of, for example, a glass plate, etc. The LED lighting device (1) has high durability, for example, glass can be reliably prevented from falling, and the translucent plate (8) made of a glass plate or the like can be reliably prevented from falling. It can protect so that a hand may not be cut | disconnected by the edge of the translucent board (8) which consists of a board etc.

  In addition, in the said embodiment of this invention, the flat heat radiation base part of a cooling panel (2) by the cooling water which distribute | circulates the inside of the copper water pipe (6) of the cooling panel (2) of the LED lighting apparatus (1) by this invention. The LED chip (11) as a light source attached to the lower surface of (3) is cooled to suppress the heat generation of the LED chip (11). A cooling fluid can be directly circulated through the hollow portion (4) of the panel (2) to cool the cooling panel (2), and a number of LED chips (11) as light sources can be cooled.

  In this case, it is necessary to use a non-corrosive fluid of aluminum as the cooling fluid, or to use an aqueous solution mixed with an aluminum corrosion inhibitor when water is used as the cooling fluid.

  FIG. 9 shows a modification of the cooling panel (2) used in the LED lighting device (1) of the present invention. In the same figure, a substantially C-shaped cross section in which a copper water pipe (6) is fitted and fitted to the other surface of an aluminum extruded shape cooling panel (2) used in the LED lighting device (1) of the present invention. The fitting portion (4a) is provided, and the copper water pipe (6) is inserted into the fitting portion (4a) and attached in a fitting shape.

  In addition, in FIG. 9, the same code | symbol was attached | subjected to the part of the same structure as the cooling panel (2) of FIG.

  FIG. 10 shows another embodiment using an air-cooled cooling panel as the cooling panel in the LED lighting device (1) of the present invention.

  In the same figure, an air-cooling type cooling panel (32) is made of an aluminum extruded section composed of a flat plate-like heat radiating base (33) and parallel fins (34) integrally provided on one side thereof. The cooling panel (32) and eventually the cooling panel (by means of the external air passing through the ventilation gap (35) between the fins (34) and coming into contact with the flat plate heat dissipating base (33) and the parallel fins (34). A large number of LED chips (11) as light sources attached to the lower surface of the flat plate-shaped heat radiation base (33) of 32) are cooled, and the heat generation of the LED chips (11) is suppressed.

  An aluminum extruded profile cover (38) is attached to the aluminum extruded profile cooling panel (32) having parallel fins (34) by screws (not shown) so as to cover the parallel fins (34). It is fixed.

  The left and right side edges (33a) and (33b) of the flat plate-like heat radiating base (33) of the cooling panel (32) are made thin, and the thin left and right side edges (33a) and (33b) respectively. Fitting recesses (36) and (36) having an arcuate cross section are provided on the inner edge, and these fitting recesses (36) and (36) are provided on the left and right side frame members (13) and (13). By fitting the lower engaging projections (15) and (15) having an arcuate cross section at the inner edges of the walls (13a) and (13a), respectively, the channel-shaped left and right side frame members (13) and (13) The left and right side edges of the cooling panel (32) and the translucent plate (8), and the left and right secondary sealing materials (9) and (9) between them are firmly held.

  10, parts having the same structure as those of the LED lighting device (1) in FIG. 3 are denoted by the same reference numerals.

  Next, in order to confirm the performance of the LED lighting device (1) used in, for example, a plant cultivation factory according to the present invention, the following experiment was performed.

  As shown in FIGS. 1 to 5, the LED lighting device (1) according to the present invention has a number of light emitting diodes (LEDs) on one side of a cooling panel (2) made of a substantially square hollow aluminum extruded member as viewed from above. An LED light emitting unit (10) including a chip (11) is attached, and a secondary reflector (12) is attached so as to surround the LED chip (11) of the LED light emitting unit (10). Then, spacers (7) made of an aluminum hollow extruded member are joined to the peripheral edge portion of the cooling panel (2), that is, the left and right side edge portions and the front and rear side edge portions, respectively, via the primary sealing material (30). ing. A translucent plate (8) made of a glass plate is disposed so as to face the LED chip mounting surface of the cooling panel (2). Each of the spacers (7) is joined via a primary sealant (30), and on the outside of each spacer (7), the side edge of the cooling panel (2) and the side edge of the translucent plate (8) A secondary sealing material (9) is filled in the gap formed between the cooling panel (2) and the translucent plate (8). Further, left and right side edges of the cooling panel (2), left and right side edges of the translucent plate (8), and both left and right secondary sealing materials (9) and (9) are made of channel-shaped aluminum extruded profiles. Side frame members (13) and (13) are respectively fitted in a covering shape, and aluminum extrusions are provided to cover the front and rear secondary seal materials (9) and (9) at the front and rear ends of the cooling panel (2) and the translucent plate (8). The shape-made cover materials (14) and (14) are attached.

  Here, the dimensions of the LED lighting device (1) according to the present invention were set to height 34.7 mm × width 130 mm × length 1150 mm.

  Next, an LED light emitting unit (10) having a width of 15 mm and a length of 160 mm was used as the LED light source. Each LED light emitting unit (10) was provided with six LED chips (LED mounting portions) (11), and three LEDs were mounted on each LED chip (LED mounting portion) (11).

  And this LED light emitting unit (10) was used for the lower surface of the flat heat radiating base (3) of the cooling panel (2) in a row of 7 sheets × 2 rows in a total of 14 sheets. Therefore, the total number of LEDs was 252.

  Here, the specifications of the LED chip (11) are Showa Denko K.K., trade name HRP-350F, and red wavelength 660 nm.

  In the LED lighting device (1) according to the present invention, a polyisobutyl adhesive tape having a thickness of 1 mm and a width of 3 mm was used as the primary sealing material (30). Further, as the secondary sealant (9), a polysulfide polymer (trade name Thiocol LP, manufactured by Toray Industries, Inc.) is used. As shown in FIGS. 3 and 4, on the outside of each spacer (7), a cooling panel ( A semi-kneaded secondary sealing material (9) was filled in a gap formed between the side edge of 2) and the side edge of the light transmitting plate (8).

  Moreover, the inside of each spacer (7) was filled with the moisture absorbent (18) which consists of a molecular sieve (Brand name MOLSIV DS2000, Union Showa Co., Ltd. product).

  The electric circuit was configured so that a current of about 22 mA flows through the LED lighting device (1) according to the present invention with a DC 22V current per LED chip (11).

  The room temperature of the laboratory was 25 ° C., and the temperature of the cooling water flowing through the copper water pipe (6) of the cooling panel (2) was controlled to a constant 19 ° C.

  Next, using the LED lighting device (1) according to the present invention, an actual lighting test is continuously performed to measure the junction temperature of the LED chip (11) of the LED light emitting unit (10), that is, the LED chip temperature. did.

  In addition, before the measurement, the LED light emitting unit (10) on which the LED chip (11) is mounted is placed in a constant temperature layer (not shown), and the LED light emitting unit (10 ) And the entire temperature of the LED chip (11) is maintained for a certain period of time until the temperature of the LED chip (11) is the same as the temperature of the thermostatic layer. After the holding, the relationship between the voltage (Vf) of the LED chip (11) when a very small current was passed in a very short time and the temperature of the constant temperature layer was examined to obtain a calibration curve. The calibration curve was required to have a very good linear relationship.

  In this way, during the actual lighting test of the LED lighting device (1) according to the present invention, when the temperature of the entire LED lighting device (1) is in a steady state, an extremely small current is measured using the LED excessive thermal resistance measuring instrument. The voltage (Vf) of the LED chip (11) was measured, and the temperature of the LED chip (11) was obtained from the calibration curve.

  Here, the flow rate of the cooling water flowing through the copper water pipe (6) of the cooling panel (2) was three conditions of 0 L / min (no water cooling), 1 L / min, and 2 L / min.

  As a result, the junction temperature of the LED chip (11) is 39.6 ° C. at a cooling water flow rate: 0 L / min (no water cooling), 29.4 ° C. at a cooling water flow rate: 1 L / min, and a cooling water flow rate: 2 L. / Min at 28.5 ° C.

  Here, since the room temperature of the laboratory is 25 ° C., the rising temperature of the LED chip (11) itself is 14.6 ° C. at a cooling water flow rate: 0 L / min (no water cooling), and a cooling water flow rate: 1 L / min. 4.4 ° C., cooling water flow rate: 2 L / min, and 3.5 ° C.

  According to such an LED lighting device (1) of the present invention, the temperature rise of the LED chip (11) itself is reduced to 1/10 compared to a conventional lighting fixture using LEDs. And according to the LED lighting apparatus (1) of this invention, it turned out that it contributes greatly to the lifetime extension of a LED light source, and the brightness degradation reduction of a LED light source.

According to the LED illuminating device (1) of the above-described embodiment according to the present invention, light energy (photon quantum amount) of about 300 μmol / m ² · s can be secured at a position 200 mm away, and as a light source for plant cultivation, fluorescence It is possible to irradiate with an energy amount approximately twice that of a lamp of about 160 μmol / m ² · s. In addition, if input electric power is increased, the light energy (photon quantum amount) irradiated from LED lighting apparatus (1) can be made still higher. Moreover, the amount of photons can also be increased by the structure of the LED light emitting unit (10) and the structure of the secondary reflector (12).

1: LED lighting device 2: Cooling panel made of aluminum hollow extruded section 3: Flat heat radiation base 4: Hollow section 5: Fitting recess 6 having a circular arc cross section: Copper water pipe 7: Aluminum hollow extruded section Spacer 8: Translucent plate 9 made of glass plate or the like 9: Secondary sealing material 10: LED mounting unit 11: LED chip 12: Secondary reflector 12a: Specular reflection part 13: Channel-shaped left and right side frame member 30: Primary sealing material

Claims (7)

  An LED light-emitting unit having a large number of light-emitting diode (LED) chips is attached to one side of a substantially square aluminum cooling panel as viewed from the plane, and a reflector is attached so as to surround each LED chip of the LED light-emitting unit, Spacers are joined to the left and right side edge portions and the front and rear side edge portions of the cooling panel through primary sealing materials, respectively, and a light transmitting plate is disposed so as to face the LED chip mounting surface of the cooling panel. The left and right side edge portions and the front and rear side edge portions of the plate are joined to the spacers via primary sealing materials, respectively, and outside the spacers, the cooling panel side edges and the translucent plate side edges The secondary sealant is filled in the gap formed between the cooling panel and the translucent plate, and both left and right sides of the cooling panel. Channel-shaped left and right side frame members are attached in a fitting manner to the left and right side edges of the light-transmitting plate and the left and right secondary seal materials, respectively, and the front and rear secondary members are provided at both front and rear ends of the cooling panel and the light-transmitting plate. An LED lighting device, wherein a lid material covering the sealing material is attached.   The cooling panel is made of an aluminum hollow extruded shape, and a hollow portion is provided on the other surface of the cooling panel, and the panel is cooled by a cooling fluid flowing through the hollow portion. LED illuminating device of description.   The LED lighting device according to claim 2, wherein a copper water pipe is expanded and inserted into a hollow portion of a cooling panel made of an aluminum hollow extruded shape member.   The cooling panel is made of an extruded aluminum shape, and a fitting portion having a substantially C-shaped cross-section is provided on the other surface of the cooling panel to hold the copper water pipe. The copper water pipe is fitted into the fitting part. The LED illumination device according to claim 1, wherein the LED illumination device is attached to the LED illumination device.   The cooling panel is made of extruded aluminum material consisting of a heat dissipation board and parallel fins integrally provided on one side, and the panel is cooled by external air flowing in contact with the heat dissipation board and the parallel fins. The LED lighting device according to claim 1, wherein the LED lighting device is configured to be configured as described above.   Attaching an LED light emitting unit having a plurality of light emitting diode (LED) chips to one side of a substantially square aluminum cooling panel as viewed from above, and attaching a reflector so as to surround each LED chip of the LED light emitting unit; A spacer is joined to each of the left and right side edges and the front and rear side edges of the cooling panel via a primary sealing material, and then a light-transmitting plate is arranged so as to face the LED chip mounting surface of the cooling panel. A step of joining the left and right side edge portions and the front and rear side edge portions of the translucent plate to the spacers via a primary sealing material, and the side edges of the cooling panel and the translucent plate outside the spacers. A process for filling a secondary sealant into the gap formed between the side edges of the cooling panel and the translucent plate over the entire circumference. Mounting the channel-shaped left and right side frame members to the left and right side edges of the cooling panel, the left and right side edges of the translucent plate, and the left and right secondary seal materials, respectively, and the cooling panel and the translucent And a step of attaching a cover material covering the front and rear secondary seal materials at both front and rear ends of the plate.   Use of the LED lighting device according to any one of claims 1 to 5 as lighting for plant cultivation factories, roads, stadiums, studios or also theaters.

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