JP2011044683A - Ceramic substrate, and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a ceramic substrate having a microfine electrode pattern and a general electrode pattern with a line width wider than that of the microfine electrode pattern, while restraining a material loss and securing thickness uniformity of the electrode patterns. <P>SOLUTION: This ceramic substrate includes a ceramic laminate 100 provided with a microfine electrode pattern area A and a general electrode pattern area B, and laminated with a multilayered ceramic layers 10a, 10b, 10c, 10d the microfine electrode pattern 110a formed on the microfine electrode pattern area A of the ceramic laminate 100, and formed in a photo-etching process, and the general electrode pattern 120a formed on the general electrode pattern area B of the ceramic laminate 100, having the line width wider than that of the microfine electrode pattern 110a, and formed in a screen printing process. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a ceramic substrate and a method for manufacturing the same, and more specifically, a fine electrode pattern is formed by applying a photo etching method only to a fine electrode pattern region, and the fine electrode pattern stranded wire is formed. The wide general electrode pattern relates to a ceramic substrate formed by a screen printing process and a manufacturing method thereof.

  Recently, along with the development of electronic device technology, the device itself has become shorter, thinner and thinner, and for this reason, integration of components has become essential.

  In order to integrate parts, a multilayer ceramic substrate formed by laminating a large number of ceramic sheets has been developed. Such a multilayer ceramic substrate is excellent in heat resistance, wear resistance, and electrical characteristics, and has been widely used as a replacement for a conventional printed circuit board, and the demand thereof tends to increase gradually.

  Such a multilayer ceramic substrate is widely used to constitute various electronic components such as FA module substrates, RF diode switches, fill filters, chip antennas, various package components, and composite devices.

  An electrode pattern for electrical connection to the outside is formed on such a multilayer ceramic substrate. The electrode pattern is formed by printing an electrode material on the green sheet and then simultaneously with the green sheet. The method can be divided into a firing method and a post-firing method in which an electrode material is printed on a substrate that has already been fired and then fired.

  In particular, in the case of a substrate that requires a fine line width, an electrode material is applied on a substrate that is fired by any one of the two methods described above, and then a photo-etching method using photolithography. An electrode pattern can be formed.

  Here, a normal ceramic substrate may be composed of a portion requiring a fine line width and a portion having a relatively wide line width for mounting a general surface mount device. Conventionally, an electrode material for electrode pattern formation is applied to the entire surface of the substrate, and then portions other than the effective pattern are etched. In the case of a specification with a wide line and line width, it can be sufficiently formed even by a screen printing method, so that there is a disadvantage that its effectiveness is low.

  In addition, when using the photo-etching method, the thickness of the electrode material to be etched must be uniform over the entire substrate, but it is difficult to ensure the uniformity of the thickness of the electrode material applied to the entire surface of the substrate. There is.

  Therefore, the present invention has been made in view of the above-mentioned problems, and the object of the present invention is to selectively perform photoetching on a ceramic substrate only at a site where a fine line width and high accuracy are required. By applying the screen printing method to the relatively wide line width, the area of the electrode material to be etched is minimized, the material loss is reduced, and the thickness uniformity of the electrode pattern is facilitated. An object of the present invention is to provide a ceramic substrate and a method for manufacturing the same that can be secured.

  In order to achieve the above object, a ceramic substrate according to a preferred embodiment of the present invention includes a ceramic laminate in which a fine electrode pattern region and a general electrode pattern region are provided, and multilayer ceramic layers are laminated. Formed on the fine electrode pattern area of the body and formed on the general electrode pattern area of the ceramic laminate by the fine electrode pattern formed by the photoetching process, and the line width is larger than the fine electrode pattern, formed by the screen printing process General electrode patterns may be included.

  Here, the side surface of the fine electrode pattern may have a surface perpendicular to the surface of the ceramic laminate.

  Further, the fine electrode pattern can include a nano-sized conductive base.

  The fine electrode pattern can have a line width of 50 μm or less.

  Further, the general electrode pattern can include a conductive paste for micro size.

  The general electrode pattern may have a line width greater than 50 μm.

  In order to achieve the above object, a method of manufacturing a ceramic substrate according to another preferred embodiment of the present invention includes a ceramic laminate including a fine electrode pattern region and a general electrode pattern region, and multilayer ceramic layers are laminated. A step of forming a conductive layer for fine electrode pattern formation on the fine electrode pattern region of the ceramic laminate, and a step of forming a general electrode pattern by screen printing on the general electrode pattern region of the ceramic laminate And a step of forming a photosensitive film pattern exposing a part of the conductive layer for forming the fine electrode pattern on the ceramic laminate including the conductive layer for forming the fine electrode pattern and the general electrode pattern; Etching the conductive layer for fine electrode pattern formation to form a fine electrode pattern A step may include.

  Here, in the step of forming the fine electrode pattern forming conductive layer, the fine electrode pattern forming conductive layer can be formed by a screen printing method.

  The conductive layer for forming a fine electrode pattern can be configured to include a nano-size conductive paste.

  The fine electrode pattern can be formed to have a line width of 50 μm or less.

  The general electrode pattern may include a micro-size conductive base.

  The general electrode pattern can be formed to have a line width greater than 50 μm.

  In addition, after the step of forming the general electrode pattern, a step of firing the conductive layer for forming a fine electrode pattern and the general electrode pattern can be further included.

  The step of forming a photosensitive film pattern includes a step of forming a photosensitive film on the ceramic laminate including the conductive layer for forming a fine electrode pattern and a general electrode pattern, and selectively exposing and developing a part of the photosensitive film. Forming a photosensitive film pattern exposing a portion of the conductive layer for forming a fine electrode pattern.

  In addition, the method may further include a step of removing the photosensitive film pattern after the step of forming the fine electrode pattern.

  As described above, according to the ceramic substrate and the manufacturing method thereof of the present invention, the fine electrode pattern is formed by the photoetching method in the fine electrode pattern region where the fine line width and high accuracy are required, and the fine electrode In a general electrode pattern area where a line width relatively wider than the pattern is required, a general electrode pattern is formed by a screen printing method, whereby a fine electrode pattern and a general electrode pattern having a larger line width are formed on the ceramic laminate Can be formed efficiently.

  Further, according to the present invention, in forming the fine electrode pattern, the fine electrode pattern forming conductive layer is not printed on the entire surface of the ceramic laminate, but is printed only on the fine electrode pattern region and then etched. As a result, the area of the conductive layer to be etched can be minimized to reduce material loss, and the thickness uniformity of the fine electrode pattern can be easily ensured.

  Further, according to the present invention, the shape of the fine electrode pattern is not affected by the firing step by etching the fired conductive layer for forming the fine electrode pattern in the photoetching step to form the fine electrode pattern. The side surface can be a vertical surface. Therefore, there is an advantage that the side wall boundary of the fine electrode pattern can be clarified and a pattern having a fine interval and a line width can be realized.

It is sectional drawing which showed the ceramic substrate by embodiment of this invention. FIG. 4 is a cross-sectional view sequentially illustrating steps for explaining a method for manufacturing a ceramic substrate according to an embodiment of the present invention. Similarly, it is sectional drawing which showed the process in order, in order to demonstrate the manufacturing method of the ceramic substrate by embodiment of this invention. Similarly, it is sectional drawing which showed the process in order, in order to demonstrate the manufacturing method of the ceramic substrate by embodiment of this invention. Similarly, it is sectional drawing which showed the process in order, in order to demonstrate the manufacturing method of the ceramic substrate by embodiment of this invention. Similarly, it is sectional drawing which showed the process in order, in order to demonstrate the manufacturing method of the ceramic substrate by embodiment of this invention. Similarly, it is sectional drawing which showed the process in order, in order to demonstrate the manufacturing method of the ceramic substrate by embodiment of this invention.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the drawings of ceramic substrates. Each embodiment shown below is given as an example for enabling the person skilled in the art to fully convey the idea of the present invention. Therefore, the present invention is not limited to the following embodiments and can be realized in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like reference numerals refer to like elements throughout the specification.

  FIG. 1 is a cross-sectional view illustrating a ceramic substrate according to an embodiment of the present invention.

  As shown in the figure, the ceramic substrate according to the embodiment of the present invention includes a ceramic laminate 100 having a fine electrode pattern region A and a general electrode pattern region B, and a fine electrode pattern formed on the ceramic laminate 100. 110a and a general electrode pattern 120a.

  Here, the ceramic laminate 100 is an LTCC substrate formed by low-temperature firing at about 800 to 1000 ° C., and may include ceramic layers 10 a, 10 b, 10 c, and 10 d stacked in multiple layers.

  The ceramic laminate 100 includes a wiring layer (not shown) interposed between the multilayer ceramic layers 10a, 10b, 10c, and 10d, and a wiring layer passing through the ceramic layers 10a, 10b, 10c, and 10d. And vias (not shown) for electrically connecting the two.

  At this time, the wiring layer may be formed on the surfaces of the ceramic layers 10a, 10b, 10c, and 10d by a screen printing method using a conductive paste such as Ag.

  In addition, vias are formed in via holes by a method such as punching at appropriate positions of the ceramic layers 10a, 10b, 10c, and 10d according to the substrate circuit pattern, and then the via holes are filled with a conductive paste such as Ag. And may be formed.

  The fine electrode pattern 110a is formed on the fine electrode pattern region A of the ceramic laminate 100, and the general electrode pattern 120a has a line width larger than that of the fine electrode pattern 110a. It is formed on the electrode pattern region B.

  The fine electrode pattern area A is a part that requires a fine line width and high accuracy, and the general electrode pattern area B is a part that may have a relatively wide line width compared to the fine electrode pattern area A. This is the part where the element is mounted.

  Here, the fine electrode pattern 110a formed in the fine electrode pattern region A can have a line width of 50 μm or less, and can include a nano-size conductive paste.

  And the general electrode pattern 120a formed in the general electrode pattern area | region B can have a line width larger than 50 micrometers, and can be set as the structure containing the electrically conductive paste for microsizes.

  Particularly, in the ceramic substrate according to the embodiment of the present invention, the fine electrode pattern 110a is formed by a photo etching process, and the general electrode pattern 120a is formed by a screen printing process. It is.

  At this time, the fine electrode pattern 110a of the ceramic substrate according to the embodiment of the present invention is a conductive layer for forming the fine electrode pattern on the fine electrode pattern region A of the fired ceramic laminate 100 (see reference numeral 110 in FIG. 2). After the conductive layer 110 is formed, the conductive layer 110 is baked, and then a part of the conductive layer 110 is etched by a photoetching process, so that the side surface has a surface perpendicular to the surface of the ceramic laminate 100. Can be formed.

  That is, the fine electrode pattern 110a can be formed as a vertical surface by etching and patterning the fired conductive layer 110 without being affected by the firing process. Therefore, according to the embodiment of the present invention, the sidewall boundary of the fine electrode pattern 110a can be clarified, and there is an advantage that a pattern having a fine interval and a line width can be realized.

  According to the embodiment of the present invention, the conductive layer for forming a fine electrode pattern is not applied to the entire surface of the ceramic laminate 100, but formed only on the fine electrode pattern region A, and then etched to form a fine electrode pattern. By forming 110a, it is possible to minimize the area of the conductive layer to be etched to reduce material loss and to easily ensure the thickness uniformity of the fine electrode pattern 110a.

  Then, the general electrode pattern 120a having a line width larger than that of the fine electrode pattern 110a is formed on the portion that does not need to be formed as the fine electrode pattern 110a, that is, on the general electrode pattern region B by the screen printing method as described above. Accordingly, the overall manufacturing cost of the ceramic substrate can be reduced, and the fine electrode pattern 110a and the general electrode pattern 120a can be efficiently formed.

  Hereinafter, a method for manufacturing a ceramic substrate according to an embodiment of the present invention will be described in detail with reference to FIGS.

  2 to 7 are cross-sectional views sequentially showing processes for explaining a method of manufacturing a ceramic substrate according to an embodiment of the present invention.

  As shown in FIG. 2, the ceramic laminated body 100 provided with the fine electrode pattern area | region A and the general electrode pattern area | region B is prepared. Here, the ceramic laminate 100 may be an LTCC substrate formed by low-temperature firing at about 800 to 1000 ° C. The ceramic laminate 100 includes multilayer ceramic layers 10a, 10b, 10c, and 10d, a wiring layer interposed between the multilayer ceramic layers 10a, 10b, 10c, and 10d, and the ceramic layers 10a, 10b, and 10c. 10d, and a via that electrically connects the wiring layers.

  Subsequently, a first mask pattern (not shown) that exposes only the fine electrode pattern region A is formed on the ceramic laminate 100, and then the fine electrode pattern region A exposed by the first mask pattern is finely patterned. The electrode pattern forming conductive layer 110 is filled with squeeze.

  Subsequently, the first mask pattern is removed.

  As described above, the conductive layer 110 for forming a fine electrode pattern can be formed by a screen printing method or the like. At this time, the conductive layer 110 for forming a fine electrode pattern can be configured to include a nano-size conductive paste or the like. For example, the main component of the conductive layer 110 for forming a fine electrode pattern may be Ag, Au, Cu, or the like.

  Next, as shown in FIG. 3, a general electrode pattern 120a is formed on the general electrode pattern region B of the ceramic laminate 100 by a screen printing method.

  Here, the general electrode pattern 120a using the screen printing method is a second mask pattern (not shown) in which an opening for exposing a region where the general electrode pattern 120a is formed is provided on the ceramic laminate 100. Then, the opening can be filled with the conductive layer for forming a general electrode pattern by squeezing. Thereafter, the second mask pattern is removed.

  Here, the general electrode pattern 120a may be configured to include a micro-size conductive paste or the like. Further, the general electrode pattern 120a can be formed to have a line width greater than 50 μm.

  Subsequently, the fine electrode pattern forming conductive layer 110 and the general electrode pattern 120a are baked.

  Subsequently, as shown in FIG. 4, a photosensitive film 130 is formed on the ceramic laminate 100 including the conductive layer 110 for forming a fine electrode pattern and the general electrode pattern 120a.

  Thereafter, as shown in FIG. 5, a portion of the photosensitive film 130 is selectively exposed and developed to form a photosensitive film pattern 130a that exposes a portion of the conductive layer 110 for forming a fine electrode pattern.

  Next, as shown in FIG. 6, the fine electrode pattern forming conductive layer 110 is etched using the photosensitive film pattern 130a as a mask to form the fine electrode pattern 110a. Here, the fine electrode pattern 110a can be formed to have a line width of 50 μm or less.

  Subsequently, as shown in FIG. 7, the photosensitive film pattern 130a is removed.

  At this time, according to the embodiment of the present invention, after the fine electrode pattern forming conductive layer 110 is fired, the fired fine electrode pattern forming conductive layer 110 is etched to form the fine electrode pattern 110a by a photoetching process. By forming, the side surface of the fine electrode pattern 110a can be a vertical surface without being affected by the baking process. Therefore, according to the embodiment of the present invention, the sidewall boundary of the fine electrode pattern 110a can be clarified, and a pattern having a fine interval and line width can be realized.

  As described above, in the embodiment of the present invention, the fine electrode pattern 110a is formed by a photoetching method using the photosensitive film pattern 130a, and the general electrode pattern 120a having a line width larger than the fine electrode pattern 110a is a line. The fine electrode pattern 110a and the general electrode pattern 120a can be efficiently formed on the ceramic laminate 100 by forming by a screen printing method suitable for forming an electrode pattern having a relatively large width.

  In forming the fine electrode pattern 110a, the fine electrode pattern forming conductive layer 110 is not applied to the entire surface of the ceramic laminate 100, but is formed only on the fine electrode pattern region A and then etched. As a result, the area of the conductive layer 110 to be etched can be minimized to reduce material loss, and the thickness uniformity of the fine electrode pattern 110a can be easily ensured.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

DESCRIPTION OF SYMBOLS 10a, 10b, 10c, 10d Ceramic layer 100 Ceramic laminated body 110 Electroconductive layer for fine electrode pattern formation 110a Fine electrode pattern 120a General electrode pattern 130 Photosensitive film 130a Photosensitive film pattern A Fine electrode pattern area B General electrode pattern area

Claims (15)

A ceramic laminate in which a fine electrode pattern region and a general electrode pattern region are provided, and a multilayer ceramic layer is laminated;
A fine electrode pattern formed on the fine electrode pattern region of the ceramic laminate and formed by a photoetching process;
A general electrode pattern formed on the general electrode pattern region of the ceramic laminate, having a line width larger than the fine electrode pattern, and formed by a screen printing process;
Including ceramic substrate.   The ceramic substrate according to claim 1, wherein a side surface of the fine electrode pattern has a vertical surface with respect to a surface of the ceramic laminate.   The ceramic substrate according to claim 1, wherein the fine electrode pattern includes a nano-size conductive paste.   The ceramic substrate according to claim 1, wherein the fine electrode pattern has a line width of 50 μm or less.   The ceramic substrate according to claim 1, wherein the general electrode pattern includes a conductive paste for micro size.   The ceramic substrate according to claim 1, wherein the general electrode pattern has a line width greater than 50 μm. Preparing a ceramic laminate including a fine electrode pattern region and a general electrode pattern region, and a multilayer ceramic layer laminated;
Forming a conductive layer for forming a fine electrode pattern on the fine electrode pattern region of the ceramic laminate;
Forming a general electrode pattern by screen printing on the general electrode pattern region of the ceramic laminate;
Forming a photosensitive film pattern exposing a portion of the conductive layer for forming a fine electrode pattern on the ceramic laminate including the conductive layer for forming a fine electrode pattern and the general electrode pattern;
Etching the fine electrode pattern forming conductive layer exposed by the photosensitive film pattern to form a fine electrode pattern;
A method for manufacturing a ceramic substrate comprising: In the step of forming the conductive layer for forming the fine electrode pattern,
The method for manufacturing a ceramic substrate according to claim 7, wherein the conductive layer for forming a fine electrode pattern is formed by a screen printing method.   The method for manufacturing a ceramic substrate according to claim 7, wherein the conductive layer for forming a fine electrode pattern includes a nano-size conductive paste.   The method for manufacturing a ceramic substrate according to claim 7, wherein the fine electrode pattern is formed to have a line width of 50 μm or less.   The method for manufacturing a ceramic substrate according to claim 7, wherein the general electrode pattern includes a micro-size conductive paste.   The method for manufacturing a ceramic substrate according to claim 7, wherein the general electrode pattern is formed to have a line width greater than 50 μm. After the step of forming the general electrode pattern,
The method for manufacturing a ceramic substrate according to claim 7, further comprising a step of firing the conductive layer for forming a fine electrode pattern and the general electrode pattern. The step of forming the photosensitive film pattern includes:
Forming a photosensitive film on top of the ceramic laminate including the fine electrode pattern forming conductive layer and the general electrode pattern;
The method of manufacturing a ceramic substrate according to claim 7, further comprising: exposing and developing a part of the photosensitive film selectively to form a photosensitive film pattern exposing a part of the conductive layer for forming the fine electrode pattern. After the step of forming the fine electrode pattern,
The method of manufacturing a ceramic substrate according to claim 7, further comprising a step of removing the photosensitive film pattern.

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