JP2011051089A - Polishing tool and machining method for workpiece - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing tool capable of forming a surface of a workpiece with high quality in a short time. <P>SOLUTION: The polishing tool 10 includes: a rotation shaft 1 arranged in parallel with a feeding direction S along the surface Wa of the workpiece W; and at least two polishing bodies 7, 8. The polishing body 7 is formed of a foamed resin such as a foamed polyurethane resin having the higher porosity of an outer peripheral surface 7a than those of the polishing bodies 8, 9. Furthermore, the polishing body 8 is formed of a non-foamed resin such as a non-foamed polyurethane resin, i.e., a material having higher rigidity than that of the polishing body 7. At polishing machining, the surface Wa of the workpiece W is polished and removed by the polishing body 7, and thereby waviness formed on the surface Wa is smoothed by the polishing body 8. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a polishing tool used for processing a workpiece such as an optical element such as a lens or a mirror or an optical element molding die, and a method for processing the workpiece.

Currently, the surface area of a workpiece is used when finishing and polishing the surface shape of a so-called non-axisymmetric free-form surface that has a different curvature at each point of the workpiece such as an optical element such as a lens or a mirror or a mold for molding an optical element. The polishing process is performed using a polishing tool having a smaller contact area compared to the above. This polishing tool is configured by attaching a disc-shaped polishing body to a rotating shaft, and is attached to a polishing apparatus. In polishing using this type of polishing tool, the outer peripheral surface of the polishing body is pressed against the workpiece surface at a constant pressure while rotating the polishing body at a constant rotation speed, and the retention calculated according to the removal depth Partial removal is performed at an arbitrary depth in a straight groove shape by changing the speed in the feed direction based on time. Then, the entire surface of the workpiece is polished into an arbitrary shape by shifting the workpiece or the polishing tool by a predetermined interval by the feed pitch in a direction orthogonal to the feed direction and overlapping the removed portions. At this time, the polishing removal amount r varies as shown in the following Preston empirical formula.
r = P × V × K × T

  Where r: polishing removal amount, P: pressure, V: relative speed between polishing tool and workpiece surface, K: process variable (including polishing tool material and outer peripheral surface condition), and T: dwell time. When polishing and removal is performed according to the above formula, waviness of the polishing tool with one rotation period is generated on the surface of the work piece due to the pressure, speed, and tool surface property distribution of the polishing tool with one rotation period, and the quality of the work surface of the optical element is improved. It is known to decline. This is because a process fluctuation of one rotation period of the tool occurs due to pressure, tool rotation speed, distribution of the occupied area of holes on the surface of the polishing body, and thickness distribution during one rotation of the tool. For this reason, conventionally, after polishing the surface of the workpiece by scanning the polishing tool in the X-axis direction, the polishing tool is again applied with a polishing tool having a different form, or the same polishing tool is moved in the X-axis direction. The surface of the workpiece was polished by scanning in the Y-axis direction orthogonal to the workpiece. Thereby, the surface waviness of the optical element which is a workpiece is smoothed, and the deterioration of the surface quality of the optical element is suppressed (see Patent Document 1).

JP-A-11-90806

  However, in the above conventional method, after the polishing process by the polishing tool, in order to smooth the undulation of the surface of the workpiece, the polishing process must be performed again by a polishing tool having a different form, so that the polishing process time is extended. End up. As a result, the productivity of a workpiece such as an optical element is lowered, and the production cost of the workpiece is also affected.

  Further, in the above conventional method, the waviness of the workpiece surface can be reduced. However, since the workpiece surface is polished a plurality of times with the same polishing body, the target shape can be reduced. It may shift | deviate and the quality of workpiece surfaces, such as an optical element, may fall. For example, depending on the processing conditions, the polishing liquid may not uniformly enter between the polishing body and the workpiece, and the polishing removal progress speed may be different within the contact surface of the polishing body with the workpiece. As a result, the surface finish having different polishing removal depths depending on the location may result, and the surface quality of the workpiece may be degraded.

  Accordingly, an object of the present invention is to provide a polishing tool capable of forming a high-quality workpiece surface in a short time and a workpiece processing method.

  The present invention is a polishing tool for polishing the surface of a workpiece, the rotating shaft, a disc-shaped first polishing body provided on the rotating shaft and having an outer peripheral surface as a processing surface, and the first A disc-shaped second polishing body provided on the rotating shaft adjacent to the polishing body and having an outer peripheral surface as a processing surface, wherein the first polishing body has an outer periphery that is more peripheral than the second polishing body. The surface is formed in a shape having a high porosity, and the second polishing body is made of a material having rigidity higher than that of the first polishing body.

  The present invention is also a processing method for a workpiece for polishing the surface of the workpiece, the first disc-shaped polishing having an outer peripheral surface mounted adjacent to the same rotating shaft as a processing surface. A body and a second abrasive body are brought into pressure contact with the workpiece, and the first abrasive body and the second abrasive body are relative to the workpiece in a direction parallel to the rotation axis. The first polishing body has an outer peripheral surface with a higher porosity than the second polishing body, and the second polishing body is more rigid than the first polishing body. The swell formed by processing by the first polishing body is removed by the second polishing body.

  According to the present invention, since the outer peripheral surface of the first polishing body is formed in a shape having a high porosity, a film of the polishing liquid is formed between the workpiece surface and the outer peripheral surface of the first polishing body. This makes it difficult to prevent the film from being lifted, and a high polishing removal efficiency can be obtained. In addition, since the second polishing body, which is different from the first polishing body, is made of a highly rigid material, the outer peripheral surface of the second polishing body is less likely to contact the undulation valley and easy to contact the peak. As a result, the ability to smooth the swell increases. Since the first polishing body and the second polishing body having different functions are provided on the rotating shaft adjacent to each other, removal by polishing and smoothing of undulation can be performed at a time, and the surface of the high-quality workpiece Can be obtained in a short time.

It is explanatory drawing of the polishing tool which concerns on 1st Embodiment of this invention. It is explanatory drawing of the polishing tool which concerns on 2nd Embodiment of this invention. It is explanatory drawing of the polishing tool which concerns on other embodiment of this invention.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.

[First Embodiment]
A polishing apparatus 100 shown in FIG. 1 performs processing on the surface of a workpiece W placed on an XY stage (not shown) using a polishing tool 10 mounted on a polishing apparatus main body. The workpiece W has a surface Wa that is a flat surface, a spherical surface, or a non-horizontal surface such as a non-axisymmetric free-form surface. The workpiece W is, for example, an optical element such as a lens or a mirror or an optical element molding die. The polishing tool 10 includes a rotating shaft 1 and at least two disc-shaped polishing bodies 7 and 8 provided on the rotating shaft 1 so as to be adjacent to each other. The rotating shaft 1 of the polishing tool 10 is a tool of the polishing apparatus 100. By being attached to the rotating device 3, the polishing device main body is rotatably supported. As for the 1st grinding | polishing body 7 and the 2nd grinding | polishing body 8, the outer peripheral surface becomes the processed surfaces 7a and 8a. The first polishing body 7 and the second polishing body 8 are each fixed to a rotating shaft 1 that passes through the center of the disk surface. Thereby, the 1st grinding | polishing body 7 and the 2nd grinding | polishing body 8 are attached to the rotating shaft 1 so that it may mutually adjoin. The polishing tool 10 is attached to the tool rotating device 3 and is driven to rotate about the rotation axis 1 by the tool rotating device 3. Then, the polishing tool 10 is brought into pressure contact with the workpiece W, and the first polishing body 7 and the second polishing body 8 are moved relative to the workpiece W in a direction parallel to the rotation axis 1. To process. The relative movement of the polishing tool 10 with respect to the workpiece W is executed by, for example, movement of the workpiece W by an XY stage (not shown).

  The polishing apparatus 100 includes a Z column (not shown) that moves the support member 4 connected to the tool rotating device 3 in the vertical direction. Here, as shown in FIG. 1, the upward direction is referred to as the Z-axis direction, and the downward direction is referred to as the −Z-axis direction. The polishing apparatus 100 is a processed surface of each polishing body 7, 8 of the polishing tool 10 by lowering the Z column in the −Z-axis direction while rotating the rotating shaft 1 of the polishing tool 10 at a constant rotation speed. The outer peripheral surfaces 7a and 8a operate so as to be brought into pressure contact with the surface Wa of the workpiece W. The polishing apparatus 100 adjusts the pressure contact force to the surface Wa of the workpiece W, the relative speed of the outer peripheral surfaces 7a and 8a of the polishing bodies 7 and 8 with respect to the surface Wa, and the residence time. The indentation depth to the surface Wa of the work piece 8 is controlled. Then, in a state where the polishing bodies 7 and 8 are rotated in pressure contact with the surface Wa of the workpiece W in the pressurizing direction in the −Z-axis direction, they are sent in a feeding direction S that is a moving direction parallel to the rotating shaft 1. Thus, a groove having a predetermined cut depth and a predetermined width extending linearly in the feed direction S is formed on the surface Wa. As a method of moving the polishing tool 10 with respect to the surface Wa of the workpiece W, the workpiece W may be moved with respect to the polishing tool 10, or the polishing tool 10 is moved with respect to the workpiece W. You may do it.

  In the first embodiment, the rotating shaft 1 of the polishing tool 10 is disposed in parallel with the relative movement direction of the polishing tool 10 and the workpiece W to be polished. Each of the polishing bodies 7 and 8 is fixed to a rotating shaft 1 that penetrates the center of the disk surface, and rotates integrally with the rotating shaft 1 around the center.

  The polishing body 7 is a first polishing body formed of a foamed resin, and a large number of holes are formed in the outer peripheral surface 7a. The foamed resin is preferably a foamed polyurethane resin. On the other hand, the polishing body 8 is a second polishing body formed of a non-foamed resin, and almost no pores are formed on the outer peripheral surface 8a. That is, the outer peripheral surface 7 a of the polishing body 7 is formed in a shape having a higher porosity than the outer peripheral surface 8 a of the polishing body 8. As this non-foamed resin, a non-foamed polyurethane resin is preferable. Since the abrasive body 8 is formed of a non-foamed polyurethane resin, the abrasive body 8 is more rigid and less elastically deformed than the abrasive body 7 formed of a foamed polyurethane resin. In other words, the polishing body 7 is less rigid than the polishing body 8 and easily elastically deforms.

  The polishing body 8 is disposed adjacent to the polishing body 7, and the polishing body 8 is polished when the relative movement direction of the polishing tool 10 and the workpiece is the feed direction (X-axis direction). It arrange | positions so that it may be located in the upstream with respect to the body 7. FIG. The polishing body 7 is formed to have a slightly larger diameter than the polishing body 8. The polishing body 7 has a radius larger than that of the polishing body 8 by the same amount as the difference between the elastic deformation amount of the polishing body 7 and the elastic deformation amount of the polishing body 8 due to the pressure pressed on the surface Wa of the workpiece W. It is formed with. With this shape, the load by which the polishing body 7 and the polishing body 8 are pressed against the workpiece W when pressurized is the same.

  In addition, as for the thickness of the grinding | polishing body 8, 1.0 mm or more and 1.5 mm or less are preferable. If it is smaller than 1.0 mm, the rigidity of the polishing body 8 is low, so that the polishing body 8 becomes the shape of the surface Wa of the workpiece W, and undulation cannot be removed. If it is larger than 1.5 mm, it will exceed 4 mm including the polishing body 7 and its gap, and the size of the removal mark will be larger than 4 mm. For this reason, the shape of a short wavelength cannot be corrected and the required processing accuracy cannot be obtained. The thickness of the polishing body 7 is preferably set to a thickness that is thicker than the polishing body 8 and is 4 mm or less by adding a gap to the polishing body 8. When the polishing body 8 is thicker than the polishing body 7, the waviness generated by the polishing body 8 cannot be completely smoothed by the polishing body 7. That is, the polishing body 7 is formed thicker than the polishing body 8. The thickness of the polishing body is the distance between the disk surfaces that are the side surfaces of the polishing body that intersect perpendicularly with the rotation axis. In the first embodiment, the interval between the polishing bodies 7 and 8 adjacent to each other is set to 0.5 mm or less. This is to reduce the size of the removal mark to 4 mm or less and ensure the necessary processing accuracy by making the total of the polishing body 7, the polishing body 8 and the gap between them 4 mm or less. In this way, the polishing bodies 7 and 8 are arranged on the rotary shaft 1 with a space therebetween.

  With the above configuration, when polishing the surface Wa of the workpiece W using the polishing tool 10, the polishing bodies 7 and 8 are lowered in the −Z-axis direction while rotating in the rotation direction of the rotary shaft 1, and polishing is performed. The outer peripheral surfaces 7a and 8a of the bodies 7 and 8 are brought into pressure contact with the surface Wa of the workpiece W. Since the polishing body 7 is formed of a polyurethane foam resin, the polishing body 7 is elastically deformed and rotates while closely contacting the surface of the workpiece W.

  Further, since the polishing body 7 is formed of a foamed polyurethane resin, a large number of holes are formed in the outer peripheral surface 7a, and the polishing liquid (polishing abrasive grains) can easily enter the holes. . Therefore, it is possible to suppress the formation of a polishing liquid film between the outer peripheral surface 7a of the polishing body 7 and the surface Wa of the workpiece W, and the polishing body 7 can be prevented from being lifted with respect to the surface Wa. Can be suppressed. Further, a large amount of abrasive grains can be held by a large number of holes, and the number of abrasive grains supplied between the outer peripheral surface 7a of the polishing body 7 and the surface Wa of the workpiece W increases, The polishing removal efficiency is increased. As described above, the surface Wa of the workpiece W is effectively polished by the polishing body 7, but periodic waviness may be formed by the polishing body 7 on the surface Wa of the workpiece W.

  When the moving direction of the polishing tool 10 relative to the workpiece W is the feed direction S (X-axis direction) as shown in FIG. 1, the waviness formed on the surface Wa of the workpiece W by the polishing body 7 is polished. It is smoothed by a polishing body 8 that passes next (finally) the body 7. More specifically, since the polishing body 8 is made of a non-foamed polyurethane resin, the polishing body 8 has higher rigidity than the polishing body 7 and is not easily elastically deformed even when pressed against the surface Wa of the workpiece W. Therefore, since the outer peripheral surface 8a of the polishing body 8 is less likely to contact the undulation valleys and more likely to contact the peaks, the undulation smoothing ability of the polishing body 8 is high. The waviness ridge formed on the surface Wa of the workpiece W is removed by the polishing body 8, and the surface Wa of the workpiece W is effectively smoothed.

[Second Embodiment]
Next, a second embodiment of the present invention will be described. A polishing tool 11 according to the second embodiment is shown in FIG. The same parts as those in FIG. The polishing tool 11 includes a rotating shaft 1 and three disk-shaped polishing bodies 7, 8, 9 provided on the rotating shaft 1 so as to be adjacent to each other. By being attached to the tool rotating device 3, it is rotatably supported by the polishing apparatus main body. As for the 1st grinding | polishing body 7, the 2nd grinding | polishing body 8, and the 3rd grinding | polishing body 9, the outer peripheral surface becomes the processed surface 7a, 8a, 9a. The first polishing body 7, the second polishing body 8, and the third polishing body 9 are fixed to the rotary shaft 1 that penetrates the center of the disk surface. Thus, the first polishing body 7 and the second polishing body 8, and the first polishing body 7 and the third polishing body 9 are attached to the rotary shaft 1 so as to be adjacent to each other, and the center portion is the center. It rotates integrally with the rotating shaft 1.

  The polishing body 9 is formed of a non-foamed resin like the polishing body 8, and almost no pores are formed on the outer peripheral surface 9a. That is, the outer peripheral surface 7 a of the polishing body 7 is formed in a shape having a higher porosity than the outer peripheral surface 9 a of the polishing body 9. As this non-foamed resin, a non-foamed polyurethane resin is preferable. Since the polishing body 9 is made of a non-foamed polyurethane resin, the polishing body 9 is more rigid and less elastically deformed than the polishing body 7 made of a foamed polyurethane resin. In other words, the polishing body 7 is less rigid than the polishing body 9 and is easily elastically deformed.

  Next, the processing method of the to-be-processed object in this embodiment using the polishing tool 11 is demonstrated using FIG.2 (b). After the polishing tool 11 forms a groove on the surface Wa of the workpiece W in the X-axis direction, the polishing tool 11 is moved at a constant interval P (feed pitch) in the Y-axis direction orthogonal to the feed direction S (X-axis direction). ), And moves in the feed-back direction (−X axis direction) with a part overlapped with the already formed groove. In the present embodiment, the polishing tool 11 is slid by a predetermined interval P in the Y-axis direction in this way. The movement direction of the polishing tool 11 relative to the workpiece is alternately switched between the feed direction (X-axis direction) and the feed-back direction (−X axis direction), and the entire surface of the workpiece W is polished into an arbitrary shape. Apply. As a method of moving the polishing tool 11 with respect to the surface Wa of the workpiece W, the workpiece W may be moved with respect to the polishing tool 11, or the polishing tool 11 may be moved with respect to the workpiece W. You may make it move.

  The polishing body 9 is disposed adjacent to the polishing body 7, and the polishing body 9 is a polishing body when the moving direction of the polishing tool 11 with respect to the workpiece is the return direction (−X axis direction). 7 on the upstream side.

  In addition, when the polishing tool 11 is moved relative to the workpiece W in the feed back direction (−X axis direction), the waviness formed on the surface Wa of the workpiece W by the polishing body 7 is the polishing body 7. Is smoothed by the polishing body 9 that passes next (finally). That is, since the polishing body 9 is formed of a non-foamed polyurethane resin, the surface Wa of the workpiece W is high because the polishing body 7 has higher rigidity and higher waviness smoothing ability than the polishing body 7. Is effectively smoothed. In the second embodiment, abrasive bodies 8 and 9 having high rigidity are disposed adjacent to both sides of the abrasive body 7. Therefore, when the moving direction of the polishing tool 11 with respect to the workpiece is alternately switched between the feed direction S (X-axis direction) and the feed-back direction (−X-axis direction), removal by polishing is performed in either direction. After that, the swell can be smoothed.

  As described above, when the moving direction of the polishing tool 11 with respect to the workpiece is the feed direction (X-axis direction), the surface Wa is polished and removed by the polishing body 7 and then the undulation of the surface Wa is smoothed by the polishing body 8. In the case of the feed-back direction (−X-axis direction), the surface Wa is polished and removed by the polishing body 7 and then the waviness of the surface Wa is smoothed by the polishing body 9. Accordingly, the entire surface of the workpiece W is removed by polishing and the undulation is smoothed by shifting the movement direction alternately while shifting the pitch P in the direction orthogonal to the movement direction of the polishing tool 11 relative to the workpiece W. Can be done at once. That is, the polishing removal and the smoothing of the undulation can be performed only by scanning the polishing tool 11 once with respect to the surface Wa of the workpiece W. Thus, by giving each polishing body a different function, a high-quality workpiece surface can be obtained in a short time when polishing a free-form surface.

[Third Embodiment]
Next, a third embodiment of the present invention will be described. A polishing tool 12 according to the third embodiment is shown in FIG. The same parts as those in FIG. In FIG. 3A, a plurality of grooves 9b having a thickness of 0.1 mm or more and not more than the thickness of the polishing body 9 are formed on the outer peripheral surface 9a of the polishing body 9 in increments of 2 ° or less along a direction parallel to the rotation axis. ing. If the depth is smaller than 0.1 mm, when the polishing body 9 is pressurized, the polishing body 9 is deformed and the bottom of the groove comes into contact with the surface Wa of the workpiece W, so that the effect of the groove cannot be exhibited. There is. Since a plurality of grooves 9 b are formed on the outer peripheral surface 9 a of the polishing body 9, a polishing liquid film is formed between the outer peripheral surface 9 a of the polishing body 9 and the surface Wa of the workpiece W. And the floating of the polishing body 9 with respect to the surface Wa can be suppressed. Therefore, the ability to smooth the swell formed on the surface Wa of the workpiece W is further improved. This groove may also be formed in the polishing body 8, and may not be formed in the polishing body 9 but may be formed only in the polishing body 8. When formed on only one of the polishing body 8 or the polishing body 9, the swell smoothing ability of the polishing body on which the groove is formed is improved, and when formed on both the polishing body 8 and the polishing body 9, the polishing body 8 and the polishing body 9. Both the swell smoothing ability is improved, and a higher quality workpiece surface can be obtained.

[Fourth Embodiment]
Next, a fourth embodiment of the present invention will be described. A polishing tool 13 according to the fourth embodiment is shown in FIG. The same parts as those in FIG. In FIG. 3B, in the fourth embodiment, the polishing tool 13 contacts the (both) side surfaces 8c and 8d of the polishing body 7 that is the first polishing body and the polishing body 8 that is the second polishing body. Disk-shaped support members 21a and 21b for preventing deformation made of a metal plate such as stainless steel. The support members 21a and 21b are set to have a radius smaller than that of the polishing body 8 so as not to contact the surface Wa of the workpiece W. The support members 21a and 21b are preferably set to be 0.1 mm smaller than the elastic deformation amount of the polishing body 8. If it is larger than this, the support members 21a and 21b come into contact with the surface Wa of the workpiece W when the polishing body 8 is elastically deformed, and if it is smaller than this, sufficient rigidity to support the polishing body 8 is obtained. May not be able to get. The support members 21a and 21b preferably have a thickness of 0.1 mm or more and 0.5 mm or less. If it is thicker than this, it may come into contact with another polishing body, and if it is thinner than this, sufficient rigidity to support the polishing body 8 may not be obtained.

  With the above configuration, even when the polishing body 8 receives a force in the feed direction S during the polishing process, the polishing body 8 is supported by the support members 21a and 21b. . As a result, unevenness of polishing removal that occurs when the polishing body 8 is swung can be suppressed, and a higher-quality workpiece surface can be obtained. Further, the support members 21a and 21b can select a material having lower rigidity with respect to the rigidity of the polishing body 8. The support member may be formed on the polishing body 9, or may not be formed on the polishing body 8 but may be formed only on the polishing body 9. When the polishing body 8 or the polishing body 9 is formed only on one side, unevenness of polishing removal of the formed polishing body can be suppressed, and when formed on both the polishing body 8 and the polishing body 9, polishing removal of both polishing bodies is performed. Therefore, it is possible to obtain a higher-quality workpiece surface.

[Fifth Embodiment]
Next, a fifth embodiment of the present invention will be described. A polishing tool 14 according to the fifth embodiment is shown in FIG. The same parts as those in FIG. In FIG. 3C, the polishing tool 14 includes three disk-shaped polishing bodies 22, 23 and 24. The polishing body 22 is a first polishing body formed of a foamed polyurethane resin as a foamed resin, and a large number of holes are formed in the outer peripheral surface 22a. On the other hand, the polishing body 23 is a second polishing body formed of a non-foaming polyurethane resin as a non-foaming resin, and the polishing body 24 is a third polishing body formed of a non-foaming polyurethane resin as a non-foaming resin. This is a polished body. There are almost no holes in the outer peripheral surfaces 23a and 24a. That is, the outer peripheral surface 22 a of the polishing body 22 is formed in a shape having a higher porosity than the outer peripheral surfaces 23 a and 24 a of the polishing bodies 23 and 24.

  In addition, since the polishing bodies 23 and 24 are made of a non-foamed polyurethane resin, the polishing bodies 23 and 24 are more rigid and less elastically deformed than the polishing body 22 made of a foamed polyurethane resin. In other words, the polishing body 22 is less rigid than the polishing bodies 23 and 24 and is easily elastically deformed. The polishing bodies 23 and 24 are disposed adjacent to the polishing body 22. The polishing body 23 is disposed upstream of the movement direction with respect to the polishing body 22 when the movement direction of the polishing tool with respect to the workpiece is the feeding direction S (X-axis direction). It arrange | positions in the moving direction upstream with respect to the grinding | polishing body 22 at the time of (-X-axis direction). The polishing body 22 is formed to have a slightly larger diameter than the polishing bodies 23 and 24.

  The thickness in the direction parallel to the moving direction of the polishing body 23 and the polishing body 24 is set to 1.0 mm, for example. The thickness of the polishing body 22 is set to 2.0 mm, for example. This is because the total thickness of the polishing body 22, the polishing body 23, and the polishing body 24 is set to 4 mm or less, so that the size of the removal mark is set to 4 mm or less to ensure necessary processing accuracy. That is, the polishing body 22 is formed thicker than the polishing body 23 and the polishing body 24. In addition, a plurality of grooves 23b and 24b having a depth of 0.1 mm or more and a thickness of the polishing bodies 23 and 24 or less are provided on the outer peripheral surfaces 23a and 24a of the polishing bodies 23 and 24 along a direction parallel to the rotation axis direction. It is formed in steps of ° or less. When the depth is 0.1 mm or less, when the polishing bodies 23 and 24 are pressurized, the polishing bodies 23 and 24 are deformed, and the bottom of the groove comes into contact with the surface Wa of the workpiece W, thereby improving the effect of the groove. I can't show it. When the angle is larger than 2 °, a film of a polishing liquid is generated, and the polishing body is prevented from coming into contact with the surface of the workpiece, so that the processing efficiency is remarkably reduced. In the fifth embodiment, the interval between the polishing bodies 22 and 23 adjacent to each other and the interval between the polishing bodies 22 and 24 are set to 0 mm without disposing them, and the respective polishing bodies 22, 23, and 24 are arranged on the rotary shaft 1. . If the interval is not opened, the removal trace of the entire tool becomes small, so that correction processing can be performed to a shorter wavelength shape, and a high-quality workpiece surface can be obtained.

  In the fifth embodiment, the polishing body 23 and the polishing body 24 are made of the same material and have the same shape (the same diameter, the same width, and the same groove interval), and are symmetric with respect to the polishing body 22. It is configured. Therefore, in the fifth embodiment, in addition to the same effects as the first embodiment, the movement direction of the polishing tool with respect to the workpiece in each of the polishing bodies 23 and 24 is the + X axis direction and the −X axis direction. In either case, the waviness generated in the polishing body 22 can be similarly smoothed. Therefore, when polishing a free-form surface, a higher-quality workpiece surface can be obtained in a short time. In the fifth embodiment, the polishing bodies 23 and 24 are provided with grooves 23b and 24b. Therefore, it is possible to prevent the polishing bodies 23 and 24 from being lifted regardless of whether the movement direction of the polishing tool relative to the workpiece is the + X axis direction or the −X axis direction, and effectively smooth the swell. Can do.

  Although the present invention has been described based on the above embodiment, the present invention is not limited to this. In the fourth embodiment, the support members 21a and 21b are formed in a disk shape and the material is stainless steel. However, the shape and material can be arbitrarily set as long as the wobbling of the polishing body 8 can be prevented. is there. In the fourth embodiment, the support members 21a and 21b are provided on the polishing body 8. However, the support members may be provided on the polishing body 7 or the polishing body 9 as well (that is, the first and second polishing members). A support member may be provided on at least one of the bodies), and in this case, the same effect can be obtained.

  Moreover, in 1st Embodiment, although the space | interval of the mutually adjacent grinding | polishing bodies 7 and 8 was 0.5 mm, the space | interval is arbitrary and there exists the same effect even if it sets to any space | interval. In the fifth embodiment, the interval between the polishing bodies 22 and 23 and the polishing bodies 22 and 24 is set to 0 mm. However, as long as the arrangement of the polishing bodies is symmetrical, the interval is arbitrary, and any interval is set. However, the same effect can be obtained.

  Moreover, although the said 2nd-5th embodiment demonstrated the case where there were three polishing bodies, it is not limited to this. In the second to fifth embodiments, the case where the moving direction of the polishing tool with respect to the workpiece is alternately switched between the X-axis direction and the −X-axis direction has been described. However, when the moving direction is only one direction, The polishing body downstream in the feed direction with respect to the polishing body 7 (polishing body 22) can be omitted.

  Further, another polishing body may be interposed between the polishing body 7 and the polishing body 8, and another polishing body may be interposed between the polishing body 7 and the polishing body 9. May be. Similarly, another polishing body may be inserted between the polishing body 22 and the polishing body 23, and another polishing body may be inserted between the polishing body 22 and the polishing body 24. It may be left. In this case, the polishing bodies 8 and 23 or the polishing bodies 9 and 22 will finally pass through the surface of the workpiece, and the swell can be effectively smoothed. In this case, it is preferable to provide the same number of polishing bodies symmetrically across the polishing bodies 7 and 22.

  Moreover, although the said 1st-5th embodiment demonstrated the case where foaming resin was foaming polyurethane resin, foaming resin may be foaming epoxy resin, foaming phenol resin, etc. Similarly, although the case where the non-foamed resin is a non-foamed polyurethane resin has been described, the non-foamed resin may be a non-foamed epoxy resin, a non-foamed phenol resin, or the like.

1 Rotating shaft 7 Abrasive body (first abrasive body)
8 Polishing body (second polishing body)
9 Abrasive body (third abrasive body)
10, 11, 12, 13, 14 Polishing tool

Claims (6)

A rotation axis;
A disc-shaped first polishing body provided on the rotating shaft and having an outer peripheral surface as a processing surface;
A disc-shaped second polishing body provided on the rotary shaft adjacent to the first polishing body and having a peripheral surface as a processing surface;
The first polishing body has an outer peripheral surface formed in a shape having a higher porosity than the second polishing body,
The polishing tool for polishing a surface of a workpiece, wherein the second polishing body is made of a material having rigidity higher than that of the first polishing body.   The polishing tool according to claim 1, further comprising a deformation preventing support member provided on a side surface of at least one of the first polishing body and the second polishing body.   The polishing tool according to claim 1, wherein the first polishing body is made of a foamed resin.   The polishing tool according to any one of claims 1 to 3, wherein a plurality of grooves are formed on the outer peripheral surface of the second polishing body in parallel with the feed direction. A processing method of a workpiece for polishing the surface of the workpiece,
A disc-shaped first polishing body and a second polishing body having a peripheral surface attached adjacent to the same rotating shaft as a processing surface are pressed against the workpiece, and the first polishing body and Moving the second polishing body relative to the workpiece in a direction parallel to the rotation axis;
The first polishing body has an outer peripheral surface formed in a shape having a higher porosity than the second polishing body,
The second polishing body is made of a material having higher rigidity than the first polishing body,
A method of processing a workpiece, wherein waviness formed by processing by the first polishing body is removed by the second polishing body.   The workpiece processing method according to claim 5, wherein the second polishing body is disposed upstream in a direction in which the second polishing body is moved with respect to the first polishing body.

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