JP2011040510A - Printed circuit board for light emitting module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed circuit board for a light emitting module, which is capable of efficiently dissipating heat generated by an LED through a heat dissipation section by integrally providing the heat dissipation section on the printed circuit board for increasing the heat dissipation area, and furthermore, is capable of increasing the brightness of the light emitting module through the use of reflecting surfaces produced by bending the printed circuit board itself. <P>SOLUTION: As the printed circuit board 1 for a light emitting module, a printed circuit board 2, which includes a wiring pattern 3 formed on one side 2a of a metal plate and the heat dissipation part 6 consisting of multiple heat dissipation fins 6a and integrally provided on the other side 2b of the metal plate, is used. The printed circuit board 2 has shade parts 7 which are bent at a predetermined angle toward the one side 2a by using parts of the heat dissipation fins 6a in the heat dissipation part 6 as bending lines. Light emitted from the LED 5, which is a light emitting element mounted on the wiring pattern 3, is reflected by the reflecting surfaces of the shade parts 7. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a printed circuit board for a light emitting module excellent in heat dissipation of heat generated by the light emitting element, and more particularly to a printed circuit board for a light emitting module in which a shade portion that changes the direction of light emitted from the light emitting element is integrally formed.

  In recent years, in light of environmental problems, particularly in the reduction of carbon dioxide, semiconductor light emitting diodes (hereinafter abbreviated as LEDs), which have low power consumption, are frequently used as various lighting devices. When used for illumination, a high-brightness LED is required. However, since this high-brightness LED causes a high current to flow because it generates a high temperature, it is necessary to dissipate heat in order to emit light efficiently. Therefore, it has been proposed to dissipate heat by joining a heat sink having heat dissipation fins to a printed circuit board on which high-brightness LEDs are mounted, or to dissipate heat using a metal base substrate whose core is the printed circuit board itself. Yes. Moreover, since the light emitted from the LED diffuses, it is necessary to provide a light reflecting means in order to collect and emit the light in one direction.

  As an example, in Japanese Patent Laid-Open No. 2002-93206 (Patent Document 1), in order to be able to dissipate concentrated heat generation in heat conduction in an LED signal lamp, the substrate holding the LED is made a self-supporting structure with a metal plate. Then, the substrate is placed on the heat radiating fin via the insulating heat conductive sheet, and the substrate and the insulating heat conductive sheet are pressed against the heat radiating fin by a resin pressure plate that also serves as a reflecting mirror. Mounting is disclosed. Japanese Patent Application Laid-Open No. 2007-173440 (Patent Document 2) uses a metal substrate in which a concave portion is formed on one surface, and in the concave portion, a heat dissipation resin that is an insulating layer and copper are formed in accordance with the shape of the insulating layer. By forming a lead frame as the main component and mounting the LED on this lead frame part, the heat generated by the LED is transmitted to the lead frame, and diffused from the metal substrate to the heat sink fixed to the metal substrate via the heat dissipation resin On the other hand, it is disclosed that the luminance is increased by pressing the lead frame in accordance with the concave portion of the metal substrate and reflecting the light emitted from the side surface of the LED by the side surface of the concave portion of the lead frame. Furthermore, in Japanese Patent Application Laid-Open No. 2007-335896 (Patent Document 3), the surface of a metal substrate is covered with a hollow layer, a light emitting element is mounted on a flat surface on the front side of the metal substrate, and at least two on the back surface. It has been proposed to project a heat dissipating part composed of the above pin-shaped fins and to form a cup structure that reflects light emitted from the LED in a predetermined direction on the flat surface of the metal substrate.

JP 2002-93206 A JP 2007-173440 A JP 2007-335896 A

  In the heat dissipation structure shown in Patent Document 1 described above, the metal plate holding the LED is placed on the heat dissipation fin via the insulating heat conductive sheet, but generally the heat conductivity of the insulating heat conductive sheet. Therefore, there is a problem that the heat dissipation efficiency is low and the heat generated by the LED cannot be sufficiently dissipated. On the other hand, since a resin pressure plate is provided to direct light emitted from the LED in one direction, there is a problem that the number of parts increases and the size increases. Furthermore, the radiation fin shown in Patent Document 1 is a radiator formed by drawing an aluminum material, and in order to obtain a predetermined radiation effect, a large radiator is inevitably necessary. Even if the weight and volume are increased and the light source is reduced in size as an LED, the heat dissipation structure is increased.

  The heat dissipating structure disclosed in Patent Document 2 transmits heat generated in the LED from the lead frame to the metal substrate via the heat dissipating resin, and further transmits to the heat sink to be diffused. About dissipating heat using a heat-dissipating resin and a heat sink, there are almost the same problems as in Patent Document 1. In addition, in order to direct the light emitted from the LED in one direction, since the lead frame is processed into a concave shape after forming the concave portion in the metal substrate itself, the processing becomes complicated. There is a problem that the price rises. Moreover, since the concave portion has a small diameter, there is also a problem that light diffuses.

  The heat dissipating structure disclosed in Patent Document 3 includes means for dissipating heat generated in the LED and means for directing light emitted from the LED in one direction. When the heat dissipating part is projected, there is a limit to the plastic deformation of the metal, so that a small fin cannot be projected for a long time, which inevitably increases the size. Further, the means for condensing light in one direction also has a problem that light diffuses in the same manner as in Patent Document 2 described above in order to form and reflect the cup structure on the flat surface of the metal substrate. Yes.

  Therefore, the object of the present invention is to provide a heat dissipating part integrally on a printed board made of a metal plate to increase the heat dissipating area, and to efficiently dissipate the heat generated from the LED through the heat dissipating fins of the heat dissipating part. Another object of the present invention is to provide a printed circuit board for a light emitting module capable of increasing the luminance of the light emitting module by a reflecting surface obtained by bending the printed circuit board itself.

  In order to solve the above-described problems, the printed circuit board for a light emitting module according to the present invention is formed of a metal foil with an insulating layer formed on one surface of a metal plate having a good thermal conductivity. A wiring pattern is formed, and the other surface of the metal plate is integrally provided with at least one row of heat radiating portions made up of a plurality of heat radiating fins standing up in a thin plate shape by digging up with a digging tool. A printed circuit board having a substrate part, wherein the printed circuit board part is bent at a predetermined angle toward one side of the printed circuit board part with a part of the heat radiating fin in the heat radiating part as a bending line. A shade portion having a reflective surface on one side of the shade portion is integrally connected, and the direction of light emitted from the light emitting element mounted on the wiring pattern is determined by the shade portion. It is summarized in that for reflecting morphism surface.

  The bent line is a line orthogonal to or parallel to the surfaces of the plurality of heat dissipating fins of the heat dissipating part.

  The bent line may be a line parallel to the surfaces of the plurality of heat dissipating fins of the heat dissipating part, and the printed circuit board may be formed in an arc shape by sequentially bending between the heat dissipating fins.

  In the heat radiating portion, the thickness of the bottom surface formed between the radiating fins adjacent to each other is made smaller than the thickness of the metal plate.

  The wiring pattern on which the light emitting element is mounted may be provided with a resist layer having high brightness, and this resist layer may be extended on the reflection surface of the shade part.

  Further, the reflection surface of the shade part may be a base of a metal plate.

  According to the printed circuit board for a light emitting module according to the present invention, on the other surface of the printed circuit board portion based on a metal plate having a good thermal conductivity bonded with a metal foil via an insulating adhesive layer, Since the heat radiating portion comprising a plurality of heat radiating fins erected in a thin plate shape is integrally provided, a light emitting element (hereinafter referred to as “LED”) with heat generation disposed in the wiring pattern formed by the metal foil. It is possible to dissipate heat by directly transferring heat from the printed circuit board portion to the heat radiating portion. The heat dissipating part has a large heat dissipating area, so that the heat dissipating efficiency is high and desired heat dissipating is possible, so that the heat of the LED can be efficiently diffused and cooled. And since the heat | fever emitted from LED is transmitted to a thermal radiation part in a short time, it becomes possible to raise the thermal radiation efficiency further. In addition to such characteristics of the printed circuit board, in the present invention, a part of the heat radiating fin in the heat radiating part is bent at a predetermined angle to the one surface side of the printed circuit board part as a bending line, thereby Since the shade portion having the reflection surface is continuously provided, the direction of light emitted from the LED mounted on the wiring pattern can be reflected on the reflection surface of the shade portion. In this way, the heat radiation part is formed integrally with the printed circuit board metal plate itself, and the shade part with the reflective surface is formed, so the configuration is simplified, and it is possible to reduce component costs and manufacturing costs. It becomes.

  If the bent line for forming the shade portion is a line orthogonal to the surfaces of the plurality of heat radiation fins of the heat radiation portion, the rigidity is increased by forming a plurality of plate-shaped heat radiation fins, and the plurality of heat radiation fins themselves Since it is not bent, and a plurality of plate-like heat radiation fins are erected by digging up and digging down with a tool, it becomes thinner than the plate thickness of the metal plate and easily bends to one side of the printed board part Since it is in a state, it can be easily bent without using a special jig.

  Further, when the bending line for forming the shade portion is a line parallel to the surfaces of the plurality of heat radiation fins of the heat radiation portion, as described above, the plurality of plate-shaped heat radiation fins are erected and erected by a tool to be erected. In particular, since the base end portion of the radiating fin is formed thinner than the thickness of the metal plate, it can be easily bent.

  Furthermore, if the bent line for forming the shade portion is a line parallel to the surfaces of the plurality of heat radiating fins of the heat radiating portion, the base end portion of the heat radiating fin is formed thinner than the thickness of the metal plate. The fins can be easily bent, and the arc-shaped shade portion can be easily formed on the printed circuit board by sequentially bending between the heat dissipating fins.

  Furthermore, if the brightness of the color of the resist layer covering the wiring pattern on which the light emitting element is mounted is increased to be close to white and this resist layer is extended to the reflection surface of the shade portion, the light emitted from the LED The reflectance can be increased.

  Further, by using the metal plate base as the reflection surface of the shade portion, it is possible to form a reflection surface having a high reflectance without forming a special reflection film or the like.

  In the printed circuit board for a light emitting module according to the present invention, an insulating layer is formed on one surface of a metal plate having good thermal conductivity, and a wiring pattern made of a metal foil is formed through the insulating layer. On the other side, a printed circuit board is used in which at least one row of heat radiating portions made up of a plurality of heat radiating fins standing up in a thin plate shape by digging up with a digging tool is integrally provided. And this printed circuit board forms the shade part which makes one side of a metal plate a reflective surface by bending a part of heat radiation fin in a heat radiating part by a predetermined angle to one side of a metal plate. An LED as a light emitting element is mounted on the wiring pattern, and the direction of light emitted from the LED is reflected by the reflecting surface of the shade portion.

  Next, a printed circuit board for a light emitting module according to the present invention will be described in detail with reference to the drawings.

  The printed circuit board 1 for a light emitting module shown in FIGS. 1 to 3 has a base plate made of a metal plate such as copper, iron, iron-nickel alloy, or aluminum having good thermal conductivity, and a heat radiating portion 6 is formed at the center. The printed circuit board part 2 and shade parts 7 are integrally connected to the left and right sides of the printed circuit board part 2.

  In the printed board 2, a metal foil such as a copper foil is bonded to one surface 2 a of a metal plate via an insulating adhesive layer, similarly to a known metal core printed board. As the adhesive layer, for example, a thermosetting resin such as a high heat resistant epoxy resin is used as a base resin. In order to improve the thermal conductivity of the adhesive layer, an inorganic filler of fine particles can be blended. As is well known, a predetermined wiring pattern 3 is formed on the metal foil by chemical etching. Further, the wiring pattern 3 is covered with a resist film 4 having an electrical insulating property except for the land. The wiring pattern 3 is wired with one or more LEDs 5 as light emitting elements.

  On the other surface 2b of the printed board portion 2 made of the metal plate, a row of heat radiation portions 6 are integrally formed. The heat radiating portion 6 is composed of a plurality of thin plate-shaped heat radiating fins 6a. The base end portions of the heat radiating fins 6a are integrally connected from the other surface 2b of the printed circuit board portion 2, the front end side of the heat radiating fins 6a is slightly curved, and the plurality of heat radiating fins 6a have the same angle and the same interval. Standing up is formed. Further, the plurality of heat radiating fins 6 a of the heat radiating portion 6 are formed so that the base end portion connected to the printed circuit board portion 2 is thick, and is thinned toward the tip portion.

  Moreover, since the plate | board thickness of the radiation fin 6a is formed by digging up from the other surface of a metal plate, it can be made thin. Incidentally, when radiating heat by the air cooling method, it is desirable to form the radiating fins 6a with a plate thickness of about 0.03 mm to 1.0 mm. In addition, the interval between the radiation fins 5a is preferably 1.0 mm to 8.0 mm. On the other hand, when radiating heat by the liquid cooling method, it is desirable to set the interval between the radiating fins 5a to 0.01 mm to 8.0 mm.

  And the plate | board thickness between the bottom face formed between the adjacent radiation fins 6a and the one surface 2a of the printed circuit board part 2 is formed smaller than the plate | board thickness of the metal plate which is a base substrate. In addition, you may form so that the plate | board thickness or space | interval of each radiation fin 6a may each differ. Furthermore, if the plate thickness of the heat radiating fin 6a is formed so that the base end portion is thick and the tip end portion is thinned, the base end portion is thick, so that the heat capacity becomes large and heat from the printed circuit board portion 2 can be easily received. become. Furthermore, heat is sequentially dissipated as the heat is transmitted toward the tip, and the tip can be easily dissipated even with a small heat capacity. Thus, since the heat dissipation fin 6a changes the plate thickness according to heat transfer and heat dissipation, the heat dissipation portion 6 having high heat dissipation efficiency is obtained.

  On both the left and right sides of the printed circuit board unit 2, shade parts 7 having a reflective surface on one side of the printed circuit board unit 2 are integrally provided. The shade portion 7 is formed by bending a part of the heat dissipating fins 6a in the heat dissipating portion 6 to the one surface side of the printed circuit board portion 2 by a predetermined angle with a bending line BL.

  In the embodiment shown in FIGS. 1 to 3, the bent line BL is the same as a virtual line connecting the end faces of the plurality of heat radiating fins 6 a in the heat radiating portion 6, and the bent line BL is a plurality of heat radiating in the heat radiating portion 6. It is orthogonal to the surface of the fin 6a. That is, the heat radiating part 6 in which a plurality of plate-like heat radiating fins 6a are formed has rigidity in a direction perpendicular to the heat radiating fins 6a. The substrate part 2 cannot be bent. However, the base end portions of the end surfaces of the plurality of heat radiation fins 6a as the bent lines BL are formed upright by digging up the plurality of plate-shaped heat radiation fins 6a and digging them down with a tool, as will be described in detail in the heat radiation fin forming process described later. Thus, the plate thickness is thin, and the printed board portion 2 is easily bent toward the one surface 2a side. Therefore, when the shade portion 7 is bent, the bending portion BL has a lower bending strength than the heat dissipation portion 6 and the printed circuit board portion 2, so that the shade portion 7 can be easily bent along the bending line BL. . Since the bending line BL is provided on both sides of the heat radiating part 6 of the printed circuit board part 2, a pair of left and right shade parts 7 is formed by bending each of the both sides.

  Further, as shown in FIG. 2, the wiring pattern 3 is covered with a resist film 4 having electrical insulation except for the land. The resist film 4 is only a portion of the printed circuit board portion 2 and does not cover the left and right shade portions 7. Therefore, the base of the metal plate is exposed on one surface side of the printed circuit board portion 2 of the shade portion 7. As described above, since the metal plate uses a material such as aluminum having good thermal conductivity, the metal plate has a good reflectance even in a normal state.

  Then, when a plurality of LEDs 5 wired in the wiring pattern 3 are energized to emit light, the light 5a emitted from the LEDs 5 is reflected by the reflecting surface of the shade portion 7 as shown in FIG. Can be changed. As a result, it acts to increase the brightness of the LED 5 as viewed from below in the figure.

  Thus, when the reflective surface of the one side of the printed circuit board part 2 of the shade part 7 is used as the base of the metal plate, rust may be generated due to exposure, so that a reduction in reflectance due to rust is prevented. It is desirable to pre-coat a rust preventive film for this purpose.

  As this coating means, it is desirable to extend the resist film 4 formed on the printed board portion 2 to the reflecting surface on the one surface 2a side of the printed board portion 2 of the shade portion 7. At this time, since the resist film 4 functions as a reflecting surface, the resist film 4 preferably has a color close to white so as to increase the brightness of the color, and thereby efficiently emits the light 5a emitted from the LED 5. It can be reflected.

  In addition, when attaching the printed circuit board 1 for light emitting modules mentioned above to apparatuses, such as a lighting fixture, it is desirable to provide the attachment metal fitting 8 as shown with a dashed-two dotted line in FIG. Both ends of the mounting bracket 8 are fixed to the shade portion 7, and the height thereof is set higher than that of the heat radiating portion 6. Then, for example, a screw hole formed on the upper surface of the mounting bracket 8 and the device can be fixed with a screw or the like. Moreover, you may utilize a part of shade part 7 for attachment of the printed circuit board 1 for light emitting modules.

  Next, a manufacturing method of the heat radiating portion 6 of the light emitting module printed circuit board 1 shown in FIGS. 1 to 3 will be described with reference to FIG. As a material of the printed circuit board portion 2, copper or aluminum is preferable as a metal plate having good thermal conductivity and good machinability. Further, the plate thickness of the printed circuit board portion 2 is preferably 0.5 mm to several mm used in a normal electronic circuit. Then, a metal foil such as a copper foil is bonded to the one surface 2a of the printed circuit board part 2 in advance through an insulating adhesive layer 4, and a predetermined wiring pattern 3 is formed on the metal foil by etching. Further, a resist film 4 is formed except for the lands of the wiring pattern 3 to constitute a metal-based printed board. In the state before the heat radiation part 6 is formed, the LED 5 is not disposed. The printed circuit board unit 2 is placed on a pressing device (not shown). Thereafter, the radiating fins 6 a are formed upright by the digging and raising tool 9.

  The digging tool 9 is formed with a blade portion 9a perpendicular to the moving direction at the tip on the bottom surface side, and its width is set to a width necessary for the heat radiating portion 6. Further, the digging tool 9 is attached to a driving device (not shown) so as to incline at a predetermined angle θ so that the rear end side becomes higher with respect to one surface of the metal plate 2. The inclination angle θ is appropriately set depending on the height of the heat radiating fins 6a, the plate thickness, the material of the metal plate 2, or the like, but is generally set to 5 degrees to 20 degrees.

  In FIG. 4A, a thin plate-like heat radiation fin 6a is formed upright on the other surface 2b of the printed circuit board portion 2. The heat radiating fin 6a moves the digging tool 9 in a direction indicated by an arrow at a predetermined angle θ by a driving device after the blade part 9a of the digging tool 9 is brought into contact with a predetermined position of the other surface 2b of the printed circuit board unit 2. The blade portion 9a of the digging tool 9 is formed upright by digging down the other surface 2b of the printed circuit board portion 2. By forming the radiating fins 6a upright, a surface 2c to be machined is formed on the other surface 2b of the printed circuit board portion 2 so as to be inclined and equal to the inclination angle of the tool 9.

  Next, as shown in FIG. 4A, the printed circuit board portion 2 and the digging tool 9 are relatively moved so that the blade portion 9a is placed at a position where the digging allowance p on the upstream side of the processing surface 2c is obtained. Make contact. The excavation allowance p is set to about 0.1 mm to 3.0 mm. When the digging tool 9 is moved in the direction indicated by the arrow at a predetermined angle θ, the blade portion 9a bites into the printed circuit board portion 2 as shown in FIG. 4B, and the formation of the radiation fins 6a is started. Thereafter, when the digging tool 9 is further moved, the height of the radiation fins 6a increases as shown in FIG. Then, by digging up the digging tool 9 to a predetermined depth, the radiating fins 6a having a predetermined height are formed upright as shown in FIG. 4 (D). After that, the blade portion 9a of the digging tool 9 is moved to a position where the digging allowance p on the upstream side of the processing surface 2c formed by the radiating fins 6a formed upright earlier is obtained, and FIG. As shown in (C), the next radiating fin 6a having a predetermined height is formed upright by moving the blade portion 9a of the digging tool 9 until it reaches a predetermined depth. In this manner, the digging tool 9 is moved to a position upstream of the processing surface 2c and the digging process of moving the digging tool 9 until it reaches a predetermined depth is sequentially repeated, so that the plurality of radiating fins 6a have the same angle, And it stands upright at the same interval.

  Thus, by forming the plurality of heat radiation fins 6a, as shown in FIG. 4 and FIG. 5, a recess having a thickness t2 thinner than the thickness t1 of the printed circuit board portion 2 between the adjacent heat radiation fins 6a. A place 2d is formed, and inner walls 2e are formed on both sides of the recess 2d. The inner wall 2e is in contact with both sides of the base end portion of the radiating fin 6a. Shade portions 7 are provided integrally with the printed circuit board portion 2 on both the left and right sides of the outer wall with the inner wall 2e as a boundary.

  As described above, the printed circuit board 1 on which the heat radiating portion 6 including the plurality of heat radiating fins 6a is formed is one to a plurality of light emitting elements in the wiring pattern 3 as shown in FIG. Wire the LED 5. In this mounting process, for example, a known reflow soldering apparatus is used, and the LED 5 is mounted by this apparatus. When the reflow soldering apparatus is used, solder printing is performed on the wiring pattern 3 in advance.

  In the next step, the printed circuit board 1 on which the LED 5 is mounted is bent at a predetermined angle on the one surface side of the printed circuit board section 2 as the bending line BL as described above, thereby forming the shade section 7. As shown in FIG. 5, the bent line BL is an imaginary line that connects the portions where the inner walls 2e formed on both sides of the recess 2d and the end surfaces of the base end portions of the radiation fins 6a are in contact. When the shade portions 7 are formed on both sides of the heat radiating portion 6 as in the embodiment shown in FIG. 5, the bending lines BL are respectively formed on the left and right sides of the heat radiating portion 6.

  From this state, when one of the printed circuit board unit 2 and the shade unit 7 is directed to one surface side of the printed circuit board unit 2 as indicated by a two-dot chain line in FIG. That is, the heat radiating portion 6 formed with a plurality of plate-like heat radiating fins 6a is not bent because the heat radiating fins 6a are formed at right angles to the bending line BL. On the other hand, the bottom surface of the inner wall 2e in contact with the end surface of the base end portion of the radiating fin 6a is thinner than the plate thickness of the shade portion 7 as shown in FIG. Bending from the line BL toward one side of the printed circuit board 2. On the contrary, even if it is going to bend the shade part 7 to the heat radiation part 6 side which is the other surface of the printed circuit board part 2, the end surface of the base end part of the heat radiation fin 6a and the inner wall 2e will be in a pressure contact state, and the heat radiation fin 6a will be It becomes difficult to bend such as destroying. Therefore, the bending direction of the shade part 7 is limited to only one side of the printed circuit board part 2. In this way, a pair of left and right shade portions 7 is formed by bending both sides of the printed board portion 2 from the bent lines BL provided on both sides of the heat radiating portion 6 of the printed board portion 2.

  FIG. 6 shows a second embodiment of the printed circuit board for a light emitting module according to the present invention. 6 is different from the above-described first embodiment in that the printed board portion 10 is formed at the position of the shade portion 7 bent on both the left and right sides in the first embodiment. That is, in the second embodiment, the printed circuit board portion 10 bent to the left and right sides is integrally formed with a row of heat radiation portions 11 constituted by a plurality of thin plate-shaped heat radiation fins 11a on the other surface 10b. The LED 5 serving as a light emitting element is wired in a wiring pattern formed on the one surface 10a. Further, the wiring pattern is covered with a resist film having electrical insulation except for the land. And between the printed circuit board parts 10 on both the left and right sides, a shade part 12 which also serves as a flat mounting part is integrally provided.

  Also in the second embodiment, the bending line BL2 for bending the printed circuit board portion 10 and the shade portion 12 connects the end surfaces of the heat radiating portion 11 that are orthogonal to the surfaces of the plurality of heat radiating fins 11a. It is the same as an imaginary line, and is formed on the shade part 12 side of the left and right heat radiating parts 11, respectively. Since the portion of the bent line BL2 is also thinly formed by digging up a plurality of plate-like heat radiation fins 11a and standing up with a tool, it is easy to bend toward the one surface 10a side of the printed circuit board 10 It has become. Therefore, when bending from the shade part 11, the bending line BL2 is less bent than the heat dissipation part 11 and the printed board part 10, so that the left and right printed board parts 10 are easily bent along the bent line BL2. be able to.

  When the LEDs 5 wired on the left and right printed circuit board portions 10 are caused to emit light, the emitted light is reflected by the shade portions 11 and the reflecting surfaces of the opposite printed circuit board portions 10 to change the direction, and the luminance of the LEDs 5 is increased. Act to enhance. As the reflection surface of the central shade portion 12, the reflection surface may be formed by extending from a resist film coated on the wiring pattern of the printed board portion 10 on both the left and right sides, or the metal constituting the printed board. A reflective surface may be formed by exposing the base material of the plate.

  The central shade portion 12 in the second embodiment can also be used as an attachment portion of a light emitting module printed board. For example, by disposing the mounting column 13 as shown by a two-dot chain line on the upper surface of the shade portion 12, it can be fixed to a device such as a lighting fixture with a screw or the like. Further, a protrusion may be formed on the shade portion 12 by, for example, burring, and the protrusion 12 may be attached to a device such as a lighting fixture.

  FIG. 7 shows a third embodiment of the printed circuit board for a light emitting module according to the present invention. In the third embodiment, similarly to the first embodiment described above, a row of heat radiating portions 6 are integrally formed on the other surface 2b of the printed board portion 2, and a pair of shades are provided on the left and right sides of the printed board portion 2. Part 7 is formed. Here, the difference from the first embodiment is that the shade portions 7 on both the left and right sides are curved in a substantially arc shape on the one surface 2a side of the printed circuit board portion 2.

  When a plurality of LEDs 5 wired to the wiring pattern 3 are energized to emit light, the light 5a emitted from the LEDs 5 is reflected by the curved reflecting surface of the shade portion 7 as shown in FIG. The direction can be changed. The reflected light is easily reflected downward in the figure because the reflection surface is curved, and as a result, the brightness of the LED 5 can be increased.

  FIG. 8 shows a fourth embodiment of the printed circuit board for a light emitting module according to the present invention. In the fourth embodiment, the second printed circuit board portions 21 are formed on both the left and right sides of the central printed circuit board portion 20, and the other surfaces 20b and 21b of the central printed circuit board portion 20 and the second printed circuit board portions 21 on both sides are formed. Are formed integrally with a plurality of thin plate-like heat radiation fins 22a, 23a. Furthermore, a wiring pattern (not shown) is formed on the one surface 20a, 21a, and the LED 5 that is a light emitting element is wired in this wiring pattern. The second printed circuit board portions 21 on both sides are bent toward the one surface 20 a side by a predetermined angle with respect to the central printed circuit board portion 20. And in the 4th Example shown in FIG. 8, the 2nd printed circuit board part 21 of both sides is shared as a shade part.

  Also in the fourth embodiment, the bending line BL4 for bending the second printed circuit board portion 21 on both sides with respect to the central printed circuit board portion 20 is a heat radiating portion formed in the central printed circuit board portion 20. 22 is the same as the imaginary line connecting the end faces orthogonal to the surfaces of the plurality of heat radiation fins 22 a, and is formed on both sides of the heat radiation portion 22. The bent line BL4 is also bent toward the one surface 20a side of the central printed circuit board portion 20 because the plate thickness is formed thin by digging up a plurality of plate-like heat radiation fins 22a and standing up with a tool. Easy to use. Accordingly, when the second printed circuit board portions 21 on both sides are bent, the bending line BL4 has a lower bending strength than the heat radiating portion 22, so that the second printed circuit board portions 21 on both the left and right sides follow the bent line BL4. Can be bent easily.

  For the convenience of forming a plurality of heat radiation fins 22a and heat radiation fins 23a in the heat radiation part 22 formed in the central printed circuit board part 20 and the heat radiation part 23 formed in the second printed circuit board part 21 on both sides, In the case of standing upright apart from each other, the space between the heat radiating portions 22 and 23 is formed thick, and bending lines BL4 are formed on both sides of the thick portion. When the second printed circuit board portion 21 is bent from both sides of the central printed circuit board portion 20, either one of the two bent lines BL4 is selected and bent, or the two bent lines BL4 are You may bend both and the 2nd printed circuit board part 21 may be bent in steps.

  FIG. 9 shows a fifth embodiment of the printed circuit board for a light emitting module according to the present invention. The fifth embodiment is the same as the first embodiment described above, except that the other surface 2b of the printed circuit board portion 2 is integrally formed with a row of heat radiation portions 6, but is different from the first embodiment. The point is that, in addition to forming a pair of shade portions 7 on both the left and right sides of the printed circuit board portion 2, a pair of shade portions 17 is formed on both the front and rear sides of the printed circuit board portion 2.

  In the fifth embodiment, the bending line BL for bending the left and right shade portions 7 of the printed circuit board portion 2 is the same as the bending line BL shown in FIGS. The bending line BL5 for bending is a line parallel to the surface of the heat radiation fin 6a of the heat radiation portion 6. The base end portion of the radiating fin 6a as the bending line BL5 is formed by standing up by digging up the plate-shaped radiating fin 6a and digging it up with the tool 9 in the radiating fin forming step shown in FIG. In particular, since the base end portion of the heat radiating fin 6a is formed thin, it is easy to bend. Therefore, the shade portion 17 can be easily bent with the base end portion of the radiating fin 6a as the bending line BL5.

  Moreover, the heat sink fin is not formed in the shade parts 17 of the front and rear sides. This is because the heat radiating portion 6 is formed only on the other surface 2b of the printed circuit board portion 2, and the heat radiating fin forming step shown in FIG. The plate-shaped heat radiation fins 6a can be formed upright using the digging tool 9. If necessary, a plurality of plate-like heat radiating fins may be formed on the shade portions 17 on both the front and rear sides, and the shade portions 17 may be formed by bending at the bending line BL5.

  FIG. 10 shows a sixth embodiment of the printed circuit board for a light emitting module according to the present invention. The sixth embodiment is a modification of the second embodiment shown in FIG. 6, in which the width of the flat shade portion 12 integrally connected between the printed board portions 10 on both the left and right sides is made as narrow as possible. It is. As described above, the printed circuit board part 10 is formed in a bent state on the left and right sides of the shade part 12, and a plurality of thin plate-like heat radiation fins 11a are formed on the other surface 10b of the printed circuit board part 10. A row of heat dissipating portions 11 configured by the above is integrally formed, and LEDs 5 as light emitting elements are wired in a wiring pattern formed on one surface 10a. Further, the wiring pattern is covered with a resist film having electrical insulation except for the land.

  In addition, the bent line BL6 in the sixth embodiment is the same as the imaginary line that connects both end faces orthogonal to the surfaces of the plurality of heat radiation fins 11a in the heat radiation portion 11 on both sides of the narrow shade portion 12. The left and right heat dissipating parts 11 are formed on the shade part 12 side. Since the portion of the bent line BL6 is also formed thin by digging up a plurality of plate-like heat radiation fins 11a and standing up with a tool, it is easy to bend toward the one surface 10a side of the printed circuit board portion 10 It has become. Therefore, when the bent portion is bent from the shade portion 11, the bending line BL6 is less bent than the heat radiating portion 11 and the printed board portion 10, so that the left and right printed board portions 10 are easily bent along the bent line BL6. be able to. In the sixth embodiment, the narrow shade portions 12 are formed. However, when the heat radiating portions 11 are integrally formed on the left and right printed board portions 10, two rows are formed using one digging tool 9. In the case where the heat dissipating fins 11a are separated to form the heat dissipating fins 11a at the same time, and the heat dissipating fins 11a can be formed close to each other, such as individually forming the heat dissipating portions 11, the narrow shade portions may not be provided.

  Furthermore, in Example 6, the heat radiating part 11 integrally formed on the other surface 10b of the printed circuit board part 10 is divided into a plurality of individual groups. The positions of the groups of these heat radiating portions 11 correspond to the positions where the LEDs 5 that are the light emitting elements wired in the wiring pattern are in the center. And the heat | fever emitted from LED5 is transmitted to the group of the thermal radiation part 11 located in a corresponding position, and can thermally radiate efficiently. In addition, when the group of the heat radiating portions 11 is formed in a place where heat radiation is necessary in this way, the number of radiating fins is reduced, so that the manufacturing time can be shortened and the cost can be reduced.

  In addition, it is applicable also to the other Example by this invention to form a thermal radiation part as a group corresponding to the arrangement | positioning position of LED5 like Example 6. FIG.

  Then, when the LED 5 wired to the left and right printed circuit board portions 10 is caused to emit light, the emitted light is reflected by the reflecting surface of the opposite printed circuit board portion 10 and the direction is changed, so that the brightness of the LED 5 is increased. Works.

  FIG. 11 shows a seventh embodiment of the printed circuit board for a light emitting module according to the present invention. In the seventh embodiment, a printed circuit board is formed in an arc shape by sequentially bending between the radiation fins using a line parallel to the surfaces of the plurality of radiation fins of the heat radiation portion as a bending line.

  In the seventh embodiment, the light emitting module printed circuit board 30 is composed of a flat printed circuit board portion 31 and a shade portion 32 formed in an arc shape. On the other surface 32b of the part 32, a row of heat radiating parts 33 constituted by a plurality of thin plate-like heat radiating fins 33a are integrally formed. Furthermore, the LED 5 that is a light emitting element is wired in the wiring pattern formed on the one surface 31 a of the printed circuit board portion 31. The wiring pattern is covered with a resist film 34 having electrical insulation except for the land. The resist film 34 may also extend to the other surface 32b of the shade portion 32.

  In Example 7, the bending line BL7 for bending the shade portion 32 is a line parallel to the surface of the heat radiation fin 33a of the heat radiation portion 33, and a plurality of bend lines BL7 are provided between the heat radiation fins 33a. As described above, the base end portion of the radiating fin 33a that is the bent line BL7 is formed by standing up by forming a plate-shaped radiating fin by digging it up with a tool in the radiating fin forming step shown in FIG. The plate thickness, particularly the base end portion of the radiating fin 33a, is formed thin, so that it is easily bent. Therefore, the shade part 32 can be easily bent by setting the base end part of the radiation fin 33a to the bending line BL7. Then, by bending the bending line BL7 provided between the heat radiation fins 33a of the shade portion 32 having a reduced plate thickness at a predetermined angle, the entire shade portion 32 is formed in an arc shape as shown in FIG. Can be curved.

  As described above, when the plurality of LEDs 5 are energized to emit light, the light emitted from the LEDs 5 is reflected by the reflecting surface curved in the arc shape of the shade portion 32 to change the direction, and the brightness of the LEDs 5 is increased. This is the same as the embodiment.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above embodiments and can be variously modified without departing from the gist thereof. For example, the shape of the printed circuit board part and the shade part in the printed circuit board for the light emitting module is not a quadrangle as illustrated in each example, but an appropriate shape according to the configuration of the device to be attached, as in the case of a general printed circuit board. You may form in. Moreover, you may change suitably a height, a space | interval, etc. of the radiation fin of a thermal radiation part according to the heat_generation | fever state of LED and the thermal radiation distribution of a thermal radiation part.

It is a perspective view which shows the 1st Example of the printed circuit board for light emitting modules concerning this invention. It is a top view which shows the one surface side of the printed circuit board for light emitting modules shown in FIG. It is sectional drawing which shows the printed circuit board for light emitting modules shown in FIG. (A) thru | or (D) is process explanatory drawing which shows the manufacturing process which forms the thermal radiation part of the printed circuit board for light emitting modules. It is principal part sectional drawing which shows the bending state of the shade part in the printed circuit board for light emitting modules shown in FIG. It is a perspective view which shows the 2nd Example of the printed circuit board for light emitting modules concerning this invention. It is a perspective view which shows the 3rd Example of the printed circuit board for light emitting modules concerning this invention. It is a perspective view which shows the 4th Example of the printed circuit board for light emitting modules concerning this invention. It is a perspective view which shows the 5th Example of the printed circuit board for light emitting modules concerning this invention. It is a perspective view which shows the 6th Example of the printed circuit board for light emitting modules concerning this invention. It is a perspective view which shows the 7th Example of the printed circuit board for light emitting modules concerning this invention.

DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 for light emitting modules Printed circuit board part 2a One end 2b The other side 3 Wiring pattern 4 Resist film 5 LED (light emitting element)
6 Radiation part 6a Radiation fin 7 Shade part 9 Digging tool 9a Blade part BL Bend line

Claims (7)

An insulating layer is formed on one surface of a metal plate with good thermal conductivity, and a wiring pattern made of a metal foil is formed through this insulating layer. The other surface of the metal plate is dug up with a digging tool. The printed circuit board having a printed circuit board part integrally provided with at least one row of heat radiation parts composed of a plurality of heat radiation fins standing up in a thin plate shape,
The printed circuit board part has a shade having a reflection surface on one side of the printed circuit board part by bending a part of the heat radiating fin in the heat radiation part at a predetermined angle to the one surface side of the printed circuit board part. The parts are connected together,
A printed circuit board for a light emitting module, wherein a direction of light emitted from a light emitting element mounted on the wiring pattern is reflected on a reflection surface of the shade portion.   The printed circuit board for a light emitting module according to claim 1, wherein the bent line is a line orthogonal to the surfaces of the plurality of heat radiation fins of the heat radiation portion.   The printed circuit board for a light emitting module according to claim 1, wherein the bent line is a line parallel to the surfaces of the plurality of heat radiation fins of the heat radiation portion.   4. The printed circuit board for a light emitting module according to claim 3, wherein a line parallel to the surfaces of the plurality of heat radiation fins of the heat radiation portion is bent, and the heat radiation fin is sequentially bent to form a printed circuit board in an arc shape.   The printed circuit board for a light emitting module according to any one of claims 1 to 3, wherein a plate thickness of a bottom surface formed between heat radiating fins adjacent to each other in the heat radiating portion is smaller than a plate thickness of the metal plate.   The printed circuit board for a light emitting module according to claim 1, wherein a resist layer having a high brightness is provided on the wiring pattern on which the light emitting element is mounted, and the resist layer is extended on the reflection surface of the shade portion.   The printed circuit board for a light emitting module according to claim 1, wherein the reflection surface of the shade portion is a base of a metal plate.

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